JP7115635B2 - Resin composition, light-shielding film, and substrate with partition - Google Patents

Description

TECHNICAL FIELD The present invention relates to a resin composition, a light-shielding film formed from the resin composition, and a substrate with partition walls having patterned partition walls.

In recent years, as a color display device with high light utilization efficiency, a color display device including a wavelength conversion section made of a wavelength conversion phosphor, a polarization separation means, and a polarization conversion means has been proposed (see, for example, Patent Document 1). ). For example, a blue light source, a liquid crystal element, a phosphor that emits red fluorescence when excited by blue light, a phosphor that emits green fluorescence when excited by blue light, and a light scattering layer that scatters blue light. A color display device including a conversion unit has been proposed (see, for example, Patent Document 2).

However, color filters containing color-converting phosphors, such as those described in Patent Documents 1 and 2, generate fluorescence in all directions, resulting in low light extraction efficiency and insufficient brightness. In particular, in high-definition display devices called 4K and 8K, since the pixel size is small, the problem of brightness becomes significant, and higher brightness is required.

JP-A-2000-131683 JP 2009-244383 A JP-A-2000-347394 JP 2006-259421 A WO2020/008969

Generally, in such a display device, the color-converting phosphors are separated by partition walls to prevent color mixture of light between adjacent pixels. In particular, if the excitation light of the color-converting phosphor leaks into adjacent pixels, it will emit light in the adjacent pixels and cause color mixture. Also, in order to improve the brightness of the display device, it is effective to separate the color conversion phosphors with highly reflective partition walls. From the above, there is a demand for a barrier rib material that achieves both high light shielding properties for blue light and high reflectance for all visible light.

In order to form barrier ribs that achieve both high light-shielding properties for blue light and high reflectivity for all visible light, the inventors firstly added a white barrier rib material using a titanium oxide white pigment that exhibits high reflectance, A method of using a material added with a yellow pigment, which is a complementary color of blue, was investigated. However, in this method, the entire exposure light is absorbed by the white pigment and the yellow pigment, and the light does not reach the bottom of the film during exposure, resulting in poor pattern processability.

Therefore, the inventors devised a design in which the exposure light is transmitted during the process of pattern exposure after film formation, and the light shielding property is increased after heating the exposed film at a temperature of 120° C. or more and 250° C. or less. Also, a resin composition containing a resin, an organometallic compound containing at least one metal selected from the group consisting of silver, gold, platinum and palladium, a photopolymerization initiator or a quinonediazide compound, and a solvent is used. This was achieved by doing so (see Patent Document 5). In particular, it was found that when an organic silver compound is used, the film turns yellow due to the formation of silver nanoparticles after heating, and the blue light shielding property increases.

However, it was newly revealed that this technology has a problem with weather resistance because if unreacted organic silver compounds remain in the film after heating, they are decomposed by light or heat, changing the color of the film. Moreover, since it is necessary to use a large amount (1% or more of the solid content) of an expensive organic silver compound, there is also a problem of cost. Furthermore, in order to sufficiently improve the light shielding property of the film, heating at 150° C. or higher is necessary, and this technology cannot be applied when heating conditions at a low temperature of about 100 to 120° C. are required. .

Therefore, the present invention provides a resin composition which is excellent in weather resistance even under heating conditions of about 100 to 120° C. and capable of forming barrier ribs having both high light shielding properties for blue light and high reflectance for all visible light. The purpose is to provide it at a relatively low cost.

As a result of intensive research, the inventors of the present application have found that a resin composition containing a resin, a photopolymerization initiator or a quinonediazide compound, a white pigment and/or a light-shielding pigment, an organic silver compound, and a reducing agent exhibits weather resistance. The inventors have found that it is possible to form a partition wall which is excellent in both high reflectivity for all visible light and high light shielding performance for blue light, and have arrived at the present invention.

That is, the present invention provides the following.
(1) a resin, a photoinitiator or a quinonediazide compound, a white pigment and/or a light-shielding pigment, an organic silver compound, and a reducing agent , wherein the white pigment is SiO ₂ , Al ₂ O ₃ and ZrO ; ₂ , wherein the light-shielding pigment contains at least one of a red pigment, a blue pigment, a black pigment, a green pigment, and a yellow pigment .
(2) A resin composition containing a resin, a photopolymerization initiator or a quinonediazide compound, a white pigment and/or a light-shielding pigment, an organic silver compound, and a reducing agent, wherein the reducing agent is A resin composition which is a compound containing two or more phenolic hydroxyl groups or a compound containing an enediol group.
(3) The resin composition according to (1) or (2), wherein the organic silver compound is a compound represented by the following general formula (1).

(In general formula (1), R ₁ represents hydrogen or an organic group having 1 to 30 carbon atoms.)
(4) The resin composition according to (1) or (2), wherein the organic silver compound is a polymer compound having at least a structure represented by the following general formula (2).

(In general formula (2), R ² and R ³ each independently represent hydrogen or an organic group having 1 to 30 carbon atoms , and a represents an integer of 1 or more ).
The resin composition according to any one of (1) to (4), wherein the reducing agent is a hydroquinone compound represented by the following general formula (3).

(In general formula (3), R ₄ , R ₅ , R ₆ and R ₇ each independently represent hydrogen, a hydroxy group, or an organic group having 1 to 30 carbon atoms).
(6) The resin composition according to any one of (1) to (5), wherein the resin is polysiloxane having a styryl group.
(7) The resin composition according to any one of (1) to (6), further containing a liquid-repellent compound having a radically photopolymerizable group.
(8) A light-shielding film obtained by curing the resin composition according to any one of (1) to (7).
(9) A substrate with barrier ribs having (A-1) a pattern of the resin composition according to any one of (1) to (7) formed on a base substrate, the thickness at a wavelength of 450 nm. A substrate with partition walls having a reflectance of 10% to 60% per 10 μm and an OD value of 1.5 to 5.0 per 10 μm thickness at a wavelength of 450 nm.
(10) A substrate with barrier ribs having (A-1) patterned barrier ribs on a base substrate, wherein the patterned barrier ribs comprise a resin, a white pigment and/or a light-shielding pigment, silver oxide and / Or a board|substrate with a partition containing a silver particle and a quinone compound.
(11) The substrate with barrier ribs according to (9), wherein (A-1) the patterned barrier ribs contain a resin, a white pigment, and silver oxide and/or silver particles.
(12) The (A-1) patterned partition wall further contains a liquid-repellent compound, and the content of the liquid-repellent compound in the (A-1) patterned partition wall is 0.01% by weight to 10% by weight. % by weight, the substrate with partition walls according to any one of (9) to (11).
(13) Between the base substrate and (A-1) patterned barrier ribs, (A-2) patterned light shielding barrier ribs having an OD value of 0.5 or more per 1.0 μm of thickness are provided. The substrate with partition walls according to any one of (9) to (12), further comprising:
(14) The pixel layer according to any one of (9) to (13), further comprising (A-1) a pixel layer containing (B) a color-converting luminescent material arranged and separated by patterned partition walls. Substrate with partition.
(15) The substrate with partition walls according to (14), wherein the color-converting luminescent material contains a phosphor selected from quantum dots and pyrromethene derivatives.
(16) The substrate with partition walls according to (14) or (15), further comprising a color filter having a thickness of 1 to 5 μm between the base substrate and (B) the pixel layer containing the color-converting luminescent material.
(17) A display device comprising the substrate with partition walls according to any one of (9) to (16) and a light source selected from a liquid crystal cell, an organic EL cell, a mini-LED cell and a micro-LED cell.

The resin composition of the present invention allows exposure light to pass through during the process of pattern exposure after film formation, but when the exposed film is heated at a temperature of 100° C. or more and 250° C. or less, the organic silver compound is reduced by the reducing agent in the film. Since yellow particles are efficiently generated in the process and the blue light shielding property is improved, it is possible to form a fine thick film barrier rib pattern that is excellent in weather resistance and has both high reflectivity for all visible light and high light shielding property for blue light. It is possible.

1 is a cross-sectional view showing one embodiment of a substrate with partitions of the present invention having patterned partitions. FIG. 1 is a cross-sectional view showing one embodiment of a substrate with partitions of the present invention having pixels containing patterned partitions and a color-converting luminescent material; FIG. FIG. 2 is a cross-sectional view showing one embodiment of the partition-attached substrate of the present invention, which has patterned partitions, a color-converting luminescent material, and light-shielding partitions. FIG. 2 is a cross-sectional view showing one embodiment of the substrate with partitions of the present invention, which has patterned partitions, a color-converting luminescent material, and a color filter. FIG. 2 is a cross-sectional view showing one embodiment of the partition-attached substrate of the present invention, which has patterned partitions, color-converting luminescent material, light-shielding partitions, and color filters. 1 is a cross-sectional view showing one embodiment of a substrate with partitions of the present invention having patterned partitions, a color-converting luminescent material, and a low refractive index layer; FIG. 1 is a cross-sectional view showing one embodiment of a substrate with partitions of the present invention having patterned partitions, a color-converting luminescent material, a low refractive index layer, and an inorganic protective layer I. FIG. 1 is a cross-sectional view showing one embodiment of a substrate with partitions of the present invention having patterned partitions, a color-converting luminescent material, a low refractive index layer, and an inorganic protective layer I. FIG. 1 is a cross-sectional view showing one embodiment of a substrate with partitions of the present invention having patterned partitions, a color-converting luminescent material, a light-shielding partition, a color filter, a low refractive index layer, and an inorganic protective layer I. FIG. 1 is a cross-sectional view showing one embodiment of a substrate with partitions of the present invention having patterned partitions, a color-converting luminescent material, a low refractive index layer, and an inorganic protective layer II. FIG. FIG. 2 is a cross-sectional view showing one embodiment of the substrate with partitions of the present invention having patterned partitions, a color-converting luminescent material, a color filter, and an inorganic protective layer III and/or a yellow organic protective layer. FIG. 2 is a cross-sectional view showing one embodiment of the substrate with partitions of the present invention having patterned partitions, a color-converting luminescent material, an inorganic protective layer IV and/or a yellow organic protective layer. 1 is a cross-sectional view showing one embodiment of a substrate with partitions of the present invention having pixels containing patterned partitions and light-emitting light sources selected from organic EL cells, mini-LED cells, and micro-LED cells. FIG. A cross-sectional view showing one embodiment of a substrate with partitions of the present invention having pixels containing patterned partitions, a color-converting luminescent material, and a light-emitting light source selected from an organic EL cell, a mini-LED cell, and a micro-LED cell. be. FIG. 3 is a cross-sectional view showing the configuration of a display device used for color mixture evaluation in Examples.

Preferred embodiments of the resin composition, the light-shielding film formed from the resin composition, and the substrate with partition walls according to the present invention will be specifically described below, but the present invention is limited to the following embodiments. Instead, it can be implemented with various changes depending on the purpose and application.

INDUSTRIAL APPLICABILITY The resin composition of the present invention can be suitably used as a material for forming a color-converting phosphor, a partition wall separating light sources selected from organic EL cells, mini-LED cells, and micro-LED cells. The resin composition of the present invention contains a resin, a photopolymerization initiator or a quinonediazide compound, a white pigment and/or a light-shielding pigment, an organic silver compound, and a reducing agent.

The resin has a function of improving crack resistance and light resistance of the partition walls. The content of the resin in the solid content of the resin composition is preferably 10% by weight or more, more preferably 20% by weight or more, from the viewpoint of improving the crack resistance of the partition walls during heat treatment. On the other hand, from the viewpoint of improving light resistance, the resin content in the solid content of the resin composition is preferably 60% by weight or less, more preferably 50% by weight or less. Here, the solid content means all the components excluding volatile components such as solvent among the components contained in the resin composition. The amount of solids can be determined by heating the resin composition to evaporate the volatile components and weighing the residue.

Examples of resins include polysiloxane, polyimide, polyimide precursors, polybenzoxazole, polybenzoxazole precursors, and (meth)acrylic polymers. Here, (meth)acrylic polymer means a polymer of methacrylic acid ester and/or acrylic acid ester. You may contain 2 or more types of these. Among these, polysiloxane is preferable because it is excellent in heat resistance and light resistance.

Polysiloxane is a hydrolysis/dehydration condensate of organosilane. When the resin composition of the present invention has negative photosensitivity, the polysiloxane preferably contains at least a repeating unit represented by the following general formula (4). Further, other repeating units may be included. By including repeating units derived from the bifunctional alkoxysilane compound represented by the general formula (4), excessive thermal polymerization (condensation) of polysiloxane due to heating can be suppressed, and the crack resistance of the partition walls can be improved. It is preferable that the polysiloxane contains 10 to 80 mol % of repeating units represented by the general formula (4) in all repeating units. By including 10 mol % or more of the repeating unit represented by the general formula (4), the crack resistance can be further improved. The content of the repeating unit represented by formula (4) is more preferably 15 mol % or more, and even more preferably 20 mol % or more. On the other hand, by including 80 mol % or less of the repeating unit represented by the general formula (4), the molecular weight of the polysiloxane can be sufficiently increased during polymerization, and the coatability can be improved. The content of the repeating unit represented by formula (4) is more preferably 70 mol % or less.

In general formula (4) above, R ⁸ and R ⁹ , which may be the same or different, each represent a monovalent organic group having 1 to 20 carbon atoms. R ⁸ and R ⁹ are preferably groups selected from an alkyl group having 1 to 6 carbon atoms and an aryl group having 6 to 12 carbon atoms, from the viewpoint of facilitating adjustment of the molecular weight of polysiloxane during polymerization. However, in the alkyl group and the aryl group, at least part of the hydrogen atoms may be substituted with a radically polymerizable group. In this case, the radically polymerizable group may be radically polymerized in the cured product of the negative photosensitive resin composition.

Polysiloxane preferably further contains a repeating unit represented by the following general formula (5). By containing the repeating unit derived from the trifunctional alkoxysilane compound represented by the general formula (5), the crosslink density of the polysiloxane increases after film formation, and the hardness and chemical resistance of the film can be improved. It is preferable that the polysiloxane contains 10 to 80 mol % of repeating units represented by the general formula (5) in all repeating units. The content of the repeating unit represented by formula (5) is more preferably 15 mol % or more, and even more preferably 20 mol % or more. On the other hand, by containing 80 mol % or less of the repeating unit represented by the general formula (5), excessive thermal polymerization (condensation) of polysiloxane due to heating can be suppressed, and the crack resistance of the partition walls can be improved. The content of the repeating unit represented by formula (5) is more preferably 70 mol % or less.

In general formula (5) above, R ¹⁰ represents a monovalent organic group having 1 to 20 carbon atoms. R ¹⁰ is preferably a group selected from an alkyl group having 1 to 6 carbon atoms and an aryl group having 6 to 12 carbon atoms, from the viewpoint of facilitating adjustment of the molecular weight of polysiloxane during polymerization. However, in the alkyl group and the aryl group, at least part of the hydrogen atoms may be substituted with a radically polymerizable group. In this case, the radically polymerizable group may be radically polymerized in the cured product of the negative photosensitive resin composition. Moreover, two or more kinds of repeating units represented by the general formula (5) having different R ¹⁰ may be included in the polysiloxane. In general formula (5), R ¹⁰ preferably contains a repeating unit containing a styryl group. By including a repeating unit derived from a trifunctional alkoxysilane compound containing a styryl group, even under low temperature heating conditions of about 100 to 120 ° C., the crosslink density of the polysiloxane increases after film formation, resulting in film hardness and chemical resistance. can be improved.

The repeating units represented by the general formulas (4) and (5) are derived from alkoxysilane compounds represented by the following general formulas (6) and (7), respectively. That is, polysiloxanes containing repeating units represented by the general formulas (4) and (5) are hydrolyzed and alkoxysilane compounds containing alkoxysilane compounds represented by the following general formulas (6) and (7). It can be obtained by polycondensation. Other alkoxysilane compounds may also be used. In the general formulas (6) and (7), the notations "-(OR ¹¹ ) ₂ " and "-(OR ¹¹ ) ₃ " mean that the Si atom has two "-(OR ¹¹ )" and three It means that they are individually connected.

In general formulas (6) and (7) above, R ⁸ to R ¹⁰ represent the same groups as R ⁸ to R ¹⁰ in general formulas (4) and (5), respectively. R ¹¹ , which may be the same or different, represents a monovalent organic group having 1 to 20 carbon atoms, preferably an alkyl group having 1 to 6 carbon atoms.

Examples of the alkoxysilane compound represented by the general formula (6) include dimethyldimethoxysilane, dimethyldiethoxysilane, ethylmethyldimethoxysilane, ethylmethyldiethoxysilane, methylpropyldimethoxysilane, methylpropyldiethoxysilane, diphenyldimethoxysilane. Silane, diphenyldiethoxysilane, styrylmethyldimethoxysilane, styrylmethyldiethoxysilane, γ-methacryloylpropylmethyldimethoxysilane, γ-methacryloylpropylmethyldiethoxysilane, γ-acryloylpropylmethyldimethoxysilane, γ-acryloylpropylmethyldiethoxy Silane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 2-(3,4-epoxycyclohexyl)ethylmethyldimethoxysilane, 2-(3,4-epoxycyclohexyl)ethylethyl Dimethoxysilane, methylphenyldimethoxysilane, methylphenyldiethoxysilane, 3-dimethylmethoxysilylpropylsuccinic anhydride, 3-dimethylethoxysilylpropylsuccinic anhydride, 3-dimethylmethoxysilylpropionic acid, 3-dimethylethoxysilylpropion acid, 3-dimethylmethoxysilylpropylcyclohexyldicarboxylic anhydride, 3-dimethylethoxysilylpropylcyclohexyldicarboxylic anhydride, bis(trifluoromethyl)dimethoxysilane, bis(trifluoropropyl)dimethoxysilane, bis(trifluoropropyl) diethoxysilane, trifluoropropylmethyldimethoxysilane, trifluoropropylmethyldiethoxysilane, trifluoropropylethyldimethoxysilane, trifluoropropylethyldiethoxysilane, heptadecafluorodecylmethyldimethoxysilane and the like. You may use 2 or more types of these.

Examples of alkoxysilane compounds represented by general formula (7) include methyltrimethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, propyltrimethoxysilane, propyltriethoxysilane, isobutyltrimethoxysilane, silane, isobutyltriethoxysilane, cyclohexyltrimethoxysilane, cyclohexyltriethoxysilane, 3-isocyanatopropyltrimethoxysilane, 3-isocyanatopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3 - trifunctional alkoxysilane compounds such as ureidopropyltrimethoxysilane and 3-ureidopropyltriethoxysilane; 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 2-(3,4-epoxy cyclohexyl)ethyltrimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltriethoxysilane, 3-ethyl-3-{[3-(trimethoxysilyl)propoxy]methyl}oxetane, 3-ethyl-3-{ Epoxy or oxetane group-containing alkoxysilane compounds such as [3-(triethoxysilyl)propoxy]methyl}oxetane: phenyltrimethoxysilane, phenyltriethoxysilane, 1-naphthyltrimethoxysilane, 2-naphthyltrimethoxysilane, 2 -naphthyltrimethoxysilane, 2-naphthyltrimethoxysilane, tolyltrimethoxysilane, tolyltriethoxysilane, 1-phenylethyltrimethoxysilane, 1-phenylethyltriethoxysilane, 2-phenylethyltrimethoxysilane, 2-phenyl aromatic ring-containing alkoxysilane compounds such as ethyltriethoxysilane, 3-trimethoxysilylpropylphthalic anhydride, 3-triethoxysilylpropylphthalic anhydride; styryltrimethoxysilane, styryltriethoxysilane, vinyltrimethoxysilane, Radical polymerization of vinyltriethoxysilane, allyltrimethoxysilane, allyltriethoxysilane, γ-acryloylpropyltrimethoxysilane, γ-acryloylpropyltriethoxysilane, γ-methacryloylpropyltrimethoxysilane, γ-methacryloylpropyltriethoxysilane, etc. Alkoxysilane compound containing a functional group; 3-trimethoxysilylpropio acid, 3-triethoxysilylpropionic acid, 4-trimethoxysilylbutyric acid, 4-triethoxysilylbutyric acid, 5-trimethoxysilylvaleric acid, 5-triethoxysilylvaleric acid, 3-trimethoxysilylpropylsuccinic anhydride 3-triethoxysilylpropyl succinic anhydride, 3-trimethoxysilylpropyl cyclohexyldicarboxylic anhydride, 3-triethoxysilylpropyl cyclohexyldicarboxylic anhydride, 3-trimethoxysilylpropyl phthalic anhydride, 3 - Carboxyl group-containing alkoxysilane compounds such as triethoxysilylpropyl phthalic anhydride; trifluoropropyltrimethoxysilane, trifluoropropyltriethoxysilane, perfluoropentyltrimethoxysilane, perfluoropentyltriethoxysilane, tridecafluorooctyl fluorine group-containing alkoxy such as trimethoxysilane, tridecafluorooctyltriethoxysilane, tridecafluorooctyltripropoxysilane, tridecafluorooctyltriisopropoxysilane, heptadecafluorodecyltrimethoxysilane, heptadecafluorodecyltriethoxysilane; Examples include silane compounds. You may use 2 or more types of these.

When the resin composition of the present invention has negative photosensitivity, it contains at least one radically polymerizable group-containing alkoxysilane compound as the alkoxysilane compound represented by general formulas (6) and/or (7). is preferred. By containing the radically polymerizable group-containing alkoxysilane compound, a crosslinking reaction proceeds with the radicals generated in the exposed area, and the degree of curing of the exposed area can be increased. When the resin composition of the present invention has negative photosensitivity, it contains at least one carboxyl group-containing alkoxysilane compound as the alkoxysilane compound represented by the general formulas (6) and/or (7). is preferred. Containing a carboxyl group-containing alkoxysilane compound improves the solubility of the unexposed area, and can improve the resolution during pattern processing.

Other alkoxysilane compounds include, for example, tetrafunctional alkoxysilane compounds such as tetramethoxysilane, tetraethoxysilane, and silicate 51 (tetraethoxysilane oligomer); monofunctional alkoxysilane compounds such as trimethylmethoxysilane and triphenylmethoxysilane; are mentioned. You may use 2 or more types of these.

The content of the alkoxysilane compound represented by the general formula (6) in the alkoxysilane compound that is the raw material of the polysiloxane is the content of the repeating unit represented by the general formula (4) in all the repeating units of the polysiloxane. From the viewpoint of setting the amount within the above range, it is preferably 10 mol % or more, more preferably 15 mol % or more, and even more preferably 20 mol % or more. On the other hand, the content of the alkoxysilane compound represented by general formula (7) is preferably 80 mol % or less, more preferably 70 mol % or less, from the same viewpoint.

From the viewpoint of coatability, the weight average molecular weight (Mw) of polysiloxane is preferably 1,000 or more, more preferably 2,000 or more. On the other hand, from the viewpoint of developability, Mw of polysiloxane is preferably 500,000 or less, more preferably 300,000 or less. Here, the Mw of polysiloxane in the present invention refers to a polystyrene conversion value measured by gel permeation chromatography (GPC). The measuring method is as described in Examples below.

Polysiloxane can be obtained by hydrolyzing the aforementioned organosilane compound and then subjecting the hydrolyzate to a dehydration condensation reaction in the presence or absence of a solvent.

Various conditions for hydrolysis can be set according to physical properties suitable for the intended use, taking into consideration the reaction scale, the size and shape of the reaction vessel, and the like. Various conditions include, for example, acid concentration, reaction temperature, and reaction time.

Acid catalysts such as hydrochloric acid, acetic acid, formic acid, nitric acid, oxalic acid, hydrochloric acid, sulfuric acid, phosphoric acid, polyphosphoric acid, polyvalent carboxylic acids and their anhydrides, and ion exchange resins can be used for the hydrolysis reaction. Among these, an acidic aqueous solution containing an acid selected from formic acid, acetic acid and phosphoric acid is preferred.

When an acid catalyst is used for the hydrolysis reaction, the amount of the acid catalyst added is 0.05 parts by weight with respect to 100 parts by weight of all the alkoxysilane compounds used in the hydrolysis reaction, from the viewpoint of making the hydrolysis proceed more rapidly. part or more is preferable, and 0.1 part by weight or more is more preferable. On the other hand, from the viewpoint of appropriately adjusting the progress of the hydrolysis reaction, the amount of the acid catalyst to be added is preferably 20 parts by weight or less, more preferably 10 parts by weight or less with respect to 100 parts by weight of all the alkoxysilane compounds. Here, the total amount of alkoxysilane compound means the amount including all of the alkoxysilane compound, its hydrolyzate and its condensate. The same shall apply hereinafter.

A hydrolysis reaction can be performed in a solvent. The solvent can be appropriately selected in consideration of the stability, wettability, volatility, etc. of the resin composition.

When a solvent is generated by the hydrolysis reaction, hydrolysis can be performed without a solvent. When used in a resin composition, it is also preferable to adjust the resin composition to an appropriate concentration by further adding a solvent after the hydrolysis reaction is completed. It is also possible to distill off and remove all or part of the alcohol produced by heating and/or under reduced pressure after hydrolysis, and then add a suitable solvent.

Examples of the dehydration-condensation reaction method include a method of directly heating a silanol compound solution obtained by a hydrolysis reaction of an organosilane compound. The heating temperature is preferably 50° C. or higher and the boiling point of the solvent or lower, and the heating time is preferably 1 to 100 hours. Further, reheating or addition of a base catalyst may be performed in order to increase the degree of polymerization of polysiloxane. Depending on the purpose, after the dehydration condensation reaction, an appropriate amount of the alcohol produced may be distilled off under heating and/or under reduced pressure, and then a suitable solvent may be added.

The resin composition of the present invention preferably has negative or positive photosensitivity when used for pattern formation of partition walls (A-1) described below. When imparting negative photosensitivity, it is preferable to contain a photopolymerization initiator, and partition walls having a highly precise pattern can be formed. The negative photosensitive resin composition preferably further contains a photopolymerizable compound. On the other hand, when imparting positive photosensitivity, it is preferable to contain a quinonediazide compound.

Any photopolymerization initiator can be used as long as it decomposes and/or reacts with irradiation of light (including ultraviolet rays and electron beams) to generate radicals. For example, 2-methyl-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholin-4-yl α-Aminoalkylphenone compounds such as -phenyl)-butan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1; 2,4,6-trimethylbenzoylphenyl Acylphosphine oxide compounds such as phosphine oxide, bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide, bis(2,6-dimethoxybenzoyl)-(2,4,4-trimethylpentyl)-phosphine oxide ; 1-phenyl-1,2-propanedione-2-(O-ethoxycarbonyl)oxime, 1,2-octanedione-1-[4-(phenylthio)-2-(O-benzoyloxime)], 1- Phenyl-1,2-butadione-2-(O-methoxycarbonyl)oxime, 1,3-diphenylpropanetrione-2-(O-ethoxycarbonyl)oxime, ethanone-1-[9-ethyl-6-(2- oxime ester compounds such as methylbenzoyl)-9H-carbazol-3-yl]-1-(O-acetyloxime); 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1-(4-isopropyl α-hydroxyketones such as phenyl)-2-hydroxy-2-methylpropan-1-one, 4-(2-hydroxyethoxy)phenyl-(2-hydroxy-2-propyl)ketone, 1-hydroxycyclohexyl-phenylketone Compound; Acetophenone compounds such as 2,2-diethoxyacetophenone, 2,3-diethoxyacetophenone, 4-t-butyldichloroacetophenone, benzalacetophenone, 4-azidobenzalacetophenone, and the like. You may contain 2 or more types of these.

From the viewpoint of effectively promoting radical curing, the content of the photopolymerization initiator in the resin composition of the present invention is preferably 0.01% by weight or more, more preferably 1% by weight or more, based on the solid content. On the other hand, the content of the photopolymerization initiator is preferably 20% by weight or less, more preferably 10% by weight or less, based on the solid content, from the viewpoint of suppressing elution of the remaining photopolymerization initiator.

The photopolymerizable compound in the present invention refers to a compound having two or more ethylenically unsaturated double bonds in its molecule. Considering the easiness of radical polymerization, the photopolymerizable compound preferably has a (meth)acrylic group.

Examples of photopolymerizable compounds include diethylene glycol diacrylate, triethylene glycol diacrylate, tetraethylene glycol diacrylate, diethylene glycol dimethacrylate, triethylene glycol dimethacrylate, tetraethylene glycol dimethacrylate, trimethylolpropane diacrylate, and trimethylolpropane. triacrylate, trimethylolpropane dimethacrylate, trimethylolpropane trimethacrylate, 1,3-butanediol diacrylate, 1,3-butanediol dimethacrylate, neopentyl glycol diacrylate, 1,4-butanediol diacrylate, 1, 4-butanediol dimethacrylate, 1,6-hexanediol diacrylate, 1,9-nonanediol dimethacrylate, 1,10-decanediol dimethacrylate, dimethylol-tricyclodecane diacrylate, pentaerythritol triacrylate, pentaerythritol tetra Acrylates, pentaerythritol trimethacrylate, pentaerythritol tetramethacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, tripentaerythritol heptaacrylate, tripentaerythritol octaacrylate, tetrapentaerythritol nonaacrylate, tetrapentaerythritol decaacrylate, pentapenta Erythritol undecaacrylate, pentapentaerythritol dodecaacrylate, tripentaerythritol heptamethacrylate, tripentaerythritol octamethacrylate, tetrapentaerythritol nona methacrylate, tetrapentaerythritol decamethacrylate, pentapentaerythritol undecamethacrylate, pentapentaerythritol dodecamethacrylate, dimethylol- and tricyclodecane diacrylate. You may contain 2 or more types of these.

From the viewpoint of effectively promoting radical curing, the content of the photopolymerizable compound in the resin composition of the present invention is preferably 1% by weight or more based on the solid content. On the other hand, from the viewpoint of suppressing excessive reaction of radicals and improving resolution, the content of the photopolymerizable compound is preferably 50% by weight or less in the solid content.

As the quinonediazide compound, a compound in which a sulfonic acid of naphthoquinonediazide is bonded to a compound having a phenolic hydroxyl group via an ester is preferable. Compounds having a phenolic hydroxyl group used here include, for example, BIs-Z, TekP-4HBPA (tetrakis P-DO-BPA), TrIsP-HAP, TrIsP-PA, BIsRS-2P, BIsRS-3P (the above, commercial products name, manufactured by Honshu Chemical Industry Co., Ltd.), BIR-PC, BIR-PTBP, BIR-BIPC-F (trade names, manufactured by Asahi Organic Chemicals Industry Co., Ltd.), 4,4'-sulfonyldiphenol, BPFL (trade name, manufactured by JFE Chemical Co., Ltd.). As the quinonediazide compound, those obtained by introducing 4-naphthoquinonediazide sulfonic acid or 5-naphthoquinonediazide sulfonic acid into these compounds having a phenolic hydroxyl group via an ester bond are preferable. manufactured by Toyo Gosei Co., Ltd.), SBF-525 (trade name, manufactured by AZ Electronic Materials Co., Ltd.), and the like.

From the viewpoint of improving sensitivity, the content of the quinonediazide compound in the resin composition of the present invention is preferably 0.5% by weight or more, more preferably 1% by weight or more, based on the solid content. On the other hand, the content of the quinonediazide compound is preferably 25% by weight or less, more preferably 20% by weight or less, based on the solid content, from the viewpoint of improving resolution.

The resin composition of the present invention preferably further contains a white pigment and/or a light-shielding pigment. A white pigment has a function of further improving the reflectance of the partition wall. The light-shielding pigment has a function of further improving the light-shielding property of the partition wall against light of a specific wavelength.

When only a white pigment is contained in the resin composition as the pigment, or when both the white pigment and the light-shielding pigment are contained in the resin composition, partition walls having both high reflectivity and high light-shielding property can be obtained. On the other hand, when only a light-shielding pigment is contained in the resin composition as the pigment, partition walls having high light-shielding properties for a specific wavelength can be obtained.

Examples of white pigments include titanium dioxide, zirconium oxide, zinc oxide, barium sulfate, and composite compounds thereof. You may contain 2 or more types of these. Among these, titanium dioxide is preferable because of its high reflectance and easy industrial use.

The crystal structure of titanium dioxide is classified into anatase, rutile and brookite types. Among these, rutile-type titanium oxide is preferable because of its low photocatalytic activity.

The white pigment may be surface-treated. Surface treatment with a metal selected from Al, Si and Zr is preferable, and the light resistance and heat resistance of the formed partition walls can be improved.

The average primary particle size of the white pigment is preferably from 100 to 500 nm, more preferably from 150 nm to 350 nm, from the viewpoint of further improving the reflectance of the partition walls. Here, the average primary particle size of the white pigment can be measured by a laser diffraction method using a particle size distribution analyzer (N4-PLUS; manufactured by Beckman Coulter, Inc.).

Titanium dioxide pigments preferably used as white pigments include, for example, R960 manufactured by DuPont (rutile type, SiO ₂ /Al ₂ O ₃ treatment, average primary particle size 210 nm), CR-97 manufactured by Ishihara Sangyo Co., Ltd. (rutile type, Al ₂ O ₃ /ZrO ₂ treatment, average primary particle size 250 nm), JR-301; Teika Co., Ltd. (rutile type, Al ₂ O ₃ treatment, average primary particle size 300 nm), JR-405 Tayca Co., Ltd. (rutile type, Al ₂ O ₃ treatment, average primary particle size 210 nm), JR-600A; Tayca Co., Ltd. (rutile type, Al ₂ O ₃ treatment, average primary particle size 250 nm), JR- 603; Teika Co., Ltd. (rutile type, Al ₂ O ₃ /ZrO ₂ treatment, average primary particle size 280 nm), and the like. You may contain 2 or more types of these.

From the viewpoint of further improving the reflectance, the content of the white pigment in the resin composition is preferably 10% by weight or more, more preferably 15% by weight or more, based on the solid content. On the other hand, from the viewpoint of improving the surface smoothness of the partition walls, the content of the white pigment is preferably 60% by weight or less, more preferably 55% by weight or less in the solid content.

Any light-shielding pigment can be used as long as it improves the light-shielding property of light of a wavelength, and examples thereof include red pigments, blue pigments, black pigments, green pigments, yellow pigments, and the like.

Examples of red pigments include Pigment Red (hereinafter abbreviated as PR) 9, PR177, PR179, PR180, PR192, PR209, PR215, PR216, PR217, PR220, PR223, PR224, PR226, PR227, PR228, PR240, and PR254. mentioned. You may contain 2 or more types of these.

Examples of blue pigments include Pigment Blue (hereinafter abbreviated as PB) 15, PB15:3, PB15:4 and PB15:6. You may contain 2 or more types of these.

Examples of black pigments include black organic pigments, mixed-color organic pigments, and black inorganic pigments.

Examples of black organic pigments include carbon black, perylene black, aniline black, and benzofuranone pigments. These may be coated with a resin.

Mixed organic pigments include, for example, pseudo-black pigments obtained by mixing two or more pigments selected from red, blue, green, purple, yellow, magenta, cyan, and the like. Among these, a mixed pigment of a red pigment and a blue pigment is preferable from the viewpoint of achieving both a moderately high OD value and pattern workability. The weight ratio of the red pigment and the blue pigment in the mixed pigment is preferably 20/80 to 80/20, more preferably 30/70 to 70/30.

Black inorganic pigments include, for example, graphite; fine particles of metals such as titanium, copper, iron, manganese, cobalt, chromium, nickel, zirconium, zinc, calcium, silver, gold, platinum, and palladium; metal oxides; metal sulfides; metal nitrides; metal oxynitrides; and metal carbides. You may contain 2 or more types of these.

Examples of green pigments include C.I. I. Pigment Green (hereinafter abbreviated as PG) 7, PG36, PG58, PG37, PG59 and the like. You may contain 2 or more types of these.

Examples of yellow pigments include pigment yellow (hereinafter abbreviated as PY) PY137, PY138, PY139, PY147, PY148, PY150, PY153, PY154, PY166, PY168 and PY185. You may contain 2 or more types of these.

The content of the light-shielding pigment in the solid content of the resin composition is preferably 0.005% by weight or more, more preferably 0.05% by weight or more, based on the solid content, from the viewpoint of improving the light-shielding property of light of a specific wavelength. more preferred. On the other hand, from the viewpoint of pattern workability, it is preferably 30% by weight or less, more preferably 15% by weight or less. The average primary particle size of the light-shielding pigment is preferably from 1 to 300 nm, more preferably from 2 nm to 50 nm, from the viewpoint of achieving both the light-shielding properties of the partition walls and the pattern workability. Here, the average primary particle size of the light-shielding pigment can be measured by a laser diffraction method using a particle size distribution analyzer (N4-PLUS; manufactured by Beckman Coulter, Inc.).

The resin composition of the present invention preferably further contains an organic silver compound. The organic silver compound generates yellow particles such as silver nanoparticles by decomposing and aggregating in the exposure step and/or the heating step, and can improve the light shielding property of the film. Any organic silver compound may be used as long as it generates yellow particles in the exposure process and/or the heating process. Examples of conventionally known organic silver compounds include, for example, paragraphs "0048" to "0049" of JP-A-10-62899; Page 19, line 37, European Patent Application Publication No. 962,812A1, JP-A-11-349591, JP-A-2000-7683, JP-A-2000-72711, JP-A-2002-23301, JP-A-2002 -23303, 2002-49119, 196446, European Patent Application Publication No. 1246001A1, European Patent Application Publication No. 1258775A1, JP 2003-140290, JP 2003-195445 JP, No. 2003-295378, No. 2003-295379, No. 2003-295380, No. 2003-295381, No. 2003-270755, and organic silver compounds described in JP 2003-270755, etc., and aliphatic silver salts of carboxylic acids;

Among these, a compound represented by the following general formula (1) and/or a polymer compound having a structure represented by the following general formula (2) is preferred from the viewpoint of further yellowing.

In general formula (1), R ₁ represents hydrogen or an organic group having 1 to 30 carbon atoms. Here, the "organic group having 1 to 30 carbon atoms" includes alkyl groups having 1 to 30 carbon atoms (including linear and branched alkyl groups) and/or aromatic carbonized groups having 6 to 30 carbon atoms. A hydrogen group is preferred. Preferred specific examples thereof include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, n-pentyl group, isopentyl group, n-hexyl group, isohexyl group, n-heptyl group, isoheptyl group, n-octyl group, isooctyl group, n-nonyl group, isononyl group, decyl group, undecyl group, dodecyl group, tridecyl group, tetradecyl group, pentadecyl group, hexadecyl group, heptadecyl group, octadecyl group, nonadecyl group, eicosyl phenyl, benzyl, tolyl, biphenyl and naphthyl radicals.

In general formula (2), R ² and R ³ each independently represent hydrogen or an organic group having 1 to 30 carbon atoms. Here, the "organic group having 1 to 30 carbon atoms" includes alkyl groups having 1 to 30 carbon atoms (including linear and branched alkyl groups) and/or aromatic carbonized groups having 6 to 30 carbon atoms. A hydrogen group is preferred. Preferred specific examples thereof include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, n-pentyl group, isopentyl group, n-hexyl group, isohexyl group, n-heptyl group, isoheptyl group, n-octyl group, isooctyl group, n-nonyl group, isononyl group, decyl group, undecyl group, dodecyl group, tridecyl group, tetradecyl group, pentadecyl group, hexadecyl group, heptadecyl group, octadecyl group, nonadecyl group, eicosyl phenyl, benzyl, tolyl, biphenyl and naphthyl radicals. Also, a is an integer of 1 or more, preferably 1 to 10,000, more preferably 5 to 1,000.

Examples of organic silver compounds represented by formula (1) include silver acetate, silver propionate, silver butyrate, silver valerate, silver hexanoate, silver enanthate, silver octylate, silver pelargonate, and silver caprate. , silver neodecanoate, silver salicylate, silver carbonate, silver p-toluenesulfonate, silver trifluoroacetate, silver 2-ethylhexanoate, silver diethyldithiocarbamate, silver benzoate, silver pyridine-2-carboxylate, silver behenate, Silver arachidate, silver stearate, silver oleate, silver laurate, silver caproate, silver myristate, silver palmitate and the like. You may contain 2 or more types of these. Among these, silver neodecanoate, silver octylate, and silver salicylate are preferable from the viewpoint of solubility in organic solvents and yellowing.

The organic silver compound represented by the general formula (2) has a structure in which the carboxyl group in the (meth)acrylic polymer having the carboxyl group is converted into a silver salt. The organic silver compound represented by the general formula (2) is obtained, for example, by stirring a (meth)acrylic polymer having a carboxyl group and silver nitrate in an organic solvent in the presence of an amine catalyst, as in the preparation examples described later. be done.

The (meth)acrylic polymer having a carboxyl group is obtained by polymerizing an unsaturated carboxylic acid. Examples of unsaturated carboxylic acids include acrylic acid, methacrylic acid, itaconic acid, crotonic acid, maleic acid, fumaric acid, vinylacetic acid, and acid anhydrides. These may be used alone, or may be used in combination with other copolymerizable ethylenically unsaturated compounds. Specific examples of copolymerizable ethylenically unsaturated compounds include methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, n-propyl acrylate, isopropyl acrylate, n-propyl methacrylate, and methacrylic acid. isopropyl, n-butyl acrylate, n-butyl methacrylate, sec-butyl acrylate, sec-butyl methacrylate, iso-butyl acrylate, iso-butyl methacrylate, tert-butyl acrylate, tert-butyl methacrylate, unsaturated carboxylic acid alkyl esters such as n-pentyl acrylate, n-pentyl methacrylate, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, benzyl acrylate, benzyl methacrylate, styrene, p-methylstyrene, o-methylstyrene, Aromatic vinyl compounds such as m-methylstyrene and α-methylstyrene, unsaturated carboxylic acid aminoalkyl esters such as aminoethyl acrylate, unsaturated carboxylic acid glycidyl esters such as glycidyl acrylate and glycidyl methacrylate, vinyl acetate, vinyl propionate, etc. carboxylic acid vinyl esters, vinyl cyanide compounds such as acrylonitrile, methacrylonitrile and α-chloroacrylonitrile, aliphatic conjugated dienes such as 1,3-butadiene and isoprene, polystyrenes having acryloyl groups or methacryloyl groups at their ends, Examples include, but are not limited to, macromonomers such as polymethyl acrylate, polymethyl methacrylate, polybutyl acrylate, polybutyl methacrylate, and polysilicone. The (meth)acrylic polymer is not particularly limited.

A commercially available product may be used as the (meth)acrylic polymer having the carboxyl group. Commercially available (meth)acrylic polymers having a carboxyl group include, for example, AX3-BX-TR-101, AX3-BX-TR-102, AX3-BX-TR-106, AX3-BX-TR-107, AX3- BX-TR-108, AX3-BX-TR-109, AX3-BX-TR-110, AX3-RD-TR-501, AX3-RD-TR-502, AX3-RD-TR-503, AX3-RD- TR-504, AX3-RD-TR-103, AX3-RD-TR-104 (trade name, manufactured by Nippon Shokubai Co., Ltd.), SPCR-10X, SPCR-10P, SPCR-24X, SPCR-18X, SPCR-215X ( (trade name, manufactured by Showa Denko KK), X-4007 (trade name, manufactured by NOF Corporation), and the like. Among these, SPCR-10X, SPCR-10P, SPCR-24X, SPCR-18X and SPCR-215X are preferred. Two or more of these may be used.

Further, the weight average molecular weight (Mw) of the polymer compound represented by the general formula (2) is not particularly limited, but is preferably 5000 to 50000, more preferably 8000 to 35000 in terms of polystyrene measured by GPC. . If Mw is less than 5,000, pattern drooping will occur during heat curing, resulting in lower resolution. On the other hand, when Mw is more than 50,000, silver is difficult to be reduced and yellow particles are difficult to form.

The content of the organic silver compound in the solid content of the resin composition is preferably 0.1% by weight or more, more preferably 0.4% by weight or more. By setting the content of the organic silver compound to 0.4% by weight or more, the partition walls obtained can be made more yellow, and the blue light shielding properties of the partition walls are improved. On the other hand, if the content of the organic silver compound is too large, radicals partially generated by decomposition of the organic silver compound cause an excessive reaction, making pattern formation difficult. Moreover, since the organic silver compound is expensive, if the content is too large, the cost of the resin composition will increase. Therefore, the content of the organic silver compound in the solid content of the resin composition is preferably 10% by weight or less, more preferably 5.0% by weight or less.

The resin composition of the present invention preferably further contains a reducing agent. The reducing agent accelerates the reduction of the organic silver compound, thereby more efficiently producing yellow particles, and can improve the light-shielding property of the film even under low-temperature heating conditions of about 100 to 120°C. As a result, for example, the present technology can be applied even in applications in which a material such as an organic EL material that is concerned about heat resistance exists as an underlying layer and low-temperature heating conditions are essential. Moreover, since the content of the organic silver compound in the resin composition can be reduced, the resin composition can be provided at a lower cost. In addition, if an unreacted organic silver compound remains in the film after heating, it will be decomposed by light or heat, and the film color will change, resulting in a film with poor weather resistance. , the amount of the organic silver compound remaining in the film after curing is reduced, and the weather resistance is improved.

The reducing agent may be any compound as long as it promotes the reduction of the organic silver compound, but from the viewpoint of reducing the organic silver compound more efficiently, it contains two or more phenolic hydroxyl groups in the molecule. Compounds or compounds containing enediol groups are preferred.

Compounds containing two or more phenolic hydroxyl groups in the molecule include, for example, dihydric phenol compounds such as catechol compounds, hydroquinone compounds, resorcinol compounds, anthrahydroquinone compounds, and polyphenols containing three or more phenolic hydroxyl groups. compound. Among these, a hydroquinone compound represented by the following general formula (3) is more preferable from the viewpoint of reducing properties.

In general formula (3), R ₄ , R ₅ , R ₆ and R ₇ each independently represent hydrogen, a hydroxy group, or an organic group having 1 to 30 carbon atoms. Here, the "organic group having 1 to 30 carbon atoms" includes alkyl groups having 1 to 30 carbon atoms (including linear and branched alkyl groups) and/or aromatic carbonized groups having 6 to 30 carbon atoms. A hydrogen group is preferred. Preferred specific examples thereof include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, n-pentyl group, isopentyl group, n-hexyl group, isohexyl group, n-heptyl group, isoheptyl group, n-octyl group, isooctyl group, n-nonyl group, isononyl group, decyl group, undecyl group, dodecyl group, tridecyl group, tetradecyl group, pentadecyl group, hexadecyl group, heptadecyl group, octadecyl group, nonadecyl group, eicosyl phenyl, benzyl, tolyl, biphenyl and naphthyl radicals.

Examples of hydroquinone compounds represented by the following general formula (3) include hydroquinone, methylhydroquinone, ethylhydroquinone, propylhydroquinone, butylhydroquinone, t-butylhydroquinone, 2,3-dimethylhydroquinone, 2,3-diethylhydroquinone, 2,3-dipropylhydroquinone, 2,3-dibutylhydroquinone, 2,3-di-t-butylhydroquinone, 2,5-dimethylhydroquinone, 2,5-diethylhydroquinone, 2,5-dipropylhydroquinone, 2,5 -dibutylhydroquinone, 2,5-di-t-butylhydroquinone, hydroquinone dimethyl ether, hydroquinone diethyl ether, 1,2,4-benzenetriol, 2,5-dihydroxyacetophenone, 2,5-dihydroxybenzoic acid, phenylhydroquinone, 2, 6-dimethylhydroquinone, 2,6-diethylhydroquinone, 2,6-dipropylhydroquinone, 2,6-dibutylhydroquinone, 2,6-di-t-butylhydroquinone, 2,6-dihydroxyacetophenone, 2,6-dihydroxybenzoin acid, phenylhydroquinone, phenylhydroquinone, 2,5-t-amylhydroquinone and the like. Among them, t-butylhydroquinone, 2,3-dimethylhydroquinone, 2,6-dimethylhydroquinone, 2,5-t-amylhydroquinone, 2,3-dipropylhydroquinone, 2,3-dibutylhydroquinone, 2,3-di-t-butylhydroquinone, 2,5-dipropylhydroquinone, 2,5-dibutylhydroquinone, 2,5-di-t-butylhydroquinone preferable.

Compounds containing an enediol group include, for example, ascorbic acid, α-pyridoin, fructose, xylose, glucose, dioxyacetone, glycolaldehyde, benzoin, monooxyacetone, benzoylcarbinol. Among these, glycolaldehyde is preferable from the viewpoint of reducing properties and solubility in organic solvents.

The content of the reducing agent in the solid content of the resin composition is preferably 0.01% by weight or more, more preferably 0.1% by weight or more. By setting the content of the reducing agent to 0.1% by weight or more, the organic silver compound can be reduced more effectively, the partition walls obtained can be further yellowed, and the blue light blocking properties of the partition walls are improved. . In addition, the amount of the organic silver compound remaining in the film after curing is reduced, improving the weather resistance.

On the other hand, when the resin composition is a negative photosensitive resin composition, if the content of the reducing agent is too large, the reducing agent traps radicals generated by the decomposition of the photopolymerization initiator during exposure, resulting in decreased exposure sensitivity. descend. Therefore, the content of the reducing agent in the solid content of the resin composition is preferably 3.0% by weight or less, more preferably 1.5% by weight or less.

The resin composition of the present invention preferably further contains a liquid-repellent compound. A liquid-repellent compound is a compound that imparts a property of repelling water or an organic solvent (liquid-repellent performance) to a resin composition. The compound is not particularly limited as long as it has such properties, but specifically, a compound having a fluoroalkyl group is preferably used. By containing the liquid-repellent compound, liquid-repellent performance can be imparted to the top of the partition walls (A-1) described later after the partition walls (A-1) are formed. As a result, for example, when forming pixels containing the (B) color-converting light-emitting material described later, color-converting light-emitting materials having different compositions can be easily applied to each pixel.

The liquid-repellent compound is preferably a liquid-repellent compound having a radically photopolymerizable group. By having a photoradical polymerizable group, it is possible to form a strong bond with a resin, so that liquid repellency can be more easily imparted to the top of the partition wall.

Examples of liquid-repellent compounds include 1,1,2,2-tetrafluorooctyl (1,1,2,2-tetrafluoropropyl) ether, 1,1,2,2-tetrafluorooctylhexyl ether, and octaethylene. Glycol di(1,1,2,2-tetrafluorobutyl) ether, perfluoroalkyl-N-ethylsulfonylglycinate, bis(N-perfluorooctylsulfonyl-N-ethylaminoethyl) phosphate, monoperfluoroalkyl Examples thereof include compounds having fluoroalkyl or fluoroalkylene groups at the terminal, main chain and/or side chain such as ethyl phosphate. In addition, commercially available liquid-repellent compounds include "Megafac" (registered trademark) F142D, F172, F173, F183, F444, and F477 (manufactured by Dainippon Ink and Chemicals Co., Ltd.), F-top EF301, 303, and 352. (manufactured by Shin-Akita Kasei Co., Ltd.), Florard FC-430, FC-431 (manufactured by Sumitomo 3M Co., Ltd.), “Asahi Guard” (registered trademark) AG710, “Surflon” (registered trademark) S-382, SC -101, SC-102, SC-103, SC-104, SC-105, SC-106 (manufactured by Asahi Glass Co., Ltd.), BM-1000, BM-1100 (manufactured by Yusho Co., Ltd.), NBX-15, Examples include FTX-218 and DFX-18 (manufactured by Neos Co., Ltd.). You may contain 2 or more types of these.

Liquid-repellent compounds having photoradical polymerizable groups include, for example, “Megafac” (registered trademark) RS-72-A, RS-75-A, RS-76-E, RS-56, RS-72-K , RS-75, RS-76-E, RS-76-NS, RS-76, and RS-90 (all trade names, manufactured by DIC Corporation). In this case, the photopolymerizable group may be photopolymerized in the partition walls (A-1) made of the photocured product of the negative photosensitive resin composition.

From the viewpoint of improving the liquid-repellent performance of the partition wall and improving the inkjet applicability, the content of the liquid-repellent compound in the resin composition is preferably 0.01% by weight or more, more preferably 0.1% by weight or more, based on the solid content. more preferred. On the other hand, from the viewpoint of improving compatibility with resins and white pigments, the content of the liquid-repellent compound is preferably 10% by weight or less, more preferably 5% by weight or less, based on the solid content.

The resin composition of the present invention may further contain an organic metal compound other than the organic silver compound. The organometallic compound other than the organosilver compound is preferably an organometallic compound containing at least one metal selected from the group consisting of gold, platinum and palladium. An organometallic compound containing at least one metal selected from the group consisting of gold, platinum and palladium decomposes and agglomerates in the exposure step and/or the heating step to form black particles, which deteriorates pattern processability. The light-shielding property of the film can be further improved without reducing the

Examples of organic metal compounds other than organic silver compounds include organic gold compounds such as chloro(triphenylphosphine) gold, gold resinate MR7901-P, and tetrachloroauric acid tetrahydrate; bis(acetylacetonato)platinum, dichlorobis organoplatinum compounds such as (triphenylphosphine)platinum and dichlorobis(benzonitrile)platinum; and organic palladium compounds such as dibenzylideneacetone palladium. You may contain 2 or more types of these.

Among these, an organometallic compound selected from bis(acetylacetonato)palladium, dichlorobis(triphenylphosphine)palladium, dichlorobis(benzonitrile)palladium and tetrakis(triphenylphosphine)palladium from the viewpoint of further improving light shielding properties. is preferred.

In the resin composition of the present invention, the content of the organic metal compound other than the organic silver compound in the solid content is preferably 0.2 to 5% by weight. By making it 0.2% by weight or more, the light shielding property of the obtained film can be further improved. 0.5% by weight or more is more preferable. On the other hand, by setting the content of the organic metal compound other than the organic silver compound to 5% by weight or less, the reflectance can be further improved. 3% by weight or less is more preferable.

The resin composition of the present invention may further contain a coordinating compound having a phosphorus atom (hereinafter sometimes referred to as "coordinating compound"). The coordinating compound coordinates to the organometallic compound in the resin composition, improves the solubility of the organometallic compound in the solvent, promotes the decomposition of the organometallic compound, and further improves the light-shielding properties of the resulting film. can be made Coordinating compounds include, for example, triphenylphosphine, tri-t-butylphosphine, trimethylphosphine, tricyclohexylphosphine, tri-t-butylphosphine tetrafluoroborate, tri(2-furyl)phosphine, tris(1- adamantyl)phosphine, tris(diethylamino)phosphine, tris(4-methoxyphenyl)phosphine, tris(O-tolyl)phosphine and the like. You may contain 2 or more types of these. The content of the coordinating compound in the solid content of the resin composition of the present invention is preferably 0.5 to 3.0 molar equivalents relative to the organometallic compound.

Moreover, the resin composition of the present invention may contain a polymerization inhibitor, a surfactant, an adhesion improver, and the like, if necessary.

By including a surfactant in the resin composition of the present invention, it is possible to improve flowability during application. Surfactants include, for example, "Megafac" (registered trademark) F142D, F172, F173, F183, F445, F470, F475, F477 (trade names, manufactured by Dainippon Ink & Chemicals, Inc.), NBX- 15, fluorine-based surfactants such as FTX-218 (trade name, manufactured by Neos Co., Ltd.); Japan Co., Ltd.), polyalkylene oxide surfactants, poly(meth)acrylate surfactants, and the like. You may contain 2 or more types of these.

By including an adhesion improving agent in the resin composition of the present invention, the adhesion to the underlying substrate is improved, and highly reliable partition walls can be obtained. Examples of adhesion improvers include alicyclic epoxy compounds and silane coupling agents. Among these, alicyclic epoxy compounds are preferred from the viewpoint of heat resistance.

Examples of alicyclic epoxy compounds include 3′,4′-epoxycyclohexymethyl-3,4-epoxycyclohexanecarboxylate, 2,2-bis(hydroxymethyl)-1-butanol and 1,2-epoxy- 4-(2-oxiranyl)cyclohexane adduct, ε-caprolactone-modified 3′,4′-epoxycyclohexylmethyl 3′,4′-epoxycyclohexane carboxylate, 1,2-epoxy-4-vinylcyclohexane, butanetetracarboxylic acid tetra(3,4-epoxycyclohexylmethyl)-modified ε-caprolactone, 3,4-epoxycyclohexylmethyl methacrylate, and the like. You may contain 2 or more types of these.

The content of the adhesion improving agent in the resin composition of the present invention is preferably 0.1% by weight or more, more preferably 1% by weight or more, based on the solid content, from the viewpoint of further improving the adhesion to the underlying substrate. . On the other hand, the content of the adhesion improver is preferably 20% by weight or less, more preferably 10% by weight or less, in the solid content from the viewpoint of pattern processability.

The resin composition of the present invention preferably further contains a solvent. The solvent has the function of adjusting the viscosity of the resin composition to a range suitable for application and improving the uniformity of the partition walls. As the solvent, it is preferable to combine a solvent having a boiling point of more than 150° C. and 250° C. or less under atmospheric pressure and a solvent having a boiling point of 150° C. or less.

Examples of solvents include alcohols such as isopropanol and diacetone alcohol; glycols such as ethylene glycol and propylene glycol; ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol. ethers such as monopropyl ether and propylene glycol monobutyl ether; ketones such as methyl ethyl ketone, acetylacetone, methyl propyl ketone, methyl butyl ketone, methyl isobutyl ketone, diisobutyl ketone and cyclopentanone; amides such as dimethylformamide and dimethylacetamide; Ethyl acetate, propyl acetate, butyl acetate, isobutyl acetate, ethylene glycol monoethyl ether acetate, propylene glycol monomethyl ether acetate, 3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, methyl lactate, ethyl lactate, butyl lactate, etc. acetates; aromatic or aliphatic hydrocarbons such as toluene, xylene, hexane, cyclohexane; γ-butyrolactone, N-methyl-2-pyrrolidone, dimethyl sulfoxide; You may contain 2 or more types of these. Among these, it is preferable to combine diacetone alcohol as a solvent with a boiling point of more than 150° C. and 250° C. or less under atmospheric pressure and propylene glycol monomethyl ether as a solvent with a boiling point of 150° C. or less from the viewpoint of coating properties.

The content of the solvent can be arbitrarily set according to the coating method and the like. For example, when forming a film by spin coating, the content of the solvent is generally 50% by weight or more and 95% by weight or less in the resin composition.

The resin composition of the present invention is produced by, for example, mixing the aforementioned resin, photopolymerization initiator or quinonediazide compound, white pigment and/or light-shielding pigment, organic silver compound, reducing agent and, if necessary, other components. be able to.

Next, the light shielding film of the present invention will be explained. The light-shielding film of the present invention is obtained by curing the resin composition of the present invention described above. The light-shielding film of the present invention can be suitably used as a light-shielding pattern in an OGS type touch panel, such as a decorative pattern for a cover base material, in addition to the barrier ribs (A-1) described later. The film thickness of the light shielding film is preferably 10 μm or more.

Next, the method for producing the light-shielding film of the present invention will be described with an example. The method for producing a light-shielding film of the present invention includes a film-forming step of applying the resin composition of the present invention on a base substrate and drying to obtain a dry film, an exposure step of pattern-exposing the obtained dry film, and a It is preferable to have a developing step of dissolving and removing a portion of the dry film that is soluble in a developer and a heating step of heating and curing the dry film after development.

In the method for producing a light-shielding film of the present invention, in the heating step, the film after development is heated at a temperature of 100° C. or more and 250° C. or less, thereby increasing the OD value per 10 μm of film thickness at a wavelength of 450 nm by 1.0 or more. It is characterized by From the viewpoint of further improving the OD value, the heating temperature in the heating step is preferably 150° C. or higher, more preferably 180° C. or higher.

The heating temperature during the heating step is preferably 250° C. or lower, more preferably 240° C. or lower, from the viewpoint of suppressing crack generation in the heated film. The heating time is preferably 15 minutes to 2 hours. The film formed from the resin composition of the present invention has a low OD value at the time of exposure, and the OD value increases after pattern formation. Angular diaphragms can be obtained. In addition, since the OD value at a wavelength of 450 nm after pattern formation is high, it is possible to obtain partition walls that have both high reflectivity for all visible light and high light shielding performance for blue light.

Examples of the method of applying the resin composition in the film-forming step include a slit coating method and a spin coating method. Examples of the drying device include a hot air oven and a hot plate. The drying time is preferably 80 to 120° C., preferably 1 to 15 minutes.

The exposure step is a step of photocuring the necessary portion of the dry film by exposure or photolyzing the unnecessary portion of the dry film to make any portion of the dry film soluble in the developer. . In the exposure step, exposure may be performed through a photomask having a predetermined opening, or an arbitrary pattern may be directly drawn using a laser beam or the like without using a photomask.

Examples of the exposure device include a proximity exposure machine. The actinic rays irradiated in the exposure step include, for example, near-infrared rays, visible rays, and ultraviolet rays, and ultraviolet rays are preferred. Examples of the light source include low-pressure mercury lamps, high-pressure mercury lamps, ultra-high-pressure mercury lamps, halogen lamps, germicidal lamps, etc. Ultra-high-pressure mercury lamps are preferred.

Exposure conditions can be appropriately selected depending on the thickness of the dry film to be exposed. In general, it is preferable to perform exposure using an ultra-high pressure mercury lamp with an output of 1 to 100 mW/cm ² and an exposure amount of 1 to 10,000 mJ/cm ² .

In the development process, the developer-soluble portion of the dry film after exposure is dissolved and removed with the developer, leaving only the developer-insoluble portion, and the dry film patterned in an arbitrary pattern shape (hereinafter referred to as , which is called a pre-heating pattern). The pattern shape includes, for example, a lattice shape, a stripe shape, a hole shape, and the like.

The developing method includes, for example, an immersion method, a spray method, a brush method, and the like.

As the developer, a solvent capable of dissolving unnecessary portions in the dry film after exposure can be appropriately selected, and an aqueous solution containing water as a main component is preferable. For example, when the resin composition contains a polymer having a carboxyl group, the developer is preferably an alkaline aqueous solution. Examples of alkaline aqueous solutions include inorganic alkaline aqueous solutions such as sodium hydroxide, potassium hydroxide, sodium carbonate and calcium hydroxide; organic alkaline aqueous solutions such as tetramethylammonium hydroxide and trimethylbenzylammonium hydroxide. Among these, a potassium hydroxide aqueous solution or a tetramethylammonium hydroxide aqueous solution is preferable from the viewpoint of improving resolution. From the viewpoint of improving developability, the concentration of the alkaline aqueous solution is preferably 0.05% by weight or more, more preferably 0.1% by weight or more. On the other hand, the concentration of the alkaline aqueous solution is preferably 5% by weight or less, more preferably 1% by weight or less, from the viewpoint of suppressing peeling and corrosion of the pattern before heating. Moreover, from the viewpoint of improving the resolution, the developer may contain a surfactant. The developing temperature is preferably 20 to 50° C. in order to facilitate process control.

The heating step is a step of heating and curing the preheated pattern formed in the developing step. Examples of heating devices include hot plates and ovens. Preferred heating temperature and heating time are as described above.

Next, the board|substrate with a partition of this invention is demonstrated. The substrate with partition walls of the present invention has (A-1) patterned partition walls (hereinafter sometimes referred to as “partition walls (A-1)”) formed on an underlying substrate. The underlying substrate functions as a support for the substrate with partition walls. When pixels containing a color-converting luminescent material, which will be described later, are included, the partition has a function of suppressing color mixture of light between adjacent pixels.

In the substrate with partition walls of the present invention, the partition walls (A-1) have a reflectance of 10% to 60% per 10 μm thickness at a wavelength of 450 nm and an OD value of 1.5 to 5.0 per 10 μm thickness at a wavelength of 450 nm. characterized by being By setting the reflectance to 10% or more and the OD value to 5.0 or less, (A-1) the luminance of the display device can be improved by utilizing the reflection on the side surface of the partition wall. On the other hand, by setting the reflectance at a wavelength of 450 nm to 60% or less and the OD value to 1.5 or more, blue light passing through the partition wall (A-1) is suppressed and color mixture of light between adjacent pixels is suppressed. can be done.

FIG. 1 shows a cross-sectional view of one mode of the substrate with partitions of the present invention having patterned partitions. A base substrate 1 has partition walls 2 patterned thereon.

<Underlying substrate>
Examples of the base substrate include a glass plate, a resin plate, and a resin film. Non-alkali glass is preferable as the material of the glass plate. Polyester, (meth)acrylic polymer, transparent polyimide, polyethersulfone and the like are preferable as materials for the resin plate and the resin film. The thickness of the glass plate and the resin plate is preferably 1 mm or less, more preferably 0.8 mm or less. The thickness of the resin film is preferably 100 μm or less.

<Partition (A-1)>
The barrier rib (A-1) has a reflectance of 10% to 60% per 10 μm thickness at a wavelength of 450 nm and an OD value of 1.5 to 5.0 per 10 μm thickness at a wavelength of 450 nm. Here, the thickness of the partition (A-1) refers to the height of the partition (A-1) and/or the width of the partition (A-1). The height of the partition (A-1) refers to the length of the partition (A-1) in the direction perpendicular to the base substrate (height direction). In the case of the substrate with partition walls shown in FIG. 1, the height of the partition walls 2 is represented by symbol H. Further, the width of the partition (A-1) refers to the length of the partition (A-1) in the direction horizontal to the base substrate. In the case of the substrate with partition walls shown in FIG. 1, the width of the partition walls 2 is represented by symbol L. In addition, in this specification, "height" may be called "thickness."

In the present invention, it is considered that the reflectance on the side surface of the partition wall contributes to the improvement of the brightness of the display device, and the light shielding property contributes to the suppression of color mixture. On the other hand, since the reflectance and OD value per thickness are considered to be the same regardless of the height direction and width direction, the present invention focuses on the reflectance and OD value per thickness of the partition walls. As will be described later, the partition wall (A-1) preferably has a thickness of 0.5 to 100 μm and a width of 1 to 100 μm. Therefore, in the present invention, 10 μm is selected as a representative value of the thickness of the partition (A-1), and the reflectance and OD value per 10 μm of thickness are focused on.

If the reflectance per 10 μm of thickness at a wavelength of 450 nm is less than 10%, the reflection on the side surfaces of the barrier ribs becomes small, resulting in insufficient luminance of the display device. The reflectance per 10 μm thickness at a wavelength of 450 nm is preferably 10% or more, more preferably 20% or more, and even more preferably 30% or more. The higher the reflectance per 10 μm thickness at a wavelength of 450 nm, the greater the reflection of the blue excitation light on the side surface of the partition wall. is improved, and the brightness of the display device can be improved.

Further, the reflectance per 10 μm thickness of the partition wall (A-1) at a wavelength of 550 nm is preferably 30% or more, more preferably 40% or more, and even more preferably 50% or more. The higher the reflectance per 10 μm thickness at a wavelength of 550 nm, the greater the reflection of green light on the side surface of the partition wall. The emitted green light can be efficiently reflected and the brightness of the display device can be improved.

Furthermore, the reflectance per 10 μm thickness of the partition (A-1) at a wavelength of 630 nm is preferably 30% or more, more preferably 40% or more, and even more preferably 50% or more. The higher the reflectance per 10 μm of thickness at a wavelength of 630 nm, the greater the reflection of red light on the side surface of the partition wall. The reflected red light can be efficiently reflected and the brightness of the display device can be improved.

Further, if the OD value per 10 μm thickness of the partition wall (A-1) at a wavelength of 450 nm is less than 1.5, the blue excitation light leaks to adjacent pixels, resulting in light color mixture. The OD value per 10 μm thickness of the partition (A-1) at a wavelength of 450 nm is preferably 1.5 or more, more preferably 2.0 or more, and even more preferably 2.5 or more.

Further, the OD value per 10 μm thickness of the partition (A-1) at a wavelength of 550 nm is preferably 1.0 or more, more preferably 1.5 or more, and even more preferably 2.0 or more. The higher the OD value per 10 μm of thickness at a wavelength of 550 nm, the greater the light-blocking property of green light on the side surface of the partition wall. Emitted green light can be efficiently shielded to prevent color mixture and improve the contrast of the display device.

Furthermore, the OD value per 10 μm thickness of the partition wall (A-1) at a wavelength of 630 nm is preferably 1.0 or more, more preferably 1.5 or more, and even more preferably 2.0 or more. The higher the OD value per 10 μm thickness at a wavelength of 630 nm, the greater the red light-blocking property of the partition wall side surfaces. Emitted red light is efficiently shielded to prevent color mixture and improve the contrast of the display device.

The reflectance per 10 μm thickness of the partition wall (A-1) at wavelengths of 450 nm, 550 nm, and 630 nm was measured from the upper surface of the partition wall (A-1) with a thickness of 10 μm using a spectrophotometer (for example, CM manufactured by Konica Minolta Co., Ltd. -2600d) can be used to measure by SCI mode. However, when a sufficient area for measurement cannot be secured, or when a measurement sample with a thickness of 10 μm cannot be collected, and the composition of the partition wall (A-1) is known, the same composition as the partition wall (A-1) A solid film having a thickness of 10 μm may be prepared, and the reflectance per 10 μm thickness may be obtained by similarly measuring the reflectance of the solid film instead of the partition wall (A-1). For example, using the material for forming the partition wall (A-1), a solid film was prepared under the same processing conditions as for the formation of the partition wall (A-1) except that the thickness was 10 μm and no pattern was formed. Reflectance may be similarly measured from the top surface of the film.

The OD value per 10 μm thickness of the partition wall (A-1) at wavelengths of 450 nm, 550 nm, and 630 nm is obtained from the top surface of the partition wall (A-1) with a thickness of 10 μm using an optical densitometer (for example, Hitachi High-Tech Science U-4100). can be used to measure the intensity of incident light and transmitted light, and the intensity can be calculated by the following formula (1). However, when a sufficient area for measurement cannot be secured, or when a measurement sample with a thickness of 10 μm cannot be collected, and the composition of the partition (A-1) is known, the partition (A-1) A 10 μm-thick solid film having the same composition as A-1) may be prepared, and the OD value per 10 μm thickness may be obtained by similarly measuring the OD value of the solid film instead of the partition wall (A-1). .

OD value = log10( _I0 /I) (1)
I ₀ : incident light intensity I : transmitted light intensity.

In addition, as means for adjusting the reflectance and the OD value within the above ranges, for example, the partition (A-1) is made to have a preferable composition described later.

The taper angle of the partition wall (A-1) is preferably 45° to 110°. The taper angle of the partition wall (A-1) refers to the angle formed by the side and bottom sides of the cross section of the partition wall. In the case of the substrate with partition walls shown in FIG. 1, the taper angle of the partition walls 2 is represented by the symbol θ. By setting the taper angle to 45° or more, the difference in width between the upper portion and the bottom portion of the partition wall (A-1) is reduced, and the width of the partition wall (A-1) can be easily formed within the preferable range described later. . More preferably, the taper angle is 70° or more. On the other hand, by setting the taper angle to 110° or less, when pixels containing the (B) color-converting light-emitting material described later are formed by inkjet coating, it is possible to suppress the breakdown of the ink and improve the inkjet coating properties. can be done. Here, the collapse of ink refers to a phenomenon in which ink crosses over a partition and mixes into an adjacent pixel portion. The taper angle is more preferably 95° or less. The taper angle of the partition wall (A-1) is measured using an optical microscope (FE-SEM (eg, S-4800 manufactured by Hitachi, Ltd.)) at an acceleration voltage of 3. It can be obtained by observing at 0 kV and a magnification of 2,500 times and measuring the angle formed by the side and base of the cross section of the partition wall (A-1).

As means for adjusting the taper angle of the partition wall (A-1) within the above range, for example, the partition wall (A-1) is made to have a preferable composition described later, or the resin composition of the present invention described above is used. forming.

When the substrate with partition walls has pixels containing (B) a color-converting luminescent material described later, the thickness of the partition walls (A-1) is preferably larger than the thickness of the pixels. Specifically, the thickness of the partition wall (A-1) is preferably 0.5 μm or more, more preferably 10 μm or more. On the other hand, the thickness of the partition wall (A-1) is preferably 100 μm or less, more preferably 50 μm or less, from the viewpoint of extracting light emitted from the bottom of the pixel more efficiently. In addition, the width of the partition (A-1) is preferably sufficient to further improve the brightness by utilizing light reflection on the side of the partition and to further suppress color mixture of light in adjacent pixels due to light leakage. Specifically, the width of the partition is preferably 1 μm or more, more preferably 5 μm or more. On the other hand, the width of the partition wall (A-1) is preferably 100 μm or less, more preferably 50 μm or less, from the viewpoint of securing a large light-emitting region of the pixel and further improving luminance.

The partition wall (A-1) has a repeating pattern for a predetermined number of pixels corresponding to the screen size of the image display device. The number of pixels of the image display device is, for example, 4000 horizontally and 2000 vertically. The number of pixels affects the resolution (fineness) of the displayed image. Therefore, it is necessary to form the number of pixels corresponding to the required image resolution and the screen size of the image display device, and it is preferable to determine the partition pattern formation dimensions accordingly.

The partition wall (A-1) preferably contains a resin, a white pigment and/or a light-shielding pigment, silver oxide and/or silver particles, and a quinone compound. The resin has a function of improving crack resistance and light resistance of the partition walls. A white pigment has a function of further improving the reflectance of the partition wall. The light-shielding pigment has a function of improving the light-shielding properties of the partition wall against light of a specific wavelength. Silver oxide and/or silver particles have the function of adjusting the OD value and suppressing color mixture of light in adjacent pixels. When the resin composition contains a hydroquinone compound as a reducing agent, the quinone compound is generated in the partition wall by being oxidized when the hydroquinone compound promotes reduction of the organic silver compound.

The resin, white pigment, and light-shielding pigment are as described above as materials constituting the resin composition. The resin content in the partition walls (A-1) is preferably 10% by weight or more, more preferably 20% by weight or more, from the viewpoint of improving the crack resistance of the partition walls during heat treatment. On the other hand, from the viewpoint of improving light resistance, the resin content in the partition (A-1) is preferably 60% by weight or less, more preferably 50% by weight or less.

The content of the white pigment in the partition wall (A-1) is preferably 20% by weight or more, more preferably 30% by weight or more, from the viewpoint of further improving the reflectance. On the other hand, from the viewpoint of improving the surface smoothness of the partition walls, the content of the white pigment in the partition walls (A-1) is preferably 60% by weight or less, more preferably 55% by weight or less.

The content of the light-shielding pigment in the partition wall (A-1) is preferably 0.005% by weight or more, more preferably 0.05% by weight or more, based on the solid content, from the viewpoint of improving the light-shielding property of light of a specific wavelength. preferable. On the other hand, it is preferably 30% by weight or less, more preferably 15% by weight or less, from the viewpoint of not impairing the reflectance of the partition walls.

Silver oxide and/or silver particles refer to yellow particles or black particles generated by decomposition/aggregation of the organic silver compound in the aforementioned resin composition during the exposure step and/or heating step. The content of silver oxide and/or silver particles in the partition wall (A-1) is 0.1% by weight from the viewpoint of further suppressing color mixing of light in adjacent pixels by adjusting the reflectance and OD within the ranges described above. 0.4% by weight or more is more preferable. On the other hand, from the viewpoint of adjusting the reflectance and OD to the ranges described above, the content of silver oxide and/or silver particles in the partition wall (A-1) is preferably 10% by weight or less, and 3.0% by weight or less. more preferred.

The partition (A-1) preferably further contains a liquid-repellent compound. By containing the liquid-repellent compound, liquid-repellent performance can be imparted to the partition wall (A-1). In addition, color-converting light-emitting materials having different compositions can be easily applied separately. The liquid-repellent compound is as described above as a material constituting the resin composition.

From the viewpoint of improving the liquid-repellent performance of the partition walls and improving the inkjet applicability, the content of the liquid-repellent compound in the partition walls (A-1) is preferably 0.01% by weight or more, more preferably 0.1% by weight or more. more preferred. On the other hand, from the viewpoint of improving compatibility with resins and white pigments, the content of the liquid-repellent compound in the partition wall (A-1) is preferably 10% by weight or less, more preferably 5% by weight or less.

The surface contact angle of the partition wall (A-1) with respect to propylene glycol monomethyl ether acetate is preferably 10° or more, more preferably 20° or more, from the viewpoint of improving inkjet applicability and facilitating separate coating of the color-converting luminescent material. More preferably, 40° or more is even more preferable. On the other hand, from the viewpoint of improving the adhesion between the partition wall and the underlying substrate, the surface contact angle of the partition wall (A-1) is preferably 70° or less, more preferably 60° or less. Here, the surface contact angle of the partition wall (A-1) conforms to the substrate glass surface wettability test method specified in JIS R3257 (enacted date = 1999/04/20) for the upper part of the partition wall. can be measured by As a method for adjusting the surface contact angle of the partition wall (A-1) to the above range, for example, a method using the liquid-repellent compound described above can be used.

As a method for patterning the barrier ribs (A-1) on the base substrate, a photosensitive paste method is preferable because the pattern shape can be easily adjusted. As a method for patterning barrier ribs by a photosensitive paste method, for example, the above-mentioned resin composition is applied onto a base substrate and dried to obtain a dry film. A method comprising an exposure step of pattern-wise exposing according to the shape, a developing step of dissolving and removing portions soluble in the developer in the dry film after exposure, and a heating step of curing the barrier ribs after development is preferred. The resin composition preferably has positive or negative photosensitivity. Pattern exposure may be performed through a photomask having a predetermined opening, or an arbitrary pattern may be directly drawn using a laser beam or the like without using a photomask. When the substrate with partition walls has color filters and/or light-shielding partition walls (A-2), which will be described later, partition walls (A-1) are similarly formed on the color filters and/or light-shielding partition walls (A-2). Can be patterned. Each step is as described above for the method of manufacturing the light shielding film.

The substrate with partition walls of the present invention further includes pixels (hereinafter sometimes referred to as “pixels (B)”) containing (B) color-converting luminescent materials arranged separated by the partition walls (A-1). It is preferred to have

The pixel (B) has a function of enabling color display by converting at least part of the wavelength range of incident light and emitting output light in a wavelength range different from that of the incident light.

FIG. 2 shows a cross-sectional view of one mode of the substrate with partitions of the present invention having patterned partitions (A-1) and pixels (B). A base substrate 1 has patterned partition walls 2 , and pixels 3 are arranged in regions separated by the partition walls 2 .

The color conversion material preferably contains a phosphor selected from inorganic phosphors and organic phosphors.

The substrate with partition walls of the present invention can be used as a display device by combining, for example, a backlight that emits blue light, liquid crystals formed on TFTs, and pixels (B). In this case, the region corresponding to the red pixel preferably contains a red phosphor that emits red fluorescence when excited by blue excitation light. Similarly, the region corresponding to the green pixel preferably contains a green phosphor that emits green fluorescence when excited by blue excitation light. A region corresponding to a blue pixel preferably does not contain a phosphor.

The inorganic phosphor is preferably one that emits green or red light by blue excitation light, that is, one that is excited by excitation light with a wavelength of 400 to 500 nm and has a peak emission spectrum in the region of 500 to 700 nm. . Examples of such inorganic phosphors include YAG-based phosphors, TAG-based phosphors, sialon-based phosphors, Mn ⁴⁺ -activated fluoride complex phosphors, and inorganic semiconductors called quantum dots. You may use 2 or more types of these. Among these, quantum dots are preferred. Since quantum dots have a smaller average particle size than other phosphors, (B) the surface of the pixel can be smoothed to suppress light scattering on the surface, so that the light extraction efficiency is further improved. Brightness can be further improved.

Quantum dot materials include, for example, II-IV group, III-V group, IV-VI group, and IV group semiconductors. Examples of these inorganic semiconductors include Si, Ge, Sn, Se, Te, B, C (including diamond), P, BN, BP, BAs, AlN, AlP, AlAs, AlSb, GaN, GaP, GaAs, GaSb, InN, InP, InAs, InSb, ZnO, ZnS, ZnSe, ZnTe, CdS, CdSe, CdSeZn, CdTe, HgS, HgSe, HgTe, BeS, BeSe, BeTe, MgS, MgSe, GeS, GeSe, GeTe, SnS, _SnSe , _SnTe , PbO, PbS, PbSe, PbTe, CuF, CuCl, CuBr, CuI, _Si3N4 , _{Ge3N4 , Al2O3} and the like. You may use 2 or more types of these.

As the organic phosphor, one that emits green, red, or other colors by blue excitation light is preferable. A pyrromethene derivative having a basic skeleton represented by the following structural formula (8) as a phosphor emitting red fluorescence, and a pyrromethene derivative having a basic skeleton represented by the following structural formula (9) as a phosphor emitting green fluorescence derivatives and the like. Other examples include perylene-based derivatives, porphyrin-based derivatives, oxazine-based derivatives, and pyrazine-based derivatives that emit red or green fluorescence depending on the selection of substituents. You may contain 2 or more types of these. Among these, pyrromethene derivatives are preferred because of their high quantum yield. A pyrromethene derivative can be obtained, for example, by the method described in JP-A-2011-241160.

Since the organic phosphor is soluble in a solvent, it is possible to easily form pixels (B) with a desired thickness.

From the viewpoint of improving color characteristics, the thickness of the pixel (B) is preferably 0.5 μm or more, more preferably 1 μm or more. On the other hand, the thickness of the pixel (B) is preferably 30 μm or less, more preferably 20 μm or less, from the viewpoint of thinning the display device and curved surface processing.

The size of each pixel (B) is generally about 20 to 200 μm.

The pixels (B) are preferably arranged separated by partitions (A-1). By providing a partition between pixels, diffusion and color mixture of emitted light can be further suppressed.

As a method for forming the pixel (B), for example, a method of filling a space separated by a partition (A-1) with a coating liquid containing a color-converting luminescent material (hereinafter referred to as a color-converting luminescent material coating liquid) can be mentioned. be done. The color-converting luminescent material coating liquid may further contain a resin and a solvent.

As a method for filling the color-converting luminescent material coating liquid, a photolithographic method, an inkjet method, and the like can be mentioned, but the inkjet coating method is preferable from the viewpoint of easily separately coating each pixel with different types of color-converting luminescent materials.

The obtained coating film may be dried under reduced pressure and/or dried by heating. When drying under reduced pressure, the drying temperature under reduced pressure is preferably 80° C. or lower in order to prevent the drying solvent from re-condensing on the inner wall of the reduced pressure chamber. The pressure for drying under reduced pressure is preferably lower than the vapor pressure of the solvent contained in the coating film, and preferably 1 to 1000 Pa. The drying time under reduced pressure is preferably 10 to 600 seconds. In the case of heat drying, the heat drying apparatus includes, for example, an oven and a hot plate. The heat drying temperature is preferably 60 to 200°C. The heat drying time is preferably 1 to 60 minutes.

<Light shielding partition (A-2)>
In the substrate with partition walls of the present invention, (A-1) between the underlying substrate and the patterned partition walls, and (A-2) an OD value per 1.0 μm of thickness of 0.5 or more. It is preferable to have a pattern-formed partition (hereinafter sometimes referred to as a “light-shielding partition (A-2)”). By having the light-shielding partition (A-2), it is possible to improve light-shielding properties, suppress light leakage from the backlight in the display device, and obtain a high-contrast and clear image.

FIG. 3 shows a cross-sectional view showing one embodiment of the partition-attached substrate of the present invention having light-shielding partitions. It has partition walls 2 and light-shielding partition walls 4 patterned on a base substrate 1 , and pixels 3 are arranged in regions separated by the partition walls 2 and the light-shielding partition walls 4 .

The light-shielding partition (A-2) has an OD value of 0.5 or more per 1.0 μm of thickness. Here, the thickness of the light shielding partition (A-2) is preferably 0.5 to 10 μm, as will be described later. In the present invention, 1.0 μm was selected as a representative value of the thickness of the light-shielding barrier ribs (A-2), and attention was paid to the OD value per 1.0 μm of thickness. By setting the OD value per 1.0 μm of thickness to 0.5 or more, the light shielding property can be further improved, and a clearer image with higher contrast can be obtained. The OD value per 1.0 μm of thickness is more preferably 1.0 or more. On the other hand, the OD value per 1.0 μm of thickness is preferably 4.0 or less, which can improve pattern workability. The OD value per 1.0 μm of thickness is more preferably 3.0 or less. The OD value of the light-shielding partition wall (A-2) can be measured in the same manner as the OD value of the partition wall (A-1) described above. Incidentally, as a means for setting the OD value within the above range, for example, the light-shielding partition (A-2) is made to have a preferable composition described later.

The thickness of the light-shielding partition (A-2) is preferably 0.5 μm or more, more preferably 1.0 μm or more, from the viewpoint of improving light-shielding properties. On the other hand, from the viewpoint of improving flatness, the thickness of the light shielding partition (A-2) is preferably 10 μm or less, more preferably 5 μm or less. Further, the width of the light-shielding partition (A-2) is preferably approximately the same as that of the above-described partition (A-1).

The light shielding partition (A-2) preferably contains a resin and a black pigment. The resin has a function of improving crack resistance and light resistance of the partition walls. The black pigment has a function of absorbing incident light and reducing emitted light.

Examples of resins include epoxy resins, (meth)acrylic polymers, polyurethanes, polyesters, polyimides, polyolefins, and polysiloxanes. You may contain 2 or more types of these. Among these, polyimide is preferable because it is excellent in heat resistance and solvent resistance.

Examples of the black pigment include those exemplified as the black pigment in the resin composition described above, palladium oxide, platinum oxide, gold oxide, silver oxide, and the like. A black pigment selected from titanium nitride, zirconium nitride, carbon black, palladium oxide, platinum oxide, gold oxide and silver oxide is preferred because it has high light-shielding properties.

As a method for patterning the light-shielding partition (A-2) on the underlying substrate, for example, a photosensitive material described in JP-A-2015-1654 is used, and the above-described partition (A-1) is photosensitive. A method of forming a pattern by a transparent paste method is preferred.

In addition, the substrate with partition walls of the present invention preferably further has a color filter (hereinafter sometimes referred to as “color filter”) having a thickness of 1 to 5 μm between the base substrate and the pixels (B). . A color filter has a function of transmitting visible light in a specific wavelength range and making the transmitted light have a desired hue. By including the color filter, the color purity of the display device can be improved. Color purity can be further improved by setting the thickness of the color filter to 1 μm or more. On the other hand, by setting the thickness of the color filter to 5 μm or less, the luminance can be further improved.

FIG. 4 shows a cross-sectional view of one embodiment of the substrate with partition walls of the present invention having a color filter. It has patterned partition walls 2 and color filters 5 on a base substrate 1 , and pixels 3 on the color filters 5 .

Examples of the color filter include a color filter using a pigment-dispersed material in which a pigment is dispersed in a photoresist, which is used for flat panel displays such as liquid crystal displays. More specifically, a blue color filter that selectively transmits a wavelength of 400 nm to 550 nm, a green color filter that selectively transmits a wavelength of 500 nm to 600 nm, a yellow color filter that selectively transmits a wavelength of 500 nm or more, A red color filter that selectively transmits wavelengths of 600 nm or more may be used.

Moreover, the color filter may be laminated separately from the pixel (B) containing the color-converting luminescent material, or may be integrally laminated.

The substrate with partition walls of the present invention preferably further has a color filter with a thickness of 1 to 5 μm separated by a light-shielding partition wall between the underlying substrate and the pixels (B).

FIG. 5 shows a cross-sectional view of one embodiment of the partition-attached substrate of the present invention having color filters separated by light-shielding partition walls. Color filters 5 separated by patterned light-shielding barrier ribs 4 are provided on a base substrate 1, and barrier ribs 2 and pixels 3 are provided thereon.

The substrate with partition walls of the present invention further includes (C) a low refractive index layer having a refractive index of 1.20 to 1.35 at a wavelength of 550 nm (hereinafter referred to as "low refractive index layer (C)” may be described). By having the low refractive index layer (C), the light extraction efficiency can be further improved, and the luminance of the display device can be further improved.

FIG. 6 shows a cross-sectional view of one embodiment of the substrate with partition walls of the present invention having a low refractive index layer. It has patterned barrier ribs 2 and pixels 3 on an underlying substrate 1, and further has a low refractive index layer 6 thereon.

In the display device, the refractive index of the low refractive index layer (C) is preferably 1.20 or more from the viewpoint of appropriately suppressing the reflection of light from the backlight and allowing light to enter the pixels (B) efficiently. 23 or more is more preferable. On the other hand, from the viewpoint of improving brightness, the refractive index of the low refractive index layer (C) is preferably 1.35 or less, more preferably 1.30 or less. Here, the refractive index of the low refractive index layer (C) is measured by irradiating light with a wavelength of 550 nm from a direction perpendicular to the cured film surface under atmospheric pressure and at 20° C. using a prism coupler. can be done.

The low refractive index layer (C) preferably contains polysiloxane and silica particles having no hollow structure. Polysiloxane has high compatibility with inorganic particles such as silica particles and functions as a binder capable of forming a transparent layer. In addition, by containing silica particles, minute voids can be efficiently formed in the low refractive index layer (C) to reduce the refractive index, and the refractive index can be easily adjusted within the above range. can be done. Furthermore, by using silica particles that do not have a hollow structure, cracks can be suppressed because they do not have a hollow structure that tends to cause cracks during curing shrinkage.

The polysiloxane contained in the low refractive index layer (C) preferably contains fluorine. By containing fluorine, the refractive index of the low refractive index layer (C) can be easily adjusted to 1.20 to 1.35. Fluorine-containing polysiloxane can be obtained by hydrolyzing and polycondensing a plurality of alkoxysilane compounds including at least a fluorine-containing alkoxysilane compound represented by the following general formula (10). Other alkoxysilane compounds may also be used. In general formula (10), the notation "-(OR ¹² ) _4-m " means that (4-m) "-(OR ¹² )" are bonded to the Si atom.

In general formula (10) above, R ¹³ represents a fluoroalkyl group having 3 to 17 fluorine atoms. The fluoroalkyl group preferably has 1 to 20 carbon atoms. R ¹² represents the same group as R ¹¹ in general formulas (6) to (7). m represents 1 or 2; 4-m R ¹² and m R ¹³ may be the same or different.

Examples of fluorine-containing alkoxysilane compounds represented by general formula (10) include trifluoroethyltrimethoxysilane, trifluoroethyltriethoxysilane, trifluoropropyltrimethoxysilane, trifluoropropyltriethoxysilane, trifluoroethylethyl dimethoxysilane, trifluoroethylethyldiethoxysilane, trifluoroethylethyldiisopropoxysilane, and the like. You may use 2 or more types of these.

The content of polysiloxane in the low refractive index layer (C) is preferably 4% by weight or more from the viewpoint of suppressing cracks. On the other hand, the content of polysiloxane is 32% by weight or less from the viewpoint of ensuring thixotropic properties due to the network between silica particles, maintaining an appropriate air layer in the low refractive index layer (C), and further reducing the refractive index. is preferred.

Silica particles having no hollow structure in the low refractive index layer (C) include, for example, "Snowtex" (registered trademark) manufactured by Nissan Chemical Industries, Ltd. and "Organo Silica Sol" (registered trademark) series (isopropyl alcohol dispersion , methyl ethyl ketone dispersion, propylene glycol monomethyl ether dispersion, methanol dispersion, etc. Product numbers PGM-ST, PMA-ST, IPA-ST, IPA-ST-L, IPA-ST-ZL, IPA-ST-UP, MEK- ST-UP, etc.). You may contain 2 or more types of these.

The content of silica particles that do not have a hollow structure in the low refractive index layer (C) ensures thixotropy due to the network between silica particles, maintains an appropriate air layer in the low refractive index layer (C), and refraction From the viewpoint of further reducing the rate, 68% by weight or more is preferable. On the other hand, the content of silica particles having no hollow structure is preferably 96% by weight or less from the viewpoint of suppressing cracks.

The thickness of the low refractive index layer (C) is preferably 0.1 μm or more, more preferably 0.5 μm or more, from the viewpoint of covering the steps of the pixels (B) and suppressing the occurrence of defects. On the other hand, the thickness of the low refractive index layer (C) is preferably 20 μm or less, more preferably 10 μm or less, from the viewpoint of reducing stress that causes cracks in the low refractive index layer (C).

As a method for forming the low refractive index layer (C), a coating method is preferable because the forming method is easy. For example, the low refractive index layer (C) can be formed by applying a low refractive index resin composition containing polysiloxane and silica particles onto the pixels (B), drying, and then heating.

The substrate with partition walls of the present invention preferably further has an inorganic protective layer I having a thickness of 50 to 1,000 nm on the low refractive index layer (C). Since the presence of the inorganic protective layer I makes it difficult for moisture in the atmosphere to reach the low refractive index layer (C), it is possible to suppress fluctuations in the refractive index of the low refractive index layer (C) and suppress luminance degradation. can.

7 and 8 show cross-sectional views of one embodiment of the substrate with partition walls of the present invention having a low refractive index layer and an inorganic protective layer I. FIG. It has patterned partition walls 2 and pixels 3 on an underlying substrate 1, and further has a low refractive index layer 6 and an inorganic protective layer I7 above or below them.

The substrate with partition walls of the present invention preferably has the low refractive index layer (C) between the pixel (B) and the color filter. It is preferred to have an inorganic protective layer (I) of 1,000 nm. By having the low refractive index layer (C) between the pixel (B) and the color filter, the effect of improving the light extraction of emitted light is increased, and the brightness of the display is improved.

FIG. 9 shows a cross-sectional view of one embodiment of the substrate with partition walls of the present invention having the low refractive index layer and the inorganic protective layer (I) between the pixels (B) and the color filters. A color filter 5 separated by a light-shielding partition wall 4 is provided on a base substrate 1, a low refractive index layer 6 and an inorganic protective layer (I) 7 are provided thereon, and a pattern is formed thereon. It has partition walls 2 and pixels 3 .

Further, the substrate with partition walls of the present invention preferably further has an inorganic protective layer (II) having a thickness of 50 to 1,000 nm between the pixel (B) and the low refractive index layer (C). By having the inorganic protective layer (II), it becomes difficult for the raw material forming the pixel (B) to move from the pixel (B) to the low refractive index layer. It is possible to suppress luminance deterioration.

FIG. 10 shows a cross-sectional view of one mode of the substrate with partition walls of the present invention having a low refractive index layer and an inorganic protective layer (II). It has patterned partition walls 2 and pixels 3 on a base substrate 1 , and further has an inorganic protective layer (II) 8 and a low refractive index layer 6 thereon.

Further, the substrate with partition walls of the present invention preferably further has an inorganic protective layer (III) and/or a yellow organic protective layer having a thickness of 50 to 1,000 nm between the color filter and the pixel (B). By having the inorganic protective layer (III), it becomes difficult for the raw materials for forming the color filter to reach the pixel (B) containing the color conversion light emitting material from the color filter. ) can be suppressed. In addition, by having the yellow organic protective layer, it is possible to cut blue leakage light that has not been completely converted by the pixels (B) containing the color-converting light-emitting material, thereby improving color reproducibility.

FIG. 11 shows a cross-sectional view of one embodiment of the substrate with partition walls of the present invention having a color filter and an inorganic protective layer (III) and/or a yellow organic protective layer. It has patterned barrier ribs 2 and color filters 5 on a base substrate 1, has an inorganic protective layer (III) and/or a yellow organic protective layer 9 thereon, and further has barrier ribs thereon. It has pixels 3 arranged at 2 intervals.

Further, the substrate with partition walls of the present invention preferably further has an inorganic protective layer (IV) and/or a yellow organic protective layer having a thickness of 50 to 1,000 nm on the underlying substrate. The inorganic protective layer (IV) and/or the yellow organic protective layer act as a refractive index adjusting layer, extracting light emitted from the pixels (B) more efficiently, and can further improve the luminance of the display device. In addition, the yellow organic protective layer cuts the blue leakage light that has not been completely converted by the pixels (B) containing the color-converting light-emitting material, and can improve color reproducibility. The inorganic protective layer (IV) and/or the yellow organic protective layer are more preferably provided between the underlying substrate and the partition walls (A) and the pixels (B).

FIG. 12 shows a cross-sectional view of one embodiment of the substrate with partition walls of the present invention having an inorganic protective layer (IV) and/or a yellow organic protective layer. It has an inorganic protective layer (IV) and/or a yellow organic protective layer 10 on a base substrate 1, and has patterned barrier ribs 2 and pixels 3 thereon.

Examples of materials constituting the inorganic protective layers (I) to (IV) include metal oxides such as silicon oxide, indium tin oxide and gallium zinc oxide; metal nitrides such as silicon nitride; and fluorides such as magnesium fluoride. etc. You may contain 2 or more types of these. Among these, silicon nitride or silicon oxide is more preferable because of its low water vapor permeability and high permeability.

The thickness of the inorganic protective layers (I) to (IV) is preferably 50 nm or more, more preferably 100 nm or more, from the viewpoint of sufficiently suppressing permeation of substances such as water vapor. On the other hand, from the viewpoint of suppressing a decrease in transmittance, the thickness of the inorganic protective layers (I) to (IV) is preferably 800 nm or less, more preferably 500 nm or less.

The thickness of the inorganic protective layers (I) to (IV) is determined by exposing a cross section perpendicular to the underlying substrate using a polishing apparatus such as a cross section polisher, and examining the cross section using a scanning electron microscope or a transmission electron microscope. can be measured by magnified observation.

Examples of the method for forming the inorganic protective layers (I) to (IV) include a sputtering method. The inorganic protective layer is preferably colorless and transparent or yellow and transparent.

The yellow organic protective layer is obtained, for example, by patterning the resin composition containing the above-mentioned organic silver compound. As described above, the organic silver compound has the function of yellowing the protective layer by decomposing and aggregating in the heating process during pattern formation to form yellow particles. In the yellow organic protective layer resin composition, the content of the organic silver compound is preferably 0.2 to 5% by weight based on the solid content. By setting the content of the organic silver compound to 0.2% by weight or more, yellowing can be further achieved. The content of the organic silver compound is more preferably 1.5% by weight or more based on the solid content. On the other hand, by setting the content of the organic silver compound to 5% by weight or less in the solid content, the transmittance can be further improved.

The resin composition forming the yellow organic protective layer may contain a yellow pigment. Examples of yellow pigments include Pigment Yellow (hereinafter abbreviated as PY) PY137, PY138, PY139, PY147, PY148, PY150, PY153, PY154, PY166, PY168 and PY185. Among them, a yellow pigment selected from PY139, PY147, PY148 and PY150 is preferable from the viewpoint of selectively shielding blue light.

As a method of patterning the yellow organic protective layer, a method of forming a pattern by a photosensitive paste method is preferable, as in the case of the barrier ribs (A-1) described above.

When the yellow organic protective layer 8 is formed on the color filter 7 as shown in FIG. 7, the yellow organic protective layer 8 may serve as an overcoat layer for flattening each pixel of the color filter.

The thickness of the yellow organic protective layer is preferably 100 nm or more, more preferably 500 nm or more, from the viewpoint of sufficiently shielding blue leakage light. On the other hand, the thickness of the yellow organic protective layer is preferably 3000 nm or less, more preferably 2000 nm or less, from the viewpoint of suppressing a decrease in light extraction efficiency.

The substrate with partition walls of the present invention can also be used in display devices using mini- or micro-LEDs, in which a large number of LEDs corresponding to pixels separated by partition walls formed on the substrate are arranged. ON/OFF of each pixel is enabled by ON/OFF of a mini or micro LED, no liquid crystal is required. In other words, the substrate with partition walls of the present invention can be used not only for partition walls for separating pixels, but also for partition walls for separating mini or micro LEDs in a backlight.

For example, the substrate with partition walls of the present invention preferably further has a light emitting source selected from organic EL cells, mini-LED cells and micro-LED cells on the underlying substrate. By separating the light-emitting light sources selected from the organic EL cells, the mini-LED cells and the micro-LED cells by partition walls, it is possible to prevent color mixture between pixels and improve the display color purity of the display.

FIG. 13 shows a cross-sectional view of one mode of the substrate with partition walls of the present invention, which has a light-emitting light source selected from organic EL cells, mini-LED cells, and micro-LED cells. A light emitting source 11 selected from organic EL cells, mini-LED cells and micro-LED cells is provided between partition walls 2 patterned on a base substrate 1 .

Moreover, the substrate with partition walls of the present invention preferably further has pixels (B) on the light emitting light sources selected from organic EL cells, mini-LED cells and micro-LED cells.

FIG. 14 shows a cross-sectional view of one embodiment of the substrate with partition walls of the present invention, which has light-emitting light sources and pixels selected from organic EL cells, mini-LED cells, and micro-LED cells. A light emitting source 11 selected from organic EL cells, mini-LED cells and micro-LED cells is provided between partition walls 2 patterned on a base substrate 1, and pixels 3 are provided thereon.

Next, the display device of the present invention will be described. A display device of the present invention includes the substrate with partition walls and a light emitting source. As the light emission source, a light emission source selected from a liquid crystal cell, an organic EL cell, a mini LED cell and a micro LED cell is preferable. An organic EL cell is more preferable as the light source because of its excellent light emission characteristics. A mini-LED cell is a cell in which a large number of LEDs each having a length and width of about 100 μm to 10 mm are arranged. A micro LED cell refers to a cell in which a large number of LEDs each having a length and width of less than 100 μm are arranged.

A method for manufacturing a display device of the present invention will be described by taking an example of a display device having a substrate with partition walls and an organic EL cell of the present invention. A photosensitive polyimide resin is applied on a glass substrate, and an insulating film having an opening is formed by photolithography. After aluminum is sputtered thereon, the aluminum is patterned by photolithography to form a back electrode layer made of aluminum in the openings where there is no insulating film. Subsequently, tris(8-quinolinolato)aluminum (hereinafter abbreviated as Alq3) was formed thereon as an electron transport layer by vacuum vapor deposition, and then Alq3 as a light-emitting layer was formed with dicyanomethylenepyran, quinacridone and 4,4′. forming a white light-emitting layer doped with bis(2,2-diphenylvinyl)biphenyl; Next, N,N'-diphenyl-N,N'-bis(α-naphthyl)-1,1'-biphenyl-4,4'-diamine is deposited as a hole transport layer by vacuum deposition. Finally, ITO is deposited as a transparent electrode by sputtering to fabricate an organic EL cell having a white light-emitting layer. A display device can be produced by bonding the aforementioned substrate with partition walls to the organic EL cell obtained in this manner so as to face each other with a sealant.

EXAMPLES The present invention will be described in more detail with reference to Examples and Comparative Examples below, but the present invention is not limited to these scopes. The names of the compounds using abbreviations among the compounds used are shown below.

PGMEA: propylene glycol monomethyl ether acetate EDM: diethylene glycol ethyl methyl ether DAA: diacetone alcohol BHT: dibutylhydroxytoluene.

The solid content concentrations of the polysiloxane solutions in Synthesis Examples 1 to 6 were determined by the following method. 1.5 g of the polysiloxane solution was put into an aluminum cup and heated at 250° C. for 30 minutes using a hot plate to evaporate the liquid. The weight of the solid content remaining in the aluminum cup after heating was weighed, and the solid content concentration was obtained from the ratio to the weight before heating.

The weight average molecular weights of the polysiloxane solutions in Synthesis Examples 1 to 6 were measured as polystyrene-equivalent weight average molecular weights by the following method.
Apparatus: Waters GPC measuring apparatus with RI detector (2695)
Column: PLgel MIXED-C column (manufactured by Polymer Laboratories, 300 mm) x 2 (connected in series)
Measurement temperature: 40°C
Flow rate: 1 mL/min
Solvent: Tetrahydrofuran (THF) 0.5% by mass solution Standard substance: polystyrene Detection mode: RI

The content ratio of each repeating unit in polysiloxane in Synthesis Examples 1 to 6 was obtained by the following method. A polysiloxane solution is injected into a “Teflon” (registered trademark) NMR sample tube with a diameter of 10 mm and ²⁹ Si-NMR measurement is performed, and the Si derived from a specific organosilane is compared with the integrated value of the entire Si derived from the organosilane. The content ratio of each repeating unit was calculated from the ratio of the integrated value of. ²⁹ Si-NMR measurement conditions are shown below.

Apparatus: Nuclear magnetic resonance apparatus (JNM-GX270; manufactured by JEOL Ltd.)
Measurement method: Gated decoupling method Measurement nucleus frequency: 53.6693 MHz ( ²⁹ Si nuclei)
Spectrum width: 20000Hz
Pulse width: 12 μs (45° pulse)
Pulse repetition time: 30.0 seconds Solvent: Acetone-d6
Reference substance: Tetramethylsilane Measurement temperature: 23°C
Sample rotation speed: 0.0 Hz.

Synthesis Example 1 Polysiloxane (PSL-1) solution In a 1000 ml three-necked flask, 203.13 g (0.831 mol) of diphenyldimethoxysilane, 76.06 g (0.306 mol) of 3-methacryloxypropyltrimethoxysilane, 3- 21.56 g (0.088 mol) of (3,4-epoxycyclohexyl)propyltrimethoxysilane, 42.08 g (0.350 mol) of dimethyldimethoxysilane, 45.91 g of 3-trimethoxysilylpropylsuccinic anhydride ( 0.175 mol), 1.475 g of BHT, and 308.45 g of PGMEA were charged, and 3.887 g of phosphoric acid (1.0% by weight based on the charged monomer) was dissolved in 76.39 g of water while stirring at 40°C. Aqueous phosphoric acid was added over 30 minutes. After that, the flask was immersed in an oil bath at 70° C. and stirred for 60 minutes, and then the oil bath was heated to 115° C. over 30 minutes. After 1 hour from the start of heating, the temperature of the solution (internal temperature) reached 100° C., and the solution was heated and stirred for 2 hours (internal temperature: 100 to 110° C.) to obtain a polysiloxane solution. A mixed gas of 95% by volume of nitrogen and 5% by volume of oxygen was flowed at 0.05 liter/min during the temperature rise and heating and stirring. A total of 173.99 g of methanol and water, which are by-products, were distilled during the reaction. PGMEA was added to the obtained polysiloxane solution so that the solid content concentration was 40% by weight to obtain a polysiloxane (PSL-1) solution. The weight average molecular weight of the obtained polysiloxane (PSL-1) was 6,000. Also, diphenyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane, dimethyldimethoxysilane, 3-trimethoxysilylpropylsuccinate in polysiloxane (PSL-1) The molar ratio of each repeating unit derived from acid anhydride was 47.5 mol %, 17.5 mol %, 5 mol %, 20 mol % and 10 mol %, respectively.

Synthesis Example 2 Polysiloxane (PSL-2) solution In a 1000 ml three-necked flask, 164.83 g (0.831 mol) of phenyltrimethoxysilane, 76.06 g (0.306 mol) of 3-methacryloxypropylmethyldimethoxysilane, 3 21.56 g (0.088 mol) of -(3,4-epoxycyclohexyl)propyltrimethoxysilane, 42.08 g (0.350 mol) of dimethyldimethoxysilane, and 45.91 g of 3-trimethoxysilylpropylsuccinic anhydride (0.175 mol), 1.186 g of BHT, and 255.58 g of PGMEA were charged, and 3.504 g of phosphoric acid (1.0% by weight based on the charged monomers) was dissolved in 91.35 g of water while stirring at 40°C. An aqueous phosphoric acid solution was added over 30 minutes. After that, the flask was immersed in an oil bath at 70° C. and stirred for 60 minutes, and then the oil bath was heated to 115° C. over 30 minutes. After 1 hour from the start of heating, the temperature of the solution (internal temperature) reached 100° C., and the solution was heated and stirred for 2 hours (internal temperature: 100 to 110° C.) to obtain a polysiloxane solution. A mixed gas of 95% by volume of nitrogen and 5% by volume of oxygen was flowed at 0.05 liter/min during the temperature rise and heating and stirring. A total of 208.08 g of methanol and water, which are by-products, were distilled during the reaction. PGMEA was added to the obtained polysiloxane solution so that the solid content concentration was 40% by weight to obtain a polysiloxane (PSL-2) solution. The weight average molecular weight of the obtained polysiloxane (PSL-2) was 5,500. Phenyltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane, dimethyldimethoxysilane, 3-trimethoxysilylpropyl in polysiloxane (PSL-2) The molar ratio of each repeating unit derived from succinic anhydride was 47.5 mol %, 17.5 mol %, 5 mol %, 20 mol % and 10 mol %, respectively.

Synthesis Example 3 Polysiloxane (PSL-3) solution In a 1000 ml three-necked flask, 71.16 g (0.306 mol) of 3-methacryloxypropylmethyldimethoxysilane, 78.52 g (0.35 mol) of styryltrimethoxysilane, 3 21.56 g (0.088 mol) of -(3,4-epoxycyclohexyl)propyltrimethoxysilane, 113.22 g (0.83 mol) of methyltrimethoxysilane, and 45 g of 3-trimethoxysilylpropylsuccinic anhydride. 91 g (0.175 mol), 1.080 g of BHT, and 234.92 g of PGMEA were charged, and 3.304 g of phosphoric acid (1.0% by weight based on the charged monomers) was added to 92.14 g of water while stirring at 40°C. A dissolved aqueous solution of phosphoric acid was added over a period of 30 minutes. After that, the flask was immersed in an oil bath at 70° C. and stirred for 60 minutes, and then the oil bath was heated to 115° C. over 30 minutes. After 1 hour from the start of heating, the temperature of the solution (internal temperature) reached 100° C., and the solution was heated and stirred for 2 hours (internal temperature: 100 to 110° C.) to obtain a polysiloxane solution. A mixed gas of 95% by volume of nitrogen and 5% by volume of oxygen was flowed at 0.05 liter/min during the temperature rise and heating and stirring. A total of 209 g of methanol and water, which are by-products, were distilled during the reaction. PGMEA was added to the obtained polysiloxane solution so that the solid content concentration was 40% by weight to obtain a polysiloxane (PSL-3) solution. The weight average molecular weight of the obtained polysiloxane (PSL-3) was 12,000. Also, 3-methacryloxypropylmethyldimethoxysilane, styryltrimethoxysilane, 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane, methyltrimethoxysilane, 3-trimethoxysilyl in polysiloxane (PSL-3) The molar ratio of each repeating unit derived from propylsuccinic anhydride was 17.5 mol %, 20 mol %, 5 mol %, 47.5 mol % and 10 mol %, respectively.

Synthesis Example 4 Polysiloxane (PSL-4) solution In a 1000 ml three-necked flask, 71.16 g (0.306 mol) of 3-methacryloxypropylmethyldimethoxysilane, 19.63 g (0.088 mol) of styryltrimethoxysilane, 3 21.56 g (0.088 mol) of -(3,4-epoxycyclohexyl)propyltrimethoxysilane, 148.97 g (1.09 mol) of methyltrimethoxysilane, and 45 g of 3-trimethoxysilylpropylsuccinic anhydride. 91 g (0.175 mol), 0.963 g of BHT, and 212.01 g of PGMEA were charged, and 3.072 g of phosphoric acid (1.0% by weight based on the charged monomers) was added to 92.14 g of water while stirring at 40°C. A dissolved aqueous solution of phosphoric acid was added over a period of 30 minutes. After that, the flask was immersed in an oil bath at 70° C. and stirred for 60 minutes, and then the oil bath was heated to 115° C. over 30 minutes. After 1 hour from the start of heating, the temperature of the solution (internal temperature) reached 100° C., and the solution was heated and stirred for 2 hours (internal temperature: 100 to 110° C.) to obtain a polysiloxane solution. A mixed gas of 95% by volume of nitrogen and 5% by volume of oxygen was flowed at 0.05 liter/min during the temperature rise and heating and stirring. A total of 209 g of methanol and water, which are by-products, were distilled during the reaction. PGMEA was added to the obtained polysiloxane solution so that the solid content concentration was 40% by weight to obtain a polysiloxane (PSL-4) solution. The weight average molecular weight of the obtained polysiloxane (PSL-4) was 10,000. Also, 3-methacryloxypropylmethyldimethoxysilane, styryltrimethoxysilane, 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane, methyltrimethoxysilane, 3-trimethoxysilyl in polysiloxane (PSL-4) The molar ratio of each repeating unit derived from propylsuccinic anhydride was 17.5 mol %, 5 mol %, 5 mol %, 62.5 mol % and 10 mol %, respectively.

Synthesis Example 5 Polysiloxane (PSL-5) solution In a 1000 ml three-necked flask, 71.16 g (0.306 mol) of 3-methacryloxypropylmethyldimethoxysilane, 157.03 g (0.70 mol) of styryltrimethoxysilane, 3 21.56 g (0.088 mol) of -(3,4-epoxycyclohexyl)propyltrimethoxysilane, 65.55 g (0.481 mol) of methyltrimethoxysilane, and 45 g (0.481 mol) of 3-trimethoxysilylpropylsuccinic anhydride. 91 g (0.175 mol), 1.235 g of BHT, and 265.45 g of PGMEA were charged, and 3.072 g of phosphoric acid (1.0% by weight based on the charged monomers) was added to 92.14 g of water while stirring at 40°C. A dissolved aqueous solution of phosphoric acid was added over a period of 30 minutes. After that, the flask was immersed in an oil bath at 70° C. and stirred for 60 minutes, and then the oil bath was heated to 115° C. over 30 minutes. After 1 hour from the start of heating, the temperature of the solution (internal temperature) reached 100° C., and the solution was heated and stirred for 2 hours (internal temperature: 100 to 110° C.) to obtain a polysiloxane solution. A mixed gas of 95% by volume of nitrogen and 5% by volume of oxygen was flowed at 0.05 liter/min during the temperature rise and heating and stirring. A total of 209 g of methanol and water, which are by-products, were distilled during the reaction. PGMEA was added to the obtained polysiloxane solution so that the solid content concentration was 40% by weight to obtain a polysiloxane (PSL-5) solution. The weight average molecular weight of the obtained polysiloxane (PSL-5) was 10,000. Also, 3-methacryloxypropylmethyldimethoxysilane, styryltrimethoxysilane, 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane, methyltrimethoxysilane, 3-trimethoxysilyl in polysiloxane (PSL-5) The molar ratio of each repeating unit derived from propylsuccinic anhydride was 17.5 mol %, 40 mol %, 5 mol %, 27.5 mol % and 10 mol %, respectively.

Synthesis Example 6 Polysiloxane (PSL-6) solution In a 1000 ml three-necked flask, 213.82 g (0.875 mol) of diphenyldimethoxysilane and 43.12 g (0.875 mol) of 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane were added. .175 mol), 68.86 g (0.263 mol) of tetraethoxysilane, 59.59 g (0.438 mol) of methyltrimethoxysilane, 1.413 g of BHT, and 298.06 g of PGMEA were charged and stirred at 40°C. An aqueous phosphoric acid solution prepared by dissolving 3.854 g of phosphoric acid (1.0% by weight with respect to the charged monomers) in 83.48 g of water was added over 30 minutes. After that, the flask was immersed in an oil bath at 70° C. and stirred for 60 minutes, and then the oil bath was heated to 115° C. over 30 minutes. After 1 hour from the start of heating, the temperature of the solution (internal temperature) reached 100° C., and the solution was heated and stirred for 2 hours (internal temperature: 100 to 110° C.) to obtain a polysiloxane solution. A mixed gas of 95% by volume of nitrogen and 5% by volume of oxygen was flowed at 0.05 liter/min during the temperature rise and heating and stirring. A total of 282.58 g of methanol and water, which are by-products, were distilled during the reaction. PGMEA was added to the obtained polysiloxane solution so that the solid content concentration was 40% by weight to obtain a polysiloxane (PSL-6) solution. The weight average molecular weight of the obtained polysiloxane (PSL-6) was 5,500. Further, the molar ratio of each repeating unit derived from diphenyldimethoxysilane, 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane, tetraethoxysilane, and methyltrimethoxysilane in polysiloxane (PSL-6) is 50 mol %, 10 mol %, 15 mol %, and 25 mol %.

The compositions of Synthesis Examples 1 to 6 are summarized in Table 1.

Synthesis Example 7 Green organic phosphor 3,5-dibromobenzaldehyde (3.0 g), 4-t-butylphenylboronic acid (5.3 g), tetrakis(triphenylphosphine) palladium (0) (0.4 g), and Potassium carbonate (2.0 g) was placed in the flask and the flask was purged with nitrogen. Degassed toluene (30 mL) and degassed water (10 mL) were added thereto and refluxed for 4 hours. After cooling the reaction solution to room temperature and liquid-separating, the organic layer was wash|cleaned by the saturated salt solution. The organic layer was dried over magnesium sulfate, filtered, and the solvent was distilled off. The resulting reaction product was purified by silica gel column chromatography to give 3,5-bis(4-t-butylphenyl)benzaldehyde (3.5 g) as a white solid. Next, 3,5-bis(4-t-butylphenyl)benzaldehyde (1.5 g) and 2,4-dimethylpyrrole (0.7 g) were placed in a flask, followed by anhydrous dichloromethane (200 mL) and trifluoroacetic acid (1 drop) was added and stirred for 4 hours under a nitrogen atmosphere. A dehydrated dichloromethane solution of 2,3-dichloro-5,6-dicyano-1,4-benzoquinone (0.85 g) was added to the reaction mixture, and the mixture was further stirred for 1 hour. After completion of the reaction, boron trifluoride diethyl ether complex (7.0 mL) and diisopropylethylamine (7.0 mL) were added and stirred for 4 hours, then water (100 mL) was added and stirred to separate the organic layer. did. The organic layer was dried over magnesium sulfate, filtered, and the solvent was distilled off. The resulting reaction product was purified by silica gel column chromatography to obtain 0.4 g of green powder (yield 17%). The ¹ H-NMR analysis results of the obtained green powder are as follows, and it was confirmed that the green powder obtained above was [G-1] represented by the following structural formula.

¹ H-NMR (CDCl ₃ (d = ppm)): 7.95 (s, 1H), 7.63-7.48 (m, 10H), 6.00 (s, 2H), 2.58 (s , 6H), 1.50 (s, 6H), 1.37 (s, 18H).

Synthesis Example 8 Red organic phosphor A mixed solution of 300 mg of 4-(4-t-butylphenyl)-2-(4-methoxyphenyl)pyrrole, 201 mg of 2-methoxybenzoyl chloride and 10 ml of toluene was heated at 120° C. under a nitrogen stream. Heated for 6 hours. After cooling to room temperature, the solvent was evaporated. The obtained residue was washed with 20 ml of ethanol and vacuum dried to obtain 260 mg of 2-(2-methoxybenzoyl)-3-(4-t-butylphenyl)-5-(4-methoxyphenyl)pyrrole. rice field. Next, 2-(2-methoxybenzoyl)-3-(4-t-butylphenyl)-5-(4-methoxyphenyl)pyrrole 260 mg, 4-(4-t-butylphenyl)-2-(4- A mixed solution of 180 mg of methoxyphenyl)pyrrole, 206 mg of methanesulfonic anhydride and 10 ml of degassed toluene was heated at 125° C. for 7 hours under a nitrogen stream. After cooling the reaction mixture to room temperature, 20 ml of water was added and extracted with 30 ml of dichloromethane. After the organic layer was washed twice with 20 ml of water, it was evaporated and dried in a vacuum to obtain a pyrromethene compound as a residue. Next, 305 mg of diisopropylethylamine and 670 mg of boron trifluoride diethyl ether complex were added to a mixed solution of the obtained pyrromethene derivative and 10 ml of toluene under a nitrogen stream, and the mixture was stirred at room temperature for 3 hours. 20 ml of water was poured into the reaction mixture and extracted with 30 ml of dichloromethane. The organic layer was washed twice with 20 ml of water, dried over magnesium sulfate, and evaporated. After purification by silica gel column chromatography and vacuum drying, 0.27 g of reddish purple powder was obtained (yield 70%). The results of ¹ H-NMR analysis of the obtained reddish purple powder are as follows, and it was confirmed that the reddish purple powder obtained above was [R-1] represented by the following structural formula.

¹ H-NMR (CDCl ₃ (d=ppm)): 1.19 (s, 18H), 3.42 (s, 3H), 3.85 (s, 6H), 5.72 (d, 1H), 6.20 (t, 1H), 6.42-6.97 (m, 16H), 7.89 (d, 4H).

Synthesis Example 9 Silica Particle-Containing Polysiloxane Solution (LS-1)
0.05 g (0.4 mmol) of methyltrimethoxysilane, 0.66 g (3.0 mmol) of trifluoropropyltrimethoxysilane, and 0.10 g (0.0 mmol) of trimethoxysilylpropylsuccinic anhydride are placed in a 500 ml three-necked flask. .4 mmol), 7.97 g (34 mmol) of γ-acryloxypropyltrimethoxysilane, and 15.6% by weight of an isopropyl alcohol dispersion of silica particles (IPA-ST-UP: manufactured by Nissan Chemical Industries, Ltd.). 224.37 g was added, and 163.93 g of ethylene glycol mono-t-butyl ether was added. An aqueous phosphoric acid solution prepared by dissolving 0.088 g of phosphoric acid in 4.09 g of water was added over 3 minutes while stirring at room temperature. After that, the flask was immersed in an oil bath at 40° C. and stirred for 60 minutes, and then the oil bath was heated to 115° C. over 30 minutes. After 1 hour from the start of heating, the internal temperature of the solution reached 100° C., and by further heating and stirring for 2 hours (the internal temperature was 100 to 110° C.), a silica particle-containing polysiloxane solution (LS-1) was obtained. rice field. During the temperature rise and heating and stirring, 0.05 l (liter) of nitrogen was flowed per minute. A total of 194.01 g of methanol and water, which are by-products, were distilled during the reaction. The obtained silica particle-containing polysiloxane solution (LS-1) had a solid content concentration of 24.3% by weight, and the content of polysiloxane and silica particles in the solid content was 15% by weight and 85% by weight, respectively. . Polysiloxanes methyltrimethoxysilane, trifluoropropyltrimethoxysilane, 3-trimethoxysilylpropylsuccinic anhydride, and γ-acryloxypropyltrimethoxysilane in the obtained silica particle-containing polysiloxane (LS-1) The molar ratio of each repeating unit derived from was 1.0 mol%, 8.0 mol%, 1.0 mol% and 90.0 mol%, respectively.

Example 1 Partition wall resin composition (P-1)
5.00 g of titanium dioxide pigment (R-960; manufactured by BASF Japan Co., Ltd. (hereinafter "R-960")) as a white pigment, and polysiloxane (PSL-1) solution obtained in Synthesis Example 1 as a resin. 5.00 g was mixed and dispersed using a mill-type disperser filled with zirconia beads to obtain a pigment dispersion (MW-1). As an organic silver compound, 0.50 g of silver neodecanoate was dissolved in 4.50 g of EDM to obtain an organic silver compound solution (OA-1).

Next, 8.25 g of the pigment dispersion (MW-1), 7.025 g of the polysiloxane (PSL-1) solution, 1.031 g of the organic silver compound solution (OA-1), t-butylhydroquinone as a reducing agent 0.026 g, as a photoinitiator, ethanone, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-,1-(O-acetyloxime) ("Irgacure" (registered trademark) OXE-02, manufactured by BASF Japan Ltd. (hereinafter “OXE-02”)) 0.155 g, bis (2,4,6-trimethylbenzoyl)-phenylphosphine oxide (“Irgacure” 819, BASF Japan Co., Ltd. (hereinafter “IC-819”)) 0.258 g, as a photopolymerizable compound, dipentaerythritol hexaacrylate (“KAYARAD” (registered trademark) DPHA, manufactured by Shin Nihon Yakugyo Co., Ltd. (hereinafter “ DPHA")) 2.063 g, and as a liquid-repellent compound, a photopolymerizable fluorine-containing compound ("Megafac" (registered trademark) RS-72A, 20% by weight PGMEA diluted solution product, manufactured by DIC Corporation (hereinafter "RS- 72A”)) 0.258 g, 3′,4′-epoxycyclohexylmethyl-3,4-epoxycyclohexane carboxylate (“Celoxide” (registered trademark) 2021P, manufactured by Daicel Corporation (hereinafter “Celoxide (registered trademark) 2021P ”)) 0.021 g, ethylene bis (oxyethylene) bis [3-(5-tert-butyl-4-hydroxy-m-tolyl) propionate] (“Irganox” (registered trademark) 1010, BASF Japan Ltd. (hereinafter “IRGANOX (registered trademark) 1010”)) 0.031 g, and acrylic surfactant (“BYK” (registered trademark) 352, manufactured by BYK Chemie Japan Co., Ltd. (hereinafter “BYK-352”)) 0.103 g of a 10% by weight diluted solution of PGMEA (corresponding to a concentration of 500 ppm) was dissolved in 1.405 g of solvent PGMEA and stirred. The resulting mixture was filtered through a 5.0 μm filter to obtain a partition wall resin composition (P-1).

Example 2 Partition wall resin composition (P-2)
Example 1 except that the amount of the organic silver compound solution (OA-1) added was 0.722 g, the amount of the polysiloxane (PSL-1) solution added was 7.10 g, and the amount of PGMEA added was 1.64 g. A partition wall resin composition (P-2) was obtained in the same manner as above.

Example 3 Partition wall resin composition (P-3)
Example 1 except that the amount of the organic silver compound solution (OA-1) added was 0.516 g, the amount of the polysiloxane (PSL-1) solution added was 7.15 g, and the amount of PGMEA added was 1.79 g. A partition wall resin composition (P-3) was obtained in the same manner as above.

Example 4 Resin composition for partition walls (P-4)
Example 1 except that the added amount of the organic silver compound solution (OA-1) was 0.206 g, the added amount of the polysiloxane (PSL-1) solution was 7.32 g, and the added amount of PGMEA was 2.02 g. A partition wall resin composition (P-4) was obtained in the same manner as above.

Example 5 Partition wall resin composition (P-5)
6.59 g of the pigment dispersion (MW-1), 4.78 g of the polysiloxane (PSL-1) solution, 4.12 g of the organic silver compound solution (OA-1), and 0.021 g of t-butylhydroquinone as a reducing agent. , 0.124 g of OXE-02 as a photopolymerization initiator, 0.206 g of IC-819, 1.648 g of DPHA as a photopolymerizable compound, 0.206 g of RS-72A as a liquid repellent compound, and celoxide 0.016 g of 2021P, 0.025 g of IRGANOX 1010, and 0.103 g of a 10 wt % PGMEA diluted solution of BYK-352 were dissolved in 2.76 g of solvent PGMEA and stirred. The resulting mixture was filtered through a 5.0 μm filter to obtain a partition wall resin composition (P-5).

Example 6 Partition wall resin composition (P-6)
The added amount of the organic silver compound solution (OA-1) was 0.516 g, the added amount of the polysiloxane (PSL-1) solution was 7.19 g, the added amount of t-butylhydroquinone was 0.010 g, and the added amount of PGMEA. A resin composition for partition walls (P-6) was obtained in the same manner as in Example 1, except that the weight was changed to 1.77 g.

Example 7 Partition wall resin composition (P-7)
As an organic silver compound, 0.50 g of silver salicylate was dissolved in 4.50 g of EDM to obtain an organic silver compound solution (OA-2). A partition wall resin composition (P-7) was obtained in the same manner as in Example 2, except that the organic silver compound solution (OA-2) was used instead of the organic silver compound solution (OA-1).

Example 8 Partition wall resin composition (P-8)
As an organic silver compound, 0.50 g of silver octylate was dissolved in 4.50 g of EDM to obtain an organic silver compound solution (OA-3). A partition wall resin composition (P-8) was obtained in the same manner as in Example 2, except that the organic silver compound solution (OA-3) was used instead of the organic silver compound solution (OA-1).

Example 9 Partition wall resin composition (P-9)
As the organic silver compound, 2.50 g of the organic silver compound (APAG-1) obtained in Preparation Example 8 described later was dissolved in 2.50 g of EDM to obtain an organic silver compound solution (OA-4). A resin composition for partition walls (P-9) was obtained in the same manner as in Example 2, except that the organic silver compound solution (OA-4) was used instead of the organic silver compound solution (OA-1).

Example 10 Partition wall resin composition (P-10)
A partition wall resin composition (P-10) was obtained in the same manner as in Example 2, except that 2,3-dimethylhydroquinone was used as the reducing agent instead of t-butylhydroquinone.

Example 11 Partition wall resin composition (P-11)
A partition wall resin composition (P-11) was obtained in the same manner as in Example 2, except that trimethylhydroquinone was used as the reducing agent instead of t-butylhydroquinone.

Example 12 Partition wall resin composition (P-12)
A partition wall resin composition (P-12) was obtained in the same manner as in Example 2, except that 2,6-dimethylhydroquinone was used as the reducing agent instead of t-butylhydroquinone.

Example 13 Partition wall resin composition (P-13)
A partition wall resin composition (P-13) was obtained in the same manner as in Example 2, except that phenylhydroquinone was used as the reducing agent instead of t-butylhydroquinone.

Example 14 Partition wall resin composition (P-14)
A partition wall resin composition (P-14) was obtained in the same manner as in Example 2, except that 2,5-t-amylhydroquinone was used as the reducing agent instead of t-butylhydroquinone.

Example 15 Partition wall resin composition (P-15)
A partition wall resin composition (P-15) was obtained in the same manner as in Example 2, except that hydroquinone was used as the reducing agent instead of t-butylhydroquinone.

Example 16 Partition wall resin composition (P-16)
A partition wall resin composition (P-16) was obtained in the same manner as in Example 2, except that glycolaldehyde was used as the reducing agent instead of t-butylhydroquinone.

Example 17 Partition wall resin composition (P-17)
For partition walls in the same manner as in Example 2 except that the amount of t-butylhydroquinone added was 0.005 g, the amount of polysiloxane (PSL-1) solution added was 7.15 g, and the amount of PGMEA added was 1.61 g. A resin composition (P-17) was obtained.

Example 18 Partition wall resin composition (P-18)
For partition walls in the same manner as in Example 2 except that the amount of t-butylhydroquinone added was 0.413 g, the amount of polysiloxane (PSL-1) solution added was 6.14 g, and the amount of PGMEA added was 2.22 g. A resin composition (P-18) was obtained.

Example 19 Partition wall resin composition (P-19)
5.00 g of R-960 as a white pigment and 5.00 g of a polysiloxane (PSL-2) solution as a resin are mixed and dispersed using a mill-type dispersing machine filled with zirconia beads to obtain a pigment dispersion (MW -2) was obtained. Add 8.25 g of pigment dispersion (MW-2) instead of the pigment dispersion (MW-1), and add 7 polysiloxane (PSL-2) solutions instead of the polysiloxane (PSL-1) solution. A resin composition for partition walls (P-19) was obtained in the same manner as in Example 2, except that 10 g of PGMEA was added and 1.64 g of PGMEA was added.

Example 20 Partition wall resin composition (P-20)
5.00 g of R-960 as a white pigment and 5.00 g of a polysiloxane (PSL-3) solution as a resin are mixed and dispersed using a mill-type dispersing machine filled with zirconia beads to obtain a pigment dispersion (MW -3) was obtained. 8.25 g of pigment dispersion (MW-3) was added instead of the pigment dispersion (MW-1), and 7 polysiloxane (PSL-3) solutions were added instead of the polysiloxane (PSL-1) solution. A resin composition for partition walls (P-20) was obtained in the same manner as in Example 2, except that 10 g of PGMEA was added and 1.64 g of PGMEA was added.

Example 21 Partition wall resin composition (P-21)
5.00 g of R-960 as a white pigment and 5.00 g of a polysiloxane (PSL-4) solution as a resin are mixed and dispersed using a mill-type dispersing machine filled with zirconia beads to obtain a pigment dispersion (MW -4) was obtained. 8.25 g of pigment dispersion (MW-4) was added instead of the pigment dispersion (MW-1), and 7 polysiloxane (PSL-4) solutions were added instead of the polysiloxane (PSL-1) solution. A resin composition for partition walls (P-21) was obtained in the same manner as in Example 2, except that 10 g of PGMEA was added and 1.64 g of PGMEA was added.

Example 22 Partition wall resin composition (P-22)
5.00 g of R-960 as a white pigment and 5.00 g of a polysiloxane (PSL-5) solution as a resin are mixed and dispersed using a mill-type dispersing machine filled with zirconia beads to obtain a pigment dispersion (MW -5) was obtained. Add 8.25 g of pigment dispersion (MW-5) instead of the pigment dispersion (MW-1), and add 7 polysiloxane (PSL-5) solutions instead of the polysiloxane (PSL-1) solution. A resin composition for partition walls (P-22) was obtained in the same manner as in Example 2, except that 10 g of PGMEA was added and 1.64 g of PGMEA was added.

Example 23 Partition wall resin composition (P-23)
5.00 g of R-960 as a white pigment and 5.00 g of a polysiloxane (PSL-6) solution as a resin are mixed and dispersed using a mill-type disperser filled with zirconia beads to obtain a pigment dispersion (MW -6) was obtained. 8.25 g of pigment dispersion (MW-6), 7.941 g of polysiloxane (PSL-6) solution, 0.722 g of the organic silver compound solution (OA-1), 0.026 g of t-butylhydroquinone as a reducing agent, 2.063 g of THP-17 (trade name, manufactured by Toyo Gosei Co., Ltd.) as a quinonediazide compound, 0.258 g of RS-72A, 0.021 g of Celoxide 2021P, and 0.031 g of IRGANOX1010 as liquid-repellent compounds, and 0.103 g of a 10% by weight PGMEA diluted solution of BYK-352 was dissolved in 1.018 g of solvent PGMEA and stirred. The resulting mixture was filtered through a 5.0 μm filter to obtain a partition wall resin composition (P-23).

Example 24 Partition wall resin composition (P-24)
For partition walls in the same manner as in Example 2, except that the amount of polysiloxane (PSL-1) solution added was 7.23 g and the amount of PGMEA was 1.77 g without adding the liquid-repellent compound RS-72A. A resin composition (P-24) was obtained.

Example 25 Partition wall resin composition (P-25)
5.00 g of R-960 as a white pigment, 5.00 g of polysiloxane (PSL-1) solution as a resin, and 0.0188 g of titanium nitride as a light-shielding pigment are mixed, and a mill-type disperser filled with zirconia beads is used. to obtain a pigment dispersion (MW-7). Instead of the pigment dispersion (MW-1), 8.27 g of pigment dispersion (MW-7) was added, the amount of polysiloxane (PSL-1) solution added was 7.06 g, and the amount of PGMEA added was 2. A partition wall resin composition (P-25) was obtained in the same manner as in Example 2, except that the weight was 31 g.

Example 26 Partition wall resin composition (P-26)
5.00 g of R-960 as a white pigment, 5.00 g of polysiloxane (PSL-1) solution as a resin, 0.0113 g of Pigment Red 254 (PR254) as a light-shielding pigment, Pigment Blue 15:6N (PB15:6N) ) was mixed and dispersed using a mill-type disperser filled with zirconia beads to obtain a pigment dispersion (MW-8). Instead of the pigment dispersion (MW-1), add 8.27 g of the pigment dispersion (MW-8), add 7.06 g of the polysiloxane (PSL-1) solution, and add 2 of PGMEA. A partition wall resin composition (P-26) was obtained in the same manner as in Example 2, except that the weight was 31 g.

Example 27 Partition wall resin composition (P-27)
0.103 g of bis(acetylacetonato)palladium as an organometallic compound and 0.089 g of triphenylphosphine as a coordinating compound having a phosphorus atom (equimolar amount relative to the organometallic compound) were added to 1.726 g of DAA. to obtain an organometallic compound solution (OM-1). Same as Example 2 except that 1.17 g of the organometallic compound solution (OM-1) was added, the amount of the polysiloxane (PSL-1) solution added was 6.86 g, and the amount of PGMEA added was 0.92 g. to obtain a partition wall resin composition (P-27).

Example 28 Partition wall resin composition (P-28)
5.00 g of titanium nitride as a light-shielding pigment and 5.00 g of a polysiloxane (PSL-1) solution as a resin are mixed and dispersed using a mill-type disperser filled with zirconia beads to obtain a pigment dispersion (MW-9). Obtained. 0.164 g of the pigment dispersion (MW-9), 14.51 g of polysiloxane (PSL-1) solution, 0.021 g of t-butylhydroquinone as a reducing agent, and 0 OXE-02 as a photopolymerization initiator. .164 g, 0.328 g of IC-819, 1.640 g of DPHA as a photopolymerizable compound, 0.205 g of RS-72A, 0.016 g of celoxide 2021P and 0.025 g of IRGANOX 1010 as liquid repellent compounds, and BYK-352 were dissolved in 2.75 g of solvent PGMEA and stirred. The resulting mixture was filtered through a 5.0 μm filter to obtain a partition wall resin composition (P-28).

Example 29 Partition wall resin composition (P-29)
3.00 g of PR254 as a light-shielding pigment, 2.00 g of PB15:6N, and 5.00 g of polysiloxane (PSL-1) solution as a resin are mixed, and dispersed using a mill-type disperser filled with zirconia beads. A dispersion (MW-10) was obtained. The same as in Example 28 except that 0.574 g of the pigment dispersion (MW-10) was added, the amount of polysiloxane (PSL-1) solution added was 13.49 g, and the amount of PGMEA added was 3.37 g. to obtain a partition wall resin composition (P-29).

Comparative Example 1 Partition wall resin composition (P-30)
13.40 g of polysiloxane (PSL-1) solution, 0.574 g of the organic silver compound solution (OA-1), 0.021 g of t-butylhydroquinone as a reducing agent, and 0.02 g of OXE-02 as a photopolymerization initiator. 123 g, 0.246 g of IC-819, 1.640 g of DPHA as a photopolymerizable compound, 0.205 g of RS-72A, 0.016 g of Celoxide 2021P and 0.025 g of IRGANOX 1010 as liquid repellent compounds, and 0.103 g of a 10% by weight PGMEA diluted solution of BYK-352 was dissolved in 0.02 g of solvent PGMEA and stirred. The resulting mixture was filtered through a 5.0 μm filter to obtain a partition wall resin composition (P-30).

Comparative Example 2 Partition wall resin composition (P-31)
Same as Example 2 except that the amount of polysiloxane (PSL-1) solution added was 7.28 g and the amount of PGMEA was 2.18 g without adding the organic silver compound solution (OA-1). to obtain a partition wall resin composition (P-31).

Comparative Example 3 Partition wall resin composition (P-32)
For partition walls in the same manner as in Example 1 except that the amount of polysiloxane (PSL-1) solution added was 7.09 g and the amount of PGMEA was 1.37 g without adding the reducing agent t-butylhydroquinone. A resin composition (P-32) was obtained.

The compositions of Examples 1-29 and Comparative Examples 1-3 are summarized in Table 2.

Preparation Example 1 Color Conversion Luminescent Material Composition (CL-1)
Green quantum dot material (Lumidot 640 CdSe / ZnS, average particle size 6.3 nm: manufactured by Aldrich) 0.5 wt% toluene solution 20 parts by weight, DPHA 45 parts by weight, "Irgacure" (registered trademark) 907 ( 5 parts by weight of BASF Japan Co., Ltd.), 166 parts by weight of 30% by weight PGMEA solution of acrylic resin (SPCR-18 (trade name), Showa Denko Co., Ltd.) and 97 parts by weight of toluene are mixed and stirred. and dissolved uniformly. The resulting mixture was filtered through a 0.45 μm syringe filter to prepare a color-converting luminescent material composition (CL-1).

Preparation Example 2 Color-converting luminescent material composition (CL-2)
Color in the same manner as in Preparation Example 1, except that 0.4 parts by weight of the green phosphor G-1 obtained in Synthesis Example 10 was used instead of the green quantum dot material, and the amount of toluene added was changed to 117 parts by weight. A conversion luminescent material composition (CL-2) was prepared.

Preparation Example 3 Color conversion luminescent material composition (CL-3)
Color in the same manner as in Preparation Example 1, except that 0.4 parts by weight of the red phosphor R-1 obtained in Synthesis Example 11 was used instead of the green quantum dot material, and the amount of toluene added was changed to 117 parts by weight. A conversion luminescent material composition (CL-3) was prepared.

Preparation Example 4 Color filter forming material (CF-1)
C. I. Pigment Green 59, 90 g, C.I. I. 60 g of Pigment Yellow 150, 75 g of a polymer dispersant (“BYK” (registered trademark)-6919 (trade name) manufactured by BYK Chemie (hereinafter “BYK-6919”)), a binder resin (“Adeka Arkles” (registered trademark) ) 100 g of WR301 (trade name, manufactured by ADEKA Corporation) and 675 g of PGMEA were mixed to prepare a slurry. A beaker containing the slurry was connected to a Dyno mill and a tube, and zirconia beads with a diameter of 0.5 mm were used as media to perform dispersion treatment at a peripheral speed of 14 m/s for 8 hours to obtain Pigment Green 59 dispersion (GD-1). was made.

Pigment Green 59 dispersion (GD-1) 56.54 g, acrylic resin (“Cyclomer” (registered trademark) P (ACA) Z250 (trade name) manufactured by Daicel Allnex Co., Ltd. (hereinafter “P (ACA) Z250” )) 3.14 g, DPHA 2.64 g, a photopolymerization initiator (“OPTOMER” (registered trademark) NCI-831 (trade name) manufactured by ADEKA Corporation (hereinafter “NCI-831”)) 0.330 g, 0.04 g of a surfactant (BYK” (registered trademark)-333 (trade name) manufactured by BYK-Chemie (hereinafter “BYK-333”)), 0.01 g of BHT as a polymerization inhibitor, and 37 g of PGMEA as a solvent. 30 g were mixed to prepare a color filter forming material (CF-1).

Preparation Example 5 Resin composition for light-shielding barrier ribs 150 g of carbon black (MA100 (trade name) manufactured by Mitsubishi Chemical Corporation), 75 g of polymer dispersant BYK-6919, 100 g of P(ACA)Z250, and 675 g of PGMEA were mixed. to prepare a slurry. A beaker containing the slurry was connected to a Dyno mill and a tube, and zirconia beads with a diameter of 0.5 mm were used as media to perform dispersion treatment at a peripheral speed of 14 m/s for 8 hours to prepare a pigment dispersion liquid (MB-1). did.

Pigment dispersion (MB-1) 56.54 g, P (ACA) Z250 3.14 g, DPHA 2.64 g, NCI-831 0.330 g, BYK-333 0.04 g, tertiary polymerization inhibitor 0.01 g of butylcatechol and 37.30 g of PGMEA were mixed to prepare a resin composition for light-shielding partition walls.

Preparation Example 6 Low refractive index layer-forming material 5.350 g of the silica particle-containing polysiloxane solution (LS-1) obtained in Synthesis Example 7, 1.170 g of ethylene glycol mono-t-butyl ether, and 3.48 g of DAA After mixing, the mixture was filtered through a 0.45 μm syringe filter to prepare a low refractive index layer-forming material.

Preparation Example 7 Yellow organic protective layer-forming material (YL-1)
C. I. 150 g of Pigment Yellow 150, 75 g of polymer dispersant (“BYK” (registered trademark)-6919 (trade name) manufactured by BYK-Chemie Co., Ltd. (hereinafter “BYK-6919”)), a binder resin (“ADEKA Arkles” (registered trademark) ) 100 g of WR301 (trade name, manufactured by ADEKA Corporation) and 675 g of PGMEA were mixed to prepare a slurry. A beaker containing the slurry was connected to a Dyno mill and a tube, and zirconia beads with a diameter of 0.5 mm were used as media to perform dispersion treatment at a peripheral speed of 14 m/s for 8 hours to obtain Pigment Yellow 150 dispersion (YD-1). was made.

Pigment Yellow 150 dispersion liquid (YD-1) 3.09 g, polysiloxane (PSL-1) solution 23.54 g as resin, DPHA 6.02 g as photopolymerizable compound, silver neodecanoate as organometallic compound 6.02 g of the prepared organometallic compound solution (OM-2), 0.20 g of OXE-02 as a photopolymerization initiator, 0.40 g of IC-819, 0.060 g of IRGANOX (registered trademark) 1010, and BYK 0.050 g of a 10% by weight diluted solution of PGMEA of -352 (equivalent to a concentration of 500 ppm) was dissolved in 61.15 g of solvent PGMEA and stirred. The resulting mixture was filtered through a 5.0 μm filter to obtain a yellow organic protective layer-forming material (YL-1).

Preparation Example 8 Organic silver compound (APAG-1)
As a (meth)acrylic polymer solution, 5.0 g of a 30% by weight PGMEA solution of SPCR-10P ((trade name), manufactured by Showa Denko KK) was dissolved in 5.0 g of acetone, and 0.0555 g of diethanolamine ((meth)acrylic 1.5 molar equivalents relative to the polymer) was added dropwise and stirred at room temperature for 1 hour to produce an amine salt of the (meth)acrylic polymer solution. Next, 0.0287 g of silver nitrate (I) was added to this solution, and the mixture was stirred at room temperature for 1 hour to form a precipitate. After filtering through a 5.0 μm filter, PGMEA was added so that the solid content was 20%, to obtain an organic silver compound (APAG-1).

Examples 30-52, Examples 54-59, Comparative Examples 4-6
A 10 cm square non-alkali glass substrate (manufactured by AGC Techno Glass Co., Ltd., thickness 0.7 mm) was used as the base substrate. A partition wall resin composition shown in Tables 2 to 5 was applied thereon by spin coating, and dried at a temperature of 100° C. for 3 minutes using a hot plate (trade name: SCW-636, manufactured by Dainippon Screen Mfg. Co., Ltd.). , to prepare a dry film. The prepared dried film was exposed through a photomask using a parallel light mask aligner (trade name: PLA-501F, manufactured by Canon Inc.) with an ultra-high pressure mercury lamp as a light source, with an exposure amount of 300 mJ/cm ² (g, h , i-line). Then, using an automatic developing device ("AD-2000 (trade name)" manufactured by Takizawa Sangyo Co., Ltd.), shower development is performed using a 0.045% by weight potassium hydroxide aqueous solution for 100 seconds, and then water is used for 30 seconds. Rinse for seconds. Furthermore, using an oven (trade name IHPS-222, manufactured by ESPEC Co., Ltd.), it was heated in the air at a temperature of 230 ° C. for 30 minutes, and a partition with a height of 10 µm and a width of 20 µm was formed on the glass substrate, and the short side was 80 µm. , were formed in a grid-like pattern with a pitch interval of 280 μm on the long side.

The regions separated by the partition walls of the obtained substrate with partition walls were coated with the color-converting luminescent material compositions shown in Tables 3 to 5 using an inkjet method in a nitrogen atmosphere, dried at 100° C. for 30 minutes, and the thickness was reduced. Pixels of 5.0 μm were formed to obtain a substrate with partition walls having the configuration shown in FIG.

Example 53
A 10 cm square non-alkali glass substrate (manufactured by AGC Techno Glass Co., Ltd., thickness 0.7 mm) was used as the base substrate. A partition wall resin composition (P-23) was spin-coated thereon, and dried at a temperature of 100° C. for 3 minutes using a hot plate (trade name: SCW-636, manufactured by Dainippon Screen Mfg. Co., Ltd.). A dry film was prepared. The prepared dried film was exposed through a photomask using a parallel light mask aligner (trade name: PLA-501F, manufactured by Canon Inc.) with an ultra-high pressure mercury lamp as a light source, with an exposure amount of 300 mJ/cm ² (g, h , i-line). Then, using an automatic developing device ("AD-2000 (trade name)" manufactured by Takizawa Sangyo Co., Ltd.), shower development is performed with a 2.38% by weight tetramethylammonium hydroxide aqueous solution for 90 seconds, and then rinsed with water for 30 seconds. did. Then, similarly to the above, bleaching was performed by exposing with an exposure dose of 500 mJ/cm ² (g, h, i lines) without passing through a photomask. Furthermore, using an oven (trade name IHPS-222, manufactured by ESPEC Co., Ltd.), it was heated in the air at a temperature of 230 ° C. for 30 minutes, and a partition with a height of 10 µm and a width of 20 µm was formed on the glass substrate, and the short side was 80 µm. , were formed in a grid-like pattern with a pitch interval of 280 μm on the long side.

The color-converting luminescent material composition (CL-2) was applied to the regions separated by the partition walls of the obtained substrate with partition walls using an inkjet method under a nitrogen atmosphere, dried at 100° C. for 30 minutes, and formed to a thickness of 5. Pixels of 0.0 μm were formed to obtain a substrate with partition walls having the structure shown in FIG.

Example 60
A 10 cm square non-alkali glass substrate (manufactured by AGC Techno Glass Co., Ltd., thickness 0.7 mm) was used as the base substrate. The material for forming light-shielding barrier ribs obtained in Preparation Example 5 was spin-coated thereon, and dried at a temperature of 90° C. for 2 minutes using a hot plate (trade name: SCW-636, manufactured by Dainippon Screen Mfg. Co., Ltd.). , to prepare a dry film. The prepared dried film was exposed through a photomask using a parallel light mask aligner (trade name: PLA-501F, manufactured by Canon Inc.) with an ultra-high pressure mercury lamp as a light source, with an exposure amount of 40 mJ/cm ² (g, h , i-line). Thereafter, using an automatic developing device ("AD-2000 (trade name)" manufactured by Takizawa Sangyo Co., Ltd.), development is performed with a 0.3% by weight tetramethylammonium aqueous solution for 50 seconds, and then rinsed with water for 30 seconds. did. Furthermore, using an oven (trade name: IHPS-222, manufactured by ESPEC Co., Ltd.), it was heated in the air at a temperature of 230° C. for 30 minutes, and a layer having a height of 2.0 μm, a width of 20 μm, and a thickness of 1.0 μm was formed on the glass substrate. A substrate with light-shielding barrier ribs was obtained, in which barrier ribs having an OD value of 2.0 per 0 μm were formed in a lattice pattern with a pitch of 40 μm on the short side and 280 μm on the long side.

Then, by the same method as in Example 32, barrier ribs having a height of 10 μm and a width of 20 μm were formed on the light shielding barrier ribs in a lattice pattern similar to that of the light shielding barrier ribs having a pitch of 40 μm on the short side and 280 μm on the long side. obtained a substrate with The color-converting luminescent material composition (CL-2) obtained in Preparation Example 2 was applied to the regions separated by the partition walls of the obtained substrate with partition walls using an inkjet method in a nitrogen atmosphere, and the mixture was heated at 100°C. After drying for 30 minutes, pixels with a thickness of 5.0 μm were formed to obtain a substrate with partition walls having the structure shown in FIG.

Example 61
The colorant obtained in Preparation Example 4 was applied to the regions separated by the partition walls of the substrate with partition walls before pixel formation, which was obtained by the same method as in Example 32, so that the film thickness after curing was 2.5 μm. A filter-forming material (CF-1) was applied and vacuum dried. Exposure was performed at an exposure dose of 40 mJ/cm ² (g, h, i lines) through a photomask designed to expose the regions of the openings of the substrate with partition walls. After developing with a 0.3% by weight tetramethylammonium aqueous solution for 50 seconds, heat curing was performed at 230° C. for 30 minutes. A color filter layer was formed. Thereafter, the color-converting light-emitting material composition (CL-2) obtained in Preparation Example 2 was applied onto the color filter in a nitrogen atmosphere using an inkjet method and dried at 100° C. for 30 minutes to obtain a thickness of 5.5. Pixels of 0 μm were formed to obtain a substrate with partition walls having the structure shown in FIG.

Example 62
A 10 cm square non-alkali glass substrate (manufactured by AGC Techno Glass Co., Ltd., thickness 0.7 mm) was used as the base substrate. The material for forming light-shielding barrier ribs obtained in Preparation Example 5 was spin-coated thereon, and dried at a temperature of 90° C. for 2 minutes using a hot plate (trade name: SCW-636, manufactured by Dainippon Screen Mfg. Co., Ltd.). , to prepare a dry film. The prepared dried film was exposed through a photomask using a parallel light mask aligner (trade name: PLA-501F, manufactured by Canon Inc.) with an ultra-high pressure mercury lamp as a light source, with an exposure amount of 40 mJ/cm ² (g, h , i-line). Thereafter, using an automatic developing device ("AD-2000 (trade name)" manufactured by Takizawa Sangyo Co., Ltd.), development is performed with a 0.3% by weight tetramethylammonium aqueous solution for 50 seconds, and then rinsed with water for 30 seconds. did. Furthermore, using an oven (trade name: IHPS-222, manufactured by ESPEC Co., Ltd.), it was heated in the air at a temperature of 230° C. for 30 minutes, and a layer having a height of 2.0 μm, a width of 20 μm, and a thickness of 1.0 μm was formed on the glass substrate. A substrate with light-shielding barrier ribs was obtained, in which barrier ribs having an OD value of 2.0 per 0 μm were formed in a lattice pattern with a pitch of 40 μm on the short side and 280 μm on the long side.

After that, the color filter forming material (CF-1) obtained in Preparation Example 4 was applied to the regions separated by the light-shielding partition walls so that the film thickness after curing was 2.5 μm, and dried in a vacuum. Exposure was performed at an exposure dose of 40 mJ/cm ² (g, h, i lines) through a photomask designed to expose the regions of the openings of the substrate with partition walls. After developing with a 0.3% by weight tetramethylammonium aqueous solution for 50 seconds, heat curing was performed at 230° C. for 30 minutes. A color filter layer was formed.

Thereafter, the low refractive index layer-forming material obtained in Preparation Example 6 was spin-coated and dried at a temperature of 90° C. for 2 minutes using a hot plate (trade name: SCW-636, manufactured by Dainippon Screen Mfg. Co., Ltd.). , to prepare a dry film. Furthermore, using an oven (trade name IHPS-222, manufactured by ESPEC Co., Ltd.), the mixture is heated in air at a temperature of 90°C for 30 minutes to form a low refractive index layer having a height of 1.0 µm and a refractive index of 1.25. did.

Furthermore, after that, on the low refractive index layer, a silicon nitride film with a thickness of 300 nm, which corresponds to the inorganic protective layer I with a height of 50 to 1,000 nm, is formed using a plasma CVD apparatus (PD-220NL, manufactured by Samco). formed.

A substrate with barrier ribs was formed thereon by the same method as in Example 32, with barrier ribs having a height of 10 μm and a width of 20 μm formed in a lattice pattern similar to the light-shielding barrier ribs having a pitch of 40 μm on the short side and 280 μm on the long side. got The color-converting luminescent material composition (CL-2) obtained in Preparation Example 2 was applied to the regions separated by the partition walls of the obtained substrate with partition walls using an inkjet method in a nitrogen atmosphere, and the mixture was heated at 100°C. After drying for 30 minutes, pixels having a thickness of 5.0 μm were formed to obtain a substrate with partition walls having the structure shown in FIG.

Example 63
A plasma CVD device ( PD-220NL (manufactured by Samco) was used to form a silicon nitride film with a thickness of 300 nm, which corresponds to the inorganic protective layer III with a thickness of 50 to 1,000 nm. Furthermore, on the inorganic protective layer III, in a nitrogen atmosphere, the color-converting light-emitting material composition (CL-2) obtained in Preparation Example 2 is applied using an inkjet method, dried at 100° C. for 30 minutes, and the thickness is Pixels of 5.0 μm were formed to obtain a substrate with partitions having the configuration shown in FIG. 11 .

Example 64
A color filter layer having a thickness of 2.5 μm, a short side of 40 μm and a long side of 280 μm was formed by the same method as in Example 61. The resulting yellow organic protective layer-forming material (YL-1) was applied and vacuum-dried. Exposure was performed at an exposure amount of 300 mJ/cm ² (g, h, i lines) through a photomask designed to expose the regions of the openings of the substrate with partition walls. After developing with a 0.3% by weight tetramethylammonium aqueous solution for 50 seconds, heat curing was performed at 230° C. for 30 minutes to form a yellow organic protective layer having a thickness of 1.0 μm, a short side of 40 μm and a long side of 280 μm. Furthermore, on the yellow organic protective layer, in a nitrogen atmosphere, using an inkjet method, the color conversion light-emitting material composition (CL-2) obtained in Preparation Example 2 is applied, dried at 100 ° C. for 30 minutes, and the thickness is Pixels of 5.0 μm were formed to obtain a substrate with partitions having the configuration shown in FIG. 11 .

Tables 3 to 5 show the configurations of each example and comparative example.

Evaluation methods in each example and comparative example are shown below.

<Refractive index of low refractive index layer>
The low refractive index layer-forming material used in each example was applied onto a silicon wafer using a spinner, and a hot plate (trade name: SCW-636, manufactured by Dainippon Screen Mfg. Co., Ltd.) was used at a temperature of 90°C. Dried for 2 minutes. After that, using an oven (IHPS-222; manufactured by ESPEC Co., Ltd.), it was heated in the air at 90° C. for 30 minutes to prepare a cured film. Using a prism coupler (PC-2000 (manufactured by Metricon Co., Ltd.)), the refractive index was measured by irradiating light with a wavelength of 550 nm from the direction perpendicular to the surface of the cured film at 20° C. under atmospheric pressure. , rounded to the second decimal place.

<Crack resistance>
The barrier rib-forming resin composition used in each example and comparative example was spin-coated so that the film thickness after heating was 10 μm, 15 μm, 20 μm and 25 μm, respectively. In the subsequent steps of the barrier rib-forming resin compositions used in Examples 36 to 60, Examples 62 to 71 and Comparative Examples 5 to 8, the entirety was exposed without using a photomask during exposure. A solid film was formed on a glass substrate by processing under the same conditions as in Examples and Comparative Examples. Subsequent steps of the partition-forming resin composition used in Example 61 were processed under the same conditions as in Example 62, except that bleaching was performed after development without exposure, and a solid film was formed on the glass substrate. made. Using the resulting solid film as a model of the barrier ribs of the substrates with barrier ribs obtained in Examples and Comparative Examples, the glass substrate having the solid film was visually observed to evaluate the presence or absence of cracks in the solid film. If even one crack was confirmed, it was determined that the film had no crack resistance at that film thickness. For example, when there were no cracks at a film thickness of 15 μm and cracks at a film thickness of 20 μm, the crack resistant film thickness was judged to be “≧15 μm”. In addition, the crack resistant film thickness was determined as "≧25 μm" when there was no crack even at 25 μm, and the crack resistant film thickness was determined as "<10 μm" when there was a crack even at 10 μm, and the crack resistance was determined.

<Resolution>
Using a spin coater (trade name 1H-360S, manufactured by Mikasa Co., Ltd.), the partition wall resin composition used in each example and comparative example was coated on a 10 cm square non-alkali glass substrate to determine the film thickness after heating. was spin-coated to a thickness of 10 μm, and dried at a temperature of 100° C. for 3 minutes using a hot plate (trade name SCW-636, manufactured by Dainippon Screen Mfg. Co., Ltd.) to prepare a dry film with a thickness of 10 μm. .

The prepared dry film was measured using a parallel light mask aligner (trade name: PLA-501F, manufactured by Canon Inc.) with an ultra-high pressure mercury lamp as a light source, and each width of 100 μm, 80 μm, 60 μm, 50 μm, 40 μm, 30 μm and 20 μm. was exposed at an exposure amount of 300 mJ/cm ² (g, h, i lines) with a gap of 100 μm through a mask having a line and space pattern of . Then, using an automatic developing device ("AD-2000 (trade name)" manufactured by Takizawa Sangyo Co., Ltd.), shower development is performed using a 0.045% by weight potassium hydroxide aqueous solution for 100 seconds, and then water is used for 30 seconds. Rinse for seconds.

Using a microscope adjusted to a magnification of 100, the pattern after development was enlarged and observed, and the narrowest line width among the patterns in which no residue was observed in the unexposed area was defined as the resolution. However, when there was also a residue in the unexposed area near the pattern with a width of 100 μm, it was defined as “>100 μm”.

<Reflectance>
Except that the partition-forming resin compositions used in Examples 30 to 52, Examples 54 to 59 and Comparative Examples 4 to 6 were entirely exposed without passing through a photomask during the exposure, each of the examples and comparative examples was performed. A solid film having a height of 10 μm was formed on a glass substrate by processing under the same conditions. The partition-forming resin composition used in Example 53 was processed under the same conditions as in Example 53, except that it was developed without being exposed to light and then bleached, and a solid film having a height of 10 μm was formed on a glass substrate. made. Using a spectrophotometer (trade name: CM-2600d, manufactured by Konica Minolta, Inc.), the glass substrate having the obtained solid film was measured for reflectance at wavelengths of 450 nm, 550 nm and 630 nm in SCI mode from the solid film side. It was measured. However, when cracks or wrinkles occurred in the solid film, the reflectance was not measured because accurate values could not be obtained due to such cracks.

<OD value>
As a model of the barrier ribs of the substrate with barrier ribs obtained in each example and comparative example, a solid film having a height of 10 μm was formed on a glass substrate in the same manner as in the evaluation of the reflectance. For the glass substrate having the obtained solid film, the intensity of incident light and transmitted light was measured using an optical densitometer (Hitachi High-Tech Science U-4100), and the wavelengths of 450 nm, 550 nm and 630 nm were measured according to the above formula (1). The OD value in was calculated. As for the OD value, the solid film before the heating process and the OD value after the heating process were measured, and the differences are shown in Tables 6 to 8.

Further, for Examples 60 and 62, a solid film was similarly formed on a glass substrate as a model of the light shielding partition (A-2). The intensity of incident light and transmitted light on the obtained glass substrate having the solid film was measured using an optical densitometer (Hitachi High-Tech Science U-4100), and the intensity was calculated according to the above formula (1).

<Weather resistance>
As a model of the barrier ribs of the substrate with barrier ribs obtained in each example and comparative example, a solid film having a height of 10 μm was formed on a glass substrate in the same manner as in the evaluation of the reflectance. For the glass substrate having the obtained solid film, using a spectrophotometer (trade name CM-2600d, manufactured by Konica Minolta, Inc.) in SCI mode from the solid film side, chromaticity (L* value, a* and b* values) were measured. After that, the glass substrate having each solid film was set in a desktop xenon accelerated weathering tester (trade name Q-SUN Xe-1, manufactured by Q-Lab), and irradiated with light having a wavelength of 340 nm at an irradiation amount of 0.42 W/ A weather resistance test was performed for 100 hours under the conditions of m ² and chamber temperature of 45°C. Thereafter, the chromaticity (L* value, a* and b* values) of the glass substrate having each solid film is measured again from the solid film side in the SCI mode, and the amount of change ΔE in the reflection chromaticity coordinate is calculated by the following formula. (2).

ΔE = {(ΔL*) ² + (Δa*) ² + (Δb*) ² } ^1/2 (2)
The calculated ΔE was evaluated for weather resistance according to the following criteria. A smaller ΔE indicates higher weather resistance.

A: ΔE<3.0
B: 3.0≤ΔE≤6.0
C: 6.0≤ΔE

<Taper angle>
In each of the examples and comparative examples, an arbitrary cross section of the substrate with partition walls before pixel formation was measured using an optical microscope (FE-SEM (S-4800); manufactured by Hitachi, Ltd.) at an acceleration voltage of 3.0 kV. was observed and the taper angle was measured.

<Surface contact angle>
As a model of the barrier ribs in the substrates with barrier ribs obtained in each example and comparative example, a solid film with a height of 10 μm was formed on a glass substrate in the same manner as in the evaluation of the reflectance. The surface of the obtained solid film was measured at 25 ° C. in the atmosphere using DM-700 manufactured by Kyowa Interface Science Co., Ltd., microsyringe: Teflon (registered trademark) coated needle 22G for contact angle meter manufactured by Kyowa Interface Science Co., Ltd. The surface contact angle was measured in accordance with the substrate glass surface wettability test method defined in JIS R3257 (enacted date = 1999/04/20). However, propylene glycol monomethyl ether acetate was used instead of water, and the contact angle between the surface of the solid film and propylene glycol monomethyl ether acetate was measured.

<Inkjet coatability>
In the substrates with partition walls before forming the pixels obtained in each example and comparative example, PGMEA was used as an ink for the pixel portions surrounded by the grid-like partition walls, and an inkjet coating device (InkjetLabo, cluster technology ( Co., Ltd.) was used for inkjet coating. 160 pL of PGMEA was applied to each grid pattern, and the presence or absence of breakage (a phenomenon in which ink crosses over the partition wall and mixes into the adjacent pixel portion) was observed, and the inkjet applicability was evaluated according to the following criteria. The smaller the breakage, the higher the liquid repellency and the better the inkjet applicability.

A: Ink did not overflow from the pixel.
B: Ink overflowed from the inside of the pixel to the upper surface of the partition in a part.
C: Ink overflowed from the inside of the pixel to the upper surface of the partition on the entire surface.

<Height>
For each layer of the substrate with partition walls obtained in each example and comparative example, the film thickness before and after the formation of each layer was measured using a Surfcom stylus film thickness measurement device, and the difference was calculated to determine the height. It was measured.

In addition, for Examples 62 and 63, a cross section perpendicular to the underlying substrate was exposed using a polishing apparatus such as a cross section polisher, and the cross section was enlarged and observed with a scanning electron microscope or a transmission electron microscope. , the height of each inorganic protective layer was measured.

<OD value change after low temperature heating>
Glass was prepared in the same manner as in the evaluation of the OD value described above, except that the partition wall-forming resin composition used in each example and comparative example was used and the final heating conditions were changed to 100° C. in air for 60 minutes. A solid film with a height of 10 μm was formed on the substrate. For the obtained solid film, the intensity of incident light and transmitted light was measured using an optical densitometer (Hitachi High-Tech Science U-4100) in the same manner as in the evaluation of the OD value, and then the OD value was calculated. The solid film before the heating process and the OD value at a wavelength of 450 nm after the heating process were measured, and the difference was calculated to evaluate the change in the OD value during low-temperature heating according to the following criteria.

A: ΔOD value>1.5
B: 0.5 ≤ ΔOD value ≤ 1.5
C: ΔOD value <0.5

<Low temperature curability>
Using the partition-forming resin composition used in each example and comparative example, partition walls were formed in the same manner, except that the final heating conditions were changed to 100° C. in air for 60 minutes. Regarding the obtained substrate with partition walls, 1,6-hexanedioldiacrylate was used as an ink and ink jet coating was performed on the inside of the partition walls in the same manner as in the evaluation of the ink jet applicability described above. Then, the inside of the pixel was observed after 1 hour and 3 hours, and the low-temperature curability of the partition walls was evaluated according to the following criteria. It shows that the low-temperature curability of the partition wall is so excellent that there is no seepage into adjacent pixels.

A: Even after 3 hours from inkjet application, no ink seepage into adjacent pixels was observed. B: No ink seepage into adjacent pixels was observed after 1 hour from inkjet application, but after 3 hours. Bleeding was observed C: Immediately after ink-jet application, ink was seen to bleed into adjacent pixels

<Storage stability>
The partition wall-forming resin composition used in each example and comparative example was evaluated in the same manner as the evaluation of resolution immediately after preparation, after storage at 25° C. for 3 days from preparation, and after storage for 7 days. Storage stability was evaluated according to the following criteria.

A: Evaluation immediately after preparation, after storage at 25°C for 3 days, and after storage at 25°C for 7 days showed no change in processable resolution. B: Evaluation immediately after preparation and after storage at 25°C for 3 days. There was no change in the resolution that can be processed, respectively, but in the evaluation after storage at 25 ° C. for 7 days, the resolution that can be processed deteriorated. Processable resolution deteriorated

<Brightness>
A planar light-emitting device equipped with a commercially available LED backlight (peak wavelength 465 nm) was used as a light source, and the substrates with partition walls obtained in each example and comparative example were placed so that the pixel portion was on the light source side. A current of 30 mA is passed through this planar light emitting device to light the LED element, and the luminance (unit: cd/m ² ) based on the CIE1931 standard is measured using a spectral radiance meter (CS-1000, manufactured by Konica Minolta). measured and taken as the initial luminance. However, the evaluation of luminance was performed using a relative value with the initial luminance of Example 69 being 100 as the standard.

In addition, after lighting the LED element for 48 hours at room temperature (23° C.), the luminance was similarly measured to evaluate the change in luminance over time. However, the evaluation of luminance was performed using a relative value with the initial luminance of Example 69 being 100 as the standard.

<Color characteristics>
The substrate with partition walls obtained in each example and comparative example was placed on a commercially available white reflector such that the pixels were arranged on the side of the white reflector. Using a spectrophotometer (CM-2600d, manufactured by Konica Minolta, measuring diameter φ8 mm), the substrate with partition walls was irradiated with light from the underlying substrate side, and the spectrum including regular reflection light was measured.

Color standard BT. The color gamut defined by 2020 is defined as the three primary colors red, green and blue on the spectral locus shown in the chromaticity diagram, with the wavelengths of red, green and blue corresponding to 630 nm, 532 nm and 467 nm respectively. From the reflectance (R) at three wavelengths of 470 nm, 530 nm and 630 nm of the obtained reflection spectrum, the emission color of the pixel was evaluated according to the following criteria.

A: _R530 /( _R630 + _R530 + _R470 )≧0.55
B: _R530 /( _R630 + _R530 + _R470 ) < 0.55.

<Display characteristics>
The display characteristics of the display devices produced by combining the substrates with partition walls and the organic EL elements obtained in Examples and Comparative Examples were evaluated based on the following criteria.

A: The display device has a very vivid green display, and is clear and excellent in contrast.
B: The display device has no problem, although the colors are somewhat unnatural.

<Mixed color>
In the substrates with partition walls before forming pixels obtained in each of Examples and Comparative Examples, a color-converting luminescent material composition ( CL-2) was applied and dried at 100° C. for 30 minutes to form pixels with a thickness of 5.0 μm. After that, among the pixel portions surrounded by the grid-like partition walls, the color-converting luminescent material composition (CL -3) was applied and dried at 100° C. for 30 minutes to form pixels with a thickness of 5.0 μm.

On the other hand, a blue organic EL cell having the same width as the pixel portion surrounded by the grid-like partition walls was prepared, and the substrate with the partition walls and the blue organic EL cell were opposed to each other and bonded with a sealant, as shown in FIG. A display device of the composition was obtained.

Of the blue organic EL cells 11 in FIG. 15, only the blue organic EL cells bonded directly below the pixels 3 (CL-2) formed of the color-converting light-emitting material composition (CL-2) are lit. , For the pixel 3 (CL-3) portion formed of the color conversion luminescent material composition (CL-3), the absorption intensity at a wavelength of 630 nm was measured using a microspectrophotometer LVmicro-V (manufactured by Lambda Vision Co., Ltd.). A (630 nm) was measured. A smaller value of the absorption intensity A (630 nm) indicates that color mixture is less likely to occur. Color mixture was determined according to the following criteria.

A: A (630 nm) < 0.01
B: 0.01≦A (630 nm)≦0.5
C: 0.5<A (630 nm).

Tables 6 to 8 show the evaluation results of each example and comparative example.

1 base substrate 2 partition wall 3 pixel 3 (CL-2) pixel formed of color-converting luminescent material composition (CL-2) 3 (CL-3) formed of color-converting luminescent material composition (CL-3) Pixel 4 Light shielding partition 5 Color filter 6 Low refractive index layer 7 Inorganic protective layer I
8 inorganic protective layer II
9 inorganic protective layer III and/or yellow organic protective layer 10 inorganic protective layer IV and/or yellow organic protective layer 11 light source selected from organic EL cell, mini LED cell and micro LED cell 12 blue organic EL cell H partition wall Thickness L Partition width θ Taper angle

Claims (17)

It contains a resin, a photoinitiator or a quinonediazide compound, a white pigment and/or a light-shielding pigment, an organic silver compound, and a reducing agent, and the white pigment is selected from SiO ₂ , Al ₂ O ₃ and ZrO ₂ . and the light-shielding pigment contains at least one of a red pigment, a blue pigment, a black pigment, a green pigment, and a yellow pigment . A resin composition containing a resin, a photopolymerization initiator or a quinonediazide compound, a white pigment and/or a light-shielding pigment, an organic silver compound, and a reducing agent, wherein two or more of the reducing agents are present in the molecule. A resin composition which is a compound containing a phenolic hydroxyl group or a compound containing an enediol group. 3. The resin composition according to claim 1, wherein the organic silver compound is a compound represented by the following general formula (1).

(In general formula (1), R ₁ represents hydrogen or an organic group having 1 to 30 carbon atoms.) 3. The resin composition according to claim 1, wherein said organic silver compound is a polymer compound having at least a structure represented by the following general formula (2).

(In general formula (2), R ² and R ³ each independently represent hydrogen or an organic group having 1 to 30 carbon atoms , and a represents an integer of 1 or more ). The resin composition according to any one of claims 1 to 4, wherein the reducing agent is a hydroquinone compound represented by the following general formula (3).

(In general formula (3), R ₄ , R ₅ , R ₆ and R ₇ each independently represent hydrogen, a hydroxy group, or an organic group having 1 to 30 carbon atoms). The resin composition according to any one of claims 1 to 5, wherein the resin is polysiloxane having a styryl group. 7. The resin composition according to any one of claims 1 to 6, further comprising a liquid-repellent compound having a radically photopolymerizable group. A light-shielding film obtained by curing the resin composition according to any one of claims 1 to 7. A barrier rib-equipped substrate having (A-1) pattern-formed barrier ribs of the resin composition according to any one of claims 1 to 7 on a base substrate, the reflectance per 10 μm thickness at a wavelength of 450 nm. is 10% to 60%, and the OD value per 10 μm thickness at a wavelength of 450 nm is 1.5 to 5.0. (A-1) A substrate with barrier ribs having pattern-formed barrier ribs on a base substrate, wherein the pattern-formed barrier ribs are composed of a resin, a white pigment and/or a light-shielding pigment, silver oxide and/or silver A substrate with partition walls containing particles and a quinone compound. 10. The substrate with barrier ribs according to claim 9, wherein (A-1) the patterned barrier ribs contain a resin, a white pigment, and silver oxide and/or silver particles. The (A-1) patterned partition walls further contain a liquid-repellent compound, and (A-1) the content of the liquid-repellent compound in the patterned partition walls is 0.01% by weight to 10% by weight. The substrate with partition walls according to any one of claims 9 to 11. Between the base substrate and (A-1) patterned barrier ribs, (A-2) patterned light shielding barrier ribs having an OD value per 1.0 μm of thickness of 0.5 or more are further provided. The substrate with partition walls according to any one of claims 9 to 12. 14. The substrate with partition walls according to any one of claims 9 to 13, further comprising (A-1) pixel layers containing (B) color-converting luminescent materials arranged and separated by patterned partition walls. 15. The substrate with partition walls according to claim 14, wherein said color-converting luminescent material contains a phosphor selected from quantum dots and pyrromethene derivatives. 16. The substrate with partition walls according to claim 14 or 15, further comprising a color filter having a thickness of 1 to 5 μm between the base substrate and (B) the pixel layer containing the color-converting luminescent material. A display device comprising the substrate with partition walls according to any one of claims 9 to 16 and a light-emitting light source selected from a liquid crystal cell, an organic EL cell, a mini-LED cell and a micro-LED cell.

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