WO2021200357A1

WO2021200357A1 - Resin composition, light-shielding film, and substrate with partition wall

Info

Publication number: WO2021200357A1
Application number: PCT/JP2021/011831
Authority: WO
Inventors: 英祐飯塚; 諏訪　充史; 小林　秀行
Original assignee: 東レ株式会社
Priority date: 2020-03-30
Filing date: 2021-03-23
Publication date: 2021-10-07
Also published as: KR20220161259A; JPWO2021200357A1; CN115427514A; CN115427514B; JP7115635B2; TW202138459A

Abstract

Disclosed is a resin composition which is for forming a partition wall on a substrate of a display device, has excellent weather resistance, and is relatively inexpensive, and with which a partition wall having both high reflectivity for whole visible light and high light-shielding property for blue light can be formed. This resin composition contains a resin, a photopolymerization initiator or a quinone diazide compound, a white pigment, an organic silver compound, and a reducing agent. Examples of the reducing agent include a compound containing at least two phenolic hydroxyl groups in a molecule or a compound containing an enediol group.

Description

Resin composition, light-shielding film, and substrate with bulkhead

The present invention relates to a resin composition, a light-shielding film formed from the resin composition, and a substrate with a partition wall having a patterned partition wall.

In recent years, as a color display device having high light utilization efficiency, a color display device including a wavelength conversion unit composed of a wavelength conversion phosphor and a polarization separation means and a polarization conversion means has been proposed (see, for example, Patent Document 1). ). For example, a wavelength having a blue light source, a liquid crystal element, a phosphor excited by blue light to emit red fluorescence, a phosphor excited by blue light to emit green fluorescence, and a light scattering layer that scatters blue light. A color display device including a conversion unit has been proposed (see, for example, Patent Document 2).

However, a color filter containing a color conversion phosphor as described in

Patent Documents

1 and 2 has low light extraction efficiency and insufficient brightness because fluorescence is generated in all directions. In particular, in high-definition display devices such as 4K and 8K, since the pixel size becomes small, the problem of luminance becomes remarkable, so that higher luminance is required.

Japanese Unexamined Patent Publication No. 2000-131683 JP-A-2009-244383 Japanese Unexamined Patent Publication No. 2000-347394 Japanese Unexamined Patent Publication No. 2006-259421 WO2020 / 000869

Generally, in such a display device, the color conversion phosphor is separated by a partition wall to prevent color mixing of light between adjacent pixels. In particular, when the excitation light of the color conversion phosphor leaks to the adjacent pixels, it emits light in the adjacent pixels and causes color mixing. Therefore, in many cases, the light-shielding property of the blue light (wavelength 450 nm) of the partition wall is extremely important. Further, in order to improve the brightness of the display device, it is effective to separate the color conversion phosphors with a highly reflective partition wall. From the above, there is a demand for a partition material that has both high light blocking effect of blue light and high reflectivity of the entire visible light.

In order to form a partition wall that has both high light-shielding property of blue light and high reflectivity of visible light as a whole, the inventors first applied a white partition wall material using a titanium oxide white pigment that exhibits high reflectance. A method of using a material to which a yellow pigment, which is a complementary color of blue, was added was investigated. However, in this method, it has been clarified that the entire exposure light is absorbed by the white pigment and the yellow pigment, the light does not reach the bottom of the film at the time of exposure, and the pattern processability is poor.

Therefore, the inventors devised a design that transmits exposure light during the process of pattern exposure after film formation, heats the exposed film at a temperature of 120 ° C. or higher and 250 ° C. or lower, and then increases the light-shielding property. Further, a resin composition containing a resin, an organometallic compound containing at least one metal selected from the group consisting of silver, gold, platinum and palladium, a photopolymerization initiator or a quinonediazide compound, and a solvent is used. This was achieved (see Patent Document 5). In particular, it has been found that when an organic silver compound is used, the film turns yellow due to the formation of silver nanoparticles after heating, and the light-shielding property of blue light increases.

However, it has been newly clarified that this technology has a problem in weather resistance because when an unreacted organic silver compound remains in the film after heating, it is decomposed by light or heat and the film color changes. In addition, since it is necessary to use an expensive organic silver compound in a large amount (1% or more in the solid content), there is also a problem in cost. Further, in order to sufficiently increase the light-shielding property of the film, heating at 150 ° C. or higher is required, and this technique cannot be applied when heating conditions at a low temperature of about 100 to 120 ° C. are required. ..

Therefore, the present invention provides a resin composition which is excellent in weather resistance even under heating conditions of about 100 to 120 ° C. and can form a partition wall having both high light-shielding property of blue light and high reflectivity of visible light as a whole. The purpose is to provide it at a relatively low price.

As a result of diligent research, the inventors of the present application have made a weather resistant resin composition containing a resin, a photopolymerization initiator or a quinonediazide compound, a white pigment and / or a light-shielding pigment, an organic silver compound, and a reducing agent. We have found that it is possible to form a partition wall having both high reflectivity of the entire visible light and high light-shielding property of blue light, and arrived at the present invention.

That is, the present invention provides the following.
(1) A resin composition containing a resin, a photopolymerization initiator or a quinonediazide compound, a white pigment and / or a light-shielding pigment, an organic silver compound, and a reducing agent.
(2) The resin composition according to (1), wherein the reducing agent is a compound containing two or more phenolic hydroxyl groups in the molecule or a compound containing an enol group.
(3) The resin composition according to (1) or (2), wherein the organic silver compound is a compound represented by the following general formula (1).

(In the general formula (1), R ₁ represents hydrogen or an organic group having 1 to 30 carbon atoms.)
(4) The resin composition according to (1) or (2), wherein the organic silver compound is at least a polymer compound having a structure represented by the following general formula (2).

(In the general formula (2), R ² and R ³ independently represent hydrogen or an organic group having 1 to 30 carbon atoms).
The resin composition according to any one of (1) to (4), wherein the reducing agent is a hydroquinone compound represented by the following general formula (3).

(In the general formula (3), R ₄ , R ₅ , R ₆ and R ₇ independently represent hydrogen, a hydroxy group, or an organic group having 1 to 30 carbon atoms).
(6) The resin composition according to any one of (1) to (5), wherein the resin is a polysiloxane having a styryl group.
(7) The resin composition according to any one of (1) to (6), which further contains a liquid-repellent compound having a photoradical polymerizable group.
(8) A light-shielding film obtained by curing the resin composition according to any one of (1) to (7).
(9) A substrate with a partition wall having a partition wall in which the pattern (A-1) is formed by the resin composition according to any one of (1) to (7) on the base substrate, and the thickness at a wavelength of 450 nm. A substrate with a partition wall having a reflectance of 10% to 60% per 10 μm and an OD value of 1.5 to 5.0 per thickness of 10 μm at a wavelength of 450 nm.
(10) A substrate with a partition wall having (A-1) a pattern-formed partition wall on the base substrate, wherein the pattern-formed partition wall is a resin, a white pigment and / or a light-shielding pigment, silver oxide, and the like. / Or a substrate with a partition wall containing silver particles and a quinone compound.
(11) The substrate with a partition wall according to (9), wherein the partition wall formed with the pattern (A-1) contains a resin, a white pigment, silver oxide and / or silver particles.
(12) The (A-1) patterned partition wall further contains a liquid repellent compound, and the content of the liquid repellent compound in the (A-1) patterned partition wall is 0.01% by weight to 10% by weight. The substrate with a partition wall according to any one of (9) to (11), which is% by weight.
(13) A patterned light-shielding partition wall having an OD value of 0.5 or more per (A-2) thickness of 1.0 μm is provided between the base substrate and the (A-1) patterned partition wall. The substrate with a partition wall according to any one of (9) to (12), which is further possessed.
(14) The item according to any one of (9) to (13), further comprising a pixel layer containing the (B) color-converting light-emitting material arranged separated by the (A-1) pattern-formed partition wall. Substrate with partition wall.
(15) The substrate with a partition wall according to (14), wherein the color conversion light emitting material contains a phosphor selected from quantum dots and a pyrromethene derivative.
(16) The substrate with a partition wall according to (14) or (15), further comprising a color filter having a thickness of 1 to 5 μm between the base substrate and the pixel layer containing the (B) color conversion light emitting material.
(17) A display device having the substrate with a partition wall according to any one of (9) to (16) and a light emitting light source selected from a liquid crystal cell, an organic EL cell, a mini LED cell, and a micro LED cell.

The resin composition of the present invention allows exposure light to pass through during the step of pattern exposure after film formation, but when the exposed film is heated at a temperature of 100 ° C. or higher and 250 ° C. or lower, the organic silver compound is reduced in the film by a reducing agent. Because yellow particles are efficiently generated and the light-shielding property of blue light is improved, it is possible to form a fine thick film partition pattern that has excellent weather resistance and has both high reflectivity of visible light and high light-shielding property of blue light. It is possible.

It is sectional drawing which shows one aspect of the substrate with a partition wall of this invention which has a partition wall formed with a pattern. It is sectional drawing which shows one aspect of the substrate with a partition wall of this invention which has the partition wall which formed the pattern and the pixel which contains the color conversion light emitting material. It is sectional drawing which shows one aspect of the substrate with a partition wall of this invention which has a partition wall formed with a pattern, a color conversion light emitting material, and a light-shielding partition wall. It is sectional drawing which shows one aspect of the substrate with a partition wall of this invention which has a partition wall formed with a pattern, a color conversion light emitting material, and a color filter. It is sectional drawing which shows one aspect of the substrate with a partition wall of this invention which has a partition wall which formed a pattern, a color conversion light emitting material, a light-shielding partition wall, and a color filter. It is sectional drawing which shows one aspect of the substrate with a partition wall of this invention which has a partition wall formed with a pattern, a color conversion light emitting material, and a low refractive index layer. It is sectional drawing which shows one aspect of the substrate with the partition wall of this invention which has the partition wall which formed the pattern, the color conversion light emitting material, the low refractive index layer and the inorganic protective layer I. It is sectional drawing which shows one aspect of the substrate with the partition wall of this invention which has the partition wall which formed the pattern, the color conversion light emitting material, the low refractive index layer and the inorganic protective layer I. It is sectional drawing which shows one aspect of the substrate with a partition wall of this invention which has a partition | partition which formed a pattern, a color conversion light emitting material, a light-shielding partition wall, a color filter, a low refractive index layer, and an inorganic protective layer I. It is sectional drawing which shows one aspect of the substrate with a partition wall of this invention which has the partition wall which formed the pattern, the color conversion light emitting material, the low refractive index layer and the inorganic protective layer II. FIG. 5 is a cross-sectional view showing an aspect of a substrate with a partition wall of the present invention having a patterned partition wall, a color conversion light emitting material, a color filter, and an inorganic protective layer III and / or a yellow organic protective layer. FIG. 5 is a cross-sectional view showing an aspect of a substrate with a partition wall of the present invention having a patterned partition wall, a color conversion light emitting material, an inorganic protective layer IV and / or a yellow organic protective layer. FIG. 5 is a cross-sectional view showing an aspect of a substrate with a partition wall of the present invention, which has pixels containing a pattern-formed partition wall and a light emitting light source selected from an organic EL cell, a mini LED cell, and a micro LED cell. FIG. 6 is a cross-sectional view showing an aspect of a substrate with a partition wall of the present invention having pixels containing a patterned partition wall, a color conversion light emitting material, and a light emitting light source selected from an organic EL cell, a mini LED cell, and a micro LED cell. be. It is sectional drawing which shows the structure of the display device used for the color mixing evaluation in an Example.

Hereinafter, preferred embodiments of the resin composition according to the present invention, the light-shielding film formed from the resin composition, and the substrate with a partition wall will be specifically described, but the present invention is limited to the following embodiments. It is not a thing, and it can be changed and implemented in various ways according to the purpose and application.

The resin composition of the present invention can be suitably used as a material for forming a partition wall that separates a color conversion phosphor, a light emitting light source selected from an organic EL cell, a mini LED cell, a micro LED cell, and the like. The resin composition of the present invention contains a resin, a photopolymerization initiator or a quinonediazide compound, a white pigment and / or a light-shielding pigment, an organic silver compound, and a reducing agent.

The resin has a function of improving the crack resistance and light resistance of the partition wall. The content of the resin in the solid content of the resin composition is preferably 10% by weight or more, more preferably 20% by weight or more, from the viewpoint of improving the crack resistance of the partition wall in the heat treatment. On the other hand, from the viewpoint of improving the light resistance, the content of the resin in the solid content of the resin composition is preferably 60% by weight or less, more preferably 50% by weight or less. Here, the solid content means all the components contained in the resin composition excluding volatile components such as a solvent. The amount of solid content can be determined by heating the resin composition and measuring the residue obtained by evaporating the volatile components.

Examples of the resin include polysiloxane, polyimide, polyimide precursor, polybenzoxazole, polybenzoxazole precursor, (meth) acrylic polymer and the like. Here, the (meth) acrylic polymer means a polymer of a methacrylic acid ester and / or an acrylic acid ester. Two or more of these may be contained. Among these, polysiloxane is preferable because it is excellent in heat resistance and light resistance.

Polysiloxane is a hydrolyzed / dehydrated condensate of organosilane. When the resin composition of the present invention has negative photosensitive properties, the polysiloxane preferably contains at least a repeating unit represented by the following general formula (4). Further, other repeating units may be included. By containing the repeating unit derived from the bifunctional alkoxysilane compound represented by the general formula (4), excessive thermal polymerization (condensation) of polysiloxane due to heating can be suppressed, and crack resistance of the partition wall can be improved. It is preferable that 10 to 80 mol% of the repeating unit represented by the general formula (4) is contained in all the repeating units in the polysiloxane. By containing 10 mol% or more of the repeating unit represented by the general formula (4), the crack resistance can be further improved. The content of the repeating unit represented by the general formula (4) is more preferably 15 mol% or more, further preferably 20 mol% or more. On the other hand, by containing 80 mol% or less of the repeating unit represented by the general formula (4), the molecular weight of the polysiloxane at the time of polymerization can be sufficiently increased and the coatability can be improved. The content of the repeating unit represented by the general formula (4) is more preferably 70 mol% or less.

In the above general formula (4), R ⁸ and R ⁹ may be the same or different, respectively, and represent a monovalent organic group having 1 to 20 carbon atoms. R ⁸ and R ⁹ are preferably groups selected from an alkyl group having 1 to 6 carbon atoms and an aryl group having 6 to 12 carbon atoms from the viewpoint of facilitating the adjustment of the molecular weight of the polysiloxane during polymerization. However, at least a part of hydrogen of the alkyl group and the aryl group may be substituted with a radically polymerizable group. In this case, the radically polymerizable group may be radically polymerized in the cured product of the negative photosensitive resin composition.

The polysiloxane further preferably contains a repeating unit represented by the following general formula (5). By including the repeating unit derived from the trifunctional alkoxysilane compound represented by the general formula (5), the crosslink density of the polysiloxane is increased after the film formation, and the hardness and chemical resistance of the film can be improved. It is preferable that 10 to 80 mol% of the repeating unit represented by the general formula (5) is contained in all the repeating units in the polysiloxane. The content of the repeating unit represented by the general formula (5) is more preferably 15 mol% or more, further preferably 20 mol% or more. On the other hand, by containing 80 mol% or less of the repeating unit represented by the general formula (5), excessive thermal polymerization (condensation) of polysiloxane due to heating can be suppressed, and crack resistance of the partition wall can be improved. The content of the repeating unit represented by the general formula (5) is more preferably 70 mol% or less.

In the above general formula (5), R ¹⁰ represents a monovalent organic group having 1 to 20 carbon atoms. R ¹⁰ is preferably a group selected from an alkyl group having 1 to 6 carbon atoms and an aryl group having 6 to 12 carbon atoms from the viewpoint of facilitating the adjustment of the molecular weight of the polysiloxane during polymerization. However, at least a part of hydrogen of the alkyl group and the aryl group may be substituted with a radically polymerizable group. In this case, the radically polymerizable group may be radically polymerized in the cured product of the negative photosensitive resin composition. Further, in the polysiloxane, a repeating unit represented by formula (5) with different R ¹⁰ may contain two or more types. In the general formula (5), ^{it is preferable that R 10} contains a repeating unit containing a styryl group. By containing a repeating unit derived from a trifunctional alkoxysilane compound containing a styryl group, the crosslink density of polysiloxane is increased after film formation even under low temperature heating conditions of about 100 to 120 ° C, and the hardness and chemical resistance of the film are increased. Can be improved.

The repeating units represented by the general formulas (4) and (5) are derived from the alkoxysilane compounds represented by the following general formulas (6) and (7), respectively. That is, the polysiloxane containing the repeating unit represented by the general formulas (4) and (5) hydrolyzes the alkoxysilane compound containing the alkoxysilane compound represented by the following general formulas (6) and (7). It can be obtained by polycondensation. Further other alkoxysilane compounds may be used. In the general formulas (6) and (7), the ^{notations "-(OR 11} ) ₂ " and "-(OR ¹¹ ) ₃ " have two "-(OR ¹¹ )" in the Si atom and 3 respectively. It means that they are individually combined.

In the general formula (6) and ^{^{(7), R 8 ~ R}} 10 are in each formula (4) and (5) ^represent the same groups as ^R 8 ^~ R ^10. R ¹¹ may be the same or different, represents a monovalent organic group having 1 to 20 carbon atoms, and an alkyl group having 1 to 6 carbon atoms is preferable.

Examples of the alkoxysilane compound represented by the general formula (6) include dimethyldimethoxysilane, dimethyldiethoxysilane, ethylmethyldimethoxysilane, ethylmethyldiethoxysilane, methylpropyldimethoxysilane, methylpropyldiethoxysilane, and diphenyldimethoxy. Silane, diphenyldiethoxysilane, styrylmethyldimethoxysilane, styrylmethyldiethoxysilane, γ-methacryloylpropylmethyldimethoxysilane, γ-methacryloylpropylmethyldiethoxysilane, γ-acryloylpropylmethyldimethoxysilane, γ-acryloylpropylmethyldiethoxy Silane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 2- (3,4-epylcyclohexyl) ethylmethyldimethoxysilane, 2- (3,4-epoxycyclohexyl) ethylethyl Dimethoxysilane, methylphenyldimethoxysilane, methylphenyldiethoxysilane, 3-dimethylmethoxysilylpropyl succinic acid anhydride, 3-dimethylethoxysilylpropyl succinic acid anhydride, 3-dimethylmethoxysilylpropionic acid, 3-dimethylethoxysilylpropion Acid, 3-dimethylmethoxysilylpropylcyclohexyldicarboxylic acid anhydride, 3-dimethylethoxysilylpropylcyclohexyldicarboxylic acid anhydride, bis (trifluoromethyl) dimethoxysilane, bis (trifluoropropyl) dimethoxysilane, bis (trifluoropropyl) Examples thereof include diethoxysilane, trifluoropropylmethyldimethoxysilane, trifluoropropylmethyldiethoxysilane, trifluoropropylethyldimethoxysilane, trifluoropropylethyldiethoxysilane, and heptadecafluorodecylmethyldimethoxysilane. Two or more of these may be used.

Examples of the alkoxysilane compound represented by the general formula (7) include methyltrimethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, propyltrimethoxysilane, propyltriethoxysilane, and isobutyltrimethoxy. Silane, Isobutyltriethoxysilane, Cyclohexyltrimethoxysilane, Cyclohexyltriethoxysilane, 3-Ixocyanopropyltrimethoxysilane, 3-Ixoxidepropyltriethoxysilane, 3-Aminopropyltrimethoxysilane, 3-Aminopropyltriethoxysilane, 3 -Trifunctional alkoxysilane compounds such as ureidopropyltrimethoxysilane and 3-ureidopropyltriethoxysilane; 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 2- (3,4-epoxy) Cyclohexyl) ethyltrimethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltriethoxysilane, 3-ethyl-3-{[3- (trimethoxysilyl) propoxy] methyl} oxetane, 3-ethyl-3-{ [3- (Triethoxysilyl) propoxy] methyl} An epoxy group such as oxetane or an alkoxysilane compound containing an oxetane group: phenyltrimethoxysilane, phenyltriethoxysilane, 1-naphthyltrimethoxysilane, 2-naphthyltrimethoxysilane, 2 -Nufftilt dimethoxysilane, 2-naphthyltrimethoxysilane, triltrimethoxysilane, triltriethoxysilane, 1-phenylethyltrimethoxysilane, 1-phenylethyltriethoxysilane, 2-phenylethyltrimethoxysilane, 2-phenyl Arocyclic ring-containing alkoxysilane compounds such as ethyltriethoxysilane, 3-trimethoxysilylpropylphthalic anhydride, 3-triethoxysilylpropylphthalic anhydride; styryltrimethoxysilane, styryltriethoxysilane, vinyltrimethoxysilane, Radical polymerization of vinyl triethoxysilane, allyltrimethoxysilane, allyltriethoxysilane, γ-acryloylpropyltrimethoxysilane, γ-acryloylpropyltriethoxysilane, γ-methacryloylpropyltrimethoxysilane, γ-methacryloylpropyltriethoxysilane, etc. Sex group-containing alkoxysilane compound; 3-trimethoxysilylpropi Onic acid, 3-triethoxysilylpropionic acid, 4-trimethoxysilylbutyric acid, 4-triethoxysilylbutyric acid, 5-trimethoxysilylvaleric acid, 5-triethoxysilylvaleric acid, 3-trimethoxysilylpropyl succinic acid anhydride Compound, 3-Triethoxysilylpropyl succinic acid anhydride, 3-trimethoxysilylpropylcyclohexyldicarboxylic acid anhydride, 3-triethoxysilylpropylcyclohexyldicarboxylic acid anhydride, 3-trimethoxysilylpropylphthalic acid anhydride, 3 -Carboxyl group-containing alkoxysilane compounds such as triethoxysilylpropylphthalic anhydride; trifluoropropyltrimethoxysilane, trifluoropropyltriethoxysilane, perfluoropentyltriethoxysilane, perfluoropentyltriethoxysilane, tridecafluorooctyl Fluorine group-containing alkoxy such as trimethoxysilane, tridecafluorooctyl trimethoxysilane, tridecafluorooctyl repropoxysilane, tridecafluorooctyl triisopropoxysilane, heptadecafluorodecyltrimethoxysilane, heptadecafluorodecyltriethoxysilane Examples include silane compounds. Two or more of these may be used.

When the resin composition of the present invention has negative photosensitive property, it contains at least one radical polymerizable group-containing alkoxysilane compound as the alkoxysilane compound represented by the general formulas (6) and / or (7). Is preferable. By containing the radically polymerizable group-containing alkoxysilane compound, the cross-linking reaction proceeds with the radicals generated in the exposed portion, and the degree of curing of the exposed portion can be increased. When the resin composition of the present invention has negative photosensitive property, it contains at least one carboxyl group-containing alkoxysilane compound as the alkoxysilane compound represented by the general formulas (6) and / or (7). Is preferable. By containing the carboxyl group-containing alkoxysilane compound, the solubility of the unexposed portion can be improved, and the resolution can be improved during pattern processing.

Examples of other alkoxysilane compounds include tetrafunctional alkoxysilane compounds such as tetramethoxysilane, tetraethoxysilane, and silicate 51 (tetraethoxysilane oligomer); monofunctional alkoxysilane compounds such as trimethylmethoxysilane and triphenylmethoxysilane. Can be mentioned. Two or more of these may be used.

The content of the alkoxysilane compound represented by the general formula (6) in the alkoxysilane compound which is the raw material of the polysiloxane is the content of the repeating unit represented by the general formula (4) in all the repeating units of the polysiloxane. From the viewpoint of keeping the amount in the above range, 10 mol% or more is preferable, 15 mol% or more is more preferable, and 20 mol% or more is further preferable. On the other hand, the content of the alkoxysilane compound represented by the general formula (7) is preferably 80 mol% or less, more preferably 70 mol% or less, from the same viewpoint.

The weight average molecular weight (Mw) of the polysiloxane is preferably 1,000 or more, more preferably 2,000 or more, from the viewpoint of coatability. On the other hand, from the viewpoint of developability, the Mw of the polysiloxane is preferably 500,000 or less, more preferably 300,000 or less. Here, the Mw of the polysiloxane in the present invention refers to a polystyrene-equivalent value measured by gel permeation chromatography (GPC). The measuring method is as described in Examples described later.

Polysiloxane can be obtained by hydrolyzing the above-mentioned organosilane compound and then dehydrating and condensing the hydrolyzate in the presence of a solvent or in the absence of a solvent.

Various conditions for hydrolysis can be set according to the physical characteristics suitable for the intended use, taking into consideration the reaction scale, the size and shape of the reaction vessel, and the like. Examples of various conditions include acid concentration, reaction temperature, reaction time, and the like.

For the hydrolysis reaction, acid catalysts such as hydrochloric acid, acetic acid, formic acid, nitrate, oxalic acid, hydrochloric acid, sulfuric acid, phosphoric acid, polyphosphoric acid, polyvalent carboxylic acid and its anhydride, and ion exchange resin can be used. Among these, an acidic aqueous solution containing an acid selected from formic acid, acetic acid and phosphoric acid is preferable.

When an acid catalyst is used in the hydrolysis reaction, the amount of the acid catalyst added is 0.05% by weight with respect to 100 parts by weight of the total alkoxysilane compound used in the hydrolysis reaction from the viewpoint of allowing the hydrolysis to proceed more rapidly. More than parts are preferable, and 0.1 parts by weight or more is more preferable. On the other hand, from the viewpoint of appropriately adjusting the progress of the hydrolysis reaction, the amount of the acid catalyst added is preferably 20 parts by weight or less, more preferably 10 parts by weight or less, based on 100 parts by weight of the total alkoxysilane compound. Here, the total amount of the alkoxysilane compound means an amount including all of the alkoxysilane compound, its hydrolyzate and its condensate. The same shall apply hereinafter.

The hydrolysis reaction can be carried out in a solvent. The solvent can be appropriately selected in consideration of the stability, wettability, volatility and the like of the resin composition.

When a solvent is generated by the hydrolysis reaction, it is also possible to carry out the hydrolysis without a solvent. When used in a resin composition, it is also preferable to adjust the resin composition to an appropriate concentration by further adding a solvent after the completion of the hydrolysis reaction. It is also possible to distill and remove all or part of the produced alcohol or the like by heating and / or under reduced pressure after hydrolysis, and then add a suitable solvent.

Examples of the dehydration condensation reaction method include a method of heating a silanol compound solution obtained by a hydrolysis reaction of an organosilane compound as it is. The heating temperature is preferably 50 ° C. or higher and lower than the boiling point of the solvent, and the heating time is preferably 1 to 100 hours. Further, in order to increase the degree of polymerization of the polysiloxane, reheating or addition of a base catalyst may be performed. Further, depending on the purpose, after the dehydration condensation reaction, an appropriate amount of the produced alcohol or the like may be distilled off and removed under heating and / or reduced pressure, and then a suitable solvent may be added.

When the resin composition of the present invention is used for pattern formation of the partition wall (A-1) described later, it preferably has negative or positive photosensitivity. When negative photosensitivity is imparted, it is preferable to contain a photopolymerization initiator, and a partition wall having a high-definition pattern shape can be formed. The negative photosensitive resin composition preferably further contains a photopolymerizable compound. On the other hand, when imparting positive photosensitivity, it is preferable to contain a quinonediazide compound.

The photopolymerization initiator may be any one as long as it decomposes and / or reacts with light (including ultraviolet rays and electron beams) to generate radicals. For example, 2-methyl- [4- (methylthio) phenyl] -2-morpholinopropane-1-one, 2-dimethylamino-2- (4-methylbenzyl) -1- (4-morpholin-4-yl) Α-Aminoalkylphenone compounds such as -phenyl) -butane-1-one, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1; 2,4,6-trimethylbenzoylphenyl Acylphosphine oxide compounds such as phosphine oxide, bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide, bis (2,6-dimethoxybenzoyl)-(2,4,4-trimethylpentyl) -phosphine oxide 1-Phenyl-1,2-propanedione-2- (O-ethoxycarbonyl) oxime, 1,2-octanedione-1- [4- (phenylthio) -2- (O-benzoyloxime)], 1- Phenyl-1,2-butadion-2- (O-methoxycarbonyl) oxime, 1,3-diphenylpropanthrion-2- (O-ethoxycarbonyl) oxime, etanone-1- [9-ethyl-6- (2-) Oxim ester compounds such as methylbenzoyl) -9H-carbazole-3-yl] -1- (O-acetyloxime); 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1- (4-isopropyl) Α-Hydroxyketones such as phenyl) -2-hydroxy-2-methylpropan-1-one, 4- (2-hydroxyethoxy) phenyl- (2-hydroxy-2-propyl) ketone, 1-hydroxycyclohexyl-phenylketone Compounds: Acetphenone compounds such as 2,2-diethoxyacetophenone, 2,3-diethoxyacetophenone, 4-t-butyldichloroacetophenone, benzalacetophenone, 4-azidobenzalacetophenone and the like can be mentioned. Two or more of these may be contained.

The content of the photopolymerization initiator in the resin composition of the present invention is preferably 0.01% by weight or more, more preferably 1% by weight or more, based on the solid content, from the viewpoint of effectively advancing radical curing. On the other hand, from the viewpoint of suppressing elution of the residual photopolymerization initiator, the content of the photopolymerization initiator is preferably 20% by weight or less, more preferably 10% by weight or less in the solid content.

The photopolymerizable compound in the present invention refers to a compound having two or more ethylenically unsaturated double bonds in the molecule. Considering the ease of radical polymerization, the photopolymerizable compound preferably has a (meth) acrylic group.

Examples of the photopolymerizable compound include diethylene glycol diacrylate, triethylene glycol diacrylate, tetraethylene glycol diacrylate, diethylene glycol dimethacrylate, triethylene glycol dimethacrylate, tetraethylene glycol dimethacrylate, trimethylolpropane diacrylate, and trimethylolpropane. Triacrylate, Trimethylol Propane Dimethacrylate, Trimethylol Propane Trimethacrylate, 1,3-Butanediol Diacrylate, 1,3-Butanediol Dimethacrylate, Neopentyl glycol Diacrylate, 1,4-Butanediol Diacrylate, 1, 4-Butanediol dimethacrylate, 1,6-hexanediol diacrylate, 1,9-nonanediol dimethacrylate, 1,10-decanediol dimethacrylate, dimethylol-tricyclodecanediacrylate, pentaerythritol triacrylate, pentaerythritol tetra Acrylate, pentaerythritol trimethacrylate, pentaerythritol tetramethacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, tripentaerythritol heptaacrylate, tripentaerythritol octaacrylate, tetrapentaerythritol nonaacrylate, tetrapentaerythritol decaacrylate, pentapenta Erislithol undecaacrylate, pentapentaerythritol decaacrylate, tripentaerythritol heptamethacrylate, tripentaerythritol octamethacrylate, tetrapentaerythritol nonamethacrylate, tetrapentaerythritol decamethacrylate, pentapentaerythritol undecamethacrylate, pentapentaerythritol dodecamethacrylate, dimethyrole- Examples thereof include tricyclodecanediacrylate. Two or more of these may be contained.

The content of the photopolymerizable compound in the resin composition of the present invention is preferably 1% by weight or more in the solid content from the viewpoint of effectively advancing radical curing. On the other hand, from the viewpoint of suppressing the excessive reaction of radicals and improving the resolution, the content of the photopolymerizable compound is preferably 50% by weight or less in the solid content.

As the quinone diazide compound, a compound in which a sulfonic acid of naphthoquinone diazide is bonded to a compound having a phenolic hydroxyl group with an ester is preferable. Examples of the compound having a phenolic hydroxyl group used here include BIs-Z, TekP-4HBPA (Tetrakiss P-DO-BPA), TrisP-HAP, TrisP-PA, BIsRS-2P, and BIsRS-3P (these are products). Name, manufactured by Honshu Chemical Industry Co., Ltd., BIR-PC, BIR-PTBP, BIR-BIPC-F (above, trade name, manufactured by Asahi Organic Materials Industry Co., Ltd.), 4,4'-sulfonyldiphenol, BPFL (Product name, manufactured by JFE Chemical Co., Ltd.) and the like. As the quinone diazide compound, a compound in which 4-naphthoquinone diazido sulfonic acid or 5-naphthoquinone diazido sulfonic acid is introduced into these compounds having a phenolic hydroxyl group by an ester bond is preferable, and for example, THP-17 and TDF-517 (trade name, trade name, TDF-517) are preferable. Examples thereof include Toyo Synthetic Industry Co., Ltd.) and SBF-525 (trade name, manufactured by AZ Electronic Materials Co., Ltd.).

The content of the quinonediazide compound in the resin composition of the present invention is preferably 0.5% by weight or more, more preferably 1% by weight or more, based on the solid content, from the viewpoint of improving the sensitivity. On the other hand, the content of the quinone diazide compound is preferably 25% by weight or less, more preferably 20% by weight or less, based on the solid content, from the viewpoint of improving the resolution.

The resin composition of the present invention preferably further contains a white pigment and / or a light-shielding pigment. The white pigment has a function of further improving the reflectance of the partition wall. The light-shielding pigment has a function of further improving the light-shielding property of light of a specific wavelength of the partition wall.

When the resin composition contains only the white pigment as the pigment and when the white pigment and the light-shielding pigment are contained at the same time, a partition wall having both high reflectivity and high light-shielding property can be obtained. On the other hand, when the resin composition contains only a light-shielding pigment as the pigment, a partition wall having a high light-shielding property for a specific wavelength can be obtained.

Examples of the white pigment include titanium dioxide, zirconium oxide, zinc oxide, barium sulfate, and a composite compound thereof. Two or more of these may be contained. Among these, titanium dioxide having high reflectance and easy industrial use is preferable.

The crystal structure of titanium dioxide is classified into anatase type, rutile type and brookite type. Among these, rutile-type titanium oxide is preferable because it has low photocatalytic activity.

The white pigment may be surface-treated. Surface treatment with a metal selected from Al, Si and Zr is preferable, and the light resistance and heat resistance of the formed partition wall can be improved.

The average primary particle size of the white pigment is preferably 100 to 500 nm, more preferably 150 nm to 350 nm, from the viewpoint of further improving the reflectance of the partition wall. Here, the average primary particle size of the white pigment can be measured by a laser diffraction method using a particle size distribution measuring device (N4-PLUS; manufactured by Beckman Coulter Co., Ltd.) or the like.

The preferred titanium dioxide pigment for use as a white pigment, for example, R960; Dupont Co. (rutile _type, SiO 2 / _Al 2 _{O 3} process, the average primary particle size 210 nm), CR-97; manufactured by Ishihara Sangyo Kaisha, Ltd. Made by (rutile type, Al ₂ O ₃ / ZrO ₂ treatment, average primary particle diameter 250 nm), JR-301; manufactured by Teika Co., Ltd. (rutile type, Al ₂ O ₃ treatment, average primary particle diameter 300 nm), JR-405 Made by Teika Co., Ltd. (rutile type, Al ₂ O ₃ treatment, average primary particle diameter 210 nm), JR-600A; Teika Co., Ltd. (rutile type, Al ₂ O ₃ treatment, average primary particle diameter 250 nm), JR- 603; Takeka Co., Ltd. (rutile type, Al ₂ O ₃ / ZrO ₂ treatment, average primary particle size 280 nm) and the like can be mentioned. Two or more of these may be contained.

The content of the white pigment in the resin composition is preferably 10% by weight or more, more preferably 15% by weight or more in the solid content from the viewpoint of further improving the reflectance. On the other hand, from the viewpoint of improving the surface smoothness of the partition wall, the content of the white pigment is preferably 60% by weight or less, more preferably 55% by weight or less in the solid content.

The light-shielding pigment may be any light-shielding pigment as long as it improves the light-shielding property of wavelength light, and examples thereof include red pigments, blue pigments, black pigments, green pigments, and yellow pigments.

Examples of the red pigment include Pigment Red (hereinafter abbreviated as PR) 9, PR177, PR179, PR180, PR192, PR209, PR215, PR216, PR217, PR220, PR223, PR224, PR226, PR227, PR228, PR240, PR254 and the like. Can be mentioned. Two or more of these may be contained.

Examples of the blue pigment include Pigment Blue (hereinafter abbreviated as PB) 15, PB15: 3, PB15: 4, PB15: 6, and the like. Two or more of these may be contained.

Examples of black pigments include black organic pigments, mixed color organic pigments, and black inorganic pigments.

Examples of black organic pigments include carbon black, perylene black, aniline black, and benzofuranone pigments. These may be coated with a resin.

Examples of the mixed color organic pigment include those obtained by mixing two or more kinds of pigments selected from red, blue, green, purple, yellow, magenta, cyan and the like to make them pseudo-black. Among these, a mixed pigment of a red pigment and a blue pigment is preferable from the viewpoint of achieving both a moderately high OD value and pattern processability. The weight ratio of the red pigment to the blue pigment in the mixed pigment is preferably 20/80 to 80/20, more preferably 30/70 to 70/30.

Examples of the black inorganic pigment include graphite; fine particles of metals such as titanium, copper, iron, manganese, cobalt, chromium, nickel, zirconium, zinc, calcium, silver, gold, platinum, and palladium; metal oxides; metal composite oxidation. Materials; metal sulfides; metal nitrides; metal oxynitrides; metal carbides and the like. Two or more of these may be contained.

Examples of the green pigment include C.I. I. Pigment green (hereinafter abbreviated as PG) 7, PG36, PG58, PG37, PG59 and the like. Two or more of these may be contained.

Examples of the yellow pigment include Pigment Yellow (hereinafter abbreviated as PY) PY137, PY138, PY139, PY147, PY148, PY150, PY153, PY154, PY166, PY168, PY185 and the like. Two or more of these may be contained.

The content of the light-shielding pigment in the solid content of the resin composition is preferably 0.005% by weight or more, preferably 0.05% by weight or more, from the viewpoint of improving the light-shielding property of light having a specific wavelength. More preferred. On the other hand, from the viewpoint of pattern processability, 30% by weight or less is preferable, and 15% by weight or less is more preferable. The average primary particle size of the light-shielding pigment is preferably 1 to 300 nm, more preferably 2 nm to 50 nm, from the viewpoint of achieving both light-shielding properties and pattern processability of the partition wall. Here, the average primary particle size of the light-shielding pigment can be measured by a laser diffraction method using a particle size distribution measuring device (N4-PLUS; manufactured by Beckman Coulter, Inc.) or the like.

The resin composition of the present invention preferably further contains an organic silver compound. The organic silver compound decomposes and aggregates in the exposure step and / or the heating step to generate yellow particles such as silver nanoparticles, and can improve the light-shielding property of the film. The organic silver compound may be any compound that generates yellow particles in the exposure step and / or the heating step. Examples of conventionally known organic silver compounds include paragraphs "0048" to "0049" of JP-A-10-62899, and pages 24 to 24 of the European Patent Application Publication No. 803,764A1. Page 19, line 37, European Patent Application Publication No. 962, 812A1, Japanese Patent Application Laid-Open No. 11-349591, Japanese Patent Application Laid-Open No. 2000-7683, 2000-72711, 2002-23301, 2002 -23303, 2002-49119, 196446, European Patent Application Publication No. 1246001A1, European Patent Application Publication No. 1258775A1, Japanese Patent Application Laid-Open No. 2003-140290, Japanese Patent Application Laid-Open No. 2003-195445 Organic silver compounds and aliphatic compounds described in Japanese Patent Application Laid-Open No. 2003-295378, 2003-295379, 2003-295380, 2003-295381, 2003-270755, etc. Examples include silver salts of carboxylic acids.

Among these, from the viewpoint of yellowing, it is preferable to have a compound represented by the following general formula (1) and / or a polymer compound having a structure represented by the following general formula (2).

In the general formula (1), R ₁ represents hydrogen or an organic group having 1 to 30 carbon atoms. Here, the "organic group having 1 to 30 carbon atoms" includes an alkyl group having 1 to 30 carbon atoms (including a linear and branched alkyl group) and / or an aromatic hydrocarbon having 6 to 30 carbon atoms. A hydrogen group is preferred. Preferred specific examples of these are methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, n-pentyl group, isopentyl group, n-hexyl group, isohexyl group, n-heptyl group, Isoheptyl group, n-octyl group, isooctyl group, n-nonyl group, isononyl group, decyl group, undecyl group, dodecyl group, tridecyl group, tetradecyl group, pentadecyl group, hexadecyl group, heptadecyl group, octadecyl group, nonadecil group, eicosyl Examples include groups, phenyl groups, benzyl groups, tolyl groups, biphenyl groups and naphthyl groups.

In the general formula (2), R ² and R ³ independently represent hydrogen or an organic group having 1 to 30 carbon atoms, respectively. Here, the "organic group having 1 to 30 carbon atoms" includes an alkyl group having 1 to 30 carbon atoms (including a linear and branched alkyl group) and / or an aromatic hydrocarbon having 6 to 30 carbon atoms. A hydrogen group is preferred. Preferred specific examples of these are methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, n-pentyl group, isopentyl group, n-hexyl group, isohexyl group, n-heptyl group, Isoheptyl group, n-octyl group, isooctyl group, n-nonyl group, isononyl group, decyl group, undecyl group, dodecyl group, tridecyl group, tetradecyl group, pentadecyl group, hexadecyl group, heptadecyl group, octadecyl group, nonadecil group, eicosyl Examples include groups, phenyl groups, benzyl groups, tolyl groups, biphenyl groups and naphthyl groups. Further, a is an integer of 1 or more, preferably 1 to 10000, and more preferably 5 to 1000.

Examples of the organic silver compound represented by the general formula (1) include silver acetate, silver propionate, silver butyrate, silver valerate, silver hexanoate, silver enanthate, silver octylate, silver pelargonate, and silver caproate. , Silver neodecanoate, silver salicylate, silver carbonate, silver paratoluenesulfonate, silver trifluoroacetate, silver 2-ethylhexanoate, silver diethyldithiocarbamate, silver benzoate, silver pyridine-2-carboxylate, silver behenate, Examples thereof include silver arachidate, silver stearate, silver oleate, silver laurate, silver caproate, silver myristate, and silver palmitate. Two or more of these may be contained. Of these, silver neodecanoate, silver octylate, and silver salicylate are preferable from the viewpoint of solubility in an organic solvent and yellowing.

The organic silver compound represented by the general formula (2) has a structure in which the carboxyl group in the (meth) acrylic polymer having a carboxyl group is a silver salt. The organic silver compound represented by the general formula (2) can be obtained, for example, by stirring a (meth) acrylic polymer having a carboxyl group and silver nitrate in an organic solvent in the presence of an amine catalyst as in the preparation examples described later. Be done.

The (meth) acrylic polymer having a carboxyl group is obtained by polymerizing an unsaturated carboxylic acid. Examples of unsaturated carboxylic acids include acrylic acid, methacrylic acid, itaconic acid, crotonic acid, maleic acid, fumaric acid, vinyl acetic acid, acid anhydrides and the like. These may be used alone or in combination with other copolymerizable ethylenically unsaturated compounds. Specific examples of the copolymerizable ethylenically unsaturated compound include methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, n-propyl acrylate, isopropyl acrylate, n-propyl methacrylate, and methacrylic acid. Isopropyl, n-butyl acrylate, n-butyl methacrylate, sec-butyl acrylate, sec-butyl methacrylate, iso-butyl acrylate, iso-butyl methacrylate, tert-butyl acrylate, tert-butyl methacrylate, Unsaturated carboxylic acid alkyl esters such as n-pentyl acrylate, n-pentyl methacrylate, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, benzyl acrylate, benzyl methacrylate, styrene, p-methylstyrene, o-methylstyrene, Aromatic vinyl compounds such as m-methylstyrene and α-methylstyrene, unsaturated carboxylic acid aminoalkyl esters such as aminoethyl acrylate, unsaturated carboxylic acid glycidyl esters such as glycidyl acrylate and glycidyl methacrylate, vinyl acetate, vinyl propionate, etc. Butyl vinyl ester, acrylonitrile, methacrylonitrile, vinyl cyanide compounds such as α-chloroacrylonitrile, aliphatic conjugated diene such as 1,3-butadiene and isoprene, polystyrene having an acryloyl group or a methacryloyl group at the ends, respectively. Examples thereof include, but are not limited to, polymethylacrylate, polymethylmethacrylate, polybutylacrylate, polybutylmethacrylate, and macromonomas such as polysilicone. The (meth) acrylic polymer is not particularly limited.

As the (meth) acrylic polymer having a carboxyl group, a commercially available product may be used. Examples of commercially available (meth) acrylic polymers having a carboxyl group include AX3-BX-TR-101, AX3-BX-TR-102, AX3-BX-TR-106, AX3-BX-TR-107, and AX3-. BX-TR-108, AX3-BX-TR-109, AX3-BX-TR-110, AX3-RD-TR-501, AX3-RD-TR-502, AX3-RD-TR-503, AX3-RD- TR-504, AX3-RD-TR-103, AX3-RD-TR-104 (trade name, manufactured by Nippon Catalyst Co., Ltd.), SPCR-10X, SPCR-10P, SPCR-24X, SPCR-18X, SPCR-215X ( Product name, Showa Denko Co., Ltd.), X-4007 (Product name, manufactured by Nichiyu Co., Ltd.) and the like. Among these, SPCR-10X, SPCR-10P, SPCR-24X, SPCR-18X, and SPCR-215X are preferable. Two or more of these may be used.

The weight average molecular weight (Mw) of the polymer compound represented by the general formula (2) is not particularly limited, but is preferably 5000 to 50,000, more preferably 8000 to 35000 in terms of polystyrene measured by GPC. .. If Mw is less than 5000, pattern dripping occurs during thermosetting and the resolution is lowered. On the other hand, when Mw is larger than 50,000, silver is less likely to be reduced and yellow particles are less likely to be formed.

The content of the organic silver compound in the solid content of the resin composition is preferably 0.1% by weight or more, more preferably 0.4% by weight or more. By setting the content of the organic silver compound to 0.4% by weight or more, the obtained partition wall can be further yellowed, and the light blocking property of the blue light of the partition wall is improved. On the other hand, if the content of the organic silver compound is too large, an excessive reaction is caused by radicals partially generated by the decomposition of the organic silver compound, which makes pattern formation difficult. Further, since the organic silver compound is expensive, if the content is too large, the cost of the resin composition becomes high. Therefore, the content of the organic silver compound in the solid content of the resin composition is preferably 10% by weight or less, more preferably 5.0% by weight or less.

The resin composition of the present invention preferably further contains a reducing agent. The reducing agent promotes the reduction of the organic silver compound to more efficiently generate yellow particles, and can improve the light-shielding property of the film even under low-temperature heating conditions of about 100 to 120 ° C. This makes it possible to apply this technology even in applications where, for example, a material having a concern about heat resistance such as an organic EL material is present as a base and low temperature heating conditions are essential. Further, since the content of the organic silver compound in the resin composition can be reduced, the resin composition can be provided at a lower cost. Further, if an unreacted organic silver compound remains in the film after heating, it is decomposed by light or heat and the film color changes, resulting in a film having poor weather resistance. The amount of the organic silver compound remaining in the film after curing is reduced, and the weather resistance is improved. Twice

The reducing agent may be any compound as long as it promotes the reduction of the organic silver compound, but from the viewpoint of more efficiently reducing the organic silver compound, the molecule contains two or more phenolic hydroxyl groups. It is preferably a compound or a compound containing an enol group.

Examples of the compound containing two or more phenolic hydroxyl groups in the molecule include a divalent phenol compound such as a catechol compound, a hydroquinone compound, a resosinol compound, and an anthrahydroquinone compound, and a polyphenol containing three or more phenolic hydroxyl groups. Examples include compounds. Among these, from the viewpoint of reducing property, the hydroquinone compound represented by the following general formula (3) is more preferable.

In the general formula (3), R ₄ , R ₅ , R ₆ and R ₇ independently represent hydrogen, a hydroxy group, or an organic group having 1 to 30 carbon atoms, respectively. Here, the "organic group having 1 to 30 carbon atoms" includes an alkyl group having 1 to 30 carbon atoms (including a linear and branched alkyl group) and / or an aromatic hydrocarbon having 6 to 30 carbon atoms. A hydrogen group is preferred. Preferred specific examples of these are methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, n-pentyl group, isopentyl group, n-hexyl group, isohexyl group, n-heptyl group, Isoheptyl group, n-octyl group, isooctyl group, n-nonyl group, isononyl group, decyl group, undecyl group, dodecyl group, tridecyl group, tetradecyl group, pentadecyl group, hexadecyl group, heptadecyl group, octadecyl group, nonadecil group, eicosyl Examples include groups, phenyl groups, benzyl groups, tolyl groups, biphenyl groups and naphthyl groups.

Examples of the hydroquinone compound represented by the following general formula (3) include hydroquinone, methylhydroquinone, ethylhydroquinone, propylhydroquinone, butylhydroquinone, t-butylhydroquinone, 2,3-dimethylhydroquinone, and 2,3-diethylhydroquinone. 2,3-Dipropylhydroquinone, 2,3-dibutylhydroquinone, 2,3-dit-butylhydroquinone, 2,5-dimethylhydroquinone, 2,5-diethylhydroquinone, 2,5-dipropylhydroquinone, 2,5 -Dibutylhydroquinone, 2,5-dit-butylhydroquinone, hydroquinone dimethylether, hydroquinone diethylether, 1,2,4-benzenetriol, 2,5-dihydroxyacetophenone, 2,5-dihydroxybenzoic acid, phenylhydroquinone, 2, 6-Dimethylhydroquinone, 2,6-diethylhydroquinone, 2,6-dipropylhydroquinone, 2,6-dibutylhydroquinone, 2,6-dit-butylhydroquinone, 2,6-dihydroxyacetophenone, 2,6-dihydroxybenzoene Acids, phenylhydroquinone, phenylhydroquinone, 2,5-t-amylhydroquinone and the like can be mentioned. Among these, t-butylhydroquinone, 2,3-dimethylhydroquinone, 2,6-dimethylhydroquinone, 2,5-t-amylhydroquinone, from the viewpoints of reducibility, solubility in organic solvents, and storage stability, 2,3-Dipropylhydroquinone, 2,3-dibutylhydroquinone, 2,3-dit-butylhydroquinone, 2,5-dipropylhydroquinone, 2,5-dibutylhydroquinone, 2,5-dit-butylhydroquinone preferable.

Examples of the compound containing an endiol group include ascorbic acid, α-pyridin, fructose, xylose, glucose, dioxyacetone, glycolaldehyde, benzoin, monooxyacetone, and benzoylcarbinol. Among these, glycolaldehyde is preferable from the viewpoint of reducing property and solubility in an organic solvent.

The content of the reducing agent in the solid content of the resin composition is preferably 0.01% by weight or more, more preferably 0.1% by weight or more. By setting the content of the reducing agent to 0.1% by weight or more, the organic silver compound can be reduced more effectively, the obtained partition wall can be made more yellow, and the light-shielding property of the blue light of the partition wall is improved. .. In addition, the amount of the organic silver compound remaining in the film after curing is reduced, and the weather resistance is improved.

On the other hand, when the resin composition is a negative photosensitive resin composition, if the content of the reducing agent is too large, the reducing agent traps radicals generated by the decomposition of the photopolymerization initiator during exposure, resulting in poor exposure sensitivity. descend. Therefore, the content of the reducing agent in the solid content of the resin composition is preferably 3.0% by weight or less, more preferably 1.5% by weight or less.

The resin composition of the present invention preferably further contains a liquid repellent compound. The liquid-repellent compound is a compound that imparts the property of repelling water or an organic solvent (liquid-repellent performance) to the resin composition. The compound having such properties is not particularly limited, but specifically, a compound having a fluoroalkyl group is preferably used. By containing the liquid repellent compound, it is possible to impart liquid repellent performance to the top of the partition wall after forming the partition wall (A-1) described later. Thereby, for example, when forming pixels containing the color conversion light emitting material (B) described later, color conversion light emitting materials having different compositions can be easily applied to each pixel.

The liquid-repellent compound is preferably a liquid-repellent compound having a photoradical polymerizable group. By having a photoradical polymerizable group, a strong bond can be formed with the resin, so that liquid repellent performance can be more easily imparted to the top of the partition wall.

Examples of the liquid repellent compound include 1,1,2,2-tetrafluorooctyl (1,1,2,2-tetrafluoropropyl) ether, 1,1,2,2-tetrafluorooctylhexyl ether, and octaethylene. Glycoldi (1,1,2,2-tetrafluorobutyl) ether, perfluoroalkyl-N-ethylsulfonylglycine salt, bis phosphate (N-perfluorooctylsulfonyl-N-ethylaminoethyl), monoperfluoroalkyl Examples thereof include compounds having a fluoroalkyl or fluoroalkylene group at the terminal, main chain and / or side chain such as ethyl phosphate ester. Commercially available liquid repellent compounds include "Mega Fvck" (registered trademark) F142D, F172, F173, F183, F444, F477 (all manufactured by Dainippon Ink and Chemicals Co., Ltd.), Ftop EF301, 303, 352. (Manufactured by Shin-Akita Kasei Co., Ltd.), Florard FC-430, FC-431 (manufactured by Sumitomo 3M Co., Ltd.), "Asahi Guard" (registered trademark) AG710, "Surflon" (registered trademark) S-382, SC -101, SC-102, SC-103, SC-104, SC-105, SC-106 (manufactured by Asahi Glass Co., Ltd.), BM-1000, BM-1100 (manufactured by Yusho Co., Ltd.), NBX-15, Examples include FTX-218 and DFX-18 (manufactured by Neos Co., Ltd.). Two or more of these may be contained.

Examples of the liquid repellent compound having a photoradical polymerizable group include "Mega Fvck" (registered trademark) RS-72-A, RS-75-A, RS-76-E, RS-56, RS-72-K. , RS-75, RS-76-E, RS-76-NS, RS-76, RS-90 (above, trade name, manufactured by DIC Co., Ltd.) and the like. In this case, the photopolymerizable group may be photopolymerized in the partition wall (A-1) made of the photocured product of the negative photosensitive resin composition.

From the viewpoint of improving the liquid repellent performance of the partition wall and improving the inkjet coatability, the content of the liquid repellent compound in the resin composition is preferably 0.01% by weight or more, preferably 0.1% by weight or more in the solid content. More preferred. On the other hand, from the viewpoint of improving the compatibility with the resin and the white pigment, the content of the liquid-repellent compound is preferably 10% by weight or less, more preferably 5% by weight or less in the solid content.

The resin composition of the present invention may further contain an organometallic compound other than the organosilver compound. The organometallic compound other than the organosilver compound is preferably an organometallic compound containing at least one metal selected from the group consisting of gold, platinum and palladium. The organometallic compound containing at least one metal selected from the group consisting of gold, platinum and palladium deteriorates in pattern processability because it becomes black particles by decomposing and aggregating in the exposure step and / or the heating step. The light-shielding property of the film can be further improved without causing the film.

Examples of the organometallic compound other than the organosilver compound include organic gold compounds such as chloro (triphenylphosphine) gold, gold resinate MR7901-P, and tetrachlorogold acid tetrahydrate; bis (acetylacetonato) platinum and dichlorobis. Organic platinum compounds such as (triphenylphosphine) platinum and dichlorobis (benzonitrile) platinum; bis (acetylacetonato) palladium, dichlorobis (triphenylphosphine) palladium, dichlorobis (benzonitrile) palladium, tetrakis (triphenylphosphine) palladium, Examples thereof include organic palladium compounds such as divendilideneacetonepalladium. Two or more of these may be contained.

Among these, organometallic compounds selected from bis (acetylacetonato) palladium, dichlorobis (triphenylphosphine) palladium, dichlorobis (benzonitrile) palladium and tetrakis (triphenylphosphine) palladium from the viewpoint of further improving the light-shielding property. Is preferable.

In the resin composition of the present invention, the content of the organometallic compound other than the organosilver compound in the solid content is preferably 0.2 to 5% by weight. By setting the content to 0.2% by weight or more, the light-shielding property of the obtained film can be further improved. More preferably, it is 0.5% by weight or more. On the other hand, the reflectance can be further improved by setting the content of the organometallic compound other than the organosilver compound to 5% by weight or less. More preferably, it is 3% by weight or less.

The resin composition of the present invention may further contain a coordinating compound having a phosphorus atom (hereinafter, may be referred to as a "coordinating compound"). The coordinating compound coordinates with the organometallic compound in the resin composition, improves the solubility of the organometallic compound in the solvent, promotes the decomposition of the organometallic compound, and further improves the light-shielding property of the obtained film. Can be made to. Examples of coordinating compounds include triphenylphosphine, tri-t-butylphosphine, trimethylphosphine, tricyclohexylphosphine, tri-t-butylphosphine tetrafluoroborate, tri (2-furyl) phosphine, and tris (1-frill). Examples thereof include adamantyl) phosphine, tris (diethylamino) phosphine, tris (4-methoxyphenyl) phosphine, and tris (O-tolyl) phosphine. Two or more of these may be contained. The content of the coordinating compound in the solid content of the resin composition of the present invention is preferably 0.5 to 3.0 molar equivalents with respect to the organometallic compound.

Further, the resin composition of the present invention may contain a polymerization inhibitor, a surfactant, an adhesion improver and the like, if necessary.

By containing a surfactant in the resin composition of the present invention, the flowability at the time of coating can be improved. Examples of the surfactant include "Mega Fuck" (registered trademark) F142D, F172, F173, F183, F445, F470, F475, F477 (trade name, manufactured by Dainippon Ink and Chemicals Co., Ltd.), NBX-. 15, Fluorosurfactants such as FTX-218 (trade name, manufactured by Neos Co., Ltd.); "BYK" (registered trademark) -333, 301, 331, 345, 307 (above, trade name, Big Chemie) Silicone-based surfactants such as those manufactured by Japan Co., Ltd .; polyalkylene oxide-based surfactants; poly (meth) acrylate-based surfactants, and the like. Two or more of these may be contained.

By containing the adhesion improver in the resin composition of the present invention, the adhesion with the underlying substrate is improved, and a highly reliable partition wall can be obtained. Examples of the adhesion improving agent include an alicyclic epoxy compound and a silane coupling agent. Among these, an alicyclic epoxy compound is preferable from the viewpoint of heat resistance.

Examples of the alicyclic epoxy compound include 3', 4'-epoxycycloheximethyl-3,4-epoxycyclohexanecarboxylate, and 1,2-epoxy of 2,2-bis (hydroxymethyl) -1-butanol. 4- (2-oxylanyl) cyclohexane adduct, ε-caprolactone modified 3', 4'-epoxycyclohexylmethyl 3', 4'-epoxycyclohexanecarboxylate, 1,2-epoxy-4-vinylcyclohexane, butanetetracarboxylic acid Tetra (3,4-epoxycyclohexylmethyl) modified ε-caprolactone, 3,4-epoxycyclohexylmethylmethacrylate, and the like can be mentioned. Two or more of these may be contained.

The content of the adhesion improver in the resin composition of the present invention is preferably 0.1% by weight or more, more preferably 1% by weight or more in the solid content from the viewpoint of further improving the adhesion to the underlying substrate. .. On the other hand, the content of the adhesion improver is preferably 20% by weight or less, and more preferably 10% by weight or less in the solid content from the viewpoint of pattern processability.

The resin composition of the present invention preferably further contains a solvent. The solvent has a function of adjusting the viscosity of the resin composition within a range suitable for coating and improving the uniformity of the partition wall. As the solvent, it is preferable to combine a solvent having a boiling point of more than 150 ° C. and 250 ° C. or lower under atmospheric pressure and a solvent having a boiling point of 150 ° C. or lower.

Examples of the solvent include alcohols such as isopropanol and diacetone alcohol; glycols such as ethylene glycol and propylene glycol; ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether and propylene glycol. Ethers such as monopropyl ether and propylene glycol monobutyl ether; ketones such as methyl ethyl ketone, acetyl acetone, methyl propyl ketone, methyl butyl ketone, methyl isobutyl ketone, diisobutyl ketone and cyclopentanone; amides such as dimethylformamide and dimethylacetamide; Ethyl acetate, propyl acetate, butyl acetate, isobutyl acetate, ethylene glycol monoethyl ether acetate, propylene glycol monomethyl ether acetate, 3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, methyl lactate, ethyl lactate, butyl lactate, etc. Acetates of the above; aromatic or aliphatic hydrocarbons such as toluene, xylene, hexane and cyclohexane, γ-butyrolactone, N-methyl-2-pyrrolidone, dimethyl sulfoxide and the like can be mentioned. Two or more of these may be contained. Among these, from the viewpoint of coatability, it is preferable to combine diacetone alcohol as a solvent having a boiling point of more than 150 ° C. and 250 ° C. or lower under atmospheric pressure and propylene glycol monomethyl ether as a solvent having a boiling point of 150 ° C. or lower.

The solvent content can be arbitrarily set according to the coating method and the like. For example, when the film is formed by spin coating, the content of the solvent is generally 50% by weight or more and 95% by weight or less in the resin composition.

The resin composition of the present invention is produced, for example, by mixing the above-mentioned resin, photopolymerization initiator or quinonediazide compound, white pigment and / or light-shielding pigment, organic silver compound, reducing agent and other components if necessary. be able to.

Next, the light-shielding film of the present invention will be described. The light-shielding film of the present invention is obtained by curing the above-mentioned resin composition of the present invention. The light-shielding film of the present invention can be suitably used as a light-shielding pattern in an OGS type touch panel such as a decorative pattern for a cover base material, in addition to the partition wall (A-1) described later. The film thickness of the light-shielding film is preferably 10 μm or more.

Next, the method for producing the light-shielding film of the present invention will be described with an example. The method for producing a light-shielding film of the present invention includes a film-forming step of applying the resin composition of the present invention on a base substrate and drying to obtain a dry film, an exposure step of pattern-exposing the obtained dry film, and a post-exposure process. It is preferable to have a developing step of dissolving and removing a portion of the dry film that is soluble in the developing solution and a heating step of heating the developed dry film to cure it.

In the method for producing a light-shielding film of the present invention, the OD value per 10 μm film thickness at a wavelength of 450 nm is increased by 1.0 or more by heating the developed film at a temperature of 100 ° C. or higher and 250 ° C. or lower in the heating step. It is characterized by letting it. The heating temperature during the heating step is preferably 150 ° C. or higher, more preferably 180 ° C. or higher, from the viewpoint of further improving the OD value.

The heating temperature during the heating step is preferably 250 ° C. or lower, more preferably 240 ° C. or lower, from the viewpoint of suppressing the generation of cracks in the film to be heated. The heating time is preferably 15 minutes to 2 hours. The film formed from the resin composition of the present invention has a low OD value during exposure and an increase in OD value after pattern formation. Therefore, in the exposure step, the film is sufficiently photocured to the bottom to have a preferable taper described later. An angled partition can be obtained. In addition, since the OD value at a wavelength of 450 nm after pattern formation is high, it is possible to obtain a partition wall that has both high reflectivity of the entire visible light and high light-shielding property of blue light.

Examples of the method for applying the resin composition in the film forming step include a slit coating method and a spin coating method. Examples of the drying device include a hot air oven and a hot plate. The drying time is preferably 80 to 120 ° C., and the drying time is preferably 1 to 15 minutes.

The exposure step is a step of photocuring a necessary part of the dry film by exposure or photodecomposing an unnecessary part of the dry film to make any part of the dry film soluble in a developing solution. .. In the exposure step, exposure may be performed through a photomask having a predetermined opening, or an arbitrary pattern may be directly drawn using laser light or the like without using a photomask.

Examples of the exposure apparatus include a proximity exposure machine. Examples of the active light beam to be irradiated in the exposure step include near infrared rays, visible rays, and ultraviolet rays, and ultraviolet rays are preferable. Examples of the light source include a low-pressure mercury lamp, a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a halogen lamp, a germicidal lamp, and the like, and an ultra-high-pressure mercury lamp is preferable.

The exposure conditions can be appropriately selected depending on the thickness of the dry film to be exposed. Generally, it is preferable to expose with an exposure amount of ^{1 to 10,000 mJ / cm 2} using an ultrahigh pressure mercury lamp having an output of 1 to 100 mW / cm ^2.

In the developing step, the part of the dry film after exposure that is soluble in the developing solution is dissolved and removed with the developing solution, and only the part that is insoluble in the developing solution remains. , Called a pre-heating pattern). Examples of the pattern shape include a grid shape, a stripe shape, a hole shape, and the like.

Examples of the developing method include a dipping method, a spray method, and a brush method.

As the developing solution, a solvent capable of dissolving unnecessary portions in the dried film after exposure can be appropriately selected, and an aqueous solution containing water as a main component is preferable. For example, when the resin composition contains a polymer having a carboxyl group, an alkaline aqueous solution is preferable as the developing solution. Examples of the alkaline aqueous solution include inorganic alkaline aqueous solutions such as sodium hydroxide, potassium hydroxide, sodium carbonate and calcium hydroxide; and organic alkaline aqueous solutions such as tetramethylammonium hydroxide and trimethylbenzylammonium hydroxide. Among these, an aqueous solution of potassium hydroxide or an aqueous solution of tetramethylammonium hydroxide is preferable from the viewpoint of improving the resolution. The concentration of the alkaline aqueous solution is preferably 0.05% by weight or more, more preferably 0.1% by weight or more, from the viewpoint of improving developability. On the other hand, the concentration of the alkaline aqueous solution is preferably 5% by weight or less, more preferably 1% by weight or less, from the viewpoint of suppressing peeling and corrosion of the pattern before heating. Further, from the viewpoint of improving the resolution, the developing solution may contain a surfactant. The development temperature is preferably 20 to 50 ° C. in order to facilitate process control.

The heating step is a step of heating and curing the preheating pattern formed in the developing step. Examples of the heating device include a hot plate, an oven, and the like. The preferred heating temperature and heating time are as described above.

Next, the substrate with a partition wall of the present invention will be described. The substrate with a partition wall of the present invention has a partition wall (hereinafter, may be referred to as “partition wall (A-1)”) in which a (A-1) pattern is formed on a base substrate. The base substrate has a function as a support in a substrate with a partition wall. When the partition wall has pixels containing a color conversion light emitting material described later, it has a function of suppressing color mixing of light between adjacent pixels.

In the substrate with a partition wall of the present invention, the partition wall (A-1) has a reflectance of 10% to 60% per 10 μm thickness at a wavelength of 450 nm and an OD value of 1.5 to 5.0 per 10 μm thickness at a wavelength of 450 nm. It is characterized by being. By setting the reflectance to 10% or more and the OD value to 5.0 or less, the brightness of the display device can be improved by utilizing the reflection on the side surface of the (A-1) partition wall. On the other hand, by setting the reflectance at a wavelength of 450 nm to 60% or less and the OD value to 1.5 or more, blue light transmitted through the partition wall (A-1) is suppressed and color mixing of light between adjacent pixels is suppressed. Can be done.

FIG. 1 shows a cross-sectional view of one aspect of the substrate with a partition wall of the present invention having a pattern-formed partition wall. A patterned partition wall 2 is provided on the base substrate 1. Twice

<Base substrate>
Examples of the base substrate include a glass plate, a resin plate, a resin film, and the like. As the material of the glass plate, non-alkali glass is preferable. As the material of the resin plate and the resin film, polyester, (meth) acrylic polymer, transparent polyimide, polyether sulfone and the like are preferable. The thickness of the glass plate and the resin plate is preferably 1 mm or less, preferably 0.8 mm or less. The thickness of the resin film is preferably 100 μm or less.

<Septum (A-1)>
The partition wall (A-1) is characterized in that the reflectance per 10 μm thickness at a wavelength of 450 nm is 10% to 60%, and the OD value per 10 μm thickness at a wavelength of 450 nm is 1.5 to 5.0. Here, the thickness of the partition wall (A-1) refers to the height of the partition wall (A-1) and / or the width of the partition wall (A-1). The height of the partition wall (A-1) refers to the length in the direction (height direction) perpendicular to the base substrate of the partition wall (A-1). In the case of the substrate with a partition wall shown in FIG. 1, the height of the partition wall 2 is represented by reference numeral H. The width of the partition wall (A-1) refers to the length in the horizontal direction with the base substrate of the partition wall (A-1). In the case of the substrate with a partition wall shown in FIG. 1, the width of the partition wall 2 is represented by reference numeral L. In this specification, "height" may be referred to as "thickness".

In the present invention, it is considered that the reflectance on the side surface of the partition wall contributes to the improvement of the brightness of the display device, and the light-shielding property contributes to the suppression of color mixing. On the other hand, since the reflectance and OD value per thickness are considered to be the same regardless of the height direction and the width direction, the present invention focuses on the reflectance and OD value per thickness of the partition wall. As will be described later, the thickness of the partition wall (A-1) is preferably 0.5 to 100 μm, and the width is preferably 1 to 100 μm. Therefore, in the present invention, 10 μm was selected as the representative value of the thickness of the partition wall (A-1), and the reflectance and the OD value per 10 μm thickness were focused on.

If the reflectance per 10 μm thickness at a wavelength of 450 nm is less than 10%, the reflection on the side surface of the partition wall becomes small, and the brightness of the display device becomes insufficient. The reflectance per 10 μm thickness at a wavelength of 450 nm is preferably 10% or more, more preferably 20% or more, still more preferably 30% or more. The higher the reflectance per 10 μm thickness at a wavelength of 450 nm, the greater the reflection of blue excitation light on the side surface of the partition wall. Therefore, when a pixel containing the color conversion light emitting material (B) described later is contained between the partition walls, the color conversion efficiency Can be improved and the brightness of the display device can be improved.

Further, the reflectance per 10 μm thickness of the partition wall (A-1) at a wavelength of 550 nm is preferably 30% or more, more preferably 40% or more, still more preferably 50% or more. The higher the reflectance per 10 μm thickness at a wavelength of 550 nm, the greater the reflection of green light on the side surface of the partition wall. Therefore, when a pixel containing the color conversion light emitting material (B) described later is contained between the partition walls, light is emitted within the pixel. It is possible to efficiently reflect the green light and improve the brightness of the display device.

Further, the reflectance per 10 μm thickness of the partition wall (A-1) at a wavelength of 630 nm is preferably 30% or more, more preferably 40% or more, still more preferably 50% or more. The higher the reflectance per 10 μm thickness at a wavelength of 630 nm, the greater the reflection of red light on the side surface of the partition wall. Therefore, when a pixel containing the color conversion light emitting material (B) described later is contained between the partition walls, light is emitted within the pixel. It is possible to efficiently reflect the red light and improve the brightness of the display device.

Further, if the OD value per 10 μm thickness of the partition wall (A-1) at a wavelength of 450 nm is less than 1.5, blue excitation light leaks to adjacent pixels, resulting in light color mixing. The OD value per 10 μm thickness of the partition wall (A-1) at a wavelength of 450 nm is preferably 1.5 or more, more preferably 2.0 or more, still more preferably 2.5 or more.

Further, the OD value per 10 μm thickness of the partition wall (A-1) at a wavelength of 550 nm is preferably 1.0 or more, more preferably 1.5 or more, still more preferably 2.0 or more. The higher the OD value per 10 μm thickness at a wavelength of 550 nm, the greater the light-shielding property of green light on the side surface of the partition wall. It is possible to efficiently block the emitted green light to prevent color mixing and improve the contrast of the display device.

Further, the OD value per 10 μm thickness of the partition wall (A-1) at a wavelength of 630 nm is preferably 1.0 or more, more preferably 1.5 or more, still more preferably 2.0 or more. The higher the OD value per 10 μm thickness at a wavelength of 630 nm, the greater the light-shielding property of red light on the side surface of the partition wall. It is possible to efficiently block the emitted red light to prevent color mixing and improve the contrast of the display device.

The reflectance of the partition wall (A-1) at wavelengths of 450 nm, 550 nm, and 630 nm per 10 μm thickness is determined from the upper surface of the partition wall (A-1) having a thickness of 10 μm by a spectrocolorimeter (for example, CM manufactured by Konica Minolta Co., Ltd.). -2600d) can be used for measurement in SCI mode. However, if a sufficient area for measurement cannot be secured, or if a measurement sample having a thickness of 10 μm cannot be collected and the composition of the partition wall (A-1) is known, the composition is the same as that of the partition wall (A-1). A solid film having a thickness of 10 μm may be prepared, and the reflectance per 10 μm thickness may be obtained by measuring the reflectance of the solid film in the same manner instead of the partition wall (A-1). For example, using a material on which a partition wall (A-1) is formed, a solid film is produced under the same processing conditions as the partition wall (A-1) except that the thickness is 10 μm and no pattern is formed, and the solid film is obtained. The reflectance of the film may be measured from the upper surface in the same manner.

The OD value per 10 μm thickness of the partition wall (A-1) at wavelengths of 450 nm, 550 nm, and 630 nm is an optical densitometer (for example, U-4100 manufactured by Hitachi High-Tech Science) from the top surface of the partition wall (A-1) having a thickness of 10 μm. The intensity of the incident light and the transmitted light can be measured using the following equation (1). However, if a sufficient area for measurement cannot be secured, or if a measurement sample having a thickness of 10 μm cannot be collected and the composition of the partition wall (A-1) is known, the partition wall (similar to the measurement of reflectance) A solid film having the same composition as A-1) and having a thickness of 10 μm may be prepared, and the OD value per 10 μm thickness may be obtained by measuring the OD value of the solid film in the same manner instead of the partition wall (A-1). ..

OD value = log10 (I ₀ / I) ・・・ (1)
I ₀ : Incident light intensity I: Transmitted light intensity.

As a means for setting the reflectance and the OD value within the above ranges, for example, the partition wall (A-1) may have a preferable composition described later.

The taper angle of the partition wall (A-1) is preferably 45 ° to 110 °. The taper angle of the partition wall (A-1) refers to the angle formed by the side surface and the bottom surface of the partition wall cross section. In the case of the substrate with a partition wall shown in FIG. 1, the taper angle of the partition wall 2 is represented by the reference numeral θ. By setting the taper angle to 45 ° or more, the difference in width between the top and bottom of the partition wall (A-1) becomes small, and the width of the partition wall (A-1) can be easily formed in a preferable range described later. .. The taper angle is more preferably 70 ° or more. On the other hand, by setting the taper angle to 110 ° or less, when the pixels containing the color conversion light emitting material (B) described later are formed by inkjet coating, the ink breakage is suppressed and the inkjet coating property is improved. Can be done. Here, the ink rupture refers to a phenomenon in which the ink gets over the partition wall and mixes with the adjacent pixel portion. The taper angle is more preferably 95 ° or less. The taper angle of the partition wall (A-1) is an acceleration voltage of 3 using an optical microscope (FE-SEM (for example, S-4800 manufactured by Hitachi, Ltd.)) for any cross section of the partition wall (A-1). It can be obtained by observing at a magnification of 2,500 kV and measuring the angle formed by the side and bottom of the cross section of the partition wall (A-1).

As a means for setting the taper angle of the partition wall (A-1) in the above range, for example, the partition wall (A-1) has a preferable composition described later, and the resin composition of the present invention described above is used. For example, forming.

When the partition wall (A-1) has pixels containing the color conversion light emitting material (B) described later, the thickness of the partition wall (A-1) is preferably larger than the thickness of the pixels. Specifically, the thickness of the partition wall (A-1) is preferably 0.5 μm or more, and more preferably 10 μm or more. On the other hand, from the viewpoint of more efficiently extracting light emission at the bottom of the pixel, the thickness of the partition wall (A-1) is preferably 100 μm or less, more preferably 50 μm or less. Further, the width of the partition wall (A-1) is preferably sufficient to further improve the brightness by utilizing the light reflection on the side surface of the partition wall and further suppress the color mixing of light in the adjacent pixels due to light leakage. Specifically, the width of the partition wall is preferably 1 μm or more, more preferably 5 μm or more. On the other hand, the width of the partition wall (A-1) is preferably 100 μm or less, more preferably 50 μm or less, from the viewpoint of securing a large amount of light emitting regions of the pixels and further improving the brightness.

The partition wall (A-1) has a repeating pattern for a predetermined number of pixels according to the screen size of the image display device. Examples of the number of pixels of the image display device include 4000 pixels in the horizontal direction and 2000 pixels in the vertical direction. The number of pixels affects the resolution (fineness) of the displayed image. Therefore, it is necessary to form a number of pixels according to the required image resolution and the screen size of the image display device, and it is preferable to determine the pattern formation dimension of the partition wall accordingly.

The partition wall (A-1) preferably contains a resin, a white pigment and / or a light-shielding pigment, silver oxide and / or silver particles, and a quinone compound. The resin has a function of improving the crack resistance and light resistance of the partition wall. The white pigment has a function of further improving the reflectance of the partition wall. The light-shielding pigment has a function of improving the light-shielding property of light of a specific wavelength of the partition wall. The silver oxide and / or silver particles have a function of adjusting the OD value and suppressing the color mixing of light in the adjacent pixels. When the hydroquinone compound is contained as a reducing agent in the resin composition, the quinone compound is produced in the partition wall by being oxidized by itself when the hydroquinone compound promotes the reduction of the organic silver compound.

The resin, white pigment, and light-shielding pigment are as described above as the materials constituting the resin composition. The content of the resin in the partition wall (A-1) is preferably 10% by weight or more, more preferably 20% by weight or more, from the viewpoint of improving the crack resistance of the partition wall in the heat treatment. On the other hand, from the viewpoint of improving the light resistance, the content of the resin in the partition wall (A-1) is preferably 60% by weight or less, more preferably 50% by weight or less. Twice

The content of the white pigment in the partition wall (A-1) is preferably 20% by weight or more, more preferably 30% by weight or more, from the viewpoint of further improving the reflectance. On the other hand, from the viewpoint of improving the surface smoothness of the partition wall, the content of the white pigment in the partition wall (A-1) is preferably 60% by weight or less, more preferably 55% by weight or less.

The content of the light-shielding pigment in the partition wall (A-1) is preferably 0.005% by weight or more, more preferably 0.05% by weight or more in the solid content from the viewpoint of improving the light-shielding property of light having a specific wavelength. preferable. On the other hand, from the viewpoint of not impairing the reflectance of the partition wall, 30% by weight or less is preferable, and 15% by weight or less is more preferable.

Silver oxide and / or silver particles refer to yellow particles or black particles generated by decomposition and agglutination of the organic silver compound in the resin composition described above in the exposure step and / or the heating step. The content of silver oxide and / or silver particles in the partition wall (A-1) is 0.1% by weight from the viewpoint of adjusting the reflectance and OD to the above-mentioned ranges to further suppress the color mixing of light in the adjacent pixels. The above is preferable, and 0.4% by weight or more is more preferable. On the other hand, from the viewpoint of adjusting the reflectance and OD within the above ranges, the content of silver oxide and / or silver particles in the partition wall (A-1) is preferably 10% by weight or less, preferably 3.0% by weight or less. More preferred.

The partition wall (A-1) preferably further contains a liquid repellent compound. By containing the liquid-repellent compound, the partition wall (A-1) can be imparted with liquid-repellent performance. For example, when forming pixels containing the color conversion light emitting material (B) described later, each pixel is formed. In addition, color-converting light-emitting materials having different compositions can be easily applied separately. The liquid-repellent compound is as described above as a material constituting the resin composition.

From the viewpoint of improving the liquid repellent performance of the partition wall and improving the inkjet coating property, the content of the liquid repellent compound in the partition wall (A-1) is preferably 0.01% by weight or more, preferably 0.1% by weight or more. More preferred. On the other hand, from the viewpoint of improving the compatibility with the resin and the white pigment, the content of the liquid repellent compound in the partition wall (A-1) is preferably 10% by weight or less, more preferably 5% by weight or less.

The surface contact angle of the partition wall (A-1) with respect to propylene glycol monomethyl ether acetate is preferably 10 ° or more, preferably 20 ° or more, from the viewpoint of improving inkjet coatability and facilitating the separation of color conversion luminescent materials. More preferably, 40 ° or more is further preferable. On the other hand, from the viewpoint of improving the adhesion between the partition wall and the base substrate, the surface contact angle of the partition wall (A-1) is preferably 70 ° or less, more preferably 60 ° or less. Here, the surface contact angle of the partition wall (A-1) conforms to the wettability test method of the substrate glass surface specified in JIS R3257 (establishment date = 1999/04/20) with respect to the upper part of the partition wall. Can be measured. Examples of the method for setting the surface contact angle of the partition wall (A-1) within the above range include a method using the above-mentioned liquid repellent compound.

As a method for forming a pattern of the partition wall (A-1) on the base substrate, the photosensitive paste method is preferable because the pattern shape can be easily adjusted. As a method of forming a pattern of the partition wall by the photosensitive paste method, for example, a coating step of applying the above-mentioned resin composition on a base substrate and drying to obtain a dry film, and a desired pattern of the obtained dry film. A method having an exposure step of pattern exposure according to the shape, a development step of dissolving and removing a portion of the dry film after exposure that is soluble in a developer, and a heating step of curing the partition wall after development is preferable. The resin composition preferably has positive or negative photosensitive properties. The pattern exposure may be performed through a photomask having a predetermined opening, or an arbitrary pattern may be directly drawn using a laser beam or the like without using a photomask. If the substrate with a partition wall has a color filter and / or a light-shielding partition wall (A-2) described later, the partition wall (A-1) is similarly placed on the color filter and / or the light-shielding partition wall (A-2). A pattern can be formed. Each step is as described above as a method for producing a light-shielding film.

The substrate with a partition wall of the present invention further includes pixels (hereinafter, may be referred to as “pixels (B)”) containing (B) color-converting light-emitting material arranged separated by the partition wall (A-1). It is preferable to have.

The pixel (B) has a function of enabling color display by converting at least a part of the wavelength region of the incident light and emitting the emitted light in the wavelength region different from the incident light.

FIG. 2 shows a cross-sectional view of one aspect of the substrate with a partition wall of the present invention having a pattern-formed partition wall (A-1) and pixels (B). A patterned partition wall 2 is provided on the base substrate 1, and pixels 3 are arranged in a region separated by the partition wall 2.

The color conversion material preferably contains a phosphor selected from an inorganic phosphor and an organic phosphor.

The substrate with a partition wall of the present invention can be used as a display device by combining, for example, a backlight that emits blue light, a liquid crystal crystal formed on the TFT, and a pixel (B). In this case, it is preferable that the region corresponding to the red pixel contains a red phosphor that is excited by blue excitation light and emits red fluorescence. Similarly, the region corresponding to the green pixel preferably contains a green phosphor that is excited by blue excitation light and emits green fluorescence. It is preferable that the region corresponding to the blue pixel does not contain a phosphor.

As the inorganic phosphor, one that emits each color such as green or red by blue excitation light, that is, one that is excited by excitation light having a wavelength of 400 to 500 nm and has a peak in the emission spectrum in the region of 500 to 700 nm is preferable. .. Examples of such inorganic phosphors include YAG-based phosphors, TAG-based phosphors, sialone-based phosphors, Mn ⁴⁺ activated fluoride complex phosphors, and inorganic semiconductors called quantum dots. Two or more of these may be used. Among these, quantum dots are preferable. Since quantum dots have a smaller average particle size than other phosphors, the surface of the (B) pixel can be smoothed and light scattering on the surface can be suppressed, so that the light extraction efficiency can be further improved. The brightness can be further improved.

Examples of the quantum dot material include semiconductors of group II-IV, group III-V, group IV-VI, and group IV. Examples of these inorganic semiconductors include Si, Ge, Sn, Se, Te, B, C (including diamond), P, BN, BP, BAs, AlN, AlP, AlAs, AlSb, GaN, GaP, GaAs, GaSb, InN, InP, InAs, InSb, ZnO, ZnS, ZnSe, ZnTe, CdS, CdSe, CdSeZn, CdTe, HgS, HgSe, HgTe, BeS, BeSe, BeTe, MgS, MgSe, GeS, GeS Examples thereof include SnSe, SnTe, PbO, PbS, PbSe, PbTe, CuF, CuCl, CuBr, CuI, Si ₃ N ₄ , Ge ₃ N ₄ , Al ₂ O ₃ . Two or more of these may be used.

As the organic phosphor, one that emits each color such as green or red by blue excitation light is preferable. As a phosphor that emits red fluorescence, a pyrromethene derivative having a basic skeleton represented by the following structural formula (8), and as a phosphor that emits green fluorescence, pyrromethene having a basic skeleton represented by the following structural formula (9). Examples include derivatives. Other examples include perylene-based derivatives, porphyrin-based derivatives, oxazine-based derivatives, and pyrazine-based derivatives that fluoresce red or green depending on the selection of the substituent. Two or more of these may be contained. Among these, a pyrromethene derivative is preferable because of its high quantum yield. The pyrromethene derivative can be obtained, for example, by the method described in JP-A-2011-241160.

Since the organic phosphor is soluble in a solvent, pixels (B) having a desired thickness can be easily formed.

The thickness of the pixel (B) is preferably 0.5 μm or more, more preferably 1 μm or more, from the viewpoint of improving the color characteristics. On the other hand, the thickness of the pixel (B) is preferably 30 μm or less, more preferably 20 μm or less, from the viewpoint of thinning the display device and processability of curved surfaces.

The size of each pixel (B) is generally about 20 to 200 μm.

Pixels (B) are preferably arranged separated by a partition wall (A-1). By providing a partition wall between the pixels, it is possible to further suppress the diffusion and color mixing of the emitted light.

Examples of the method for forming the pixels (B) include a method of filling a space separated by a partition wall (A-1) with a coating liquid containing a color conversion light emitting material (hereinafter referred to as a color conversion light emitting material coating liquid). Be done. The color conversion light emitting material coating liquid may further contain a resin or a solvent.

Examples of the filling method for the color conversion luminescent material coating liquid include a photolithography method and an inkjet method, but the inkjet coating method is preferable from the viewpoint of easily coating different types of color conversion luminescent materials on each pixel.

The obtained coating film may be dried under reduced pressure and / or heated and dried. In the case of vacuum drying, the vacuum drying temperature is preferably 80 ° C. or lower in order to prevent the drying solvent from recondensing on the inner wall of the vacuum chamber. The pressure for drying under reduced pressure is preferably equal to or lower than the vapor pressure of the solvent contained in the coating film, and is preferably 1 to 1000 Pa. The vacuum drying time is preferably 10 to 600 seconds. In the case of heat drying, examples of the heat drying device include an oven and a hot plate. The heating and drying temperature is preferably 60 to 200 ° C. The heating and drying time is preferably 1 to 60 minutes.

<Shading partition (A-2)>
The substrate with a partition wall of the present invention has an OD value of 0.5 or more per (A-2) thickness of 1.0 μm between the base substrate and the partition wall in which the pattern is formed (A-1). It is preferable to have a certain patterned partition wall (hereinafter, may be referred to as "light-shielding partition wall (A-2)"). By having the light-shielding partition wall (A-2), it is possible to improve the light-shielding property, suppress light leakage of the backlight in the display device, and obtain a high-contrast and clear image.

FIG. 3 shows a cross-sectional view showing one aspect of the substrate with a partition wall of the present invention having a light-shielding partition wall. A patterned partition wall 2 and a light-shielding partition wall 4 are provided on the base substrate 1, and pixels 3 are arranged in a region separated by the partition wall 2 and the light-shielding partition wall 4.

The light-shielding partition wall (A-2) has an OD value of 0.5 or more per 1.0 μm thickness. Here, the thickness of the light-shielding partition wall (A-2) is preferably 0.5 to 10 μm as described later. In the present invention, 1.0 μm was selected as the representative value of the thickness of the light-shielding partition wall (A-2), and attention was paid to the OD value per 1.0 μm thickness. By setting the OD value per 1.0 μm thickness to 0.5 or more, the light-shielding property can be further improved and a clear image with higher contrast can be obtained. The OD value per 1.0 μm thickness is more preferably 1.0 or more. On the other hand, the OD value per 1.0 μm thickness is preferably 4.0 or less, and the pattern processability can be improved. The OD value per 1.0 μm thickness is more preferably 3.0 or less. The OD value of the light-shielding partition wall (A-2) can be measured in the same manner as the OD value of the partition wall (A-1) described above. As a means for setting the OD value in the above range, for example, the light-shielding partition wall (A-2) may have a preferable composition described later.

The thickness of the light-shielding partition wall (A-2) is preferably 0.5 μm or more, more preferably 1.0 μm or more, from the viewpoint of improving the light-shielding property. On the other hand, from the viewpoint of improving flatness, the thickness of the light-shielding partition wall (A-2) is preferably 10 μm or less, more preferably 5 μm or less. Further, the width of the light-shielding partition wall (A-2) is preferably about the same as that of the above-mentioned partition wall (A-1).

The light-shielding partition wall (A-2) preferably contains a resin and a black pigment. The resin has a function of improving the crack resistance and light resistance of the partition wall. The black pigment has a function of absorbing incident light and reducing emitted light.

Examples of the resin include epoxy resin, (meth) acrylic polymer, polyurethane, polyester, polyimide, polyolefin, polysiloxane, and the like. Two or more of these may be contained. Among these, polyimide is preferable because it has excellent heat resistance and solvent resistance.

Examples of the black pigment include those exemplified as the black pigment in the above-mentioned resin composition, palladium oxide, platinum oxide, gold oxide, silver oxide and the like. A black pigment selected from titanium nitride, zirconium nitride, carbon black, palladium oxide, platinum oxide, gold oxide and silver oxide is preferable because of its high light-shielding property.

As a method of forming a pattern of the light-shielding partition wall (A-2) on the base substrate, for example, a photosensitive material described in JP-A-2015-1654 is used, and the light-shielding partition wall (A-1) is exposed to light in the same manner as the above-mentioned partition wall (A-1). A method of forming a pattern by the sex paste method is preferable.

Further, the substrate with a partition wall of the present invention preferably further has a color filter having a thickness of 1 to 5 μm (hereinafter, may be referred to as “color filter”) between the base substrate and the pixel (B). .. The color filter has a function of transmitting visible light in a specific wavelength range and making the transmitted light a desired hue. By having a color filter, the color purity of the display device can be improved. By setting the thickness of the color filter to 1 μm or more, the color purity can be further improved. On the other hand, by setting the thickness of the color filter to 5 μm or less, the brightness can be further improved.

FIG. 4 shows a cross-sectional view of one aspect of the substrate with a partition wall of the present invention having a color filter. It has a pattern-formed partition wall 2 and a color filter 5 on the base substrate 1, and has pixels 3 on the color filter 5.

Examples of the color filter include a color filter using a pigment-dispersed material in which a pigment is dispersed in a photoresist, which is used for a flat panel display such as a liquid crystal display. More specifically, a blue color filter that selectively transmits a wavelength of 400 nm to 550 nm, a green color filter that selectively transmits a wavelength of 500 nm to 600 nm, and a yellow color filter that selectively transmits a wavelength of 500 nm or more. Examples thereof include a red color filter that selectively transmits a wavelength of 600 nm or more.

Further, the color filter may be laminated apart from the pixel (B) containing the color conversion light emitting material, or may be integrally laminated.

The substrate with a partition wall of the present invention preferably has a color filter having a thickness of 1 to 5 μm, which is further separated by a light-shielding partition wall between the base substrate and the pixel (B).

FIG. 5 shows a cross-sectional view of one aspect of the substrate with a partition wall of the present invention having a color filter separated by a light-shielding partition wall. A color filter 5 is provided on the base substrate 1 and separated by a light-shielding partition wall 4 in which a pattern is formed, and a partition wall 2 and pixels 3 are provided on the color filter 5.

The substrate with a partition wall of the present invention has a low refractive index layer (hereinafter, "low refractive index layer") having a refractive index of 1.20 to 1.35 at a wavelength of (C) 550 nm on the upper or lower portion of the pixel (B). (C) "may be described). By having the low refractive index layer (C), it is possible to further improve the light extraction efficiency and further improve the brightness of the display device.

FIG. 6 shows a cross-sectional view of one aspect of the substrate with a partition wall of the present invention having a low refractive index layer. A patterned partition wall 2 and pixels 3 are provided on the base substrate 1, and a low refractive index layer 6 is further provided on these partition walls 2.

In the display device, the refractive index of the low refractive index layer (C) is preferably 1.20 or more from the viewpoint of appropriately suppressing the reflection of the light of the backlight and efficiently incident the light on the pixel (B). 23 or more is more preferable. On the other hand, from the viewpoint of improving the brightness, the refractive index of the low refractive index layer (C) is preferably 1.35 or less, more preferably 1.30 or less. Here, the refractive index of the low refractive index layer (C) is measured by irradiating the cured film surface with light having a wavelength of 550 nm from the direction perpendicular to the cured film surface under the condition of 20 ° C. under atmospheric pressure using a prism coupler. Can be done.

The low refractive index layer (C) preferably contains polysiloxane and silica particles having no hollow structure. Polysiloxane has high compatibility with inorganic particles such as silica particles and functions as a binder capable of forming a transparent layer. Further, by containing silica particles, minute voids can be efficiently formed in the low refractive index layer (C) to reduce the refractive index, and the refractive index can be easily adjusted to the above-mentioned range. Can be done. Furthermore, by using silica particles that do not have a hollow structure, cracks can be suppressed because they do not have a hollow structure that easily causes cracks during curing shrinkage.

The polysiloxane contained in the low refractive index layer (C) preferably contains fluorine. By containing fluorine, the refractive index of the low refractive index layer (C) can be easily adjusted to 1.20 to 1.35. The fluorine-containing polysiloxane can be obtained by hydrolyzing and polycondensing a plurality of alkoxysilane compounds including at least a fluorine-containing alkoxysilane compound represented by the following general formula (10). Further other alkoxysilane compounds may be used. In the general formula (10), the ^{notation "-(OR 12} ) _4-m " means that (4-m) "-(OR ^{12)" are bonded to the Si atom.}

In the above general formula (10), R ¹³ represents a fluoroalkyl group having 3 to 17 fluorine numbers. The fluoroalkyl group preferably has 1 to 20 carbon atoms. R ¹² represents the same group as ^{R 11} in the general formulas (6) to (7). m represents 1 or 2. 4-m-number of ^{R 12} and m pieces of ^{R 13} may be the same or different from each other.

Examples of the fluorine-containing alkoxysilane compound represented by the general formula (10) include trifluoroethyltrimethoxysilane, trifluoroethyltriethoxysilane, trifluoropropyltrimethoxysilane, and trifluoropropyltriethoxysilane trifluoroethyl ethyl. Examples thereof include dimethoxysilane, trifluoroethyl ethyl diethoxysilane, and trifluoroethyl ethyl diisopropoxysilane. Two or more of these may be used.

The content of polysiloxane in the low refractive index layer (C) is preferably 4% by weight or more from the viewpoint of suppressing cracks. On the other hand, the content of polysiloxane is 32% by weight or less from the viewpoint of ensuring thixotropic property due to the network between silica particles, maintaining an appropriate air layer in the low refractive index layer (C), and further reducing the refractive index. Is preferable.

Examples of silica particles having no hollow structure in the low refractive index layer (C) include "Snowtex" (registered trademark) and "organosilica sol" (registered trademark) series (isopropyl alcohol dispersion) manufactured by Nissan Chemical Industries, Ltd. , Methyl ethyl ketone dispersion, Propylene glycol monomethyl ether dispersion, Methanol dispersion, etc. Part numbers PGM-ST, PMA-ST, IPA-ST, IPA-ST-L, IPA-ST-ZL, IPA-ST-UP, MEK- (ST-UP, etc.) can be mentioned. Two or more of these may be contained.

The content of the silica particles having no hollow structure in the low refractive index layer (C) ensures the thixo property due to the network between the silica particles, maintains an appropriate air layer in the low refractive index layer (C), and refracts. From the viewpoint of further reducing the rate, 68% by weight or more is preferable. On the other hand, the content of silica particles having no hollow structure is preferably 96% by weight or less from the viewpoint of suppressing cracks.

The thickness of the low refractive index layer (C) is preferably 0.1 μm or more, more preferably 0.5 μm or more, from the viewpoint of covering the step of the pixel (B) and suppressing the occurrence of defects. On the other hand, the thickness of the low refractive index layer (C) is preferably 20 μm or less, more preferably 10 μm or less, from the viewpoint of reducing stress that causes cracks in the low refractive index layer (C).

As a method for forming the low refractive index layer (C), a coating method is preferable because the forming method is easy. For example, the low refractive index layer (C) can be formed by applying a low refractive index resin composition containing polysiloxane and silica particles on the pixel (B), drying the mixture, and then heating the pixel (B).

Further, it is preferable that the substrate with a partition wall of the present invention further has an inorganic protective layer I having a thickness of 50 to 1,000 nm on the low refractive index layer (C). Since the presence of the inorganic protective layer I makes it difficult for moisture in the atmosphere to reach the low refractive index layer (C), it is possible to suppress fluctuations in the refractive index of the low refractive index layer (C) and suppress brightness deterioration. can.

7 and 8 show a cross-sectional view of one aspect of the substrate with a partition wall of the present invention having the low refractive index layer and the inorganic protective layer I. A patterned partition wall 2 and pixels 3 are provided on the base substrate 1, and a low refractive index layer 6 and an inorganic protective layer I7 are further provided above or below these.

The substrate with a partition wall of the present invention preferably has the low refractive index layer (C) between the pixel (B) and the color filter, and further, on the low refractive index layer (C), a thickness of 50 to 50 to It is preferable to have an inorganic protective layer (I) having a thickness of 1,000 nm. By having the low refractive index layer (C) between the pixel (B) and the color filter, the effect of improving the light extraction of the emitted light is enhanced, and the brightness of the display is improved.

FIG. 9 shows a cross-sectional view of one aspect of the substrate with a partition wall of the present invention having the low refractive index layer and the inorganic protective layer (I) between the pixel (B) and the color filter. A color filter 5 separated by a light-shielding partition wall 4 was provided on the base substrate 1, a low refractive index layer 6 and an inorganic protective layer (I) 7 were provided on the color filters 5, and a pattern was further formed on them. It has a partition wall 2 and a pixel 3.

Further, the substrate with a partition wall of the present invention preferably further has an inorganic protective layer (II) having a thickness of 50 to 1,000 nm between the pixel (B) and the low refractive index layer (C). By having the inorganic protective layer (II), it becomes difficult for the raw material forming the pixel (B) to move from the pixel (B) to the low refractive index layer, so that the refractive index fluctuation of the low refractive index layer (C) is caused. It can be suppressed and the deterioration of brightness can be suppressed.

FIG. 10 shows a cross-sectional view of one aspect of the substrate with a partition wall of the present invention having a low refractive index layer and an inorganic protective layer (II). A patterned partition wall 2 and pixels 3 are provided on the base substrate 1, and an inorganic protective layer (II) 8 and a low refractive index layer 6 are further provided on the partition walls 2 and pixels 3.

Further, the substrate with a partition wall of the present invention preferably further has an inorganic protective layer (III) and / or a yellow organic protective layer having a thickness of 50 to 1,000 nm between the color filter and the pixel (B). By having the inorganic protective layer (III), it becomes difficult for the material for forming the color filter to reach the pixel (B) containing the color conversion light emitting material from the color filter, so that the pixel (B) containing the color conversion light emitting material is difficult to reach. ) Brightness deterioration can be suppressed. Further, by having the yellow organic protective layer, it is possible to cut the blue leakage light that could not be completely converted by the pixel (B) containing the color conversion light emitting material, and to improve the color reproducibility.

FIG. 11 shows a cross-sectional view of one aspect of the partition-mounted substrate of the present invention having a color filter and an inorganic protective layer (III) and / or a yellow organic protective layer. A patterned partition wall 2 and a color filter 5 are provided on the base substrate 1, an inorganic protective layer (III) and / or a yellow organic protective layer 9 is provided on these, and a partition wall is further provided on these. It has pixels 3 arranged separated by two.

Further, the substrate with a partition wall of the present invention preferably further has an inorganic protective layer (IV) and / or a yellow organic protective layer having a thickness of 50 to 1,000 nm on the base substrate. The inorganic protective layer (IV) and / or the yellow organic protective layer can act as a refractive index adjusting layer to more efficiently extract the light emitted from the pixel (B) and further improve the brightness of the display device. Further, the yellow organic protective layer can cut the blue leaked light that could not be completely converted by the pixel (B) containing the color conversion light emitting material, and can improve the color reproducibility. It is more preferable that the inorganic protective layer (IV) and / or the yellow organic protective layer is provided between the base substrate and the partition wall (A) and the pixel (B).

FIG. 12 shows a cross-sectional view of one aspect of the substrate with a partition wall of the present invention having an inorganic protective layer (IV) and / or a yellow organic protective layer. An inorganic protective layer (IV) and / or a yellow organic protective layer 10 is provided on the base substrate 1, and a patterned partition wall 2 and pixels 3 are provided on the inorganic protective layer (IV) and / or a yellow organic protective layer 10.

Examples of the materials constituting the inorganic protective layers (I) to (IV) include metal oxides such as silicon oxide, indium tin oxide, and zinc oxide; metal nitrides such as silicon nitride; and fluorides such as magnesium fluoride. And so on. Two or more of these may be contained. Among these, silicon nitride or silicon oxide is more preferable because it has low water vapor permeability and high permeability.

The thickness of the inorganic protective layers (I) to (IV) is preferably 50 nm or more, more preferably 100 nm or more, from the viewpoint of sufficiently suppressing the permeation of substances such as water vapor. On the other hand, from the viewpoint of suppressing the decrease in transmittance, the thickness of the inorganic protective layers (I) to (IV) is preferably 800 nm or less, more preferably 500 nm or less.

The thickness of the inorganic protective layers (I) to (IV) is determined by exposing a cross section perpendicular to the base substrate using a polishing device such as a cross section polisher and using a scanning electron microscope or a transmission electron microscope. Can be measured by magnifying and observing.

Examples of the method for forming the inorganic protective layers (I) to (IV) include a sputtering method. The inorganic protective layer is preferably colorless and transparent or yellow transparent.

The yellow organic protective layer is obtained, for example, by pattern-processing a resin composition containing the above-mentioned organic silver compound. As described above, the organic silver compound has a function of yellowing the protective layer by decomposing and agglutinating in the heating step during pattern formation to form yellow particles. In the resin composition for the yellow organic protective layer, the content of the organic silver compound is preferably 0.2 to 5% by weight in the solid content. By setting the content of the organic silver compound to 0.2% by weight or more, more yellowing can be achieved. The content of the organic silver compound is more preferably 1.5% by weight or more in the solid content. On the other hand, by setting the content of the organic silver compound to 5% by weight or less in the solid content, the transmittance can be further improved.

The resin composition forming the yellow organic protective layer may contain a yellow pigment. Examples of the yellow pigment include Pigment Yellow (hereinafter abbreviated as PY) PY137, PY138, PY139, PY147, PY148, PY150, PY153, PY154, PY166, PY168, PY185 and the like. Among them, a yellow pigment selected from PY139, PY147, PY148 and PY150 is preferable from the viewpoint of selectively blocking blue light.

As a method for forming a pattern of the yellow organic protective layer, a method of forming a pattern by a photosensitive paste method is preferable as in the case of the partition wall (A-1) described above.

When the yellow organic protective layer 8 is formed on the color filter 7 as shown in FIG. 7, the yellow organic protective layer 8 may serve as an overcoat layer for flattening each pixel of the color filter.

The thickness of the yellow organic protective layer is preferably 100 nm or more, more preferably 500 nm or more, from the viewpoint of sufficiently blocking blue leakage light. On the other hand, from the viewpoint of suppressing a decrease in light extraction efficiency, the thickness of the yellow organic protective layer is preferably 3000 nm or less, more preferably 2000 nm or less.

The substrate with a partition wall of the present invention can also be used for a display device using a mini or micro LED in which a large number of LEDs corresponding to each pixel separated by a partition wall formed on the substrate are arranged. Each pixel can be turned on / off by turning on / off the mini or micro LED, and no liquid crystal display is required. That is, the substrate with a partition wall of the present invention can be used not only as a partition wall for separating each pixel but also as a partition wall for separating a mini or micro LED in a backlight.

For example, the substrate with a partition wall of the present invention preferably further has a light emitting light source selected from an organic EL cell, a mini LED cell, and a micro LED cell on the base substrate. By separating the light emitting light sources selected from the organic EL cell, the mini LED cell, and the micro LED cell with a partition wall, it is possible to prevent color mixing between the pixels and improve the display color purity of the display.

FIG. 13 shows a cross-sectional view of one aspect of the substrate with a partition wall of the present invention having a light emitting light source selected from an organic EL cell, a mini LED cell, and a micro LED cell. A light emitting light source 11 selected from an organic EL cell, a mini LED cell, and a micro LED cell is provided between the partition walls 2 having a pattern formed on the base substrate 1.

Further, it is preferable that the substrate with a partition wall of the present invention further has pixels (B) on a light emitting light source selected from an organic EL cell, a mini LED cell, and a micro LED cell.

FIG. 14 shows a cross-sectional view of one aspect of the substrate with a partition wall of the present invention having a light emitting light source and pixels selected from an organic EL cell, a mini LED cell, and a micro LED cell. A light emitting light source 11 selected from an organic EL cell, a mini LED cell, and a micro LED cell is provided between the partition walls 2 having a pattern formed on the base substrate 1, and a pixel 3 is further provided on the light emitting light source 11.

Next, the display device of the present invention will be described. The display device of the present invention includes the substrate with a partition wall and a light emitting light source. As the light emitting light source, a light emitting light source selected from a liquid crystal cell, an organic EL cell, a mini LED cell and a micro LED cell is preferable. An organic EL cell is more preferable as the light emitting light source because of its excellent light emitting characteristics. The mini LED cell refers to a cell in which a large number of LEDs having a vertical and horizontal length of about 100 μm to 10 mm are arranged. The micro LED cell refers to a cell in which a large number of LEDs having a length and width of less than 100 μm are arranged.

The manufacturing method of the display device of the present invention will be described with reference to an example of the display device having the substrate with a partition wall and the organic EL cell of the present invention. A photosensitive polyimide resin is applied onto a glass substrate, and an insulating film having an opening is formed by using a photolithography method. After sputtering aluminum on the aluminum, patterning of aluminum is performed by a photolithography method to form a back electrode layer made of aluminum in an opening without an insulating film. Subsequently, tris (8-quinolinolato) aluminum (hereinafter abbreviated as Alq3) was formed on it as an electron transport layer by a vacuum vapor deposition method, and then dicyanomethylenepyran, quinacridone and 4,4'are formed on Alq3 as a light emitting layer. -Forms a white light emitting layer doped with bis (2,2-diphenylvinyl) biphenyl. Next, N, N'-diphenyl-N, N'-bis (α-naphthyl) -1,1'-biphenyl-4,4'-diamine is formed as a hole transport layer by a vacuum vapor deposition method. Finally, ITO is formed as a transparent electrode by sputtering to produce an organic EL cell having a white light emitting layer. A display device can be manufactured by adhering the above-mentioned substrate with a partition wall and the organic EL cell thus obtained to face each other with a sealing agent.

Hereinafter, the present invention will be described in more detail with reference to Examples and Comparative Examples, but the present invention is not limited to these ranges. The names of the compounds used that use abbreviations are shown below.

PGMEA: Propylene glycol monomethyl ether acetate EDM: Diethylene glycol ethyl methyl ether DAA: Diacetone alcohol BHT: Dibutylhydroxytoluene.

The solid content concentration of the polysiloxane solution in Synthesis Examples 1 to 6 was determined by the following method. 1.5 g of the polysiloxane solution was weighed in an aluminum cup and heated at 250 ° C. for 30 minutes using a hot plate to evaporate the liquid content. The weight of the solid content remaining in the aluminum cup after heating was weighed, and the solid content concentration was determined from the ratio to the weight before heating.

For the weight average molecular weight of the polysiloxane solutions in Synthesis Examples 1 to 6, the polystyrene-equivalent weight average molecular weight was measured by the following method.
Device: GPC measuring device with RI detector manufactured by Waters (2695)
Column: PLgel MIXED-C column (manufactured by Polymer Laboratories, 300 mm) x 2 (series connection)
Measurement temperature: 40 ° C
Flow rate: 1 mL / min
Solvent: Tetrahydrofuran (THF) 0.5% by mass Solution Standard substance: Polystyrene Detection mode: RI

The content ratio of each repeating unit in the polysiloxane in Synthesis Examples 1 to 6 was determined by the following method. A polysiloxane solution is injected into an NMR sample tube manufactured by "Teflon" (registered trademark) with a diameter of 10 mm, and ²⁹ Si-NMR measurement is performed. The content ratio of each repeating unit was calculated from the ratio of the integrated values of. ²⁹ Si-NMR measurement conditions are shown below.

Device: Nuclear magnetic resonance device (JNM-GX270; manufactured by JEOL Ltd.)
Measurement method: Gated decoupling method Measurement nuclear frequency: 53.6693 MHz ( ²⁹ Si nucleus)
Spectral width: 20000Hz
Pulse width: 12 μs (45 ° pulse)
Pulse repetition time: 30.0 seconds Solvent: Acetone-d6
Reference substance: Tetramethylsilane Measurement temperature: 23 ° C
Sample rotation speed: 0.0 Hz.

Synthesis Example 1 Polysiloxane (PSL-1) solution In a 1000 ml three-mouthed flask, 203.13 g (0.831 mol) of diphenyldimethoxysilane and 76.06 g (0.306 mol) of 3-methacryloxypropyltrimethoxysilane, 3- 21.56 g (0.088 mol) of (3,4-epoxycyclohexyl) propyltrimethoxysilane, 42.08 g (0.350 mol) of dimethyldimethoxysilane, 45.91 g (3-trimethoxysilylpropylsuccinic anhydride). 0.175 mol), 1.475 g of BHT, and 308.45 g of PGMEA were charged, and 3.887 g of phosphoric acid (1.0% by weight based on the charged monomer) was dissolved in 76.39 g of water with stirring at 40 ° C. Aqueous phosphate solution was added over 30 minutes. Then, the flask was immersed in an oil bath at 70 ° C. and stirred for 60 minutes, and then the temperature of the oil bath was raised to 115 ° C. over 30 minutes. One hour after the start of the temperature rise, the solution temperature (internal temperature) reached 100 ° C., and the mixture was heated and stirred for 2 hours (internal temperature was 100 to 110 ° C.) to obtain a polysiloxane solution. During the temperature rise and heating and stirring, a mixed gas of 95% by volume of nitrogen and 5% by volume of oxygen was flowed at 0.05 liter / fraction. A total of 173.99 g of methanol and water, which are by-products, were distilled off during the reaction. PGMEA was added to the obtained polysiloxane solution so that the solid content concentration was 40% by weight to obtain a polysiloxane (PSL-1) solution. The weight average molecular weight of the obtained polysiloxane (PSL-1) was 6,000. Further, in polysiloxane (PSL-1), diphenyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3- (3,4-epoxycyclohexyl) propyltrimethoxysilane, dimethyldimethoxysilane, 3-trimethoxysilylpropyl succinate. The molar ratio of each repeating unit derived from acid anhydride was 47.5 mol%, 17.5 mol%, 5 mol%, 20 mol% and 10 mol%, respectively.

Synthesis Example 2 Polysiloxane (PSL-2) solution In a 1000 ml three-mouthed flask, 164.83 g (0.831 mol) of phenyltrimethoxysilane and 76.06 g (0.306 mol) of 3-methacryloxypropylmethyldimethoxysilane are used. -(3,4-epoxycyclohexyl) propyltrimethoxysilane 21.56 g (0.088 mol), dimethyldimethoxysilane 42.08 g (0.350 mol), 3-trimethoxysilylpropyl succinic anhydride 45.91 g (0.175 mol), 1.186 g of BHT, and 255.58 g of PGMEA were charged, and 3.504 g of phosphoric acid (1.0% by weight based on the charged monomer) was dissolved in 91.35 g of water with stirring at 40 ° C. The aqueous phosphate solution was added over 30 minutes. Then, the flask was immersed in an oil bath at 70 ° C. and stirred for 60 minutes, and then the temperature of the oil bath was raised to 115 ° C. over 30 minutes. One hour after the start of the temperature rise, the solution temperature (internal temperature) reached 100 ° C., and the mixture was heated and stirred for 2 hours (internal temperature was 100 to 110 ° C.) to obtain a polysiloxane solution. During the temperature rise and heating and stirring, a mixed gas of 95% by volume of nitrogen and 5% by volume of oxygen was flowed at 0.05 liter / fraction. A total of 208.08 g of methanol and water, which are by-products, were distilled off during the reaction. PGMEA was added to the obtained polysiloxane solution so that the solid content concentration was 40% by weight to obtain a polysiloxane (PSL-2) solution. The weight average molecular weight of the obtained polysiloxane (PSL-2) was 5,500. Further, in polysiloxane (PSL-2), phenyltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3- (3,4-epoxycyclohexyl) propyltrimethoxysilane, dimethyldimethoxysilane, 3-trimethoxysilylpropyl The molar ratio of each repeating unit derived from succinic anhydride was 47.5 mol%, 17.5 mol%, 5 mol%, 20 mol% and 10 mol%, respectively.

Synthesis Example 3 Polysiloxane (PSL-3) solution 71.16 g (0.306 mol) of 3-methacryloxypropylmethyldimethoxysilane and 78.52 g (0.35 mol) of styryltrimethoxysilane in a 1000 ml three-mouth flask. -(3,4-epoxycyclohexyl) propyltrimethoxysilane 21.56 g (0.088 mol), methyltrimethoxysilane 113.22 g (0.83 mol), 3-trimethoxysilylpropyl succinic anhydride 45. 91 g (0.175 mol), 1.080 g of BHT, and 234.92 g of PGMEA were charged, and 3.304 g of phosphoric acid (1.0% by weight based on the charged monomer) was added to 92.14 g of water while stirring at 40 ° C. The dissolved aqueous phosphate solution was added over 30 minutes. Then, the flask was immersed in an oil bath at 70 ° C. and stirred for 60 minutes, and then the temperature of the oil bath was raised to 115 ° C. over 30 minutes. One hour after the start of the temperature rise, the solution temperature (internal temperature) reached 100 ° C., and the mixture was heated and stirred for 2 hours (internal temperature was 100 to 110 ° C.) to obtain a polysiloxane solution. During the temperature rise and heating and stirring, a mixed gas of 95% by volume of nitrogen and 5% by volume of oxygen was flowed at 0.05 liter / fraction. A total of 209 g of methanol and water, which are by-products, were distilled off during the reaction. PGMEA was added to the obtained polysiloxane solution so that the solid content concentration was 40% by weight to obtain a polysiloxane (PSL-3) solution. The weight average molecular weight of the obtained polysiloxane (PSL-3) was 12,000. In addition, 3-methacryloxypropylmethyldimethoxysilane, styryltrimethoxysilane, 3- (3,4-epoxycyclohexyl) propyltrimethoxysilane, methyltrimethoxysilane, 3-trimethoxysilyl in polysiloxane (PSL-3). The molar ratio of each repeating unit derived from propyl succinic anhydride was 17.5 mol%, 20 mol%, 5 mol%, 47.5 mol% and 10 mol%, respectively.

Synthesis Example 4 Polysiloxane (PSL-4) solution In a 1000 ml three-necked flask, 71.16 g (0.306 mol) of 3-methacryloxypropylmethyldimethoxysilane and 19.63 g (0.088 mol) of styryltrimethoxysilane. -(3,4-epoxycyclohexyl) propyltrimethoxysilane 21.56 g (0.088 mol), methyltrimethoxysilane 148.97 g (1.09 mol), 3-trimethoxysilylpropyl succinic anhydride 45. 91 g (0.175 mol), 0.963 g of BHT, and 212.01 g of PGMEA were charged, and 3.072 g of phosphoric acid (1.0% by weight based on the charged monomer) was added to 92.14 g of water while stirring at 40 ° C. The dissolved aqueous phosphate solution was added over 30 minutes. Then, the flask was immersed in an oil bath at 70 ° C. and stirred for 60 minutes, and then the temperature of the oil bath was raised to 115 ° C. over 30 minutes. One hour after the start of the temperature rise, the solution temperature (internal temperature) reached 100 ° C., and the mixture was heated and stirred for 2 hours (internal temperature was 100 to 110 ° C.) to obtain a polysiloxane solution. During the temperature rise and heating and stirring, a mixed gas of 95% by volume of nitrogen and 5% by volume of oxygen was flowed at 0.05 liter / fraction. A total of 209 g of methanol and water, which are by-products, were distilled off during the reaction. PGMEA was added to the obtained polysiloxane solution so that the solid content concentration was 40% by weight to obtain a polysiloxane (PSL-4) solution. The weight average molecular weight of the obtained polysiloxane (PSL-4) was 10,000. In addition, 3-methacryloxypropylmethyldimethoxysilane, styryltrimethoxysilane, 3- (3,4-epoxycyclohexyl) propyltrimethoxysilane, methyltrimethoxysilane, 3-trimethoxysilyl in polysiloxane (PSL-4). The molar ratio of each repeating unit derived from propyl succinic anhydride was 17.5 mol%, 5 mol%, 5 mol%, 62.5 mol% and 10 mol%, respectively.

Synthesis Example 5 Polysiloxane (PSL-5) solution In a 1000 ml three-necked flask, 71.16 g (0.306 mol) of 3-methacryloxypropylmethyldimethoxysilane and 157.03 g (0.70 mol) of styryltrimethoxysilane. -(3,4-epoxycyclohexyl) propyltrimethoxysilane 21.56 g (0.088 mol), methyltrimethoxysilane 65.55 g (0.481 mol), 3-trimethoxysilylpropyl succinic anhydride 45. 91 g (0.175 mol), 1.235 g of BHT, and 265.45 g of PGMEA were charged, and 3.072 g of phosphoric acid (1.0% by weight based on the charged monomer) was added to 92.14 g of water with stirring at 40 ° C. The dissolved aqueous phosphate solution was added over 30 minutes. Then, the flask was immersed in an oil bath at 70 ° C. and stirred for 60 minutes, and then the temperature of the oil bath was raised to 115 ° C. over 30 minutes. One hour after the start of the temperature rise, the solution temperature (internal temperature) reached 100 ° C., and the mixture was heated and stirred for 2 hours (internal temperature was 100 to 110 ° C.) to obtain a polysiloxane solution. During the temperature rise and heating and stirring, a mixed gas of 95% by volume of nitrogen and 5% by volume of oxygen was flowed at 0.05 liter / fraction. A total of 209 g of methanol and water, which are by-products, were distilled off during the reaction. PGMEA was added to the obtained polysiloxane solution so that the solid content concentration was 40% by weight to obtain a polysiloxane (PSL-5) solution. The weight average molecular weight of the obtained polysiloxane (PSL-5) was 10,000. In addition, 3-methacryloxypropylmethyldimethoxysilane, styryltrimethoxysilane, 3- (3,4-epoxycyclohexyl) propyltrimethoxysilane, methyltrimethoxysilane, 3-trimethoxysilyl in polysiloxane (PSL-5). The molar ratio of each repeating unit derived from propyl succinic anhydride was 17.5 mol%, 40 mol%, 5 mol%, 27.5 mol% and 10 mol%, respectively.

Synthesis Example 6 Polysiloxane (PSL-6) solution In a 1000 ml three-mouthed flask, 213.82 g (0.875 mol) of diphenyldimethoxysilane and 43.12 g (0) of 3- (3,4-epoxycyclohexyl) propyltrimethoxysilane .175 mol), 68.86 g (0.263 mol) of tetraethoxysilane, 59.59 g (0.438 mol) of methyltrimethoxysilane, 1.413 g of BHT, and 298.06 g of PGMEA, and stirred at 40 ° C. However, an aqueous phosphoric acid solution prepared by dissolving 3.854 g of silane (1.0% by weight based on the charged monomer) in 83.48 g of water was added over 30 minutes. Then, the flask was immersed in an oil bath at 70 ° C. and stirred for 60 minutes, and then the temperature of the oil bath was raised to 115 ° C. over 30 minutes. One hour after the start of the temperature rise, the solution temperature (internal temperature) reached 100 ° C., and the mixture was heated and stirred for 2 hours (internal temperature was 100 to 110 ° C.) to obtain a polysiloxane solution. During the temperature rise and heating and stirring, a mixed gas of 95% by volume of nitrogen and 5% by volume of oxygen was flowed at 0.05 liter / fraction. A total of 282.58 g of methanol and water, which are by-products, were distilled off during the reaction. PGMEA was added to the obtained polysiloxane solution so that the solid content concentration was 40% by weight to obtain a polysiloxane (PSL-6) solution. The weight average molecular weight of the obtained polysiloxane (PSL-6) was 5,500. In addition, the molar ratio of each repeating unit derived from diphenyldimethoxysilane, 3- (3,4-epoxycyclohexyl) propyltrimethoxysilane, tetraethoxysilane, and methyltrimethoxysilane in polysiloxane (PSL-6) is different. It was 50 mol%, 10 mol%, 15 mol%, and 25 mol%.

Table 1 summarizes the compositions of Synthesis Examples 1 to 6.

Synthesis Example 7 Green organic phosphor 3,5-dibromobenzaldehyde (3.0 g), 4-t-butylphenylboronic acid (5.3 g), tetrakis (triphenylphosphine) palladium (0) (0.4 g), and Potassium carbonate (2.0 g) was placed in a flask and replaced with nitrogen. Degassed toluene (30 mL) and degassed water (10 mL) were added thereto, and the mixture was refluxed for 4 hours. The reaction solution was cooled to room temperature, separated, and then the organic layer was washed with saturated brine. The organic layer was dried over magnesium sulfate, filtered, and then the solvent was distilled off. The obtained reaction product was purified by silica gel column chromatography to obtain a white solid of 3,5-bis (4-t-butylphenyl) benzaldehyde (3.5 g). Next, 3,5-bis (4-t-butylphenyl) benzaldehyde (1.5 g) and 2,4-dimethylpyrrole (0.7 g) were placed in a flask, and dehydrated dichloromethane (200 mL) and trifluoroacetic acid (1) were placed. Droplets) were added, and the mixture was stirred for 4 hours under a nitrogen atmosphere. A dehydrated dichloromethane solution of 2,3-dichloro-5,6-dicyano-1,4-benzoquinone (0.85 g) was added to the reaction mixture, and the mixture was further stirred for 1 hour. After completion of the reaction, boron trifluorinated diethyl ether complex (7.0 mL) and diisopropylethylamine (7.0 mL) were added and stirred for 4 hours, then water (100 mL) was further added and stirred to separate the organic layer. bottom. The organic layer was dried over magnesium sulfate, filtered, and then the solvent was distilled off. The obtained reaction product was purified by silica gel column chromatography to obtain 0.4 g of green powder (yield 17%). The ¹ H-NMR analysis result of the obtained green powder is as follows, and it was confirmed that the green powder obtained above is [G-1] represented by the following structural formula.

^{1 1} H-NMR (CDCl ₃ (d = ppm)): 7.95 (s, 1H), 7.63-7.48 (m, 10H), 6.00 (s, 2H), 2.58 (s) , 6H), 1.50 (s, 6H), 1.37 (s, 18H).

Synthesis Example 8 A mixed solution of 300 mg of red organic phosphor 4- (4-t-butylphenyl) -2- (4-methoxyphenyl) pyrrole, 201 mg of 2-methoxybenzoyl chloride and 10 ml of toluene was prepared at 120 ° C. under a nitrogen stream. It was heated for 6 hours. After cooling to room temperature, the solvent was evaporated. The obtained residue was washed with 20 ml of ethanol and vacuum dried to obtain 260 mg of 2- (2-methoxybenzoyl) -3- (4-t-butylphenyl) -5- (4-methoxyphenyl) pyrrole. rice field. Next, 2- (2-methoxybenzoyl) -3- (4-t-butylphenyl) -5- (4-methoxyphenyl) pyrrole 260 mg, 4- (4-t-butylphenyl) -2- (4-) A mixed solution of 180 mg of methoxyphenyl) pyrrole, 206 mg of methanesulfonic acid anhydride and 10 ml of degassed toluene was heated at 125 ° C. for 7 hours under a nitrogen stream. The reaction mixture was cooled to room temperature, 20 ml of water was injected, and the mixture was extracted with 30 ml of dichloromethane. The organic layer was washed twice with 20 ml of water, then evaporated and vacuum dried to obtain a pyrromethene as a residue. Next, 305 mg of diisopropylethylamine and 670 mg of boron trifluoride diethyl ether complex were added to the obtained mixed solution of pyrromethene and 10 ml of toluene under a nitrogen stream, and the mixture was stirred at room temperature for 3 hours. 20 ml of water was poured into the reaction mixture and extracted with 30 ml of dichloromethane. The organic layer was washed twice with 20 ml of water, dried over magnesium sulfate, and then evaporated. After purification by silica gel column chromatography and vacuum drying, 0.27 g of reddish purple powder was obtained (yield 70%). The ¹ H-NMR analysis result of the obtained reddish purple powder is as follows, and it was confirmed that the reddish purple powder obtained above is [R-1] represented by the following structural formula.

^{1 1} H-NMR (CDCl ₃ (d = ppm)): 1.19 (s, 18H), 3.42 (s, 3H), 3.85 (s, 6H), 5.72 (d, 1H), 6.20 (t, 1H), 6.42-6.97 (m, 16H), 7.89 (d, 4H).

Synthesis Example 9 Silica particle-containing polysiloxane solution (LS-1)
In a 500 ml three-necked flask, 0.05 g (0.4 mmol) of methyltrimethoxysilane, 0.66 g (3.0 mmol) of trifluoropropyltrimethoxysilane, and 0.10 g (0) of trimethoxysilylpropylsuccinate anhydride. .4 mmol), 7.97 g (34 mmol) of γ-acryloxypropyltrimethoxysilane, and 15.6 wt% isopropyl alcohol dispersion of silica particles (IPA-ST-UP: manufactured by Nissan Chemical Industry Co., Ltd.). 224.37 g was added, and 163.93 g of ethylene glycol mono-t-butyl ether was added. While stirring at room temperature, an aqueous phosphoric acid solution prepared by dissolving 0.088 g of phosphoric acid in 4.09 g of water was added over 3 minutes. Then, the flask was immersed in an oil bath at 40 ° C. and stirred for 60 minutes, and then the temperature of the oil bath was raised to 115 ° C. over 30 minutes. The internal temperature of the solution reaches 100 ° C. 1 hour after the start of temperature rise, and the solution is heated and stirred for another 2 hours (internal temperature is 100 to 110 ° C.) to obtain a silica particle-containing polysiloxane solution (LS-1). rice field. During the temperature rise and heating and stirring, 0.05 liter (liter) / fraction of nitrogen was flowed. A total of 194.01 g of methanol and water, which are by-products, were distilled off during the reaction. The solid content concentration of the obtained silica particle-containing polysiloxane solution (LS-1) was 24.3% by weight, and the contents of the polysiloxane and silica particles in the solid content were 15% by weight and 85% by weight, respectively. .. Methyltrimethoxysilane, trifluoropropyltrimethoxysilane, 3-trimethoxysilylpropylsuccinate anhydride, and γ-acryloxypropyltrimethoxysilane of the polysiloxane in the obtained silica particle-containing polysiloxane (LS-1). The molar ratio of each repeating unit derived from was 1.0 mol%, 8.0 mol%, 1.0 mol% and 90.0 mol%, respectively.

Example 1 Resin composition for partition wall (P-1)
As a white pigment, 5.00 g of a titanium dioxide pigment (R-960; manufactured by BASF Japan Ltd. (hereinafter, “R-960”)) was used, and as a resin, a polysiloxane (PSL-1) solution obtained in Synthesis Example 1 was used. 5.00 g was mixed and dispersed using a mill-type disperser filled with zirconia beads to obtain a pigment dispersion solution (MW-1). Further, as an organic silver compound, 0.50 g of silver neodecanoate was dissolved in 4.50 g of EDM to obtain an organic silver compound solution (OA-1).

Next, 8.25 g of the pigment dispersion (MW-1), 7.025 g of the polysiloxane (PSL-1) solution, 1.031 g of the organic silver compound solution (OA-1), and t-butylhydroquinone as a reducing agent. 0.026 g, as a photopolymerization initiator, etanone, 1- [9-ethyl-6- (2-methylbenzoyl) -9H-carbazole-3-yl]-, 1- (О-acetyloxime) (“Irgacure” (Registered Trademark) OXE-02, manufactured by BASF Japan Co., Ltd. (hereinafter "OXE-02")) 0.155 g, bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide ("Irgacure" 819, BASF) Made by Japan Co., Ltd. (hereinafter "IC-819") 0.258 g, as a photopolymerizable compound, dipentaerythritol hexaacrylate ("KAYARAD" (registered trademark) DPHA, manufactured by Shin Nihon Yakuhin Co., Ltd. (hereinafter "" DPHA ")) 2.063 g, as a liquid repellent compound, a photopolymerizable fluorine-containing compound ("Megafuck" (registered trademark) RS-72A, 20 wt% PGMEA diluted solution product, manufactured by DIC Co., Ltd. (hereinafter "RS-") 72A ")) 0.258 g, 3', 4'-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate ("Ceroxide" (registered trademark) 2021P, manufactured by Daicel Co., Ltd. (hereinafter "Ceroxide (registered trademark) 2021P") ”)) 0.021 g, ethylene bis (oxyethylene) bis [3- (5-tert-butyl-4-hydroxy-m-tolyl) compound] (“Irganox” (registered trademark) 1010, BASF Japan Co., Ltd. Made by (hereinafter "IRGANOX (registered trademark) 1010")) 0.031 g, and acrylic solvent ("BYK" (registered trademark) 352, manufactured by Big Chemie Japan Co., Ltd. (hereinafter "BYK-352")) 0.103 g of a 10 wt% diluted solution of PGMEA (corresponding to a concentration of 500 ppm) was dissolved in 1.405 g of the solvent PGMEA and stirred. The obtained mixture was filtered through a 5.0 μm filter to obtain a resin composition for partition walls (P-1).

Example 2 Resin composition for partition wall (P-2)
Example 1 except that the amount of the organic silver compound solution (OA-1) added was 0.722 g, the amount of the polysiloxane (PSL-1) solution added was 7.10 g, and the amount of PGMEA added was 1.64 g. A resin composition for partition walls (P-2) was obtained in the same manner as in the above.

Example 3 Resin composition for partition wall (P-3)
Example 1 except that the amount of the organic silver compound solution (OA-1) added was 0.516 g, the amount of polysiloxane (PSL-1) solution added was 7.15 g, and the amount of PGMEA added was 1.79 g. A resin composition for partition walls (P-3) was obtained in the same manner as in the above.

Example 4 Resin composition for partition wall (P-4)
Example 1 except that the amount of the organic silver compound solution (OA-1) added was 0.206 g, the amount of the polysiloxane (PSL-1) solution added was 7.32 g, and the amount of PGMEA added was 2.02 g. A resin composition for partition walls (P-4) was obtained in the same manner as in the above.

Example 5 Resin composition for partition wall (P-5)
6.59 g of the pigment dispersion (MW-1), 4.78 g of the polysiloxane (PSL-1) solution, 4.12 g of the organic silver compound solution (OA-1), 0.021 g of t-butylhydroquinone as a reducing agent. As a photopolymerization initiator, OXE-02 is 0.124 g, IC-819 is 0.206 g, as a photopolymerizable compound, DPHA is 1.648 g, and as a liquid repellent compound, RS-72A is 0.206 g. 0.016 g of 2021P, 0.025 g of IRGANOX1010, and 0.103 g of a 10 wt% diluted solution of BYK-352 PGMEA were dissolved in 2.76 g of the solvent PGMEA and stirred. The obtained mixture was filtered through a 5.0 μm filter to obtain a resin composition for partition walls (P-5).

Example 6 Resin composition for partition wall (P-6)
The amount of the organic silver compound solution (OA-1) added was 0.516 g, the amount of polysiloxane (PSL-1) solution added was 7.19 g, the amount of t-butylhydroquinone added was 0.010 g, and the amount of PGMEA added. A resin composition for partition walls (P-6) was obtained in the same manner as in Example 1 except that the amount was 1.77 g.

Example 7 Resin composition for partition wall (P-7)
As an organic silver compound, 0.50 g of silver salicylate was dissolved in 4.50 g of EDM to obtain an organic silver compound solution (OA-2). A resin composition for partition walls (P-7) was obtained in the same manner as in Example 2 except that the organic silver compound solution (OA-2) was used instead of the organic silver compound solution (OA-1).

Example 8 Resin composition for partition wall (P-8)
As an organic silver compound, 0.50 g of silver octylate was dissolved in 4.50 g of EDM to obtain an organic silver compound solution (OA-3). A resin composition for partition walls (P-8) was obtained in the same manner as in Example 2 except that the organic silver compound solution (OA-3) was used instead of the organic silver compound solution (OA-1).

Example 9 Resin composition for partition wall (P-9)
As the organic silver compound, 2.50 g of the organic silver compound (APAG-1) obtained in Preparation Example 8 described later was dissolved in 2.50 g of EDM to obtain an organic silver compound solution (OA-4). A resin composition for partition walls (P-9) was obtained in the same manner as in Example 2 except that the organic silver compound solution (OA-4) was used instead of the organic silver compound solution (OA-1).

Example 10 Resin composition for partition wall (P-10)
A resin composition for partition walls (P-10) was obtained in the same manner as in Example 2 except that 2,3-dimethylhydroquinone was used instead of t-butylhydroquinone as the reducing agent.

Example 11 Resin composition for partition wall (P-11)
A resin composition for partition walls (P-11) was obtained in the same manner as in Example 2 except that trimethylhydroquinone was used as the reducing agent instead of t-butylhydroquinone.

Example 12 Resin composition for partition wall (P-12)
A resin composition for partition walls (P-12) was obtained in the same manner as in Example 2 except that 2,6-dimethylhydroquinone was used instead of t-butylhydroquinone as the reducing agent.

Example 13 Resin composition for partition wall (P-13)
A resin composition for partition walls (P-13) was obtained in the same manner as in Example 2 except that phenylhydroquinone was used as the reducing agent instead of t-butylhydroquinone.

Example 14 Resin composition for partition wall (P-14)
A resin composition for partition walls (P-14) was obtained in the same manner as in Example 2 except that 2,5-t-amylhydroquinone was used as the reducing agent instead of t-butylhydroquinone.

Example 15 Resin composition for partition wall (P-15)
A resin composition for partition walls (P-15) was obtained in the same manner as in Example 2 except that hydroquinone was used as the reducing agent instead of t-butylhydroquinone.

Example 16 Resin composition for partition wall (P-16)
A resin composition for partition walls (P-16) was obtained in the same manner as in Example 2 except that glycolaldehyde was used instead of t-butylhydroquinone as the reducing agent.

Example 17 Resin composition for partition wall (P-17)
For partition wall as in Example 2, except that the amount of t-butylhydroquinone added was 0.005 g, the amount of polysiloxane (PSL-1) solution added was 7.15 g, and the amount of PGMEA added was 1.61 g. A resin composition (P-17) was obtained.

Example 18 Resin composition for partition wall (P-18)
For partition wall as in Example 2 except that the amount of t-butylhydroquinone added was 0.413 g, the amount of polysiloxane (PSL-1) solution added was 6.14 g, and the amount of PGMEA added was 2.22 g. A resin composition (P-18) was obtained.

Example 19 Resin composition for partition wall (P-19)
5.00 g of R-960 as a white pigment and 5.00 g of a polysiloxane (PSL-2) solution as a resin were mixed and dispersed using a mill-type disperser filled with zirconia beads, and the pigment dispersion liquid (MW) was used. -2) was obtained. 8.25 g of the pigment dispersion liquid (MW-2) was added in place of the pigment dispersion liquid (MW-1), and 7 polysiloxane (PSL-2) solution was added in place of the polysiloxane (PSL-1) solution. A resin composition for partition wall (P-19) was obtained in the same manner as in Example 2 except that 10.10 g was added and 1.64 g of PGMEA was added.

Example 20 Resin composition for partition wall (P-20)
5.00 g of R-960 as a white pigment and 5.00 g of a polysiloxane (PSL-3) solution as a resin were mixed and dispersed using a mill-type disperser filled with zirconia beads, and the pigment dispersion liquid (MW) was used. -3) was obtained. 8.25 g of the pigment dispersion liquid (MW-3) was added in place of the pigment dispersion liquid (MW-1), and 7 polysiloxane (PSL-3) solution was added in place of the polysiloxane (PSL-1) solution. A resin composition for partition wall (P-20) was obtained in the same manner as in Example 2 except that 10.10 g was added and 1.64 g of PGMEA was added.

Example 21 Resin composition for partition wall (P-21)
5.00 g of R-960 as a white pigment and 5.00 g of a polysiloxane (PSL-4) solution as a resin were mixed and dispersed using a mill-type disperser filled with zirconia beads, and the pigment dispersion liquid (MW) was used. -4) was obtained. 8.25 g of the pigment dispersion liquid (MW-4) was added in place of the pigment dispersion liquid (MW-1), and 7 polysiloxane (PSL-4) solution was added in place of the polysiloxane (PSL-1) solution. A resin composition for partition walls (P-21) was obtained in the same manner as in Example 2 except that 10.10 g was added and 1.64 g of PGMEA was added.

Example 22 Resin composition for partition wall (P-22)
5.00 g of R-960 as a white pigment and 5.00 g of a polysiloxane (PSL-5) solution as a resin were mixed and dispersed using a mill-type disperser filled with zirconia beads, and the pigment dispersion liquid (MW) was used. -5) was obtained. 8.25 g of the pigment dispersion liquid (MW-5) was added in place of the pigment dispersion liquid (MW-1), and 7 polysiloxane (PSL-5) solutions were added in place of the polysiloxane (PSL-1) solution. A resin composition for partition walls (P-22) was obtained in the same manner as in Example 2 except that 10.10 g was added and 1.64 g of PGMEA was added.

Example 23 Resin composition for partition wall (P-23)
5.00 g of R-960 as a white pigment and 5.00 g of a polysiloxane (PSL-6) solution as a resin were mixed and dispersed using a mill-type disperser filled with zirconia beads, and the pigment dispersion liquid (MW) was used. -6) was obtained. 8.25 g of pigment dispersion (MW-6), 7.941 g of polysiloxane (PSL-6) solution, 0.722 g of the organic silver compound solution (OA-1), 0.026 g of t-butylhydroquinone as a reducing agent, 2.063 g of THP-17 (trade name, manufactured by Toyo Synthetic Industry Co., Ltd.) as a quinone diazide compound, 0.258 g of RS-72A as a liquid repellent compound, 0.021 g of celoxide 2021P, 0.031 g of IRGANOX 1010, and 0.103 g of a 10 wt% diluted solution of BYK-352 PGMEA was dissolved in 1.018 g of the solvent PGMEA and stirred. The obtained mixture was filtered through a 5.0 μm filter to obtain a resin composition for partition walls (P-23).

Example 24 Resin composition for partition wall (P-24)
For partition walls in the same manner as in Example 2 except that the amount of the polysiloxane (PSL-1) solution added was 7.23 g and the amount of PGMEA added was 1.77 g without adding the liquid repellent compound RS-72A. A resin composition (P-24) was obtained.

Example 25 Resin composition for partition wall (P-25)
A mill-type disperser filled with zirconia beads by mixing 5.00 g of R-960 as a white pigment, 5.00 g of a polysiloxane (PSL-1) solution as a resin, and 0.0188 g of titanium nitride as a light-shielding pigment. The pigment dispersion solution (MW-7) was obtained. Instead of the pigment dispersion liquid (MW-1), 8.27 g of the pigment dispersion liquid (MW-7) was added, the amount of the polysiloxane (PSL-1) solution added was 7.06 g, and the amount of PGMEA added was 2. A resin composition for partition walls (P-25) was obtained in the same manner as in Example 2 except that the amount was .31 g.

Example 26 Resin composition for partition wall (P-26)
5.00 g of R-960 as a white pigment, 5.00 g of a polysiloxane (PSL-1) solution as a resin, 0.0113 g of Pigment Red 254 (PR254) as a light-shielding pigment, Pigment Blue 15: 6N (PB15: 6N) ) Was mixed and dispersed using a mill-type disperser filled with zirconia beads to obtain a pigment dispersion liquid (MW-8). Instead of the pigment dispersion liquid (MW-1), 8.27 g of the pigment dispersion liquid (MW-8) was added, the amount of the polysiloxane (PSL-1) solution added was 7.06 g, and the amount of PGMEA added was 2. A resin composition for partition walls (P-26) was obtained in the same manner as in Example 2 except that the amount was .31 g.

Example 27 Resin composition for partition wall (P-27)
As an organometallic compound, 0.103 g of bis (acetylacetonato) palladium and 0.089 g of triphenylphosphine as a coordinating compound having a phosphorus atom (equal molar amount with respect to the organometallic compound) were DAA 1.726 g. To obtain an organometallic compound solution (OM-1). Same as in Example 2 except that 1.17 g of the organometallic compound solution (OM-1) was added, the amount of the polysiloxane (PSL-1) solution added was 6.86 g, and the amount of PGMEA added was 0.92 g. A resin composition for partition walls (P-27) was obtained.

Example 28 Resin composition for partition wall (P-28)
5.00 g of titanium nitride as a light-shielding pigment and 5.00 g of a polysiloxane (PSL-1) solution as a resin were mixed and dispersed using a mill-type disperser filled with zirconia beads to prepare a pigment dispersion (MW-9). Obtained. 0.164 g of the pigment dispersion (MW-9), 14.51 g of a polysiloxane (PSL-1) solution, 0.021 g of t-butylhydroquinone as a reducing agent, and 0 of OXE-02 as a photopolymerization initiator. .164 g, IC-819 0.328 g, DPHA 1.640 g as a photopolymerizable compound, RS-72A 0.205 g as a liquid repellent compound, celoxide 2021P 0.016 g, IRGANOX 1010 0.025 g, And 0.103 g of a 10 wt% diluted solution of BYK-352 PGMEA was dissolved in 2.75 g of the solvent PGMEA and stirred. The obtained mixture was filtered through a 5.0 μm filter to obtain a resin composition for partition walls (P-28).

Example 29 Resin composition for partition wall (P-29)
3.00 g of PR254 as a light-shielding pigment, 2.00 g of PB15: 6N, and 5.00 g of a polysiloxane (PSL-1) solution as a resin were mixed and dispersed using a mill-type disperser filled with zirconia beads. A dispersion (MW-10) was obtained. Same as in Example 28 except that 0.574 g of the pigment dispersion liquid (MW-10) was added, the amount of the polysiloxane (PSL-1) solution added was 13.49 g, and the amount of PGMEA added was 3.37 g. A resin composition for partition walls (P-29) was obtained.

Comparative Example 1 Resin composition for partition wall (P-30)
13.40 g of a polysiloxane (PSL-1) solution, 0.574 g of the organic silver compound solution (OA-1), 0.021 g of t-butylhydroquinone as a reducing agent, and 0.XE-02 as a photopolymerization initiator. 123 g, IC-819 0.246 g, DPHA 1.640 g as a photopolymerizable compound, RS-72A 0.205 g as a liquid repellent compound, celoxide 2021P 0.016 g, IRGANOX 1010 0.025 g, and 0.103 g of a 10 wt% diluted solution of BYK-352 PGMEA was dissolved in 0.02 g of the solvent PGMEA and stirred. The obtained mixture was filtered through a 5.0 μm filter to obtain a resin composition for partition walls (P-30).

Comparative Example 2 Resin composition for partition wall (P-31)
Same as in Example 2 except that the amount of the polysiloxane (PSL-1) solution added was 7.28 g and the amount of PGMEA added was 2.18 g without adding the organic silver compound solution (OA-1). A resin composition for partition walls (P-31) was obtained.

Comparative Example 3 Resin composition for partition wall (P-32)
For partition wall as in Example 1 except that the amount of the polysiloxane (PSL-1) solution added was 7.09 g and the amount of PGMEA added was 1.37 g without adding the reducing agent t-butylhydroquinone. A resin composition (P-32) was obtained.

Table 2 summarizes the compositions of Examples 1 to 29 and Comparative Examples 1 to 3.

Preparation Example 1 Color conversion luminescent material composition (CL-1)
20 parts by weight of 0.5 wt% toluene solution of green quantum dot material (Lumidot 640 CdSe / ZnS, average particle size 6.3 nm: manufactured by Aldrich), 45 parts by weight of DPHA, "Irgacure" (registered trademark) 907 (registered trademark) Mix 5 parts by weight of BASF Japan Ltd., 166 parts by weight of 30% by weight PGMEA solution of acrylic resin (SPCR-18 (trade name), Showa Denko Corporation) and 97 parts by weight of toluene and stir. And dissolved uniformly. The obtained mixture was filtered through a 0.45 μm syringe filter to prepare a color conversion luminescent material composition (CL-1).

Preparation Example 2 Color conversion luminescent material composition (CL-2)
The color was the same as in Preparation Example 1 except that 0.4 parts by weight of the green phosphor G-1 obtained in Synthesis Example 10 was used instead of the green quantum dot material and the amount of toluene added was changed to 117 parts by weight. A conversion light emitting material composition (CL-2) was prepared.

Preparation Example 3 Color conversion luminescent material composition (CL-3)
The color was the same as in Preparation Example 1 except that 0.4 parts by weight of the red phosphor R-1 obtained in Synthesis Example 11 was used instead of the green quantum dot material and the amount of toluene added was changed to 117 parts by weight. A conversion light emitting material composition (CL-3) was prepared.

Preparation Example 4 Color filter forming material (CF-1)
C. I. Pigment Green 59 90g, C.I. I. Pigment Yellow 150 60 g, polymer dispersant (“BYK” (registered trademark) -6919 (trade name) manufactured by Big Chemie (hereinafter “BYK-6919”)) 75 g, binder resin (“ADEKA ARCLUS” (registered trademark)” ) 100 g of WR301 (trade name) manufactured by ADEKA Corporation) and 675 g of PGMEA were mixed to prepare a slurry. A beaker containing the slurry was connected to a dyno mill with a tube, and zirconia beads having a diameter of 0.5 mm were used as a medium for dispersion treatment at a peripheral speed of 14 m / s for 8 hours. Pigment Green 59 dispersion (GD-1) Was produced.

Pigment Green 59 Dispersion (GD-1) 56.54g, Acrylic Resin ("Cyclomer" (Registered Trademark) P (ACA) Z250 (trade name) manufactured by Daicel Ornex Co., Ltd. (hereinafter "P (ACA) Z250") )) 3.14 g, DPHA 2.64 g, photopolymerization initiator (“Optomer” (registered trademark) NCI-831 (trade name) manufactured by ADEKA CORPORATION (hereinafter “NCI-831”)) 0.330 g, 0.04 g of surfactant (BYK (registered trademark) -333 (trade name) manufactured by Big Chemie (hereinafter “BYK-333”)), 0.01 g of BHT as a polymerization inhibitor, and 37. PGMEA as a solvent. 30 g was mixed to prepare a color filter forming material (CF-1).

Preparation Example 5 Resin composition for light-shielding partition carbon black (MA100 (trade name) manufactured by Mitsubishi Chemical Corporation) 150 g, polymer dispersant BYK-6919 (75 g), P (ACA) Z250 (100 g), and PGMEA (675 g) are mixed. To prepare a slurry. A beaker containing the slurry is connected to a dyno mill with a tube, and zirconia beads having a diameter of 0.5 mm are used as a medium for dispersion treatment at a peripheral speed of 14 m / s for 8 hours to prepare a pigment dispersion (MB-1). bottom.

Pigment dispersion (MB-1) 56.54 g, P (ACA) Z250 3.14 g, DPHA 2.64 g, NCI-831 0.330 g, BYK-333 0.04 g, as a polymerization inhibitor. 0.01 g of butylcatechol and 37.30 g of PGMEA were mixed to prepare a resin composition for a light-shielding partition wall.

Preparation Example 6 Low Refractive Index Layer Forming Material 5.350 g of silica particle-containing polysiloxane solution (LS-1) obtained in Synthesis Example 7, 1.170 g of ethylene glycol mono-t-butyl ether, and 3.48 g of DAA. After mixing, it was filtered through a 0.45 μm syringe filter to prepare a low refractive index layer forming material.

Preparation Example 7 Yellow Organic Protective Layer Forming Material (YL-1)
C. I. Pigment Yellow 150 (150 g), polymer dispersant ("BYK" (registered trademark) -6919 (trade name) manufactured by Big Chemie (hereinafter "BYK-6919")) (75 g), binder resin ("ADEKA ARCLUDS" (registered trademark)) ) 100 g of WR301 (trade name) manufactured by ADEKA Corporation) and 675 g of PGMEA were mixed to prepare a slurry. A beaker containing the slurry was connected to a dyno mill with a tube, and zirconia beads having a diameter of 0.5 mm were used as a medium for dispersion treatment at a peripheral speed of 14 m / s for 8 hours. Pigment Yellow 150 dispersion (YD-1) Was produced.

Pigment Yellow 150 dispersion (YD-1) 3.09 g, polysiloxane (PSL-1) solution 23.54 g as resin, DPHA 6.02 g as photopolymerizable compound, and silver neodecanoate as organic metal compound. 6.02 g of the prepared organic metal compound solution (OM-2), 0.20 g of OXE-02 as a photopolymerization initiator, 0.40 g of IC-819, 0.060 g of IRGANOX® 1010, and BYK. 0.050 g (corresponding to a concentration of 500 ppm) of a 10 wt% diluted solution of PGMEA of -352 was dissolved in 61.15 g of the solvent PGMEA and stirred. The obtained mixture was filtered through a 5.0 μm filter to obtain a yellow organic protective layer forming material (YL-1).

Preparation Example 8 Organic silver compound (APAG-1)
As a (meth) acrylic polyma solution, 5.0 g of a 30 wt% PGMEA solution of SPCR-10P ((trade name), manufactured by Showa Denko KK) was dissolved in 5.0 g of acetone, and 0.0555 g of diethanolamine ((meth) acrylic) was dissolved. (1.5 eq) was added dropwise to the polymer, and the mixture was stirred at room temperature for 1 hour to produce an amine salt of a (meth) acrylic polymer solution. Next, 0.0287 g of silver nitrate (I) was added to this solution, and the mixture was stirred at room temperature for 1 hour to form a precipitate. After filtering with a 5.0 μm filter, PGMEA was added so that the solid content became 20% to obtain an organic silver compound (APAG-1).

Examples 30-52, Examples 54-59, Comparative Examples 4-6
A 10 cm square non-alkali glass substrate (manufactured by AGC Technoglass Co., Ltd., thickness 0.7 mm) was used as the base substrate. The resin compositions for partition walls shown in Tables 2 to 5 are spin-coated onto the resin compositions, and dried using a hot plate (trade name SCW-636, manufactured by Dainippon Screen Mfg. Co., Ltd.) at a temperature of 100 ° C. for 3 minutes. , A dry film was prepared. The prepared dry film was subjected to a parallel light mask aligner (trade name PLA-501F, manufactured by Canon Inc.) using an ultrahigh pressure mercury lamp as a light source, and an exposure amount of 300 mJ / cm ² (g, h) via a photomask. , I line). Then, using an automatic developing device (“AD-2000 (trade name)” manufactured by Takizawa Sangyo Co., Ltd.), shower development was performed for 100 seconds using a 0.045 wt% potassium hydroxide aqueous solution, and then 30 using water. Rinse for seconds. Further, using an oven (trade name IHPS-222, manufactured by ESPEC CORPORATION), the partition is heated in air at a temperature of 230 ° C. for 30 minutes, and a partition wall having a height of 10 μm and a width of 20 μm is formed on a glass substrate with a short side of 80 μm. , A partition wall formed in a grid pattern with a pitch interval of 280 μm on the long side was formed.

The color conversion luminescent material composition shown in Tables 3 to 5 was applied to the region of the obtained substrate with a partition wall separated by the partition wall in a nitrogen atmosphere using an inkjet method, dried at 100 ° C. for 30 minutes, and thickened. A 5.0 μm pixel was formed, and a substrate with a partition wall having the configuration shown in FIG. 2 was obtained.

Example 53
A 10 cm square non-alkali glass substrate (manufactured by AGC Technoglass Co., Ltd., thickness 0.7 mm) was used as the base substrate. A resin composition for partition walls (P-23) was spin-coated on the resin composition, and dried on a hot plate (trade name SCW-636, manufactured by Dainippon Screen Mfg. Co., Ltd.) at a temperature of 100 ° C. for 3 minutes. A dry film was prepared. The prepared dry film was subjected to a parallel light mask aligner (trade name PLA-501F, manufactured by Canon Inc.) using an ultrahigh pressure mercury lamp as a light source, and an exposure amount of 300 mJ / cm ² (g, h) via a photomask. , I line). Then, using an automatic developing device (“AD-2000 (trade name)” manufactured by Takizawa Sangyo Co., Ltd.), shower-develop with 2.38 wt% tetramethylammonium hydroxide aqueous solution for 90 seconds, and then rinse with water for 30 seconds. bottom. Then, in the same manner as before, exposure was performed with an exposure amount of 500 mJ / cm ² (g, h, i line) without using a photomask, and bleaching was performed. Further, using an oven (trade name IHPS-222, manufactured by ESPEC CORPORATION), the partition is heated in air at a temperature of 230 ° C. for 30 minutes, and a partition wall having a height of 10 μm and a width of 20 μm is formed on a glass substrate with a short side of 80 μm. , A partition wall formed in a grid pattern with a pitch interval of 280 μm on the long side was formed.

The color conversion luminescent material composition (CL-2) was applied to the region of the obtained substrate with a partition wall separated by the partition walls in a nitrogen atmosphere using an inkjet method, dried at 100 ° C. for 30 minutes, and had a thickness of 5 A 0.0 μm pixel was formed, and a substrate with a partition wall having the configuration shown in FIG. 2 was obtained.

Example 60
A 10 cm square non-alkali glass substrate (manufactured by AGC Technoglass Co., Ltd., thickness 0.7 mm) was used as the base substrate. On it, the light-shielding partition wall forming material obtained in Preparation Example 5 was spin-coated and dried at a temperature of 90 ° C. for 2 minutes using a hot plate (trade name SCW-636, manufactured by Dainippon Screen Mfg. Co., Ltd.). , A dry film was prepared. The prepared dry film was subjected to a parallel light mask aligner (trade name PLA-501F, manufactured by Canon Inc.) using an ultrahigh pressure mercury lamp as a light source, and an exposure amount of 40 mJ / cm ² (g, h) via a photomask. , I line). Then, using an automatic developing device (“AD-2000 (trade name)” manufactured by Takizawa Sangyo Co., Ltd.), it was developed with a 0.3 wt% tetramethylammonium aqueous solution for 50 seconds, and then rinsed with water for 30 seconds. bottom. Further, using an oven (trade name IHPS-222, manufactured by ESPEC CORPORATION), the mixture is heated in air at a temperature of 230 ° C. for 30 minutes, and is placed on a glass substrate with a height of 2.0 μm, a width of 20 μm, and a thickness of 1. A substrate with a light-shielding partition wall was obtained in which a partition wall having an OD value of 2.0 per 0 μm was formed in a grid pattern with a short side of 40 μm and a long side of 280 μm at pitch intervals.

Then, by the same method as in Example 32, a partition wall having a height of 10 μm and a width of 20 μm is formed on the light-shielding partition wall in a grid pattern similar to that of the light-shielding partition wall having a pitch interval of 40 μm on the short side and 280 μm on the long side. Obtained a substrate with. The color conversion luminescent material composition (CL-2) obtained in Preparation Example 2 was applied to the region of the obtained substrate with a partition wall separated by the partition wall in a nitrogen atmosphere by an inkjet method, and at 100 ° C. It was dried for 30 minutes to form pixels having a thickness of 5.0 μm, and a substrate with a partition wall having the configuration shown in FIG. 3 was obtained.

Example 61
The color obtained in Preparation Example 4 so that the film thickness after curing is 2.5 μm in the region separated by the partition wall of the substrate with the partition wall before pixel formation, which was obtained by the same method as in Example 32. A filter forming material (CF-1) was applied and vacuum dried. ^{Exposure was performed at an exposure amount of 40 mJ / cm 2} (g, h, i-line) through a photomask designed to expose the area of the opening of the substrate with a partition wall. After developing for 50 seconds with a 0.3 wt% tetramethylammonium aqueous solution, heat curing was performed at 230 ° C. for 30 minutes, and the height was 2.5 μm, the short side was 40 μm, and the long side was 280 μm in the region separated by the partition wall. A color filter layer was formed. Then, the color conversion luminescent material composition (CL-2) obtained in Preparation Example 2 was applied onto the color filter under a nitrogen atmosphere using an inkjet method, dried at 100 ° C. for 30 minutes, and the thickness was 5. A pixel of 0 μm was formed, and a substrate with a partition wall having the configuration shown in FIG. 4 was obtained.

Example 62
A 10 cm square non-alkali glass substrate (manufactured by AGC Technoglass Co., Ltd., thickness 0.7 mm) was used as the base substrate. On it, the light-shielding partition wall forming material obtained in Preparation Example 5 was spin-coated and dried at a temperature of 90 ° C. for 2 minutes using a hot plate (trade name SCW-636, manufactured by Dainippon Screen Mfg. Co., Ltd.). , A dry film was prepared. The prepared dry film was subjected to a parallel light mask aligner (trade name PLA-501F, manufactured by Canon Inc.) using an ultrahigh pressure mercury lamp as a light source, and an exposure amount of 40 mJ / cm ² (g, h) via a photomask. , I line). Then, using an automatic developing device (“AD-2000 (trade name)” manufactured by Takizawa Sangyo Co., Ltd.), it was developed with a 0.3 wt% tetramethylammonium aqueous solution for 50 seconds, and then rinsed with water for 30 seconds. bottom. Further, using an oven (trade name IHPS-222, manufactured by ESPEC CORPORATION), the mixture is heated in air at a temperature of 230 ° C. for 30 minutes, and is placed on a glass substrate with a height of 2.0 μm, a width of 20 μm, and a thickness of 1. A substrate with a light-shielding partition wall was obtained in which a partition wall having an OD value of 2.0 per 0 μm was formed in a grid pattern with a short side of 40 μm and a long side of 280 μm at pitch intervals.

Then, the color filter forming material (CF-1) obtained in Preparation Example 4 was applied to the region separated by the light-shielding partition wall so that the film thickness after curing was 2.5 μm, and vacuum-dried. ^{Exposure was performed at an exposure amount of 40 mJ / cm 2} (g, h, i-line) through a photomask designed to expose the area of the opening of the substrate with a partition wall. After developing for 50 seconds with a 0.3 wt% tetramethylammonium aqueous solution, heat curing was performed at 230 ° C. for 30 minutes, and the height was 2.5 μm, the short side was 40 μm, and the long side was 280 μm in the region separated by the partition wall. A color filter layer was formed.

Then, the low refractive index layer forming material obtained in Preparation Example 6 was spin-coated and dried at a temperature of 90 ° C. for 2 minutes using a hot plate (trade name SCW-636, manufactured by Dainippon Screen Mfg. Co., Ltd.). , A dry film was prepared. Further, using an oven (trade name IHPS-222, manufactured by ESPEC CORPORATION), the mixture is heated in air at a temperature of 90 ° C. for 30 minutes to form a low refractive index layer having a height of 1.0 μm and a refractive index of 1.25. bottom.

After that, a silicon nitride film having a film thickness of 300 nm, which corresponds to an inorganic protective layer I having a height of 50 to 1,000 nm, was formed on the low refractive index layer using a plasma CVD apparatus (PD-220NL, manufactured by SAMCO). Formed.

On top of these, a partition wall having a height of 10 μm and a width of 20 μm is formed in a grid pattern similar to a light-shielding partition wall having a short side of 40 μm and a long side of 280 μm in the same manner as in Example 32. Got The color conversion luminescent material composition (CL-2) obtained in Preparation Example 2 was applied to the region of the obtained substrate with a partition wall separated by the partition wall in a nitrogen atmosphere by an inkjet method, and at 100 ° C. It was dried for 30 minutes to form pixels having a thickness of 5.0 μm, and a substrate with a partition wall having the configuration shown in FIG. 9 was obtained.

Example 63
The plasma CVD apparatus ( PD-220NL (manufactured by SAMCO) was used to form a silicon nitride film having a film thickness of 300 nm, which corresponds to an inorganic protective layer III having a thickness of 50 to 1,000 nm. Further, the color conversion luminescent material composition (CL-2) obtained in Preparation Example 2 was applied onto the inorganic protective layer III under a nitrogen atmosphere using an inkjet method, dried at 100 ° C. for 30 minutes, and thickened. A 5.0 μm pixel was formed, and a substrate with a partition wall having the configuration shown in FIG. 11 was obtained.

Example 64
According to Preparation Example 7, a color filter layer having a thickness of 2.5 μm, a short side of 40 μm, and a long side of 280 μm, which was obtained by the same method as in Example 61, was formed on a color filter of a substrate with a partition wall before pixel formation. The obtained yellow organic protective layer forming material (YL-1) was applied and vacuum dried. ^{Exposure was performed at an exposure amount of 300 mJ / cm 2} (g, h, i-line) through a photomask designed to expose the area of the opening of the substrate with a partition wall. After developing with a 0.3 wt% tetramethylammonium aqueous solution for 50 seconds, it was heat-cured at 230 ° C. for 30 minutes to form a yellow organic protective layer having a thickness of 1.0 μm, a short side of 40 μm, and a long side of 280 μm. Further, the color conversion luminescent material composition (CL-2) obtained in Preparation Example 2 was applied onto the yellow organic protective layer under a nitrogen atmosphere using an inkjet method, dried at 100 ° C. for 30 minutes, and thickened. A 5.0 μm pixel was formed, and a substrate with a partition wall having the configuration shown in FIG. 11 was obtained.

Tables 3 to 5 show the configurations of each example and comparative example.

The evaluation methods in each example and comparative example are shown below.

<Refractive index of low refractive index layer>
The low refractive index layer forming material used in each example was applied onto a silicon wafer with a spinner, and a hot plate (trade name SCW-636, manufactured by Dainippon Screen Mfg. Co., Ltd.) was used at a temperature of 90 ° C. It was dried for 2 minutes. Then, using an oven (IHPS-222; manufactured by ESPEC CORPORATION), it was heated in air at 90 ° C. for 30 minutes to prepare a cured film. Using a prism coupler (PC-2000 (manufactured by Metrocon Co., Ltd.)), the cured film surface is irradiated with light having a wavelength of 550 nm from the vertical direction under atmospheric pressure and at 20 ° C., and the refractive index is measured. , Rounded to the third decimal place.

<Crack resistance>
The partition wall-forming resin compositions used in each Example and Comparative Example were spin-coated so that the film thicknesses after heating were 10 μm, 15 μm, 20 μm, and 25 μm, respectively. Regarding the subsequent steps of the partition wall forming resin composition used in Examples 36 to 60, Examples 62 to 71, and Comparative Examples 5 to 8, each embodiment was performed except that the entire surface was exposed without using a photomask at the time of exposure. A solid film was prepared on a glass substrate by processing under the same conditions as in the examples and comparative examples. The subsequent steps of the partition forming resin composition used in Example 61 were processed under the same conditions as in Example 62 except that bleaching was performed after development without exposure, and a solid film was formed on the glass substrate. Made. The obtained solid film was used as a model of the partition wall of the substrate with a partition wall obtained in each Example and Comparative Example, and the glass substrate having the solid film was visually observed to evaluate the presence or absence of cracks in the solid film. If even one crack was confirmed, it was judged that there was no crack resistance at that film thickness. For example, when there were no cracks when the film thickness was 15 μm and there were cracks when the film thickness was 20 μm, the crack resistance film thickness was determined to be “≧ 15 μm”. Further, the crack resistance film thickness when there was no crack even at 25 μm was determined as “≧ 25 μm”, and the crack resistance film thickness when there was a crack even at 10 μm was determined as “<10 μm”, respectively, and the crack resistance was determined.

<Resolution>
Using a spin coater (trade name 1H-360S, manufactured by Mikasa Co., Ltd.), the resin composition for partition walls used in each Example and Comparative Example was placed on a 10 cm square non-alkali glass substrate, and the film thickness after heating. Was spin-coated to a thickness of 10 μm and dried using a hot plate (trade name SCW-636, manufactured by Dainippon Screen Mfg. Co., Ltd.) at a temperature of 100 ° C. for 3 minutes to prepare a dry film having a film thickness of 10 μm. ..

The prepared dry film is used as a parallel light mask aligner (trade name: PLA-501F, manufactured by Canon Inc.) with an ultra-high pressure mercury lamp as a light source, and has widths of 100 μm, 80 μm, 60 μm, 50 μm, 40 μm, 30 μm, and 20 μm. Through a mask having the line & space pattern of, the exposure was performed at an exposure amount of 300 mJ / cm ² (g, h, i line) with a gap of 100 μm. Then, using an automatic developing device (“AD-2000 (trade name)” manufactured by Takizawa Sangyo Co., Ltd.), shower development was performed for 100 seconds using a 0.045 wt% potassium hydroxide aqueous solution, and then 30 using water. Rinse for seconds.

Using a microscope adjusted to a magnification of 100 times, the developed pattern was magnified and observed, and the narrowest line width was used as the resolution among the patterns in which no residue was observed in the unexposed area. However, when there was a residue in the unexposed portion near the pattern having a width of 100 μm, it was set to “> 100 μm”.

<Reflectance>
Except that the partition wall-forming resin compositions used in Examples 30 to 52, 54 to 59, and Comparative Examples 4 to 6 were entirely exposed without using a photomask at the time of exposure, they were different from each of the Examples and Comparative Examples. It was processed under the same conditions to prepare a solid film having a height of 10 μm on a glass substrate. The partition wall-forming resin composition used in Example 53 was processed under the same conditions as in Example 53 except that it was developed without exposure and then bleached, and a solid film having a height of 10 μm was formed on a glass substrate. Made. With respect to the obtained glass substrate having a solid film, a spectrocolorimeter (trade name CM-2600d, manufactured by Konica Minolta Co., Ltd.) was used to determine the reflectance at wavelengths of 450 nm, 550 nm and 630 nm from the solid film side in SCI mode. It was measured. However, when cracks or wrinkles were generated in the solid film, the reflectance was not measured because an accurate value could not be obtained due to the cracks or the like.

<OD value>
As a model of the partition wall of the substrate with a partition wall obtained in each Example and Comparative Example, a solid film having a height of 10 μm was prepared on the glass substrate in the same manner as in the evaluation of the reflectance. With respect to the obtained glass substrate having a solid film, the intensities of incident light and transmitted light were measured using an optical densitometer (U-4100 manufactured by Hitachi High-Tech Science), and wavelengths of 450 nm, 550 nm and 630 nm were measured by the above formula (1). The OD value in was calculated. Regarding the OD value, the solid film before the heating step and the OD value after the heating step were measured, and the differences are shown in Tables 6 to 8.

Further, for Examples 60 and 62, a solid film was similarly produced on a glass substrate as a model of the light-shielding partition wall (A-2). With respect to the obtained glass substrate having a solid film, the intensities of incident light and transmitted light were measured using an optical densitometer (U-4100 manufactured by Hitachi High-Tech Science), and calculated by the above formula (1).

<Weather resistance>
As a model of the partition wall of the substrate with a partition wall obtained in each Example and Comparative Example, a solid film having a height of 10 μm was prepared on the glass substrate in the same manner as in the evaluation of the reflectance. For the obtained glass substrate having a solid film, a spectrophotometer (trade name CM-2600d, manufactured by Konica Minolta Co., Ltd.) was used to chromaticity (L * value, a *) from the solid film side in SCI mode. And b * value) were measured. After that, the glass substrate having each solid film was set in a desktop xenon accelerated weathering tester (trade name: Q-SUN Xe-1, manufactured by Q-Lab), and light having a wavelength of 340 nm was irradiated at a dose of 0.42 W / m ^2, and subjected 100h weather resistance test under the conditions of the chamber temperature 45 ° C.. After that, the chromaticity (L * value, a * and b * values) of the glass substrate having each solid film is measured again from the solid film side in the SCI mode, and the amount of change ΔE of the reflected chromaticity coordinates is calculated by the following equation. Obtained according to (2).

ΔE = {(ΔL *) ² + (Δa *) ² + (Δb *) ² } ^1/2 ... (2)
The calculated ΔE was evaluated for weather resistance according to the following criteria. The smaller ΔE, the higher the weather resistance.

A: ΔE <3.0
B: 3.0 ≤ ΔE ≤ 6.0
C: 6.0 ≤ ΔE

<Taper angle>
In each Example and Comparative Example, an arbitrary cross section of the substrate with a partition wall before pixel formation was subjected to an acceleration voltage of 3.0 kV using an optical microscope (FE-SEM (S-4800); manufactured by Hitachi, Ltd.). It was observed and the taper angle was measured.

<Surface contact angle>
As a model of the partition wall in the partition wall-equipped substrate obtained in each Example and Comparative Example, a solid film having a height of 10 μm was prepared on the glass substrate in the same manner as in the evaluation of the reflectance. Regarding the surface of the obtained solid film, DM-700 manufactured by Kyowa Interface Science Co., Ltd., microsyringe: Teflon (registered trademark) coated needle 22G for contact angle meter manufactured by Kyowa Interface Science Co., Ltd. was used at 25 ° C. for the atmosphere. Among them, the surface contact angle was measured in accordance with the wettability test method for the surface of the substrate glass specified in JIS R3257 (establishment date = 1999/04/20). However, propylene glycol monomethyl ether acetate was used instead of water, and the contact angle between the surface of the solid film and propylene glycol monomethyl ether acetate was measured.

<Inkjet coatability>
In the substrate with a partition wall before forming the pixels obtained in each Example and Comparative Example, an inkjet coating device (InkjetLabo, Cluster Technology) (InkjetLabo, Cluster Technology) using PGMEA as an ink for the pixel portion surrounded by the grid-like partition walls. Inkjet coating was performed using (manufactured by Co., Ltd.). 160 pL of PGMEA was applied to one grid pattern, and the presence or absence of breakage (a phenomenon in which the ink got over the partition wall and mixed into the adjacent pixel portion) was observed, and the inkjet coatability was evaluated according to the following criteria. The smaller the number of breaks, the higher the liquid repellency and the better the inkjet coating property.

A: The ink did not overflow from the inside of the pixel.
B: Ink overflowed from the inside of the pixel to the upper surface of the partition wall in a part.
C: Ink overflowed from the inside of the pixel to the upper surface of the partition wall on the entire surface.

<Height>
For each layer of the substrate with partition wall obtained in each Example and Comparative Example, the film thickness before and after the formation of each layer was measured using a surfcom stylus type film thickness measuring device, and the difference was calculated to determine the height. It was measured.

Further, in Examples 62 to 63, a cross section perpendicular to the base substrate is exposed using a polishing device such as a cross section polisher, and the cross section is magnified and observed with a scanning electron microscope or a transmission electron microscope. , The height of each inorganic protective layer was measured.

<Change in OD value after low temperature heating>
Using the partition wall forming resin composition used in each Example and Comparative Example, the glass was used in the same manner as in the evaluation of the OD value described above, except that the final heating condition was changed to 60 minutes at 100 ° C. in air. A solid film having a height of 10 μm was prepared on the substrate. With respect to the obtained solid film, the OD value was calculated after measuring the intensities of incident light and transmitted light using an optical densitometer (U-4100 manufactured by Hitachi High-Tech Science) in the same manner as in the evaluation of the OD value described above. The solid film before the heating step and the OD value at a wavelength of 450 nm after the heating step were measured, and the difference was calculated to evaluate the change in the OD value during low-temperature heating according to the following criteria.

A: ΔOD value> 1.5
B: 0.5 ≤ ΔOD value ≤ 1.5
C: ΔOD value <0.5

<Low temperature curability>
Using the partition wall forming resin composition used in each Example and Comparative Example, a partition wall was formed in the same manner except that the final heating condition was changed to 60 minutes at 100 ° C. in air. The obtained substrate with a partition wall was inkjet-coated in the partition wall using 1,6-hexanediol diacrylate as an ink in the same manner as in the evaluation of the inkjet coatability described above. Then, the inside of the pixel was observed after 1 hour and 3 hours, and the low temperature curability of the partition wall was evaluated according to the following criteria. It is shown that the low temperature curability of the partition wall is excellent so that there is no exudation to the adjacent pixels.

A: No ink seepage to adjacent pixels even after 3 hours from inkjet application B: No ink seepage to adjacent pixels 1 hour after inkjet application, but 3 hours later Exudation was observed C: Immediately after the inkjet application, ink exudation was observed in the adjacent pixels.

<Storage stability>
The partition wall forming resin composition used in each Example and Comparative Example was evaluated in the same manner as the above-mentioned resolution evaluation immediately after preparation, after storage at 25 ° C. for 3 days, and after storage for 7 days. Storage stability was evaluated according to the following criteria.

A: Immediately after preparation, after storage at 25 ° C for 3 days, and after storage at 25 ° C for 7 days, there was no change in processable resolution. B: Evaluation immediately after preparation and after storage at 25 ° C for 3 days. In each case, there was no change in the processable resolution, but in the evaluation after storage at 25 ° C for 7 days, the processable resolution deteriorated. C: Compared with immediately after preparation, the evaluation after storage at 25 ° C for 3 days showed that. Processable resolution has deteriorated

<Brightness>
Using a planar light emitting device equipped with a commercially available LED backlight (peak wavelength 465 nm) as a light source, the substrates with partition walls obtained in each Example and Comparative Example were installed so that the pixel portion was on the light source side. A current of 30 mA is passed through this planar light emitting device to light the LED element, and a spectral radiance meter (CS-1000, manufactured by Konica Minolta) is used to measure the brightness (unit: cd / m ² ) based on the CIE 1931 standard. It was measured and used as the initial brightness. However, the evaluation of the brightness was performed by a relative value with the initial brightness of Example 69 as the standard 100.

Further, after the LED element was turned on for 48 hours at room temperature (23 ° C.), the brightness was measured in the same manner to evaluate the change in brightness with time. However, the evaluation of the brightness was performed by a relative value with the initial brightness of Example 69 as the standard 100.

<Color characteristics>
On a commercially available white reflector, the substrates with partition walls obtained in each Example and Comparative Example were installed so that the pixels were arranged on the white reflector side. Using a spectrophotometer (CM-2600d, manufactured by Konica Minolta, measurement diameter φ8 mm), light was irradiated from the base substrate side of the substrate with a partition wall, and the spectrum including specular reflected light was measured.

Color standard BT that can almost reproduce the colors of the natural world. The color gamut defined by 2020 defines red, green, and blue as the three primary colors on the spectral locus shown in the chromaticity diagram, and the wavelengths of red, green, and blue correspond to 630 nm, 532 nm, and 467 nm, respectively. From the reflectance (R) of three wavelengths of 470 nm, 530 nm and 630 nm of the obtained reflection spectrum, the emission color of the pixel was evaluated according to the following criteria.

A: R ₅₃₀ / (R ₆₃₀ + R ₅₃₀ + R ₄₇₀ ) ≧ 0.55
B: R ₅₃₀ / (R ₆₃₀ + R ₅₃₀ + R ₄₇₀ ) <0.55.

<Display characteristics>
The display characteristics of the display device manufactured by combining the substrate with a partition wall and the organic EL element obtained in each Example and Comparative Example were evaluated based on the following criteria.

A: The green display is very colorful, and it is a clear and high-contrast display device.
B: This is a display device that has no problem, although the colors are slightly unnatural.

<Mixed color>
In the substrate with a partition wall before forming the pixels, which was obtained in each Example and Comparative Example, a color-converted light-emitting material composition (a color-converted light-emitting material composition) was used on a part of the pixel portion surrounded by the lattice-shaped partition walls by using an inkjet method. CL-2) was applied and dried at 100 ° C. for 30 minutes to form pixels having a thickness of 5.0 μm. Then, in the pixel portion surrounded by the lattice-shaped partition wall, the area adjacent to the area to which the color conversion light emitting material composition (CL-2) is applied is subjected to the color conversion light emitting material composition (CL) by using the inkjet method. -3) was applied and dried at 100 ° C. for 30 minutes to form pixels having a thickness of 5.0 μm.

On the other hand, a blue organic EL cell having the same width as the pixel portion surrounded by the lattice-shaped partition wall is produced, the above-mentioned substrate with partition wall and the blue organic EL cell are opposed to each other and bonded with a sealing agent, and is shown in FIG. Obtained a configuration display.

Of the blue organic EL cells 11 in FIG. 15, only the blue organic EL cells bonded directly under the pixel 3 (CL-2) formed of the color conversion light emitting material composition (CL-2) are lit. , Absorption intensity at a wavelength of 630 nm for the pixel 3 (CL-3) portion formed of the color conversion light emitting material composition (CL-3) using a microspectrophotometer LVmicro-V (manufactured by Lambda Vision Co., Ltd.). A (630 nm) was measured. The smaller the value of the absorption intensity A (630 nm), the less likely it is that color mixing will occur. Color mixing was determined according to the following criteria.

A: A (630 nm) <0.01
B: 0.01 ≤ A (630 nm) ≤ 0.5
C: 0.5 <A (630 nm).

Tables 6 to 8 show the evaluation results of each example and comparative example.

1 Base substrate 2 Partition 3 Pixels 3 (CL-2) Pixels formed of color conversion luminescent material composition (CL-2) 3 (CL-3) Pixels formed of color conversion luminescent material composition (CL-3) Pixel 4 Light-shielding partition 5 Color filter 6 Low refractive index layer 7 Inorganic protective layer I
8 Inorganic protective layer II
9 Inorganic protective layer III and / or yellow organic protective layer 10 Inorganic protective layer IV and / or yellow organic protective layer 11 Light source selected from organic EL cell, mini LED cell and micro LED cell 12 Blue organic EL cell H partition Thickness L Partition width θ Taper angle

Claims

A resin composition containing a resin, a photopolymerization initiator or a quinonediazide compound, a white pigment and / or a light-shielding pigment, an organic silver compound, and a reducing agent.
The resin composition according to claim 1, wherein the reducing agent is a compound containing two or more phenolic hydroxyl groups in the molecule or a compound containing an enol group.
The resin composition according to claim 1 or 2, wherein the organic silver compound is a compound represented by the following general formula (1).

(In the general formula (1), R 1 represents hydrogen or an organic group having 1 to 30 carbon atoms.)
The resin composition according to claim 1 or 2, wherein the organic silver compound is a polymer compound having at least a structure represented by the following general formula (2).

(In the general formula (2), R 2 and R 3 independently represent hydrogen or an organic group having 1 to 30 carbon atoms).
The resin composition according to any one of claims 1 to 4, wherein the reducing agent is a hydroquinone compound represented by the following general formula (3).

(In the general formula (3), R 4 , R 5 , R 6 and R 7 independently represent hydrogen, a hydroxy group, or an organic group having 1 to 30 carbon atoms).
The resin composition according to any one of claims 1 to 5, wherein the resin is a polysiloxane having a styryl group.
The resin composition according to any one of claims 1 to 6, further containing a liquid-repellent compound having a photoradical polymerizable group.
A light-shielding film obtained by curing the resin composition according to any one of claims 1 to 7.
A substrate with a partition wall having a partition wall (A-1) formed by the resin composition according to any one of claims 1 to 7 on a base substrate, and a reflectance per 10 μm thickness at a wavelength of 450 nm. Is 10% to 60%, and the OD value per 10 μm thickness at a wavelength of 450 nm is 1.5 to 5.0.
A substrate with a partition wall having (A-1) patterned partition walls on the base substrate, wherein the pattern-formed partition walls are a resin, a white pigment and / or a light-shielding pigment, silver oxide and / or silver. A substrate with a partition wall containing particles and a quinone compound.
The substrate with a partition wall according to claim 9, wherein the partition wall formed with the (A-1) pattern contains a resin, a white pigment, silver oxide and / or silver particles.
The (A-1) pattern-formed partition wall further contains a liquid-repellent compound, and the content of the liquid-repellent compound in the (A-1) pattern-formed partition wall is 0.01% by weight to 10% by weight. The substrate with a partition wall according to any one of claims 9 to 11.
A patterned light-shielding partition wall having an OD value of 0.5 or more per (A-2) thickness of 1.0 μm is further provided between the base substrate and the (A-1) patterned partition wall. The substrate with a partition wall according to any one of claims 9 to 12.
The substrate with a partition wall according to any one of claims 9 to 13, further comprising a pixel layer containing the (B) color conversion light emitting material arranged separated by the partition wall formed with the (A-1) pattern.
The substrate with a partition wall according to claim 14, wherein the color conversion light emitting material contains a phosphor selected from quantum dots and a pyrromethene derivative.
The substrate with a partition wall according to claim 14 or 15, further comprising a color filter having a thickness of 1 to 5 μm between the base substrate and the pixel layer containing the (B) color conversion light emitting material.
A display device having the substrate with a partition wall according to any one of claims 9 to 16 and a light emitting light source selected from a liquid crystal cell, an organic EL cell, a mini LED cell, and a micro LED cell.