KR102624898B1 - Resin composition, light-blocking film, method for producing light-blocking film, and substrate having partitioning wall attached thereto - Google Patents

Abstract

A resin composition containing a resin, an organometallic compound containing at least one metal selected from the group consisting of silver, gold, platinum, and palladium, a photopolymerization initiator or a quinonediazide compound, and a solvent. A resin composition that forms a partition having both high reflectance and high light-shielding properties, even under heating conditions of 250°C or lower, is provided.

Description

Resin composition, light-shielding film, manufacturing method of light-shielding film, and barrier-equipped substrate

The present invention relates to a resin composition, a light-shielding film formed from the resin composition, a method of manufacturing the light-shielding film, and a barrier rib-equipped substrate having patterned barrier ribs.

Liquid crystal displays, which are a type of image display device, generally display color using a white light source such as LED and a color filter that selectively passes red, green, and blue. However, color display using such color filters has poor light use efficiency and has problems with color reproducibility.

Therefore, as a color display device with increased light utilization efficiency, a color display device including a wavelength conversion unit including a phosphor for wavelength conversion, a polarization separation unit, and a polarization conversion unit has been proposed (for example, Patent Document 1 reference). For example, a blue light source, a liquid crystal element, a phosphor that is excited by blue light and emits red fluorescence, a phosphor that is excited by blue light and emits green fluorescence, and a wavelength converter having a light scattering layer that scatters blue light. A color display device has been proposed (for example, see Patent Document 2).

However, color filters containing color conversion phosphors as described in Patent Documents 1 and 2 have low light extraction efficiency and insufficient luminance because fluorescence is generated in all directions. In particular, in high-precision display devices called 4K and 8K, as the pixel size becomes smaller, the problem of luminance becomes more significant, and higher luminance is required.

Japanese Patent Publication No. 2000-131683 Japanese Patent Publication No. 2009-244383 Japanese Patent Publication No. 2000-347394 Japanese Patent Publication No. 2006-259421

In order to improve the luminance of a display device, it is effective to increase the reflectance of the partition separating the color conversion phosphors. Additionally, in order to prevent color mixing of light between adjacent pixels, it is necessary to increase the light-blocking properties of the partition. From the above, a barrier material that has both high reflectance and light-shielding properties is required.

In order to form a partition having both high reflectivity and light-shielding properties, the inventors first examined a method of using a material in which black pigment was added to a white partition material with high reflectivity. However, in this method, light is absorbed by the white pigment and black pigment during exposure, and the problem that the pattern processability is poor because the light does not reach the bottom of the film became clear.

On the other hand, as described in Patent Documents 3 and 4, a technique for blackening by adding a specific metal compound and baking after pattern formation has been proposed. However, these blackening technologies require firing at 400°C or higher, and have the problem that light-shielding properties do not improve with heating at 250°C or lower.

Therefore, the purpose of the present invention is to provide a resin composition capable of forming a partition having both high reflectance and light-shielding properties even under heating conditions of 250°C or lower.

The present invention is a resin composition containing a resin, an organometallic compound containing at least one metal selected from the group consisting of silver, gold, platinum, and palladium, a photopolymerization initiator or a quinonediazide compound, and a solvent.

The resin composition of the present invention allows light to pass through during the pattern exposure process after film formation, but its light-shielding properties increase after the exposed film is heated to a temperature of 120°C or higher and 250°C or lower, so it has a high reflectance even under heating conditions of 250°C or lower. It is possible to form a fine thick film barrier pattern with high light blocking properties.

1 is a cross-sectional view showing one aspect of the barrier rib-equipped substrate of the present invention having patterned barrier ribs.
Fig. 2 is a cross-sectional view showing one aspect of the barrier rib-equipped substrate of the present invention, which has patterned barrier ribs and pixels containing a color conversion light-emitting material.
Figure 3 is a cross-sectional view showing one aspect of the barrier rib-equipped substrate of the present invention having a low refractive index layer.
Fig. 4 is a cross-sectional view showing one aspect of the substrate with a barrier rib of the present invention having a low refractive index layer and an inorganic protective layer I.
Fig. 5 is a cross-sectional view showing one aspect of the barrier rib-equipped substrate of the present invention having a low refractive index layer and an inorganic protective layer II.
Fig. 6 is a cross-sectional view showing one aspect of the substrate with a partition of the present invention having a color filter.
Fig. 7 is a cross-sectional view showing one aspect of the substrate with a partition of the present invention having a color filter, an inorganic protective layer III, and/or a yellow organic protective layer.
Fig. 8 is a cross-sectional view showing one aspect of the substrate with a partition of the present invention having a color filter, an inorganic protective layer IV, and/or a yellow organic protective layer.
Fig. 9 is a cross-sectional view showing one aspect of the substrate with a barrier rib of the present invention having a light-shielding barrier rib.
Fig. 10 is a cross-sectional view showing the configuration of a display device used for color mixing evaluation in the example.

Hereinafter, preferred embodiments of the resin composition, the light-shielding film formed from the resin composition, the manufacturing method of the light-shielding film, and the substrate with partitions according to the present invention will be described in detail. However, the present invention is not limited to the following embodiments, and the purpose or It can be implemented in various ways depending on the purpose.

The resin composition of the present invention can be suitably used as a material for forming a partition separating color conversion phosphors. The resin composition of the present invention includes a resin, an organometallic compound (hereinafter sometimes referred to as an "organometallic compound") containing at least one metal selected from the group consisting of silver, gold, platinum, and palladium, It is preferable to contain a photopolymerization initiator or a quinonediazide compound and a solvent.

The resin has the function of improving the crack resistance and light resistance of the partition wall. The content of the resin in the solid content of the resin composition is preferably 10% by weight or more, and more preferably 20% by weight or more, from the viewpoint of improving the crack resistance of the partition during heat treatment. On the other hand, from the viewpoint of improving light resistance, the content of the resin in the solid content of the resin composition is preferably 60% by weight or less, and more preferably 50% by weight or less. Here, solid content means all components included in the resin composition excluding volatile components such as solvents. The amount of solid content can be determined by heating the resin composition and counting the remaining content after evaporating the volatile components.

Examples of the resin include polysiloxane, polyimide, polyimide precursor, polybenzoxazole, polybenzoxazole precursor, (meth)acrylic polymer, etc. Here, (meth)acrylic polymer means a polymer of methacrylic acid ester and/or acrylic acid ester. You may contain two or more of these. Among these, polysiloxane is preferable because it is excellent in transparency, heat resistance, and light resistance.

Polysiloxane is a hydrolyzed and dehydrated condensate of organosilane. When the resin composition of the present invention has negative photosensitivity, the polysiloxane preferably contains at least a repeating unit represented by the following general formula (2). Additionally, other repeating units may be included. By including a repeating unit derived from a bifunctional alkoxysilane compound represented by general formula (2), excessive thermal polymerization (condensation) of polysiloxane due to heating can be suppressed and crack resistance of the partition can be improved. Of all the repeating units in the polysiloxane, it is preferable to contain 10 to 80 mol% of the repeating unit represented by General Formula (2). By containing 10 mol% or more of the repeating unit represented by General Formula (2), crack resistance can be further improved. The content of the repeating unit represented by General Formula (2) is more preferably 15 mol% or more, and even more preferably 20 mol% or more. On the other hand, by including 80 mol% or less of the repeating unit represented by General Formula (2), the molecular weight of the polysiloxane can be sufficiently increased during polymerization to improve coatability. The content of the repeating unit represented by General Formula (2) is more preferably 70 mol% or less.

In the general formula (2), R ¹ and R ² may be the same or different, and represent a monovalent organic group having 1 to 20 carbon atoms. R ¹ and R ² are preferably groups selected from an alkyl group having 1 to 6 carbon atoms and an aryl group having 6 to 12 carbon atoms from the viewpoint of facilitating adjustment of the molecular weight of the polysiloxane during polymerization. However, in the alkyl group and the aryl group, at least part of the hydrogen may be substituted by a radical polymerizable group. In this case, in the cured product of the negative photosensitive resin composition, the radical polymerizable group may be radically polymerized.

When the resin composition of the present invention has negative photosensitivity, the polysiloxane preferably further contains a repeating unit selected from the repeating unit represented by the following general formula (3) and the repeating unit represented by the following general formula (4) . By including a repeating unit derived from a fluorine-containing alkoxysilane compound represented by General Formula (3) or General Formula (4), the refractive index of polysiloxane is reduced, and when it contains the white pigment described later, the refractive index with the white pigment is reduced. By enlarging the difference, the interface reflection can be further improved, and the reflectance can be further improved. It is more preferable to contain a total of 20 to 80 mol% of the repeating unit selected from the repeating unit represented by General Formula (3) and the repeating unit represented by General Formula (4) in the polysiloxane. By containing a total of 20 mol% or more of the repeating unit represented by the general formula (3) and the repeating unit represented by the general formula (4), the reflection at the interface between the polysiloxane and the white pigment is further improved when the white pigment described later is contained. By doing so, the reflectance can be further improved. The total content of the repeating unit represented by General Formula (3) and the repeating unit represented by General Formula (4) is more preferably 40 mol% or more. On the other hand, by containing a total of 80 mol% or less of the repeating unit represented by general formula (3) and the repeating unit represented by general formula (4), excessive hydrophobization of polysiloxane is suppressed and compatibility with other components in the composition is improved. and the resolution can be improved. The total content of the repeating unit represented by General Formula (3) and the repeating unit represented by General Formula (4) is more preferably 70 mol% or less. Additionally, other repeating units may be included.

In the general formulas (3) and (4), R ³ represents an alkyl group, alkenyl group, aryl group, or arylalkyl group having 1 to 10 carbon atoms in which all or part of hydrogen is replaced with fluorine. R ⁴ represents a single bond, -O-, -CH ₂ -CO-, -CO-, or -O-CO-. R ⁵ represents a monovalent organic group having 1 to 20 carbon atoms. R ³ is preferably an alkyl group of 1 to 6 carbon atoms in which all or part of hydrogen is replaced with fluorine from the viewpoint of further reducing the refractive index of polysiloxane. Additionally, in the photocured product of the negative photosensitive resin composition, the alkenyl group may be radically polymerized.

The repeating units represented by the general formulas (2) to (4) are derived from alkoxysilane compounds represented by the following general formulas (5) to (7), respectively. That is, the polysiloxane containing repeating units represented by the general formulas (2) to (4) hydrolyzes and condenses the alkoxysilane compound containing the alkoxysilane compound represented by the general formulas (5) to (7) below. It can be obtained by combining. Additionally, other alkoxysilane compounds may be used.

In the general formulas (5) to (7), R ¹ to R ⁵ each represent the same group as R ¹ to R ⁵ in the general formulas (2) to (4). R ⁶ may be the same or different, and represents a monovalent organic group having 1 to 20 carbon atoms, and an alkyl group having 1 to 6 carbon atoms is preferable.

Examples of the alkoxysilane compound represented by general formula (5) include dimethyldimethoxysilane, dimethyldiethoxysilane, ethylmethyldimethoxysilane, ethylmethyldimethoxysilane, methylpropyldimethoxysilane, methylpropyldiethoxysilane, Diphenyldimethoxysilane, diphenyldiethoxysilane, cyclohexylmethyldimethoxysilane, cyclohexylmethyldiethoxysilane, vinylmethyldimethoxysilane, vinylmethyldiethoxysilane, allylmethyldimethoxysilane, allylmethyldiethoxysilane, Styrylmethyldimethoxysilane, styrylmethyldiethoxysilane, γ-methacryloylpropylmethyldimethoxysilane, γ-methacryloylpropylmethyldiethoxysilane, γ-acryloylpropylmethyldimethoxysilane, γ -Acryloylpropylmethyldiethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 2-(3,4-epoxycyclohexyl)ethylmethyldimethoxysilane, 2 -(3,4-Epoxycyclohexyl)ethyl ethyldimethoxysilane, diphenyldimethoxysilane, diphenyldiethoxysilane, 3-dimethylmethoxysilylpropylsuccinic anhydride, 3-dimethylethoxysilylpropylsuccinic anhydride, 3- Dimethylmethoxysilylpropionic acid, 3-dimethylethoxysilylpropionic acid, 3-dimethylmethoxysilylpropylcyclohexyldicarboxylic acid anhydride, 3-dimethylethoxysilylpropylcyclohexyldicarboxylic acid anhydride, 5-dimethylmethoxysilyl Valeric acid, 5-dimethylethoxysilylvaleric acid, 3-dimethylmethoxysilylpropylphthalic anhydride, 3-dimethylethoxysilylpropylphthalic anhydride, 3-dimethylmethoxysilylpropylphthalic anhydride, 3-dimethylethoxysilylpropylphthalic acid Examples include anhydride, 4-dimethylmethoxysilylbutyric acid, and 4-dimethylethoxysilylbutyric acid. You may use two or more of these.

Examples of the alkoxysilane compound represented by general formula (6) include trifluoropropyltrimethoxysilane, trifluoropropyltriethoxysilane, perfluoropentyltrimethoxysilane, and perfluoropentyltriethoxysilane. Silane, tridecafluorooctyltrimethoxysilane, tridecafluorooctyltriethoxysilane, tridecafluorooctyltripropoxysilane, tridecafluorooctyltriisopropoxysilane, heptadecafluorodecyl Trimethoxysilane, heptadecafluorodecyltriethoxysilane, etc. are mentioned. You may use two or more of these.

Alkoxysilane compounds represented by general formula (7) include bis(trifluoromethyl)dimethoxysilane, bis(trifluoropropyl)dimethoxysilane, bis(trifluoropropyl)diethoxysilane, and trifluoropropylmethyl. Dimethoxysilane, trifluoropropylmethyldiethoxysilane, trifluoropropylethyldimethoxysilane, trifluoropropylethyldiethoxysilane, and heptadecafluorodecylmethyldimethoxysilane. You may use two or more of these.

Other alkoxysilane compounds include, for example, methyltrimethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, propyltrimethoxysilane, propyltriethoxysilane, and isobutyltrime. Toxysilane, isobutyltriethoxysilane, cyclohexyltrimethoxysilane, cyclohexyltriethoxysilane, 3-isocyanatepropyltrimethoxysilane, 3-isocyanatepropyltriethoxysilane, 3-aminopropyltrimethoxysilane, trifunctional alkoxysilane compounds such as 3-aminopropyltriethoxysilane, 3-ureidopropyltrimethoxysilane, and 3-ureidopropyltriethoxysilane; tetrafunctional alkoxysilane compounds such as tetramethoxysilane, tetraethoxysilane, and silicate 51 (tetraethoxysilane oligomer); Monofunctional alkoxysilane compounds such as trimethylmethoxysilane and triphenylmethoxysilane; 3-Glycidoxypropyltrimethoxysilane, 3-Glycidoxypropyltriethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 2-(3,4-epoxycyclohexyl) Ethyltriethoxysilane, 3-ethyl-3-{[3-(triethoxysilyl)propoxy]methyl}oxetane, 3-ethyl-3-{[3-(triethoxysilyl)propoxy]methyl }Alkoxysilane compounds containing epoxy groups or oxetane groups such as oxetane: phenyltrimethoxysilane, phenyltriethoxysilane, 1-naphthyltrimethoxysilane, 2-naphthyltrimethoxysilane, 2-naphthyltrimethoxysilane , 2-naphthyltrimethoxysilane, tolyltrimethoxysilane, tolyltriethoxysilane, 1-phenylethyltrimethoxysilane, 1-phenylethyltriethoxysilane, 2-phenylethyltrimethoxysilane, 2- aromatic ring-containing alkoxysilane compounds such as phenylethyltriethoxysilane, 3-trimethoxysilylpropylphthalic anhydride, and 3-triethoxysilylpropylphthalic anhydride; Styryltrimethoxysilane, styryltriethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, allyltrimethoxysilane, allyltriethoxysilane, γ-acryloylpropyltrimethoxysilane, γ -Alkoxysilane compounds containing radical polymerizable groups such as acryloylpropyltriethoxysilane, γ-methacryloylpropyltrimethoxysilane, and γ-methacryloylpropyltriethoxysilane; 3-trimethoxysilylpropionic acid, 3-triethoxysilylpropionic acid, 4-trimethoxysilylbutyric acid, 4-triethoxysilylbutyric acid, 5-trimethoxysilylvaleric acid, 5-triethoxysilylvaleric acid, 3-Trimethoxysilylpropylsuccinic anhydride, 3-triethoxysilylpropylsuccinic anhydride, 3-trimethoxysilylpropylcyclohexyldicarboxylic acid anhydride, 3-triethoxysilylpropylcyclohexyldicarboxylic acid anhydride , carboxyl group-containing alkoxysilane compounds such as 3-trimethoxysilylpropylphthalic anhydride and 3-triethoxysilylpropylphthalic anhydride.

The content of the alkoxysilane compound represented by the general formula (5) in the alkoxysilane compound serving as the raw material for polysiloxane is the content of the repeating unit represented by the general formula (2) in all repeating units of the polysiloxane within the range described above. From this viewpoint, 10 mol% or more is preferable, 15 mol% or more is more preferable, and 20 mol% or more is still more preferable. On the other hand, from the same viewpoint, the content of the alkoxysilane compound represented by the general formula (5) is preferably 80 mol% or less, and more preferably 70 mol% or less. In addition, regarding the total content of the alkoxysilane compounds represented by General Formula (6) and General Formula (7), the total content of repeating units represented by General Formula (3) and General Formula (4) is set to the above-mentioned range. From a viewpoint, 20 mol% or more is preferable, and 40 mol% or more is more preferable. On the other hand, from the same viewpoint, the total content of the alkoxysilane compounds represented by the general formulas (6) and (7) is preferably 80 mol% or less, and more preferably 70 mol% or less.

The weight average molecular weight (Mw) of polysiloxane is preferably 1,000 or more, and more preferably 2,000 or more from the viewpoint of coatability. On the other hand, from the viewpoint of developability, the Mw of polysiloxane is preferably 50,000 or less, and more preferably 20,000 or less. Here, the Mw of polysiloxane in the present invention refers to the polystyrene conversion value measured by gel permeation chromatography (GPC).

Polysiloxane can be obtained by hydrolyzing the above-mentioned organosilane compound and then subjecting the hydrolyzate to a dehydration condensation reaction in the presence of a solvent or without a solvent.

Various conditions for hydrolysis can be set according to physical properties suitable for the intended use, taking into account the reaction scale, size and shape of the reaction vessel, etc. Examples of various conditions include acid concentration, reaction temperature, reaction time, etc.

For the hydrolysis reaction, acid catalysts such as hydrochloric acid, acetic acid, formic acid, nitric acid, oxalic acid, hydrochloric acid, sulfuric acid, phosphoric acid, polyphosphoric acid, polyhydric carboxylic acid or its anhydride, and ion exchange resin can be used. Among these, an acidic aqueous solution containing an acid selected from formic acid, acetic acid and phosphoric acid is preferable.

When using an acid catalyst in the hydrolysis reaction, the amount of the acid catalyst added is preferably 0.05 parts by weight or more, and 0.1 part by weight based on 100 parts by weight of the total alkoxysilane compounds used in the hydrolysis reaction, from the viewpoint of making the hydrolysis progress more quickly. Parts by weight or more is more preferable. On the other hand, from the viewpoint of appropriately controlling the progress of the hydrolysis reaction, the amount of acid catalyst added is preferably 20 parts by weight or less, and more preferably 10 parts by weight or less, based on 100 parts by weight of the total alkoxysilane compound. Here, the total amount of alkoxysilane compounds refers to the amount including all of the alkoxysilane compound, its hydrolyzate, and its condensate. The same applies below.

The hydrolysis reaction can be performed in a solvent. The solvent can be appropriately selected considering the stability, wettability, volatility, etc. of the resin composition.

When a solvent is produced through a hydrolysis reaction, it is also possible to perform hydrolysis in the absence of a solvent. When used in a resin composition, it is also preferable to adjust the resin composition to an appropriate concentration by further adding a solvent after completion of the hydrolysis reaction. In addition, it is also possible to distill or remove all or part of the produced alcohol, etc., by heating and/or under reduced pressure after hydrolysis, and then add a suitable solvent.

When a solvent is used in the hydrolysis reaction, the amount of solvent added is preferably 50 parts by weight or more, and more preferably 80 parts by weight or more, based on 100 parts by weight of the total alkoxysilane compound, from the viewpoint of suppressing gel formation. On the other hand, the amount of solvent added is preferably 500 parts by weight or less, and more preferably 200 parts by weight or less, based on 100 parts by weight of the total alkoxysilane compound, from the viewpoint of promoting hydrolysis more quickly.

Additionally, ion-exchanged water is preferable as water used in the hydrolysis reaction. The amount of water can be set arbitrarily, but is preferably 1.0 to 4.0 mol per mole of the total alkoxysilane compound.

Examples of the dehydration condensation reaction include a method of heating the silanol compound solution obtained through the hydrolysis reaction of the organosilane compound as is. The heating temperature is preferably 50°C or higher and the boiling point or lower of the solvent, and the heating time is preferably 1 to 100 hours. Additionally, reheating or addition of a base catalyst may be performed to increase the degree of polymerization of polysiloxane. Additionally, depending on the purpose, after the dehydration condensation reaction, an appropriate amount of the resulting alcohol or the like may be distilled and removed under heating and/or reduced pressure, and then a suitable solvent may be added.

From the viewpoint of storage stability of the resin composition, it is preferable that the siloxane resin solution after hydrolysis and dehydration condensation does not contain the catalyst, and the catalyst can be removed as necessary. As a catalyst removal method, water washing, treatment with an ion exchange resin, etc. are preferable from the viewpoint of simplicity of operation and removability. Water washing is a method of diluting a polysiloxane solution with an appropriate hydrophobic solvent, washing the solution several times with water, and then concentrating the obtained organic layer using an evaporator or the like. Treatment with an ion exchange resin is a method of bringing a polysiloxane solution into contact with an appropriate ion exchange resin.

The organometallic compound decomposes and aggregates in the exposure process and/or the heating process when forming the pattern of the barrier rib (A-1) described later, thereby forming black particles or yellow particles, and forms the barrier rib (A-1) described later. It has the function of improving OD value. Since the OD value is low before exposure and the OD value increases after pattern formation, in the exposure process, the exposed light can be sufficiently transmitted to the bottom to cause photocuring or photodecomposition. For example, in the case of a resin composition having negative photosensitivity, if a pattern is formed using a resin composition containing a large amount of black pigment in advance to form a partition (A-1) with a high OD value, the Photocuring tends to be insufficient. As a result, the shape of the obtained partition wall A-1 tends to be inversely tapered. When a pattern is formed using the resin composition of the present invention containing the above-described organometallic compound, the taper angle can be easily set to the preferable range described later because the bottom portion is sufficiently photocured.

Examples of the organometallic compound include silver-containing organometallic compounds such as silver neodecanoate, silver octylate, and silver salicylate; Organometallic compounds containing gold such as chloro(triphenylphosphine)gold and tetrachloroauric acid tetrahydrate; Organometallic compounds containing platinum, such as bis(acetylacetonato)platinum, dichlorobis(triphenylphosphine)platinum, and dichlorobis(benzonitrile)platinum; Organometallic compounds containing palladium, such as bis(acetylacetonato)palladium, dichlorobis(triphenylphosphine)palladium, dichlorobis(benzonitrile)palladium, tetrakis(triphenylphosphine)palladium, and dibenzylideneacetonepalladium. etc. can be mentioned. You may contain two or more of these.

Among these, neodecanoic acid, if it contains organometallic compounds containing silver such as silver octylate or silver salicylate, turns black by decomposing and agglomerating in the exposure process, and turns yellow by further decomposing and agglomerating in the subsequent heating process. do.

On the other hand, organometallic compounds containing platinum such as bis(acetylacetonato)platinum, dichlorobis(triphenylphosphine)platinum, and dichlorobis(benzonitrile)platinum; Organometallic compounds selected from palladium, such as bis(acetylacetonato)palladium, dichlorobis(triphenylphosphine)palladium, dichlorobis(benzonitrile)palladium, tetrakis(triphenylphosphine)palladium, and dibenzylideneacetonepalladium. If contained, it blackens by decomposing and agglomerating in the exposure process and/or heating process.

Among these, from the viewpoint of further improving the OD value, organic metals selected from bis(acetylacetonato)palladium, dichlorobis(triphenylphosphine)palladium, dichlorobis(benzonitrile)palladium, and tetrakis(triphenylphosphine)palladium. Compounds are preferred.

In the resin composition of the present invention, the content of the organometallic compound in the solid content is preferably 0.2 to 5% by weight. By setting the content of the organometallic compound to 0.2% by weight or more, the OD value of the obtained partition can be further improved. The content of the organometallic compound is more preferably 1.5% by weight or more. On the other hand, the reflectance can be further improved by setting the content of the organometallic compound to 5% by weight or less.

When the resin composition of the present invention is used to form a pattern of a partition (A-1) described later, it is preferable to have negative or positive photosensitivity. In the case of imparting negative photosensitivity, it is preferable to contain a photopolymerization initiator, and partition walls in a high-precision pattern can be formed. It is preferable that the negative photosensitive resin composition further contains a photopolymerizable compound. On the other hand, when providing positive photosensitivity, it is preferable to contain a quinonediazide compound.

The photopolymerization initiator may be any one as long as it decomposes and/or reacts upon irradiation of light (including ultraviolet rays and electron beams) to generate radicals. For example, 2-methyl-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholine α-aminoalkylphenone compounds such as -4-yl-phenyl)-butan-1-one and 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1; 2,4,6-trimethylbenzoylphenylphosphine oxide, bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide, bis(2,6-dimethoxybenzoyl)-(2,4,4-trimethylpentyl )-Acylphosphine oxide compounds such as phosphine oxide; 1-phenyl-1,2-propanedione-2-(O-ethoxycarbonyl)oxime, 1,2-octanedione-1-[4-(phenylthio)-2-(O-benzoyloxime)], 1-phenyl-1,2-butadione-2-(O-methoxycarbonyl)oxime, 1,3-diphenylpropanetrione-2-(O-ethoxycarbonyl)oxime, ethanone-1- Oxime ester compounds such as [9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-1-(O-acetyloxime); Benzyl ketal compounds such as benzyl dimethyl ketal; 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1-(4-isopropylphenyl)-2-hydroxy-2-methylpropan-1-one, 4-(2-hydroxy α-hydroxyketone compounds such as toxy)phenyl-(2-hydroxy-2-propyl)ketone and 1-hydroxycyclohexyl-phenylketone; Benzophenone, 4,4-bis(dimethylamino)benzophenone, 4,4-bis(diethylamino)benzophenone, o-benzoylmethyl benzoate, 4-phenylbenzophenone, 4,4-dichlorobenzophenone, hydroxy Benzophenone compounds such as benzophenone, 4-benzoyl-4'-methyl-diphenyl sulfide, alkylated benzophenone, and 3,3',4,4'-tetra(t-butylperoxycarbonyl)benzophenone; Acetophenone compounds such as 2,2-diethoxyacetophenone, 2,3-diethoxyacetophenone, 4-t-butyldichloroacetophenone, benzalacetophenone, and 4-azidebenzalacetophenone; aromatic keto ester compounds such as methyl 2-phenyl-2-oxyacetate; and benzoic acid ester compounds such as ethyl 4-dimethylaminobenzoate, (2-ethyl)hexyl 4-dimethylaminobenzoate, ethyl 4-diethylaminobenzoate, and methyl 2-benzoylbenzoate. You may contain two or more of these.

From the viewpoint of effectively advancing radical hardening, the content of the photopolymerization initiator in the resin composition of the present invention is preferably 0.01% by weight or more, and more preferably 1% by weight or more based on the solid content. On the other hand, from the viewpoint of suppressing elution of the remaining photopolymerization initiator and further improving yellowing, the content of the photopolymerization initiator is preferably 20% by weight or less, and more preferably 10% by weight or less, based on the solid content.

The photopolymerizable compound in the present invention refers to a compound having two or more ethylenically unsaturated double bonds in the molecule. Considering the ease of radical polymerization, it is preferable that the photopolymerizable compound has a (meth)acrylic group.

Examples of photopolymerizable compounds include diethylene glycol diacrylate, triethylene glycol diacrylate, tetraethylene glycol diacrylate, diethylene glycol dimethacrylate, triethylene glycol dimethacrylate, and tetraethylene glycol dimethacrylate. Crylate, trimethylolpropane diacrylate, trimethylolpropane triacrylate, trimethylolpropane dimethacrylate, trimethylolpropane trimethacrylate, 1,3-butanediol diacrylate, 1,3-butanediol dimethacrylate Rate, neopentyl glycol diacrylate, 1,4-butanediol diacrylate, 1,4-butanediol dimethacrylate, 1,6-hexanediol diacrylate, 1,9-nonanediol dimethacrylate, 1 , 10-decanediol dimethacrylate, dimethylol-tricyclodecane diacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, pentaerythritol trimethacrylate, pentaerythritol tetramethacrylate, Dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, tripentaerythritol heptaacrylate, tripentaerythritol octaacrylate, tetrapentaerythritol nonaacrylate, tetrapentaerythritol decaacrylate, pentapenta Erythritol undecaacrylate, pentapentaerythritol dodecaacrylate, tripentaerythritol heptamethacrylate, tripentaerythritol octamethacrylate, tetrapentaerythritol nonamethacrylate, tetrapentaerythritol decamethacrylate salt, pentapentaerythritol undecamethacrylate, pentapentaerythritol dodecamethacrylate, and dimethylol-tricyclodecane diacrylate. You may contain two or more of these.

The content of the photopolymerizable compound in the resin composition of the present invention is preferably 1% by weight or more based on the solid content from the viewpoint of effectively promoting radical hardening. On the other hand, from the viewpoint of suppressing excessive reaction of radicals and improving resolution, the content of the photopolymerizable compound is preferably 40% by weight or less based on the solid content.

As the quinonediazide compound, a compound in which the sulfonic acid of naphthoquinonediazide is bonded as an ester to a compound having a phenolic hydroxyl group is preferable. Compounds having a phenolic hydroxyl group used here include, for example, BIs-Z, TekP-4HBPA (tetrakis P-DO-BPA), TrIsP-HAP, TrIsP-PA, BIsRS-2P, BIsRS-3P (above, brand names) , Honshu Kagaku Kogyo Co., Ltd.), BIR-PC, BIR-PTBP, BIR-BIPC-F (above, brand name, Asahi Yukizai Kogyo Co., Ltd.), 4,4'-sulfonyldiphenol, BPFL ( Brand name, product made by JFE Chemical Co., Ltd., etc. can be mentioned. As quinonediazide compounds, those having 4-naphthoquinonediazide sulfonic acid or 5-naphthoquinone diazide sulfonic acid introduced through an ester bond into these compounds having a phenolic hydroxyl group are preferable, for example, THP-17, TDF- 517 (brand name, manufactured by Toyo Gose Kogyo Co., Ltd.), SBF-525 (brand name, manufactured by AZ Electronic Materials Co., Ltd.), etc.

From the viewpoint of improving sensitivity, the content of the quinonediazide compound in the resin composition of the present invention is preferably 0.5% by weight or more, and more preferably 1% by weight or more, based on the solid content. On the other hand, from the viewpoint of improving resolution, the content of the quinonediazide compound is preferably 25% by weight or less, and more preferably 20% by weight or less, based on the solid content.

The solvent has the function of adjusting the viscosity of the resin composition to a range suitable for application and improving the uniformity of the partition. As a solvent, it is preferable to combine a solvent with a boiling point of more than 150°C and 250°C or less under atmospheric pressure and a solvent with a boiling point of 150°C or less.

Examples of solvents include alcohols such as ethanol, propanol, isopropanol, and diacetone alcohol; Glycols such as ethylene glycol and propylene glycol; Ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, and propylene glycol monobutyl ether; Ketones such as methyl ethyl ketone, acetylacetone, methyl propyl ketone, methyl butyl ketone, methyl isobutyl ketone, diisobutyl ketone, and cyclopentanone; Amides such as dimethylformamide and dimethylacetamide; Ethyl acetate, propyl acetate, butyl acetate, isobutyl acetate, ethylene glycol monoethyl ether acetate, propylene glycol monomethyl ether acetate, 3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, methyl lactate, ethyl lactate. Acetates such as butyl lactate; Aromatic or aliphatic hydrocarbons such as toluene, xylene, hexane, and cyclohexane, γ-butyrolactone, N-methyl-2-pyrrolidone, and dimethyl sulfoxide can be mentioned. You may contain two or more of these. Among these, from the viewpoint of applicability, it is preferable to combine diacetone alcohol as a solvent with a boiling point of more than 150°C and 250°C or less under atmospheric pressure and propylene glycol monomethyl ether as a solvent with a boiling point of 150°C or less.

The content of the solvent can be arbitrarily set depending on the application method, etc. For example, when forming a film by spin coating, the solvent content is generally set to 50% by weight or more and 95% by weight or less of the resin composition.

It is preferable that the resin composition of the present invention further contains a coordination compound (hereinafter sometimes referred to as a “coordination compound”) having a phosphorus atom. The coordinating compound coordinates with the organometallic compound in the resin composition, improves the solubility of the organometallic compound in the solvent, promotes decomposition of the organometallic compound, and can further improve the OD value of the resulting barrier rib. Coordinating compounds include, for example, triphenylphosphine, tri-t-butylphosphine, trimethylphosphine, tricyclohexylphosphine, tri-t-butylphosphine tetrafluoroborate, and tri(2-furyl)phosphine. Examples include pin, tris(1-adamantyl)phosphine, tris(diethylamino)phosphine, tris(4-methoxyphenyl)phosphine, and tris(O-tolyl)phosphine. You may contain two or more of these. The content of the coordination compound in the resin composition of the present invention is preferably 0.5 to 3.0 molar equivalents relative to the organometallic compound.

It is preferable that the resin composition of the present invention further contains a white pigment and/or a black pigment. The white pigment has the function of further improving the reflectance of the partition. Black pigment has the function of adjusting the OD value.

Examples of white pigments include titanium dioxide, zirconium oxide, zinc oxide, barium sulfate, and complex compounds thereof. You may contain two or more of these. Among these, titanium dioxide is preferable because it has a high reflectivity and is easy to use industrially.

The crystal structure of titanium dioxide is classified into anatase type, rutile type, and brookite type. Among these, rutile-type titanium oxide is preferable because of its low photocatalytic activity.

The white pigment may be subjected to surface treatment. Surface treatment with a metal selected from Al, Si and Zr is preferable and can improve the light resistance and heat resistance of the formed barrier rib.

The median diameter of the white pigment is preferably 100 to 500 nm from the viewpoint of further improving the reflectance of the partition. Here, the median diameter of the white pigment can be calculated from the particle size distribution measured by laser diffraction using a particle size distribution measuring device (N4-PLUS; manufactured by Beckman Coulter Co., Ltd.) or the like.

Titanium dioxide pigments preferably used as white pigments include, for example, R960; CR-97, manufactured by DuPont Co., Ltd. (rutile type, SiO ₂ /Al ₂ O ₃ treated, average primary particle size 210 nm); JR-301, manufactured by Ishihara Sangyo Co., Ltd. (rutile type, Al ₂ O ₃ /ZrO ₂ treated, average primary particle size 250 nm); JR-405, manufactured by Teika Co., Ltd. (rutile type, Al ₂ O ₃ treated, average primary particle size 300 nm); JR-600A, manufactured by Teika Co., Ltd. (rutile type, Al ₂ O ₃ treated, average primary particle size 210 nm); Teika Co., Ltd. (rutile type, Al ₂ O ₃ treated, average primary particle size 250 nm), JR-603; Teika Co., Ltd. (rutile type, Al ₂ O ₃ /ZrO ₂ treatment, average primary particle diameter 280 nm), etc. are mentioned. You may contain two or more of these.

From the viewpoint of further improving the reflectance, the content of the white pigment in the resin composition is preferably 20% by weight or more in solid content, and more preferably 30% by weight or more. On the other hand, from the viewpoint of improving the surface smoothness of the partition, the content of the white pigment is preferably 60% by weight or less in the solid content, and more preferably 55% by weight or less.

Examples of black pigments include black organic pigments, mixed-color organic pigments, and black inorganic pigments.

Examples of black organic pigments include carbon black, perylene black, aniline black, and benzofuranone-based pigments. These may be coated with resin.

Examples of mixed organic pigments include those obtained by mixing two or more pigments selected from red, blue, green, violet, yellow, magenta, cyan, etc. and making them pseudo-black. Among these, a mixed pigment of a red pigment and a blue pigment is preferable from the viewpoint of achieving both an appropriately high OD value and pattern processability. The weight ratio of the red pigment and blue pigment in the mixed pigment is preferably 20/80 to 80/20, and more preferably 30/70 to 70/30. Specific examples of representative pigments are expressed by color index (CI) numbers as follows. Red pigments include, for example, Pigment Red (hereinafter abbreviated as PR) 9, PR48, PR97, PR122, PR123, PR144, PR149, PR166, PR168, PR177, PR179, PR180, PR192, PR209, PR215, PR216, PR217. , PR220, PR223, PR224, PR226, PR227, PR228, PR240, PR254, etc. You may contain two or more of these. Examples of the blue pigment include Pigment Blue (hereinafter abbreviated as PB) 15, PB15:3, PB15:4, PB15:6, PB22, PB60, and PB64. You may contain two or more of these.

Examples of the black inorganic pigment include graphite; Fine particles of metals such as titanium, copper, iron, manganese, cobalt, chromium, nickel, zinc, calcium, silver, gold, platinum, and palladium; metal oxide; metal complex oxides; metal sulfides; metal nitride; metal oxynitride; Metal carbides, etc. can be mentioned. You may contain two or more of these.

Among the above black pigments, pigments selected from titanium nitride, zirconium nitride, carbon black, and mixed pigments with a weight ratio of red pigment and blue pigment of 20/80 to 80/20 are preferable because they have high light blocking properties. In addition, from the viewpoint of easy adjustment of the taper angle of the partition A-1 to a preferred range described later, a pigment selected from titanium nitride, zirconium nitride, and a mixed pigment with a weight ratio of red pigment and blue pigment of 20/80 to 80/20. is more preferable.

The content of the black pigment in the resin composition is preferably 0.01% by weight or more, and 0.05% by weight or more in solid content from the viewpoint of adjusting the reflectance and OD to the above-mentioned range and further suppressing color mixing of light in adjacent pixels. It is more desirable. On the other hand, from the viewpoint of adjusting the reflectance and OD to the above-mentioned ranges, the content of the black pigment is preferably 5% by weight or less in the solid content, and more preferably 3% by weight or less.

It is preferable that the resin composition of the present invention further contains a photobase generator. By containing a photobase generator, a base is generated in the exposure process to promote decomposition and aggregation of the organometallic compound in the resin composition, thereby converting the organometallic compound into black particles or yellow particles more efficiently, and the obtained The OD value of the partition can be further improved.

The photobase generator may be any one as long as it decomposes and/or reacts with irradiation of light (including ultraviolet rays and electron beams) to generate a base. For example, 2-(9-oxoxanthen-2-yl)propionic acid 1,5,7-triazacyclo[4,4,0]dec-5-ene, N-cyclohexylcarbamic acid 1-(anthra Quinone-2-yl)ethyl, N,N-diethylcarbamate 9-anthrylmethyl, N-cyclohexylcarbamate 9-anthrylmethyl, 1-carboxylic acid 9-anthrylmethylpiperidine, N, N-dicyclohexylcarbamate 9-anthrylmethyl, N,N-dicyclohexylcarbamate 1-(anthraquinon-2-yl)ethyl, cyclohexylammonium propionate 2-(3-benzoylphenyl), butyltriphenyl 1,2-dicyclohexyl-4,4,5,5,-tetramethylbiguanidinium boronic acid, 2-(3-benzoylphenyl)propionic acid 1,2-diisopropyl-3-[bis(dimethylamino) Examples include methylene]guanidinium, (2-nitrophenyl)methyl4-hydroxypiperidine-1-carboxylic acid, and 2-(3-benzoylphenyl)guanidinium propionate. You may use two or more of these.

The content of the photobase generator in the resin composition of the present invention is preferably 0.5% by weight or more based on the solid content from the viewpoint of further improving the OD value. On the other hand, the content of the photobase generator is preferably 2.0% by weight or less based on the solid content from the viewpoint of improving resolution.

The resin composition of the present invention may contain a liquid-repellent compound. A liquid-repellent compound is a compound that imparts a property (liquid-repellent performance) to a resin composition to repel water or organic solvents. There is no particular limitation as long as the compound has these properties, but specifically, a compound having a fluoroalkyl group is preferably used. By containing a liquid-repelling compound, liquid-repellent performance can be imparted to the top of the partition wall (A-1) after formation. Thereby, for example, when forming a pixel containing the color conversion light emitting material (B) described later, color conversion light emitting materials with different compositions can be easily separately applied to each pixel.

Examples of liquid-repellent compounds include 1,1,2,2-tetrafluorooctyl (1,1,2,2-tetrafluoropropyl) ether, 1,1,2,2-tetrafluorooctylhexyl ether, Octaethylene glycol di(1,1,2,2-tetrafluorobutyl) ether, hexaethylene glycol (1,1,2,2,3,3-hexafluoropentyl) ether, octapropylene glycol di(1, 1,2,2-tetrafluorobutyl) ether, hexapropylene glycol di(1,1,2,2,3,3-hexafluoropentyl) ether, sodium perfluorodecyl sulfonate, 1,1,2 ,2,8,8,9,9,10,10-decafluorodecane, 1,1,2,2,3,3-hexafluorodecane, N-[3-(perfluorooctanesulfonamide) [Propyl]-N, N'-dimethyl-N-carboxymethylene ammonium betaine, perfluoroalkyl sulfonamide propyl trimethyl ammonium salt, perfluoroalkyl-N-ethyl sulfonyl glycine salt, bis phosphate (N-perfluoro oxide Compounds having a fluoroalkyl or fluoroalkylene group at the terminal, main chain, and/or side chain, such as thylsulfonyl-N-ethylaminoethyl) and monoperfluoroalkyl ethyl phosphate, can be mentioned. In addition, commercially available liquid-repellent compounds include "Megapec" (registered trademark) F142D, F172, F173, F183, F444, F477 (above, manufactured by Dainippon Ink Kagaku Kogyo Co., Ltd.), Ftop EF301, 303, 352 (new) Akita Kasei Co., Ltd.), Fluorad FC-430, FC-431 (Sumitomo 3M Co., Ltd.), “Asahi Guard” (registered trademark) AG710, “Suplon” (registered trademark) S-382, SC -101, SC-102, SC-103, SC-104, SC-105, SC-106 (made by Asahi Glass Co., Ltd.), BM-1000, BM-1100 (made by Yusho Co., Ltd.), NBX-15 , FTX-218, DFX-18 (manufactured by Neos Co., Ltd.), etc. You may contain two or more of these. Among these, those having a photopolymerizable group are more preferable because they have high reactivity and can form a firm bond with the resin. Examples of the liquid-repellent compound having a fluorine atom and a photopolymerizable group include "Megapec" (registered trademark) RS-76-E, RS-56, RS-72-k, RS-75, RS-76-E, RS- 76-NS, RS-76, RS-90 (above, brand name, manufactured by DIC Corporation), etc. In addition, in this case, in the partition wall (A-1) containing the photocured product of the negative photosensitive resin composition, the photopolymerizable group may be photopolymerized.

From the viewpoint of improving the liquid-repellent performance of the partition and improving inkjet applicability, the content of the liquid-repelling compound in the resin composition is preferably 0.01% by weight or more, more preferably 0.1% by weight or more, based on the solid content. On the other hand, from the viewpoint of improving compatibility with resin or white pigment, the content of the liquid-repellent compound is preferably 10% by weight or less, and more preferably 5% by weight or less, based on the solid content.

Additionally, the resin composition of the present invention may contain an ultraviolet absorber, a polymerization inhibitor, a surfactant, an adhesion improver, etc., as needed.

By containing an ultraviolet absorber in the resin composition of the present invention, light resistance can be improved and resolution can be further improved. As an ultraviolet absorber, from the viewpoint of transparency and non-coloring, 2-(2H-benzotriazol-2-yl)phenol, 2-(2H-benzotriazol-2-yl)-4,6-tert-pentylphenol, 2 -(2H-benzotriazol-2-yl)-4-(1,1,3,3-tetramethylbutyl)phenol, 2(2H-benzotriazol-2-yl)-6-dodecyl-4- Benzotriazole-based compounds such as methylphenol and 2-(2'-hydroxy-5'-methacryloxyethylphenyl)-2H-benzotriazole; Benzophenone-based compounds such as 2-hydroxy-4-methoxybenzophenone; Triazine-based compounds such as 2-(4,6-diphenyl-1,3,5triazin-2-yl)-5-[(hexyl)oxy]-phenol, etc. are preferably used.

Resolution can be further improved by containing a polymerization inhibitor in the resin composition of the present invention. Examples of polymerization inhibitors include di-t-butylhydroxytoluene, butylhydroxyanisole, hydroquinone, 4-methoxyphenol, 1,4-benzoquinone, and t-butylcatechol. In addition, commercially available polymerization inhibitors include "IRGANOX" (registered trademark) 1010, 1035, 1076, 1098, 1135, 1330, 1726, 1425, 1520, 245, 259, 3114, 565, 295 (above, product name, BASF Japan (above) Co., Ltd.), etc. may be mentioned. You may contain two or more of these.

By containing a surfactant in the resin composition of the present invention, flow properties during application can be improved. As a surfactant, for example, "Megapec" (registered trademark) F142D, F172, F173, F183, F445, F470, F475, F477 (above, brand name, Dainippon Ink Kagaku Kogyo Co., Ltd.), NBX-15 , fluorine-based surfactants such as FTX-218 (trade name, manufactured by Neos Co., Ltd.); Silicone-based surfactants such as "BYK" (registered trademark) -333, 301, 331, 345, 307 (above, brand name, manufactured by Big Chemi Japan Co., Ltd.); polyalkylene oxide-based surfactant; and poly(meth)acrylate-based surfactants. You may contain two or more of these.

By containing an adhesion improving agent in the resin composition of the present invention, adhesion to the underlying substrate is improved, and a highly reliable partition can be obtained. Examples of adhesion improving agents include alicyclic epoxy compounds and silane coupling agents. Among these, alicyclic epoxy compounds have high heat resistance and can further suppress color change after heating.

Examples of alicyclic epoxy compounds include 3',4'-epoxycyclohexymethyl-3,4-epoxycyclohexanecarboxylate, 1,2-bis(hydroxymethyl)-1-butanol, and 2,2-bis(hydroxymethyl)-1-butanol. -Epoxy-4-(2-oxiranyl)cyclohexane adduct, ε-caprolactone modified 3',4'-epoxycyclohexylmethyl 3',4'-epoxycyclohexanecarboxylate, 1,2-epoxy- 4-vinylcyclohexane, butanetetracarboxylic acid tetra(3,4-epoxycyclohexylmethyl) formula ε-caprolactone, 3,4-epoxycyclohexylmethyl methacrylate, hydrogenated bisphenol A diglycidyl ether, Hydrogenated bisphenol F diglycidyl ether, hydrogenated bisphenol E diglycidyl ether, hydrogenated bisphenol A bis(propylene glycol glycidyl ether) ether, hydrogenated bisphenol A bis(ethylene glycol glycidyl ether) ether, 1,4-cyclohexanedicarboxylic acid diglycidyl, 1,4-cyclohexanedimethanol diglycidyl ether, etc. You may contain two or more of these.

The content of the adhesion improving agent in the resin composition of the present invention is preferably 0.1% by weight or more, and more preferably 1% by weight or more based on the solid content, from the viewpoint of further improving adhesion to the underlying substrate. On the other hand, the content of the adhesion improver is preferably 20% by weight or less, and more preferably 10% by weight or less, based on the solid content, from the viewpoint of further suppressing color change due to heating.

The resin composition of the present invention can be produced, for example, by mixing the above-mentioned resin, an organometallic compound, a photopolymerization initiator or quinonediazide compound, a solvent, and other components as necessary.

Next, the light-shielding film of the present invention will be described. The light-shielding film of the present invention is obtained by curing the resin composition of the present invention described above. The light-shielding film of the present invention can be suitably used as a light-shielding pattern in an OGS type touch panel, such as a decorative pattern for a cover base material, in addition to the partition A-1 described later. The thickness of the light-shielding film is preferably 10 μm or more.

Next, the manufacturing method of the light-shielding film of this invention is demonstrated with an example. The method for producing a light-shielding film of the present invention includes a film forming step of applying the resin composition of the present invention onto a base substrate and drying it to obtain a dried film, an exposure step of exposing the obtained dried film to a pattern, and soluble in the developer in the dried film after exposure. It is desirable to have a development process to dissolve and remove the portion and a heating process to harden the dried film after development by heating it.

The method for producing a light-shielding film of the present invention is characterized in that, in the heating step, the OD value per 10 μm of film thickness is increased by 0.3 or more by heating the developed film to a temperature of 120°C or more and 250°C or less. From the viewpoint of further improving the OD value, the heating temperature during the heating process is preferably 150°C or higher, and more preferably 180°C or higher. The heating temperature during the heating process is preferably 250°C or lower, and more preferably 240°C or lower, from the viewpoint of suppressing cracks in the film being heated. The heating time is preferably 15 minutes to 2 hours. Since the film formed from the resin composition of the present invention has a low OD value during exposure and the OD value increases after pattern formation, it is sufficiently photocured to the bottom in the exposure process to obtain a partition having a preferable taper angle described later. You can. In addition, since the OD value after pattern formation is high, a partition that has both high reflectance and light blocking properties can be obtained.

Examples of the application method of the resin composition in the film forming process include the slit coating method and spin coating method. Examples of drying devices include hot air ovens and hot plates. The drying time is preferably 80 to 120°C, and the drying time is preferably 1 to 15 minutes.

The exposure process is a process in which necessary parts of the dried film are photocured by exposure, or unnecessary parts of the dried film are photodecomposed, and any part of the dried film is made soluble in a developer. In the exposure process, exposure may be carried out through a photomask having a predetermined opening, or an arbitrary pattern may be drawn directly using a laser beam or the like without using a photomask.

As an exposure apparatus, a proximity exposure machine is mentioned, for example. Actinic rays irradiated in the exposure process include, for example, near infrared rays, visible rays, and ultraviolet rays, with ultraviolet rays being preferred. In addition, examples of the light source include low-pressure mercury lamps, high-pressure mercury lamps, ultra-high pressure mercury lamps, halogen lamps, germicidal lamps, etc., and ultra-high pressure mercury lamps are preferable.

Exposure conditions can be appropriately selected depending on the thickness of the dry film to be exposed. In general, it is preferable to use an ultra-high pressure mercury lamp with an output of 1 to 100 mW/cm2 and expose at an exposure dose of 1 to 10,000 mJ/cm2.

In the development process, the part soluble in the developer in the dried film after exposure is removed by dissolving it in the developer, and only the part insoluble in the developer remains, and the dried film is patterned in an arbitrary pattern shape (hereinafter referred to as the pattern before heating). ) is the process of obtaining. Examples of the pattern shape include shapes such as lattice shape and stripe shape.

Examples of the development method include an immersion method, a spray method, and a brush method.

As a developing solution, a solvent capable of dissolving unnecessary parts in the dried film after exposure can be appropriately selected, and an aqueous solution containing water as a main component is preferable. For example, when the resin composition contains a polymer having a carboxyl group, an aqueous alkaline solution is preferable as the developer. Examples of the aqueous alkaline solution include inorganic aqueous alkali solutions such as sodium hydroxide, potassium hydroxide, sodium carbonate, and calcium hydroxide; and organic alkali aqueous solutions such as tetramethylammonium hydroxide, trimethylbenzylammonium hydroxide, monoethanolamine, and diethanolamine. Among these, from the viewpoint of improving resolution, potassium hydroxide aqueous solution or tetramethylammonium hydroxide aqueous solution is preferable. From the viewpoint of improving developability, the concentration of the aqueous alkaline solution is preferably 0.05% by weight or more, and more preferably 0.1% by weight or more. On the other hand, the concentration of the aqueous alkaline solution is preferably 5% by weight or less, and more preferably 1% by weight or less from the viewpoint of suppressing peeling or corrosion of the pattern before heating. The development temperature is preferably 20 to 50°C to facilitate process management.

The heating process is a process of heating and hardening the pattern before heating formed in the developing process. Examples of heating devices include hot plates and ovens. The preferred heating temperature and heating time are as described above.

Next, the substrate with partitions of the present invention will be described. The substrate with a barrier rib of the present invention has a barrier rib (hereinafter sometimes referred to as “partition wall (A-1)”) formed in the (A-1) pattern on an underlying substrate. The base substrate has a function as a support in the substrate with partitions. When the partition has a pixel containing a color-converting light-emitting material described later, it has a function of suppressing color mixing of light between adjacent pixels.

In the barrier-equipped substrate of the present invention, the barrier rib (A-1) is characterized by a reflectance of 20% to 60% per 10 μm thickness at a wavelength of 550 nm and an OD value of 1.0 to 3.0 per 10 μm thickness. By setting the reflectance to 20% or more and the OD value to 3.0 or less, (A-1) the luminance of the display device can be improved using reflection on the side of the partition. On the other hand, by setting the reflectance to 60% or less and the OD value to 1.0 or more, light passing through the partition A-1 can be suppressed, and color mixing of light between adjacent pixels can be suppressed.

Fig. 1 shows a cross-sectional view of one aspect of the barrier rib-equipped substrate of the present invention having patterned barrier ribs. It has a partition wall (2) patterned on the base substrate (1).

<Substrate>

Examples of the base substrate include a glass plate, a resin plate, and a resin film. As a material for the glass plate, alkali-free glass is preferable. Preferred materials for the resin plate and resin film include polyester, (meth)acrylic polymer, transparent polyimide, and polyethersulfone. The thickness of the glass plate and the resin plate is preferably 1 mm or less, and preferably 0.8 mm or less. The thickness of the resin film is preferably 100 μm or less.

<Bulkhead (A-1)>

The partition A-1 is characterized by a reflectance of 20 to 60% per 10 μm thickness at a wavelength of 550 nm and an OD value of 1.0 to 3.0. Here, the thickness of the partition A-1 refers to the length of the partition A-1 in a direction perpendicular to the underlying substrate (height direction). In the case of the substrate with a barrier rib shown in FIG. 1, the thickness of the barrier rib 2 is indicated by symbol H. Additionally, the length of the partition A-1 in a direction parallel to the underlying substrate is taken as the width of the partition A-1. In the case of the barrier rib-equipped substrate shown in Fig. 1, the width of the barrier rib 2 is indicated by symbol L.

In the present invention, it is believed that the reflectance on the side of the partition contributes to improving the luminance of the display device, and the light-shielding property of the partition contributes to suppressing color mixing. On the other hand, since the reflectance and OD value per thickness are considered to be the same regardless of the thickness direction or the width direction, the present invention focuses on the reflectance and OD value per thickness of the partition. In addition, as will be described later, the thickness of the partition A-1 is preferably 0.5 to 50 μm, and the width is preferably 5 to 40 μm. Therefore, in the present invention, 10 ㎛ was selected as a representative value of the thickness of the partition A-1, and attention was paid to the reflectance and OD value per 10 ㎛ thickness.

If the reflectance per 10 μm of thickness is less than 20%, reflection on the side of the partition becomes small, and the luminance of the display device becomes insufficient. The reflectance per 10 μm thickness is preferably 30% or more, and more preferably 35% or more. The higher the reflectance, the greater the reflection on the side of the partition, so the luminance of the display device can be improved. However, if the reflectance exceeds 60%, color mixing of light occurs between adjacent pixels. The reflectance per 10㎛ thickness is more preferably 44% or less.

Additionally, if the OD value per 10 μm of thickness is less than 1.0, color mixing of light occurs between adjacent pixels. The OD value per 10 ㎛ thickness is preferably 1.5 or more, and more preferably 2.0 or more. On the other hand, if the OD value per 10 μm of thickness exceeds 3.0, reflection on the side of the partition becomes small, and the luminance of the display device becomes insufficient. The OD value per 10㎛ thickness is more preferably 2.5 or less.

The reflectance per 10 μm thickness at a wavelength of 550 nm of the partition A-1 was measured from the upper surface of the partition A-1 with a thickness of 10 μm using a spectrophotometer (e.g., CM- manufactured by Konica Minolta Co., Ltd.). 2600d) can be used to measure by SCI mode. However, in cases where a sufficient area for measurement cannot be secured or when a measurement sample with a thickness of 10 μm cannot be collected and the composition of the partition A-1 is known, the partition A-1 and The reflectance per 10 μm thickness may be obtained by producing a 10 μm thick solid film of the same composition and measuring the reflectance similarly for the solid film instead of the partition (A-1). For example, using the material from which the barrier rib (A-1) was formed, the thickness was set to 10 μm, and a solid film was produced under the same processing conditions as for forming the barrier rib (A-1) except that the pattern was not formed, and the resulting film was obtained. For a solid film, the reflectance may be similarly measured from the top surface.

The OD value per 10 ㎛ thickness of the barrier rib (A-1) is calculated by measuring the incident light from the upper surface using an optical densitometer (for example, 361T (visual) manufactured by X-rite) for the 10 µm thick barrier rib (A-1). And the intensity of transmitted light can be measured and calculated by the following formula (1). However, in cases where a sufficient area for measurement cannot be secured or when a measurement sample with a thickness of 10 ㎛ cannot be collected and the composition of the partition A-1 is known, as in the measurement of reflectance, the partition wall The OD value per 10 μm thickness may be obtained by producing a 10 μm thick solid film of the same composition as (A-1) and measuring the OD value similarly for the solid film instead of the partition (A-1).

OD value = log10(I ₀ /I) … (One)

I ₀ : Incident light intensity

I: Transmitted light intensity.

In addition, as a means for bringing the reflectance and OD value into the above range, for example, making the partition A-1 have a preferable composition described later, etc.

The taper angle of the partition A-1 is preferably 45° to 110°. The taper angle of the partition wall (A-1) refers to the angle formed by the side and bottom sides of the partition wall cross section. In the case of the substrate with a barrier rib shown in Fig. 1, the taper angle of the barrier rib 2 is indicated by symbol θ. By setting the taper angle to 45 degrees or more, the difference between the widths of the top and bottom of the partition A-1 becomes small, and the width of the partition A-1 can be easily formed in a desirable range described later. The taper angle is more preferably 70° or more. On the other hand, by setting the taper angle to 110° or less, when forming a pixel containing the color conversion light emitting material (B) described later by inkjet application, ink agglomeration can be suppressed and inkjet coating properties can be improved. Here, ink agglomeration refers to a phenomenon in which ink crosses the partition and mixes into adjacent pixel portions. The taper angle is more preferably 95° or less. The taper angle of the partition A-1 is accelerated using an optical microscope (FE-SEM (e.g., S-4800 manufactured by Hitachi Seisakusho Co., Ltd.)) in an arbitrary cross section of the partition A-1. It can be obtained by observing at a voltage of 3.0 kV and a magnification of 2,500 times, and measuring the angle formed by the side and bottom sides of the cross section of the partition A-1.

In addition, as a means for adjusting the taper angle of the partition A-1 to the above range, for example, the partition A-1 is formed with a preferable composition described later, or formed using the resin composition of the present invention described above. Things can be mentioned.

The thickness of the partition A-1 is preferably larger than the thickness of the pixel when the partition-equipped substrate has a pixel containing the color conversion light emitting material (B) described later. Specifically, the thickness of the partition A-1 is preferably 0.5 μm or more, and more preferably 10 μm or more. On the other hand, from the viewpoint of more efficiently extracting light emission from the bottom of the pixel, the thickness of the partition A-1 is preferably 50 μm or less, and more preferably 20 μm or less. In addition, the width of the partition A-1 is preferably sufficient to further improve luminance by utilizing light reflection on the side of the partition and to further suppress color mixing of light in adjacent pixels due to light leakage. . Specifically, the width of the partition is preferably 5 μm or more, and more preferably 15 μm or more. Meanwhile, from the viewpoint of further improving luminance by securing a large light-emitting area of the pixel, the width of the partition A-1 is preferably 50 μm or less, and more preferably 40 μm or less.

The partition A-1 has a repeating pattern of a predetermined number of pixels according to the screen size of the image display device. The number of pixels in an image display device is, for example, 4000 horizontally and 2000 vertically. The number of pixels affects the resolution (detail and detail) of the displayed image. Therefore, it is necessary to form a number of pixels according to the required image resolution and the screen size of the image display device, and it is desirable to determine the pattern formation dimensions of the partition accordingly.

The partition (A-1) is a resin, a white pigment, and particles containing at least one metal oxide or metal selected from the group consisting of palladium oxide, platinum oxide, gold oxide, silver oxide, palladium, platinum, gold, and silver. (Hereinafter, it may be described as “metal oxide particles or metal particles”). The resin has the function of improving the crack resistance and light resistance of the partition wall. The white pigment has the function of further improving the reflectance of the partition. Metal oxide particles or metal particles have a function of adjusting the OD value and suppressing color mixing of light in adjacent pixels.

The resin and white pigment are the materials constituting the resin composition and are as described above. The resin content in the partition (A-1) is preferably 10% by weight or more, and more preferably 20% by weight or more, from the viewpoint of improving the crack resistance of the partition during heat treatment. On the other hand, from the viewpoint of improving light resistance, the resin content in the partition (A-1) is preferably 60% by weight or less, and more preferably 50% by weight or less.

From the viewpoint of further improving the reflectance, the content of the white pigment in the partition (A-1) is preferably 20% by weight or more, and more preferably 30% by weight or more. On the other hand, from the viewpoint of improving the surface smoothness of the partition, the content of the white pigment in the partition (A-1) is preferably 60% by weight or less, and more preferably 55% by weight or less.

Metal oxide particles or metal particles refer to black particles or yellow particles generated by decomposition and aggregation of the organometallic compound in the above-mentioned resin composition during the exposure process and/or the heating process. The content of the metal oxide particles or metal particles in the partition A-1 is preferably 0.2% by weight or more, from the viewpoint of adjusting the reflectance and OD to the above-mentioned range and further suppressing color mixing of light in adjacent pixels, and is preferably 0.5% by weight or more. Weight% or more is more preferable. On the other hand, from the viewpoint of adjusting the reflectance and OD to the above-mentioned range, the content of metal oxide particles or metal particles in the partition (A-1) is preferably 5% by weight or less, and more preferably 3% by weight or less.

It is preferable that the partition wall (A-1) further contains a liquid-repellent compound. By containing a liquid-repellent compound, liquid-repellent performance can be imparted to the partition A-1, and for example, when forming pixels containing the color-converting light-emitting material (B) described later, each pixel has a different color composition. Conversion light-emitting materials can be easily separated and applied. The liquid-repellent compound is as described above as a material constituting the resin composition.

From the viewpoint of improving the liquid-repellent performance of the partition and improving inkjet applicability, the content of the liquid-repellent compound in the partition (A-1) is preferably 0.01% by weight or more, and more preferably 0.1% by weight or more. On the other hand, from the viewpoint of improving compatibility with the resin or white pigment, the content of the liquid-repellent compound in the partition (A-1) is preferably 10% by weight or less, and more preferably 5% by weight or less.

The surface contact angle of the partition (A-1) with respect to propylene glycol monomethyl ether acetate is preferably 10° or more, and is 20° or more from the viewpoint of improving inkjet applicability and facilitating separate application of the color conversion light-emitting material. This is more preferable, and 40° or more is even more preferable. On the other hand, from the viewpoint of improving the adhesion between the partition and the underlying substrate, the surface contact angle of the partition A-1 is preferably 70° or less, and more preferably 60° or less. Here, the surface contact angle of the partition A-1 can be measured based on the wettability test method of the substrate glass surface specified in JIS R3257 (date of establishment = 1999/04/20) with respect to the upper part of the partition. Additionally, as a method of adjusting the surface contact angle of the partition A-1 to the above range, for example, a method using the above-described liquid-repellent compound can be used.

As a method of pattern forming the partition A-1 on the base substrate, the photosensitive paste method is preferable because the pattern shape can be easily adjusted. Methods for patterning partition walls by the photosensitive paste method include, for example, an application step of applying the above-mentioned resin composition onto a base substrate and drying it to obtain a dried film, an exposure step of exposing the obtained dried film to a pattern according to a desired pattern shape, A method comprising a development step of dissolving and removing the developer-soluble portion of the dried film after exposure and a heating step of curing the partition walls after development is preferable. The resin composition preferably has positive or negative photosensitivity. Pattern exposure may be performed through a photomask having a predetermined opening, or an arbitrary pattern may be drawn directly using a laser beam or the like without using a photomask. In addition, when the barrier-equipped substrate has a light-shielding barrier rib A-2, which will be described later, the barrier rib A-1 can be pattern-formed on the light-shielding barrier rib A-2 in the same manner. Each process is the same as previously described as a method of manufacturing a light-shielding film.

<Light-shading bulkhead (A-2)>

The barrier rib-equipped substrate of the present invention further includes (A-2) a patterned barrier wall (hereinafter referred to as “A-2)” having an OD value of 0.5 or more per 1.0 μm of thickness between the base substrate and the patterned barrier rib (A-1). It is preferable to have a light-shielding partition (A-2)”). By having the light-shielding partition A-2, light-shielding properties are improved, light leakage of the backlight in the display device is suppressed, and a clear image with high contrast can be obtained.

Fig. 6 is a cross-sectional view showing one aspect of the barrier rib-equipped substrate of the present invention having a light-shielding barrier rib. It has a partition 2 and a light-shielding partition 7 patterned on a base substrate 1, and pixels 3 are arranged in areas spaced apart by the partition wall 2 and the light-shielding partition 7.

The light-shielding partition (A-2) has an OD value of 0.5 or more per 1.0 μm of thickness. Here, the thickness of the light-shielding partition A-2 is preferably 0.5 to 10 μm, as will be described later. Therefore, in the present invention, 1.0 ㎛ was selected as a representative value of the thickness of the partition A-2, and attention was paid to the OD value per 1.0 ㎛ thickness. By setting the OD value per 1.0 μm of thickness to 0.5 or more, light blocking properties can be further improved, and a clearer image with higher contrast can be obtained. The OD value per 1.0㎛ thickness is more preferably 1.0 or more. On the other hand, the OD value per 1.0㎛ thickness is preferably 4.0 or less, and pattern processability can be improved. The OD value per 1.0㎛ thickness is more preferably 3.0 or less. The OD value of the light-shielding partition A-2 can be measured similarly to the OD value of the partition A-1 described above. In addition, as a means for bringing the OD value into the above range, for example, setting the light-shielding partition A-2 to a preferable composition described later can be mentioned.

From the viewpoint of improving light-shielding properties, the thickness of the light-shielding partition A-2 is preferably 0.5 μm or more, and more preferably 1.0 μm or more. On the other hand, from the viewpoint of improving flatness, the thickness of the light-shielding partition A-2 is preferably 10 μm or less, and more preferably 5 μm or less. In addition, the width of the light-shielding partition A-2 is preferably approximately the same as that of the partition A-1 described above.

The light-shielding partition (A-2) preferably contains resin and black pigment. The resin has the function of improving the crack resistance and light resistance of the partition wall. The black pigment has the function of absorbing incident light and reducing emitted light.

Examples of the resin include epoxy resin, (meth)acrylic polymer, polyurethane, polyester, polyimide, polyolefin, and polysiloxane. You may contain two or more of these. Among these, polyimide is preferred because it has excellent heat resistance and solvent resistance.

Examples of the black pigment include those exemplified as the black pigment in the resin composition described above, palladium oxide, platinum oxide, gold oxide, and silver oxide. In view of having high light-shielding properties, black pigments selected from titanium nitride, zirconium nitride, carbon black, palladium oxide, platinum oxide, gold oxide and silver oxide are preferred.

As a method of pattern forming the light-shielding barrier rib (A-2) on the base substrate, for example, using the photosensitive material described in Japanese Patent Application Laid-Open No. 2015-1654, a photosensitive paste is applied in the same manner as for the barrier rib (A-1) described above. A method of forming a pattern by law is preferable.

The substrate with a barrier rib of the present invention further includes a pixel (hereinafter sometimes referred to as “pixel (B)”) containing the color conversion light emitting material (B) arranged and spaced apart by the barrier rib (A-1). It is desirable to have. The pixel B has a function of enabling color display by converting at least a portion of the wavelength range of incident light and emitting emitted light of a different wavelength range from the incident light.

Fig. 2 shows a cross-sectional view of one aspect of the barrier rib-equipped substrate of the present invention, which has a patterned barrier rib (A-1) and a pixel (B) containing a color conversion light emitting material. It has partition walls 2 formed in a pattern on the base substrate 1, and pixels 3 are arranged in areas spaced apart by the partition walls 2.

The color conversion material preferably contains a phosphor selected from inorganic phosphors and organic phosphors.

The substrate with a barrier rib of the present invention can be used as a display device, for example, by combining a backlight that emits blue light, a liquid crystal formed on a TFT, and a pixel (B). In this case, the area corresponding to the red pixel preferably contains a red phosphor that is excited by blue excitation light and emits red fluorescence. Similarly, the area corresponding to the green pixel preferably contains a green phosphor that is excited by blue excitation light and emits green fluorescence. It is preferable that the area corresponding to the blue pixel does not contain phosphor.

The barrier-equipped substrate of the present invention can also be used in a display device using a blue micro LED as a backlight, in which a plurality of blue LEDs corresponding to each pixel are arranged on the substrate, separated by a white barrier. The ON/OFF of each pixel is made possible by the ON/OFF of the blue micro LED, and no liquid crystal is required. The substrate with a partition of the present invention can be used for either a partition separating each pixel or a partition separating blue micro LEDs in a backlight.

Inorganic phosphors are preferably those that emit light in each color, such as green or red, with blue excitation light, that is, those that are excited with excitation light with a wavelength of 400 to 500 nm and have a peak in the emission spectrum in the region of 500 to 700 nm. . Examples of such inorganic phosphors include YAG-based phosphors, TAG-based phosphors, sialon-based phosphors, Mn ⁴⁺ activated fluoride complex phosphors, and inorganic semiconductors called quantum dots. You may use two or more of these. Among these, quantum dots are preferable. Since quantum dots have a smaller average particle diameter compared to other phosphors, (B) the surface of the pixel can be smoothed and light scattering on the surface can be suppressed, so the light extraction efficiency can be further improved and the luminance can be further improved. there is.

Examples of quantum dots include particles containing semiconductors of group II-IV, group III-V, group IV-VI, and group IV. These inorganic semiconductors include, for example, Si, Ge, Sn, Se, Te, B, C (including diamond), P, BN, BP, BAs, AlN, AlP, AlAs, AlSb, GaN, GaP, GaAs, GaSb, InN, InP, InAs, InSb, ZnO, ZnS, ZnSe, ZnTe, CdS, CdSe, CdSeZn, CdTe, HgS, HgSe, HgTe, BeS, BeSe, BeTe, MgS, MgSe, GeS, GeSe, GeTe, SnS, Examples include SnSe, SnTe, PbO, PbS, PbSe, PbTe, CuF, CuCl, CuBr, CuI, Si ₃ N ₄ , Ge ₃ N ₄ , and Al ₂ O ₃ . You may use two or more of these.

The quantum dot may contain a p-type dopant or an n-type dopant. Additionally, quantum dots may have a core-shell structure. In the core-shell structure, any appropriate functional layer (single layer or multiple layers) may be formed around the shell depending on the purpose, and the shell surface may be subjected to surface treatment and/or chemical modification.

The shape of the quantum dot includes, for example, spherical shape, columnar shape, flaky shape, plate shape, irregular shape, etc. The average particle diameter of the quantum dots can be arbitrarily selected depending on the desired emission wavelength, and is preferably 1 to 30 nm. If the average particle diameter of the quantum dots is 1 to 10 nm, the peaks in the emission spectrum can be made sharper in each of blue, green, and red. The average particle diameter of the quantum dots is preferably 2 nm or more, and is preferably 8 nm or less. For example, when the average particle diameter of a quantum dot is about 2 nm, it emits blue light, when it is about 3 nm, it emits green light, and when it is about 6 nm, it emits red light. The average particle diameter of quantum dots can be measured by a dynamic light scattering method. Examples of the average particle diameter measuring device include a dynamic light scattering photometer DLS-8000 (manufactured by Otsuka Electronics Co., Ltd.).

As an organic phosphor, it is preferable to emit light of each color, such as green or red, by blue excitation light. As a phosphor emitting red fluorescence, a pyromethene derivative having a basic skeleton represented by the following structural formula (8), and a pyromethene derivative having a basic skeleton represented by the following structural formula (9) as a phosphor emitting green fluorescence, etc. You can. Other examples include perylene-based derivatives, porphyrin-based derivatives, oxazine-based derivatives, and pyrazine-based derivatives that emit red or green fluorescence depending on the selection of the substituent. You may contain two or more of these. Among these, pyromethene derivatives are preferable because of their high quantum yield. Pyromethene derivatives can be obtained, for example, by the method described in Japanese Patent Application Laid-Open No. 2011-241160.

Since the organic phosphor is soluble in solvents, a pixel (B) of a desired thickness can be easily formed.

From the viewpoint of improving color characteristics, the thickness of the pixel B is preferably 0.5 μm or more, and more preferably 1 μm or more. On the other hand, the thickness of the pixel B is preferably 30 μm or less, and more preferably 20 μm or less, from the viewpoint of thinning of the display device and curved surface processability.

The size of each pixel (B) is generally about 20 to 200㎛.

The pixels B are preferably arranged to be spaced apart by the partition A-1. By providing a partition between pixels, diffusion and color mixing of emitted light can be further suppressed.

As a method of forming the pixel B, for example, a method of filling the space separated by the partition A-1 with a coating liquid containing a color conversion light emitting material (hereinafter referred to as a color conversion light emitting material coating liquid) is included. The color conversion luminescent material coating solution may further contain a resin or a solvent.

As a method of filling the color-converting light-emitting material coating solution, an inkjet coating method or the like is preferable from the viewpoint of easily separately applying different types of color-converting light-emitting materials to each pixel.

The obtained coating film may be dried under reduced pressure and/or heated. In the case of reduced pressure drying, the reduced pressure drying temperature is preferably 80°C or lower to prevent the drying solvent from re-condensing on the inner wall of the reduced pressure chamber. The pressure of reduced pressure drying is preferably below the vapor pressure of the solvent contained in the coating film, and is preferably 1 to 1000 Pa. The reduced pressure drying time is preferably 10 to 600 seconds. In the case of heat drying, examples of the heat drying device include an oven and a hot plate. The heating drying temperature is preferably 60 to 200°C. The heat drying time is preferably 1 to 60 minutes.

The barrier-equipped substrate of the present invention further comprises, on the pixel (B), (C) a low refractive index layer (hereinafter referred to as “low refractive index layer (C)”) having a refractive index of 1.20 to 1.35 at a wavelength of 550 nm. It is desirable to have). By having the low refractive index layer (C), light extraction efficiency can be further improved and the luminance of the display device can be further improved.

Fig. 3 shows a cross-sectional view of one aspect of the barrier rib-equipped substrate of the present invention having a low refractive index layer. It has partitions 2 and pixels 3 patterned on a base substrate 1, and further has a low refractive index layer 4 thereon.

In a display device, from the viewpoint of appropriately suppressing reflection of light from the backlight and efficiently entering light into the pixel B, the refractive index of the low refractive index layer C is preferably 1.20 or more, and more preferably 1.23 or more. Meanwhile, from the viewpoint of improving luminance, the refractive index of the low refractive index layer (C) is preferably 1.35 or less, and more preferably 1.30 or less. Here, the refractive index of the low refractive index layer (C) can be measured by irradiating light with a wavelength of 550 nm from the direction perpendicular to the cured film surface under atmospheric pressure and 20°C using a prism coupler.

The low refractive index layer (C) preferably contains polysiloxane and silica particles without a hollow structure. Polysiloxane has high compatibility with inorganic particles such as silica particles and functions as a binder that can form a transparent layer. In addition, by containing silica particles, the refractive index can be reduced by efficiently forming minute voids in the low refractive index layer (C), and the refractive index can be easily adjusted to the above-mentioned range. Additionally, by using silica particles that do not have a hollow structure, cracks can be suppressed because they do not have a hollow structure that easily causes cracks to occur during curing shrinkage. In addition, in the low refractive index layer (C), the polysiloxane and the silica particles without a hollow structure may be contained independently, or the polysiloxane and the silica particles without a hollow structure may be contained in a bonded state. From the viewpoint of uniformity of the low refractive index layer (C), it is preferable that polysiloxane and silica particles without a hollow structure are contained in a combined state.

The polysiloxane contained in the low refractive index layer (C) preferably contains fluorine. By containing fluorine, the refractive index of the low refractive index layer (C) can be easily adjusted to 1.20 to 1.35. Fluorine-containing polysiloxane can be obtained by hydrolyzing and polycondensing a plurality of alkoxysilane compounds containing at least a fluorine-containing alkoxysilane compound represented by the following general formula (10). Additionally, other alkoxysilane compounds may be used.

In the general formula (10), R ⁷ represents a fluoroalkyl group having 3 to 17 fluorine atoms. R ⁶ represents the same group as R ⁶ in General Formulas (5) to (7). m represents 1 or 2. 4-m pieces of R ⁶ and m pieces of R ⁷ may each be the same or different.

Examples of the fluorine-containing alkoxysilane compound represented by general formula (10) include trifluoroethyltrimethoxysilane, trifluoroethyltriethoxysilane, trifluoroethyltriisopropoxysilane, and trifluoropropyl. Trimethoxysilane, trifluoropropyltriethoxysilane, trifluoropropyltriisopropoxysilane, heptadecafluorodecyltrimethoxysilane, heptadecafluorodecyltriethoxysilane, heptadecafluorodecyltri Isopropoxysilane, tridecafluorooctyltriethoxysilane, tridecafluorooctyltrimethoxysilane, tridecafluorooctyltriisopropoxysilane, trifluoroethylmethyldimethoxysilane, trifluoroethyl Methyldiethoxysilane, trifluoroethylmethyldiisopropoxysilane, trifluoropropylmethyldimethoxysilane, trifluoropropylmethyldiethoxysilane, trifluoropropylmethyldiisopropoxysilane, heptadecafluorodecyl Methyldimethoxysilane, heptadecafluorodecylmethyldiethoxysilane, heptadecafluorodecylmethyldiisopropoxysilane, tridecafluorooctylmethyldimethoxysilane, tridecafluorooctylmethyldiethoxysilane, tridecafluoroethylene Lowoctylmethyldiisopropoxysilane, Trifluoroethylethyldimethoxysilane, Trifluoroethylethyldiethoxysilane, Trifluoroethylethyldiisopropoxysilane, Trifluoropropylethyldimethoxysilane, Trifluoro Propylethyldiethoxysilane, trifluoropropylethyldiisopropoxysilane, heptadecafluorodecylethyldimethoxysilane, heptadecafluorodecylethyldiethoxysilane, heptadecafluorodecylethyldiisopropoxysilane, tri Examples include decafluorooctyl ethyl diethoxysilane, tridecafluorooctyl ethyl dimethoxysilane, and tridecafluorooctyl ethyl diisopropoxysilane. You may use two or more of these.

The content of polysiloxane in the low refractive index layer (C) is preferably 4% by weight or more from the viewpoint of suppressing cracks. On the other hand, the content of polysiloxane is preferably 32% by weight or less from the viewpoint of ensuring thixotropic properties due to the network between silica particles, maintaining an appropriate air layer in the low refractive index layer (C), and further reducing the refractive index.

As silica particles without a hollow structure in the low refractive index layer (C), for example, "Snowtex" (registered trademark) and "Organosilica Sol" (registered trademark) series manufactured by Nissan Chemical Industries, Ltd. ( Isopropyl alcohol dispersion, ethylene glycol dispersion, methyl ethyl ketone dispersion, dimethyl acetamide dispersion, methyl isobutyl ketone dispersion, propylene glycol monomethyl acetate dispersion, propylene glycol monomethyl ether dispersion, methanol dispersion, ethyl acetate dispersion, butyl acetate dispersion, Xylene-n-butanol dispersion, toluene dispersion, etc. Product numbers PGM-ST, PMA-ST, IPA-ST, IPA-ST-L, IPA-ST-ZL, IPA-ST-UP, etc.). You may contain two or more of these.

The content of silica particles without a hollow structure in the low refractive index layer (C) ensures thixotropic properties due to the network between silica particles, maintains an appropriate air layer in the low refractive index layer (C), and maintains the refractive index. From the viewpoint of reduction, 68% by weight or more is preferable. On the other hand, the content of silica particles without a hollow structure is preferably 96% by weight or less from the viewpoint of suppressing cracks.

The thickness of the low refractive index layer (C) is preferably 0.1 μm or more, and more preferably 0.5 μm or more, from the viewpoint of covering the level difference of the pixel (B) and suppressing the occurrence of defects. On the other hand, the thickness of the low refractive index layer (C) is preferably 20 μm or less, and more preferably 10 μm or less, from the viewpoint of reducing stress that causes cracks in the low refractive index layer (C).

As a method of forming the low refractive index layer (C), the coating method is preferable because it is easy to form. For example, the low refractive index layer (C) can be formed by applying a resin composition for low refractive index containing polysiloxane and silica particles onto the pixel (B), drying it, and then heating it.

In addition, the barrier rib-equipped substrate of the present invention preferably has an inorganic protective layer I with a thickness of 50 to 1,000 nm on the low refractive index layer (C). By having the inorganic protective layer I, it becomes difficult for moisture in the air to reach the low refractive index layer (C), thus suppressing refractive index fluctuations in the low refractive index layer (C) and suppressing luminance deterioration.

FIG. 4 shows a cross-sectional view of one aspect of the barrier rib-equipped substrate of the present invention having a low refractive index layer and an inorganic protective layer I. It has partitions 2 and pixels 3 patterned on an underlying substrate 1, and further has a low refractive index layer 4 and an inorganic protective layer I(5) on these.

In addition, the substrate with a partition of the present invention preferably has an inorganic protective layer II with a thickness of 50 to 1,000 nm between the pixel (B) and the low refractive index layer (C). By having the inorganic protective layer II, it becomes difficult for the raw materials forming the pixel (B) to move from the pixel (B) to the low refractive index layer, thereby suppressing the refractive index fluctuation of the low refractive index layer (C) and suppressing luminance deterioration. You can.

Fig. 5 shows a cross-sectional view of one aspect of the barrier rib-equipped substrate of the present invention having a low refractive index layer and an inorganic protective layer II. It has partitions 2 and pixels 3 patterned on a base substrate 1, and further has an inorganic protective layer II 6 and a low refractive index layer 4 on these.

In addition, the substrate with a partition of the present invention preferably has a color filter (hereinafter sometimes referred to as “color filter”) with a thickness of 1 to 5 μm between the base substrate and the pixel B. do. A color filter has the function of transmitting visible light in a specific wavelength range and changing the transmitted light to a desired color. By having a color filter, the color purity of the display device can be improved. Color purity can be further improved by setting the thickness of the color filter to 1㎛ or more. On the other hand, luminance can be further improved by setting the thickness of the color filter to 5 μm or less.

Fig. 6 shows a cross-sectional view of one aspect of the substrate with a partition of the present invention having a color filter. It has a partition 2 and a color filter 7 patterned on a base substrate 1, and has a pixel 3 on the color filter 7.

Examples of color filters include color filters using pigment-dispersed materials in which pigments are dispersed in photoresists, which are used in flat panel displays such as liquid crystal displays. More specifically, a blue color filter that selectively transmits wavelengths of 400 nm to 550 nm, a green color filter that selectively transmits wavelengths of 500 nm to 600 nm, a yellow color filter that selectively transmits wavelengths of 500 nm or more, and a yellow color filter that selectively transmits wavelengths of 600 nm or more. A transmitting red color filter, etc. can be mentioned. Additionally, the color filters may be stacked separately from the pixel B containing the color conversion light emitting material, or may be stacked integrally.

In addition, the substrate with a partition of the present invention preferably has an inorganic protective layer III and/or a yellow organic protective layer with a thickness of 50 to 1,000 nm between the color filter and the pixel (B). By having the inorganic protective layer III, it becomes difficult for the forming material of the color filter to reach the pixel B containing the color conversion light emitting material from the color filter, thereby preventing luminance deterioration of the pixel B containing the color conversion light emitting material. It can be suppressed. Additionally, by having a yellow organic protective layer, blue leakage light that cannot be completely converted by the pixel B containing the color conversion light-emitting material can be cut, and color reproducibility can be improved.

Fig. 7 shows a cross-sectional view of one aspect of the barrier rib-equipped substrate of the present invention having a color filter and an inorganic protective layer III and/or a yellow organic protective layer. It has a partition 2 and a color filter 7 patterned on a base substrate 1, and has an inorganic protective layer III and/or a yellow organic protective layer 8 thereon, and an inorganic protective layer III and/or a yellow organic protective layer 8. It has pixels (3) arranged and spaced apart by a partition (2) covered with a protective layer (8).

In addition, the substrate with a partition of the present invention preferably has an inorganic protective layer IV and/or a yellow organic protective layer with a thickness of 50 to 1,000 nm on the base substrate. The inorganic protective layer IV and/or the yellow organic protective layer acts as a refractive index adjustment layer, allowing light emitted from the pixel B to be extracted more efficiently, thereby further improving the luminance of the display device. Additionally, the yellow organic protective layer can cut blue leakage light that could not be fully converted by the pixel B containing the color conversion light-emitting material and improve color reproducibility. It is more preferable that the inorganic protective layer IV and/or the yellow organic protective layer are provided between the base substrate and the partition A and the pixel B.

FIG. 8 shows a cross-sectional view of one aspect of the barrier rib-equipped substrate of the present invention having an inorganic protective layer IV and/or a yellow organic protective layer. It has an inorganic protective layer IV and/or a yellow organic protective layer 9 on the base substrate 1, and has a partition 2 and a color filter 7 patterned thereon, and a partition 2 patterned thereon, and It has pixels (3).

Examples of the materials constituting the inorganic protective layers I to IV include metal oxides such as silicon oxide, indium tin oxide, and gallium zinc oxide; metal nitrides such as silicon nitride; Fluorides, such as magnesium fluoride, can be mentioned. You may contain two or more of these. Among these, silicon nitride or silicon oxide is more preferable because it has low water vapor permeability and high permeability.

The thickness of the inorganic protective layers I to IV is preferably 50 nm or more, and more preferably 100 nm or more, from the viewpoint of sufficiently suppressing the penetration of substances such as water vapor. On the other hand, from the viewpoint of suppressing a decrease in transmittance, the thickness of the inorganic protective layers I to IV is preferably 800 nm or less, and more preferably 500 nm or less.

The thickness of the inorganic protective layers I to IV is measured by exposing a cross section perpendicular to the base substrate using a polishing device such as a cross section polisher and observing the cross section enlarged using a scanning electron microscope or a transmission electron microscope. can do.

Examples of methods for forming the inorganic protective layers I to IV include sputtering and the like. The inorganic protective layer is preferably colorless and transparent or yellow transparent.

The yellow organic protective layer is obtained, for example, by pattern processing the resin composition of the present invention containing an organometallic compound containing silver as an organometallic compound. As described above, the organometallic compound containing silver decomposes and aggregates in the heating process during pattern formation to form yellow particles, and has the function of yellowing the protective layer. Examples of organometallic compounds containing silver include silver neodecanoate, silver octylate, and silver salicylate. Among these, silver neodecanoate is preferable from the viewpoint of further yellowing. In the resin composition for a yellow organic protective layer, the content of the organometallic compound containing silver is preferably 0.2 to 5% by weight of the solid content. By setting the content of the organometallic compound containing silver to 0.2% by weight or more, more yellowing can be achieved. The content of the organometallic compound containing silver is more preferably 1.5% by weight or more in solid content. On the other hand, transmittance can be further improved by setting the content of the organometallic compound containing silver to 5% by weight or less in the solid content.

The resin composition that forms the yellow organic protective layer may contain a yellow pigment. As a yellow pigment, for example, pigment yellow (hereinafter abbreviated as PY) PY12, PY13, PY17, PY20, PY24, PY83, PY86, PY93, PY95, PY109, PY110, PY117, PY125, PY129, PY137, PY138, PY139. , PY147, PY148, PY150, PY153, PY154, PY166, PY168, PY185, etc. Among them, a yellow pigment selected from PY139, PY147, PY148 and PY150 is preferable from the viewpoint of selectively blocking blue light.

As a method of forming a pattern of the yellow organic protective layer, a method of forming a pattern using a photosensitive paste method is preferable, similar to the above-mentioned partition (A-1).

As shown in FIG. 7, when forming the yellow organic protective layer 8 on the color filter 7, the yellow organic protective layer 8 may serve as an overcoat layer that flattens each pixel of the color filter.

The thickness of the yellow organic protective layer is preferably 100 nm or more, and more preferably 500 nm or more, from the viewpoint of sufficiently blocking blue leakage light. On the other hand, from the viewpoint of suppressing a decrease in light extraction efficiency, the thickness of the yellow organic protective layer is preferably 3000 nm or less, and more preferably 2000 nm or less.

Next, the display device of the present invention will be described. The display device of the present invention has the above partition-equipped substrate and a light emitting light source. The luminescent light source is preferably a luminescent light source selected from liquid crystal cells, organic EL cells, mini LED cells, and micro LED cells. Since it has excellent luminescence properties, an organic EL cell is more preferable as a luminescent light source. Here, the mini LED cell refers to a cell in which a large number of LEDs having a vertical and horizontal length of approximately 100 μm to 10 mm are arranged. A micro LED cell refers to a cell in which a large number of LEDs with a vertical and horizontal length of less than 100 μm are arranged.

The manufacturing method of the display device of the present invention will be explained by taking an example of a display device having the substrate with a partition of the present invention and an organic EL cell. A photosensitive polyimide resin is applied on a glass substrate, and an insulating film having an opening is formed using photolithography. After sputtering aluminum thereon, the aluminum is patterned by photolithography to form a back electrode layer made of aluminum in the opening without an insulating film. Subsequently, tris(8-quinolinolato)aluminum (hereinafter abbreviated as Alq3) was formed as an electron transport layer thereon by vacuum deposition, and then dicyanomethylene pyran, quinacridone and 4, were added to Alq3 as an emitting layer. A white light-emitting layer doped with 4'-bis(2,2-diphenylvinyl)biphenyl is formed. Next, N,N'-diphenyl-N,N'-bis(α-naphthyl)-1,1'-biphenyl-4,4'-diamine is formed into a film as a hole transport layer by vacuum deposition. Finally, ITO is deposited as a transparent electrode by sputtering, and an organic EL cell with a white light-emitting layer is produced. A display device can be produced by opposing the above-described barrier-equipped substrate and the organic EL cell obtained in this way and bonding them with a sealant.

Example

The present invention will be described in more detail below using examples and comparative examples, but the present invention is not limited to these scopes. In addition, among the compounds used, the names of those for which abbreviations are used are shown below.

PGMEA: propylene glycol monomethyl ether acetate

DAA: diacetone alcohol

BHT: Dibutylhydroxytoluene.

The solid content concentration of the polysiloxane solution in Synthesis Examples 1 to 4 was determined by the following method. Weighed 1.5 g of polysiloxane solution in an aluminum cup and heated it at 250°C for 30 minutes using a hot plate to evaporate the liquid. The weight of the solid content remaining in the aluminum cup after heating was measured, and the solid content concentration of the polysiloxane solution was determined from the ratio to the weight before heating.

The weight average molecular weight of polysiloxane in Synthesis Examples 1 to 4 was determined by the following method. Using a GPC analysis device (HLC-8220; manufactured by Tosoh Corporation), GPC analysis was performed based on “JIS K7252-3 (date of establishment = 2008/03/20)” using tetrahydrofuran as the mobile phase. , the weight average molecular weight in terms of polystyrene was measured.

The content ratio of each repeating unit in polysiloxane in Synthesis Examples 1 to 4 was determined by the following method. The polysiloxane solution was injected into an NMR sample tube made of "Teflon" (registered trademark) with a diameter of 10 mm, and ²⁹ Si-NMR measurement was performed, and the Si derived from a specific organosilane relative to the integrated value of the entire Si derived from the organosilane was measured. The content ratio of each repeating unit was calculated from the ratio of the integral values of . ²⁹ Si-NMR measurement conditions are shown below.

Device: Nuclear magnetic resonance device (JNM-GX270; manufactured by Nippon Electronics Co., Ltd.)

Measurement method: gated decoupling method

Measured nuclear frequency: 53.6693MHz ( ²⁹ Si nuclei)

Spectral Width: 20000Hz

Pulse Width: 12μs (45° pulse)

Pulse repetition time: 30.0 seconds

Solvent: Acetone-d6

Reference substance: tetramethylsilane

Measurement temperature: 23℃

Sample rotation speed: 0.0Hz.

Synthesis Example 1 Polysiloxane (PSL-1) solution

In a 1000 ml three-necked flask, 147.32 g (0.675 mol) of trifluoropropyltrimethoxysilane, 40.66 g (0.175 mol) of 3-methacryloxypropylmethyldimethoxysilane, and 3-trimethoxysilylpropylsuccinic anhydride. Add 26.23 g (0.10 mol), 12.32 g (0.05 mol) of 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane, 0.808 g of BHT, and 171.62 g of PGMEA, and add 52.65 g of water while stirring at room temperature. An aqueous phosphoric acid solution containing 2.265 g of phosphoric acid (1.0% by weight based on the monomer input) dissolved in g was added over 30 minutes. After that, the flask was immersed in an oil bath at 70°C and stirred for 90 minutes, and then the temperature of the oil bath was raised to 115°C over 30 minutes. One hour after the start of the temperature increase, the solution temperature (internal temperature) reached 100°C, and the solution was heated and stirred for 2 hours (internal temperature was 100 to 110°C) to obtain a polysiloxane solution. Additionally, during the temperature increase and heating and stirring, a mixed gas containing 95 volume% nitrogen and 5 volume% oxygen was fractionated at 0.05 liter/liter. During the reaction, a total of 131.35 g of by-products, methanol and water, flowed out. PGMEA was added to the obtained polysiloxane solution so that the solid content concentration was 40% by weight, thereby obtaining a polysiloxane (PSL-1) solution. Additionally, the weight average molecular weight of the obtained polysiloxane (PSL-1) was 4,000. In addition, in polysiloxane (PSL-1), trifluoropropyltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-trimethoxysilylpropylsuccinic anhydride, and 3-(3,4-epoxycyclo The molar ratios of each repeating unit derived from hexyl)propyltrimethoxysilane were 67.5 mol%, 17.5 mol%, 10 mol%, and 5 mol%, respectively.

Synthesis Example 2 Polysiloxane (PSL-2) solution

In a 1000 ml three-neck flask, 116.07 g (0.475 mol) of diphenyldimethoxysilane, 0.20 mol of dimethyldimethoxysilane, 43.46 g (0.175 mol) of 3-methacryloxypropyltrimethoxysilane, and 3-tri 26.23g (0.10mol) of methoxysilylpropylsuccinic anhydride, 12.32g (0.05mol) of 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane, 0.843g of BHT, and 176.26g of PGMEA were added, While stirring at room temperature, an aqueous phosphoric acid solution containing 2.221 g of phosphoric acid (1.0% by weight based on the input monomer) dissolved in 43.65 g of water was added over 30 minutes. After that, a polysiloxane solution was obtained in the same manner as in Synthesis Example 1. During the reaction, a total of 136.90 g of by-products, methanol and water, flowed out. PGMEA was added to the obtained polysiloxane solution so that the solid content concentration was 40% by weight, and a polysiloxane (PSL-2) solution was obtained. Additionally, the weight average molecular weight of the obtained polysiloxane (PSL-2) was 2,800. In addition, diphenyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-trimethoxysilylpropylsuccinic anhydride, and 3-(3,4-epoxycyclohexyl)propyl in polysiloxane (PSL-2) The molar ratios of each repeating unit derived from trimethoxysilane were 47.5 mol%, 20 mol%, 17.5 mol%, 10 mol%, and 5 mol%, respectively.

Synthesis Example 3 Polysiloxane (PSL-3) solution

In a 1000 ml three-neck flask, 147.32 g (0.675 mol) of trifluoropropyltrimethoxysilane, 43.46 g (0.175 mol) of 3-methacryloxypropyltrimethoxysilane, and 3-trimethoxysilylpropylsuccinic acid. Add 26.23 g (0.10 mol) of anhydride, 12.32 g (0.05 mol) of 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane, 0.810 g of BHT, and 172.59 g of PGMEA, and add water while stirring at room temperature. An aqueous phosphoric acid solution containing 2.293 g of phosphoric acid (1.0% by weight based on the input monomer) dissolved in 54.45 g was added over 30 minutes. After that, a polysiloxane solution was obtained in the same manner as in Synthesis Example 1. During the reaction, a total of 140.05 g of by-products, methanol and water, flowed out. PGMEA was added to the obtained polysiloxane solution so that the solid content concentration was 40% by weight, and a polysiloxane (PSL-3) solution was obtained. Additionally, the weight average molecular weight of the obtained polysiloxane (PSL-3) was 4,100. In addition, in polysiloxane (PSL-3), trifluoropropyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-trimethoxysilylpropylsuccinic anhydride, and 3-(3,4-epoxycyclo The molar ratios of each repeating unit derived from hexyl)propyltrimethoxysilane were 67.5 mol%, 17.5 mol%, 10 mol%, and 5 mol%, respectively.

Synthesis Example 4 Polysiloxane (PSL-4) solution

In a 1000 ml three-necked flask, 34.05 g (0.250 mol) of methyltrimethoxysilane, 99.15 g (0.500 mol) of phenyltrimethoxysilane, 31.25 g (0.150 mol) of tetraethoxysilane, 3-(3, 24.64 g (0.100 mol) of 4-epoxycyclohexyl)propyltrimethoxysilane and 174.95 g of PGMEA were added, and 0.945 g of phosphoric acid (0.50% by weight based on the added monomer) was dissolved in 56.70 g of water while stirring at room temperature to create an aqueous phosphoric acid solution. was added over 30 minutes. After that, a polysiloxane solution was obtained in the same manner as in Synthesis Example 1. During the reaction, a total of 129.15 g of by-products, methanol and water, flowed out. PGMEA was added to the obtained polysiloxane solution so that the solid content concentration was 40% by weight, and a polysiloxane (PSL-4) solution was obtained. Additionally, the weight average molecular weight of the obtained polysiloxane (PSL-4) was 4,200. In addition, each repeating unit derived from methyltrimethoxysilane, phenyltrimethoxysilane, tetraethoxysilane, and 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane in polysiloxane (PSL-4) The molar ratios were 25 mol%, 50 mol%, 15 mol%, and 10 mol%, respectively.

The compositions of Synthesis Examples 1 to 4 are combined and shown in Table 1.

Synthesis Example 5 Green organic phosphor

3,5-dibromobenzaldehyde (3.0g), 4-t-butylphenylboronic acid (5.3g), tetrakis(triphenylphosphine)palladium (0) (0.4g) and potassium carbonate (2.0g) It was placed in a flask and purged with nitrogen. Degassed toluene (30 mL) and degassed water (10 mL) were added thereto, and the mixture was refluxed for 4 hours. After the reaction solution was cooled to room temperature and separated, the organic layer was washed with saturated saline solution. This organic layer was dried with magnesium sulfate, filtered, and the solvent was distilled off. The obtained reaction product was purified by silica gel column chromatography to obtain 3,5-bis(4-t-butylphenyl)benzaldehyde (3.5 g) as a white solid. Next, 3,5-bis(4-t-butylphenyl)benzaldehyde (1.5 g) and 2,4-dimethylpyrrole (0.7 g) were added to the flask, and dehydrated dichloromethane (200 mL) and trifluoroacetic acid (1 drop) was added and stirred for 4 hours under a nitrogen atmosphere. A dehydrated dichloromethane solution of 2,3-dichloro-5,6-dicyano-1,4-benzoquinone (0.85 g) was added to the reaction mixture, and the mixture was stirred for an additional 1 hour. After completion of the reaction, boron trifluoride diethyl ether complex (7.0 mL) and diisopropylethylamine (7.0 mL) were added and stirred for 4 hours, then water (100 mL) was added and stirred, and the organic layer was separated. . This organic layer was dried with magnesium sulfate, filtered, and the solvent was distilled off. The obtained reaction product was purified by silica gel column chromatography to obtain 0.4 g of green powder (yield 17%). The results of ¹ H-NMR analysis of the obtained green powder are as follows, and it was confirmed that the green powder obtained above was [G-1] represented by the following structural formula.

¹ H-NMR (CDCl ₃ (d=ppm)): 7.95 (s, 1H), 7.63-7.48 (m, 10H), 6.00 (s, 2H), 2.58 (s, 6H), 1.50 (s, 6H) , 1.37(s, 18H).

Synthesis Example 6 Red organic phosphor

A mixed solution of 300 mg of 4-(4-t-butylphenyl)-2-(4-methoxyphenyl)pyrrole, 201 mg of 2-methoxybenzoyl chloride, and 10 ml of toluene was heated at 120°C for 6 hours under a nitrogen stream. After cooling to room temperature, the solvent was evaporated. The obtained residue was washed with 20 ml of ethanol and dried under vacuum to obtain 260 mg of 2-(2-methoxybenzoyl)-3-(4-t-butylphenyl)-5-(4-methoxyphenyl)pyrrole. Next, 260 mg of 2-(2-methoxybenzoyl)-3-(4-t-butylphenyl)-5-(4-methoxyphenyl)pyrrole, 4-(4-t-butylphenyl)-2-( A mixed solution of 180 mg of 4-methoxyphenyl)pyrrole, 206 mg of methanesulfonic anhydride, and 10 ml of degassed toluene was heated at 125°C for 7 hours under a nitrogen stream. After cooling the reaction mixture to room temperature, 20 ml of water was added and extracted with 30 ml of dichloromethane. The organic layer was washed twice with 20 ml of water, evaporated, and dried under vacuum to obtain a pyromethene body as a residue. Next, 305 mg of diisopropylethylamine and 670 mg of boron trifluoride diethyl ether complex were added to the obtained mixed solution of pyromethene body and 10 ml of toluene under a nitrogen stream, and stirred at room temperature for 3 hours. 20 ml of water was added to this reaction mixture, and the mixture was extracted with 30 ml of dichloromethane. The organic layer was washed twice with 20 ml of water, dried over magnesium sulfate, and then evaporated. After purification by silica gel column chromatography and vacuum drying, 0.27 g of red-purple powder was obtained (yield 70%). The results of ¹ H-NMR analysis of the obtained red-purple powder are as follows, and it was confirmed that the red-purple powder obtained above was [R-1] represented by the following structural formula.

¹ H-NMR (CDCl ₃ (d=ppm)): 1.19(s, 18H), 3.42(s, 3H), 3.85(s, 6H), 5.72(d, 1H), 6.20(t, 1H), 6.42 -6.97(m, 16H), 7.89(d, 4H).

Synthesis Example 7 Polysiloxane solution containing silica particles (LS-1)

In a 500ml three-necked flask, 0.05g (0.4mmol) of methyltrimethoxysilane, 0.66g (3.0mmol) of trifluoropropyltrimethoxysilane, and 0.10g (0.4mmol) of trimethoxysilylpropylsuccinic anhydride. , 7.97 g (34 mmol) of γ-acryloxypropyltrimethoxysilane and 224.37 g of an isopropyl alcohol dispersion of 15.6% by weight silica particles (IPA-ST-UP: manufactured by Nissan Chemical Industries, Ltd.) were added, and ethylene was added. 163.93 g of glycol mono-t-butyl ether was added. While stirring at room temperature, an aqueous phosphoric acid solution containing 0.088 g of phosphoric acid dissolved in 4.09 g of water was added over 3 minutes. After that, the flask was immersed in an oil bath at 40°C and stirred for 60 minutes, and then the temperature of the oil bath was raised to 115°C over 30 minutes. 1 hour after the start of the temperature increase, the internal temperature of the solution reached 100°C, and by heating and stirring for an additional 2 hours (internal temperature 100 to 110°C), a polysiloxane solution containing silica particles (LS-1) was obtained. In addition, nitrogen was classified at 0.05 l (liter)/during the temperature increase and heating and stirring. During the reaction, a total of 194.01 g of by-products, methanol and water, flowed out. The solid content concentration of the obtained silica particle-containing polysiloxane solution (LS-1) was 24.3% by weight, and the contents of polysiloxane and silica particles in the solid content were 15% by weight and 85% by weight, respectively. From methyltrimethoxysilane, trifluoropropyltrimethoxysilane, 3-trimethoxysilylpropylsuccinic anhydride, and γ-acryloxypropyltrimethoxysilane of the polysiloxane in the obtained silica particle-containing polysiloxane (LS-1). The molar ratios of each derived repeating unit were 1.0 mol%, 8.0 mol%, 1.0 mol%, and 90.0 mol%, respectively.

Example 1 Resin composition for partition (P-1)

As a white pigment, 5.00 g of titanium dioxide pigment (R-960; manufactured by BASF Japan Co., Ltd. (hereinafter “R-960”)) was mixed with 5.00 g of the polysiloxane (PSL-1) solution obtained in Synthesis Example 1 as a resin. and dispersed using a mill-type disperser filled with zirconia beads to obtain a pigment dispersion (MW-1). Additionally, 1.00 g of bis(acetylacetonato)palladium as an organometallic compound and 0.861 g of triphenylphosphine as a coordination compound having a phosphorus atom (equimolar amount relative to the organometallic compound) were dissolved in 8.139 g of DAA, An organometallic compound solution (OM-1) was obtained.

Next, 9.98 g of the pigment dispersion (MW-1), 1.86 g of the organometallic compound solution (OM-1), 0.98 g of the polysiloxane (PSL-1) solution, ethanone as a photopolymerization initiator, and 1-[9-ethyl- 6-(2-methylbenzoyl)-9H-carbazol-3-yl]-, 1-(O-acetyloxime) (“Irgacure” (registered trademark) OXE-02, manufactured by BASF Japan Co., Ltd. (hereinafter referred to as “OXE-02”)) 0.050 g, bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide (“Irgacure” 819, manufactured by BASF Japan Co., Ltd. (hereinafter “IC-819”)) 0.400 g, 1,2-diisopropyl-3-[bis(dimethylamino)methylene]guanidinium 2-(3-benzoylphenyl)propionic acid as a photobase generator (WPBG-266 (trade name), Fujifilm Wako Pure Chemical Industries, Ltd. 0.100 g of dipentaerythritol hexaacrylate ("KAYARAD" (registered trademark) DPHA, manufactured by Shin Nippon Yakyo Co., Ltd. (hereinafter referred to as "DPHA") as a photopolymerizable compound (hereinafter referred to as "WPBG-266") )) 1.20 g, 40% by weight PGMEA dilution of a photopolymerizable fluorine-containing compound (“Megapec” (registered trademark) RS-76-E, manufactured by DIC Corporation (hereinafter “RS-76-E”)) as a liquid-repellent compound. Solution 1.00 g, 3',4'-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate ("Celoxide" (registered trademark) 2021P, manufactured by Daicel Co., Ltd. (hereinafter referred to as "Celoxide" (registered trademark) ) 2021P')) 0.100 g, ethylenebis(oxyethylene)bis[3-(5-tert-butyl-4-hydroxy-m-tolyl)propionate] ("Irganox" (registered trademark) 1010, 0.030 g of BASF Japan Co., Ltd. (hereinafter “IRGANOX (registered trademark) 1010”)) and an acrylic surfactant (“BYK” (registered trademark) 352, manufactured by Big Chemi Japan Co., Ltd. (hereinafter “BYK-352”)) 0.100 g of a 10% by weight diluted solution of PGMEA (corresponding to a concentration of 500 ppm) was dissolved in 4.20 g of PGMEA as a solvent and stirred. The obtained mixture was filtered through a 5.0 μm filter to obtain a resin composition for partition walls (P-1).

Examples 2 to 3 Resin compositions for partition walls (P-2) to (P-3)

Resin compositions for partition walls (P-2) and (P-3) were prepared in the same manner as in Example 1, except that the polysiloxane (PSL-2) or (PSL-3) solution was used instead of the polysiloxane (PSL-1) solution, respectively. got it

Example 4 Resin composition for partition (P-4)

Example 1, except that "Megapec" (registered trademark) F477 (Dainippon Ink Kagaku Kogyo Co., Ltd.) 40% by weight PGMEA diluted solution was used instead of the 40% by weight PGMEA diluted solution of RS-76-E. Similarly, the resin composition for partition walls (P-4) was obtained.

Example 5 Resin composition for partition (P-5)

5.00 g of R-960 as a white pigment and 5.00 g of polysiloxane (PSL-4) solution as a resin were mixed, and dispersed using a mill-type disperser filled with zirconia beads to obtain a pigment dispersion (MW-4). 9.98 g of the pigment dispersion (MW-4), 1.86 g of the organometallic compound solution (OM-1), 1.16 g of the polysiloxane (PSL-4) solution, 0.10 g of WPBG-266 as a photobase generator, As a liquid-repellent compound, 1.00 g of a 40% by weight PGMEA diluted solution of F477, 0.100 g of Celoxide (registered trademark) 2021P, and 1.60 g of THP-17 (brand name, manufactured by Toyokose Kogyo Co., Ltd.) as a quinonediazide compound, the interface 0.100 g of PGMEA 10% by weight diluted solution of activator BYK-352 and 4.10 g of PGMEA were mixed and stirred. The obtained mixture was filtered through a 5.0 μm filter to obtain a resin composition for partition walls (P-5).

Example 6 Resin composition for partition (P-6)

An organometallic compound solution (OM-2) was prepared in the same manner as the above-mentioned organometallic compound solution (OM-1), except that silver neodecanoate was used instead of bis(acetylacetonato)palladium as the organometallic compound. A resin composition for partitions (P-6) was obtained in the same manner as in Example 1, except that the organometallic compound solution (OM-2) was used instead of the organometallic compound solution (OM-1).

Example 7 Resin composition for partition (P-7)

An organometallic compound solution (OM-3) was prepared in the same manner as the above-mentioned organometallic compound solution (OM-1), except that gold chlorotriphenylphosphine was used as the organometallic compound instead of bis(acetylacetonato)palladium. A resin composition for partition walls (P-7) was obtained in the same manner as in Example 1, except that the organometallic compound solution (OM-3) was used instead of the organometallic compound solution (OM-1).

Example 8 Resin composition for partition (P-8)

An organometallic compound solution (OM-4) was prepared in the same manner as the above organometallic compound solution (OM-1), except that bis(acetylacetonato)platinum was used instead of bis(acetylacetonato)palladium as the organometallic compound. . A resin composition for partition walls (P-8) was obtained in the same manner as in Example 1, except that the organometallic compound solution (OM-4) was used instead of the organometallic compound solution (OM-1).

Example 9 Resin composition for partition (P-9)

Except that the addition amount of the organometallic compound solution (OM-1) was changed to 0.929 g, the addition amount of the polysiloxane (PSL-1) solution was changed to 1.41 g, and 4.20 g of PGMEA as the solvent was changed to 4.70 g of PGMEA, as in Example 1. In the same manner, a resin composition for partition walls (P-9) was obtained.

Example 10 Resin composition for partition (P-10)

Example 1 and 1, except that the addition amount of the organometallic compound solution (OM-1) was changed to 0.400 g, the addition amount of the polysiloxane (PSL-1) solution was changed to 1.940 g, and 4.20 g of PGMEA as the solvent was changed to 6.27 g of PGMEA. Similarly, a resin composition for partition walls (P-10) was obtained.

Example 11 Resin composition for partition (P-11)

Example 1 and 1, except that the addition amount of the organometallic compound solution (OM-1) was changed to 4.595 g, the addition amount of the polysiloxane (PSL-1) solution was changed to 0.010 g, and 4.20 g of PGMEA as the solvent was changed to 2.92 g of PGMEA. Similarly, a resin composition for partition walls (P-11) was obtained.

Example 12 Resin composition for partition (P-12)

Mix 5.00 g of R-960 as a white pigment, 5.00 g of polysiloxane (PSL-1) solution as a resin, and 0.01 g of titanium nitride as a black pigment, and disperse them using a mill-type disperser filled with zirconia beads to obtain a pigment dispersion (MW). -2) was obtained. Example except that 9.99 g of pigment dispersion (MW-2) was added instead of pigment dispersion (MW-1), the addition amount of polysiloxane (PSL-1) solution was changed to 1.38 g, and 4.72 g of PGMEA was used as a solvent. In the same manner as in 9, a resin composition for partition walls (P-12) was obtained.

Example 13 Resin composition for partition (P-13)

10.0 g of polysiloxane (PSL-1) solution as a resin and 0.15 g of titanium nitride as a black pigment were mixed and dispersed using a mill-type disperser filled with zirconia beads to obtain a pigment dispersion (MW-3). 9.99 g of pigment dispersion (MW-3) was added instead of pigment dispersion (MW-1), the amount of polysiloxane (PSL-1) solution was changed to 15.16 g, and the amount of PGMEA was changed from 4.20 g to 0.11 g. Except this, the resin composition for partition walls (P-13) was obtained in the same manner as in Example 1.

Example 14 Resin composition for partition (P-14)

Instead of the organometallic compound solution (OM-1), 1.85 g of a 10% DAA solution of bis(acetylacetonato)palladium was used as the organometallic compound, the addition amount of the polysiloxane (PSL-1) solution was changed to 1.34 g, and the solvent A resin composition for a partition (P-14) was obtained in the same manner as in Example 1, except that 4.20 g of PGMEA was changed to 3.85 g of PGMEA.

Example 15 Resin composition for partition (P-15)

A partition was prepared in the same manner as in Example 1, except that the photobase generator WPBG-266 was not added, the addition amount of the polysiloxane (PSL-1) solution was changed to 1.21 g, and PGMEA 4.20 g was changed to PGMEA 4.07 g as the solvent. A resin composition (P-15) was obtained.

Example 16 Resin composition for partition (P-16)

Except that the 40% by weight PGMEA diluted solution of the liquid-repellent compound RS-76-E was not added, the addition amount of the polysiloxane (PSL-1) solution was changed to 2.01 g, and PGMEA 4.20 g was changed to PGMEA 4.17 g as the solvent. In the same manner as in Example 1, a resin composition for partition walls (P-16) was obtained.

Comparative Example 1 Resin composition for partition (P-17)

Instead of the organometallic compound solution (OM-1), 0.867g of an organometallic compound solution (OM-5) obtained using 1.861g of triphenylphosphine and 8.139g of DAA as a coordination compound having a phosphorus atom was added, and polysiloxane was added. (PSL-1) Except that the addition amount of the solution was changed to 1.41 g and the addition amount of PGMEA was changed from 4.20 g to 4.76 g, a resin composition for a partition (P-17) was obtained in the same manner as in Example 1.

Comparative Example 2 Resin composition for partition (P-18)

Mix 5.00 g of R-960 as a white pigment, 5.00 g of polysiloxane (PSL-1) solution as a resin, and 0.10 g of titanium nitride as a black pigment, and disperse them using a mill-type disperser filled with zirconia beads to obtain a pigment dispersion (MW). -4) was obtained. Next, 10.02 g of the pigment dispersion (MW-4), 1.73 g of the polysiloxane (PSL-1) solution, 0.050 g of OXE-02 as a photopolymerization initiator, 0.400 g of IC-819, and WPBG as a photobase generator. 0.10 g of -266, 1.20 g of DPHA as a photopolymerizable compound, 1.00 g of 40% by weight PGMEA diluted solution of RS-76-E as a liquid-repellent compound, 0.100 g of Celoxide (registered trademark) 2021P, IRGANOX (registered trademark) 0.030 g of 1010, 0.100 g of a 10% by weight diluted solution of PGMEA of BYK-352 as a surfactant, and 5.31 g of PGMEA as a solvent were mixed and stirred. The obtained mixture was filtered through a 5.0 μm filter to obtain a resin composition for partition walls (P-18).

Comparative Example 3 Resin composition for partition (P-19)

Mix 5.00 g of R-960 as a white pigment, 5.00 g of polysiloxane (PSL-1) solution as a resin, and 0.10 g of zirconium nitride as a black pigment, and disperse them using a mill-type disperser filled with zirconia beads to obtain a pigment dispersion (MW). -5) was obtained. A resin composition for partitions (P-19) was obtained in the same manner as in Comparative Example 2, except that the pigment dispersion liquid (MW-5) was used instead of the pigment dispersion liquid (MW-4).

Comparative Example 4 Resin composition for partition (P-20)

5.00 g of R-960 as a white pigment, 5.00 g of polysiloxane (PSL-1) solution as a resin, and 0.05 g of a mixed pigment of red pigment PR254 and blue pigment PB64 in a weight ratio of 60/40 as a black pigment were mixed, and zirconia beads were mixed. Pigment dispersion (MW-6) was obtained by dispersing using a charged mill-type disperser. A resin composition for partition walls (P-20) was obtained in the same manner as in Comparative Example 2, except that the pigment dispersion liquid (MW-6) was used instead of the pigment dispersion liquid (MW-4).

Comparative Example 5 Resin composition for partition (P-21)

An organometallic compound solution (OM-5) was prepared in the same manner as the above-mentioned organometallic compound solution (OM-1), except that tris(acetylacetonato)iron was used instead of bis(acetylacetonato)palladium as the organometallic compound. . A resin composition for partitions (P-21) was obtained in the same manner as in Example 1, except that the organometallic compound solution (OM-5) was used instead of the organometallic compound solution (OM-1).

Comparative Example 6 Resin composition for partition (P-22)

An organometallic compound solution (OM-5) was prepared in the same manner as the above organometallic compound solution (OM-1), except that bis(acetylacetonato)nickel was used instead of bis(acetylacetonato)palladium as the organometallic compound. . A resin composition for partitions (P-22) was obtained in the same manner as in Example 1, except that the organometallic compound solution (OM-6) was used instead of the organometallic compound solution (OM-1).

The compositions of Examples 1 to 16 and Comparative Examples 1 to 6 are combined and shown in Tables 2 and 3.

Preparation Example 1 Color conversion luminescent material composition (CL-1)

Green quantum dot material (Lumidot 640 CdSe/ZnS, average particle diameter: 6.3 nm: manufactured by Aldrich) containing 20 parts by weight of a 0.5% by weight toluene solution, 45 parts by weight of DPHA, and "Irgacure" (registered trademark) 907 (BASF Japan (BASF Japan) 5 parts by weight of (product name), 166 parts by weight of PGMEA solution of acrylic resin (SPCR-18 (trade name), manufactured by Showa Denko Co., Ltd.) and 97 parts by weight of toluene were mixed and stirred evenly. dissolved. The obtained mixture was filtered through a 0.45㎛ syringe filter to prepare a color conversion light-emitting material composition (CL-1).

Preparation Example 2 Color conversion luminescent material composition (CL-2)

A color conversion light-emitting material composition (CL- 2) was prepared.

Preparation example 3 color conversion luminescent material composition (CL-3)

A color conversion light-emitting material composition (CL- 3) was prepared.

Preparation Example 4 Color filter forming material (CF-1)

90 g of C.I. Pigment Green 59, 60 g of C.I. Pigment Yellow 150, 75 g of polymer dispersant ("BYK" (registered trademark)-6919 (brand name) manufactured by Big Chemistry (hereinafter referred to as "BYK-6919")), binder resin ("BYK" A slurry was prepared by mixing 100 g of “Adeka Ackles” (registered trademark) WR301 (trade name) manufactured by ADEKA Co., Ltd. and 675 g of PGMEA. The beaker containing the slurry was connected to a dyno mill and a tube, and using zirconia beads with a diameter of 0.5 mm as a medium, dispersion treatment was performed for 8 hours at a peripheral speed of 14 m/s to produce Pigment Green 59 dispersion (GD-1).

Pigment Green 59 dispersion (GD-1) 56.54 g, acrylic resin ("Cyclomer" (registered trademark) P(ACA)Z250 (brand name) manufactured by Daicel and Allnex Co., Ltd. (hereinafter referred to as "P(ACA)Z250") )) 3.14 g, DPHA 2.64 g, photopolymerization initiator ("Optoma" (registered trademark) NCI-831 (trade name) manufactured by ADEKA Co., Ltd. (hereinafter "NCI-831")) 0.330 g, surfactant ("BYK") (Registered trademark) -333 (brand name) 0.04 g of Big Chemistry Co., Ltd. (hereinafter referred to as “BYK-333”), 0.01 g of BHT as a polymerization inhibitor, and 37.30 g of PGMEA as a solvent were mixed to form a color filter forming material (CF- 1) was produced.

Preparation Example 5 Resin composition for light-shielding partition

A slurry was prepared by mixing 150 g of carbon black (MA100 (trade name) manufactured by Mitsubishi Chemical Corporation), 75 g of polymer dispersant BYK-6919, 100 g of P(ACA)Z250, and 675 g of PGMEA. The beaker containing the slurry was connected to a dyno mill and a tube, and dispersion treatment was performed for 8 hours at a peripheral speed of 14 m/s using zirconia beads with a diameter of 0.5 mm as a medium to produce a pigment dispersion (MB-1).

56.54 g of pigment dispersion (MB-1), 3.14 g of P(ACA)Z250, 2.64 g of DPHA, 0.330 g of NCI-831, 0.04 g of BYK-333, 0.01 g of tertiary butylcatechol as a polymerization inhibitor, and 37.30 g of PGMEA was mixed to produce a resin composition for a light-shielding partition.

Preparation Example 6 Low refractive index layer forming material

5.350 g of the silica particle-containing polysiloxane solution (LS-1) obtained in Synthesis Example 6, 1.170 g of ethylene glycol mono-t-butyl ether, and 3.48 g of DAA were mixed, and then filtered through a 0.45㎛ syringe filter to obtain a low refractive index. Layer forming materials were prepared.

Preparation Example 7 Yellow organic protective layer forming material (YL-1)

150 g of C.I. Pigment Yellow 150, 75 g of polymer dispersant ("BYK" (registered trademark)-6919 (product name) manufactured by Big Chemistry (hereinafter referred to as "BYK-6919")), binder resin ("Adeka Arkles" (registered trademark) ) A slurry was prepared by mixing 100 g of WR301 (trade name) manufactured by ADEKA Co., Ltd. and 675 g of PGMEA. The beaker containing the slurry was connected to a dyno mill and a tube, and using zirconia beads with a diameter of 0.5 mm as a medium, dispersion treatment was performed for 8 hours at a peripheral speed of 14 m/s to produce Pigment Yellow 150 dispersion (YD-1).

An organometallic compound solution prepared using 3.09g of Pigment Yellow 150 dispersion (YD-1), 23.54g of polysiloxane (PSL-1) solution as a resin, 6.02g of DPHA as a photopolymerizable compound, and silver neodecanoate as an organometallic compound. 6.02 g of (OM-2), 0.20 g of OXE-02 as a photopolymerization initiator, 0.40 g of IC-819, 0.060 g of IRGANOX (registered trademark) 1010, and 0.050 g of a 10% by weight diluted solution of PGMEA of BYK-352 (concentration (equivalent to 500 ppm) was dissolved in 61.15 g of solvent PGMEA and stirred. The obtained mixture was filtered through a 5.0 μm filter to obtain a yellow organic protective layer forming material (YL-1).

(Examples 17 to 20, Examples 22 to 28, Examples 38 to 45, Comparative Examples 7 to 9)

As a base substrate, a square alkali-free glass substrate (manufactured by AGC Techno Glass Co., Ltd., thickness 0.7 mm) with a side of 10 cm was used. The resin composition for partitions shown in Tables 4 to 5 was spin-coated thereon, and dried at a temperature of 90°C for 2 minutes using a hot plate (product name: SCW-636, manufactured by Dainippon Screen Seizo Co., Ltd.) to produce a dried film. did. The produced dried film was exposed to light at an exposure dose of 200 mJ/cm2 (i-line) using a parallel light mask aligner (product name PLA-501F, manufactured by Canon Co., Ltd.) using an ultra-high pressure mercury lamp as a light source and through a photomask. Afterwards, using an automatic developing device (“AD-2000 (brand name)” manufactured by Takizawa Sangyo Co., Ltd.), shower development was performed for 100 seconds using a 0.045% by weight potassium hydroxide aqueous solution, followed by 30 seconds using water. Rinse for seconds. In addition, using an oven (brand name IHPS-222, manufactured by Espec Co., Ltd.), heating was performed at a temperature of 230°C in the air for 30 minutes, and a partition wall with a height of 10 μm and a width of 20 μm was formed on a glass substrate with a short side of 30 μm, Barrier walls were formed in a lattice pattern with a pitch of 150 μm on the long side.

The color conversion light-emitting material composition shown in Tables 4 and 5 was applied to the area separated by the barrier of the obtained barrier-equipped substrate using an inkjet method under a nitrogen atmosphere, and dried at 100°C for 30 minutes to form a pixel with a thickness of 5.0 μm. was formed, and a substrate with partition walls having the configuration shown in FIG. 2 was obtained.

(Example 21)

As a base substrate, a square alkali-free glass substrate (manufactured by AGC Techno Glass Co., Ltd., thickness 0.7 mm) with a side of 10 cm was used. The resin composition for partitions shown in Table 4 was spin-coated thereon, and dried at a temperature of 90°C for 2 minutes using a hot plate (brand name: SCW-636, manufactured by Dainippon Screen Seizo Co., Ltd.) to produce a dried film. The produced dried film was exposed to light at an exposure dose of 200 mJ/cm2 (i-line) using a parallel light mask aligner (product name PLA-501F, manufactured by Canon Co., Ltd.) using an ultra-high pressure mercury lamp as a light source and through a photomask. Afterwards, using an automatic developing device (“AD-2000 (brand name)” manufactured by Takizawa Sankyo Co., Ltd.), shower development was performed for 90 seconds with a 2.38% by weight aqueous solution of tetramethylammonium hydroxide, and then rinsed with water for 30 seconds. . After that, as before, bleaching was performed by exposure to an exposure dose of 500 mJ/cm2 (i line) without a photomask. In addition, using an oven (product name IHPS-222, manufactured by E-Spec Co., Ltd.), heating was performed in the air at a temperature of 230°C for 30 minutes, and a partition wall with a height of 10 μm and a width of 20 μm, with a short side of 30 μm, was formed on the glass substrate. Barrier walls were formed in a lattice pattern with a pitch of 150 μm on the long side.

The color conversion light-emitting material composition shown in Tables 4 and 5 was applied to the area separated by the barrier of the obtained barrier-equipped substrate using an inkjet method under a nitrogen atmosphere, and dried at 100°C for 30 minutes to form a pixel with a thickness of 5.0 μm. was formed, and a substrate with partition walls having the configuration shown in FIG. 2 was obtained.

(Example 29)

A low-refractive-index layer forming material was spin-coated on a substrate with partitions after forming pixels in the same manner as in Example 18, and the temperature was adjusted using a hot plate (product name: SCW-636, manufactured by Dainippon Screen Seizo Co., Ltd.). A dried membrane was produced by drying at 90°C for 2 minutes. Additionally, using an oven (brand name IHPS-222, manufactured by Espec Co., Ltd.), the low refractive index layer was formed by heating in air at a temperature of 90° C. for 30 minutes, thereby obtaining a substrate with partitions having the structure shown in FIG. 3 .

(Example 30)

On the low refractive index layer of the barrier rib-equipped substrate having the low refractive index layer obtained in Example 29, a film corresponding to the inorganic protective layer I with a thickness of 50 to 1,000 nm was formed using a plasma CVD device (PD-220NL, manufactured by Samco Corporation). A silicon nitride film with a thickness of 300 nm was formed, and a substrate with partitions having the structure shown in FIG. 4 was obtained.

(Example 31)

On the substrate with partitions obtained in Example 18, a silicon nitride film with a thickness of 300 nm, corresponding to an inorganic protective layer II with a thickness of 50 to 1,000 nm, was formed on the pixel upper layer using a plasma CVD device (PD-220NL, manufactured by Samco). did. Thereafter, on the inorganic protective layer II, a low refractive index layer with a thickness of 1.0 μm was formed by the same method as Example 29 using the low index layer forming material obtained in Preparation Example 6, and a low refractive index layer of the structure shown in FIG. 5 was formed. A board with a partition was obtained.

(Example 32)

Color filter forming material (CF-1) obtained by Preparation Example 4, obtained by the same method as Example 17, so that the film thickness after curing is 2.5 μm in the area separated by the partition of the substrate with partition before pixel formation. was applied and dried in vacuum. The area of the opening of the substrate with a partition was exposed to light at an exposure dose of 40 mJ/cm2 (i-line) through a photomask designed to be exposed. After developing with a 0.3% by weight tetramethylammonium aqueous solution for 50 seconds, heat curing was performed at 230°C for 30 minutes to form a color filter with a thickness of 2.5 μm and a width of 50 μm in the area separated by the partition. Thereafter, the color conversion light-emitting material composition (CL-2) obtained in Preparation Example 2 was applied on the color filter using an inkjet method under a nitrogen atmosphere, and dried at 100°C for 30 minutes to form a pixel with a thickness of 5.0 μm. was formed, and a substrate with partition walls having the configuration shown in FIG. 6 was obtained.

(Example 33)

A plasma CVD device (PD-220NL, manufactured by Samco) was used on the color filter of the substrate with partitions before pixel formation, on which a color filter with a thickness of 2.5 μm and a width of 50 μm was formed by the same method as in Example 32. A silicon nitride film with a thickness of 300 nm, corresponding to the inorganic protective layer III of 50 to 1,000 nm, was formed. Additionally, the color conversion light-emitting material composition (CL-2) obtained in Preparation Example 2 was applied onto the inorganic protective layer III using an inkjet method under a nitrogen atmosphere, and dried at 100°C for 30 minutes to form a pixel with a thickness of 5.0 μm. was formed, and a substrate with partition walls having the configuration shown in FIG. 7 was obtained.

(Example 34)

As a base substrate, a square alkali-free glass substrate (manufactured by AGC Techno Glass Co., Ltd., thickness 0.7 mm) with a side of 10 cm was used. A silicon nitride film with a thickness of 300 nm, corresponding to the inorganic protective layer IV with a thickness of 50 to 1,000 nm, was formed thereon using a plasma CVD device (PD-220NL, manufactured by Samco). A substrate with partitions having the configuration shown in FIG. 8 was obtained in the same manner as in Example 31, except that the above substrate was used instead of a square alkali-free glass substrate with a side of 10 cm.

(Example 35)

A yellow organic protective layer forming material (YL-) obtained in Preparation Example 7 was placed on a color filter of a substrate with a partition before pixel formation, on which a color filter with a thickness of 2.5 μm and a width of 50 μm was formed by the same method as in Example 32. 1) was applied and dried in vacuum. The area of the opening of the substrate with a partition was exposed to light at an exposure dose of 40 mJ/cm2 (i-line) through a photomask designed to be exposed. After developing with a 0.3% by weight tetramethylammonium aqueous solution for 50 seconds, heat curing was performed at 230°C for 30 minutes to form a yellow organic protective layer with a thickness of 1.0 μm and a width of 50 μm. Additionally, the color conversion light-emitting material composition (CL-2) obtained in Preparation Example 2 was applied onto the yellow organic protective layer using an inkjet method under a nitrogen atmosphere, and dried at 100°C for 30 minutes to form a pixel with a thickness of 5.0 μm. was formed, and a substrate with partition walls having the configuration shown in FIG. 7 was obtained.

(Example 36)

As a base substrate, a square alkali-free glass substrate (manufactured by AGC Techno Glass Co., Ltd., thickness 0.7 mm) with a side of 10 cm was used. The yellow organic protective layer forming material (YL-1) obtained in Preparation Example 7 was applied thereon and dried in vacuum. The dried film was exposed to light at an exposure dose of 40 mJ/cm2 (i line) without a photomask, developed for 50 seconds with a 0.3 wt% tetramethylammonium aqueous solution, and heat-cured at 230°C for 30 minutes to obtain a thickness of 1.0 μm. A yellow organic protective layer was formed. A substrate with partitions having the configuration shown in FIG. 8 was obtained in the same manner as in Example 31, except that the above substrate was used instead of a square alkali-free glass substrate with a side of 10 cm.

(Example 37)

As a base substrate, a square alkali-free glass substrate (manufactured by AGC Techno Glass Co., Ltd., thickness 0.7 mm) with a side of 10 cm was used. The light-shielding barrier forming material obtained in Preparation Example 5 was spin-coated thereon, and dried at a temperature of 90° C. for 2 minutes using a hot plate (product name: SCW-636, manufactured by Dainippon Screen Seizo Co., Ltd.) to produce a dried film. . The produced dried film was exposed to light at an exposure dose of 40 mJ/cm2 (i-line) using a parallel light mask aligner (product name PLA-501F, manufactured by Canon Co., Ltd.) using an ultra-high pressure mercury lamp as a light source and a photomask interposed. Afterwards, using an automatic developing device (“AD-2000 (brand name)” manufactured by Takizawa Sangyo Co., Ltd.), development was performed for 50 seconds with a 0.3% by weight tetramethylammonium aqueous solution, followed by 30 seconds using water. Rinse for seconds. In addition, using an oven (product name IHPS-222, manufactured by Espec Co., Ltd.), heating was performed in air at a temperature of 230°C for 30 minutes, and OD values per 2.0 μm in height, 20 μm in width, and 1.0 μm in thickness were recorded on a glass substrate. A substrate with light-shielding barrier ribs was obtained in which the barrier ribs of 2.0 were formed in a lattice pattern with a pitch interval of 30 μm on the short side and 150 μm on the long side. Thereafter, by the same method as in Example 17, partitions with a height of 10 μm and a width of 20 μm were formed on the light-shielding barrier ribs in the same grid pattern as the light-shielding barrier ribs with a pitch interval of 30 μm on the short side and 150 μm on the long side. A board with a partition was obtained. The color conversion light-emitting material composition (CL-2) obtained in Preparation Example 22 was applied to the area separated by the partition of the obtained barrier-equipped substrate using an inkjet method under a nitrogen atmosphere, and dried at 100° C. for 30 minutes to obtain a thickness of 5.0. A ㎛ pixel was formed, and a substrate with a partition having the structure shown in FIG. 9 was obtained.

The composition of each example and comparative example is shown in Tables 4 to 5.

The evaluation method for each Example and Comparative Example is shown below.

<Refractive index of white pigment>

For the white pigment used in each example and comparative example, method B (liquid immersion method using a microscope (Beckett method)) among the refractive index measurement methods for plastics specified in JIS K7142-2014 (date of establishment = 2014/04/20) The refractive index was measured by . The measurement wavelength was 550 nm. However, instead of the immersion liquid used in JIS K7142-2014, “contact liquid” manufactured by Shimadzu Device Seizo Co., Ltd. was used, and the measurement was performed under the conditions of immersion liquid temperature: 20°C. As a microscope, a polarizing microscope “Opti Photo” (manufactured by Nikon Corporation) was used. Thirty samples of each white pigment were prepared, their respective refractive indices were measured, and the average value was taken as the refractive index.

<Refractive index of polysiloxane and low refractive index layer>

Polysiloxane, which is a raw material of the barrier rib forming resin composition used in each Example and Comparative Example, and the low refractive index layer forming material obtained in Preparation Example 26 were applied on a silicon wafer with a spinner, respectively, and placed on a hot plate (product name SCW-636, It was dried at a temperature of 90°C for 2 minutes using Dainippon Screen (manufactured by Seizou Co., Ltd.). Afterwards, a cured film was produced by heating at 230°C in air for 30 minutes using an oven (IHPS-222; manufactured by Espec Co., Ltd.). Using a prism coupler (PC-2000 (manufactured by Metricon Co., Ltd.)), under atmospheric pressure and 20°C, light with a wavelength of 550 nm is irradiated from a direction perpendicular to the cured film surface to measure the refractive index, expressed as 3 decimal places. has been rounded.

<Resolution>

Using a spin coater (brand name 1H-360S, manufactured by Mikasa Co., Ltd.), the resin composition for partitions used in each Example and Comparative Example was applied to a heated film on a square alkali-free glass substrate with a side of 10 cm. It was spin-coated to a thickness of 10 μm, and dried at 90°C for 2 minutes using a hot plate (trade name: SCW-636, manufactured by Dainippon Screen Seizo Co., Ltd.) to produce a dried film with a thickness of 10 μm.

The produced dry film was aligned using a parallel light mask aligner (product name PLA-501F, manufactured by Canon Co., Ltd.), using an ultra-high pressure mercury lamp as a light source, and measuring 100㎛, 80㎛, 60㎛, 50㎛, 40㎛, 30㎛ and It was exposed with a gap of 100 ㎛ at an exposure dose of 200 mJ/cm 2 (i line) through a mask having a line & space pattern each having a width of 20 ㎛. Afterwards, using an automatic developing device (“AD-2000 (brand name)” manufactured by Takizawa Sangyo Co., Ltd.), shower development was performed for 100 seconds using a 0.045% by weight potassium hydroxide aqueous solution, followed by 30 seconds using water. Rinse for seconds.

The pattern after development was observed enlarged using a microscope with magnification adjusted to 100x, and the narrowest line width among the patterns in which no residue was visible in the unexposed area was set as the resolution. However, if there was residue even in the unexposed area near the 100 ㎛ wide pattern, it was set as “>100 ㎛”.

<Reflectance>

The partition forming resin composition used in each Example and Comparative Example was processed under the same conditions as each Example and Comparative Example, except that the entirety was exposed without a photomask during exposure, to form a solid film on a glass substrate. Produced. The obtained solid film was used as a model for the partition of the partition-equipped substrate obtained in each example and comparative example, and a solid film was measured using a spectrophotometer (product name: CM-2600d, manufactured by Konica Minolta Co., Ltd.) on a glass substrate with a solid film. The reflectance at a wavelength of 550 nm was measured in SCI mode from the membrane side. However, when cracks occur in the solid film, accurate values cannot be obtained due to cracks, etc., so the reflectance was not measured.

<Crack resistance>

The partition forming resin compositions used in each Example and Comparative Example were spin-coated so that the film thicknesses after heating were 5 μm, 10 μm, 15 μm, and 20 μm, respectively. For the subsequent process, a solid film was produced on a glass substrate by processing under the same conditions as each example and comparative example, except that the entire surface was exposed without a photomask during exposure. Using the obtained solid film as a barrier model for the barrier rib-equipped substrates obtained in each Example and Comparative Example, the glass substrate with the solid film was visually observed and the presence or absence of cracks in the solid film was evaluated. When even one crack was confirmed, it was judged that there was no crack resistance in that film thickness. For example, in a case where there were no cracks at a film thickness of 15 μm and cracks at a film thickness of 20 μm, the crack-resistant film thickness was determined to be “≥15 μm.” In addition, the crack-resistant film thickness when there were no cracks even at 20 ㎛ was determined as “≥20 ㎛” and the crack-resistant film thickness when there were cracks at 5 ㎛ was determined as “<5 ㎛”, respectively, to determine crack resistance.

<OD value>

As a model of the partition of the partition-equipped substrate obtained in each Example and Comparative Example, a solid film was produced on a glass substrate in the same manner as the evaluation of the reflectance. For the obtained glass substrate with a solid film, the intensity of incident light and transmitted light was measured using an optical densitometer (361T (visual); manufactured by X-rite), and the OD value was calculated using the above-mentioned equation (1). In addition, regarding the OD value, the OD value of the solid film before the heating process and the OD value after the heating process were measured, and the differences are included and listed in Tables 6 and 7.

Additionally, for Example 37, a solid film was similarly produced on a glass substrate as a model of the light-shielding partition (A-2). For the obtained glass substrate with a solid film, the intensity of incident light and transmitted light was measured using an optical densitometer (361T (visual); manufactured by X-rite), and calculated using the above-mentioned formula (1).

<Taper angle>

In each Example and Comparative Example, an arbitrary cross section of the substrate with a partition before pixel formation was observed at an acceleration voltage of 3.0 kV using an optical microscope (FE-SEM (S-4800); manufactured by Hitachi Seisakusho Co., Ltd.). , the taper angle was measured.

<Surface contact angle>

As a model of the barrier ribs in the barrier rib-equipped substrates obtained in each of the examples and comparative examples, a solid film was produced on a glass substrate in the same manner as the evaluation of the reflectance. For the surface of the obtained solid film, DM-700 manufactured by Kyowa Kaimen Chemical Co., Ltd., microsyringe: Teflon (registered trademark) coat needle for contact angle meter 22G manufactured by Kyowa Kaimen Chemical Co., Ltd., 25 The surface contact angle was measured at ℃ in air, based on the wettability test method for the substrate glass surface specified in JIS R3257 (date of establishment = 1999/04/20). However, propylene glycol monomethyl ether acetate was used instead of water, and the contact angle between the surface of the solid film and propylene glycol monomethyl ether acetate was measured.

<Inkjet applicability>

In the substrate with partitions before forming pixels obtained in each of the examples and comparative examples, PGMEA was used as ink for the pixel portion surrounded by the grid-like partitions, and an inkjet coating device (InkjetLabo, manufactured by Cluster Technology Co., Ltd.) was used. Inkjet application was performed using . 160 pL of PGMEA was applied per grid pattern, the presence or absence of nodules (a phenomenon in which ink passes over the partition wall and mixes into adjacent pixel parts) was observed, and inkjet applicability was evaluated according to the following criteria. The smaller the number of lumps, the higher the liquid repellency and the superior inkjet applicability.

A: The ink did not overflow within the pixel.

B: In some parts, ink overflowed from within the pixel onto the upper surface of the partition.

C: Ink overflowed from within the pixel to the upper surface of the partition in the entire surface.

<Thickness>

For the substrates with partitions obtained in each of the examples and comparative examples, the height of the structure before and after forming the pixel B was measured using a Surfcom stylus film thickness measuring device, and the difference was calculated to determine the pixel B. The thickness was measured. For Examples 29 to 31, the film thickness of the low refractive index layer (C) was added, for Examples 32 to 36, the film thickness of the color filter was added, and for Example 37, the thickness (height) of the light-shielding partition was added. were measured similarly.

Additionally, for Examples 30 to 31 and 33 to 34, a cross section perpendicular to the base substrate was exposed using a polishing device such as a cross section polisher, and the cross section was observed enlarged with a scanning electron microscope or transmission electron microscope. , the thickness of the inorganic protective layers I to IV were measured, respectively.

<Luminance>

An area light emitting device equipped with a commercially available LED backlight (peak wavelength 465 nm) was used as a light source, and the substrates with partitions obtained in each Example and Comparative Example were installed so that the pixel portion was on the light source side. A current of 30 mA is passed through this area light emitting device to light up the LED element, and the luminance (unit: cd/m2) based on the CIE1931 standard is measured using a spectroradiometer (CS-1000, manufactured by Konica Minolta), and the initial It was done by luminance. However, the evaluation of luminance was performed using relative values using the initial luminance of Example 45 as 100, which is the standard.

Additionally, after lighting the LED element at room temperature (23°C) for 48 hours, the luminance was similarly measured and the change in luminance over time was evaluated. However, the evaluation of luminance was performed using relative values using the initial luminance of Example 45 as 100, which is the standard.

<Color characteristics>

On a commercially available white reflector, the substrates with partitions obtained in each Example and Comparative Example were installed so that pixels were arranged on the white reflector side. Light was irradiated from the base substrate side of the partition-equipped substrate using a spectroscopic colorimeter (CM-2600d, manufactured by Konica Minolta, measurement diameter ϕ8 mm), and the spectrum containing regular reflected light was measured.

The color gamut defined by BT.2020, a color standard that can almost reproduce natural colors, defines red, green, and blue as the three primary colors on the spectral locus shown in the chromaticity diagram, and the wavelengths of red, green, and blue are 630 nm, 532 nm, and 630 nm, respectively. Equivalent to 467nm. From the reflectance (R) of the obtained reflection spectrum at three wavelengths of 470 nm, 530 nm, and 630 nm, the emission color of the pixel was evaluated according to the following criteria.

A: R ₅₃₀ /(R ₆₃₀ +R ₅₃₀ +R ₄₇₀ )≥0.55

B: R ₅₃₀ /(R ₆₃₀ +R ₅₃₀ +R ₄₇₀ )<0.55.

<Display characteristics>

The display characteristics of the display device produced by combining the organic EL element and the barrier-walled substrate obtained in each Example and Comparative Example were evaluated based on the following criteria.

A: The green display has very clear colors and is a display device that is clear and has excellent contrast.

B: Although the colors appear slightly unnatural, this is a display device with no problems.

<Color Mix>

In the substrates with partitions obtained in each Example and Comparative Example before forming pixels, a color conversion light-emitting material composition (CL-2) is applied to a portion of the pixel portion surrounded by the grid-like partitions using an inkjet method, It was dried at 100°C for 30 minutes to form a pixel with a thickness of 5.0㎛. Thereafter, among the pixel portions surrounded by grid-like partitions, the color conversion light emitting material composition (CL-3) is applied to an area adjacent to the area to which the color conversion light emitting material composition (CL-2) has been applied using an inkjet method, and 100 It was dried at ℃ for 30 minutes to form a pixel with a thickness of 5.0㎛.

On the other hand, a blue organic EL cell having the same width as the pixel portion surrounded by lattice-like partitions was fabricated, the above-described barrier-equipped substrate and the blue organic EL cell were opposed to each other and bonded with a sealant, resulting in a display of the configuration shown in FIG. 10. Got the device.

Among the blue organic EL cells 11 in FIG. 10, only the blue organic EL cell bonded immediately below the pixel 3 (CL-2) formed of the color conversion light-emitting material composition (CL-2) is turned on, For the pixel 3 (CL-3) portion formed of the color conversion light-emitting material composition (CL-3), the absorption intensity A at a wavelength of 630 nm was measured using a microspectrophotometer LVmicro-V (manufactured by Lambda Vision Co., Ltd.) (630nm) was measured. The smaller the value of light absorption intensity A (630 nm), the more difficult it is to cause color mixing. Color mixing was determined based on the following criteria.

A: A(630nm)<0.01

B: 0.01≤A(630nm)≤0.5

C: 0.5<A(630nm).

The evaluation results of each Example and Comparative Example are shown in Tables 6 to 7.

1: not substrate
2: Bulkhead
3: Pixel
3 (CL-2): Pixel formed from color conversion light-emitting material composition (CL-2)
3 (CL-3): Pixel formed from color conversion light-emitting material composition (CL-3)
4: Low refractive index layer
5: Inorganic protective layer I
6: Inorganic protection layer II
7: Color filter
8: Inorganic protective layer III and/or yellow organic protective layer
9: Inorganic protective layer IV and/or yellow organic protective layer
10: Light-shading bulkhead
11: Blue organic EL cell
H: Thickness of bulkhead
L: Width of bulkhead
θ: Taper angle

Claims (12)

A barrier rib-equipped substrate having (A-1) patterned barrier ribs on an underlying substrate, wherein the patterned barrier ribs (A-1) contain a resin, a white pigment, and black particles or yellow particles, and at a wavelength of 550 nm. A substrate with a partition having a reflectance of 20% to 60% per 10 μm of thickness and an OD value of 1.0 to 3.0 per 10 μm of thickness. The method according to claim 1, wherein the resin content in the partition (A-1) is 10% by weight or more and 60% by weight or less, the white pigment content is 20% by weight or more and 60% by weight or less, and the content of black particles or yellow particles is 0.2% by weight. A substrate with a partition wall containing not less than % but not more than 5% by weight. The particle according to claim 1, wherein the black particles or yellow particles contain at least one metal oxide or metal selected from the group consisting of palladium oxide, platinum oxide, gold oxide, silver oxide, palladium, platinum, gold and silver. , a substrate with a partition wall. The barrier rib-equipped substrate according to claim 1, wherein the patterned barrier ribs (A-1) further contain a liquid-repellent compound, and the content of the liquid-repellent compound in the patterned barrier ribs (A-1) is 0.01% to 10% by weight. . The substrate with a barrier rib according to claim 1, wherein the patterned barrier rib (A-1) has a surface contact angle with respect to propylene glycol monomethyl ether acetate of 10° to 70°. The substrate with a barrier rib according to claim 1, wherein the (A-1) patterned barrier rib has a taper angle of 45° to 110°. The substrate with a barrier rib according to claim 1, further comprising (A-2) a patterned light-shielding barrier having an OD value of 0.5 or more per 1.0 μm of thickness between the base substrate and the patterned barrier rib (A-1). The substrate with a barrier rib according to claim 1, further comprising pixels containing the color conversion light emitting material (B) arranged to be spaced apart by the barrier ribs formed in the pattern (A-1). The substrate with a barrier rib according to claim 8, wherein the color conversion luminescent material contains a phosphor selected from quantum dots and pyromethene derivatives. The substrate with a partition according to claim 8, further comprising a color filter with a thickness of 1 to 5 μm between the base substrate and the pixel containing the color conversion light emitting material (B). 11. The method of claim 10, further comprising an inorganic protective layer having a thickness of 50 to 1,000 nm on the base substrate or between the color filter having a thickness of 1 to 5 μm and the pixel layer containing the color conversion light emitting material (B); /or a barrier rib-equipped substrate having a yellow organic protective layer. A display device comprising the barrier rib-equipped substrate according to any one of claims 1 to 11, and a light emission source selected from a liquid crystal cell, an organic EL cell, a mini LED cell, and a micro LED cell.