KR20210029764A - Resin composition, light shielding film, manufacturing method of light shielding film, and substrate with partition walls - Google Patents

Abstract

A resin composition containing a resin, an organometallic compound containing at least one metal selected from the group consisting of silver, gold, platinum, and palladium, a photoinitiator or a quinonediazide compound, and a solvent. Even under heating conditions of 250°C or less, a resin composition for forming a partition wall in which high reflectance and high light-shielding properties are compatible is provided.

Description

Resin composition, light shielding film, manufacturing method of light shielding film, and substrate with partition walls

The present invention relates to a resin composition, a light-shielding film formed of the resin composition, a method of manufacturing the light-shielding film, and a substrate with partition walls having a patterned partition wall.

A liquid crystal display device, which is a kind of image display device, generally performs color display using a white light source such as an LED and a color filter that selectively passes red, green, and blue colors. However, color display using such a color filter has poor light utilization efficiency, and has a problem in color reproducibility.

Therefore, as a color display device with high light utilization efficiency, a color display device including a wavelength conversion unit including a wavelength conversion phosphor, a polarization separation unit and a polarization conversion unit has been proposed (for example, Patent Document 1 Reference). For example, comprising a blue light source, a liquid crystal element, a phosphor excited by blue light to emit red fluorescence, a phosphor excited by blue light to emit green fluorescence, and a wavelength converter having a light scattering layer to scatter blue light A color display device has been proposed (see, for example, Patent Document 2).

However, a color filter including a color conversion phosphor as described in Patent Documents 1 and 2 has low light extraction efficiency and insufficient luminance since fluorescence is generated in all directions. In particular, in high-precision display devices referred to as 4K and 8K, since the pixel size becomes small, the problem of luminance becomes remarkable, and thus higher luminance is required.

Japanese Patent Publication No. 2000-131683 Japanese Patent Publication No. 2009-244383 Japanese Patent Laid-Open No. 2000-347394 Japanese Patent Publication No. 2006-259421

In order to improve the luminance of the display device, it is effective to increase the reflectance of the partition walls separating the color conversion phosphors. In addition, in order not to cause light mixing between adjacent pixels, it is necessary to increase the light-shielding property of the partition walls. From the above, there is a demand for a material for a partition wall in which a high reflectance and light shielding properties are compatible.

In order to form a partition wall in which high reflectance and light-shielding properties are compatible, the inventors first studied a method of using a material obtained by adding a black pigment to a white partition wall material having a high reflectance. However, in this method, the problem of poor pattern processability has become apparent because light is absorbed by the white pigment and the black pigment during exposure, and the light does not reach the bottom of the film.

On the other hand, as described in Patent Documents 3 and 4, a technique of blackening by firing after pattern formation by adding a specific metal compound has been proposed. However, these blackening techniques require firing at 400° C. or higher, and there is a problem that the light-shielding property is not improved by heating at 250° C. or lower.

Accordingly, an object of the present invention is to provide a resin composition capable of forming a partition wall in which both high reflectance and light-shielding properties are compatible even under heating conditions of 250°C or less.

The present invention is a resin composition containing a resin, an organometallic compound containing at least one metal selected from the group consisting of silver, gold, platinum, and palladium, a photoinitiator or a quinonediazide compound, and a solvent.

The resin composition of the present invention allows light to pass through the process of pattern exposure after film formation, but since the light-shielding property increases after heating the exposed film to a temperature of 120°C or more and 250°C or less, high reflectivity even under heating conditions of 250°C or less It is possible to form a fine thick-film partition wall pattern having a high light-shielding property.

1 is a cross-sectional view showing an aspect of a substrate with partition walls of the present invention having a patterned partition wall.
Fig. 2 is a cross-sectional view showing an aspect of a substrate with partition walls of the present invention having a patterned partition wall and a pixel containing a color conversion light emitting material.
3 is a cross-sectional view showing an aspect of the substrate with partition walls of the present invention having a low refractive index layer.
Fig. 4 is a cross-sectional view showing an aspect of the substrate with partition walls of the present invention having a low refractive index layer and an inorganic protective layer I.
5 is a cross-sectional view showing an aspect of the substrate with partition walls of the present invention having a low refractive index layer and an inorganic protective layer II.
6 is a cross-sectional view showing an aspect of the substrate with partition walls of the present invention having a color filter.
7 is a cross-sectional view showing an aspect of the substrate with partition walls of the present invention having a color filter and an inorganic protective layer III and/or a yellow organic protective layer.
Fig. 8 is a cross-sectional view showing an aspect of the substrate with partition walls of the present invention having a color filter and an inorganic protective layer IV and/or a yellow organic protective layer.
9 is a cross-sectional view showing an aspect of the substrate with partition walls of the present invention having a light-shielding partition wall.
10 is a cross-sectional view showing a configuration of a display device used for color mixture evaluation in an example.

Hereinafter, preferred embodiments of the resin composition according to the present invention, the light-shielding film formed from the resin composition, the method of manufacturing the light-shielding film, and the substrate with partition walls will be described in detail, but the present invention is not limited to the following embodiments, It can be implemented in various ways depending on the purpose.

The resin composition of the present invention can be suitably used as a material for forming a partition wall separating the color conversion phosphor. The resin composition of the present invention comprises a resin, an organometallic compound containing at least one metal selected from the group consisting of silver, gold, platinum, and palladium (hereinafter sometimes referred to as an ``organometallic compound''), It is preferable to contain a photoinitiator or a quinone diazide compound and a solvent.

The resin has a function of improving the crack resistance and light resistance of the partition wall. The content of the resin occupied in the solid content of the resin composition is preferably 10% by weight or more, and more preferably 20% by weight or more, from the viewpoint of improving the crack resistance of the partition wall in heat treatment. On the other hand, from the viewpoint of improving light resistance, the content of the resin occupied in the solid content of the resin composition is preferably 60% by weight or less, and more preferably 50% by weight or less. Here, the solid content means all components excluding volatile components such as a solvent among components contained in the resin composition. The amount of solid content can be calculated|required by heating a resin composition and counting the residue obtained by evaporating a volatile component.

Examples of the resin include polysiloxane, polyimide, polyimide precursor, polybenzoxazole, polybenzoxazole precursor, and (meth)acrylic polymer. Here, the (meth)acrylic polymer means a polymer of methacrylic acid ester and/or acrylic acid ester. You may contain 2 or more types of these. Among these, polysiloxane is preferable from the viewpoint of excellent transparency, heat resistance and light resistance.

Polysiloxane is a hydrolysis/dehydration condensation product of organosilane. When the resin composition of the present invention has negative photosensitivity, it is preferable that the polysiloxane contains at least a repeating unit represented by the following general formula (2). In addition, other repeating units may be included. By including the repeating unit derived from the bifunctional alkoxysilane compound represented by the general formula (2), excessive thermal polymerization (condensation) of the polysiloxane by heating can be suppressed, and crack resistance of the partition wall can be improved. It is preferable to contain 10 to 80 mol% of the repeating unit represented by general formula (2) among all the repeating units in a polysiloxane. Crack resistance can be further improved by containing 10 mol% or more of the repeating units represented by general formula (2). The content of the repeating unit represented by the general formula (2) is more preferably 15 mol% or more, and still more preferably 20 mol% or more. On the other hand, by including 80 mol% or less of the repeating unit represented by the general formula (2), the molecular weight of the polysiloxane can be sufficiently increased during polymerization to improve the coating properties. The content of the repeating unit represented by General Formula (2) is more preferably 70 mol% or less.

In the general formula (2), R ¹ and R ² may be the same or different, respectively, and represent a monovalent organic group having 1 to 20 carbon atoms. R ¹ and R ² are preferably a group selected from a C 1 to C 6 alkyl group and a C 6 to C 12 aryl group from the viewpoint of facilitating the adjustment of the molecular weight of the polysiloxane during polymerization. However, in the alkyl group and the aryl group, at least a part of the hydrogen may be substituted with a radical polymerizable group. In this case, in the cured product of the negative photosensitive resin composition, the radical polymerizable group may be radically polymerized.

When the resin composition of the present invention has negative photosensitivity, it is preferable that the polysiloxane further contains a repeating unit selected from a repeating unit represented by the following general formula (3) and a repeating unit represented by the following general formula (4). . By including the repeating unit derived from the fluorine-containing alkoxysilane compound represented by the general formula (3) or (4), the refractive index of the polysiloxane is reduced, and when a white pigment described later is contained, the refractive index with the white pigment By expanding the difference, the interfacial reflection can be further improved, and the reflectance can be further improved. It is more preferable to contain a total of 20 to 80 mol% of a repeating unit selected from the repeating unit represented by the general formula (3) and the repeating unit represented by the general formula (4) in the polysiloxane. By including 20 mol% or more in total of the repeating unit represented by the general formula (3) and the repeating unit represented by the general formula (4), when the white pigment described later is contained, the interfacial reflection between the polysiloxane and the white pigment is further improved. By doing this, the reflectance can be improved more. The total content of the repeating unit represented by the general formula (3) and the repeating unit represented by the general formula (4) is more preferably 40 mol% or more. On the other hand, by including a total of 80 mol% or less of the repeating unit represented by the general formula (3) and the repeating unit represented by the general formula (4), excessive hydrophobicization of the polysiloxane is suppressed, and compatibility with other components in the composition is improved. And improve the resolution. The total content of the repeating unit represented by the general formula (3) and the repeating unit represented by the general formula (4) is more preferably 70 mol% or less. In addition, other repeating units may be included.

In the general formulas (3) and (4), R ³ represents an alkyl group having 1 to 10 carbon atoms, an alkenyl group, an aryl group, or an arylalkyl group in which all or part of hydrogen is substituted with fluorine. R ⁴ represents a single bond, -O-, -CH ₂ -CO-, -CO-, or -O-CO-. R ⁵ represents a monovalent organic group having 1 to 20 carbon atoms. R ³ is preferably an alkyl group having 1 to 6 carbon atoms in which all or part of hydrogen is substituted with fluorine from the viewpoint of further reducing the refractive index of the polysiloxane. In addition, in the photocured product of the negative photosensitive resin composition, the alkenyl group may be radically polymerized.

The repeating units represented by the general formulas (2) to (4) are derived from alkoxysilane compounds represented by the following general formulas (5) to (7), respectively. That is, the polysiloxane containing the repeating unit represented by the general formulas (2) to (4) is hydrolyzed and polycondensed by an alkoxysilane compound containing an alkoxysilane compound represented by the following general formulas (5) to (7). It can be obtained by combining. Further, other alkoxysilane compounds may be used.

The formula (5) to (7), R ¹ to R ⁵ are the same and represents a group R ¹ to R ⁵ in the formula (2) to (4), respectively. R ⁶ may be the same or different, represents a monovalent organic group having 1 to 20 carbon atoms, and an alkyl group having 1 to 6 carbon atoms is preferable.

Examples of the alkoxysilane compound represented by the general formula (5) include dimethyldimethoxysilane, dimethyldiethoxysilane, ethylmethyldimethoxysilane, ethylmethyldimethoxysilane, methylpropyldimethoxysilane, methylpropyldiethoxysilane, Diphenyldimethoxysilane, diphenyldiethoxysilane, cyclohexylmethyldimethoxysilane, cyclohexylmethyldiethoxysilane, vinylmethyldimethoxysilane, vinylmethyldiethoxysilane, allylmethyldimethoxysilane, allylmethyldiethoxysilane, Styrylmethyldimethoxysilane, styrylmethyldiethoxysilane, γ-methacryloylpropylmethyldimethoxysilane, γ-methacryloylpropylmethyldiethoxysilane, γ-acryloylpropylmethyldimethoxysilane, γ -Acryloylpropylmethyldiethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 2-(3,4-epoxycyclohexyl)ethylmethyldimethoxysilane, 2 -(3,4-epoxycyclohexyl)ethylethyldimethoxysilane, diphenyldimethoxysilane, diphenyldiethoxysilane, 3-dimethylmethoxysilylpropylsuccinic anhydride, 3-dimethylethoxysilylpropylsuccinic anhydride, 3- Dimethylmethoxysilylpropionic acid, 3-dimethylethoxysilylpropionic acid, 3-dimethylmethoxysilylpropylcyclohexyldicarboxylic anhydride, 3-dimethylethoxysilylpropylcyclohexyldicarboxylic anhydride, 5-dimethylmethoxysilyl Valeric acid, 5-dimethylethoxysilyl valeric acid, 3-dimethylmethoxysilylpropylphthalic anhydride, 3-dimethylethoxysilylpropylphthalic anhydride, 3-dimethylmethoxysilylpropylphthalic anhydride, 3-dimethylethoxysilylpropylphthalic acid Anhydride, 4-dimethylmethoxysilylbutyric acid, 4-dimethylethoxysilylbutyric acid, and the like. You may use 2 or more types of these.

As the alkoxysilane compound represented by the general formula (6), for example, trifluoropropyltrimethoxysilane, trifluoropropyltriethoxysilane, perfluoropentyltrimethoxysilane, perfluoropentyltriethoxy Silane, tridecafluorooctyltrimethoxysilane, tridecafluorooctyltriethoxysilane, tridecafluorooctyltripropoxysilane, tridecafluorooctyltriisopropoxysilane, heptadecafluorodecyl Trimethoxysilane, heptadecafluorodecyl triethoxysilane, etc. are mentioned. You may use 2 or more types of these.

As the alkoxysilane compound represented by the general formula (7), bis(trifluoromethyl)dimethoxysilane, bis(trifluoropropyl)dimethoxysilane, bis(trifluoropropyl)diethoxysilane, trifluoropropylmethyl Dimethoxysilane, trifluoropropylmethyldiethoxysilane, trifluoropropylethyldimethoxysilane, trifluoropropylethyldiethoxysilane, heptadecafluorodecylmethyldimethoxysilane, and the like. You may use 2 or more types of these.

Examples of other alkoxysilane compounds include methyltrimethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, propyltrimethoxysilane, propyltriethoxysilane, and isobutyltrimethylan. Oxysilane, isobutyltriethoxysilane, cyclohexyltrimethoxysilane, cyclohexyltriethoxysilane, 3-isocyanatepropyltrimethoxysilane, 3-isocyanatepropyltriethoxysilane, 3-aminopropyltrimethoxysilane, Trifunctional alkoxysilane compounds such as 3-aminopropyltriethoxysilane, 3-ureidopropyltrimethoxysilane, and 3-ureidopropyltriethoxysilane; Tetrafunctional alkoxysilane compounds such as tetramethoxysilane, tetraethoxysilane, and silicate 51 (tetraethoxysilane oligomer); Monofunctional alkoxysilane compounds such as trimethylmethoxysilane and triphenylmethoxysilane; 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 2-(3,4-epoxycyclohexyl) Ethyltriethoxysilane, 3-ethyl-3-{[3-(trimethoxysilyl)propoxy]methyl}oxetane, 3-ethyl-3-{[3-(triethoxysilyl)propoxy]methyl } Epoxy groups such as oxetane or alkoxysilane compounds containing oxetane groups: phenyltrimethoxysilane, phenyltriethoxysilane, 1-naphthyltrimethoxysilane, 2-naphthyltrimethoxysilane, and 2-naphthyltrimethoxysilane , 2-naphthyltrimethoxysilane, tolyltrimethoxysilane, tolyltriethoxysilane, 1-phenylethyltrimethoxysilane, 1-phenylethyltriethoxysilane, 2-phenylethyltrimethoxysilane, 2- Aromatic ring-containing alkoxysilane compounds such as phenylethyltriethoxysilane, 3-trimethoxysilylpropylphthalic anhydride, and 3-triethoxysilylpropylphthalic anhydride; Styryltrimethoxysilane, styryltriethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, allyltrimethoxysilane, allyltriethoxysilane, γ-acryloylpropyltrimethoxysilane, γ -Alkoxysilane compounds containing radically polymerizable groups such as acryloylpropyltriethoxysilane, γ-methacryloylpropyltrimethoxysilane, and γ-methacryloylpropyltriethoxysilane; 3-trimethoxysilylpropionic acid, 3-triethoxysilylpropionic acid, 4-trimethoxysilylbutyric acid, 4-triethoxysilylbutyric acid, 5-trimethoxysilylvaleric acid, 5-triethoxysilylvaleric acid, 3-trimethoxysilylpropylsuccinic anhydride, 3-triethoxysilylpropylsuccinic anhydride, 3-trimethoxysilylpropylcyclohexyldicarboxylic anhydride, 3-triethoxysilylpropylcyclohexyldicarboxylic anhydride And carboxyl group-containing alkoxysilane compounds such as 3-trimethoxysilylpropylphthalic anhydride and 3-triethoxysilylpropylphthalic anhydride.

The content of the alkoxysilane compound represented by the general formula (5) in the alkoxysilane compound used as the raw material of the polysiloxane is the content of the repeating unit represented by the general formula (2) in all repeating units of the polysiloxane within the above-described range. From the viewpoint of doing so, 10 mol% or more is preferable, 15 mol% or more is more preferable, and 20 mol% or more is still more preferable. On the other hand, the content of the alkoxysilane compound represented by the general formula (5) is preferably 80 mol% or less, and more preferably 70 mol% or less from the same viewpoint. In addition, with respect to the total content of the alkoxysilane compound represented by the general formula (6) and the general formula (7), the total content of the repeating unit represented by the general formula (3) and the general formula (4) is set as the above-described range. From a viewpoint, 20 mol% or more is preferable, and 40 mol% or more is more preferable. On the other hand, the total content of the alkoxysilane compound represented by the general formula (6) and the general formula (7) is preferably 80 mol% or less, and more preferably 70 mol% or less from the same viewpoint.

From the viewpoint of coatability, the weight average molecular weight (Mw) of the polysiloxane is preferably 1,000 or more, and more preferably 2,000 or more. On the other hand, from the viewpoint of developability, Mw of the polysiloxane is preferably 50,000 or less, and more preferably 20,000 or less. Here, Mw of the polysiloxane in the present invention refers to a polystyrene conversion value measured by gel permeation chromatography (GPC).

Polysiloxane can be obtained by hydrolyzing the organosilane compound described above, and then subjecting the hydrolyzate to dehydration and condensation reaction in the presence of a solvent or without a solvent.

Various conditions for hydrolysis can be set according to physical properties suitable for the intended use, taking into account the reaction scale, the size and shape of the reaction vessel, and the like. As various conditions, an acid concentration, reaction temperature, reaction time, etc. are mentioned, for example.

In the hydrolysis reaction, an acid catalyst such as hydrochloric acid, acetic acid, formic acid, nitric acid, oxalic acid, hydrochloric acid, sulfuric acid, phosphoric acid, polyphosphoric acid, polyhydric carboxylic acid, anhydride thereof, and ion exchange resin can be used. Among these, an acidic aqueous solution containing an acid selected from formic acid, acetic acid and phosphoric acid is preferable.

When an acid catalyst is used for the hydrolysis reaction, the amount of the acid catalyst added is preferably 0.05 parts by weight or more, based on 100 parts by weight of the total alkoxysilane compound used in the hydrolysis reaction, from the viewpoint of promoting hydrolysis more rapidly. More preferably, it is more than one part by weight. On the other hand, from the viewpoint of appropriately adjusting the progress of the hydrolysis reaction, the amount of the acid catalyst added is preferably 20 parts by weight or less, and more preferably 10 parts by weight or less, based on 100 parts by weight of the total alkoxysilane compound. Here, the total amount of the alkoxysilane compound refers to the amount including all of the alkoxysilane compound, its hydrolyzate, and its condensate. It is the same as below.

The hydrolysis reaction can be carried out in a solvent. The solvent can be appropriately selected in consideration of stability, wettability, volatility, and the like of the resin composition.

When a solvent is generated by a hydrolysis reaction, it is also possible to perform hydrolysis in a solvent-free. When using for a resin composition, it is also preferable to adjust the resin composition to an appropriate concentration by adding a solvent further after completion of the hydrolysis reaction. Further, it is also possible to distill out and remove all or a part of the produced alcohol or the like by heating and/or under reduced pressure after hydrolysis, and then adding a suitable solvent.

In the case of using a solvent for the hydrolysis reaction, the amount of the solvent added is preferably 50 parts by weight or more, and more preferably 80 parts by weight or more, based on 100 parts by weight of the total alkoxysilane compound, from the viewpoint of suppressing gel formation. On the other hand, the addition amount of the solvent is preferably 500 parts by weight or less, and more preferably 200 parts by weight or less, based on 100 parts by weight of the total alkoxysilane compound, from the viewpoint of accelerating the hydrolysis.

In addition, ion-exchanged water is preferable as water used in the hydrolysis reaction. Although the amount of water can be set arbitrarily, 1.0 to 4.0 mol is preferable with respect to 1 mol of all the alkoxysilane compounds.

As a method of the dehydration condensation reaction, a method of heating the silanol compound solution obtained by the hydrolysis reaction of an organosilane compound as it is, etc. are mentioned. The heating temperature is preferably 50° C. or higher and lower than the boiling point of the solvent, and the heating time is preferably 1 to 100 hours. Further, in order to increase the degree of polymerization of the polysiloxane, reheating or addition of a base catalyst may be performed. Further, depending on the purpose, after the dehydration and condensation reaction, an appropriate amount of the resulting alcohol or the like may be distilled off and removed under heating and/or reduced pressure, and then a suitable solvent may be added.

From the viewpoint of storage stability of the resin composition, it is preferable that the catalyst is not contained in the siloxane resin solution after hydrolysis and dehydration condensation, and the catalyst can be removed if necessary. As the catalyst removal method, water washing, treatment with an ion exchange resin, and the like are preferable from the viewpoints of simplicity of operation and removability. Water washing is a method of diluting a polysiloxane solution with an appropriate hydrophobic solvent, washing several times with water, and then concentrating the obtained organic layer with an evaporator or the like. Treatment with an ion exchange resin is a method of bringing a polysiloxane solution into contact with an appropriate ion exchange resin.

The organometallic compound becomes black particles or yellow particles by decomposition and agglomeration in an exposure step and/or a heating step at the time of pattern formation of the partition wall (A-1) to be described later, and the partition wall (A-1) to be described later It has a function of improving the OD value. Since the OD value is low before exposure and the OD value rises after pattern formation, in the exposure step, the exposed light can be sufficiently transmitted to the bottom to be photocured or photodecomposed. For example, in the case of a resin composition having negative photosensitivity, in order to form a partition wall (A-1) having a high OD value, if a pattern is formed using a resin composition containing a large amount of black pigment in advance, Photocuring is liable to be insufficient. As a result, the shape of the obtained partition wall A-1 tends to become an inverted tapered shape. When patterning is formed using the resin composition of the present invention containing the above-described organometallic compound, the taper angle can be easily set to a preferable range described later from the viewpoint of sufficiently photocuring to the bottom.

Examples of the organometallic compound include organometallic compounds containing silver such as silver neodecanoic acid, silver octylic acid, and silver salicylate; Organometallic compounds containing gold such as chloro (triphenylphosphine) gold and tetrachloroamic acid tetrahydrate; Organometallic compounds containing platinum such as bis(acetylacetonato)platinum, dichlorobis(triphenylphosphine)platinum, and dichlorobis(benzonitrile)platinum; Organometallic compounds containing palladium such as bis (acetylacetonato) palladium, dichlorobis (triphenylphosphine) palladium, dichlorobis (benzonitrile) palladium, tetrakis (triphenylphosphine) palladium, and dibenzylideneacetone palladium And the like. You may contain 2 or more types of these.

Among these, if an organometallic compound containing silver, such as silver neodecanoic acid, silver octylic acid, or silver salicylate, is blackened by decomposition and agglomeration in the exposure step, it becomes yellow by further decomposition and agglomeration in the subsequent heating step. do.

On the other hand, organometallic compounds containing platinum, such as bis(acetylacetonato)platinum, dichlorobis(triphenylphosphine)platinum, and dichlorobis(benzonitrile)platinum; Organometallic compounds selected from palladium such as bis (acetylacetonato) palladium, dichlorobis (triphenylphosphine) palladium, dichlorobis (benzonitrile) palladium, tetrakis (triphenylphosphine) palladium, dibenzylideneacetone palladium, etc. When contained, it is blackened by decomposition and agglomeration in the exposure process and/or the heating process.

Among these, from the viewpoint of further improving the OD value, an organic metal selected from bis (acetylacetonato) palladium, dichlorobis (triphenylphosphine) palladium, dichlorobis (benzonitrile) palladium, and tetrakis (triphenylphosphine) palladium Compounds are preferred.

In the resin composition of the present invention, the content of the organometallic compound in the solid content is preferably 0.2 to 5% by weight. By making the content of the organometallic compound into 0.2% by weight or more, the OD value of the obtained partition wall can be further improved. The content of the organometallic compound is more preferably 1.5% by weight or more. On the other hand, by making the content of the organometallic compound 5% by weight or less, the reflectance can be further improved.

When the resin composition of the present invention is used for pattern formation of the partition wall (A-1) to be described later, it is preferable to have negative or positive photosensitivity. In the case of imparting negative photosensitivity, it is preferable to contain a photoinitiator, and a high-precision pattern-shaped partition wall can be formed. It is preferable that the negative photosensitive resin composition further contains a photopolymerizable compound. On the other hand, in the case of imparting positive photosensitivity, it is preferable to contain a quinone diazide compound.

The photoinitiator may be any one that decomposes and/or reacts by irradiation with light (including ultraviolet rays and electron beams) to generate radicals. For example, 2-methyl-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholine Α-aminoalkylphenone compounds such as -4-yl-phenyl)-butan-1-one and 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1; 2,4,6-trimethylbenzoylphenylphosphine oxide, bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide, bis(2,6-dimethoxybenzoyl)-(2,4,4-trimethylpentyl )-Acylphosphine oxide compounds such as phosphine oxide; 1-phenyl-1,2-propanedione-2-(O-ethoxycarbonyl)oxime, 1,2-octanedione-1-[4-(phenylthio)-2-(O-benzoyloxime)], 1-phenyl-1,2-butadione-2-(O-methoxycarbonyl)oxime, 1,3-diphenylpropanetrione-2-(O-ethoxycarbonyl)oxime, ethanone-1- Oxime ester compounds such as [9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-1-(O-acetyloxime); Benzyl ketal compounds such as benzyl dimethyl ketal; 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1-(4-isopropylphenyl)-2-hydroxy-2-methylpropan-1-one, 4-(2-hydroxye Α-hydroxyketone compounds such as oxy)phenyl-(2-hydroxy-2-propyl)ketone and 1-hydroxycyclohexyl-phenylketone; Benzophenone, 4,4-bis(dimethylamino)benzophenone, 4,4-bis(diethylamino)benzophenone, methyl o-benzoylbenzoate, 4-phenylbenzophenone, 4,4-dichlorobenzophenone, hydroxy Benzophenone compounds such as benzophenone, 4-benzoyl-4'-methyl-diphenyl sulfide, alkylated benzophenone, and 3,3',4,4'-tetra(t-butylperoxycarbonyl)benzophenone; Acetophenone compounds such as 2,2-diethoxyacetophenone, 2,3-diethoxyacetophenone, 4-t-butyldichloroacetophenone, benzalacetophenone, and 4-azidebenzalacetophenone; Aromatic ketoester compounds such as 2-phenyl-2-oxymethyl acetate; Benzoic acid ester compounds such as ethyl 4-dimethylaminobenzoate, 4-dimethylaminobenzoic acid (2-ethyl)hexyl, ethyl 4-diethylaminobenzoate, and methyl 2-benzoylbenzoate. You may contain 2 or more types of these.

The content of the photoinitiator in the resin composition of the present invention is preferably 0.01% by weight or more, and more preferably 1% by weight or more in the solid content, from the viewpoint of effectively promoting radical curing. On the other hand, from the viewpoint of suppressing the elution of the remaining photopolymerization initiator and further improving yellowing, the content of the photopolymerization initiator is preferably 20% by weight or less, and more preferably 10% by weight or less in the solid content.

The photopolymerizable compound in the present invention refers to a compound having two or more ethylenically unsaturated double bonds in a molecule. Considering the easiness of radical polymerization, it is preferable that the photopolymerizable compound has a (meth)acrylic group.

As a photopolymerizable compound, for example, diethylene glycol diacrylate, triethylene glycol diacrylate, tetraethylene glycol diacrylate, diethylene glycol dimethacrylate, triethylene glycol dimethacrylate, tetraethylene glycol dimethacrylate Acrylate, trimethylolpropane diacrylate, trimethylolpropane triacrylate, trimethylolpropane dimethacrylate, trimethylolpropane trimethacrylate, 1,3-butanediol diacrylate, 1,3-butanediol dimethacryl Rate, neopentyl glycol diacrylate, 1,4-butanediol diacrylate, 1,4-butanediol dimethacrylate, 1,6-hexanediol diacrylate, 1,9-nonanediol dimethacrylate, 1 ,10-decanediol dimethacrylate, dimethylol-tricyclodecane diacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, pentaerythritol trimethacrylate, pentaerythritol tetramethacrylate, Dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, tripentaerythritol heptaacrylate, tripentaerythritol octaacrylate, tetrapentaerythritol octaacrylate, tetrapentaerythritol decaacrylate, pentapenta Erythritol undecaacrylate, pentapentaerythritol dodecaacrylate, tripentaerythritolheptamethacrylate, tripentaerythritol octamethacrylate, tetrapentaerythritol nonamethacrylate, tetrapentaerythritol decamethacrylate Rate, pentapentaerythritol undecamethacrylate, pentapentaerythritol dodecamethacrylate, dimethylol-tricyclodecane diacrylate, and the like. You may contain 2 or more types of these.

The content of the photopolymerizable compound in the resin composition of the present invention is preferably 1% by weight or more in the solid content from the viewpoint of effectively advancing radical curing. On the other hand, from the viewpoint of suppressing excessive reaction of radicals and improving resolution, the content of the photopolymerizable compound is preferably 40% by weight or less in the solid content.

As the quinone diazide compound, a compound in which a sulfonic acid of naphthoquinone diazide is bonded to a compound having a phenolic hydroxyl group by an ester is preferable. As a compound having a phenolic hydroxyl group used herein, for example, BIs-Z, TekP-4HBPA (Tetrakis P-DO-BPA), TrIsP-HAP, TrIsP-PA, BIsRS-2P, BIsRS-3P (above, brand name , Honshu Chemical Industry Co., Ltd. product), BIR-PC, BIR-PTBP, BIR-BIPC-F (above, brand name, Asahi Yukizai Co., Ltd. product), 4,4'-sulfonyldiphenol, BPFL ( A brand name, JFE Chemical Co., Ltd. product), etc. are mentioned. As the quinone diazide compound, it is preferable that 4-naphthoquinone diazide sulfonic acid or 5-naphthoquinone diazide sulfonic acid is introduced through an ester bond to these compounds having a phenolic hydroxyl group. For example, THP-17, TDF- 517 (brand name, Toyo Kose High School Co., Ltd. product), SBF-525 (brand name, AZ Electronic Materials Co., Ltd. product), etc. are mentioned.

From the viewpoint of improving the sensitivity, the content of the quinone diazide compound in the resin composition of the present invention is preferably 0.5% by weight or more and more preferably 1% by weight or more in the solid content. On the other hand, from the viewpoint of improving the resolution, the content of the quinone diazide compound is preferably 25% by weight or less, and more preferably 20% by weight or less in the solid content.

The solvent has a function of adjusting the viscosity of the resin composition to a range suitable for application and improving the uniformity of the partition wall. As the solvent, it is preferable to combine a solvent having a boiling point of more than 150°C and not more than 250°C and a solvent having a temperature of 150°C or less under atmospheric pressure.

Examples of the solvent include alcohols such as ethanol, propanol, isopropanol, and diacetone alcohol; Glycols such as ethylene glycol and propylene glycol; Ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, and propylene glycol monobutyl ether; Ketones such as methyl ethyl ketone, acetyl acetone, methyl propyl ketone, methyl butyl ketone, methyl isobutyl ketone, diisobutyl ketone, and cyclopentanone; Amides such as dimethylformamide and dimethylacetamide; Ethyl acetate, propyl acetate, butyl acetate, isobutyl acetate, ethylene glycol monoethyl ether acetate, propylene glycol monomethyl ether acetate, 3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, methyl lactate, ethyl lactate And acetates such as butyl lactate; Aromatic or aliphatic hydrocarbons such as toluene, xylene, hexane, and cyclohexane, γ-butyrolactone, N-methyl-2-pyrrolidone, and dimethyl sulfoxide. You may contain 2 or more types of these. Among these, from the viewpoint of coating properties, it is preferable to combine diacetone alcohol as a solvent having a boiling point of more than 150°C and not more than 250°C under atmospheric pressure and propylene glycol monomethyl ether as a solvent having a temperature of 150°C or less.

The content of the solvent can be arbitrarily set depending on the application method or the like. For example, in the case of forming a film by spin coating, the content of the solvent is generally 50% by weight or more and 95% by weight or less in the resin composition.

It is preferable that the resin composition of the present invention further contains a coordinating compound having a phosphorus atom (hereinafter, it may be described as a "coordinating compound"). The coordinating compound is coordinated with the organometallic compound in the resin composition to improve the solubility of the organometallic compound in a solvent, thereby promoting decomposition of the organometallic compound, and further improving the OD value of the resulting partition wall. As a coordination compound, for example, triphenylphosphine, tri-t-butylphosphine, trimethylphosphine, tricyclohexylphosphine, tetrafluoroborate tri-t-butylphosphine, tri(2-furyl)phosphine Pin, tris(1-adamantyl)phosphine, tris(diethylamino)phosphine, tris(4-methoxyphenyl)phosphine, tris(O-tolyl)phosphine, and the like. You may contain 2 or more types of these. The content of the coordination compound in the resin composition of the present invention is preferably 0.5 to 3.0 molar equivalents based on the organometallic compound.

It is preferable that the resin composition of this invention further contains a white pigment and/or a black pigment. The white pigment has a function of further improving the reflectance of the partition wall. The black pigment has a function of adjusting the OD value.

Examples of the white pigment include titanium dioxide, zirconium oxide, zinc oxide, barium sulfate, and complex compounds thereof. You may contain 2 or more types of these. Among these, titanium dioxide having high reflectivity and easy industrial use is preferred.

The crystal structure of titanium dioxide is classified into anatase type, rutile type and bruchite type. Among these, rutile-type titanium oxide is preferred because of its low photocatalytic activity.

The white pigment may be subjected to surface treatment. Surface treatment with a metal selected from Al, Si and Zr is preferable, and light resistance and heat resistance of the formed partition wall can be improved.

The median diameter of the white pigment is preferably 100 to 500 nm from the viewpoint of further improving the reflectance of the partition wall. Here, the median diameter of the white pigment can be calculated from the particle size distribution measured by a laser diffraction method using a particle size distribution measuring device (N4-PLUS; manufactured by Beckman Coulter Co., Ltd.) or the like.

Examples of titanium dioxide pigments preferably used as white pigments include R960; DuPont Corporation (rutile type, SiO ₂ /Al ₂ O ₃ treatment, average primary particle diameter 210 nm), CR-97; Ishihara Sangyo Co., Ltd. product (rutile type, Al ₂ O ₃ /ZrO ₂ treatment, average primary particle diameter 250 nm), JR-301; Teika Corporation (rutile type, Al ₂ O ₃ treatment, average primary particle diameter 300 nm), JR-405; Teika Corporation (rutile type, Al ₂ O ₃ treatment, average primary particle diameter 210 nm), JR-600A; Teika Co., Ltd. (rutile type, Al ₂ O ₃ treatment, average primary particle diameter 250 nm), JR-603; Teika Co., Ltd. (rutile type, Al ₂ O ₃ /ZrO ₂ treatment, average primary particle diameter 280 nm), etc. are mentioned. You may contain 2 or more types of these.

From the viewpoint of further improving the reflectance, the content of the white pigment in the resin composition is preferably 20% by weight or more in the solid content, and more preferably 30% by weight or more. On the other hand, from the viewpoint of improving the surface smoothness of the partition wall, the content of the white pigment is preferably 60% by weight or less in the solid content, and more preferably 55% by weight or less.

As a black pigment, a black organic pigment, a mixed color organic pigment, a black inorganic pigment, etc. are mentioned, for example.

Examples of the black organic pigment include carbon black, perylene black, aniline black, and benzofuranone pigments. These may be coated with resin.

Examples of the mixed color organic pigments include those obtained by mixing two or more kinds of pigments selected from red, blue, green, violet, yellow, magenta, cyan, and the like to make them pseudo black. Among these, a mixed pigment of a red pigment and a blue pigment is preferable from the viewpoint of achieving both an appropriately high OD value and pattern processability. 20/80 to 80/20 are preferable and, as for the weight ratio of a red pigment and a blue pigment in a mixed pigment, 30/70 to 70/30 are more preferable. When a specific example of a typical pigment is represented by a color index (CI) number, the following are mentioned. As a red pigment, for example, Pigment Red (hereinafter abbreviated as PR) 9, PR48, PR97, PR122, PR123, PR144, PR149, PR166, PR168, PR177, PR179, PR180, PR192, PR209, PR215, PR216, PR217 , PR220, PR223, PR224, PR226, PR227, PR228, PR240, PR254, and the like. You may contain 2 or more types of these. Examples of the blue pigment include Pigment Blue (hereinafter abbreviated as PB) 15, PB15:3, PB15:4, PB15:6, PB22, PB60, PB64, and the like. You may contain 2 or more types of these.

Examples of the black inorganic pigment include graphite; Fine particles of metals such as titanium, copper, iron, manganese, cobalt, chromium, nickel, zinc, calcium, silver, gold, platinum, and palladium; Metal oxides; Metal complex oxide; Metal sulfide; Metal nitride; Metal oxynitrides; And metal carbides. You may contain 2 or more types of these.

Among the above black pigments, a pigment selected from titanium nitride, zirconium nitride, carbon black, and a mixed pigment having a weight ratio of 20/80 to 80/20 of a red pigment and a blue pigment is preferable from the viewpoint of having a high light-shielding property. In addition, from the viewpoint of easy adjustment of the taper angle of the partition wall (A-1) to a preferable range described below, a pigment selected from titanium nitride, zirconium nitride, and a mixed pigment having a weight ratio of 20/80 to 80/20 of a red pigment and a blue pigment Is more preferable.

The content of the black pigment in the resin composition is preferably 0.01% by weight or more in the solid content, and 0.05% by weight or more, from the viewpoint of further suppressing the color mixing of light in adjacent pixels by adjusting the reflectance and OD in the above-described ranges. It is more preferable. On the other hand, from the viewpoint of adjusting the reflectance and OD to the above-described range, the content of the black pigment is preferably 5% by weight or less in the solid content, and more preferably 3% by weight or less.

It is preferable that the resin composition of this invention further contains a photobase generator. By containing a photobase generator, since it generates a base in the exposure process and promotes decomposition and aggregation of the organometallic compound in the resin composition, the organometallic compound is more efficiently converted into black particles or yellow particles, and is obtained. The OD value of the partition wall can be further improved.

The photobase generator may be any one that decomposes and/or reacts by irradiation with light (including ultraviolet rays and electron beams) to generate a base. For example, 2-(9-oxoxanthen-2-yl)propionic acid 1,5,7-triazacyclo[4,4,0]dec-5-ene, N-cyclohexylcarbamic acid 1-(anthra Quinon-2-yl) ethyl, N,N-diethylcarbamic acid 9-anthrylmethyl, N-cyclohexylcarbamic acid 9-anthrylmethyl, 1-carboxylic acid 9-anthrylmethylpiperidine, N, N-dicyclohexylcarbamic acid 9-anthrylmethyl, N,N-dicyclohexylcarbamic acid 1-(anthraquinon-2-yl)ethyl, cyclohexylammonium propionate 2-(3-benzoylphenyl), butyltriphenyl Boronic acid 1,2-dicyclohexyl-4,4,5,5,-tetramethylbiguanidinium, 2-(3-benzoylphenyl)propionic acid 1,2-diisopropyl-3-[bis(dimethylamino) Methylene]guanidinium, (2-nitrophenyl)methyl4-hydroxypiperidine-1-carboxylic acid, 2-(3-benzoylphenyl)guanidinium propionate, and the like. You may use 2 or more types of these.

From the viewpoint of further improving the OD value, the content of the photobase generator in the resin composition of the present invention is preferably 0.5% by weight or more in the solid content. On the other hand, the content of the photobase generator is preferably 2.0% by weight or less in the solid content from the viewpoint of improving the resolution.

The resin composition of the present invention may contain a liquid-repellent compound. The liquid-repellent compound is a compound that gives the resin composition a property of repelling water or an organic solvent (liquid-repellent performance). Although it does not specifically limit as long as it is a compound having such a property, specifically, a compound having a fluoroalkyl group is preferably used. By containing the liquid-repellent compound, the liquid-repellent performance can be imparted to the top of the partition wall after formation of the partition wall (A-1). Thereby, for example, when forming a pixel containing a color conversion light-emitting material (B) to be described later, a color conversion light-emitting material having a different composition can be easily and separately applied to each pixel.

Examples of the liquid repellent compound include 1,1,2,2-tetrafluorooctyl (1,1,2,2-tetrafluoropropyl) ether, 1,1,2,2-tetrafluorooctylhexyl ether, Octaethylene glycol di (1,1,2,2-tetrafluorobutyl) ether, hexaethylene glycol (1,1,2,2,3,3-hexafluoropentyl) ether, octapropylene glycol di (1, 1,2,2-tetrafluorobutyl) ether, hexapropylene glycol di (1,1,2,2,3,3-hexafluoropentyl) ether, sodium perfluorododecylsulfonate, 1,1,2 ,2,8,8,9,9,10,10-decafluorododecane, 1,1,2,2,3,3-hexafluorodecane, N-[3-(perfluorooctanesulfonamide) Propyl]-N,N'-dimethyl-N-carboxymethylene ammonium betaine, perfluoroalkylsulfonamide propyltrimethylammonium salt, perfluoroalkyl-N-ethylsulfonylglycine salt, phosphate bis(N-perfluorooxy) And compounds having a fluoroalkyl or fluoroalkylene group in the terminal, main chain and/or side chain such as tylsulfonyl-N-ethylaminoethyl) and monoperfluoroalkylethylphosphate. In addition, as a commercially available liquid repellent compound, "Megapec" (registered trademark) F142D, F172, F173, F183, F444, F477 (above, manufactured by Dai Nippon Ink Chemical Co., Ltd.), Ftop EF301, 303, 352 (new Akita Kasei Co., Ltd.), Fluorad FC-430, FC-431 (Sumitomo 3M Co., Ltd.)), "Asahi Guard" (registered trademark) AG710, "Suflon" (registered trademark) S-382, SC -101, SC-102, SC-103, SC-104, SC-105, SC-106 (manufactured by Asahi Glass Co., Ltd.), BM-1000, BM-1100 (manufactured by Yusho Co., Ltd.), NBX-15 , FTX-218, DFX-18 (manufactured by Neos Co., Ltd.), and the like. You may contain 2 or more types of these. Among these, it is more preferable to have a photopolymerizable group because it has high reactivity and can form a strong bond with a resin. As a liquid repellent compound having a fluorine atom and a photopolymerizable group, for example, "Megapec" (registered trademark) RS-76-E, RS-56, RS-72-k, RS-75, RS-76-E, RS- 76-NS, RS-76, RS-90 (above, brand name, DIC Corporation make), etc. are mentioned. In this case, the photopolymerizable group may be photopolymerized in the partition wall (A-1) containing the photocured product of the negative photosensitive resin composition.

From the viewpoint of improving the liquid-repellent performance of the partition wall and improving the inkjet coatability, the content of the liquid-repellent compound in the resin composition is preferably 0.01% by weight or more, and more preferably 0.1% by weight or more in the solid content. On the other hand, from the viewpoint of improving compatibility with a resin or a white pigment, the content of the liquid-repellent compound is preferably 10% by weight or less, and more preferably 5% by weight or less in the solid content.

In addition, the resin composition of the present invention may contain an ultraviolet absorber, a polymerization inhibitor, a surfactant, an adhesion improving agent, and the like, if necessary.

By containing an ultraviolet absorber in the resin composition of the present invention, light resistance can be improved and resolution can be further improved. As an ultraviolet absorber, from the viewpoint of transparency and non-coloring, 2-(2H-benzotriazol-2-yl)phenol, 2-(2H-benzotriazol-2-yl)-4,6-tert-pentylphenol, 2 -(2H-benzotriazol-2-yl)-4-(1,1,3,3-tetramethylbutyl)phenol, 2(2H-benzotriazol-2-yl)-6-dodecyl-4- Benzotriazole-based compounds such as methylphenol and 2-(2'-hydroxy-5'-methacryloxyethylphenyl)-2H-benzotriazole; Benzophenone compounds such as 2-hydroxy-4-methoxybenzophenone; Triazine compounds, such as 2-(4,6-diphenyl-1,3,5 triazine-2-yl)-5-[(hexyl)oxy]-phenol, etc. are preferably used.

By containing a polymerization inhibitor in the resin composition of the present invention, the resolution can be further improved. Examples of the polymerization inhibitor include di-t-butylhydroxytoluene, butylhydroxyanisole, hydroquinone, 4-methoxyphenol, 1,4-benzoquinone, and t-butylcatechol. In addition, as a commercially available polymerization inhibitor, "IRGANOX" (registered trademark) 1010, 1035, 1076, 1098, 1135, 1330, 1726, 1425, 1520, 245, 259, 3114, 565, 295 (above, brand name, BASF Japan ( Note) agent), etc. are mentioned. You may contain 2 or more types of these.

By containing a surfactant in the resin composition of the present invention, the flowability at the time of application can be improved. As a surfactant, for example, "Megapec" (registered trademark) F142D, F172, F173, F183, F445, F470, F475, F477 (above, brand name, manufactured by Dai Nippon Ink Chemical Co., Ltd.), NBX-15 Fluorine-based surfactants such as FTX-218 (above, brand name, manufactured by Neos Co., Ltd.); Silicone-based surfactants such as "BYK" (registered trademark)-333, 301, 331, 345, 307 (above, brand name, manufactured by Big Chem Japan Co., Ltd.); Polyalkylene oxide surfactants; And poly(meth)acrylate-based surfactants. You may contain 2 or more types of these.

By containing the adhesive improving agent in the resin composition of the present invention, the adhesiveness to the base substrate is improved, and a highly reliable partition wall can be obtained. As an adhesive improving agent, an alicyclic epoxy compound, a silane coupling agent, etc. are mentioned, for example. Among these, since the alicyclic epoxy compound has high heat resistance, the color change after heating can be more suppressed.

As an alicyclic epoxy compound, for example, 1, 2 of 3',4'-epoxycyclohexymethyl-3,4-epoxycyclohexanecarboxylate, 2,2-bis(hydroxymethyl)-1-butanol -Epoxy-4-(2-oxyranyl)cyclohexane adduct, ε-caprolactone modified 3',4'-epoxycyclohexylmethyl3',4'-epoxycyclohexanecarboxylate, 1,2-epoxy- 4-vinylcyclohexane, butanetetracarboxylic acid tetra (3,4-epoxycyclohexylmethyl) formula ε-caprolactone, 3,4-epoxycyclohexylmethyl methacrylate, hydrogenated bisphenol A diglycidyl ether, Hydrogenated bisphenol F diglycidyl ether, hydrogenated bisphenol E diglycidyl ether, hydrogenated bisphenol A bis (propylene glycol glycidyl ether) ether, hydrogenated bisphenol A bis (ethylene glycol glycidyl ether) ether, 1,4-cyclohexanedicarboxylic acid diglycidyl, 1,4-cyclohexane dimethanol diglycidyl ether, etc. are mentioned. You may contain 2 or more types of these.

The content of the adhesion improving agent in the resin composition of the present invention is preferably 0.1% by weight or more in the solid content, and more preferably 1% by weight or more, from the viewpoint of further improving the adhesion to the base substrate. On the other hand, the content of the adhesion improving agent is preferably 20% by weight or less in the solid content, and more preferably 10% by weight or less, from the viewpoint of more suppressing color change due to heating.

The resin composition of the present invention can be produced, for example, by mixing the above-described resin, an organometallic compound, a photoinitiator or a quinonediazide compound, a solvent, and other components as necessary.

Next, the light shielding film of the present invention will be described. The light shielding film of the present invention is obtained by curing the resin composition of the present invention described above. The light-shielding film of the present invention can be suitably used as a light-shielding pattern in an OGS-type touch panel such as a decorative pattern for a cover substrate, in addition to the partition wall (A-1) described later. The thickness of the light-shielding film is preferably 10 µm or more.

Next, the manufacturing method of the light shielding film of the present invention will be described by way of example. The manufacturing method of the light shielding film of the present invention is soluble in a film forming step of applying the resin composition of the present invention on a base substrate and drying to obtain a dried film, an exposure step of exposing the obtained dried film to a pattern, and a developer in a dried film after exposure. It is preferable to have a developing step of dissolving and removing portions and a heating step of curing by heating the dried film after development.

The manufacturing method of the light-shielding film of the present invention is characterized in that in the heating step, the OD value per 10 µm of the film thickness is increased by 0.3 or more by heating the film after development at a temperature of 120°C or more and 250°C or less. From the viewpoint of further improving the OD value, the heating temperature during the heating step is preferably 150°C or higher, and more preferably 180°C or higher. The heating temperature in the heating step is preferably 250° C. or less, and more preferably 240° C. or less, from the viewpoint of suppressing the occurrence of cracks in the film to be heated. The heating time is preferably 15 minutes to 2 hours. Since the film formed from the resin composition of the present invention has a low OD value during exposure and an OD value increases after pattern formation, it is sufficiently photocured to the bottom in the exposure process to obtain a partition wall having a preferred taper angle described later. I can. In addition, since the OD value after pattern formation is high, it is possible to obtain a partition wall in which both high reflectance and light-shielding properties are compatible.

Examples of the method of applying the resin composition in the film forming step include a slit coating method and a spin coating method. As a drying device, a hot air oven, a hot plate, etc. are mentioned, for example. The drying time is preferably 80 to 120°C, and the drying time is preferably 1 to 15 minutes.

The exposure step is a step of photocuring a necessary portion of the dried film by exposure, or photodecomposing an unnecessary portion of the dried film, so that an arbitrary portion of the dried film is soluble in a developer. In the exposure step, exposure may be performed through a photomask having a predetermined opening, or an arbitrary pattern may be directly drawn using laser light or the like without using a photomask.

As an exposure apparatus, a proximity exposure machine is mentioned, for example. Examples of the active light to be irradiated in the exposure step include near-infrared rays, visible rays, and ultraviolet rays, and ultraviolet rays are preferable. Further, examples of the light source include a low-pressure mercury lamp, a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a halogen lamp, a sterilization lamp, and the like, and an ultra-high pressure mercury lamp is preferable.

The exposure conditions can be appropriately selected according to the thickness of the dried film to be exposed. In general, it is preferable to use an ultra-high pressure mercury lamp having an output of 1 to 100 mW/cm 2 to expose at an exposure amount of 1 to 10,000 mJ/cm 2.

In the developing process, a portion soluble in the developer in the dried film after exposure is dissolved and removed with a developer, and a dried film patterned in an arbitrary pattern shape, in which only the insoluble portion remains in the developer (hereinafter referred to as a pattern before heating). ). As a pattern shape, shapes, such as a lattice shape and a stripe shape, are mentioned, for example.

As a developing method, an immersion method, a spray method, a brush method, etc. are mentioned, for example.

As the developer, a solvent capable of dissolving unnecessary portions in the dried film after exposure can be appropriately selected, and an aqueous solution containing water as a main component is preferable. For example, when the resin composition contains a polymer having a carboxyl group, an aqueous alkali solution is preferable as a developer. Examples of the aqueous alkali solution include aqueous solutions of inorganic alkalis such as sodium hydroxide, potassium hydroxide, sodium carbonate and calcium hydroxide; And organic alkali aqueous solutions such as tetramethylammonium hydroxide, trimethylbenzyl ammonium hydroxide, monoethanolamine and diethanolamine. Among these, from the viewpoint of improving the resolution, an aqueous potassium hydroxide solution or an aqueous tetramethylammonium hydroxide solution is preferable. From the viewpoint of improving developability, the concentration of the aqueous alkali solution is preferably 0.05% by weight or more, and more preferably 0.1% by weight or more. On the other hand, the concentration of the aqueous alkali solution is preferably 5% by weight or less, and more preferably 1% by weight or less from the viewpoint of suppressing peeling or corrosion of the pattern before heating. The developing temperature is preferably 20 to 50°C in order to facilitate process management.

The heating process is a process of heat-hardening the pattern before heating formed in the developing process. As a heating device, a hot plate, an oven, etc. are mentioned, for example. Preferred heating temperature and heating time are as described above.

Next, the substrate with partition walls of the present invention will be described. The board|substrate with partition wall of this invention has the partition wall (A-1) patterned on the base board|substrate (hereinafter, it may be described as "partition wall (A-1)" in some cases). The base substrate has a function as a support in a substrate with a partition wall. When the partition wall has a pixel containing a color conversion light-emitting material to be described later, it has a function of suppressing the mixing of light between adjacent pixels.

In the substrate with partition walls of the present invention, the partition wall A-1 has a reflectance of 20% to 60% per 10 μm in thickness at a wavelength of 550 nm and an OD value of 1.0 to 3.0 per 10 μm in thickness. By setting the reflectance to 20% or more and the OD value to 3.0 or less, (A-1) the luminance of the display device can be improved by utilizing the reflection on the side of the partition wall. On the other hand, by setting the reflectance to 60% or less and the OD value to 1.0 or more, it is possible to suppress the light passing through the partition A-1 and to suppress the mixing of light between adjacent pixels.

Fig. 1 shows a cross-sectional view of an aspect of a substrate with partition walls of the present invention having a patterned partition wall. It has a partition wall 2 patterned on the base substrate 1.

<substrate>

As a base substrate, a glass plate, a resin plate, a resin film, etc. are mentioned, for example. As the material of the glass plate, alkali-free glass is preferable. As the material of the resin plate and the resin film, polyester, (meth)acrylic polymer, transparent polyimide, polyethersulfone, and the like are preferable. The thickness of the glass plate and the resin plate is preferably 1 mm or less, and preferably 0.8 mm or less. The thickness of the resin film is preferably 100 µm or less.

<Bulkhead (A-1)>

The partition wall A-1 is characterized in that the reflectance per 10 µm in thickness at a wavelength of 550 nm is 20 to 60% and an OD value of 1.0 to 3.0. Here, the thickness of the partition wall A-1 refers to the length of the partition wall A-1 in a direction perpendicular to the underlying substrate (height direction). In the case of the board|substrate with partition wall shown in FIG. 1, the thickness of the partition wall 2 is denoted by the symbol H. In addition, the length of the partition wall A-1 in the direction horizontal to the underlying substrate is the width of the partition wall A-1. In the case of the board|substrate with partition wall shown in FIG. 1, the width of the partition wall 2 is denoted by the symbol L.

In the present invention, it is considered that the reflectance on the side of the partition wall contributes to the improvement of the luminance of the display device, and the light shielding property of the partition wall contributes to suppression of color mixing. On the other hand, since the reflectance per thickness and the OD value are considered to be the same regardless of the thickness direction and the width direction, in the present invention, attention is paid to the reflectance per thickness of the partition wall and the OD value. Further, as will be described later, the thickness of the partition wall A-1 is preferably 0.5 to 50 µm, and the width is preferably 5 to 40 µm. Therefore, in the present invention, 10 µm was selected as a representative value of the thickness of the partition wall A-1, and attention was paid to the reflectance and OD value per 10 µm in thickness.

If the reflectance per 10 µm in thickness is less than 20%, reflection on the side surface of the partition wall becomes small, and the luminance of the display device becomes insufficient. The reflectance per 10 µm in thickness is preferably 30% or more, and more preferably 35% or more. The higher the reflectivity, the greater the reflection on the side of the partition wall, so that the luminance of the display device can be improved. However, when the reflectance exceeds 60%, light mixing occurs between adjacent pixels. The reflectance per 10 µm in thickness is more preferably 44% or less.

In addition, when the OD value per 10 µm in thickness is less than 1.0, light mixing occurs between adjacent pixels. 1.5 or more are preferable and, as for the OD value per 10 micrometers of thickness, 2.0 or more are more preferable. On the other hand, when the OD value per 10 µm in thickness exceeds 3.0, reflection on the side of the partition wall becomes small, and the luminance of the display device becomes insufficient. The OD value per 10 μm in thickness is more preferably 2.5 or less.

The reflectance per 10 μm of thickness at a wavelength of 550 nm of the partition wall (A-1) is, for the partition wall (A-1) having a thickness of 10 μm, from the top surface to a spectrophotometric (for example, Konica Minolta Corporation CM- 2600d) can be used to measure by SCI mode. However, when a sufficient area for measurement cannot be secured, or when a measurement sample having a thickness of 10 μm cannot be collected, and the composition of the barrier rib (A-1) is known, the barrier rib (A-1) and A solid film having the same composition and having a thickness of 10 µm may be prepared, and the reflectance per 10 µm may be obtained by measuring the reflectance similarly to the solid film instead of the partition wall (A-1). For example, a solid film was produced under the same processing conditions as for the formation of the partition wall (A-1) except that the thickness was set to 10 µm using the material in which the partition wall (A-1) was formed, and the pattern was not formed. With respect to the solid film, the reflectance may be similarly measured from the upper surface.

The OD value per 10 μm of the thickness of the partition A-1 is the incident light using an optical densitometer (for example, 361T (visual) manufactured by X-rite) from the upper surface of the partition A-1 having a thickness of 10 μm. And the intensity of transmitted light can be measured, and calculated by the following formula (1). However, when a sufficient area for measurement cannot be secured, or when a measurement sample having a thickness of 10 μm cannot be collected, and when the composition of the partition wall (A-1) is known, the partition wall is similar to the measurement of reflectance. A 10 µm-thick solid film having the same composition as (A-1) is prepared, and the OD value per 10 µm in thickness may be obtained by similarly measuring the OD value for the solid film instead of the partition wall (A-1).

OD value=log10(I ₀ /I)… (One)

I ₀ : Incident light intensity

I: transmitted light intensity.

Moreover, as a means for making the reflectance and the OD value into the said range, for example, making the partition wall (A-1) into the preferable composition mentioned later, etc. are mentioned.

The taper angle of the partition wall A-1 is preferably 45° to 110°. The taper angle of the partition wall A-1 refers to the angle formed by the side and the bottom side of the cross section of the partition wall. In the case of the board|substrate with partition wall shown in FIG. 1, the taper angle of the partition wall 2 is denoted by the symbol θ. By setting the taper angle to 45° or more, the difference between the widths of the upper portion and the bottom portion of the partition wall A-1 becomes small, and the width of the partition wall A-1 can be easily formed within a preferable range to be described later. The taper angle is more preferably 70° or more. On the other hand, when the taper angle is set to 110° or less, when a pixel containing the (B) color conversion luminescent material described later is formed by ink jet coating, it is possible to suppress agglomeration of ink and improve ink jet coatability. Here, the defect of ink means a phenomenon in which ink crosses the barrier rib and is mixed into adjacent pixel portions. The taper angle is more preferably 95° or less. The taper angle of the partition wall A-1 accelerates an arbitrary cross section of the partition wall A-1 using an optical microscope (FE-SEM (for example, Hitachi Seisakusho S-4800)). It can be obtained by observing with a voltage of 3.0 kV and a magnification of 2,500 times, and measuring the angle between the side and the bottom of the cross section of the partition wall A-1.

In addition, as a means for making the taper angle of the partition wall (A-1) into the above range, for example, making the partition wall (A-1) a preferable composition to be described later, formed by using the resin composition of the present invention described above. Things, etc. can be mentioned.

The thickness of the partition wall A-1 is preferably larger than the thickness of the pixel when the partition wall-equipped substrate has a pixel containing a color conversion light emitting material (B) described later. Specifically, the thickness of the partition wall A-1 is preferably 0.5 µm or more, and more preferably 10 µm or more. On the other hand, from the viewpoint of more efficient extraction of light emission at the bottom of the pixel, the thickness of the partition wall A-1 is preferably 50 µm or less, and more preferably 20 µm or less. In addition, it is preferable that the width of the partition wall A-1 is sufficient to further improve the luminance by utilizing light reflection on the side of the partition wall, and to further suppress the color mixture of light in adjacent pixels due to light leakage. . Specifically, the width of the partition wall is preferably 5 µm or more, and more preferably 15 µm or more. On the other hand, from the viewpoint of securing a large number of light emitting regions of the pixel to further improve the luminance, the width of the partition wall A-1 is preferably 50 µm or less, and more preferably 40 µm or less.

The partition wall A-1 has a repeating pattern for a predetermined number of pixels according to the screen size of the image display device. As the number of pixels of the image display device, for example, 4,000 horizontally and 2000 vertically. The number of pixels affects the resolution (delicate and dense) of the displayed image. Therefore, it is necessary to form the number of pixels according to the required image resolution and the screen size of the image display device, and it is desirable to determine the pattern formation dimension of the partition wall accordingly.

The partition wall (A-1) is a resin, a white pigment, and particles containing at least one metal oxide or metal selected from the group consisting of palladium oxide, platinum oxide, gold oxide, silver oxide, palladium, platinum, gold, and silver. (Hereinafter, it may be described as "metal oxide particles or metal particles"). The resin has a function of improving the crack resistance and light resistance of the partition wall. The white pigment has a function of further improving the reflectance of the partition wall. The metal oxide particles or metal particles have a function of adjusting the OD value and suppressing the color mixture of light in adjacent pixels.

The resin and the white pigment are as described above as materials constituting the resin composition. The content of the resin in the partition wall (A-1) is preferably 10% by weight or more, and more preferably 20% by weight or more, from the viewpoint of improving the crack resistance of the partition wall in heat treatment. On the other hand, from the viewpoint of improving light resistance, the content of the resin in the partition wall (A-1) is preferably 60% by weight or less, and more preferably 50% by weight or less.

From the viewpoint of further improving the reflectance, the content of the white pigment in the partition wall (A-1) is preferably 20% by weight or more, and more preferably 30% by weight or more. On the other hand, from the viewpoint of improving the surface smoothness of the partition wall, the content of the white pigment in the partition wall (A-1) is preferably 60% by weight or less, and more preferably 55% by weight or less.

Metal oxide particles or metal particles refer to black particles or yellow particles generated by decomposition and aggregation of the organometallic compound in the above-described resin composition in an exposure step and/or a heating step. The content of the metal oxide particles or metal particles in the partition wall (A-1) is preferably 0.2% by weight or more, and 0.5% by weight, from the viewpoint of further suppressing the color mixing of light in adjacent pixels by adjusting the reflectance and OD within the above-described range. It is more preferably at least% by weight. On the other hand, from the viewpoint of adjusting the reflectance and OD to the above-described ranges, the content of the metal oxide particles or metal particles in the partition wall (A-1) is preferably 5% by weight or less, and more preferably 3% by weight or less.

It is preferable that the partition wall (A-1) further contains a liquid-repellent compound. By containing the liquid-repellent compound, it is possible to impart liquid-repellent performance to the partition wall (A-1). For example, when forming a pixel containing a color conversion light-emitting material (B) described later, each pixel has a different color composition. The conversion light-emitting material can be easily divided and coated. The liquid-repellent compound is as described above as a material constituting the resin composition.

From the viewpoint of improving the liquid-repellent performance of the partition wall and improving the inkjet coatability, the content of the liquid-repellent compound in the partition wall (A-1) is preferably 0.01% by weight or more, and more preferably 0.1% by weight or more. On the other hand, from the viewpoint of improving compatibility with a resin or a white pigment, the content of the liquid-repellent compound in the partition wall (A-1) is preferably 10% by weight or less, and more preferably 5% by weight or less.

The surface contact angle of the partition wall (A-1) with respect to propylene glycol monomethyl ether acetate is preferably 10° or more, and 20° or more, from the viewpoint of improving inkjet coating properties and facilitating the divisional coating of the color conversion luminescent material. This is more preferable, and 40 degrees or more is still more preferable. On the other hand, from the viewpoint of improving the adhesion between the partition wall and the underlying substrate, the surface contact angle of the partition wall A-1 is preferably 70° or less, and more preferably 60° or less. Here, the surface contact angle of the partition wall (A-1) can be measured in accordance with the wettability test method of the substrate glass surface specified in JIS R3257 (establishment date = 1999/04/20) with respect to the partition wall upper part. Moreover, as a method of making the surface contact angle of the partition wall (A-1) into the said range, the method of using the liquid-repellent compound mentioned above, etc. are mentioned, for example.

As a method of forming a pattern of the partition wall A-1 on the base substrate, a photosensitive paste method is preferable from the viewpoint of easy adjustment of the pattern shape. As a method of patterning the partition wall by the photosensitive paste method, for example, a coating process in which the above-described resin composition is applied on a base substrate and dried to obtain a dried film, an exposure process in which the obtained dried film is pattern exposed according to a desired pattern shape, A method having a developing step of dissolving and removing a portion soluble in a developer in the dried film after exposure and a heating step of curing the partition wall after development is preferable. It is preferable to give the resin composition a positive type or negative type photosensitivity. Pattern exposure may be performed through a photomask having a predetermined opening, or an arbitrary pattern may be directly drawn using laser light or the like without using a photomask. In addition, when the board|substrate with partition wall has the light-shielding partition wall A-2 mentioned later, the partition wall A-1 can be patterned similarly on the light-shielding partition wall A-2. Each step is the same as described above as a manufacturing method of the light-shielding film.

<Light-shielding bulkhead (A-2)>

The barrier rib-equipped substrate of the present invention further includes (A-2) a patterned barrier rib having an OD value of 0.5 or more per 1.0 μm in thickness (hereinafter, “ It is preferable to have a light-shielding partition wall (A-2)"). By having the light-shielding partition A-2, light-shielding property is improved, light leakage of the backlight in the display device is suppressed, and a high-contrast and clear image can be obtained.

6 is a cross-sectional view showing an aspect of the substrate with partition walls of the present invention having a light-shielding partition wall. Pixels 3 are arranged in a region spaced apart by the partition wall 2 and the light blocking partition 7 having a partition wall 2 and a light blocking partition 7 patterned on the base substrate 1.

The light-shielding partition A-2 has an OD value of 0.5 or more per 1.0 µm in thickness. Here, the thickness of the light-shielding partition A-2 is preferably 0.5 to 10 µm, as described later. Therefore, in the present invention, 1.0 µm was selected as a representative value of the thickness of the partition wall A-2, and attention was paid to the OD value per 1.0 µm in thickness. When the OD value per 1.0 µm in thickness is 0.5 or more, the light-shielding property is further improved, and a higher contrast and clearer image can be obtained. The OD value per 1.0 μm of thickness is more preferably 1.0 or more. On the other hand, the OD value per 1.0 μm in thickness is preferably 4.0 or less, and pattern processability can be improved. The OD value per 1.0 mu m of thickness is more preferably 3.0 or less. The OD value of the light-shielding partition A-2 can be measured similarly to the OD value of the aforementioned partition A-1. In addition, as a means for making the OD value into the above range, for example, the light-shielding partition wall (A-2) may be made into a preferable composition to be described later, and the like.

The thickness of the light-shielding partition A-2 is preferably 0.5 µm or more, and more preferably 1.0 µm or more, from the viewpoint of improving the light-shielding property. On the other hand, from the viewpoint of improving the flatness, the thickness of the light-shielding partition A-2 is preferably 10 µm or less, and more preferably 5 µm or less. In addition, the width of the light-shielding partition A-2 is preferably about the same as that of the aforementioned partition A-1.

It is preferable that the light-shielding partition wall (A-2) contains a resin and a black pigment. The resin has a function of improving the crack resistance and light resistance of the partition wall. The black pigment has a function of absorbing incident light and reducing emitted light.

Examples of the resin include epoxy resin, (meth)acrylic polymer, polyurethane, polyester, polyimide, polyolefin, and polysiloxane. You may contain 2 or more types of these. Among these, polyimide is preferable from the viewpoint of excellent heat resistance and solvent resistance.

Examples of the black pigment include those exemplified as black pigments in the resin composition described above, and palladium oxide, platinum oxide, gold oxide, silver oxide, and the like. From the viewpoint of having a high light-shielding property, a black pigment selected from titanium nitride, zirconium nitride, carbon black, palladium oxide, platinum oxide, gold oxide and silver oxide is preferable.

As a method of patterning the light-shielding partition wall (A-2) on the base substrate, for example, a photosensitive material described in Japanese Unexamined Patent Application Publication No. 2015-1654 is used, and similarly to the partition wall (A-1) described above, a photosensitive paste A method of forming a pattern by a method is preferable.

In the substrate with partition walls of the present invention, a pixel containing the (B) color conversion light emitting material arranged to be spaced apart by the partition wall (A-1) (hereinafter, referred to as ``pixel (B)'' may be referred to as hereinafter) It is preferable to have. The pixel B has a function of enabling color display by converting at least a part of a wavelength region of incident light and emitting outgoing light in a wavelength region different from that of incident light.

Fig. 2 shows a cross-sectional view of an aspect of the substrate with partition walls of the present invention having a patterned partition wall A-1 and a pixel B containing a color conversion light-emitting material. Pixels 3 are arranged in a region spaced apart by the partition wall 2 with the partition wall 2 patterned on the base substrate 1.

It is preferable that the color conversion material contains a phosphor selected from inorganic phosphors and organic phosphors.

The substrate with partition walls of the present invention can be used as a display device by combining, for example, a backlight emitting blue light, a liquid crystal formed on a TFT, and a pixel (B). In this case, it is preferable to contain a red phosphor that is excited by blue excitation light and emits red fluorescence in a region corresponding to a red pixel. Similarly, it is preferable to contain a green phosphor that is excited by blue excitation light and emits green fluorescence in a region corresponding to a green pixel. It is preferable that no phosphor is contained in the region corresponding to the blue pixel.

The substrate with partition walls of the present invention can also be used for a display device in which a blue micro LED in which a plurality of blue LEDs corresponding to each pixel is arranged on a substrate separated by a white partition wall is used as a backlight. Each pixel can be turned on/off by turning on/off the blue micro LED, and no liquid crystal is required. The board|substrate with partition wall of this invention can be used for either a partition wall separating each pixel, and a partition wall separating a blue micro LED in a backlight.

As the inorganic phosphor, it is preferable that each color such as green or red is emitted by blue excitation light, that is, excitation by excitation light having a wavelength of 400 to 500 nm, and an emission spectrum having a peak in a region of 500 to 700 nm. . Examples of such inorganic phosphors include YAG-based phosphors, TAG-based phosphors, sialon-based phosphors, Mn ⁴⁺ activated fluoride complex phosphors, and inorganic semiconductors called quantum dots. You may use 2 or more types of these. Among these, quantum dots are preferable. Since quantum dots have a smaller average particle diameter compared to other phosphors, (B) the surface of the pixel can be smoothed to suppress light scattering on the surface, thereby further improving the light extraction efficiency and further improving the luminance. have.

Examples of quantum dots include particles containing semiconductors of group II-IV, III-V, IV-VI, and IV. Examples of these inorganic semiconductors include Si, Ge, Sn, Se, Te, B, C (including diamonds), P, BN, BP, BAs, AlN, AlP, AlAs, AlSb, GaN, GaP, GaAs, GaSb, InN, InP, InAs, InSb, ZnO, ZnS, ZnSe, ZnTe, CdS, CdSe, CdSeZn, CdTe, HgS, HgSe, HgTe, BeS, BeSe, BeTe, MgS, MgSe, GeS, GeSe, GeTe, SnS, SnSe, SnTe, PbO, PbS, PbSe, PbTe, CuF, CuCl, CuBr, CuI, Si ₃ N ₄ , Ge ₃ N ₄ , Al ₂ O ₃ and the like. You may use 2 or more types of these.

The quantum dot may contain a p-type dopant or an n-type dopant. Further, the quantum dot may have a core shell structure. In the core-shell structure, an arbitrary suitable functional layer (single layer or multiple layers) may be formed around the shell according to the purpose, and surface treatment and/or chemical modification may be performed on the surface of the shell.

As a shape of a quantum dot, a spherical shape, a column shape, a scale shape, a plate shape, an irregular shape, etc. are mentioned, for example. The average particle diameter of the quantum dots can be arbitrarily selected depending on the desired emission wavelength, and is preferably 1 to 30 nm. When the average particle diameter of the quantum dots is 1 to 10 nm, in each of blue, green, and red, the peak in the emission spectrum can be made sharper. The average particle diameter of the quantum dots is preferably 2 nm or more, and preferably 8 nm or less. For example, when the average particle diameter of the quantum dots is about 2 nm, blue light, when about 3 nm, green light, and when about 6 nm, red light is emitted. The average particle diameter of a quantum dot can be measured by a dynamic light scattering method. As a measuring device for the average particle diameter, a dynamic light scattering photometer DLS-8000 (manufactured by Otsuka Electric Corporation), etc. are mentioned.

As the organic phosphor, it is preferable to emit light in each color such as green or red by blue excitation light. As a phosphor emitting red fluorescence, a pyromethene derivative having a basic skeleton represented by the following structural formula (8), and a phosphor emitting green fluorescence, a pyromethene derivative having a basic skeleton represented by the following structural formula (9), etc. I can. Other examples include perylene-based derivatives, porphyrin-based derivatives, oxazine-based derivatives, and pyrazine-based derivatives that emit red or green fluorescence depending on the selection of the substituent. You may contain 2 or more types of these. Among these, pyromethane derivatives are preferred because of their high quantum yield. The pyromethene derivative can be obtained, for example, by the method described in Japanese Unexamined Patent Application Publication No. 2011-241160.

Since the organic phosphor is soluble in a solvent, the pixel B having a desired thickness can be easily formed.

The thickness of the pixel B is preferably 0.5 µm or more, and more preferably 1 µm or more, from the viewpoint of improving color characteristics. On the other hand, the thickness of the pixel B is preferably 30 µm or less, and more preferably 20 µm or less, from the viewpoint of thinning of the display device and curved surface workability.

The size of each pixel B is generally about 20 to 200 μm.

It is preferable that the pixels B are arranged to be spaced apart by the partition walls A-1. By providing a partition wall between the pixel and the pixel, diffusion or color mixing of the emitted light can be further suppressed.

As a method of forming the pixel B, for example, a method of filling a space separated by a partition wall A-1 with a coating solution containing a color conversion luminescent material (hereinafter, a color conversion luminescent material coating solution) is exemplified. The color conversion light-emitting material coating liquid may further contain a resin or a solvent.

As a method of filling the color conversion light-emitting material coating liquid, an inkjet coating method or the like is preferable from the viewpoint of easily applying different types of color conversion light-emitting materials to each pixel.

You may dry the obtained coating film under reduced pressure and/or heat-dry. In the case of drying under reduced pressure, in order to prevent the drying solvent from recondensing on the inner wall of the vacuum chamber, the drying temperature under reduced pressure is preferably 80° C. or lower. The pressure for drying under reduced pressure is preferably not more than the vapor pressure of the solvent contained in the coating film, and is preferably 1 to 1000 Pa. The drying time under reduced pressure is preferably 10 to 600 seconds. In the case of heating and drying, examples of the heating drying device include an oven and a hot plate. The heating drying temperature is preferably 60 to 200°C. The heating drying time is preferably 1 to 60 minutes.

In the substrate with partition walls of the present invention, on the pixel (B), (C) a low refractive index layer having a refractive index of 1.20 to 1.35 at a wavelength of 550 nm (hereinafter, it may be described as a ``low refractive index layer (C)''). It is preferable to have). By having the low refractive index layer C, the light extraction efficiency can be further improved, and the luminance of the display device can be further improved.

3 shows a cross-sectional view of an aspect of the substrate with partition walls of the present invention having a low refractive index layer. A partition wall 2 and a pixel 3 patterned on the base substrate 1 are provided, and a low refractive index layer 4 is further provided thereon.

In a display device, from the viewpoint of appropriately suppressing the reflection of light from the backlight and allowing light to be efficiently incident on the pixel B, the refractive index of the low refractive index layer C is preferably 1.20 or more, and more preferably 1.23 or more. On the other hand, from the viewpoint of improving luminance, the refractive index of the low refractive index layer (C) is preferably 1.35 or less, and more preferably 1.30 or less. Here, the refractive index of the low refractive index layer (C) can be measured by irradiating light having a wavelength of 550 nm from a direction perpendicular to the cured film surface under atmospheric pressure and at 20°C using a prism coupler.

It is preferable that the low refractive index layer (C) contains polysiloxane and silica particles not having a hollow structure. Polysiloxane has high compatibility with inorganic particles such as silica particles and functions as a binder capable of forming a transparent layer. In addition, by containing silica particles, minute voids can be efficiently formed in the low refractive index layer (C) to reduce the refractive index, and the refractive index can be easily adjusted within the above-described range. Further, by using silica particles that do not have a hollow structure, cracks can be suppressed because they do not have a hollow structure that is liable to generate cracks during cure shrinkage. In addition, in the low refractive index layer (C), the polysiloxane and the silica particles having no hollow structure may each be contained independently, or the polysiloxane and the silica particles having no hollow structure may be contained in a bonded state. From the viewpoint of the uniformity of the low refractive index layer (C), it is preferable that polysiloxane and silica particles having no hollow structure are contained in a bonded state.

It is preferable that the polysiloxane contained in the low refractive index layer (C) contains fluorine. By containing fluorine, the refractive index of the low refractive index layer (C) can be easily adjusted to 1.20 to 1.35. The fluorine-containing polysiloxane can be obtained by hydrolysis and polycondensation of a plurality of alkoxysilane compounds containing at least a fluorine-containing alkoxysilane compound represented by the following general formula (10). Further, other alkoxysilane compounds may be used.

In the general formula (10), R ⁷ represents a fluoroalkyl group having 3 to 17 fluorine atoms. R ⁶ represents the same groups as R ⁶ in the formula (5) to (7). m represents 1 or 2. 4-m R ⁶ and m R ⁷ may be the same or different, respectively.

Examples of the fluorine-containing alkoxysilane compound represented by the general formula (10) include trifluoroethyltrimethoxysilane, trifluoroethyltriethoxysilane, trifluoroethyltriisopropoxysilane, and trifluoropropyl Trimethoxysilane, trifluoropropyltriethoxysilane, trifluoropropyltriisopropoxysilane, heptadecafluorodecyltrimethoxysilane, heptadecafluorodecyltriethoxysilane, heptadecafluorodecyltri Isopropoxysilane, tridecafluorooctyltriethoxysilane, tridecafluorooctyltrimethoxysilane, tridecafluorooctyltriisopropoxysilane, trifluoroethylmethyldimethoxysilane, trifluoroethyl Methyldiethoxysilane, trifluoroethylmethyldiisopropoxysilane, trifluoropropylmethyldimethoxysilane, trifluoropropylmethyldiethoxysilane, trifluoropropylmethyldiisopropoxysilane, heptadecafluorodecyl Methyldimethoxysilane, heptadecafluorodecylmethyldiethoxysilane, heptadecafluorodecylmethyldiisopropoxysilane, tridecafluorooctylmethyldimethoxysilane, tridecafluorooctylmethyldiethoxysilane, tridecafluoro Rooctylmethyldiisopropoxysilane, trifluoroethylethyldimethoxysilane, trifluoroethylethyldiethoxysilane, trifluoroethylethyldiisopropoxysilane, trifluoropropylethyldimethoxysilane, trifluoro Propylethyldiethoxysilane, trifluoropropylethyldiisopropoxysilane, heptadecafluorodecylethyldimethoxysilane, heptadecafluorodecylethyldiethoxysilane, heptadecafluorodecylethyldiisopropoxysilane, tri Decafluorooctylethyldiethoxysilane, tridecafluorooctylethyldimethoxysilane, tridecafluorooctylethyldiisopropoxysilane, and the like. You may use 2 or more types of these.

The content of the polysiloxane in the low refractive index layer (C) is preferably 4% by weight or more from the viewpoint of suppressing cracks. On the other hand, the content of the polysiloxane is preferably 32% by weight or less from the viewpoint of securing thixotropic properties due to a network between silica particles, appropriately holding an air layer in the low refractive index layer (C), and further reducing the refractive index.

Examples of silica particles that do not have a hollow structure in the low refractive index layer (C) include "Snowtex" (registered trademark) and "organo silica sol" (registered trademark) series (registered trademark) manufactured by Nissan Chemical Industry Co., Ltd. Isopropyl alcohol dispersion, ethylene glycol dispersion, methyl ethyl ketone dispersion, dimethylacetamide dispersion, methyl isobutyl ketone dispersion, propylene glycol monomethyl acetate dispersion, propylene glycol monomethyl ether dispersion, methanol dispersion, ethyl acetate dispersion, butyl acetate dispersion, Xylene-n-butanol dispersion, toluene dispersion, etc. Part numbers PGM-ST, PMA-ST, IPA-ST, IPA-ST-L, IPA-ST-ZL, IPA-ST-UP, etc.) are mentioned. You may contain 2 or more types of these.

The content of the silica particles not having a hollow structure in the low refractive index layer (C) ensures thixotropic properties due to the network between the silica particles, appropriately maintains the air layer in the low refractive index layer (C), and improves the refractive index. From the viewpoint of reducing, it is preferably 68% by weight or more. On the other hand, the content of the silica particles not having a hollow structure is preferably 96% by weight or less from the viewpoint of suppressing cracks.

The thickness of the low refractive index layer C is preferably 0.1 µm or more, and more preferably 0.5 µm or more, from the viewpoint of suppressing the occurrence of defects by covering the step difference of the pixel B. On the other hand, the thickness of the low refractive index layer (C) is preferably 20 µm or less, and more preferably 10 µm or less from the viewpoint of reducing stress that causes cracks in the low refractive index layer (C).

As a method of forming the low refractive index layer (C), a coating method is preferable because the method is easy to form. For example, the low refractive index layer (C) can be formed by applying a resin composition for low refractive index containing polysiloxane and silica particles on the pixel (B), drying, and then heating.

In addition, it is preferable that the substrate with partition walls of the present invention further includes an inorganic protective layer I having a thickness of 50 to 1,000 nm on the low refractive index layer (C). By having the inorganic protective layer I, since moisture in the atmosphere becomes difficult to reach the low refractive index layer C, it is possible to suppress the variation of the refractive index of the low refractive index layer C and suppress the luminance deterioration.

Fig. 4 shows a cross-sectional view of an aspect of the substrate with partition walls of the present invention having a low refractive index layer and an inorganic protective layer I. It has a partition wall 2 and a pixel 3 patterned on the base substrate 1, and further has a low refractive index layer 4 and an inorganic protective layer I(5) on these.

In addition, it is preferable that the substrate with partition walls of the present invention further includes an inorganic protective layer II having a thickness of 50 to 1,000 nm between the pixel (B) and the low refractive index layer (C). By having the inorganic protective layer II, the raw material forming the pixel (B) from the pixel (B) to the low refractive index layer becomes difficult to move, so the refractive index fluctuation of the low refractive index layer (C) can be suppressed and luminance deterioration can be suppressed. I can.

5 shows a cross-sectional view of an aspect of the substrate with partition walls of the present invention having a low refractive index layer and an inorganic protective layer II. It has a partition wall 2 and a pixel 3 patterned on the base substrate 1, and further has an inorganic protective layer II 6 and a low refractive index layer 4 on these.

In addition, the substrate with partition walls of the present invention preferably has a color filter having a thickness of 1 to 5 μm (hereinafter, sometimes referred to as “color filter”) between the base substrate and the pixel (B). Do. The color filter has a function of making the transmitted light a desired color by transmitting visible light in a specific wavelength range. By having a color filter, the color purity of the display device can be improved. Color purity can be further improved by making the thickness of a color filter 1 micrometer or more. On the other hand, brightness can be further improved by setting the thickness of the color filter to 5 µm or less.

6 is a cross-sectional view of an aspect of the substrate with partition walls of the present invention having a color filter. A partition wall 2 and a color filter 7 patterned on the base substrate 1 are provided, and a pixel 3 is provided on the color filter 7.

Examples of the color filter include a color filter using a pigment-dispersed material in which a pigment is dispersed in a photoresist, which is used for a flat panel display such as a liquid crystal display. More specifically, a blue color filter that selectively transmits a wavelength of 400 nm to 550 nm, a green color filter that selectively transmits a wavelength of 500 nm to 600 nm, a yellow color filter that selectively transmits a wavelength of 500 nm or more, and a wavelength of 600 nm or more are selectively selected. A transmissive red color filter and the like. In addition, the color filters may be stacked apart from the pixel B containing the color conversion light-emitting material, or may be integrated and stacked.

Further, it is preferable that the substrate with partition walls of the present invention further has an inorganic protective layer III and/or a yellow organic protective layer having a thickness of 50 to 1,000 nm between the color filter and the pixel (B). Having the inorganic protective layer III makes it difficult for the raw material for forming the color filter to reach the pixel B containing the color conversion light-emitting material from the color filter, so that the luminance deterioration of the pixel B containing the color conversion light-emitting material is prevented. Can be suppressed. In addition, by having a yellow organic protective layer, blue leakage light that could not be completely converted by the pixel B containing the color conversion light-emitting material can be cut, and color reproducibility can be improved.

7 shows a cross-sectional view of an aspect of a substrate with partition walls of the present invention having a color filter and an inorganic protective layer III and/or a yellow organic protective layer. It has a partition wall 2 and a color filter 7 patterned on the base substrate 1, and has an inorganic protective layer III and/or a yellow organic protective layer 8 on them, and an inorganic protective layer III and/or yellow organic The pixels 3 are spaced apart and arranged by a partition wall 2 covered with a protective layer 8.

In addition, it is preferable that the substrate with partition walls of the present invention further includes an inorganic protective layer IV and/or a yellow organic protective layer having a thickness of 50 to 1,000 nm on the base substrate. The inorganic protective layer IV and/or the yellow organic protective layer acts as a refractive index adjusting layer, so that light emitted from the pixel B can be more efficiently extracted and the luminance of the display device can be further improved. In addition, the yellow organic protective layer cuts out blue leakage light that could not be completely converted by the pixel B containing the color conversion luminescent material, and can improve color reproducibility. It is more preferable that the inorganic protective layer IV and/or the yellow organic protective layer is provided between the base substrate and the partition wall (A) and the pixel (B).

8 shows a cross-sectional view of an aspect of the substrate with partition walls of the present invention having an inorganic protective layer IV and/or a yellow organic protective layer. It has an inorganic protective layer IV and/or a yellow organic protective layer 9 on the base substrate 1, has a partition wall 2 and a color filter 7 patterned thereon, and a partition wall 2 patterned thereon, and It has a pixel 3.

Examples of the material constituting the inorganic protective layers I to IV include metal oxides such as silicon oxide, indium tin oxide, and gallium zinc oxide; Metal nitrides such as silicon nitride; And fluorides such as magnesium fluoride. You may contain 2 or more types of these. Among these, silicon nitride or silicon oxide is more preferable from the viewpoint of low water vapor permeability and high permeability.

The thickness of the inorganic protective layers I to IV is preferably 50 nm or more, and more preferably 100 nm or more, from the viewpoint of sufficiently suppressing transmission of substances such as water vapor. On the other hand, from the viewpoint of suppressing the decrease in transmittance, the thickness of the inorganic protective layers I to IV is preferably 800 nm or less, and more preferably 500 nm or less.

The thickness of the inorganic protective layers I to IV is measured by exposing a cross section perpendicular to the base substrate using a polishing device such as a cross section polisher, and magnifying the cross section using a scanning electron microscope or a transmission electron microscope. can do.

As a method of forming the inorganic protective layers I to IV, for example, a sputtering method or the like can be mentioned. It is preferable that the inorganic protective layer is colorless transparent or yellow transparent.

The yellow organic protective layer is obtained, for example, by patterning the resin composition of the present invention containing an organometallic compound containing silver as an organometallic compound. As described above, the organometallic compound containing silver becomes yellow particles by decomposition and agglomeration in the heating step at the time of pattern formation as described above, and has a function of yellowing the protective layer. As an organometallic compound containing silver, silver neodecanoic acid, silver octylic acid, silver salicylate, etc. are mentioned, for example. Among these, silver neodecanoic acid is preferable from the viewpoint of yellowing more. In the resin composition for yellow organic protective layers, the content of the organometallic compound containing silver is preferably 0.2 to 5% by weight in solid content. Yellowing can be further achieved by making the content of the organometallic compound containing silver into 0.2% by weight or more. The content of the organometallic compound containing silver is more preferably 1.5% by weight or more in the solid content. On the other hand, by setting the content of the organometallic compound containing silver to 5% by weight or less in the solid content, the transmittance can be further improved.

The resin composition for forming the yellow organic protective layer may contain a yellow pigment. As a yellow pigment, for example, pigment yellow (hereinafter abbreviated as PY) PY12, PY13, PY17, PY20, PY24, PY83, PY86, PY93, PY95, PY109, PY110, PY117, PY125, PY129, PY137, PY138, PY139 , PY147, PY148, PY150, PY153, PY154, PY166, PY168, PY185, and the like. Among them, a yellow pigment selected from PY139, PY147, PY148 and PY150 is preferable from the viewpoint of selectively shielding blue light.

As a method of forming a pattern of the yellow organic protective layer, a method of forming a pattern by a photosensitive paste method, similarly to the partition wall (A-1) described above, is preferable.

As shown in FIG. 7, when the yellow organic protective layer 8 is formed on the color filter 7, the yellow organic protective layer 8 may serve as an overcoat layer for flattening each pixel of the color filter.

The thickness of the yellow organic protective layer is preferably 100 nm or more, and more preferably 500 nm or more, from the viewpoint of sufficiently shielding blue leakage light. On the other hand, from the viewpoint of suppressing a decrease in light extraction efficiency, the thickness of the yellow organic protective layer is preferably 3000 nm or less, and more preferably 2000 nm or less.

Next, the display device of the present invention will be described. The display device of the present invention includes the substrate with the partition wall and a light emitting light source. As the light-emitting light source, a light-emitting light source selected from a liquid crystal cell, an organic EL cell, a mini LED cell, and a micro LED cell is preferable. An organic EL cell is more preferable as a light-emitting light source from the viewpoint of excellent luminescence characteristics. Here, the mini-LED cell refers to a cell in which a large number of LEDs having a length of about 100 µm to 10 mm are arranged. The micro LED cell refers to a cell in which a large number of LEDs having a vertical and horizontal length of less than 100 μm are arranged.

A method of manufacturing a display device according to the present invention will be described with reference to an example of a display device including a substrate with partition walls and an organic EL cell according to the present invention. A photosensitive polyimide resin is applied on a glass substrate, and an insulating film having an opening is formed using a photolithography method. After sputtering aluminum thereon, aluminum is patterned by a photolithography method to form a rear electrode layer made of aluminum in an opening without an insulating film. Subsequently, tris(8-quinolinolato)aluminum (hereinafter abbreviated as Alq3) as an electron transport layer was deposited thereon by vacuum evaporation, and then dicyanomethylenepyran, quinacridone, and 4, on Alq3 as a light emitting layer. A white light-emitting layer doped with 4'-bis(2,2-diphenylvinyl)biphenyl is formed. Next, as a hole transport layer, N,N'-diphenyl-N,N'-bis(?-naphthyl)-1,1'-biphenyl-4,4'-diamine is deposited by vacuum evaporation. Finally, ITO is formed into a film as a transparent electrode by sputtering, and an organic EL cell having a white light emitting layer is produced. A display device can be manufactured by facing the above-described substrate with partition walls and the organic EL cells thus obtained and bonding them with a sealing agent.

Example

Hereinafter, the present invention will be described in more detail with reference to Examples and Comparative Examples, but the present invention is not limited to these ranges. In addition, the names of the abbreviations used among the compounds used are shown below.

PGMEA: Propylene glycol monomethyl ether acetate

DAA: diacetone alcohol

BHT: dibutylhydroxytoluene.

The solid content concentration of the polysiloxane solution in Synthesis Examples 1 to 4 was determined by the following method. 1.5 g of the polysiloxane solution was weighed in an aluminum cup, and the liquid was evaporated by heating at 250° C. for 30 minutes using a hot plate. The weight of the solid content remaining in the aluminum cup after heating was weighed, and the solid content concentration of the polysiloxane solution was determined from the ratio to the weight before heating.

The weight average molecular weight of the polysiloxane in Synthesis Examples 1 to 4 was determined by the following method. Using a GPC analyzer (HLC-8220; manufactured by Tosoh Corporation) and using tetrahydrofuran as a mobile phase, GPC analysis was performed based on ``JIS K7252-3 (Establishment Date = 2008/03/20)'' , The weight average molecular weight in terms of polystyrene was measured.

The content ratio of each repeating unit in the polysiloxane in Synthesis Examples 1 to 4 was determined by the following method. A polysiloxane solution was injected into an NMR sample tube made of "Teflon" (registered trademark) having a diameter of 10 mm, and ²⁹ Si-NMR measurement was performed, and Si derived from a specific organosilane relative to the integral value of the entire Si derived from organosilane The content ratio of each repeating unit was calculated from the ratio of the integral value of. ²⁹ Si-NMR measurement conditions are shown below.

Apparatus: Nuclear magnetic resonance apparatus (JNM-GX270; manufactured by Nihon Denshi Co., Ltd.)

Measurement method: gated decoupling method

Measurement nucleus frequency: 53.6693MHz ( ²⁹ Si nuclei)

Spectral Width: 20000Hz

Pulse width: 12 μs (45° pulse)

Pulse repetition time: 30.0 seconds

Solvent: acetone-d6

Reference Substance: Tetramethylsilane

Measurement temperature: 23℃

Sample rotation speed: 0.0Hz.

Synthesis Example 1 Polysiloxane (PSL-1) solution

In a 1000 ml three necked flask, trifluoropropyltrimethoxysilane was added to 147.32g (0.675mol), 3-methacryloxypropylmethyldimethoxysilane was added to 40.66g (0.175mol), and 3-trimethoxysilylpropylsuccinic anhydride To 26.23 g (0.10 mol), 3-(3,4-epoxycyclohexyl) propyltrimethoxysilane 12.32 g (0.05 mol), BHT 0.808 g, and PGMEA 171.62 g, water 52.65 while stirring at room temperature. A phosphoric acid aqueous solution in which 2.265 g of phosphoric acid (1.0% by weight based on the charged monomer) was dissolved in g was added over 30 minutes. Thereafter, the flask was immersed in an oil bath at 70°C and stirred for 90 minutes, and then the oil bath was heated to 115°C over 30 minutes. One hour after the start of temperature increase, the solution temperature (internal temperature) reached 100° C., and heated and stirred therefrom for 2 hours (internal temperature was 100 to 110° C.) to obtain a polysiloxane solution. Further, 0.05 liters/sort of a mixed gas of 95% by volume of nitrogen and 5% by volume of oxygen during heating and stirring was performed. A total of 131.35 g of methanol and water as by-products flowed out during the reaction. PGMEA was added to the obtained polysiloxane solution so that the solid content concentration was 40% by weight to obtain a polysiloxane (PSL-1) solution. In addition, the weight average molecular weight of the obtained polysiloxane (PSL-1) was 4,000. In addition, trifluoropropyltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-trimethoxysilylpropylsuccinic anhydride and 3-(3,4-epoxycyclo) in polysiloxane (PSL-1) The molar ratios of each repeating unit derived from hexyl)propyltrimethoxysilane were 67.5 mol%, 17.5 mol%, 10 mol%, and 5 mol%, respectively.

Synthesis Example 2 Polysiloxane (PSL-2) solution

To a 1000 ml three-necked flask, 116.07 g (0.475 mol) of diphenyldimethoxysilane, 43.46 g (0.175 mol) of 3-methacryloxypropyltrimethoxysilane, and 3-trimethoxysilane (0.20 mol), dimethyldimethoxysilane (0.20 mol), and 3-trimethoxysilane 26.23 g (0.10 mol) of methoxysilylpropylsuccinic anhydride, 12.32 g (0.05 mol) of 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane, 0.843 g of BHT and 176.26 g of PGMEA were added, and While stirring at room temperature, an aqueous phosphoric acid solution in which 2.221 g of phosphoric acid (1.0% by weight based on the charged monomer) was dissolved in 43.65 g of water was added over 30 minutes. Then, it carried out similarly to Synthesis Example 1, and obtained the polysiloxane solution. A total of 136.90 g of methanol and water as by-products flowed out during the reaction. PGMEA was added to the obtained polysiloxane solution so that solid content concentration might be 40 weight%, and the polysiloxane (PSL-2) solution was obtained. Moreover, the weight average molecular weight of the obtained polysiloxane (PSL-2) was 2,800. In addition, diphenyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-trimethoxysilylpropylsuccinic anhydride and 3-(3,4-epoxycyclohexyl)propyl in polysiloxane (PSL-2) The molar ratios of each repeating unit derived from trimethoxysilane were 47.5 mol%, 20 mol%, 17.5 mol%, 10 mol%, and 5 mol%, respectively.

Synthesis Example 3 Polysiloxane (PSL-3) solution

In a 1000 ml three necked flask, 147.32 g (0.675 mol) of trifluoropropyltrimethoxysilane, 43.46 g (0.175 mol) of 3-methacryloxypropyltrimethoxysilane, and 3-trimethoxysilylpropylsuccinic acid 26.23 g (0.10 mol) of anhydride, 12.32 g (0.05 mol) of 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane, 0.810 g of BHT, and 172.59 g of PGMEA were added, and water was stirred at room temperature while stirring. A phosphoric acid aqueous solution in which 2.293 g of phosphoric acid (1.0% by weight based on the charged monomer) was dissolved in 54.45 g was added over 30 minutes. Then, it carried out similarly to Synthesis Example 1, and obtained the polysiloxane solution. During the reaction, a total of 140.05 g of methanol and water as by-products flowed out. PGMEA was added to the obtained polysiloxane solution so that solid content concentration might be 40 weight%, and the polysiloxane (PSL-3) solution was obtained. Moreover, the weight average molecular weight of the obtained polysiloxane (PSL-3) was 4,100. In addition, trifluoropropyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-trimethoxysilylpropylsuccinic anhydride and 3-(3,4-epoxycyclo) in polysiloxane (PSL-3) The molar ratios of each repeating unit derived from hexyl)propyltrimethoxysilane were 67.5 mol%, 17.5 mol%, 10 mol%, and 5 mol%, respectively.

Synthesis Example 4 Polysiloxane (PSL-4) Solution

In a 1000 ml three-necked flask, 34.05 g (0.250 mol) of methyltrimethoxysilane, 99.15 g (0.500 mol) of phenyltrimethoxysilane, 31.25 g (0.150 mol) of tetraethoxysilane, 3-(3, 24.64 g (0.100 mol) of 4-epoxycyclohexyl) propyltrimethoxysilane and 174.95 g of PGMEA were added, and an aqueous phosphoric acid solution obtained by dissolving 0.945 g of phosphoric acid (0.50% by weight based on the charged monomer) in 56.70 g of water while stirring at room temperature. Was added over 30 minutes. Then, it carried out similarly to Synthesis Example 1, and obtained the polysiloxane solution. A total of 129.15 g of methanol and water as by-products flowed out during the reaction. PGMEA was added to the obtained polysiloxane solution so that solid content concentration might be 40 weight%, and the polysiloxane (PSL-4) solution was obtained. Moreover, the weight average molecular weight of the obtained polysiloxane (PSL-4) was 4,200. In addition, each repeating unit derived from methyltrimethoxysilane, phenyltrimethoxysilane, tetraethoxysilane and 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane in polysiloxane (PSL-4) The molar ratios of were 25 mol%, 50 mol%, 15 mol% and 10 mol%, respectively.

The compositions of Synthesis Examples 1 to 4 are combined and shown in Table 1.

Synthesis Example 5 Green Organic Phosphor

3,5-dibromobenzaldehyde (3.0 g), 4-t-butylphenylboronic acid (5.3 g), tetrakis (triphenylphosphine) palladium (0) (0.4 g) and potassium carbonate (2.0 g) Put in a flask, and replaced with nitrogen. Degassed toluene (30 mL) and degassed water (10 mL) were added thereto, followed by refluxing for 4 hours. After the reaction solution was cooled to room temperature and liquid-separated, the organic layer was washed with saturated brine. The organic layer was dried over magnesium sulfate, filtered, and the solvent was distilled off. The obtained reaction product was purified by silica gel column chromatography to obtain a white solid of 3,5-bis(4-t-butylphenyl)benzaldehyde (3.5 g). Next, 3,5-bis (4-t-butylphenyl) benzaldehyde (1.5 g) and 2,4-dimethylpyrrole (0.7 g) were added to the flask, and dehydrated dichloromethane (200 mL) and trifluoroacetic acid (1 Drop) was added, and the mixture was stirred for 4 hours under a nitrogen atmosphere. A dehydrated dichloromethane solution of 2,3-dichloro-5,6-dicyano-1,4-benzoquinone (0.85 g) was added to the reaction mixture, followed by stirring for an additional hour. After completion of the reaction, boron trifluoride diethyl ether complex (7.0 mL) and diisopropylethylamine (7.0 mL) were added and stirred for 4 hours, then water (100 mL) was further added and stirred, and the organic layer was separated. . This organic layer was dried over magnesium sulfate, filtered, and the solvent was distilled off. The obtained reaction product was purified by silica gel column chromatography to obtain 0.4 g of green powder (yield 17%). The ¹ H-NMR analysis results of the obtained green powder are as follows, and it was confirmed that the green powder obtained above was [G-1] represented by the following structural formula.

¹ H-NMR (CDCl ₃ (d=ppm)): 7.95 (s, 1H), 7.63-7.48 (m, 10H), 6.00 (s, 2H), 2.58 (s, 6H), 1.50 (s, 6H) , 1.37 (s, 18H).

Synthesis Example 6 Red Organic Phosphor

A mixed solution of 300 mg of 4-(4-t-butylphenyl)-2-(4-methoxyphenyl)pyrrole, 201 mg of 2-methoxybenzoyl chloride, and 10 ml of toluene was heated at 120°C for 6 hours under a nitrogen stream. After cooling to room temperature, the solvent was evaporated. The obtained residue was washed with 20 ml of ethanol and dried in vacuo to obtain 260 mg of 2-(2-methoxybenzoyl)-3-(4-t-butylphenyl)-5-(4-methoxyphenyl)pyrrole. Next, 2-(2-methoxybenzoyl)-3-(4-t-butylphenyl)-5-(4-methoxyphenyl)pyrrole 260mg, 4-(4-t-butylphenyl)-2-( A mixed solution of 180 mg of 4-methoxyphenyl)pyrrole, 206 mg of methanesulfonic anhydride, and 10 ml of degassed toluene was heated at 125°C for 7 hours under a nitrogen stream. After cooling the reaction mixture to room temperature, 20 ml of water was added, followed by extraction with 30 ml of dichloromethane. The organic layer was washed twice with 20 ml of water, and then evaporated and dried in vacuo to obtain a pyromethene body as a residue. Next, 305 mg of diisopropylethylamine and 670 mg of boron trifluoride diethyl ether complex were added to the obtained mixed solution of pyromethane and 10 ml of toluene, and stirred at room temperature for 3 hours. 20 ml of water was added to the reaction mixture, followed by extraction with 30 ml of dichloromethane. The organic layer was washed twice with 20 ml of water, dried over magnesium sulfate, and evaporated. After purification by silica gel column chromatography and drying in vacuo, 0.27 g of red-violet powder was obtained (yield 70%). The ¹ H-NMR analysis result of the obtained red-purple powder is as follows, and it was confirmed that the obtained red-purple powder was [R-1] represented by the following structural formula.

¹ H-NMR (CDCl ₃ (d=ppm)): 1.19 (s, 18H), 3.42 (s, 3H), 3.85 (s, 6H), 5.72 (d, 1H), 6.20 (t, 1H), 6.42 -6.97 (m, 16H), 7.89 (d, 4H).

Synthesis Example 7 Silica Particle-Containing Polysiloxane Solution (LS-1)

In a 500 ml three-necked flask, methyltrimethoxysilane was 0.05g (0.4mmol), trifluoropropyltrimethoxysilane was 0.66g (3.0mmol), and trimethoxysilylpropylsuccinic anhydride was 0.10g (0.4mmol). , 7.97 g (34 mmol) of γ-acryloxypropyltrimethoxysilane and 224.37 g of an isopropyl alcohol dispersion (IPA-ST-UP: manufactured by Nissan Chemical Industry Co., Ltd.) of silica particles of 15.6% by weight were added, and ethylene was added thereto. 163.93 g of glycol mono-t-butyl ether was added. While stirring at room temperature, an aqueous phosphoric acid solution in which 0.088 g of phosphoric acid was dissolved in 4.09 g of water was added over 3 minutes. Thereafter, the flask was immersed in an oil bath at 40°C and stirred for 60 minutes, and then the oil bath was heated to 115°C over 30 minutes. One hour after the start of the temperature increase, the inner temperature of the solution reached 100° C., from which the solution was heated and stirred for an additional 2 hours (the inner temperature was 100 to 110° C.) to obtain a silica particle-containing polysiloxane solution (LS-1). In addition, 0.05 L (liter)/sort of nitrogen during heating and stirring was carried out. A total of 194.01 g of methanol and water, which are by-products, flowed out during the reaction. The solid content concentration of the obtained silica particle-containing polysiloxane solution (LS-1) was 24.3% by weight, and the contents of the polysiloxane and silica particles in the solid content were 15% by weight and 85% by weight, respectively. From methyltrimethoxysilane, trifluoropropyltrimethoxysilane, 3-trimethoxysilylpropylsuccinic anhydride, and γ-acryloxypropyltrimethoxysilane of the polysiloxane in the obtained silica particle-containing polysiloxane (LS-1) The molar ratios of each derived repeating unit were 1.0 mol%, 8.0 mol%, 1.0 mol%, and 90.0 mol%, respectively.

Example 1 Resin composition for partition walls (P-1)

As a white pigment, 5.00 g of a polysiloxane (PSL-1) solution obtained by Synthesis Example 1 as a resin was mixed with 5.00 g of a titanium dioxide pigment (R-960; manufactured by BASF Japan Co., Ltd. (hereinafter “R-960”)). Then, a pigment dispersion (MW-1) was obtained by dispersing using a mill-type disperser filled with zirconia beads. In addition, 1.00 g of bis (acetylacetonato) palladium as an organometallic compound and 0.861 g of triphenylphosphine as a coordination compound having a phosphorus atom (equal molar amount relative to the organometallic compound) were dissolved in 8.139 g of DAA, An organometallic compound solution (OM-1) was obtained.

Next, 9.98 g of the pigment dispersion (MW-1), 1.86 g of the organometallic compound solution (OM-1), 0.98 g of a polysiloxane (PSL-1) solution, ethanol as a photopolymerization initiator, 1-[9-ethyl- 6-(2-methylbenzoyl)-9H-carbazol-3-yl]-, 1-(O-acetyloxime) ("Irgacure" (registered trademark) OXE-02, manufactured by BASF Japan Corporation (hereinafter) 「OXE-02」)) 0.050g, bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide ("Irgacure" 819, manufactured by BASF Japan (hereinafter "IC-819")) 0.400 g, 2-(3-benzoylphenyl)propionic acid 1,2-diisopropyl-3-[bis(dimethylamino)methylene]guanidinium (WPBG-266 (trade name)) as a photobase generator, Fujifilm Wako Junyaku Co., Ltd. (hereinafter "WPBG-266")) 0.100 g, as a photopolymerizable compound dipentaerythritol hexaacrylate ("KAYARAD" (registered trademark) DPHA, Shinnippon Pharmaceutical Co., Ltd. product (hereinafter "DPHA") )) 1.20 g, 40% by weight of PGMEA dilution of a photopolymerizable fluorine-containing compound ("Megapec" (registered trademark) RS-76-E, manufactured by DIC Corporation (hereinafter "RS-76-E")) as a liquid-repellent compound Solution 1.00 g, 3',4'-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate ("Celoxide" (registered trademark) 2021P, manufactured by Daicel Corporation (hereinafter referred to as "Celoxide (registered trademark)) ) 2021P")) 0.100g, ethylenebis(oxyethylene)bis[3-(5-tert-butyl-4-hydroxy-m-tolyl)propionate] ("Irganox" (registered trademark) 1010, BASF Japan Co., Ltd. (hereinafter "IRGANOX (registered trademark) 1010")) 0.030 g and acrylic surfactant ("BYK" (registered trademark) 352, Big Chemie Japan Co., Ltd. product (hereinafter "BYK-352"))) 0.100 g of a 10% by weight diluted solution of PGMEA (corresponding to a concentration of 500 ppm) was dissolved in 4.20 g of a solvent PGMEA and stirred. The obtained mixture was filtered through a 5.0 µm filter to obtain a resin composition for partition walls (P-1).

Examples 2 to 3 Resin compositions for partition walls (P-2) to (P-3)

Resin compositions for partition walls (P-2) and (P-3) in the same manner as in Example 1, except that the polysiloxane (PSL-2) or (PSL-3) solution was used instead of the polysiloxane (PSL-1) solution, respectively. Got it.

Example 4 Resin composition for partition walls (P-4)

In place of the 40% by weight PGMEA diluted solution of RS-76-E, "Megapec" (registered trademark) F477 (manufactured by Dai Nippon Ink Chemical Co., Ltd.) 40% by weight PGMEA diluted solution was used. Similarly, the resin composition for partition walls (P-4) was obtained.

Example 5 Resin composition for partition walls (P-5)

5.00 g of R-960 as a white pigment and 5.00 g of a polysiloxane (PSL-4) solution as a resin were mixed, and dispersed using a mill type disperser filled with zirconia beads to obtain a pigment dispersion (MW-4). 9.98 g of the pigment dispersion (MW-4), 1.86 g of the organometallic compound solution (OM-1), 1.16 g of the polysiloxane (PSL-4) solution, 0.10 g of WPBG-266 as a photobase generator, 1.00 g of 40% by weight PGMEA diluted solution of F477 as a liquid repellent compound, 0.100 g of Celoxide (registered trademark) 2021P, 1.60 g of THP-17 (trade name, manufactured by Toyo Kosei Kogyo Co., Ltd.) as a quinone diazide compound, interface 0.100 g of a 10% by weight diluted solution of PGMEA of BYK-352 activator and 4.10 g of PGMEA were mixed and stirred. The obtained mixture was filtered through a 5.0 µm filter to obtain a resin composition for partition walls (P-5).

Example 6 Resin composition for partition walls (P-6)

An organometallic compound solution (OM-2) was prepared in the same manner as the organometallic compound solution (OM-1), except that silver neodecanoate was used instead of bis(acetylacetonato)palladium as the organometallic compound. Except having used the organometallic compound solution (OM-2) instead of the organometallic compound solution (OM-1), it carried out similarly to Example 1, and obtained the resin composition for partition walls (P-6).

Example 7 Resin composition for partition walls (P-7)

An organometallic compound solution (OM-3) was prepared in the same manner as the organometallic compound solution (OM-1), except that chlorotriphenylphosphine gold was used instead of bis(acetylacetonato)palladium as the organometallic compound. Except having used the organometallic compound solution (OM-3) instead of the organometallic compound solution (OM-1), it carried out similarly to Example 1, and obtained the resin composition for partition walls (P-7).

Example 8 Resin composition for partition walls (P-8)

An organometallic compound solution (OM-4) was prepared in the same manner as the organometallic compound solution (OM-1), except that bis(acetylacetonato)platinum was used instead of bis(acetylacetonato)palladium as the organometallic compound. . Except having used the organometallic compound solution (OM-4) instead of the organometallic compound solution (OM-1), it carried out similarly to Example 1, and obtained the resin composition for partition walls (P-8).

Example 9 Resin composition for partition walls (P-9)

Except that the addition amount of the organometallic compound solution (OM-1) was changed to 0.929 g, the addition amount of the polysiloxane (PSL-1) solution was changed to 1.41 g, and PGMEA 4.20 g as a solvent was changed to PGMEA 4.70 g, as in Example 1 Similarly, the resin composition for partition walls (P-9) was obtained.

Example 10 Resin composition for partition walls (P-10)

Except that the addition amount of the organometallic compound solution (OM-1) was changed to 0.400 g, the addition amount of the polysiloxane (PSL-1) solution was changed to 1.940 g, and PGMEA 4.20 g as a solvent was changed to PGMEA 6.27 g, as in Example 1 Similarly, the resin composition for partition walls (P-10) was obtained.

Example 11 Resin composition for partition walls (P-11)

Except that the addition amount of the organometallic compound solution (OM-1) was changed to 4.595 g, the addition amount of the polysiloxane (PSL-1) solution was changed to 0.010 g, and PGMEA 4.20 g as a solvent was changed to PGMEA 2.92 g, as in Example 1 Similarly, the resin composition for partition walls (P-11) was obtained.

Example 12 Resin composition for partition walls (P-12)

Mix 5.00 g of R-960 as a white pigment, 5.00 g of a polysiloxane (PSL-1) solution as a resin, and 0.01 g of titanium nitride as a black pigment, and disperse using a mill-type disperser filled with zirconia beads to disperse the pigment dispersion (MW -2) was obtained. Examples except that 9.99 g of the pigment dispersion (MW-2) was added instead of the pigment dispersion (MW-1), the addition amount of the polysiloxane (PSL-1) solution was changed to 1.38 g, and 4.72 g of PGMEA was used as the solvent. It carried out similarly to 9, and obtained the resin composition for partition walls (P-12).

Example 13 Resin composition for partition walls (P-13)

10.0 g of a polysiloxane (PSL-1) solution as a resin and 0.15 g of titanium nitride as a black pigment were mixed, and dispersed using a mill-type disperser filled with zirconia beads to obtain a pigment dispersion (MW-3). Instead of the pigment dispersion (MW-1), 9.99 g of the pigment dispersion (MW-3) was added, the addition amount of the polysiloxane (PSL-1) solution was changed to 15.16 g, and the amount of PGMEA was changed from 4.20 g to 0.11 g. Except that, it carried out similarly to Example 1, and obtained the resin composition for partition walls (P-13).

Example 14 Resin composition for partition walls (P-14)

Instead of the organometallic compound solution (OM-1), a 10% DAA solution of bis(acetylacetonato)palladium as an organometallic compound was used 1.85g, and the amount of polysiloxane (PSL-1) solution added was changed to 1.34g, and the solvent As an example, except having changed PGMEA 4.20 g to PGMEA 3.85 g, it carried out similarly to Example 1, and obtained the resin composition for partition walls (P-14).

Example 15 Resin composition for partition walls (P-15)

The partition wall was carried out in the same manner as in Example 1, except that the addition amount of the polysiloxane (PSL-1) solution was changed to 1.21 g and PGMEA 4.20 g as the solvent was changed to PGMEA 4.07 g without adding the photobase generator WPBG-266. The resin composition (P-15) for was obtained.

Example 16 Resin composition for partition walls (P-16)

Except having changed the addition amount of the polysiloxane (PSL-1) solution to 2.01 g, and changed the PGMEA 4.20 g to PGMEA 4.17 g as a solvent without adding the 40 weight% PGMEA diluted solution of the liquid repellent compound RS-76-E, It carried out similarly to Example 1, and obtained the resin composition for partition walls (P-16).

Comparative Example 1 Resin composition for partition walls (P-17)

In place of the organometallic compound solution (OM-1), 0.867g of an organometallic compound solution (OM-5) obtained using 1.861g of triphenylphosphine and 8.139g of DAA as a coordinating compound having a phosphorus atom was added, and polysiloxane (PSL-1) A resin composition for partition walls (P-17) was obtained in the same manner as in Example 1, except that the addition amount of the solution was changed to 1.41 g and the addition amount of PGMEA was changed from 4.20 g to 4.76 g.

Comparative Example 2 Resin composition for partition walls (P-18)

Mix 5.00 g of R-960 as a white pigment, 5.00 g of a polysiloxane (PSL-1) solution as a resin, and 0.10 g of titanium nitride as a black pigment, and disperse using a mill-type disperser filled with zirconia beads to disperse the pigment dispersion (MW -4) was obtained. Next, 10.02 g of the pigment dispersion (MW-4), 1.73 g of the polysiloxane (PSL-1) solution, 0.050 g of OXE-02 as a photoinitiator, 0.400 g of IC-819, and WPBG as a photobase generator. 0.10 g of -266, 1.20 g of DPHA as a photopolymerizable compound, 1.00 g of 40 wt% PGMEA diluted solution of RS-76-E as a liquid repellent compound, 0.100 g of Celoxide (registered trademark) 2021P, IRGANOX (registered trademark) 0.030 g of 1010, 0.100 g of a 10% by weight diluted solution of PGMEA of BYK-352 as a surfactant, and 5.31 g of PGMEA as a solvent were mixed and stirred. The obtained mixture was filtered through a 5.0 µm filter to obtain a resin composition for partition walls (P-18).

Comparative Example 3 Resin composition for partition walls (P-19)

Mix 5.00 g of R-960 as a white pigment, 5.00 g of a polysiloxane (PSL-1) solution as a resin, and 0.10 g of zirconium nitride as a black pigment, and disperse using a mill-type disperser filled with zirconia beads to disperse a pigment dispersion (MW -5) was obtained. Except having used the pigment dispersion liquid (MW-5) instead of the pigment dispersion liquid (MW-4), it carried out similarly to Comparative Example 2, and obtained the resin composition for partition walls (P-19).

Comparative Example 4 Resin composition for partition walls (P-20)

5.00 g of R-960 as a white pigment, 5.00 g of a polysiloxane (PSL-1) solution as a resin, and 0.05 g of a mixed pigment having a weight ratio of 60/40 of the red pigment PR254 and the blue pigment PB64 as a black pigment were mixed, and the zirconia beads were Disperse was performed using a filled mill type disperser to obtain a pigment dispersion (MW-6). Except having used the pigment dispersion liquid (MW-6) instead of the pigment dispersion liquid (MW-4), it carried out similarly to Comparative Example 2, and obtained the resin composition for partition walls (P-20).

Comparative Example 5 Resin composition for partition walls (P-21)

An organometallic compound solution (OM-5) was prepared in the same manner as the organometallic compound solution (OM-1), except that tris(acetylacetonato)iron was used instead of bis(acetylacetonato)palladium as the organometallic compound. . Except having used the organometallic compound solution (OM-5) instead of the organometallic compound solution (OM-1), it carried out similarly to Example 1, and obtained the resin composition for partition walls (P-21).

Comparative Example 6 Resin composition for partition walls (P-22)

An organometallic compound solution (OM-5) was prepared in the same manner as the organometallic compound solution (OM-1), except that bis(acetylacetonato)nickel was used instead of bis(acetylacetonato)palladium as the organometallic compound. . Except having used the organometallic compound solution (OM-6) instead of the organometallic compound solution (OM-1), it carried out similarly to Example 1, and obtained the resin composition for partition walls (P-22).

The compositions of Examples 1 to 16 and Comparative Examples 1 to 6 are combined and shown in Tables 2 to 3.

Preparation Example 1 Color Conversion Light-Emitting Material Composition (CL-1)

20 parts by weight of a 0.5% by weight toluene solution of a green quantum dot material (Lumidot 640 CdSe/ZnS, average particle diameter 6.3 nm: manufactured by Aldrich), 45 parts by weight of DPHA, and "Irgacure" (registered trademark) 907 (BASF Japan ( Note) 5 parts by weight, 30 parts by weight of PGMEA solution of acrylic resin (SPCR-18 (trade name), manufactured by Showa Denko Co., Ltd.), 166 parts by weight and 97 parts by weight of toluene were mixed and stirred, and uniformly Dissolved. The obtained mixture was filtered through a 0.45 μm syringe filter to prepare a color conversion luminescent material composition (CL-1).

Preparation Example 2 Color Conversion Light-Emitting Material Composition (CL-2)

In the same manner as in Preparation Example 1, except that 0.4 parts by weight of the green phosphor G-1 obtained in Synthesis Example 5 was used instead of the green quantum dot material, and the addition amount of toluene was changed to 117 parts by weight, the color conversion luminescent material composition (CL- 2) was prepared

Preparation Example 3 Color Conversion Light-Emitting Material Composition (CL-3)

In the same manner as in Preparation Example 1, except that 0.4 parts by weight of the red phosphor R-1 obtained in Synthesis Example 6 was used instead of the green quantum dot material, and the addition amount of toluene was changed to 117 parts by weight, the color conversion luminescent material composition (CL- 3) was prepared

Preparation Example 4 Color Filter Forming Material (CF-1)

90 g of CI pigment green 59, 60 g of CI pigment yellow 150, 75 g of a polymer dispersant ("BYK" (registered trademark)-6919 (trade name) manufactured by Vic Chemie (hereinafter "BYK-6919"))), and a binder resin (" 100 g of Adeka Arcles" (registered trademark) WR301 (trade name) manufactured by ADEKA Co., Ltd. and 675 g of PGMEA were mixed to prepare a slurry. The beaker containing the slurry was connected to a dino mill and a tube, and dispersion treatment was performed for 8 hours at a circumferential speed of 14 m/s using 0.5 mm diameter zirconia beads as a medium to prepare Pigment Green 59 dispersion (GD-1).

Pigment Green 59 dispersion (GD-1) 56.54 g, acrylic resin ("Cyclomer" (registered trademark) P(ACA)Z250 (brand name)) manufactured by Daicel Allnex Corporation (hereinafter "P(ACA)Z250") )) 3.14 g, DPHA 2.64 g, photopolymerization initiator ("Optoma" (registered trademark) NCI-831 (trade name) manufactured by ADEKA Co., Ltd. (hereinafter "NCI-831")) 0.330 g, surfactant ("BYK") (Registered trademark) -333 (brand name) 0.04 g manufactured by Big Chemie (hereinafter referred to as "BYK-333")), 0.01 g of BHT as a polymerization inhibitor, and 37.30 g of PGMEA as a solvent were mixed, and a color filter-forming material (CF-) 1) was produced.

Preparation Example 5 Resin composition for light-shielding partition walls

A slurry was prepared by mixing 150 g of carbon black (MA100 (trade name) manufactured by Mitsubishi Chemical Co., Ltd.), 75 g of a polymer dispersant BYK-6919, 100 g of P(ACA)Z250, and 675 g of PGMEA. The beaker into which the slurry was placed was connected to a dino mill and a tube, and a dispersion treatment was performed for 8 hours at a circumferential speed of 14 m/s using 0.5 mm diameter zirconia beads as a medium to prepare a pigment dispersion (MB-1).

Pigment dispersion (MB-1) 56.54g, P(ACA)Z250 3.14g, DPHA 2.64g, NCI-831 0.330g, BYK-333 0.04g, tertiary butylcatechol 0.01g as polymerization inhibitor and 37.30 g of PGMEA was mixed, and the resin composition for light-shielding partition walls was produced.

Preparation Example 6 Low refractive index layer-forming material

5.350 g of a polysiloxane solution (LS-1) containing silica particles obtained by Synthesis Example 6, 1.170 g of ethylene glycol mono-t-butyl ether and 3.48 g of DAA were mixed, and then filtered through a 0.45 μm syringe filter to have a low refractive index. A layer forming material was prepared.

Preparation Example 7 Yellow Organic Protective Layer Forming Material (YL-1)

150 g of CI pigment yellow 150, 75 g of a polymer dispersant ("BYK" (registered trademark)-6919 (brand name) manufactured by Big Chemie (hereinafter "BYK-6919"))), and 75 g of a binder resin ("Adeka Arcles" (registered trademark)) ) 100 g of WR301 (trade name) manufactured by ADEKA Co., Ltd. and 675 g of PGMEA were mixed to prepare a slurry. The beaker into which the slurry was put was connected to a dino mill and a tube, and a dispersion treatment was performed for 8 hours at a circumferential speed of 14 m/s using zirconia beads having a diameter of 0.5 mm as a medium to prepare a pigment yellow 150 dispersion (YD-1).

An organometallic compound solution prepared using 3.09 g of pigment yellow 150 dispersion (YD-1), 23.54 g of a polysiloxane (PSL-1) solution as a resin, 6.02 g of DPHA as a photopolymerizable compound, and silver neodecanoate as an organometallic compound 6.02 g of (OM-2), 0.20 g of OXE-02 as a photopolymerization initiator, 0.40 g of IC-819, 0.060 g of IRGANOX (registered trademark) 1010, and 0.050 g of a 10% by weight diluted solution of BYK-352 PGMEA (concentration 500 ppm) was dissolved in 61.15 g of a solvent PGMEA and stirred. The obtained mixture was filtered through a 5.0 µm filter to obtain a yellow organic protective layer-forming material (YL-1).

(Examples 17 to 20, Examples 22 to 28, Examples 38 to 45, Comparative Examples 7 to 9)

As the base substrate, a square non-alkali glass substrate (manufactured by AGC Techno Glass Co., Ltd., thickness 0.7 mm) having a side of 10 cm was used. The resin composition for partition walls shown in Tables 4 to 5 was spin-coated thereon, and dried at a temperature of 90° C. for 2 minutes using a hot plate (brand name SCW-636, manufactured by Dai Nippon Screen Seizou Co., Ltd.) to form a dried film. I did. The prepared dried film was exposed using a parallel light mask aligner (trade name PLA-501F, manufactured by Canon Co., Ltd.), using an ultra-high pressure mercury lamp as a light source, and an exposure amount of 200 mJ/cm 2 (i-line) through a photomask. Thereafter, using an automatic developing device ("AD-2000 (trade name)" manufactured by Takizawa Sangyo Co., Ltd.), a 0.045% by weight aqueous solution of potassium hydroxide was used for 100 seconds of shower development, and then water was used for 30 Rinse for seconds. In addition, using an oven (trade name IHPS-222, manufactured by SPEC Co., Ltd.), it was heated for 30 minutes at a temperature of 230°C in air, and the partition wall having a height of 10 µm and a width of 20 µm on a glass substrate was 30 µm on the short side, A partition wall formed in a lattice pattern with a pitch interval of 150 μm on the long side was formed.

The color conversion luminescent material composition shown in Tables 4 to 5 was applied to the area separated by the barrier ribs of the obtained barrier ribbed substrate using an ink jet method under a nitrogen atmosphere, and dried at 100° C. for 30 minutes to obtain a pixel having a thickness of 5.0 μm. It formed and obtained the board|substrate with partition walls of the structure shown in FIG.

(Example 21)

As the base substrate, a square non-alkali glass substrate (manufactured by AGC Techno Glass Co., Ltd., thickness 0.7 mm) having a side of 10 cm was used. On that, the resin composition for partition walls shown in Table 4 was spin-coated, and dried at a temperature of 90° C. for 2 minutes using a hot plate (trade name SCW-636, manufactured by Dai Nippon Screen Seizou Co., Ltd.) to prepare a dried film. The prepared dried film was exposed using a parallel light mask aligner (trade name PLA-501F, manufactured by Canon Co., Ltd.), using an ultra-high pressure mercury lamp as a light source, and an exposure amount of 200 mJ/cm 2 (i-line) through a photomask. Then, using an automatic developing device ("AD-2000 (trade name)" manufactured by Takizawa Sangyo Co., Ltd.), it was developed by showering with a 2.38 wt% tetramethylammonium hydroxide aqueous solution for 90 seconds, and then rinsed with water for 30 seconds. . Thereafter, as before, bleaching was performed by exposing at an exposure dose of 500 mJ/cm 2 (i-line) without interposing a photomask. In addition, using an oven (trade name IHPS-222, manufactured by SPEC Co., Ltd.), heated for 30 minutes at a temperature of 230°C in the air, and the partition wall having a height of 10 µm and a width of 20 µm on a glass substrate is 30 µm on the short side, A partition wall formed in a lattice pattern with a pitch interval of 150 μm on the long side was formed.

The color conversion luminescent material composition shown in Tables 4 to 5 was applied to the area separated by the barrier ribs of the obtained barrier ribbed substrate using an ink jet method under a nitrogen atmosphere, and dried at 100° C. for 30 minutes to obtain a pixel having a thickness of 5.0 μm. Was formed, and a substrate with partition walls having the configuration shown in FIG. 2 was obtained.

(Example 29)

A low-refractive-index layer-forming material was spin-coated on a substrate with a partition wall after forming a pixel by the same method as in Example 18, and a hot plate (trade name SCW-636, manufactured by Dai Nippon Screen Seizou Co., Ltd.) was used. It dried at 90° C. for 2 minutes to prepare a dried film. Further, using an oven (trade name IHPS-222, manufactured by SPEC Co., Ltd.), it was heated at 90°C in air for 30 minutes to form a low refractive index layer, and a substrate with partition walls having the configuration shown in FIG. 3 was obtained.

(Example 30)

A film corresponding to an inorganic protective layer I having a thickness of 50 to 1,000 nm using a plasma CVD apparatus (PD-220NL, manufactured by Samko Corporation) on the low refractive index layer of the substrate with the partition wall having the low refractive index layer obtained in Example 29 A silicon nitride film having a thickness of 300 nm was formed, and a substrate with partition walls having the configuration shown in FIG. 4 was obtained.

(Example 31)

On the substrate with partition walls obtained in Example 18, a silicon nitride film having a thickness of 300 nm corresponding to the inorganic protective layer II having a thickness of 50 to 1,000 nm was formed on the upper layer of the pixel using a plasma CVD apparatus (PD-220NL, manufactured by Samko Corporation). I did. Thereafter, on the inorganic protective layer II, a low refractive index layer having a thickness of 1.0 μm was formed by the same method as in Example 29 using the low refractive index layer-forming material obtained by Preparation Example 6, and the configuration shown in FIG. A substrate with partition walls was obtained.

(Example 32)

Color filter-forming material (CF-1) obtained by Preparation Example 4 so that the film thickness after curing became 2.5 µm in a region separated by a partition wall of a substrate with partition walls before pixel formation, obtained by the same method as in Example 17 Was applied and vacuum dried. A photomask designed to be exposed to the region of the opening of the substrate with the partition wall was interposed, and exposure was performed at an exposure amount of 40 mJ/cm 2 (i-line). After developing for 50 seconds with a 0.3% by weight aqueous solution of tetramethylammonium, heat curing was performed at 230° C. for 30 minutes to form a color filter having a thickness of 2.5 µm and a width of 50 µm in a region separated by a partition wall. Thereafter, the color conversion luminescent material composition (CL-2) obtained by Preparation Example 2 was applied on the color filter under a nitrogen atmosphere by using an inkjet method, and dried at 100° C. for 30 minutes to obtain a pixel having a thickness of 5.0 μm. It formed and obtained the board|substrate with partition walls of the structure shown in FIG.

(Example 33)

On the color filter of the substrate with partition walls before pixel formation, in which a color filter having a thickness of 2.5 µm and a width of 50 µm obtained by the same method as in Example 32 was formed, a plasma CVD apparatus (PD-220NL, manufactured by Samko Corporation) was used. A silicon nitride film having a thickness of 300 nm corresponding to the inorganic protective layer III of 50 to 1,000 nm was formed. Further, on the inorganic protective layer III, the color conversion light-emitting material composition (CL-2) obtained by Preparation Example 2 was applied using an inkjet method in a nitrogen atmosphere, and dried at 100° C. for 30 minutes to obtain a pixel having a thickness of 5.0 μm. Was formed, and a substrate with partition walls having the configuration shown in FIG. 7 was obtained.

(Example 34)

As the base substrate, a square non-alkali glass substrate (manufactured by AGC Techno Glass Co., Ltd., thickness 0.7 mm) having a side of 10 cm was used. A silicon nitride film having a thickness of 300 nm was formed thereon, corresponding to the inorganic protective layer IV having a thickness of 50 to 1,000 nm, using a plasma CVD apparatus (PD-220NL, manufactured by Samko Corporation). A substrate with partition walls having the configuration shown in Fig. 8 was obtained by the same method as in Example 31 except that the substrate was used in place of a square, alkali-free glass substrate having a side of 10 cm.

(Example 35)

A yellow organic protective layer forming material (YL-) obtained in Preparation Example 7 on the color filter of a substrate with partition walls before pixel formation, in which a color filter having a thickness of 2.5 µm and a width of 50 µm obtained by the same method as in Example 32 was formed was formed. 1) was applied and vacuum dried. A photomask designed to be exposed to the region of the opening of the substrate with the partition wall was interposed, and exposure was performed at an exposure amount of 40 mJ/cm 2 (i-line). After developing for 50 seconds with a 0.3% by weight aqueous solution of tetramethylammonium, heat curing was performed at 230°C for 30 minutes to form a yellow organic protective layer having a thickness of 1.0 µm and a width of 50 µm. Further, on the yellow organic protective layer, the color conversion light-emitting material composition (CL-2) obtained in Preparation Example 2 was applied using an inkjet method in a nitrogen atmosphere, and dried at 100° C. for 30 minutes to obtain a pixel having a thickness of 5.0 μm. Was formed, and a substrate with partition walls having the configuration shown in FIG. 7 was obtained.

(Example 36)

As the base substrate, a square non-alkali glass substrate (manufactured by AGC Techno Glass Co., Ltd., thickness 0.7 mm) having a side of 10 cm was used. The yellow organic protective layer forming material (YL-1) obtained in Preparation Example 7 was applied thereon, followed by vacuum drying. The dried film was exposed to light at an exposure amount of 40 mJ/cm 2 (i-line) without a photomask, and then developed for 50 seconds with a 0.3% by weight aqueous tetramethylammonium solution, followed by heat curing at 230°C for 30 minutes to a thickness of 1.0 μm. A yellow organic protective layer was formed. A substrate with partition walls having the configuration shown in Fig. 8 was obtained by the same method as in Example 31 except that the substrate was used in place of a square, alkali-free glass substrate having a side of 10 cm.

(Example 37)

As the base substrate, a square non-alkali glass substrate (manufactured by AGC Techno Glass Co., Ltd., thickness 0.7 mm) having a side of 10 cm was used. On that, the light-shielding barrier rib-forming material obtained in Preparation Example 5 was spin-coated, and dried at a temperature of 90° C. for 2 minutes using a hot plate (trade name SCW-636, manufactured by Dai Nippon Screen Seizou Co., Ltd.) to prepare a dried film. . The prepared dried film was exposed with a parallel light mask aligner (trade name PLA-501F, manufactured by Canon Co., Ltd.), using an ultra-high pressure mercury lamp as a light source, and an exposure amount of 40 mJ/cm 2 (i-line) through a photomask. Then, using an automatic developing device ("AD-2000 (trade name)" manufactured by Takizawa Sangyo Co., Ltd.), development was performed for 50 seconds with a 0.3% by weight aqueous solution of tetramethylammonium, and then 30 with water. Rinse for seconds. In addition, using an oven (brand name IHPS-222, manufactured by SPEC Co., Ltd.), it was heated for 30 minutes at a temperature of 230° C. in air, and the OD value per 2.0 μm in height, 20 μm in width, and 1.0 μm in thickness on a glass substrate was A substrate with light-shielding barrier ribs formed in a grid pattern having a pitch spacing of 2.0 µm on the short side and 150 µm on the long side was obtained. Thereafter, by the same method as in Example 17, the barrier ribs having a height of 10 µm and a width of 20 µm were formed in the same grid pattern as the light blocking partitions having a pitch interval of 30 µm on the short side and 150 µm on the long side by the same method as in Example 17. A substrate with partition walls was obtained. The color conversion luminescent material composition (CL-2) obtained by Preparation Example 22 was applied to the area separated by the barrier ribs of the obtained barrier ribbed substrate using an ink jet method under a nitrogen atmosphere, and dried at 100° C. for 30 minutes to give a thickness of 5.0. A µm pixel was formed, and a substrate with partition walls having the configuration shown in FIG. 9 was obtained.

The configurations of each Example and Comparative Example are shown in Tables 4 to 5.

The evaluation method in each Example and a comparative example is shown below.

<Refractive index of white pigment>

For the white pigment used in each of the Examples and Comparative Examples, the method B of the method of measuring the refractive index of plastics specified in JIS K7142-2014 (date of establishment = 2014/04/20) (liquid immersion method using a microscope (Beckesian method)) The refractive index was measured by. The measurement wavelength was set to 550 nm. However, instead of the immersion liquid used in JIS K7142-2014, a "contact liquid" manufactured by Shimadzu Device Seizou was used, and the measurement was performed under the conditions of the immersion liquid temperature: 20°C. As a microscope, a polarization microscope "Optiphoto" (manufactured by Nikon Corporation) was used. Each 30 samples of white pigment were prepared, each refractive index was measured, and the average value was made into the refractive index.

<Refractive index of polysiloxane and low refractive index layer>

Polysiloxane as a raw material for the barrier rib-forming resin composition used in each of the Examples and Comparative Examples and the low-refractive-index layer-forming material obtained in Preparation Example 26 were applied on a silicon wafer by spinners, respectively, and a hot plate (trade name SCW-636, It dried for 2 minutes at a temperature of 90 degreeC using Dai-Nippon Screen Seizou Co., Ltd. product. Then, using an oven (IHPS-222; manufactured by SPEC Co., Ltd.), it was heated in air at 230°C for 30 minutes to prepare a cured film. Using a prism coupler (PC-2000 (manufactured by Metricon Co., Ltd.)), under atmospheric pressure, under the condition of 20°C, irradiate light with a wavelength of 550 nm from the vertical direction to the cured film surface to measure the refractive index and measure the refractive index, and the third digit after the decimal point. Is rounded up.

<Resolution>

Using a spin coater (trade name 1H-360S, manufactured by Mikasa Co., Ltd.), the resin composition for partition walls used in each of the Examples and Comparative Examples was formed on a square alkali-free glass substrate having a side of 10 cm, after heating. It spin-coated so that the thickness might become 10 micrometers, and it dried at 90 degreeC for 2 minutes using a hot plate (trade name SCW-636, Dai Nippon Screen Seizou Co., Ltd. product), and a 10 micrometers-thick dry film was produced.

The prepared dried film was prepared using a parallel light mask aligner (trade name PLA-501F, manufactured by Canon Co., Ltd.), using an ultra-high pressure mercury lamp as a light source, and 100 µm, 80 µm, 60 µm, 50 µm, 40 µm, 30 µm and A mask having a line & space pattern having each width of 20 µm was interposed therebetween, and exposure was performed with a gap of 100 µm at an exposure amount of 200 mJ/cm 2 (i-line). Thereafter, using an automatic developing device ("AD-2000 (trade name)" manufactured by Takizawa Sangyo Co., Ltd.), a 0.045% by weight aqueous solution of potassium hydroxide was used for 100 seconds of shower development, and then water was used for 30 Rinse for seconds.

The pattern after development was magnified and observed using a microscope adjusted to a magnification of 100 times, and the narrowest line width among patterns in which no residue was visible in the unexposed portion was used as the resolution. However, when there is a residue also in the unexposed part near the pattern of 100 micrometers width, it was set as ">100 micrometers".

<Reflectance>

The partition wall-forming resin composition used in each of the Examples and Comparative Examples was processed under the same conditions as each of the Examples and Comparative Examples, except that the whole was exposed without interposing a photomask at the time of exposure, and a solid film was formed on a glass substrate. Was produced. Using the obtained solid film as a model of the partition wall of the partition wall-equipped substrate obtained by each of the Examples and Comparative Examples, for the glass substrate having the solid film, using a spectrophotometer (trade name CM-2600d, manufactured by Konica Minolta Co., Ltd.) The reflectance at a wavelength of 550 nm was measured in the SCI mode from the film side. However, when a crack occurred in the solid film, the reflectance was not measured because an accurate value could not be obtained due to a crack or the like.

<Crack resistance>

The partition wall-forming resin composition used in each of the Examples and Comparative Examples was spin-coated so that the film thickness after heating became 5 µm, 10 µm, 15 µm, and 20 µm, respectively. For the subsequent process, except for exposing the whole without interposing a photomask at the time of exposure, it processed under the same conditions as each Example and the comparative example, and produced a solid film on a glass substrate. The obtained solid film was used as a partition wall model of the partition wall-equipped substrate obtained by each of the Examples and Comparative Examples, and the glass substrate having the solid film was visually observed, and the presence or absence of cracks in the solid film was evaluated. When any crack was confirmed, it was judged that there was no crack resistance in the film thickness. For example, when there is no crack at a film thickness of 15 µm, and a crack is present at a film thickness of 20 µm, the crack-resistant film thickness was determined to be "≥15 µm". In addition, the crack resistance film thickness when there is no crack even at 20 µm was determined to be "≥20 µm" and the crack resistance film thickness when there was crack at 5 µm was determined to be "<5 µm", respectively, and the crack resistance was determined.

<OD value>

As a model of the barrier ribs of the substrate with barrier ribs obtained by each of the Examples and Comparative Examples, a solid film was formed on the glass substrate in the same manner as in the evaluation of reflectance. For the glass substrate having the obtained solid film, the intensity of incident light and transmitted light was measured using an optical densitometer (361T (visual); manufactured by X-rite), and the OD value was calculated by the above-described equation (1). In addition, about the OD value, the solid film before a heating process and the OD value after a heating process were respectively measured, and the difference was included in Tables 6-7.

In addition, in Example 37, as a model of the light-shielding partition wall (A-2), a solid film was similarly formed on a glass substrate. For the glass substrate having the obtained solid film, the intensities of incident light and transmitted light were measured using an optical densitometer (361T (visual); manufactured by X-rite), and were calculated by the above-described formula (1).

<Taper angle>

In each of the Examples and Comparative Examples, an arbitrary cross section of the substrate with partition walls before pixel formation was observed at an acceleration voltage of 3.0 kV using an optical microscope (FE-SEM (S-4800); manufactured by Hitachi Seisakusho Co., Ltd.). , The taper angle was measured.

<Surface contact angle>

As a model of a partition wall in a substrate with partition walls obtained by each of the Examples and Comparative Examples, a solid film was produced on a glass substrate in the same manner as in the evaluation of reflectance. For the surface of the obtained solid film, using Kyowa Gaimen Chemical Co., Ltd. DM-700, micro syringe: Kyowa Gaimen Chemical Co., Ltd. Teflon for contact angle meter (registered trademark) coat needle 22G, 25 In the air at °C, the surface contact angle was measured in accordance with the wettability test method on the surface of the substrate glass specified in JIS R3257 (Establishment Date = 1999/04/20). However, using propylene glycol monomethyl ether acetate instead of water, the contact angle between the surface of the solid film and propylene glycol monomethyl ether acetate was measured.

<Inkjet applicability>

In the substrate with partition walls obtained by each of the Examples and Comparative Examples before forming a pixel, PGMEA is used as ink for a pixel portion surrounded by a grid-like partition wall, and an inkjet coating device (InkjetLabo, manufactured by Cluster Technology Co., Ltd.) Inkjet coating was performed using. 160 pL of PGMEA was applied per one grid pattern to observe the presence or absence of a lump (a phenomenon in which ink crosses the barrier and enters the adjacent pixel portion), and the inkjet coatability was evaluated according to the following criteria. The smaller the number of lumps, the higher the liquid-repellent performance and the better the inkjet coating properties.

A: Ink did not overflow within the pixel.

B: In a part, ink overflowed from the inside of the pixel to the upper surface of the partition wall.

C: In the entire surface, ink overflowed from the inside of the pixel to the upper surface of the partition wall.

<Thickness>

For the substrates with partition walls obtained by each of the Examples and Comparative Examples, the height of the structure before and after formation of the pixel B is measured using a surfcom stylus type film thickness measuring device, and the difference is calculated to calculate the pixel (B). The thickness of was measured. In Examples 29 to 31, the thickness of the low refractive index layer (C) was additionally, in Examples 32 to 36, the thickness of the color filter was further determined, and in Example 37, the thickness (height) of the light-shielding partition wall. Were measured in the same manner, respectively.

In addition, for Examples 30 to 31 and 33 to 34, by exposing a cross section perpendicular to the base substrate using a polishing apparatus such as a cross section polisher, and magnifying the cross section with a scanning electron microscope or a transmission electron microscope. , The thickness of each of the inorganic protective layers I to IV was measured.

<luminance>

A substrate with partition walls obtained in each of the Examples and Comparative Examples was provided so that the pixel portion was on the light source side using an area light emitting device equipped with a commercially available LED backlight (peak wavelength of 465 nm) as a light source. The LED element was turned on by passing a current of 30 mA through this area light emitting device, and the luminance (unit: cd/m2) based on the CIE1931 standard was measured using a spectroscopic radiation luminance meter (CS-1000, manufactured by Konica Minolta). It was taken as luminance. However, the evaluation of the luminance was performed by a relative value using the initial luminance of Example 45 as the standard 100.

Further, after the LED element was turned on at room temperature (23°C) for 48 hours, the luminance was similarly measured, and the change in luminance over time was evaluated. However, the evaluation of the luminance was performed by a relative value using the initial luminance of Example 45 as the standard 100.

<Color characteristics>

On a commercially available white reflecting plate, the substrates with partition walls obtained by each of the Examples and Comparative Examples were installed so that the pixels were disposed on the white reflecting plate side. Using a spectrophotometer (CM-2600d, manufactured by Konica Minolta, measuring diameter φ 8 mm), light was irradiated from the base substrate side of the substrate with a partition wall, and the spectrum into which the regular reflected light entered was measured.

The color gamut defined by BT.2020, a color standard that can almost reproduce natural colors, defines red, green, and blue as the three primary colors on the spectral trajectory shown in the chromaticity diagram, and the wavelengths of red, green, and blue are 630nm, 532nm, and respectively. It corresponds to 467nm. From the reflectance (R) of three wavelengths of 470 nm, 530 nm and 630 nm of the obtained reflection spectrum, the emission color of the pixel was evaluated according to the following criteria.

A: R ₅₃₀ /(R ₆₃₀ +R ₅₃₀ +R ₄₇₀ )≥0.55

B: R ₅₃₀ /(R ₆₃₀ +R ₅₃₀ +R ₄₇₀ )<0.55.

<Display characteristics>

The display characteristics of the display device manufactured by combining the substrate with partition walls obtained by each of the Examples and Comparative Examples and an organic EL element were evaluated based on the following criteria.

A: The green display is a display device with very clear color, clear, and excellent contrast.

B: Although the color is slightly unnatural, it is a display device with no problem.

<Mixed color>

In the substrate with partition walls obtained by each of the Examples and Comparative Examples before forming a pixel, a color conversion light emitting material composition (CL-2) was applied to a part of the pixel portion surrounded by the grid-shaped partition wall by using an inkjet method, It dried at 100° C. for 30 minutes to form a pixel having a thickness of 5.0 μm. Thereafter, the color conversion light-emitting material composition (CL-3) was applied to a region adjacent to the area to which the color conversion light-emitting material composition (CL-2) was applied among the pixel portions surrounded by the grid-like partition walls by using an inkjet method, and 100 It dried at °C for 30 minutes to form a pixel having a thickness of 5.0 µm.

On the other hand, a blue organic EL cell having the same width as the pixel portion surrounded by the grid-like barrier ribs was fabricated, and the above-described substrate with barrier ribs and the blue organic EL cell were opposed to each other and bonded with a sealing agent to display the configuration shown in FIG. Got the device.

Of the blue organic EL cells 11 in Fig. 10, in a state in which only the blue organic EL cells bonded directly under the pixel 3 (CL-2) formed of the color conversion light-emitting material composition (CL-2) are lit, For the portion of the pixel 3 (CL-3) formed of the color conversion light-emitting material composition (CL-3), the absorption intensity A at a wavelength of 630 nm using a microscopic spectrophotometer LVmicro-V (manufactured by Lambda Vision Co., Ltd.) (630nm) was measured. The smaller the value of the absorption intensity A (630 nm) is, the more difficult it is to cause color mixing. The color mixture was judged according to the following criteria.

A: A(630nm)<0.01

B: 0.01≤A(630nm)≤0.5

C: 0.5<A (630nm).

The evaluation results of each Example and Comparative Example are shown in Tables 6 to 7.

1: not substrate
2: bulkhead
3: pixel
3 (CL-2): A pixel formed of a color conversion light emitting material composition (CL-2)
3 (CL-3): A pixel formed of a color conversion light emitting material composition (CL-3)
4: low refractive index layer
5: inorganic protective layer I
6: inorganic protective layer II
7: color filter
8: inorganic protective layer III and/or yellow organic protective layer
9: Inorganic protective layer IV and/or yellow organic protective layer
10: shading bulkhead
11: Blue organic EL cell
H: thickness of the bulkhead
L: the width of the bulkhead
θ: taper angle

Claims (21)

A resin composition containing a resin, an organometallic compound containing at least one metal selected from the group consisting of silver, gold, platinum, and palladium, a photoinitiator or a quinonediazide compound, and a solvent. The resin composition according to claim 1, further comprising a coordinating compound having a phosphorus atom. The resin composition according to claim 1 or 2, wherein the resin is a resin selected from polysiloxane, polyimide, polyimide precursor, polybenzoxazole, polybenzoxazole precursor, and (meth)acrylic polymer. The resin composition according to any one of claims 1 to 3, wherein the resin is polysiloxane. The resin composition according to any one of claims 1 to 4, further comprising a white pigment and/or a black pigment. The resin composition according to claim 5, which contains a white pigment, wherein the white pigment is a pigment selected from titanium dioxide, zirconium oxide, zinc oxide, barium sulfate, and complex compounds thereof. The pigment according to claim 5 or 6, which contains a black pigment, wherein the black pigment is selected from titanium nitride, zirconium nitride, carbon black, and a mixed pigment having a weight ratio of 20/80 to 80/20 of a red pigment and a blue pigment. Phosphorus resin composition. The resin composition according to any one of claims 1 to 7, further comprising a photobase generator. A light shielding film obtained by curing the resin composition according to any one of claims 1 to 8. A film forming step of applying the resin composition according to any one of claims 1 to 8 on a base substrate and drying to obtain a dried film, an exposure step of exposing the obtained dried film to a pattern, and soluble in a developer in a dried film after exposure. It is a manufacturing method of a light-shielding film having a developing step of dissolving and removing a phosphorus portion and a heating step of curing by heating a dried film after development, wherein in the heating step, the dried film after development is heated to a temperature of 120° C. or more and 250° C. or less. A method of manufacturing a light-shielding film in which an OD value per 10 μm in thickness is increased by 0.3 or more. A substrate with partition walls having partition walls (A-1) patterned on the base substrate, and having a reflectance of 20% to 60% per 10 μm in thickness at a wavelength of 550 nm and an OD value of 1.0 to 3.0 per 10 μm in thickness. . The method according to claim 11, wherein the (A-1) patterned partition wall is at least one selected from the group consisting of resin, white pigment, palladium oxide, platinum oxide, gold oxide, silver oxide, palladium, platinum, gold, and silver. A substrate with partition walls containing particles of a type of metal oxide or metal. The liquid-repellent compound according to claim 11 or 12, wherein the (A-1) patterned partition further contains a liquid-repellent compound, and (A-1) the content of the liquid-repellent compound in the patterned partition is 0.01% to 10% by weight. Substrate with partition walls. The substrate with partition walls according to any one of claims 11 to 13, wherein the (A-1) patterned partition wall has a surface contact angle of 10° to 70° with respect to propylene glycol monomethyl ether acetate. The substrate with partition walls according to any one of claims 11 to 14, wherein the (A-1) patterned partition wall has a taper angle of 45° to 110°. The patterned shading according to any one of claims 11 to 15, wherein an OD value per 1.0 µm in thickness (A-2) is additionally 0.5 or more between the base substrate and the patterned partition wall (A-1). A substrate with a partition wall having a partition wall. The substrate with partition walls according to any one of claims 11 to 16, further comprising a pixel containing (B) a color conversion light emitting material arranged to be spaced apart by the (A-1) patterned partition walls. The substrate with partition walls according to claim 17, wherein the color conversion light emitting material contains a phosphor selected from quantum dots and pyromethene derivatives. The substrate with partition walls according to claim 17 or 18, further comprising a color filter having a thickness of 1 to 5 µm between the base substrate and (B) a pixel containing a color conversion light-emitting material. The inorganic protective layer according to claim 19, further comprising an inorganic protective layer having a thickness of 50 to 1,000 nm on the base substrate or between the color filter having a thickness of 1 to 5 µm and a pixel layer containing a color conversion light emitting material. / Or a substrate having a partition wall having a yellow organic protective layer. A display device comprising the substrate with barrier ribs according to any one of claims 11 to 20, and a light emitting light source selected from a liquid crystal cell, an organic EL cell, a mini LED cell, and a micro LED cell.

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