KR20220002240A - adhesive tape - Google Patents

Abstract

An object of the present invention is to provide an adhesive tape that does not peel from an adherend even when used in a process involving high temperatures and loads, can be easily peeled off during peeling, and can also suppress deformation of solder bumps. do it with Another object of the present invention is to provide a method for manufacturing a semiconductor device using the adhesive tape. This invention is an adhesive tape in which the adhesive layer A, a base film, and the adhesive layer B were laminated|stacked in this order, The said adhesive layer A is affixed to a silicon wafer chip, The said adhesive layer B is affixed to a glass plate, The said adhesive tape The die shear strength with respect to the silicon wafer chip after irradiating 3000 mJ/cm<2> ultraviolet-ray to the said adhesive layer A from the side on the side of the adhesive layer B, and heat-processing at 240 degreeC for 10 minutes is 3 N/9 mm<2> Above, the pressure-sensitive adhesive layer A is adhered to the silicon wafer, the pressure-sensitive adhesive layer A is irradiated with ultraviolet rays of 3000 mJ/cm 2 from the surface on the side of the pressure-sensitive adhesive layer B, and the silicon wafer after heat treatment at 200 ° C. for 1 hour. 180° Peel strength is 0.10 N/inch or more and 0.30 N/inch or less, the pressure-sensitive adhesive layer B is affixed to a glass plate, and the pressure-sensitive adhesive layer measured by SAICAS measurement after irradiating the pressure-sensitive adhesive layer A with an ultraviolet light of 3000 mJ/cm 2 It is an adhesive tape whose horizontal load intensity|strength in the part of 10 micrometers from the surface layer part of A is 0.06 N/mm or more.

Description

adhesive tape

The present invention relates to an adhesive tape.

DESCRIPTION OF RELATED ART In the manufacturing process of a semiconductor chip, in order to make handling at the time of processing a wafer or a semiconductor chip easy, and to prevent breakage, adhesive tape is used. For example, when a thick-film wafer cut out from a high-purity silicon single crystal or the like is ground to a predetermined thickness to obtain a thin-film wafer, grinding is performed after bonding an adhesive tape to the thick-film wafer.

The adhesive composition used for such an adhesive tape has high adhesiveness enough to firmly fix an adherend such as a wafer or semiconductor chip during the processing process, and does not damage an adherend such as a wafer or semiconductor chip after the process is completed. It is required to be able to peel without it (hereinafter also referred to as "high adhesion and easy peeling").

As an adhesive composition realizing high adhesion and easy peeling, Patent Document 1 discloses an adhesive tape using a photocurable pressure-sensitive adhesive that is cured by irradiating light such as ultraviolet rays to decrease adhesive strength. By using a photocurable adhesive as an adhesive, while being able to fix a to-be-adhered body reliably during a processing process, it can peel easily by irradiating an ultraviolet-ray etc.

Japanese Patent Laid-Open No. 5-32946

In recent years, due to thinning and miniaturization of semiconductor products, semiconductor devices in which a plurality of semiconductor chips are stacked on a wafer have come to be manufactured, and the semiconductor chips are stacked by thermocompression bonding. Here, a schematic diagram expressing the appearance of thermocompression bonding is shown in FIG. 1 . As shown in FIG. 1 , in thermocompression bonding, a semiconductor chip 3 is laminated on a wafer 2 fixed to a glass plate or the like via an adhesive tape 1 . The semiconductor chip 3 is connected to the semiconductor chip of the lower layer by applying heat and load, and the semiconductor chip is laminated|stacked by repeating this process.

In such thermocompression bonding, compression is often attempted at a high temperature of about 260° C. and a high pressure for bonding between chips or between chips and wafers, and at that time, the adhesive tape is strongly compressed in the thickness direction. In the case of using a conventional adhesive tape, when heat and load are applied, in the outer edge of the semiconductor chip lamination point, a stress in the shear direction is applied to the interface between the adhesive tape 1 and the wafer 2, and peeling at the interface occurs When a part of an adhesive tape peels, since an adhesive tape will become non-flat, a semiconductor chip will not be laminated|stacked normally, or it will become impossible to laminate|stack. Therefore, in thermocompression bonding, in addition to the conventional high adhesion and easy peeling function, an adhesive tape having a heat resistance of about 260°C and a performance not to be peeled off by heat and pressure is required.

Moreover, as another subject at the time of lamination|stacking, the deformation|transformation by the pressure at the time of thermocompression bonding of the solder bump 4 formed in the surface of the adhesive tape 1 side of the wafer 2 is mentioned. When a conventional adhesive tape is used, since the adhesion between the wafer 2 and the adhesive tape 1 is weak, the wafer 2 moves during crimping, and at that time, the solder bumps 4 embedded in the adhesive layer are deformed. There are cases. When the solder bump 4 deform|transforms, in the process after peeling of an adhesive tape, a bonding defect will generate|occur|produce, or it will become a defect by an external appearance defect. Therefore, suppression of bump deformation at the time of thermocompression bonding is also requested|required simultaneously with the adhesive tape used at the time of temporary fixing.

An object of the present invention is to provide an adhesive tape that does not peel from an adherend even when used in a process involving high temperatures and loads, can be easily peeled off during peeling, and can also suppress deformation of solder bumps. do it with Another object of the present invention is to provide a method for manufacturing a semiconductor device using the adhesive tape.

This invention is an adhesive tape in which the adhesive layer A, the base film, and the adhesive layer B were laminated|stacked in this order, The said adhesive layer A is affixed to a silicon wafer chip, The said adhesive layer B is affixed to a glass plate, The adhesive The die shear strength to the silicon wafer chip after irradiating 3000 mJ/cm<2> of ultraviolet-ray to the said adhesive layer A from the side of the said adhesive layer B side of a tape, and heat-processing at 240 degreeC for 10 minutes is 3 N/9 mm<2> Above, the pressure-sensitive adhesive layer A is adhered to the silicon wafer, the pressure-sensitive adhesive layer A is irradiated with ultraviolet rays of 3000 mJ/cm 2 from the surface on the side of the pressure-sensitive adhesive layer B, and the silicon wafer after heat treatment at 200 ° C. for 1 hour. 180° Peel strength is 0.1 N/inch or more and 0.3 N/inch or less, the pressure-sensitive adhesive layer B is attached to a glass plate, and the pressure-sensitive adhesive layer measured by SAICAS measurement after irradiating the pressure-sensitive adhesive layer A with ultraviolet rays of 3000 mJ/cm 2 It is an adhesive tape whose horizontal load intensity|strength in the part of 10 micrometers from the surface layer part of A is 0.06 N/mm or more.

Hereinafter, the present invention will be described in detail.

The adhesive tape of this invention is the adhesive tape on which the adhesive layer A, the base film, and the adhesive layer B were laminated|stacked in this order.

The adhesive tape of this invention affixes the said adhesive layer A to a silicon wafer chip, affixes the said adhesive layer B to a glass plate, and 3000 mJ/cm<2> to the said adhesive layer A from the side of the said adhesive layer B side of an adhesive tape. The die shear strength with respect to the silicon wafer chip after irradiating an ultraviolet-ray and heat-processing at 240 degreeC for 10 minutes was 3 N/9 mm<2> More than that.

At least one side of the pressure-sensitive adhesive layer of the pressure-sensitive adhesive tape satisfies the die shear strength in the above range, the 180° peel strength described later, and the horizontal load strength by SAICAS measurement, so that the pressure-sensitive adhesive tape is peeled off even by a treatment involving high temperature and load It is difficult, and also it is possible to suppress the glue retention on the adherend and the deformation of the bump.

Die shear strength is one of the methods of measuring the bonding strength of semiconductor chips. When a force is applied in the lateral direction to a semiconductor chip bonded on a wafer or substrate with a bonding material, the bonding surface between the semiconductor chip and the wafer or substrate is destroyed. The force can be measured when

In the present invention, it is used as an index for measuring the adhesiveness in the shear direction between the adhesive tape and the silicon wafer chip, specifically, by applying a force from the lateral direction to the silicon wafer chip bonded on the adhesive tape, the silicon wafer chip is peeled off Measure the strength when When the die shear strength is high, the adhesion to the stress in the shear direction is high, and it becomes difficult to peel even under the load in the shear direction applied to the interface between the adhesive tape and the wafer at the outer edge of the chip crimping point during compression. Therefore, when heat and load are applied, peeling between the wafer and the adhesive tape is less likely to occur. From the viewpoint of improving the adhesiveness between the adhesive tape and the silicon wafer in the shear direction, the die shear strength is 4 N/9 mm 2 It is preferable that it is more than 4.5 N/9 mm2 It is more preferable that it is more than 5.5 N/9 mm<2> It is more preferable that it is more than that. Although the upper limit of the said die shear strength is not specifically limited, From a viewpoint of making peeling more easily after use 10 N/9 mm<2> It is preferable that it is below. The die shear strength may be adjusted according to the type of the pressure-sensitive adhesive and the content of the silicone or fluorine compound.

In addition, the said die shear strength can be measured more specifically by the following method.

The release film on the side of the adhesive layer B of the adhesive tape cut into 3 cm x 4 cm both sides were protected with the release film is peeled, and the adhesive layer B and the slide glass (S9112, Matsunami Glass Industry Co., Ltd. make) are bonded together. The release film on the side of the adhesive layer A of the laminated body of this adhesive tape and glass is peeled, 3 mm x 3 mm, thickness 3mm, and the single crystal silicon wafer chip of surface roughness <0.1 micrometer are put on the adhesive layer A of an adhesive tape , bonding at a stage temperature of 20 °C, a head temperature of 20 °C, and a bonding pressure of 3 N. Next, using a high-pressure mercury UV irradiator, 405 nm ultraviolet rays are irradiated from the pressure-sensitive adhesive layer B side of the adhesive tape toward the pressure-sensitive adhesive layer A, and the amount of irradiation on the surface on the opposite side to the base material of the pressure-sensitive adhesive layer A is 3000 mJ/cm 2 Investigate to become Then, it heat-processes at 240 degreeC for 10 minutes. After the heat treatment, the silicon wafer chip was allowed to cool below room temperature, and using a bond tester (4000PXY, manufactured by Nordson Advanced Technology, universal type) at 25°C and 50% RH, the chip was applied to the entire side surface of the silicon wafer chip. The maximum load when the silicon wafer chip is moved by applying a force perpendicular to the side surface is measured, and this is referred to as die shear strength.

The adhesive tape of this invention affixes the said adhesive layer A to a silicon wafer, irradiates 3000 mJ/cm<2> ultraviolet-ray to the said adhesive layer A from the surface on the said adhesive layer B side, After heat-processing at 200 degreeC for 1 hour 180° peel strength to silicon wafer is 0.1 N/inch or more and 0.3 N/inch or less.

When an adhesive tape is 180 degree peeling strength of the said range, while being able to protect a to-be-adhered body with sufficient adhesive force, peeling after use can be made easy. Moreover, since sufficient adhesiveness between a semiconductor chip and an adhesive tape is obtained, deformation|transformation of a bump can be suppressed. From the viewpoint of increasing the adhesive force with the adherend and making the adhesive tape more difficult to peel, the 180° peel strength is preferably 0.11 N/inch or more, more preferably 0.13 N/inch or more, and furthermore, 0.15 N/inch or more. desirable. In addition, from the viewpoint of further facilitating peeling after use and suppressing glue residue, the 180° peel strength is more preferably 0.25 N/inch or less, and still more preferably 0.2 N/inch or less. The 180° peeling strength can be controlled by the type of the pressure-sensitive adhesive layer, the filler to be added, the inorganic filler, the particulate component or the content of the additive having a releasable component such as a urethane compound, silicone or fluorine compound.

In addition, the said 180 degree peeling strength can be measured by the following method more specifically.

The release film on the side of the pressure-sensitive adhesive layer A of the pressure-sensitive adhesive tape was peeled off, and a single crystal silicon wafer of 8 inches, thickness 0.75 mm, and surface roughness <0.1 μm was placed on the pressure-sensitive adhesive layer A of the pressure-sensitive adhesive tape, and the silicon wafer top was lifted with a 2 kg rubber roller. It bonds by reciprocating. After leaving still at room temperature for 20 minutes after bonding, the release film on the side of the adhesive layer B is peeled, then, using a high-pressure mercury-vapor UV irradiator, a 405 nm ultraviolet-ray from the adhesive layer B side of an adhesive tape adhesive layer A It irradiates toward and irradiates so that the irradiation amount in the surface on the opposite side to the base material of the adhesive layer A may be set to 3000 mJ/cm<2>. Thereafter, heat treatment is performed at 200°C for 1 hour. About the adhesive tape after heat processing, according to JISZ0237, the 180 degree direction tensile test is performed at the peeling rate of 300 mm/min, and the 180 degree peeling strength with respect to a silicon wafer is measured.

In the adhesive tape of the present invention, the pressure-sensitive adhesive layer B is adhered to a glass plate, and the pressure-sensitive adhesive layer A is irradiated with ultraviolet rays of 3000 mJ/cm 2 , and then measured by SAICAS measurement. has a horizontal load strength of 0.06 N/mm or more.

The SAICAS method, called the Surface And Interfacial Cutting Analysis System method, is an evaluation method that cuts the material from the surface layer at a low speed with a sharp cutting edge. By using the SAICAS method, it is possible to measure the horizontal and vertical forces applied to the cutting edge when cutting the surface of the pressure-sensitive adhesive layer.

When the horizontal load intensity|strength of the adhesive layer A is the said range, since the intensity|strength of an adhesive layer becomes high and the glue at the time of peeling from a to-be-adhered body is cut and it becomes hard to fall, the glue residual to a to-be-adhered body can be suppressed. From the viewpoint of increasing the strength of the pressure-sensitive adhesive layer and suppressing glue retention, the horizontal load strength is preferably 0.07 N/mm or more, more preferably 0.075 N/mm or more, and still more preferably 0.08 N/mm or more. Although the upper limit of the said horizontal load strength is not specifically limited, From a viewpoint of suppressing that an adhesive layer becomes brittle, it is preferable that it is 0.2 N/mm or less. The said horizontal load intensity|strength can be adjusted by the content of the additive which has the kind of adhesive, a filler to be added, an inorganic filler, a microparticles|fine-particles component or a urethane compound, and a releasability component.

In addition, the said horizontal load intensity|strength can be specifically measured by the following method.

The release film on the side of the pressure-sensitive adhesive layer B of the pressure-sensitive adhesive tape cut to 3 cm × 4 cm and protected with a release film on both sides was peeled, and the pressure-sensitive adhesive layer B and slide glass (S9112, manufactured by Matsunami Glass Industry Co., Ltd.) were bonded together to obtain a measurement sample. get Bonding is performed by making one reciprocating 2 kg roller on the surface by the side of the adhesive layer A of an adhesive tape. Next, the release film on the side of the pressure-sensitive adhesive layer A of the obtained sample was peeled off, and ultraviolet light of 405 nm from the side of the pressure-sensitive adhesive layer A using a high-pressure mercury UV irradiator was applied to the surface on the opposite side to the substrate of the pressure-sensitive adhesive layer A. It is irradiated so that it becomes 3000 mJ/cm2. Thereafter, using a surface/interface physical property analyzer (SAICAS DN-20, manufactured by Daipla Wintes), the horizontal force and vertical force of the pressure-sensitive adhesive layer A of the adhesive tape under the conditions of 25°C 50% RH and ultraviolet light cut measure For the cutting edge, a single-crystal diamond blade with a width of 1 mm, a rake angle of 40°, and a clearance angle of 10° is used. The point at which the horizontal load became 0.002 N or more was taken as the point where the cutting edge came into contact with the surface of the pressure-sensitive adhesive layer A, and the horizontal load strength was measured in the vertical direction from there at a depth of 10 µm.

The pressure-sensitive adhesive component constituting the pressure-sensitive adhesive layer A is not particularly limited as long as it satisfies the ranges of the die shear strength, 180° peel strength, and horizontal load strength. It is preferable that it is an adhesive component which has a bond. It is more preferable that the adhesive component which comprises the said adhesive layer A contains the polymerizable polymer of the (meth)acrylic-acid alkylester type which has a radically polymerizable unsaturated bond in a molecule|numerator.

The polymerizable polymer is, for example, a (meth)acrylic polymer having a functional group in the molecule (hereinafter referred to as a functional group-containing (meth)acrylic polymer) in advance, and a functional group reacting with the functional group in the molecule and radical polymerizable It can obtain by reacting the compound (henceforth a functional group containing unsaturated compound) which has an unsaturated bond.

The functional group-containing (meth)acrylic polymer is an acrylic acid alkyl ester and/or methacrylic acid alkyl ester having an alkyl group usually having 2 to 18 carbon atoms, a functional group-containing monomer, and further, if necessary, other copolymerizable with them It is obtained by copolymerizing the monomer for modification by a conventional method. The weight average molecular weight of the said functional group containing (meth)acrylic-type polymer is about 200,000-2 million normally.

In the present specification, the weight average molecular weight can be usually determined by the GPC method, for example, THF as an eluent at a column temperature of 40°C, and HSPgel HR MB-M 6.0×150 mm manufactured by Waters as a column. Thus, it can be determined by polystyrene standards.

As said functional group containing monomer, a carboxyl group containing monomer, a hydroxyl group containing monomer, an epoxy group containing monomer, an isocyanate group containing monomer, an amino group containing monomer, etc. are mentioned, for example. As said carboxyl group-containing monomer, acrylic acid, methacrylic acid, etc. are mentioned. Examples of the hydroxyl group-containing monomer include hydroxyethyl acrylate and hydroxyethyl methacrylate. As said epoxy group containing monomer, glycidyl acrylate, glycidyl methacrylate, etc. are mentioned. As said isocyanate group containing monomer, acrylic acid isocyanate ethyl, methacrylic acid isocyanate ethyl, etc. are mentioned. Examples of the amino group-containing monomer include aminoethyl acrylate and aminoethyl methacrylate.

As another monomer for modification which can be copolymerized, various monomers used for general (meth)acrylic polymers, such as vinyl acetate, acrylonitrile, and styrene, are mentioned, for example.

As the functional group-containing unsaturated compound to be reacted with the functional group-containing (meth)acrylic polymer, the same functional group-containing monomer as described above can be used depending on the functional group of the functional group-containing (meth)acrylic polymer. For example, when the functional group of the functional group-containing (meth)acrylic polymer is a carboxyl group, an epoxy group-containing monomer or an isocyanate group-containing monomer is used. When the functional group is a hydroxyl group, an isocyanate group-containing monomer is used. When the functional group is an epoxy group, an amide group-containing monomer such as a carboxyl group-containing monomer or acrylamide is used. When the functional group is an amino group, an epoxy group-containing monomer is used.

When the adhesive component which comprises the said adhesive layer A makes a hydroxyl value and an acid value X mgKOH/mg and Y mgKOH/mg, respectively, it is preferable that it is X+Y≥10.

When the hydroxyl value and the acid value of the pressure-sensitive adhesive component satisfy the above relational expression, the cohesive force of the pressure-sensitive adhesive component is increased, and the pressure-sensitive adhesive layer A is more difficult to break. In addition, by satisfying the above relational expression, it is possible to easily satisfy the horizontal load and die shear strength. From a viewpoint of making it more difficult to peel an adhesive tape, and a viewpoint of the control of the said horizontal load and die shear strength, it is more preferable that said X + Y is 30 or more, and it is still more preferable that it is 50 or more. Although the upper limit of said X + Y is not specifically limited, It is preferable that it is 70 or less, and it is more preferable that it is 65 or less from a viewpoint of suppressing the glue residue by adhesion improvement which arises when the polarity of an adhesive layer becomes high. In addition, the hydroxyl value and the acid value can be adjusted by, for example, the amount of the functional group-containing monomer.

As for the adhesive component which comprises the said adhesive layer A, it is preferable that the quantity of a radically polymerizable unsaturated bond is 0.2 meq/g or more and 2 meq/g or less.

When the quantity of the radically polymerizable unsaturated bond of an adhesive component is the said range, it can make it easy to satisfy|fill the ranges of the said die shear strength, 180 degree peeling strength, and horizontal load strength. From the viewpoint of more easily satisfying the ranges of die shear strength, 180° peel strength and horizontal load strength, the amount of the radically polymerizable unsaturated bond is more preferably 0.3 meq/g or more, and still more preferably 0.5 meq/g or more, , preferably 1.5 meq/g or less, and more preferably 1 meq/g or less. The amount of the radical polymerizable unsaturated bond can be adjusted, for example, according to the amount of the functional group-containing unsaturated compound.

The hydroxyl value of the said adhesive component can measure an acid value by performing the titration test of the solution of an adhesive component according to JISK0070. About the amount of unsaturated bonds, it is computable in the form of meq/g by dividing the atomic weight of 126.9 of iodine from the value of the iodine value computed by JISK0070.

It is preferable that the said adhesive layer A contains a polymerization initiator.

By curing the pressure-sensitive adhesive layer A by using the polymerizable polymer and the polymerization initiator for the pressure-sensitive adhesive layer A, it is possible to easily satisfy the ranges of the die shear strength, the 180° peel strength and the horizontal load strength. As said polymerization initiator, a photoinitiator, a thermal polymerization initiator, etc. are mentioned. Especially, a photoinitiator is preferable at the point which hardening can be performed easily and the damage to a to-be-adhered body is also small.

What is activated by irradiating the said photoinitiator with the ultraviolet-ray of a wavelength of 200-410 nm is mentioned, for example. As such a photoinitiator, for example, an acetophenone derivative compound, a benzoin ether compound, a ketal derivative compound, a phosphine oxide derivative compound, a bis(η5-cyclopentadienyl) titanocene derivative compound, benzophenone, healer ketone, chlorothioxanthone, todecylthioxanthone, dimethylthioxanthone, diethylthioxanthone, α-hydroxycyclohexylphenylketone, 2-hydroxymethylphenylpropane, and the like. Methoxyacetophenone etc. are mentioned as said acetophenone derivative compound. As said benzoin ether type compound, benzoin propyl ether, benzoin isobutyl ether, etc. are mentioned. As said ketal derivative compound, benzyl dimethyl ketal, acetophenone diethyl ketal, etc. are mentioned. These photoinitiators may be used independently and 2 or more types may be used together.

Examples of the thermal polymerization initiator include those that decompose by heat to generate active radicals that initiate polymerization and curing. Specifically, for example, dicumyl peroxide, di-t-butyl peroxide, t-butyl peroxybenzoate, t-butyl hydroperoxide, benzoyl peroxide, cumene hydroperoxide, diisopropylbenzene hydroperoxide oxide, paramentane hydroperoxide, di-t-butyl peroxide, and the like.

Although it does not specifically limit as what is marketed among these thermal-polymerization initiators, For example, Perbutyl D, Perbutyl H, Perbutyl P, Perpenta H (all above are manufactured by Nichiyo Corporation), etc. are preferable. These thermal-polymerization initiators may be used independently and 2 or more types may be used together.

The said adhesive layer A may contain the radically polymerizable polyfunctional oligomer or monomer.

When the said adhesive layer A contains a radically polymerizable polyfunctional oligomer or a monomer, ultraviolet curability improves. The polyfunctional oligomer or monomer preferably has a weight average molecular weight of 10,000 or less, and more preferably has a weight average molecular weight of 5000 or less so that the three-dimensional network of the pressure-sensitive adhesive layer by irradiation with ultraviolet rays is efficiently achieved. The number of radically polymerizable unsaturated bonds is 2-20.

The polyfunctional oligomer or monomer is, for example, trimethylolpropane triacrylate, tetramethylolmethane tetraacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol monohydroxypentaacrylate , dipentaerythritol hexaacrylate or the same methacrylates mentioned above. In addition, 1, 4- butylene glycol diacrylate, 1, 6- hexanediol diacrylate, polyethylene glycol diacrylate, commercially available oligoester acrylate, methacrylates similar to the above, etc. are mentioned. These polyfunctional oligomers or monomers may be used independently and 2 or more types may be used together.

It is preferable that the said adhesive layer A contains a crosslinking agent.

When the said adhesive layer A contains a crosslinking agent, the cohesive force of the said adhesive component can be improved. As said crosslinking agent, an isocyanate type crosslinking agent, an epoxy type crosslinking agent, etc. are mentioned, for example. Especially, an isocyanate type crosslinking agent is preferable at the point which can improve peeling performance more.

Although content of the said crosslinking agent is not specifically limited, A preferable lower limit is 0.01 weight part with respect to 100 weight part of adhesive components, a more preferable lower limit is 0.1 weight part, a preferable upper limit is 10 weight part, and a more preferable upper limit is 5 weight part. When content of the said crosslinking agent is the said range, an adhesive component can be crosslinked moderately, and the cohesive force of an adhesive component can be raised more, maintaining high adhesive force.

The pressure-sensitive adhesive layer A preferably contains a releasable component, and more preferably contains a silicone or a fluorine compound (hereinafter simply referred to as a silicone or fluorine compound) having a functional group crosslinkable with the pressure-sensitive adhesive component as the releasable component.

When the pressure-sensitive adhesive layer A contains silicone or a fluorine compound, the silicone or fluorine compound bleeds out at the interface between the pressure-sensitive adhesive layer A and the adherend, so that the adhesive tape can be peeled off easily and without glue residue after the treatment is finished. In addition, since the silicone or fluorine compound has a functional group crosslinkable with the pressure-sensitive adhesive component, the silicone or fluorine compound chemically reacts with the pressure-sensitive adhesive component or is introduced into the pressure-sensitive adhesive component through a crosslinking agent, etc., Contamination due to adhesion is suppressed.

The crosslinkable functional value in the said silicone or fluorine compound is 2-6 valence, for example, Preferably it is 2-4 valence, More preferably, it is bivalence.

The functional group that can be crosslinked with the pressure-sensitive adhesive component is appropriately determined depending on the functional group contained in the pressure-sensitive adhesive component. Select possible functional groups. The functional group crosslinkable with the (meth)acryl group is a functional group having an unsaturated double bond, and specifically, for example, a silicone or fluorine compound containing a vinyl group, a (meth)acryl group, an allyl group, a maleimide group, etc. choose Examples of the functional group that can be crosslinked with the pressure-sensitive adhesive component include a hydroxyl group, a carboxyl group, and an epoxy group in addition to the above-mentioned (meth)acrylic group and a crosslinkable functional group. Among these, when the pressure-sensitive adhesive layer A is of a curable type, a functional group having an unsaturated double bond is preferable from the viewpoint of introducing a silicone or fluorine compound into the pressure-sensitive adhesive component through a chemical reaction with the pressure-sensitive adhesive component at the same time as the curing reaction.

As said silicone or fluorine compound, silicone diacrylate, a fluoroacrylate, etc. are mentioned, for example.

As for content of the said silicone or fluorine compound in the said adhesive layer A, a preferable lower limit is 2 weight%, a more preferable minimum is 5 weight%, a more preferable minimum is 10 weight%, a preferable upper limit is 40 weight%, and a more preferable upper limit is 35 weight%, a more preferable upper limit is 30 weight%.

When content of the said silicone or a fluorine compound is the said range, a to-be-adhered body can be peeled further without a glue residue.

It is preferable that the said adhesive layer A contains the said adhesive component and the urethane compound (henceforth simply referred to as a urethane compound) which has a crosslinkable functional group.

When the said adhesive layer A contains a urethane compound, the softness|flexibility of an adhesive tape can improve and it can make it hard to tear the adhesive tape obtained. In addition, since the urethane compound has a functional group capable of crosslinking with the pressure-sensitive adhesive component, the urethane compound chemically reacts with the pressure-sensitive adhesive component or is introduced into the pressure-sensitive adhesive component through a crosslinking agent, etc., contamination due to adhesion of the urethane compound to the adherend is suppressed As a functional group crosslinkable with the said adhesive component, the thing similar to the silicone or fluorine compound which has the functional group which can crosslink with the said adhesive component is mentioned. As said urethane compound, urethane acrylate is mentioned, for example.

As for content of the said urethane compound in the said adhesive layer A, a preferable upper limit is 20 weight%, a more preferable upper limit is 15 weight%, and a more preferable upper limit is 10 weight%. When content of the said urethane compound is the said range, it can be set as the adhesive tape which is more excellent in heat resistance and adhesive residual suppression performance. Although the lower limit of content of the said urethane compound is not specifically limited, It is preferable that it is 1 weight% from a viewpoint of making an adhesive tape more difficult to tear and suppressing a glue residue.

The said adhesive layer A may contain well-known additives, such as inorganic fillers, such as fumed silica, a plasticizer, resin, surfactant, a wax, and a microparticles|fine-particles filler. The said additive may be used independently and may be used in combination of 2 or more types.

When the pressure-sensitive adhesive layer A contains an inorganic filler (fumed silica, etc.), from the viewpoint of easily adjusting the horizontal load within the above range, the content is preferably 3% by weight or more, based on 100% by weight of the pressure-sensitive adhesive component, more Preferably it is 12 weight% or more, Preferably it is 24 weight% or less, More preferably, it is 18 weight% or less.

As for the said adhesive layer A, it is preferable that the tensile strength in 23 degreeC after 3000 mJ/cm<2> ultraviolet irradiation is 1.0 Mpa or more.

When the tensile strength after ultraviolet irradiation of the said adhesive layer A is the said range, the adhesive tape obtained can be made more difficult to tear, and generation|occurrence|production of a glue residue can be suppressed more. Furthermore, the horizontal load can be controlled within the range. From the viewpoint of making the adhesive tape more brittle and suppressing glue retention, the tensile strength is more preferably 1.2 MPa or more, and still more preferably 1.5 MPa or more. Although the upper limit of the said tensile strength is not specifically limited, It is preferable that it is 6 MPa or less from a viewpoint of adhesive force.

In addition, the said tensile strength can be measured by the method according to JISK7161.

Specifically, for example, using a punching blade "Tensile No. 1 dumbbell shape" manufactured by Kobunshi Keiji Co., Ltd., the pressure-sensitive adhesive layer A is punched in a dumbbell shape so that the long side becomes the same as the flow direction at the time of manufacture. to prepare a test piece. The obtained test piece is measured at a tensile rate of 100 mm/min using "Autograph AGS-X" by Shimadzu Corporation, etc., for example, and the test piece is fractured. Tensile strength is calculated from the strength at the breaking point.

It is preferable that the said adhesive layer A has a tensile elasticity modulus in 260 degreeC after 3000 mJ/cm<2> ultraviolet irradiation of 1.0x10<^6> Pa or more.

When the tensile modulus of elasticity after ultraviolet irradiation of the pressure-sensitive adhesive layer A is within the above range, the resistance to the load of the obtained pressure-sensitive adhesive tape increases, and it is possible to make the adherend more difficult to damage, and furthermore, the horizontal load and die shear strength are within the above range. Easier to control inside From the viewpoint of making the adherend more difficult to damage, the tensile modulus ^{is more preferably 5×10 6} Pa or more, and ^{still more preferably 1×10 7} Pa or more. Although the upper limit of the said tensile elasticity modulus is not specifically limited, From a viewpoint of adhesive force, it is preferable that it is 30x10 ^{6 Pa or less.}

In addition, the said tensile elasticity modulus can be measured with the following method.

About the single-layer sample of the adhesive layer A, a 5 mm x 35 mm test piece is produced by punching using a punching blade so that a long side may become the same as the flow direction at the time of manufacture. The obtained test piece is immersed in liquid nitrogen and cooled to -50°C, and thereafter, using a viscoelastic spectrometer (eg, DVA-200, manufactured by Haiti Metrology Control, etc.), a constant-rate temperature-rising tension mode, a temperature increase rate of 10°C It heats up to 300 degreeC on the conditions of /min and a frequency of 10 Hz, and measures a storage elastic modulus. From the result of the obtained storage elastic modulus, let the storage elastic modulus in 260 degreeC be the said tensile elastic modulus.

Although the thickness of the said adhesive layer A is not specifically limited, It is preferable that a minimum is 1 micrometer and an upper limit is 200 micrometers. If the thickness of the said adhesive layer A is the said range, a to-be-adhered body can be protected by sufficient adhesive force, and also the glue residue at the time of peeling can also be suppressed. A more preferable minimum of the thickness of the said adhesive layer A is 10 micrometers, and a more preferable upper limit is 100 micrometers.

The said adhesive layer B will not specifically limit, as long as the said adhesive layer A can satisfy|fill the range of the said die shear strength and 180 degree peeling strength, It may be the same as or different from the said adhesive layer A. In addition, a hardening type may be sufficient as the said adhesive layer B, and a non-hardening type may be sufficient as it. As the adhesive constituting the pressure-sensitive adhesive layer B, for example, a rubber-based pressure-sensitive adhesive, an acrylic pressure-sensitive adhesive, a vinyl alkyl ether-based pressure-sensitive adhesive, a silicone pressure-sensitive adhesive, a polyester-based pressure-sensitive adhesive, a polyamide-based pressure-sensitive adhesive, a urethane pressure-sensitive adhesive, a styrene-diene block copolymer-based pressure-sensitive adhesive, etc. can be heard In addition, the structure of the said adhesive component is not specifically limited, A random copolymer may be sufficient and a block copolymer may be sufficient.

The pressure-sensitive adhesive layer B preferably has an ultraviolet transmittance of 1% or more at 405 nm from the viewpoint that the pressure-sensitive adhesive layer A easily satisfies the ranges of the die shear strength and 180° peel strength. The ultraviolet transmittance is more preferably 10% or more, still more preferably 15% or more, and particularly preferably 50% or more. If the said ultraviolet transmittance is more than these lower limit, even if it does not use a photosensitizer, when the said adhesive layer A is an ultraviolet curable type, the said adhesive layer A can fully be hardened. The upper limit of the said ultraviolet transmittance is not specifically limited, It is good, so that it is high as it is high, and it is 100 % or less normally.

Although the thickness of the said adhesive layer B is not specifically limited, It is preferable that a preferable minimum is 5 micrometers, a more preferable lower limit is 10 micrometers, a preferable upper limit is 100 micrometers, and a more preferable upper limit is 60 micrometers. When the thickness of the pressure-sensitive adhesive layer B is within the above range, it can adhere to a support or the like with sufficient adhesive force, thereby reliably fixing the adherend.

The material constituting the base film is not particularly limited as long as the pressure-sensitive adhesive layer A can satisfy the die shear strength and the 180° peel strength range, and it may be an organic material or an inorganic material, but it is a material having heat resistance desirable. Examples of the heat-resistant organic material include polyethylene terephthalate, polyethylene naphthalate, polyacetal, polyamide, polycarbonate, polyphenylene ether, polybutylene terephthalate, ultra-high molecular weight polyethylene, syndiotactic polystyrene, polyarylate. , polysulfone, polyethersulfone, polyphenylenesulfide, polyetheretherketone, polyimide, polyetherimide, fluororesin, liquid crystal polymer, and the like. Among them, polyethylene naphthalate is preferable from the viewpoint of excellent heat resistance. Further, examples of the heat-resistant inorganic material include thin glass and the like.

In the said base film, since the said adhesive layer A is easy to satisfy|fill the range of the said die shear strength and 180 degree peeling strength, it is preferable that the ultraviolet transmittance of 405 nm is 1 % or more. The ultraviolet transmittance is more preferably 10% or more, still more preferably 15% or more, and particularly preferably 50% or more. If the said ultraviolet transmittance is more than these lower limit, even if it does not use a photosensitizer, when the said adhesive layer A is an ultraviolet curable type, the said adhesive layer A can fully be hardened. The upper limit of the said ultraviolet transmittance is not specifically limited, It is good, so that it is high as it is high, and it is 100 % or less normally.

The shape of the said base film is not specifically limited, For example, the sheet shape which has a sheet shape, a mesh-like structure, the sheet shape with a hole, etc. are mentioned. Further, the substrate may be a substrate subjected to a treatment for improving adhesion with the pressure-sensitive adhesive such as sand blasting or surface corona treatment, or a treatment for imparting conductivity such as sputtering film formation or conductive film deposition.

Although the thickness of the said base film is not specifically limited, A preferable minimum is 5 micrometers, and a preferable upper limit is 100 micrometers. When the thickness of the said base film is in this range, there exists moderate elasticity and it can be set as the adhesive tape excellent in handleability. A more preferable minimum of the thickness of the said base film is 10 micrometers, and a more preferable upper limit is 50 micrometers.

The adhesive tape of this invention may have an anchor layer between the said base film and the said adhesive layer A, or between the said base film and the said adhesive layer B.

If an anchor layer is provided between the base film and the pressure-sensitive adhesive layer, when the pressure-sensitive adhesive layer contains a silicone or fluorine compound, the silicone or fluorine compound bleeds out toward the base film to prevent the pressure-sensitive adhesive layer from peeling off the base film. can

As said anchor layer, an acrylic adhesive, a urethane adhesive, etc. are mentioned, for example. Especially, the point which is excellent in anchor performance to an acrylic adhesive is preferable.

The said anchor layer may contain well-known additives, such as an inorganic filler, a heat stabilizer, antioxidant, an antistatic agent, a plasticizer, resin, surfactant, and a wax, as needed. These additives may be used independently and may be used combining plurality.

Although the thickness of the said anchor layer is not specifically limited, A preferable lower limit is 1 micrometer, and a preferable upper limit is 30 micrometers. If the thickness of the said anchor layer is in this range, the anchor force of the adhesive layer by the side of the said anchor layer, and a base film can be improved more. From a viewpoint of further improving the anchor force of the adhesive layer by the side of the said anchor layer, and a base film, a more preferable minimum of the thickness of the said anchor layer is 3 micrometers, and a more preferable upper limit is 10 micrometers.

In the adhesive tape of this invention, since the said adhesive layer A easily satisfies the range of the said die shear strength and 180 degree peeling strength, it is preferable that the ultraviolet transmittance of 405 nm is 1 % or more. As for the said ultraviolet transmittance, it is more preferable that it is 10 % or more, and it is still more preferable that it is 15 % or more. If the said ultraviolet transmittance is more than these lower limit, even if it does not use a photosensitizer, when the said adhesive layer A is an ultraviolet curable type, the said adhesive layer A can fully be hardened. The upper limit of the said ultraviolet transmittance is not specifically limited, It is good, so that it is high as it is high, and it is 100 % or less normally.

In addition, the ultraviolet transmittance can be measured using the spectrophotometer (U-3900, Hitachi Corporation make, or its equivalent).

The method of manufacturing the adhesive tape of this invention is not specifically limited, A conventionally well-known method can be used. For example, a solution containing a pressure-sensitive adhesive component, silicone or fluorine compound, urethane compound, etc. is coated on the film subjected to the release treatment and dried to form the pressure-sensitive adhesive layer A, and on the film subjected to another release treatment, the pressure-sensitive adhesive in the same manner After forming the layer B, it can manufacture by bonding the adhesive layer A and the adhesive layer B on both surfaces of a base film, respectively.

Although the use of the adhesive tape of this invention is not specifically limited, It is especially preferable as a protective tape in the manufacture of electronic components, such as an electronic board, a semiconductor chip, and panel components for display materials, which have a manufacturing process accompanying high temperature and load. can

The adhesive tape of this invention used in order to manufacture such an electronic component is also one of this invention. In particular, the adhesive tape of this invention can be used suitably for manufacture of electronic components including the thermocompression bonding process etc. which are heated at 280 degreeC for a short time (for example, 90 second or less, typically 1-20 second).

As a manufacturing method of a semiconductor device which can use the adhesive tape of this invention, More specifically, for example, the process of fixing a wafer on a support body via the adhesive tape of this invention, and thermocompression bonding a semiconductor chip on the wafer. The manufacturing method of the semiconductor device which has the process of laminating|stacking by bonding is mentioned. The manufacturing method of such a semiconductor device is also one of this invention.

The process of fixing the said wafer WHEREIN: Although the method of fixing a wafer on a support body via the adhesive tape of this invention is not specifically limited, Bonding the said adhesive layer A and wafers, such as a silicon wafer, the other said adhesive The method of bonding layer B and supports, such as glass, is preferable.

In the step of laminating the semiconductor chips by thermocompression bonding, thermocompression bonding may be repeatedly performed, and thermocompression bonding is heated at 280°C for a short time (for example, 90 seconds or less, typically 1 to 20 seconds). A plurality of semiconductor chips may be stacked by repeating the same process.

In the manufacturing method of the semiconductor device of this invention, you may implement the process of laminating|stacking the said semiconductor chip by thermocompression bonding after implementing another process after the process of fixing the said wafer. As said other process, the process of thinning a wafer by back-grinding, a wafer-level molding process, etc. are mentioned, for example. In the manufacturing method of the semiconductor device of this invention, after the process of laminating|stacking the said semiconductor chip by thermocompression bonding, you may implement the process of peeling an adhesive tape from the said support body, the said wafer, or both.

The said support body is not specifically limited, For example, glass, a polyimide film, a glass epoxy board|substrate, etc. are mentioned.

According to the present invention, it is possible to provide an adhesive tape that does not peel from an adherend even when used in a process involving high temperature and load, can be easily peeled off at the time of peeling, and can also suppress deformation of solder bumps. have. Moreover, according to this invention, the manufacturing method of the semiconductor device using this adhesive tape can be provided.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic diagram which showed the mode of thermocompression bonding.

The embodiments of the present invention will be described in more detail below with reference to Examples, but the present invention is not limited to these Examples.

(Synthesis of adhesive component A)

A reactor equipped with a thermometer, a stirrer, and a cooling tube was prepared. In this reactor, 94 parts by weight of 2-ethylhexyl acrylate as (meth)acrylic acid alkyl ester, 6 parts by weight of hydroxyethyl methacrylate as a functional group-containing monomer, 0.01 parts by weight of lauryl mercaptan, and 80 parts by weight of ethyl acetate were added. After that, the reactor was heated to initiate reflux. Subsequently, 0.01 parts by weight of 1,1-bis(t-hexylperoxy)-3,3,5-trimethylcyclohexane as a polymerization initiator was added into the reactor, and polymerization was started under reflux. Next, 0.01 parts by weight of 1,1-bis(t-hexylperoxy)-3,3,5-trimethylcyclohexane is added after 1 hour and 2 hours from the start of polymerization, and further 4 hours from the start of polymerization Thereafter, 0.05 parts by weight of t-hexyl peroxypivalate was added to continue the polymerization reaction. Then, 8 hours after the polymerization start, an ethyl acetate solution of a functional group-containing (meth)acrylic polymer having a solid content of 55% by weight and a weight average molecular weight of 600,000 was obtained.

With respect to 100 parts by weight of the resin solid content of the obtained functional group-containing (meth)acrylic polymer-containing ethyl acetate solution, 3.5 parts by weight of 2-isocyanatoethyl methacrylate as a functional group-containing unsaturated compound was added and reacted to obtain an adhesive component A.

(Synthesis of adhesive components B to K)

Except having carried out a composition as Table 1, it carried out similarly to the adhesive component A, and obtained adhesive component B-K.

(Measurement of acid value + hydroxyl value of adhesive components A to K)

By performing a titration test of the solution of an adhesive component according to JISK0070, the hydroxyl value and acid value of an adhesive component were measured, and acid value + hydroxyl value was computed.

(Example 1)

With respect to 100 parts by weight of the resin solid content of the obtained ethyl acetate solution of the pressure-sensitive adhesive component A, 3 parts by weight of a filler, 10 parts by weight of a urethane compound, 20 parts by weight of a release agent, 1 part by weight of a photopolymerization initiator, and 0.2 parts by weight of a crosslinking agent are mixed, An ethyl acetate solution of the constituting adhesive was obtained.

In addition, with respect to 100 parts by weight of the resin solid content of the obtained pressure-sensitive adhesive component A, 3 parts by weight of a filler, 20 parts by weight of a urethane compound, 10 parts by weight of a release agent, 1 part by weight of a photopolymerization initiator, and 1.0 parts by weight of a crosslinking agent are mixed to form an adhesive layer B An ethyl acetate solution of the adhesive was obtained.

The ethyl acetate solution of the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer A is coated on the release-treated surface of the polyethylene terephthalate film whose surface has been subjected to the release treatment with a doctor knife so that the thickness of the dry film becomes 100 μm, and then heat-dried at 110° C. for 5 minutes to obtain an adhesive layer A.

On the other hand, on the release-treated surface of the polyethylene terephthalate film subjected to the release treatment on the other surface, an ethyl acetate solution of the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer B was applied with a doctor knife so that the thickness of the dry film was 20 µm. It was made to heat-dry for minutes, and the adhesive layer B was obtained.

A 50-micrometer polyethylene naphthalate (PEN) film which corona-treated on both surfaces as a base material was prepared, the adhesive layer A and the adhesive layer B were respectively bonded together on both surfaces of the PEN film, and the adhesive tape was obtained. In addition, the following were used as a filler, a urethane compound, a mold release agent, and a photoinitiator.

Filler: Rheolosil MT-10, manufactured by Tokuyama Corporation

Urethane compound: Urethane acrylate, UN-5500, manufactured by Negami Industries

Release agent: silicone diacrylate, EBECRYL 350, manufactured by Daicel Allnex

Photopolymerization initiator: Esacure One, manufactured by Sieber Hegner, Japan

Cross-linking agent: isocyanate-based cross-linking agent, Colonate L, manufactured by Nippon Urethane Industry Co., Ltd.

(Examples 2 to 16, Comparative Examples 1 to 10)

Except having carried out the composition of the adhesive layer A like Tables 2 and 3, it carried out similarly to Example 1, and obtained the adhesive tape. In addition, about Example 10 and Comparative Examples 8 and 9, the following were used as a mold release agent.

Release agent: silicone acrylate, RAD2250, manufactured by Evonik Japan

In addition, about Example 16, the following were used as a mold release agent.

Release agent: silicone-modified acrylic polymer, 8BS-9000, manufactured by Taisei Fine Chemicals

<Physical properties>

About the adhesive tape obtained by the Example and the comparative example, the following measurement was performed. The results are shown in Tables 2 and 3.

(Measure dicer strength)

The release film on the side of the adhesive layer B of the adhesive tape cut into 3 cm x 4 cm both sides protected with the release film was peeled, and the adhesive layer B and the slide glass (S9112, Matsunami Glass Industry Co., Ltd. make) were bonded together. The release film on the side of the adhesive layer A of the laminated body of this adhesive tape and glass is peeled, 3 mm x 3 mm, thickness 3mm, and the single crystal silicon wafer chip of surface roughness <0.1 micrometer are put on the adhesive layer A of an adhesive tape , bonding was performed at a stage temperature of 20 °C, a head temperature of 20 °C, and a bonding pressure of 3N. Next, using a high-pressure mercury UV irradiator, 405 nm ultraviolet rays are irradiated from the pressure-sensitive adhesive layer B side of the adhesive tape toward the pressure-sensitive adhesive layer A, and the amount of irradiation on the surface on the opposite side to the base material of the pressure-sensitive adhesive layer A is 3000 mJ/cm 2 was investigated to become Then, it heat-processed at 240 degreeC for 10 minutes. After the heat treatment, the silicon wafer chip was allowed to cool below room temperature, and using a bond tester (4000PXY, universal type manufactured by Nordson Advanced Technology) at 25°C and 50% RH, the side surface of the silicon wafer chip was applied to the entire side surface of the silicon wafer chip. The maximum load when the silicon wafer chip was moved by applying a vertical force to the surface was measured, and this was defined as the die shear strength.

(Measurement of 180° Peel Strength)

The release film on the side of the pressure-sensitive adhesive layer A of the pressure-sensitive adhesive tape was peeled off, and a single crystal silicon wafer of 8 inches, thickness 0.75 mm, and surface roughness <0.1 µm was placed on the pressure-sensitive adhesive layer A of the pressure-sensitive adhesive tape, and the silicon wafer top was lifted with a 2 kg rubber roller. 1 It bonded together by making it reciprocate. After leaving still at room temperature for 20 minutes after bonding, the release film on the side of the adhesive layer B is peeled, then, using a high-pressure mercury-vapor irradiator, a 405 nm ultraviolet-ray from the adhesive layer B side of an adhesive tape from the adhesive layer B side It irradiated toward and irradiated so that the irradiation amount in the surface on the opposite side to the base material of the adhesive layer A might be set to 3000 mJ/cm<2>. Then, it heat-processed at 200 degreeC for 1 hour. About the adhesive tape after heat processing, according to JISZ0237, the 180 degree direction tensile test was done at the peeling rate of 300 mm/min, and the 180 degree peeling strength with respect to a silicon wafer was measured.

(Measurement of horizontal load strength)

The release film on the side of the pressure-sensitive adhesive layer B of the pressure-sensitive adhesive tape cut to 3 cm × 4 cm and protected with a release film on both sides was peeled, and the pressure-sensitive adhesive layer B and slide glass (S9112, manufactured by Matsunami Glass Industry Co., Ltd.) were bonded together to obtain a measurement sample. got it Bonding was performed by making one reciprocating 2 kg roller on the surface by the side of the adhesive layer A of an adhesive tape. Next, the release film on the side of the pressure-sensitive adhesive layer A of the obtained sample is peeled off, and ultraviolet light of 405 nm from the side of the pressure-sensitive adhesive layer A using a high-pressure mercury UV irradiator is applied to the surface of the pressure-sensitive adhesive layer A on the opposite side to the substrate. It irradiated so that it might become 3000 mJ/cm<2>. Then, using the surface/interface property analysis apparatus (SAICAS DN-20, the Daipla Wintess company make), the horizontal force and the perpendicular force of the adhesive layer A of an adhesive tape under the conditions of 25 degreeC 50 %RH and ultraviolet light cut measured. For the cutting edge, a single-crystal diamond blade with a width of 1 mm, a rake angle of 40°, and a clearance angle of 10° was used. The point at which the horizontal load became 0.002 N or more was taken as the point where the cutting edge contacted the surface of the pressure-sensitive adhesive layer A, and the horizontal load strength was measured in the vertical direction from there at a depth of 10 µm.

(Measurement of tensile strength)

A measurement sample comprising only the pressure-sensitive adhesive layer A was produced by the above method. Next, using a punching blade "Tensile No. 1 dumbbell shape" manufactured by Kobunshi Keiji Co., Ltd., the pressure-sensitive adhesive layer A was punched in the shape of a dumbbell so that the long side became the same as the flow direction at the time of manufacture to prepare a test piece. The obtained test piece was measured at a tensile rate of 100 mm/min using "Autograph AGS-X" manufactured by Shimadzu Corporation, and the test piece was fractured. Tensile strength was computed from the strength at the time of fracture|rupture.

(Measurement of tensile modulus)

Only the pressure-sensitive adhesive layer A was produced by the above method, and the obtained pressure-sensitive adhesive layer A was irradiated with ultraviolet rays at 405 nm so that the illuminance was 3000 mJ/cm 2 using a high-pressure mercury ultraviolet irradiator, and a single layer of the pressure-sensitive adhesive layer A after UV curing A sample was obtained. Next, a 5 mm x 35 mm test piece was produced by punching using a punching blade so that the long side might become the same as the flow direction at the time of manufacture. The obtained test piece was immersed in liquid nitrogen and cooled to -50°C, and thereafter, using a viscoelastic spectrometer (DVA-200, manufactured by Haiti Instruments Control, etc.), constant rate temperature increase tensile mode, temperature increase rate 10°C/min, frequency It heated up to 300 degreeC on the conditions of 10 Hz, and the storage elastic modulus was measured. The value of the storage elastic modulus (E') in 260 degreeC at this time was measured.

(Measurement of UV transmittance)

The ultraviolet transmittance of the adhesive tape was measured using the spectrophotometer (U-3900, Hitachi Corporation make). More specifically, it measured at a scan speed of 300 nm/min and a slit space|interval of 4 nm in the area|region of 800-200 nm, and the transmittance|permeability in 405 nm was measured.

<Evaluation>

About the adhesive tape obtained by the Example and the comparative example, the following method evaluated. The results are shown in Tables 2 and 3.

(Evaluation of lamination process)

The adhesive layer A side of the adhesive tape cut|disconnected circularly with a diameter of 20 cm was affixed on the silicon wafer of diameter 20 cm, 50 micrometers in thickness, and surface roughness <0.1 micrometer. Then, the adhesive layer B side of the adhesive tape was affixed on the glass wafer (Tempax, the SCHOTT company make) of diameter 20cm and thickness 0.6mm. After affixing, in a state in which the wavelength of 365 nm or less is cut with a filter, ultraviolet light having a wavelength of 405 nm from the glass wafer surface side is irradiated so that the irradiation amount to the pressure-sensitive adhesive layer A is 3000 mJ/cm 2 , and the pressure-sensitive adhesive layers A and B crosslinked and cured. The laminated body of the obtained silicon wafer/adhesive tape/glass wafer was left to stand for 1 hour with the glass surface facing down in the oven set to 200 degreeC, and it heat-processed. A 50-micrometer-thick wafer was laminated|stacked on the sample which returned to room temperature after heat processing using the flip-chip bonder (FC6000, Shibaura Mechatronics Co., Ltd. make). Specifically, on a SUS stage set at 80° C., the silicon wafer surface is adsorbed so that the silicon wafer surface is upward, and single crystal silicon with a bonding film of 9.8 mm × 9.8 mm, a thickness of 50 µm, a surface roughness <0.1 µm, and a thickness of 25 µm is adhered. Thin wafer chips were laminated using a ceramic tool having a head size of 10 mm x 10 mm. The temperature of the head at the time of lamination|stacking was 310 degreeC, the pressure was 300 N, and lamination|stacking time was 90 second.

When the lamination process was carried out, "◎" indicates that the thin wafer chips could be laminated in 8 layers, and "○" indicates that peeling occurred between the silicon wafer and the adhesive tape after the second layer was stacked in one layer. , the case where even one layer could not be laminated was regarded as "x", and the lamination process was evaluated.

(Peelability evaluation)

The surface on the side of the adhesive layer A of the adhesive tape was affixed on the wafer (bump diameter (phi)=20 micrometers, distance between bumps 30 micrometers, bump height 45 micrometers) with bumps, and the laminated body was obtained. Next, the adhesive layer B side of the adhesive tape was affixed on the glass wafer (Tempax, the SCHOTT company make) of diameter 20cm and thickness 0.6mm. After sticking, in a state in which the wavelength of 365 nm or less is cut with a filter, ultraviolet light with a wavelength of 405 nm from the glass wafer surface side is irradiated so that the irradiation amount to the pressure-sensitive adhesive layer A is 3000 mJ/cm 2 to crosslink the pressure-sensitive adhesive layer A; hardened. The laminated body of the obtained silicon wafer/adhesive tape/glass wafer was left to stand for 1 hour with the glass surface facing down in the oven set to 200 degreeC, and it heat-processed. After allowing the laminate to cool, the adhesive tape was peeled from the wafer. Observe the wafer after peeling with an optical microscope, and among the bumps existing in a range of 500 µm in all directions, "double-circle" indicates a case where the amount of bumps with glue residue is 5% or less, and "○" indicates a case where it is more than 5% and 20% or less, and 20% The peelability was evaluated by making "(triangle|delta)" when more and more and 50 % or less and "x" when more than 50 %.

(Evaluation of deformability of bumps)

The surface on the side of the adhesive layer A of the adhesive tape was affixed on the wafer (bump diameter (phi)=20 micrometers, distance between bumps 30 micrometers, bump height 45 micrometers) with bumps, and the laminated body was obtained. Next, the adhesive layer B side of the adhesive tape was affixed on the glass wafer (Tempax, the SCHOTT company make) of diameter 20cm and thickness 0.6mm. After sticking, in a state in which the wavelength of 365 nm or less is cut with a filter, ultraviolet light with a wavelength of 405 nm from the glass wafer surface side is irradiated so that the irradiation amount to the pressure-sensitive adhesive layer A is 3000 mJ/cm 2 to crosslink the pressure-sensitive adhesive layer A; hardened. The laminated body of the obtained silicon wafer/adhesive tape/glass wafer was left to stand for 1 hour with the glass surface facing down in the oven set to 200 degreeC, and it heat-processed. One layer of thin wafer chips was laminated on the bump-formed wafer of the sample of the laminate after the heat treatment under the same method and conditions as in the evaluation of the lamination process. The adhesive tape was peeled off after lamination|stacking, and the wafer with bumps after peeling was observed with the scanning electron microscope. At this time, among the bumps present in the range of 500 µm in all directions, a case in which the shape of the bumps changed in comparison with the initial state is 5% or less is "double-circle", more than 5% and 20% or less is "○", more than 20% When it is many and 50 % or less, "(triangle|delta)" and the case where it is more than 50 % were made into "x", and peelability was evaluated.

Industrial Applicability

According to the present invention, it is possible to provide an adhesive tape that does not peel from an adherend even when used in a process involving high temperature and load, can be easily peeled off at the time of peeling, and can also suppress deformation of solder bumps. have. Moreover, according to this invention, the manufacturing method of the semiconductor device using this adhesive tape can be provided.

1: adhesive tape
2: Wafer
3: semiconductor chip
4: Solder bump

Claims (9)

As an adhesive tape in which the adhesive layer A, the base film, and the adhesive layer B were laminated|stacked in this order,
The adhesive layer A is affixed to a silicon wafer chip, the adhesive layer B is affixed to a glass plate, and 3000 mJ/cm 2 of ultraviolet rays is irradiated to the adhesive layer A from the side of the adhesive layer B side of the adhesive tape, and 240° C. The die shear strength of the silicon wafer chip after heat treatment for 10 min at more than,
The pressure-sensitive adhesive layer A is affixed to a silicon wafer, the pressure-sensitive adhesive layer A is irradiated with an ultraviolet light of 3000 mJ/cm 2 from the surface on the pressure-sensitive adhesive layer B side, and the silicon wafer is subjected to heat treatment at 200° C. for 1 hour. 180° peel The strength is 0.10 N/inch or more and 0.30 N/inch or less,
The pressure-sensitive adhesive layer B was affixed to a glass plate, and the pressure-sensitive adhesive layer A was irradiated with an ultraviolet light of 3000 mJ/cm 2 , and the horizontal load strength at a portion of 10 μm from the surface layer portion of the pressure-sensitive adhesive layer A measured by SAICAS measurement was 0.06 N / mm or more, adhesive tape. The method of claim 1,
The said adhesive layer A is an adhesive tape whose tensile strength in 23 degreeC after 3000 mJ/cm<2> ultraviolet irradiation is 1.0 Mpa or more. 3. The method according to claim 1 or 2,
The said adhesive layer A is an adhesive tape whose tensile elasticity modulus in 260 degreeC after 3000 mJ/cm<2> ultraviolet irradiation is 1.0x10<^6> Pa or more. 4. The method of claim 1, 2 or 3,
The pressure-sensitive adhesive layer A contains a pressure-sensitive adhesive component containing a (meth)acrylic acid alkyl ester-based polymerizable polymer having a radically polymerizable unsaturated bond in the molecule, and the hydroxyl value and acid value of the pressure-sensitive adhesive component are each X mgKOH/mg, When it is set as Y mgKOH/mg, X+Y≥10, the adhesive tape. 5. The method of claim 1, 2, 3 or 4,
The pressure-sensitive adhesive layer A contains a pressure-sensitive adhesive component containing a (meth)acrylic acid alkyl ester-based polymerizable polymer having a radically polymerizable unsaturated bond in the molecule, and the hydroxyl value and acid value of the pressure-sensitive adhesive component are X mgKOH/mg, The adhesive tape which is X+Y<=70 when it is set as Y mgKOH/mg. 6. The method of claim 1, 2, 3, 4 or 5, wherein
The pressure-sensitive adhesive layer A contains the pressure-sensitive adhesive component, a polymerization initiator, a silicone or fluorine compound having a functional group crosslinkable with the pressure sensitive adhesive component, and a urethane compound having a functional group crosslinkable with the pressure sensitive adhesive component. Adhesive tape. 7. The method of claim 1, 2, 3, 4, 5 or 6,
An adhesive tape used to manufacture electronic components. 8. The method of claim 7,
An adhesive tape used in the manufacture of electronic components having a thermocompression bonding process. The process of fixing a wafer on a support body via the adhesive tape of Claim 1, 2, 3, 4, 5, 6, 7 or 8, and the said wafer image The manufacturing method of a semiconductor device which has the process of laminating|stacking a semiconductor chip by thermocompression bonding.

Images