WO2020217793A1

WO2020217793A1 - Adhesive tape

Info

Publication number: WO2020217793A1
Application number: PCT/JP2020/012070
Authority: WO
Inventors: 太郎塩島; 和泉大同; 樋口　勲夫
Original assignee: 積水化学工業株式会社
Priority date: 2019-04-26
Filing date: 2020-03-18
Publication date: 2020-10-29
Also published as: JPWO2020217793A1; TW202106831A; CN113272399A; KR20220002240A

Abstract

One purpose of the present invention is to provide an adhesive tape which is not separated from an adherend even if used in a process that is accompanied by a high temperature and a load, while being able to be easily separated upon separation, and which is also capable of suppressing deformation of a solder bump. Another purpose of the present invention is to provide a method for producing a semiconductor device, which uses this adhesive tape. The present invention is an adhesive tape which is obtained by sequentially stacking an adhesive layer A, a base material film and an adhesive layer B in this order, wherein: after the adhesive layer A is bonded to a silicon wafer chip, the adhesive layer B is bonded to a glass plate, and the adhesive tape is irradiated with ultraviolet light of 3,000 mJ/cm² from the adhesive layer B-side surface toward the adhesive layer A and is subjected to a heat treatment at 240°C for 10 minutes, the die shear strength with respect to the silicon wafer chip is 3 N/9 mm² or more; after the adhesive layer A is bonded to a silicon wafer, and the adhesive tape is irradiated with ultraviolet light of 3,000 mJ/cm² from the adhesive layer B-side surface toward the adhesive layer A and is subjected to a heat treatment at 200°C for one hour, the 180° peel strength with respect to the silicon wafer is from 0.10 N/inch to 0.30 N/inch (inclusive); and after the adhesive layer B is bonded to a glass plate and the adhesive layer A is irradiated with ultraviolet light of 3,000 mJ/cm², the horizontal load-bearing strength of a portion from the surface part to the depth of 10 μm of the adhesive layer A as determined by SAICAS measurement is 0.06 N/mm or more.

Description

Adhesive tape

The present invention relates to an adhesive tape.

In the semiconductor chip manufacturing process, adhesive tape is used to facilitate handling of wafers and semiconductor chips during processing and to prevent damage. For example, when a thick film wafer cut out from a high-purity silicon single crystal or the like is ground to a predetermined thickness to obtain a thin film wafer, grinding is performed after attaching an adhesive tape to the thick film wafer.

The adhesive composition used for such an adhesive tape has high adhesiveness enough to firmly fix an adherend such as a wafer or a semiconductor chip during the processing process, and is covered with the wafer or the semiconductor chip after the process is completed. It is required that the wafer can be peeled off without damaging it (hereinafter, also referred to as "high adhesive easy peeling").
As an adhesive composition that achieves high adhesiveness and easy peeling, Patent Document 1 discloses an adhesive tape using a photocurable adhesive that cures by irradiating light such as ultraviolet rays to reduce the adhesive strength. .. By using a photocurable pressure-sensitive adhesive as the pressure-sensitive adhesive, the adherend can be reliably fixed during the processing process, and can be easily peeled off by irradiating with ultraviolet rays or the like.

Japanese Unexamined Patent Publication No. 5-32946

In recent years, with the thinning and miniaturization of semiconductor products, semiconductor devices in which a large number of semiconductor chips are laminated on a wafer have been manufactured, and the semiconductor chips are laminated by thermocompression bonding. Here, FIG. 1 shows a schematic view showing the state of thermocompression bonding. As shown in FIG. 1, in thermocompression bonding, a semiconductor chip 3 is laminated on a wafer 2 fixed to a glass plate or the like via an adhesive tape 1. The semiconductor chip 3 is connected to the lower layer semiconductor chip by applying heat and a load, and the semiconductor chips are laminated by repeating this process.
In such thermocompression bonding, bonding is often performed at a high temperature and pressure of about 260 ° C. for bonding chips to each other or between chips and wafers, and at that time, the adhesive tape is strongly compressed in the thickness direction. .. When a conventional adhesive tape is used, stress in the shear direction is applied to the interface between the adhesive tape 1 and the wafer 2 at the outer edge of the semiconductor chip laminated portion when heat and load are applied, and peeling occurs at the interface. .. If a part of the adhesive tape is peeled off, the adhesive tape becomes uneven, so that the semiconductor chips cannot be laminated normally or can not be laminated. Therefore, in thermocompression bonding, an adhesive tape having a heat resistance of about 260 ° C. and a performance of not peeling due to heat and pressure is required in addition to the conventional high adhesive peeling function.
Another problem during lamination is deformation of the solder bumps 4 formed on the surface of the wafer 2 on the adhesive tape 1 side due to pressure during thermocompression bonding. When a conventional adhesive tape is used, the adhesion between the wafer 2 and the adhesive tape 1 is weak, so that the wafer 2 moves during crimping, and at that time, the solder bump 4 embedded in the adhesive layer may be deformed. .. If the solder bump 4 is deformed, a bonding defect may occur in the process after the adhesive tape is peeled off, or a defective product may be produced due to a poor appearance. Therefore, the adhesive tape used for temporary fixing is also required to suppress bump deformation during thermocompression bonding.

The present invention provides an adhesive tape that does not peel off from the adherend even when used in a process involving high temperature and load, can be easily peeled off at the time of peeling, and can also suppress deformation of solder bumps. The purpose is. Another object of the present invention is to provide a method for manufacturing a semiconductor device using the adhesive tape.

The present invention is an adhesive tape in which the pressure-sensitive adhesive layer A, the base film, and the pressure-sensitive adhesive layer B are laminated in this order. The pressure-sensitive adhesive layer A is attached to a silicon wafer chip, and the pressure-sensitive adhesive layer B is attached. Die-share strength with respect to the silicon wafer chip after being attached to a glass plate, irradiating the adhesive layer A with ultraviolet rays of 3000 mJ / cm ² from the surface of the adhesive tape on the adhesive layer B side, and heat-treating at 240 ° C. for 10 minutes. Is 3N / 9 mm ² or more, the adhesive layer A is attached to a silicon wafer, and the adhesive layer A is irradiated with ultraviolet rays of 3000 mJ / cm ² from the surface on the adhesive layer B side, and 1 at 200 ° C. The 180 ° peel strength with respect to the silicon wafer after the time heat treatment is 0.1 N / inch or more and 0.3 N / inch or less, the adhesive layer B is attached to a glass plate, and the adhesive layer A is 3000 mJ / cm. ^This is an adhesive tape having a horizontal load strength of 0.06 N / mm or more in a portion 10 μm from the surface layer portion of the pressure-sensitive adhesive layer A measured by SAICAS measurement after irradiation with the ultraviolet rays of ² .
The present invention will be described in detail below.

The adhesive tape of the present invention is an adhesive tape in which the pressure-sensitive adhesive layer A, the base film, and the pressure-sensitive adhesive layer B are laminated in this order.
In the adhesive tape of the present invention, the adhesive layer A is attached to a silicon wafer chip, the adhesive layer B is attached to a glass plate, and the surface of the adhesive tape on the adhesive layer B side to the adhesive layer A. The die shear strength with respect to the silicon wafer chip after irradiation with ultraviolet rays of 3000 mJ / cm ² and heat treatment at 240 ° C. for 10 minutes is 3 N / 9 mm ² or more.
Since at least one side of the adhesive layer of the adhesive tape satisfies the die shear strength in the above range, the 180 ° peel strength described later, and the horizontal load strength measured by SAICAS, the adhesive tape is difficult to peel off even by a treatment involving high temperature and load. In addition, it is possible to suppress adhesive residue on the adherend and deformation of bumps.

Die-share strength is one of the methods for measuring the bonding strength of a semiconductor chip, and when a force is applied laterally to the semiconductor chip bonded on a wafer or substrate by a bonding material, the semiconductor chip and the wafer or It is possible to measure the force when the joint surface of the substrate is broken.
In the present invention, it is used as an index for measuring the adhesion between the adhesive tape and the silicon wafer chip in the shear direction. Specifically, a force is applied from the lateral direction to the silicon wafer chip bonded on the adhesive tape to form the silicon wafer chip. Measure the strength when peeled off. If the die shear strength is high, the adhesion to stress in the shear direction becomes high, and it becomes difficult to peel off even with a load in the shear direction applied to the interface between the adhesive tape and the wafer at the outer edge of the chip crimping portion during compression. Peeling between the wafer and the adhesive tape is less likely to occur when heat and load are applied. From the viewpoint of enhancing the adhesion between the adhesive tape and the silicon wafer in the shear direction, the die shear strength is preferably 4N / 9mm ² or more, more preferably 4.5N / 9mm ² or more, and 5.5N / It is more preferably 9 mm ² or more. The upper limit of the die shear strength is not particularly limited, but is preferably 10 N / 9 mm ² or less from the viewpoint of facilitating peeling after use. The die shear strength can be adjusted by the type of adhesive and the content of silicone or fluorine compound.
More specifically, the die shear strength can be measured by the following method.

Peel off the release film on the adhesive layer B side of the adhesive tape whose both sides are protected by a release film cut into 3 cm x 4 cm, and attach the adhesive layer B and slide glass (S9111, manufactured by Matsunami Glass Industry Co., Ltd.). .. The release film on the adhesive layer A side of the laminated body of the adhesive tape and the glass is peeled off, and a single crystal silicon wafer chip having a thickness of 3 mm × 3 mm and a thickness of <0.1 μm is applied to the adhesive layer of the adhesive tape. It is placed on A and bonded at a stage temperature of 20 ° C., a head temperature of 20 ° C., and a bonding pressure of 3N. Next, using a high-pressure mercury UV irradiator, ultraviolet rays of 405 nm are irradiated from the pressure-sensitive adhesive layer B side of the pressure-sensitive adhesive tape toward the pressure-sensitive adhesive layer A, and the irradiation amount on the surface of the pressure-sensitive adhesive layer A on the side opposite to the base material. Irradiate so that the value is 3000 mJ / cm ² . Then, heat treatment is performed at 240 ° C. for 10 minutes. After the heat treatment, the silicon wafer chip is allowed to cool at room temperature, and a bond tester (4000PXY, manufactured by Nordson Advanced Technology Co., Ltd., universal type) is used to cover the entire side surface of the silicon wafer chip at 25 ° C. and 50% RH. A force in the direction perpendicular to the side surface is applied, and the maximum load when the silicon wafer chip is moved is measured, and this is defined as the die shear strength.

In the adhesive tape of the present invention, the adhesive layer A is attached to a silicon wafer, the adhesive layer A is irradiated with ultraviolet rays of 3000 mJ / cm ² from the surface on the adhesive layer B side, and heated at 200 ° C. for 1 hour. The 180 ° peel strength with respect to the processed silicon wafer is 0.1 N / inch or more and 0.3 N / inch or less.
When the adhesive tape has a peel strength of 180 ° in the above range, the adherend can be protected with sufficient adhesive strength and peeling after use can be facilitated. Further, since sufficient adhesion between the semiconductor chip and the adhesive tape can be obtained, deformation of the bump can be suppressed. From the viewpoint of increasing the adhesive strength with the adherend and making the adhesive tape more difficult to peel off, the 180 ° peel strength is preferably 0.11 N / inch or more, and preferably 0.13 N / inch or more. More preferably, it is 0.15 N / inch or more. Further, from the viewpoint of facilitating peeling after use and suppressing adhesive residue, the 180 ° peel strength is more preferably 0.25 N / inch or less, and further preferably 0.2 N / inch or less. .. The 180 ° peel strength can be adjusted by adjusting the content of the pressure-sensitive adhesive layer, the filler to be added, the inorganic filler, the fine particle component or the urethane compound, the additive having a releasable component such as silicone or the fluorine compound, and the like. it can.
More specifically, the 180 ° peel strength can be measured by the following method.

The release film on the adhesive layer A side of the adhesive tape is peeled off, and a single crystal silicon wafer of 8 inches, thickness 0.75 mm, and surface roughness <0.1 μm is placed on the adhesive layer A of the adhesive tape, and the silicon wafer is placed. The top is bonded by reciprocating once with a 2 kg rubber roller. After the bonding, the film is allowed to stand at room temperature for 20 minutes, the release film on the adhesive layer B side is peeled off, and then ultraviolet rays of 405 nm are adhered from the adhesive layer B side of the adhesive tape using a high-pressure mercury UV irradiator. Irradiation is performed toward the agent layer A so that the irradiation amount on the surface of the adhesive layer A opposite to the base material is 3000 mJ / cm ² . Then, heat treatment is performed at 200 ° C. for 1 hour. The adhesive tape after the heat treatment is subjected to a tensile test in the 180 ° direction at a peeling speed of 300 mm / min according to JIS Z0237, and the 180 ° peel strength with respect to the silicon wafer is measured.

In the adhesive tape of the present invention, the pressure-sensitive adhesive layer B is attached to a glass plate, the pressure-sensitive adhesive layer A is irradiated with ultraviolet rays of 3000 mJ / cm ² , and then 10 μm from the surface layer portion of the pressure-sensitive adhesive layer A measured by SAICAS measurement. The horizontal load strength in the portion is 0.06 N / mm or more.
The SAICAS method is an evaluation method for cutting a material from a surface layer portion at a low speed with a sharp cutting edge, which is called a Surface And Interfacial Cutting Analsis System method. By using the SAICAS method, it is possible to measure the horizontal force and the normal force applied to the cutting edge when cutting the surface of the pressure-sensitive adhesive layer.
When the horizontal load strength of the pressure-sensitive adhesive layer A is within the above range, the strength of the pressure-sensitive adhesive layer is increased, and the adhesive is less likely to be torn when peeled from the adherend. It can be suppressed. From the viewpoint of increasing the strength of the pressure-sensitive adhesive layer and suppressing adhesive residue, the horizontal load strength is preferably 0.07 N / mm or more, more preferably 0.075 N / mm or more, and 0.08 N / mm or more. Is more preferable. The upper limit of the horizontal load strength is not particularly limited, but is preferably 0.2 N / mm or less from the viewpoint of suppressing the pressure-sensitive adhesive layer from becoming brittle. The horizontal load strength can be adjusted by adjusting the content of the pressure-sensitive adhesive, the filler to be added, the inorganic filler, the fine particle component or the urethane compound, the additive having a releasable component, and the like.
Specifically, the horizontal load strength can be measured by the following method.

The release film on the adhesive layer B side of the adhesive tape whose both sides are protected by a release film cut into 3 cm x 4 cm is peeled off, and the adhesive layer B and the slide glass (S9111, manufactured by Matsunami Glass Industry Co., Ltd.) are bonded together. To obtain a sample for measurement. The bonding is performed by reciprocating a 2 kg roller once on the surface of the adhesive tape on the adhesive layer A side. Next, the release film on the pressure-sensitive adhesive layer A side of the obtained sample was peeled off, and an ultraviolet light of 405 nm from the pressure-sensitive adhesive layer A side was emitted from the pressure-sensitive adhesive layer A side using a high-pressure mercury UV irradiator to oppose the base material of the pressure-sensitive adhesive layer A. Irradiate so that the illuminance on the surface on the side is 3000 mJ / cm ² . After that, using a surface / interface physical property analyzer (SAICAS DN-20, manufactured by Daipla Wintes), the horizontal force and normal force of the adhesive layer A of the adhesive tape under the conditions of 25 ° C. 50% RH and ultraviolet light cut. To measure. A single crystal diamond blade having a width of 1 mm, a rake angle of 40 °, and a clearance angle of 10 ° is used as the cutting blade, and the cutting conditions are 5 μm / sec in the horizontal direction and 0.5 μm / sec in the vertical direction in the constant speed mode. The point where the horizontal load is 0.002 N or more is defined as the point where the cutting edge comes into contact with the surface of the pressure-sensitive adhesive layer A, and the horizontal load strength is measured within a depth range of 10 μm in the vertical direction from there.

The pressure-sensitive adhesive component constituting the pressure-sensitive adhesive layer A is not particularly limited as long as it satisfies the ranges of the die shear strength, the 180 ° peel strength and the horizontal load strength, but since it is easy to satisfy these ranges, radicals are introduced in the molecule. It is preferably a pressure-sensitive adhesive component having a polymerizable unsaturated bond. It is more preferable that the pressure-sensitive adhesive component constituting the pressure-sensitive adhesive layer A contains a (meth) acrylic acid alkyl ester-based polymerizable polymer having a radically polymerizable unsaturated bond in the molecule.
For the polymerizable polymer, for example, a (meth) acrylic polymer having a functional group in the molecule (hereinafter, referred to as a functional group-containing (meth) acrylic polymer) is synthesized in advance and reacts with the functional group in the molecule. It can be obtained by reacting a functional group to be subjected to a compound having a radically polymerizable unsaturated bond (hereinafter referred to as a functional group-containing unsaturated compound).

The functional group-containing (meth) acrylic polymer includes an acrylic acid alkyl ester and / or a methacrylate alkyl ester in which the number of carbon atoms of the alkyl group is usually in the range of 2 to 18, a functional group-containing monomer, and if necessary. It is obtained by copolymerizing these with another copolymerizable monomer for modification by a conventional method. The weight average molecular weight of the functional group-containing (meth) acrylic polymer is usually about 200,000 to 2,000,000.
In the present specification, the weight average molecular weight can be usually determined by the GPC method. For example, THF is used as an eluate at a column temperature of 40 ° C., and Waters HSPgel HR MB-M 6.0 × 150 mm is used as a column. It can be determined by the polystyrene standard.

Examples of the functional group-containing monomer include a carboxyl group-containing monomer, a hydroxy group-containing monomer, an epoxy group-containing monomer, an isocyanate group-containing monomer, and an amino group-containing monomer. Examples of the carboxy group-containing monomer include acrylic acid and methacrylic acid. Examples of the hydroxy group-containing monomer include hydroxyethyl acrylate and hydroxyethyl methacrylate. Examples of the epoxy group-containing monomer include glycidyl acrylate and glycidyl methacrylate. Examples of the isocyanate group-containing monomer include ethyl isocyanate, ethyl methacrylate, and the like. Examples of the amino group-containing monomer include aminoethyl acrylate and aminoethyl methacrylate.

Examples of the other copolymerizable monomer for modification include various monomers used in general (meth) acrylic polymers such as vinyl acetate, acrylonitrile, and styrene.

As the functional group-containing unsaturated compound to be reacted with the functional group-containing (meth) acrylic polymer, the same one as the above-mentioned functional group-containing monomer is used depending on the functional group of the functional group-containing (meth) acrylic polymer. it can. For example, when the functional group of the functional group-containing (meth) acrylic polymer is a carboxyl group, an epoxy group-containing monomer or an isocyanate group-containing monomer is used. When the functional group is a hydroxy group, an isocyanate group-containing monomer is used. When the functional group is an epoxy group, a carboxyl group-containing monomer or an amide group-containing monomer such as acrylamide is used. When the functional group is an amino group, an epoxy group-containing monomer is used.

The pressure-sensitive adhesive component constituting the pressure-sensitive adhesive layer A preferably has X + Y ≧ 10 when the hydroxyl value and the acid value are X mgKOH / mg and YmgKOH / mg, respectively.
When the hydroxyl value and acid value of the pressure-sensitive adhesive component satisfy the above relational expression, the cohesive force of the pressure-sensitive adhesive component is increased, and the pressure-sensitive adhesive layer A is more difficult to break. Therefore, even when heat and a load are applied. Can also make it difficult to peel off the adhesive tape. Further, by satisfying the above relational expression, it is possible to easily satisfy the above horizontal load and die shear strength. From the viewpoint of making the adhesive tape more difficult to peel off and controlling the horizontal load and die shear strength, the X + Y is more preferably 30 or more, and further preferably 50 or more. The upper limit of X + Y is not particularly limited, but is preferably 70 or less, and more preferably 65 or less, from the viewpoint of suppressing adhesive residue due to increased adhesion caused by an increase in the polarity of the pressure-sensitive adhesive layer. The hydroxyl value and acid value can be adjusted, for example, by the amount of the functional group-containing monomer.

The pressure-sensitive adhesive component constituting the pressure-sensitive adhesive layer A preferably has a radically polymerizable unsaturated bond amount of 0.2 meq / g or more and 2 meq / g or less.
When the amount of the radically polymerizable unsaturated bond of the pressure-sensitive adhesive component is within the above range, it is possible to easily satisfy the above ranges of die shear strength, 180 ° peel strength and horizontal load strength. The amount of the radically polymerizable unsaturated bond is more preferably 0.3 meq / g or more, more preferably 0.5 meq / g, from the viewpoint of making it easier to satisfy the ranges of the die shear strength, the 180 ° peel strength and the horizontal load strength. It is more preferably g or more, preferably 1.5 meq / g or less, and even more preferably 1 meq / g or less. The amount of the radically polymerizable unsaturated bond can be adjusted, for example, by the amount of the functional group-containing unsaturated compound.

The hydroxyl value and acid value of the pressure-sensitive adhesive component can be measured by performing a titration test of a solution of the pressure-sensitive adhesive component according to JIS K0070. The unsaturated bond amount can be calculated in the form of meq / g by subtracting the atomic weight of iodine 126.9 from the value of iodine value calculated by JIS K0070.

The pressure-sensitive adhesive layer A preferably contains a polymerization initiator.
By using the polymerizable polymer and the polymerization initiator in the pressure-sensitive adhesive layer A and curing the pressure-sensitive adhesive layer A, it is possible to easily satisfy the ranges of the die shear strength, the 180 ° peel strength and the horizontal load strength. Examples of the polymerization initiator include a photopolymerization initiator and a thermal polymerization initiator. Of these, a photopolymerization initiator is preferable because it can be easily cured and damage to the adherend is small.

Examples of the photopolymerization initiator include those that are activated by irradiating with ultraviolet rays having a wavelength of 200 to 410 nm. Examples of such photopolymerization initiators include acetophenone derivative compounds, benzophenone ether compounds, ketal derivative compounds, phosphine oxide derivative compounds, bis (η5-cyclopentadienyl) titanosen derivative compounds, benzophenone, Michler ketone, and chloro. Examples thereof include thioxanthone, todecylthioxanthone, dimethylthioxanthone, diethylthioxanthone, α-hydroxycyclohexylphenylketone, 2-hydroxymethylphenylpropane and the like. Examples of the acetophenone derivative compound include methoxyacetophenone and the like. Examples of the benzoin ether compound include benzoin propyl ether and benzoin isobutyl ether. Examples of the ketal derivative compound include benzyldimethyl ketal and acetophenone diethyl ketal. These photopolymerization initiators may be used alone or in combination of two or more.

Examples of the thermal polymerization initiator include those that generate active radicals that are decomposed by heat to initiate polymerization curing. Specifically, for example, dicumyl peroxide, di-t-butyl peroxide, t-butylperoxybenzoale, t-butylhydroperoxide, benzoyl peroxide, cumene hydroperoxide, diisopropylbenzene hydroperoxide, etc. Examples thereof include paramentan hydroperoxide and di-t-butyl peroxide.
Of these thermal polymerization initiators, those commercially available are not particularly limited, but for example, perbutyl D, perbutyl H, perbutyl P, perpenta H (all of which are manufactured by NOF CORPORATION) and the like are suitable. These thermal polymerization initiators may be used alone or in combination of two or more.

The pressure-sensitive adhesive layer A may contain a radically polymerizable polyfunctional oligomer or monomer.
When the pressure-sensitive adhesive layer A contains a radically polymerizable polyfunctional oligomer or monomer, the ultraviolet curability is improved. The polyfunctional oligomer or monomer preferably has a weight average molecular weight of 10,000 or less, and more preferably has a weight average molecular weight of 5000 so that the pressure-sensitive adhesive layer can be efficiently reticulated by irradiation with ultraviolet rays. The number of radically polymerizable unsaturated bonds in the molecule is 2 to 20 below.

The polyfunctional oligomer or monomer is, for example, trimethylolpropane triacrylate, tetramethylolmethanetetraacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol monohydroxypentaacrylate, dipentaerythritol hexaacrylate or the same methacrylate as above. Kind and the like. Other examples include 1,4-butylene glycol diacrylate, 1,6-hexanediol diacrylate, polyethylene glycol diacrylate, commercially available oligoester acrylate, and the same methacrylates as described above. These polyfunctional oligomers or monomers may be used alone or in combination of two or more.

The pressure-sensitive adhesive layer A preferably contains a cross-linking agent.
When the pressure-sensitive adhesive layer A contains a cross-linking agent, the cohesive force of the pressure-sensitive adhesive component can be improved. Examples of the above-mentioned cross-linking agent include isocyanate-based cross-linking agents and epoxy-based cross-linking agents. Of these, isocyanate-based cross-linking agents are preferable because they can further improve the peeling performance.

The content of the cross-linking agent is not particularly limited, but the preferable lower limit is 0.01 parts by weight, the more preferable lower limit is 0.1 parts by weight, the preferable upper limit is 10 parts by weight, and the more preferable upper limit is 100 parts by weight. 5 parts by weight. When the content of the cross-linking agent is in the above range, the pressure-sensitive adhesive component can be appropriately cross-linked to further enhance the cohesive force of the pressure-sensitive adhesive component while maintaining high adhesive strength.

The pressure-sensitive adhesive layer A preferably contains a releasable component, and is a silicone or fluorine compound having a functional group crosslinkable with the pressure-sensitive adhesive component as the releasable component (hereinafter, also simply referred to as silicone or fluorine compound). Is more preferable to contain.
When the pressure-sensitive adhesive layer A contains a silicone or a fluorine compound, the silicone or the fluorine compound bleeds out at the interface between the pressure-sensitive adhesive layer A and the adherend, so that the adhesive tape can be easily peeled off without adhesive residue after the treatment is completed. can do. Further, since the silicone or the fluorine compound has a functional group capable of cross-linking with the pressure-sensitive adhesive component, the silicone or the fluorine compound chemically reacts with the pressure-sensitive adhesive component or is incorporated into the pressure-sensitive adhesive component via a cross-linking agent or the like. Therefore, the contamination caused by the adhesion of the silicone or the fluorine compound to the adherend is suppressed.
The crosslinkable functional value of the silicone or fluorine compound is, for example, 2 to 6 valent, preferably 2 to 4 valent, and more preferably divalent.
The functional group crosslinkable with the pressure-sensitive adhesive component is appropriately determined by the functional group contained in the pressure-sensitive adhesive component. For example, when the pressure-sensitive adhesive component contains a (meth) acrylic acid alkyl ester-based polymerizable polymer. , (Meta) Select an acrylic group and a crosslinkable functional group. The functional group crosslinkable with the (meth) acrylic group is a functional group having an unsaturated double bond, and specifically contains, for example, a vinyl group, a (meth) acrylic group, an allyl group, a maleimide group and the like. Select silicone or fluorine compounds. Examples of the functional group that can be crosslinked with the pressure-sensitive adhesive component include a hydroxyl group, a carboxyl group, an epoxy group, and the like, in addition to the functional group that can be crosslinked with the (meth) acrylic group. Among them, when the pressure-sensitive adhesive layer A is a curable type, silicone or a fluorine compound chemically reacts with the pressure-sensitive adhesive component at the same time as the curing reaction and is incorporated into the pressure-sensitive adhesive component. Therefore, a functional having an unsaturated double bond. It is preferably a group.
Examples of the silicone or fluorine compound include silicone diacrylate and fluoroacrylate.

The content of the silicone or fluorine compound in the pressure-sensitive adhesive layer A has a preferable lower limit of 2% by weight, a more preferable lower limit of 5% by weight, a further preferable lower limit of 10% by weight, a preferable upper limit of 40% by weight, and a more preferable upper limit. Is 35% by weight, and a more preferable upper limit is 30% by weight.
When the content of the silicone or fluorine compound is in the above range, the adherend can be peeled off with less adhesive residue.

The pressure-sensitive adhesive layer A preferably contains a urethane compound (hereinafter, also simply referred to as a urethane compound) having a functional group crosslinkable with the pressure-sensitive adhesive component.
When the pressure-sensitive adhesive layer A contains a urethane compound, the flexibility of the pressure-sensitive adhesive tape is improved, and the obtained pressure-sensitive adhesive tape can be made difficult to tear. Further, since the urethane compound has a functional group capable of cross-linking with the pressure-sensitive adhesive component, the urethane compound chemically reacts with the pressure-sensitive adhesive component or is incorporated into the pressure-sensitive adhesive component via a cross-linking agent or the like. Contamination caused by the adhesion of urethane compounds to the body is suppressed. Examples of the functional group crosslinkable with the pressure-sensitive adhesive component include those similar to silicone or fluorine compounds having a functional group crosslinkable with the pressure-sensitive adhesive component. Examples of the urethane compound include urethane acrylate.

The content of the urethane compound in the pressure-sensitive adhesive layer A has a preferable upper limit of 20% by weight, a more preferable upper limit of 15% by weight, and a further preferable upper limit of 10% by weight. When the content of the urethane compound is within the above range, an adhesive tape having more excellent heat resistance and adhesive residue suppressing performance can be obtained. The lower limit of the content of the urethane compound is not particularly limited, but it is preferably 1% by weight from the viewpoint of making the adhesive tape more difficult to tear and suppressing adhesive residue.

The pressure-sensitive adhesive layer A may contain an inorganic filler such as fumed silica, a plasticizer, a resin, a surfactant, a wax, a fine particle filler, and other known additives. The above additives may be used alone or in combination of two or more.

When the pressure-sensitive adhesive layer A contains an inorganic filler (fumed silica or the like), the content thereof is preferably 100% by weight of the pressure-sensitive adhesive component from the viewpoint of making it easy to adjust the horizontal load within the above range. It is 3% by weight or more, more preferably 12% by weight or more, preferably 24% by weight or less, and more preferably 18% by weight or less.

The pressure-sensitive adhesive layer A preferably has a tensile strength of 1.0 MPa or more at 23 ° C. after irradiation with ultraviolet rays of 3000 mJ / cm ² .
When the tensile strength of the pressure-sensitive adhesive layer A after irradiation with ultraviolet rays is within the above range, the obtained adhesive tape can be made more difficult to tear, and the generation of adhesive residue can be further suppressed. Further, the horizontal load can be controlled within the above range. From the viewpoint of making the adhesive tape more difficult to tear and suppressing adhesive residue, the tensile strength is more preferably 1.2 MPa or more, and even more preferably 1.5 MPa or more. The upper limit of the tensile strength is not particularly limited, but is preferably 6 MPa or less from the viewpoint of adhesive strength.

The tensile strength can be measured by a method according to JIS K 7161.
Specifically, for example, using a punching blade "tensile No. 1 type dumbbell shape" manufactured by Polymer Instruments Co., Ltd., the adhesive layer A is dumbbelled so that the long side is the same as the flow direction at the time of manufacture. A test piece is prepared by punching into a shape. The obtained test piece is measured at a tensile speed of 100 mm / min using, for example, "Autograph AGS-X" manufactured by Shimadzu Corporation, and the test piece is broken. The tensile strength is calculated from the strength at the breaking point.

The pressure-sensitive adhesive layer A is preferably a tensile modulus at 260 ° C. after ultraviolet irradiation of 3000 mJ / cm ² is 1.0 × ¹⁰ 6 Pa or more.
When the tensile elastic modulus of the pressure-sensitive adhesive layer A after irradiation with ultraviolet rays is within the above range, the resistance to the load of the obtained adhesive tape is enhanced, the adherend can be made less likely to be damaged, and further, the above-mentioned horizontal It becomes easier to control the load and die shear strength within the above range. From the viewpoint of making the adherend less likely to be damaged, the tensile elastic modulus is more preferably 5 × 10 ⁶ Pa or more, and further preferably 1 × 10 ⁷ Pa or more. The upper limit of the tensile elastic modulus is not particularly limited, but is preferably 30 × 10 ⁶ Pa or less from the viewpoint of adhesive strength.

The tensile elastic modulus can be measured by the following method.
A 5 mm × 35 mm test piece is produced by punching a single-layer sample of the pressure-sensitive adhesive layer A with a punching blade so that the long side is the same as the flow direction at the time of manufacture. The obtained test piece is immersed in liquid nitrogen and cooled to -50 ° C., and then using a viscoelastic spectrometer (for example, DVA-200, manufactured by IT Measurement Control Co., Ltd., etc.), a constant-speed temperature rise tensile mode. The temperature is raised to 300 ° C. under the conditions of a heating rate of 10 ° C./min and a frequency of 10 Hz, and the storage elastic modulus is measured. From the result of the obtained storage elastic modulus, the storage elastic modulus at 260 ° C. is defined as the tensile elastic modulus.

The thickness of the pressure-sensitive adhesive layer A is not particularly limited, but the lower limit is preferably 1 μm and the upper limit is preferably 200 μm. When the thickness of the pressure-sensitive adhesive layer A is within the above range, the adherend can be protected with sufficient adhesive strength, and adhesive residue during peeling can be suppressed. The more preferable lower limit of the thickness of the pressure-sensitive adhesive layer A is 10 μm, and the more preferable upper limit is 100 μm.

The pressure-sensitive adhesive layer B is not particularly limited as long as the pressure-sensitive adhesive layer A can satisfy the range of the die-share strength and the 180 ° peel strength, and may be the same as or different from the pressure-sensitive adhesive layer A. .. Further, the pressure-sensitive adhesive layer B may be a curable type or a non-curable type. Examples of the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer B include a rubber-based pressure-sensitive adhesive, an acrylic-based pressure-sensitive adhesive, a vinyl alkyl ether-based pressure-sensitive adhesive, a silicone-based pressure-sensitive adhesive, a polyester-based pressure-sensitive adhesive, a polyamide-based pressure-sensitive adhesive, and a urethane-based pressure-sensitive adhesive. Examples thereof include styrene / diene block copolymer adhesives. The structure of the pressure-sensitive adhesive component is not particularly limited, and may be a random copolymer or a block copolymer.

The pressure-sensitive adhesive layer B preferably has an ultraviolet transmittance of 1% or more at 405 nm because the pressure-sensitive adhesive layer A easily satisfies the range of the die shear strength and the 180 ° peel strength. The ultraviolet transmittance is more preferably 10% or more, further preferably 15% or more, and particularly preferably 50% or more. When the ultraviolet transmittance is at least these lower limits, the pressure-sensitive adhesive layer A can be sufficiently cured when the pressure-sensitive adhesive layer A is an ultraviolet-curable type without using a photosensitizer. The upper limit of the ultraviolet transmittance is not particularly limited, and the higher the upper limit, the better, usually 100% or less.

The thickness of the pressure-sensitive adhesive layer B is not particularly limited, but the preferable lower limit is 5 μm, the more preferable lower limit is 10 μm, the preferable upper limit is 100 μm, and the more preferable upper limit is 60 μm. When the thickness of the upper pressure-sensitive adhesive layer B is within the above range, it can be adhered to the support or the like with sufficient adhesive strength, and the adherend can be reliably fixed.

The material constituting the base film is not particularly limited as long as the pressure-sensitive adhesive layer A can satisfy the range of the die shear strength and the 180 ° peel strength, and may be an organic material or an inorganic material. However, it is preferable that the material has heat resistance. Examples of heat-resistant organic materials include polyethylene terephthalate, polyethylene naphthalate, polyacetal, polyamide, polycarbonate, polyphenylene ether, polybutylene terephthalate, ultra-high molecular weight polyethylene, syndiotactic polystyrene, polyarylate, polysulfone, and polyether sulfone. Examples thereof include polyphenylene sulfide, polyetheretherketone, polyimide, polyetherimide, fluororesin, and liquid crystal polymer. Of these, polyethylene naphthalate is preferable because it has excellent heat resistance. Further, examples of the heat-resistant inorganic material include thin glass.

Since the pressure-sensitive adhesive layer A easily satisfies the range of the die shear strength and the 180 ° peel strength, the base film preferably has an ultraviolet transmittance of 1% or more at 405 nm. The ultraviolet transmittance is more preferably 10% or more, further preferably 15% or more, and particularly preferably 50% or more. When the ultraviolet transmittance is at least these lower limits, the pressure-sensitive adhesive layer A can be sufficiently cured when the pressure-sensitive adhesive layer A is an ultraviolet-curable type without using a photosensitizer. The upper limit of the ultraviolet transmittance is not particularly limited, and the higher the upper limit, the better, usually 100% or less.

The shape of the base film is not particularly limited, and examples thereof include a sheet shape, a sheet shape having a mesh-like structure, and a sheet shape having holes. Further, the above-mentioned base material is a base material which has been subjected to a treatment for improving the adhesive force with an adhesive such as sandblasting treatment and a surface corona treatment, and a treatment for imparting conductivity such as sputtering film formation and conductive film deposition. May be good.

The thickness of the base film is not particularly limited, but the preferable lower limit is 5 μm and the preferable upper limit is 100 μm. When the thickness of the base film is within this range, the adhesive tape has an appropriate elasticity and is excellent in handleability. The more preferable lower limit of the thickness of the base film is 10 μm, and the more preferable upper limit is 50 μm.

The adhesive tape of the present invention may have an anchor layer between the base film and the pressure-sensitive adhesive layer A, or between the base film and the pressure-sensitive adhesive layer B.
When an anchor layer is provided between the base film and the pressure-sensitive adhesive layer, when the pressure-sensitive adhesive layer contains a silicone or a fluorine compound, the silicone or the fluorine compound bleeds out to the base film side and the pressure-sensitive adhesive is provided. It is possible to prevent the layer from peeling off from the base film.

Examples of the anchor layer include an acrylic pressure-sensitive adhesive and a urethane-based pressure-sensitive adhesive. Of these, an acrylic adhesive is preferable because it has excellent anchoring performance.

The anchor layer may contain known additives such as an inorganic filler, a heat stabilizer, an antioxidant, an antistatic agent, a plasticizer, a resin, a surfactant, and a wax, if necessary. These additives may be used alone or in combination of two or more.

The thickness of the anchor layer is not particularly limited, but a preferable lower limit is 1 μm and a preferable upper limit is 30 μm. When the thickness of the anchor layer is within this range, the anchor force between the pressure-sensitive adhesive layer on the anchor layer side and the base film can be further improved. From the viewpoint of further improving the anchoring force between the adhesive layer on the anchor layer side and the base film, the more preferable lower limit of the thickness of the anchor layer is 3 μm, and the more preferable upper limit is 10 μm.

The adhesive tape of the present invention preferably has an ultraviolet transmittance of 1% or more at 405 nm because the adhesive layer A easily satisfies the range of the die shear strength and the 180 ° peel strength. The ultraviolet transmittance is more preferably 10% or more, and further preferably 15% or more. When the ultraviolet transmittance is at least these lower limits, the pressure-sensitive adhesive layer A can be sufficiently cured when the pressure-sensitive adhesive layer A is an ultraviolet-curable type without using a photosensitizer. The upper limit of the ultraviolet transmittance is not particularly limited, and the higher the upper limit, the better, usually 100% or less.
The ultraviolet transmittance can be measured using a spectrophotometer (U-3900, manufactured by Hitachi, Ltd., or an equivalent product thereof).

The method for producing the adhesive tape of the present invention is not particularly limited, and conventionally known methods can be used. For example, a solution containing a pressure-sensitive adhesive component, a silicone or a fluorine compound, a urethane compound, or the like was applied onto a film that had undergone a mold release treatment and dried to form a pressure-sensitive adhesive layer A, which was then subjected to another mold release treatment. After forming the pressure-sensitive adhesive layer B on the film by the same method, the pressure-sensitive adhesive layer A and the pressure-sensitive adhesive layer B can be bonded to both sides of the base film.

The application of the adhesive tape of the present invention is not particularly limited, but it can be particularly preferably used as a protective tape in the manufacture of electronic parts such as electronic substrates, semiconductor chips, and panel parts for display materials, which have a manufacturing process involving high temperature and load. it can.
The adhesive tape of the present invention used for manufacturing such electronic components is also one of the present inventions. In particular, the adhesive tape of the present invention can be suitably used for manufacturing electronic components including a thermocompression bonding step of heating at 280 ° C. for a short time (for example, 90 seconds or less, typically 1 to 20 seconds). ..
As a method for manufacturing a semiconductor device that can use the adhesive tape of the present invention, more specifically, for example, a step of fixing a wafer on a support via the adhesive tape of the present invention and heating a semiconductor chip on the wafer. Examples thereof include a method for manufacturing a semiconductor device having a step of laminating by crimp bonding. A method for manufacturing such a semiconductor device is also one of the present inventions.

In the step of fixing the wafer, the method of fixing the wafer on the support via the adhesive tape of the present invention is not particularly limited, but the adhesive layer A and the wafer such as a silicon wafer are bonded to each other and the other A method of bonding the pressure-sensitive adhesive layer B and a support such as glass is preferable.

In the step of laminating the semiconductor chips by thermocompression bonding, the thermocompression bonding may be repeated, and the thermocompression bonding is heated at 280 ° C. for a short time (for example, 90 seconds or less, typically 1 to 20 seconds). A large number of semiconductor chips may be laminated by repeating the above steps.

In the method for manufacturing a semiconductor device of the present invention, the step of fixing the wafer may be followed by another step, and then the step of laminating the semiconductor chips by thermocompression bonding. Examples of the other steps include a step of thinning the wafer by back grinding, a wafer level molding step, and the like. In the method for manufacturing a semiconductor device of the present invention, a step of laminating the semiconductor chips by thermocompression bonding and then a step of peeling the adhesive tape from the support, the wafer, or both may be performed.

The support is not particularly limited, and examples thereof include glass, a polyimide film, and a glass epoxy substrate.

According to the present invention, an adhesive tape that does not peel off from the adherend even when used in a process involving high temperature and load, can be easily peeled off at the time of peeling, and can also suppress deformation of solder bumps. Can be provided. Further, according to the present invention, it is possible to provide a method for manufacturing a semiconductor device using the adhesive tape.

It is a schematic diagram which showed the state of thermocompression bonding bonding.

Hereinafter, embodiments of the present invention will be described in more detail with reference to examples, but the present invention is not limited to these examples.

(Synthesis of adhesive component A)
A reactor equipped with a thermometer, a stirrer, and a cooling tube was prepared. In this reactor, 94 parts by weight of 2-ethylhexyl acrylate as the (meth) acrylic acid alkyl ester, 6 parts by weight of hydroxyethyl methacrylate as the functional group-containing monomer, 0.01 part by weight of lauryl mercaptan, and 80 parts by weight of ethyl acetate were added. After the addition, the reactor was heated to initiate reflux. Subsequently, 0.01 part by weight of 1,1-bis (t-hexylperoxy) -3,3,5-trimethylcyclohexane was added as a polymerization initiator into the reactor, and the polymerization was started under reflux. It was. Next, 0.01 parts by weight of 1,1-bis (t-hexylperoxy) -3,3,5-trimethylcyclohexane was added 1 hour and 2 hours after the start of the polymerization, and further, the polymerization was started. After 4 hours from the above, 0.05 parts by weight of t-hexyl peroxypivalate was added to continue the polymerization reaction. Then, 8 hours after the start of the polymerization, an ethyl acetate solution of a functional group-containing (meth) acrylic polymer having a solid content of 55% by weight and a weight average molecular weight of 600,000 was obtained.
To 100 parts by weight of the resin solid content of the obtained ethyl acetate solution containing a functional group-containing (meth) acrylic polymer, 3.5 parts by weight of 2-isocyanatoethyl methacrylate was added as a functional group-containing unsaturated compound to react. The adhesive component A was obtained.

(Synthesis of adhesive components B to K)
Adhesive components B to K were obtained in the same manner as the pressure-sensitive adhesive component A except that the compositions were as shown in Table 1.

(Measurement of acid value + hydroxyl value of adhesive components A to K)
By performing a titration test of the solution of the pressure-sensitive adhesive component according to JIS K0070, the hydroxyl value and acid value of the pressure-sensitive adhesive component were measured, and the acid value + hydroxyl value was calculated.

(Example 1)
3 parts by weight of filler, 10 parts by weight of urethane compound, 20 parts by weight of mold release agent, 1 part by weight of photopolymerization initiator, and cross-linking agent with respect to 100 parts by weight of the resin solid content of the obtained ethyl acetate solution of the pressure-sensitive adhesive component A. 0.2 parts by weight were mixed to obtain an ethyl acetate solution of the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer A.
Further, with respect to 100 parts by weight of the resin solid content of the obtained pressure-sensitive adhesive component A, 3 parts by weight of the filler, 20 parts by weight of the urethane compound, 10 parts by weight of the release agent, 1 part by weight of the photopolymerization initiator, and the cross-linking agent 1. 0 parts were mixed to obtain an ethyl acetate solution of the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer B.
The ethyl acetate solution of the adhesive constituting the pressure-sensitive adhesive layer A is applied with a doctor knife on the release-treated surface of the polyethylene terephthalate film whose surface has been released-treated so that the thickness of the dry film is 100 μm. The pressure-sensitive adhesive layer A was obtained by heating and drying at 110 ° C. for 5 minutes.
On the other hand, on the release-treated surface of the polyethylene terephthalate film whose surface has been released-treated, a doctor knife is applied with an ethyl acetate solution of the adhesive constituting the pressure-sensitive adhesive layer B so that the thickness of the dry film is 20 μm. And dried by heating at 110 ° C. for 5 minutes to obtain an adhesive layer B.
A 50 μm polyethylene naphthalate (PEN) film having corona treatment on both sides was prepared as a base material, and an adhesive layer A and an adhesive layer B were bonded to both sides of the PEN film to obtain an adhesive tape. The following fillers, urethane compounds, mold release agents, and photopolymerization initiators were used.
Filler: Leoloseal MT-10, Tokuyama Urethane Compound: Urethane Acrylate, UN-5500, Negami Kogyo's Mold Release Agent: Silicone Diacrylate, EBECRYL 350, Daicel Ornex Photopolymerization Initiator: Esacure One, Nippon Sibel Hegner Cross-linking agent: Isocyanate-based cross-linking agent, Coronate L, manufactured by Nippon Urethane Industry Co., Ltd.

(Examples 2 to 16, Comparative Examples 1 to 10)
An adhesive tape was obtained in the same manner as in Example 1 except that the composition of the pressure-sensitive adhesive layer A was as shown in Tables 2 and 3. In Example 10, Comparative Examples 8 and 9, the following mold release agents were used.
Release agent: Silicon acrylate, RAD2250, manufactured by Evonik Japan Co., Ltd. In addition, in Example 16, the following was used as the release agent.
Release agent: Silicone modified acrylic polymer, 8BS-9000, manufactured by Taisei Fine Chemicals Co., Ltd.

<Physical properties>
The following measurements were performed on the adhesive tapes obtained in Examples and Comparative Examples. The results are shown in Tables 2 and 3.

(Measurement of die share strength)
The release film on the adhesive layer B side of the adhesive tape whose both sides are protected by the release film, cut into 3 cm x 4 cm, is peeled off, and the adhesive layer B and the slide glass (S9111, manufactured by Matsunami Glass Industry Co., Ltd.) are bonded together. It was. The release film on the adhesive layer A side of the laminated body of the adhesive tape and the glass is peeled off, and a single crystal silicon wafer chip having a thickness of 3 mm × 3 mm and a thickness of <0.1 μm is applied to the adhesive layer of the adhesive tape. It was placed on A and bonded at a stage temperature of 20 ° C., a head temperature of 20 ° C., and a bonding pressure of 3N. Next, using a high-pressure mercury UV irradiator, ultraviolet rays of 405 nm are irradiated from the pressure-sensitive adhesive layer B side of the pressure-sensitive adhesive tape toward the pressure-sensitive adhesive layer A, and the irradiation amount on the surface of the pressure-sensitive adhesive layer A on the side opposite to the base material. Irradiated so that the value was 3000 mJ / cm ² . Then, heat treatment was performed at 240 ° C. for 10 minutes. After the heat treatment, the silicon wafer chip is allowed to cool at room temperature, and a bond tester (4000PXY, a universal type manufactured by Nordson Advanced Technology Co., Ltd.) is used to cover the entire side surface of the silicon wafer chip at 25 ° C. and 50% RH. A force in the vertical direction was applied to the silicon wafer chip, and the maximum load when the silicon wafer chip was moved was measured and used as the die shear strength.

(Measurement of 180 ° peel strength)
The release film on the adhesive layer A side of the adhesive tape is peeled off, and a single crystal silicon wafer of 8 inches, thickness 0.75 mm, and surface roughness <0.1 μm is placed on the adhesive layer A of the adhesive tape, and the silicon wafer is placed. The top was bonded by reciprocating once with a 2 kg rubber roller. After the bonding, the film is allowed to stand at room temperature for 20 minutes, the release film on the adhesive layer B side is peeled off, and then ultraviolet rays of 405 nm are adhered from the adhesive layer B side of the adhesive tape using a high-pressure mercury UV irradiator. The film was irradiated toward the agent layer A so that the irradiation amount on the surface of the pressure-sensitive adhesive layer A opposite to the base material was 3000 mJ / cm ² . Then, heat treatment was performed at 200 ° C. for 1 hour. The adhesive tape after the heat treatment was subjected to a tensile test in the 180 ° direction at a peeling speed of 300 mm / min according to JIS Z0237, and the 180 ° peel strength with respect to the silicon wafer was measured.

(Measurement of horizontal load strength)
The release film on the adhesive layer B side of the adhesive tape whose both sides are protected by a release film cut into 3 cm x 4 cm is peeled off, and the adhesive layer B and the slide glass (S9111, manufactured by Matsunami Glass Industry Co., Ltd.) are bonded together. A sample for measurement was obtained. The bonding was performed by reciprocating a 2 kg roller once on the surface of the adhesive tape on the adhesive layer A side. Next, the release film on the pressure-sensitive adhesive layer A side of the obtained sample was peeled off, and an ultraviolet light of 405 nm from the pressure-sensitive adhesive layer A side was emitted from the pressure-sensitive adhesive layer A side using a high-pressure mercury UV irradiator to oppose the base material of the pressure-sensitive adhesive layer A. The irradiation was performed so that the illuminance on the side surface was 3000 mJ / cm ² . After that, using a surface / interface physical property analyzer (SAICAS DN-20, manufactured by Daipla Wintes), the horizontal force and normal force of the adhesive layer A of the adhesive tape under the conditions of 25 ° C. 50% RH and ultraviolet light cut. Was measured. A single crystal diamond blade having a width of 1 mm, a rake angle of 40 °, and a clearance angle of 10 ° was used as the cutting blade, and the cutting conditions were 5 μm / sec in the horizontal direction and 0.5 μm / sec in the vertical direction in the constant speed mode. The point where the horizontal load was 0.002 N or more was defined as the point where the cutting edge came into contact with the surface of the pressure-sensitive adhesive layer A, and the horizontal load strength was measured within a depth range of 10 μm in the vertical direction from there.

(Measurement of tensile strength)
A measurement sample consisting of only the pressure-sensitive adhesive layer A was prepared by the above method. Next, using a punching blade "Tensile No. 1 type dumbbell shape" manufactured by Polymer Instruments Co., Ltd., the adhesive layer A is punched into a dumbbell shape so that the long side is the same as the flow direction at the time of manufacture. Was produced. The obtained test piece was measured at a tensile speed of 100 mm / min using "Autograph AGS-X" manufactured by Shimadzu Corporation, and the test piece was broken. The tensile strength was calculated from the strength at the time of breaking.

(Measurement of tensile modulus)
Only the pressure-sensitive adhesive layer A is prepared by the above method, and the obtained pressure-sensitive adhesive layer A is irradiated with ultraviolet rays of 405 nm using a high-pressure mercury ultraviolet irradiation machine so that the illuminance becomes 3000 mJ / cm ^2, and the ultraviolet rays are cured. A single layer sample of the later pressure-sensitive adhesive layer A was obtained. Next, a test piece of 5 mm × 35 mm was produced by punching with a punching blade so that the long side was the same as the flow direction at the time of manufacturing. The obtained test piece is immersed in liquid nitrogen and cooled to -50 ° C., and then, using a viscoelastic spectrometer (DVA-200, manufactured by IT Measurement Control Co., Ltd.), constant speed temperature rise and tension mode, temperature rise. The temperature was raised to 300 ° C. under the conditions of a speed of 10 ° C./min and a frequency of 10 Hz, and the storage elastic modulus was measured. The value of the storage elastic modulus (E') at 260 ° C. at this time was measured.

(Measurement of UV transmittance)
The ultraviolet transmittance of the adhesive tape was measured using a spectrophotometer (U-3900, manufactured by Hitachi, Ltd.). More specifically, the measurement was performed in a region of 800 to 200 nm at a scan speed of 300 nm / min and a slit interval of 4 nm, and the transmittance at 405 nm was measured.

<Evaluation>
The adhesive tapes obtained in Examples and Comparative Examples were evaluated by the following methods. The results are shown in Tables 2 and 3.

(Evaluation of laminating process)
The adhesive layer A side of the adhesive tape cut into a circle with a diameter of 20 cm was attached to a silicon wafer having a diameter of 20 cm, a thickness of 50 μm, and a surface roughness <0.1 μm. Next, the adhesive B layer side of the adhesive tape was attached to a glass wafer (Tempax, manufactured by SCHOTT) having a diameter of 20 cm and a thickness of 0.6 mm. After sticking, with the wavelength of 365 nm or less cut by a filter, ultraviolet light having a wavelength of 405 nm is irradiated from the glass wafer surface side so that the irradiation amount of the pressure-sensitive adhesive layer A is 3000 mJ / cm ^2. A and B were crosslinked and cured. The obtained silicon wafer / adhesive tape / glass wafer laminate was allowed to stand for 1 hour in an oven set at 200 ° C. with the glass side facing down, and heat-treated. A 50 μm-thick wafer was laminated on the sample that had returned to room temperature after the heat treatment using a flip chip bonder (FC6000, manufactured by Shibaura Mechatronics Co., Ltd.). Specifically, it is adsorbed on a SUS stage set at 80 ° C. so that the silicon wafer surface faces up, and has a thickness of 9.8 mm × 9.8 mm, a thickness of 50 μm, a surface roughness <0.1 μm, and a thickness of 25 μm. Single crystal silicon thin wafer chips with a bonding film were laminated using a ceramic tool with a head size of 10 mm × 10 mm. The temperature of the head during stacking was 310 ° C., the pressure was 300 N, and the stacking time was 90 seconds.
When the laminating process is performed, the case where the thin wafer chips can be laminated in eight stages is indicated by "◎", and the case where the first stage can be laminated but peeling occurs between the silicon wafer and the adhesive tape in the second and subsequent stages. The laminating process was evaluated with "◯" and "x" when even one step could not be laminated.

(Evaluation of peelability)
The surface of the adhesive tape on the adhesive layer A side was attached to a wafer with bumps (bump diameter φ = 20 μm, bump distance 30 μm, bump height 45 μm) to obtain a laminate. Next, the adhesive layer B side of the adhesive tape was attached to a glass wafer (Tempax, manufactured by SCHOTT) having a diameter of 20 cm and a thickness of 0.6 mm. After sticking, with the wavelength of 365 nm or less cut by a filter, ultraviolet light having a wavelength of 405 nm is irradiated from the glass wafer surface side so that the irradiation amount of the pressure-sensitive adhesive layer A is 3000 mJ / cm ^2. A was crosslinked and cured. The obtained silicon wafer / adhesive tape / glass wafer laminate was allowed to stand for 1 hour in an oven set at 200 ° C. with the glass side facing down, and heat-treated. After allowing the laminate to cool, the adhesive tape was peeled off from the wafer. The wafer after peeling was observed with an optical microscope, and when the number of bumps remaining in the adhesive was 5% or less among the bumps existing in the range of 500 μm square, it was “◎”, which was more than 5% and 20% or less. The peelability was evaluated as "◯" when the value was "◯", "Δ" when the percentage was more than 20% and 50% or less, and "x" when the percentage was more than 50%.

(Evaluation of bump deformability)
The surface of the adhesive tape on the adhesive layer A side was attached to a wafer with bumps (bump diameter φ = 20 μm, bump distance 30 μm, bump height 45 μm) to obtain a laminate. Next, the adhesive layer B side of the adhesive tape was attached to a glass wafer (Tempax, manufactured by SCHOTT) having a diameter of 20 cm and a thickness of 0.6 mm. After sticking, with the wavelength of 365 nm or less cut by a filter, ultraviolet light having a wavelength of 405 nm is irradiated from the glass wafer surface side so that the irradiation amount of the pressure-sensitive adhesive layer A is 3000 mJ / cm ^2. A was crosslinked and cured. The obtained silicon wafer / adhesive tape / glass wafer laminate was allowed to stand for 1 hour in an oven set at 200 ° C. with the glass side facing down, and heat-treated. A thin wafer chip was laminated in one stage on the bumped wafer of the sample of the laminate after the heat treatment under the same method and conditions as in the evaluation of the above lamination process. After laminating, the adhesive tape was peeled off, and the peeled wafer with bumps was observed with a scanning electron microscope. At this time, among the bumps existing in the range of 500 μm square, the case where the bump whose shape has changed compared to the initial state is 5% or less is “◎”, and the case where it is more than 5% and 20% or less. Was evaluated as “◯”, when it was more than 20% and 50% or less, it was evaluated as “Δ”, and when it was more than 50%, it was evaluated as “x”.

1 Adhesive tape 2 Wafer 3 Semiconductor chip 4 Solder bump

Claims

An adhesive tape in which the pressure-sensitive adhesive layer A, the base film, and the pressure-sensitive adhesive layer B are laminated in this order.
The pressure-sensitive adhesive layer A is attached to a silicon wafer chip, the pressure-sensitive adhesive layer B is attached to a glass plate, and ultraviolet rays of 3000 mJ / cm 2 are applied to the pressure-sensitive adhesive layer A from the surface of the pressure-sensitive adhesive tape on the side of the pressure-sensitive adhesive layer B. The die shear strength for the silicon wafer chip after irradiation and heat treatment at 240 ° C. for 10 minutes is 3N / 9 mm 2 or more.
The pressure-sensitive adhesive layer A is attached to a silicon wafer, the pressure-sensitive adhesive layer A is irradiated with ultraviolet rays of 3000 mJ / cm 2 from the surface on the pressure-sensitive adhesive layer B side, and the silicon wafer is heat-treated at 200 ° C. for 1 hour. The 180 ° peel strength is 0.10 N / inch or more and 0.30 N / inch or less.
After the pressure-sensitive adhesive layer B is attached to a glass plate and the pressure-sensitive adhesive layer A is irradiated with ultraviolet rays of 3000 mJ / cm 2 , the horizontal load strength at a portion 10 μm from the surface layer portion of the pressure-sensitive adhesive layer A measured by SAICAS measurement is Adhesive tape that is 0.06 N / mm or more.
The adhesive tape according to claim 1, wherein the pressure-sensitive adhesive layer A has a tensile strength of 1.0 MPa or more at 23 ° C. after irradiation with ultraviolet rays of 3000 mJ / cm 2 .
The adhesive tape according to claim 1 or 2, wherein the pressure-sensitive adhesive layer A has a tensile elastic modulus of 1.0 × 10 6 Pa or more at 260 ° C. after irradiation with ultraviolet rays of 3000 mJ / cm 2 .
The pressure-sensitive adhesive layer A contains a pressure-sensitive adhesive component containing a (meth) acrylic acid alkyl ester-based polymerizable polymer having a radically polymerizable unsaturated bond in the molecule, and has a hydroxyl value and an acid value of the pressure-sensitive adhesive component. The adhesive tape according to claim 1, 2 or 3, wherein X + Y ≧ 10 when each of is XmgKOH / mg and YmgKOH / mg.
The pressure-sensitive adhesive layer A contains a pressure-sensitive adhesive component containing a (meth) acrylic acid alkyl ester-based polymerizable polymer having a radically polymerizable unsaturated bond in the molecule, and has a hydroxyl value and an acid value of the pressure-sensitive adhesive component. The adhesive tape according to claim 1, 2, 3 or 4, wherein X + Y ≦ 70, respectively, when XmgKOH / mg and YmgKOH / mg are used.
The pressure-sensitive adhesive layer A includes the pressure-sensitive adhesive component, a polymerization initiator, a silicone or fluorine compound having a functional group crosslinkable with the pressure-sensitive adhesive component, and a urethane having a functional group cross-linkable with the pressure-sensitive adhesive component. The adhesive tape according to claim 1, 2, 3, 4 or 5, which contains a compound.
The adhesive tape according to claim 1, 2, 3, 4, 5 or 6, which is used for manufacturing an electronic component.
The adhesive tape according to claim 7, which is used for manufacturing an electronic component having a thermocompression bonding step.
A step of fixing a wafer on a support via the adhesive tape according to claim 1, 2, 3, 4, 5, 6, 7 or 8, and a step of laminating a semiconductor chip on the wafer by thermocompression bonding. , Semiconductor device manufacturing method.