KR20210138332A - 전도체 본딩 방법 - Google Patents

전도체 본딩 방법 Download PDF

Info

Publication number
KR20210138332A
KR20210138332A KR1020200056539A KR20200056539A KR20210138332A KR 20210138332 A KR20210138332 A KR 20210138332A KR 1020200056539 A KR1020200056539 A KR 1020200056539A KR 20200056539 A KR20200056539 A KR 20200056539A KR 20210138332 A KR20210138332 A KR 20210138332A
Authority
KR
South Korea
Prior art keywords
conductive
conductive particle
conductor
pattern
fixing material
Prior art date
Application number
KR1020200056539A
Other languages
English (en)
Korean (ko)
Inventor
안성룡
Original Assignee
안성룡
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 안성룡 filed Critical 안성룡
Priority to KR1020200056539A priority Critical patent/KR20210138332A/ko
Priority to US17/924,949 priority patent/US20230209724A1/en
Priority to CN202080100673.8A priority patent/CN115552595A/zh
Priority to PCT/KR2020/007319 priority patent/WO2021230413A1/fr
Priority to EP20935732.6A priority patent/EP4152372A4/fr
Publication of KR20210138332A publication Critical patent/KR20210138332A/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
KR1020200056539A 2020-05-12 2020-05-12 전도체 본딩 방법 KR20210138332A (ko)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020200056539A KR20210138332A (ko) 2020-05-12 2020-05-12 전도체 본딩 방법
US17/924,949 US20230209724A1 (en) 2020-05-12 2020-06-05 Conductor bonding method
CN202080100673.8A CN115552595A (zh) 2020-05-12 2020-06-05 导电体焊接方法
PCT/KR2020/007319 WO2021230413A1 (fr) 2020-05-12 2020-06-05 Procédé de liaison de conducteur
EP20935732.6A EP4152372A4 (fr) 2020-05-12 2020-06-05 Procédé de liaison de conducteur

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020200056539A KR20210138332A (ko) 2020-05-12 2020-05-12 전도체 본딩 방법

Publications (1)

Publication Number Publication Date
KR20210138332A true KR20210138332A (ko) 2021-11-19

Family

ID=78524464

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020200056539A KR20210138332A (ko) 2020-05-12 2020-05-12 전도체 본딩 방법

Country Status (5)

Country Link
US (1) US20230209724A1 (fr)
EP (1) EP4152372A4 (fr)
KR (1) KR20210138332A (fr)
CN (1) CN115552595A (fr)
WO (1) WO2021230413A1 (fr)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04290489A (ja) * 1991-03-19 1992-10-15 Shin Etsu Polymer Co Ltd ヒートシールコネクターの製造方法
JP2888466B2 (ja) * 1992-04-07 1999-05-10 信越ポリマー株式会社 ヒートシールコネクターの製造方法
KR20070038771A (ko) * 2005-10-06 2007-04-11 엘지전자 주식회사 플라즈마 디스플레이 장치
KR101156177B1 (ko) * 2010-06-16 2012-06-18 한국생산기술연구원 전도성 입자 수용홈이 형성된 이방 도전성 필름, 전도성 입자 수용홈이 형성된 에폭시 수지를 사용한 플립 칩 접합방법 및 이를 이용한 플립 칩 패키지
WO2013089199A1 (fr) * 2011-12-16 2013-06-20 旭化成イーマテリアルズ株式会社 Puce semi-conductrice ayant un film électroconducteur anisotrope fixé, tranche semi-conductrice ayant un film électroconducteur anisotrope fixé et dispositif semi-conducteur
JP6759578B2 (ja) * 2014-12-22 2020-09-23 デクセリアルズ株式会社 異方導電性フィルム及び接続構造体
US9653425B2 (en) * 2015-08-26 2017-05-16 Apple Inc. Anisotropic conductive film structures

Also Published As

Publication number Publication date
EP4152372A4 (fr) 2024-05-29
EP4152372A1 (fr) 2023-03-22
CN115552595A (zh) 2022-12-30
WO2021230413A1 (fr) 2021-11-18
US20230209724A1 (en) 2023-06-29

Similar Documents

Publication Publication Date Title
US11226522B2 (en) Display apparatus and electronic device
US9955619B2 (en) Light emitting device, light emitting element mounting method, and light emitting element mounter
US20010012706A1 (en) Connecting structure, electro-optical device, and electronic apparatus
KR100874295B1 (ko) 표시장치 및 평면형 표시장치
JP5162979B2 (ja) 発光装置
CN1207946C (zh) 电路基板连接结构、具有该结构的液晶显示器件及安装方法
JP7096210B2 (ja) 接続体、接続体の製造方法、電子部品の接続方法、及び電子部品
KR20180050438A (ko) 이방성 도전 필름, 이방성 도전 필름의 제조 방법, 접속체의 제조 방법 및 접속 방법
TW200813961A (en) Organic light emitting diode display and method of manufacturing the same
KR20180120527A (ko) 반도체 발광 소자를 이용한 디스플레이 장치의 제조 방법
KR20000062451A (ko) 영상 장치 및 그 제조 방법
US7021946B2 (en) Connector integrated with a LED element
JP3543676B2 (ja) マルチチップの実装構造及びその実装構造の製造方法、ならびに電気光学装置及び電子機器
CN1179609C (zh) 压接连接衬底、液晶装置及电子设备
KR20210138332A (ko) 전도체 본딩 방법
US20060119263A1 (en) Double-side display device and method of making same
CN108119783B (zh) Oled发光模块
KR20200071497A (ko) 마이크로led를 이용한 전자 장치 제조방법
TW201933580A (zh) 導電薄膜、光電半導體裝置及其製造方法
US11864437B2 (en) Display device including anisotropic conductive film and method of manufacturing display device
KR100666137B1 (ko) 타일드 액정표시장치 및 그의 히트씰 실장방법
KR20080053593A (ko) 표시 패널 및 그 제조 방법
CN105474376A (zh) 半导体器件
US20230387095A1 (en) Display module and display apparatus having the same
KR100696214B1 (ko) 아우터 리드 본딩 및 테이프 오토메이티드 본딩 공정용 원레이어 복합 시트

Legal Events

Date Code Title Description
E902 Notification of reason for refusal
E601 Decision to refuse application