KR20210111693A - 프린트 배선판의 제조방법 - Google Patents

프린트 배선판의 제조방법 Download PDF

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Publication number
KR20210111693A
KR20210111693A KR1020210026432A KR20210026432A KR20210111693A KR 20210111693 A KR20210111693 A KR 20210111693A KR 1020210026432 A KR1020210026432 A KR 1020210026432A KR 20210026432 A KR20210026432 A KR 20210026432A KR 20210111693 A KR20210111693 A KR 20210111693A
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KR
South Korea
Prior art keywords
layer
resin
release layer
release
resin composition
Prior art date
Application number
KR1020210026432A
Other languages
English (en)
Korean (ko)
Inventor
마리코 미요시
Original Assignee
아지노모토 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아지노모토 가부시키가이샤 filed Critical 아지노모토 가부시키가이샤
Publication of KR20210111693A publication Critical patent/KR20210111693A/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
KR1020210026432A 2020-03-03 2021-02-26 프린트 배선판의 제조방법 KR20210111693A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020035871A JP7276199B2 (ja) 2020-03-03 2020-03-03 プリント配線板の製造方法
JPJP-P-2020-035871 2020-03-03

Publications (1)

Publication Number Publication Date
KR20210111693A true KR20210111693A (ko) 2021-09-13

Family

ID=77467617

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020210026432A KR20210111693A (ko) 2020-03-03 2021-02-26 프린트 배선판의 제조방법

Country Status (4)

Country Link
JP (1) JP7276199B2 (ja)
KR (1) KR20210111693A (ja)
CN (1) CN113347793A (ja)
TW (1) TW202142074A (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017183411A (ja) 2016-03-29 2017-10-05 味の素株式会社 プリント配線板の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4930829B2 (ja) * 2006-07-04 2012-05-16 凸版印刷株式会社 部品搭載基板およびその製造方法
KR101682886B1 (ko) * 2009-07-14 2016-12-06 아지노모토 가부시키가이샤 동박이 부착된 접착 필름
JP5633124B2 (ja) * 2009-07-24 2014-12-03 味の素株式会社 金属膜付きフィルム
JP6149440B2 (ja) * 2013-03-13 2017-06-21 味の素株式会社 多層プリント配線板の製造方法およびそれに用いるキャリア金属箔付きプリプレグ含有複合材
JP6516143B2 (ja) * 2015-01-30 2019-05-22 大日本印刷株式会社 発熱板、導電性パターンシートおよび発熱板を備えた乗り物
TWI696108B (zh) * 2015-02-13 2020-06-11 日商半導體能源研究所股份有限公司 功能面板、功能模組、發光模組、顯示模組、位置資料輸入模組、發光裝置、照明設備、顯示裝置、資料處理裝置、功能面板的製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017183411A (ja) 2016-03-29 2017-10-05 味の素株式会社 プリント配線板の製造方法

Also Published As

Publication number Publication date
JP2021141133A (ja) 2021-09-16
JP7276199B2 (ja) 2023-05-18
CN113347793A (zh) 2021-09-03
TW202142074A (zh) 2021-11-01

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