KR20210108436A - 피검 소자와의 콘택이 향상된 수직형 프로브 헤드 - Google Patents

피검 소자와의 콘택이 향상된 수직형 프로브 헤드 Download PDF

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Publication number
KR20210108436A
KR20210108436A KR1020217023265A KR20217023265A KR20210108436A KR 20210108436 A KR20210108436 A KR 20210108436A KR 1020217023265 A KR1020217023265 A KR 1020217023265A KR 20217023265 A KR20217023265 A KR 20217023265A KR 20210108436 A KR20210108436 A KR 20210108436A
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KR
South Korea
Prior art keywords
guide
contact
probe head
probe
lower guide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020217023265A
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English (en)
Korean (ko)
Inventor
스테파노 페리시
Original Assignee
테크노프로브 에스.피.에이.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 테크노프로브 에스.피.에이. filed Critical 테크노프로브 에스.피.에이.
Publication of KR20210108436A publication Critical patent/KR20210108436A/ko
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
KR1020217023265A 2018-12-27 2019-12-17 피검 소자와의 콘택이 향상된 수직형 프로브 헤드 Pending KR20210108436A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
IT102018000021253 2018-12-27
IT102018000021253A IT201800021253A1 (it) 2018-12-27 2018-12-27 Testa di misura a sonde verticali avente un contatto perfezionato con un dispositivo da testare
PCT/EP2019/085709 WO2020136045A1 (en) 2018-12-27 2019-12-17 Vertical probe head having an improved contact with a device under test

Publications (1)

Publication Number Publication Date
KR20210108436A true KR20210108436A (ko) 2021-09-02

Family

ID=66049576

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020217023265A Pending KR20210108436A (ko) 2018-12-27 2019-12-17 피검 소자와의 콘택이 향상된 수직형 프로브 헤드

Country Status (10)

Country Link
US (1) US11867723B2 (https=)
EP (1) EP3903111B1 (https=)
JP (1) JP2022515457A (https=)
KR (1) KR20210108436A (https=)
CN (1) CN113272661B (https=)
IT (1) IT201800021253A1 (https=)
PH (1) PH12021551509A1 (https=)
SG (1) SG11202106774PA (https=)
TW (1) TWI837255B (https=)
WO (1) WO2020136045A1 (https=)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102475883B1 (ko) * 2022-11-09 2022-12-08 윌테크놀러지(주) 니들 팁의 길이조절을 위한 가변형 스페이서를 갖는 니들블럭
KR20230121371A (ko) * 2022-02-11 2023-08-18 (주)티에스이 프리로드형 프로브 헤드
KR20240015027A (ko) * 2022-07-26 2024-02-02 스타 테크놀로지스, 인코포레이션 가이드 플레이트 구조 및 프로브 어레이
KR20240055555A (ko) * 2022-10-20 2024-04-29 주식회사 에이엠에스티 프로브 카드 제작 방법
KR20240139725A (ko) * 2023-03-15 2024-09-24 (주)티에스이 반도체 소자 테스트용 프로브 헤드
KR20240160510A (ko) * 2023-05-02 2024-11-11 (주)티에스이 반도체 소자 테스트용 프로브 헤드

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT202000020407A1 (it) 2020-08-25 2022-02-25 Technoprobe Spa Testa di misura per il test di dispositivi elettronici comprendenti elementi ottici integrati
IT202100032882A1 (it) * 2021-12-29 2023-06-29 Technoprobe Spa Sonda di contatto per teste di misura di dispositivi elettronici e relativa testa di misura
EP4261547A1 (en) * 2022-04-12 2023-10-18 Microtest S.p.A. Testing head with vertical probes for a probe card and corresponding method of assembly
KR102901238B1 (ko) * 2022-12-16 2025-12-17 주식회사 피코프리시젼 테스트 장치
CN119199206A (zh) * 2023-06-27 2024-12-27 迪科特测试科技(苏州)有限公司 包含不同长度探针组的探针卡结构
CN119199205A (zh) * 2023-06-27 2024-12-27 迪科特测试科技(苏州)有限公司 探针卡结构
KR102843592B1 (ko) * 2023-07-07 2025-08-07 윌테크놀러지(주) 초단 길이의 좌굴 mems 프로브를 갖는 반도체 패키지 테스트 장치

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US4506215A (en) * 1981-06-30 1985-03-19 International Business Machines Corporation Modular test probe
US4622514A (en) * 1984-06-15 1986-11-11 Ibm Multiple mode buckling beam probe assembly
US5367254A (en) * 1993-02-01 1994-11-22 International Business Machines Corporation Test probe assembly using buckling wire probes within tubes having opposed overlapping slots
DE69326609T2 (de) * 1993-07-23 2000-04-27 International Business Machines Corp., Armonk Testsondenanordnung mit Knicknadeln
US6404211B2 (en) * 1999-02-11 2002-06-11 International Business Machines Corporation Metal buckling beam probe
IT1317517B1 (it) * 2000-05-11 2003-07-09 Technoprobe S R L Testa di misura per microstrutture
ITMI20012574A1 (it) * 2001-12-06 2003-06-06 Technoprobe S R L Sonda di contattatura per una testa di misura
PL1580562T3 (pl) * 2004-03-24 2008-02-29 Technoprobe Spa Sonda kontaktowa do głowicy testującej
US7180318B1 (en) * 2004-10-15 2007-02-20 Xilinx, Inc. Multi-pitch test probe assembly for testing semiconductor dies having contact pads
JP5337341B2 (ja) * 2006-11-30 2013-11-06 株式会社日本マイクロニクス 電気的接続装置およびその組み立て方法
JP4539681B2 (ja) * 2007-06-04 2010-09-08 三菱電機株式会社 ウエハテスト用プローブカード
CN107003335B (zh) * 2015-01-04 2020-05-22 金日 接触测试装置
WO2016146499A1 (en) * 2015-03-13 2016-09-22 Technoprobe S.P.A. Testing head with vertical probes having an improved sliding movement within respective guide holes and correct holding of the probes within the testing head under different operative conditions
WO2016177850A1 (en) * 2015-05-07 2016-11-10 Technoprobe S.P.A. Testing head having vertical probes, in particular for reduced pitch applications
TWI713807B (zh) * 2016-12-16 2020-12-21 義大利商探針科技公司 具有增進的頻率性質的測試頭
IT201700017061A1 (it) * 2017-02-15 2018-08-15 Technoprobe Spa Scheda di misura perfezionata per applicazioni ad alta frequenza

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230121371A (ko) * 2022-02-11 2023-08-18 (주)티에스이 프리로드형 프로브 헤드
KR20240015027A (ko) * 2022-07-26 2024-02-02 스타 테크놀로지스, 인코포레이션 가이드 플레이트 구조 및 프로브 어레이
KR20240055555A (ko) * 2022-10-20 2024-04-29 주식회사 에이엠에스티 프로브 카드 제작 방법
KR102475883B1 (ko) * 2022-11-09 2022-12-08 윌테크놀러지(주) 니들 팁의 길이조절을 위한 가변형 스페이서를 갖는 니들블럭
KR20240139725A (ko) * 2023-03-15 2024-09-24 (주)티에스이 반도체 소자 테스트용 프로브 헤드
KR20240160510A (ko) * 2023-05-02 2024-11-11 (주)티에스이 반도체 소자 테스트용 프로브 헤드

Also Published As

Publication number Publication date
CN113272661A (zh) 2021-08-17
CN113272661B (zh) 2024-09-27
SG11202106774PA (en) 2021-07-29
TW202024647A (zh) 2020-07-01
US20210318355A1 (en) 2021-10-14
IT201800021253A1 (it) 2020-06-27
EP3903111B1 (en) 2024-08-07
US11867723B2 (en) 2024-01-09
EP3903111A1 (en) 2021-11-03
PH12021551509A1 (en) 2022-03-07
JP2022515457A (ja) 2022-02-18
TWI837255B (zh) 2024-04-01
WO2020136045A1 (en) 2020-07-02

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Patent event date: 20210722

Patent event code: PA01051R01D

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PE0902 Notice of grounds for rejection

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Patent event date: 20240923

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Patent event date: 20250401