CN113272661B - 具有与被测器件的改进的接触的垂直探针头 - Google Patents
具有与被测器件的改进的接触的垂直探针头 Download PDFInfo
- Publication number
- CN113272661B CN113272661B CN201980086156.7A CN201980086156A CN113272661B CN 113272661 B CN113272661 B CN 113272661B CN 201980086156 A CN201980086156 A CN 201980086156A CN 113272661 B CN113272661 B CN 113272661B
- Authority
- CN
- China
- Prior art keywords
- contact
- probe
- lower guide
- guide member
- guide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT102018000021253 | 2018-12-27 | ||
| IT102018000021253A IT201800021253A1 (it) | 2018-12-27 | 2018-12-27 | Testa di misura a sonde verticali avente un contatto perfezionato con un dispositivo da testare |
| PCT/EP2019/085709 WO2020136045A1 (en) | 2018-12-27 | 2019-12-17 | Vertical probe head having an improved contact with a device under test |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113272661A CN113272661A (zh) | 2021-08-17 |
| CN113272661B true CN113272661B (zh) | 2024-09-27 |
Family
ID=66049576
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201980086156.7A Active CN113272661B (zh) | 2018-12-27 | 2019-12-17 | 具有与被测器件的改进的接触的垂直探针头 |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US11867723B2 (https=) |
| EP (1) | EP3903111B1 (https=) |
| JP (1) | JP2022515457A (https=) |
| KR (1) | KR20210108436A (https=) |
| CN (1) | CN113272661B (https=) |
| IT (1) | IT201800021253A1 (https=) |
| PH (1) | PH12021551509A1 (https=) |
| SG (1) | SG11202106774PA (https=) |
| TW (1) | TWI837255B (https=) |
| WO (1) | WO2020136045A1 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20250052783A1 (en) * | 2021-12-29 | 2025-02-13 | Technoprobe S.P.A. | Contact probe for probe heads of electronic devices and corresponding probe head |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IT202000020407A1 (it) | 2020-08-25 | 2022-02-25 | Technoprobe Spa | Testa di misura per il test di dispositivi elettronici comprendenti elementi ottici integrati |
| KR102751716B1 (ko) * | 2022-02-11 | 2025-01-09 | (주)티에스이 | 프리로드형 프로브 헤드 |
| EP4261547A1 (en) * | 2022-04-12 | 2023-10-18 | Microtest S.p.A. | Testing head with vertical probes for a probe card and corresponding method of assembly |
| TWI831307B (zh) * | 2022-07-26 | 2024-02-01 | 思達科技股份有限公司 | 導板結構及探針陣列 |
| KR102847367B1 (ko) * | 2022-10-20 | 2025-08-18 | 주식회사 에이엠에스티 | 프로브 카드 제작 방법 |
| KR102475883B1 (ko) * | 2022-11-09 | 2022-12-08 | 윌테크놀러지(주) | 니들 팁의 길이조절을 위한 가변형 스페이서를 갖는 니들블럭 |
| KR102901238B1 (ko) * | 2022-12-16 | 2025-12-17 | 주식회사 피코프리시젼 | 테스트 장치 |
| KR102802787B1 (ko) * | 2023-03-15 | 2025-05-07 | (주)티에스이 | 반도체 소자 테스트용 프로브 헤드 |
| KR102866843B1 (ko) * | 2023-05-02 | 2025-10-01 | (주)티에스이 | 반도체 소자 테스트용 프로브 헤드 |
| CN119199206A (zh) * | 2023-06-27 | 2024-12-27 | 迪科特测试科技(苏州)有限公司 | 包含不同长度探针组的探针卡结构 |
| CN119199205A (zh) * | 2023-06-27 | 2024-12-27 | 迪科特测试科技(苏州)有限公司 | 探针卡结构 |
| KR102843592B1 (ko) * | 2023-07-07 | 2025-08-07 | 윌테크놀러지(주) | 초단 길이의 좌굴 mems 프로브를 갖는 반도체 패키지 테스트 장치 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0164672A2 (en) * | 1984-06-15 | 1985-12-18 | International Business Machines Corporation | A multiple mode buckling beam probe assembly |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4506215A (en) * | 1981-06-30 | 1985-03-19 | International Business Machines Corporation | Modular test probe |
| US5367254A (en) * | 1993-02-01 | 1994-11-22 | International Business Machines Corporation | Test probe assembly using buckling wire probes within tubes having opposed overlapping slots |
| DE69326609T2 (de) * | 1993-07-23 | 2000-04-27 | International Business Machines Corp., Armonk | Testsondenanordnung mit Knicknadeln |
| US6404211B2 (en) * | 1999-02-11 | 2002-06-11 | International Business Machines Corporation | Metal buckling beam probe |
| IT1317517B1 (it) * | 2000-05-11 | 2003-07-09 | Technoprobe S R L | Testa di misura per microstrutture |
| ITMI20012574A1 (it) * | 2001-12-06 | 2003-06-06 | Technoprobe S R L | Sonda di contattatura per una testa di misura |
| PL1580562T3 (pl) * | 2004-03-24 | 2008-02-29 | Technoprobe Spa | Sonda kontaktowa do głowicy testującej |
| US7180318B1 (en) * | 2004-10-15 | 2007-02-20 | Xilinx, Inc. | Multi-pitch test probe assembly for testing semiconductor dies having contact pads |
| JP5337341B2 (ja) * | 2006-11-30 | 2013-11-06 | 株式会社日本マイクロニクス | 電気的接続装置およびその組み立て方法 |
| JP4539681B2 (ja) * | 2007-06-04 | 2010-09-08 | 三菱電機株式会社 | ウエハテスト用プローブカード |
| CN107003335B (zh) * | 2015-01-04 | 2020-05-22 | 金日 | 接触测试装置 |
| WO2016146499A1 (en) * | 2015-03-13 | 2016-09-22 | Technoprobe S.P.A. | Testing head with vertical probes having an improved sliding movement within respective guide holes and correct holding of the probes within the testing head under different operative conditions |
| WO2016177850A1 (en) * | 2015-05-07 | 2016-11-10 | Technoprobe S.P.A. | Testing head having vertical probes, in particular for reduced pitch applications |
| TWI713807B (zh) * | 2016-12-16 | 2020-12-21 | 義大利商探針科技公司 | 具有增進的頻率性質的測試頭 |
| IT201700017061A1 (it) * | 2017-02-15 | 2018-08-15 | Technoprobe Spa | Scheda di misura perfezionata per applicazioni ad alta frequenza |
-
2018
- 2018-12-27 IT IT102018000021253A patent/IT201800021253A1/it unknown
-
2019
- 2019-12-17 PH PH1/2021/551509A patent/PH12021551509A1/en unknown
- 2019-12-17 EP EP19818146.3A patent/EP3903111B1/en active Active
- 2019-12-17 JP JP2021537176A patent/JP2022515457A/ja active Pending
- 2019-12-17 WO PCT/EP2019/085709 patent/WO2020136045A1/en not_active Ceased
- 2019-12-17 KR KR1020217023265A patent/KR20210108436A/ko active Pending
- 2019-12-17 CN CN201980086156.7A patent/CN113272661B/zh active Active
- 2019-12-17 SG SG11202106774PA patent/SG11202106774PA/en unknown
- 2019-12-18 TW TW108146490A patent/TWI837255B/zh active
-
2021
- 2021-06-24 US US17/357,833 patent/US11867723B2/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0164672A2 (en) * | 1984-06-15 | 1985-12-18 | International Business Machines Corporation | A multiple mode buckling beam probe assembly |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20250052783A1 (en) * | 2021-12-29 | 2025-02-13 | Technoprobe S.P.A. | Contact probe for probe heads of electronic devices and corresponding probe head |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113272661A (zh) | 2021-08-17 |
| KR20210108436A (ko) | 2021-09-02 |
| SG11202106774PA (en) | 2021-07-29 |
| TW202024647A (zh) | 2020-07-01 |
| US20210318355A1 (en) | 2021-10-14 |
| IT201800021253A1 (it) | 2020-06-27 |
| EP3903111B1 (en) | 2024-08-07 |
| US11867723B2 (en) | 2024-01-09 |
| EP3903111A1 (en) | 2021-11-03 |
| PH12021551509A1 (en) | 2022-03-07 |
| JP2022515457A (ja) | 2022-02-18 |
| TWI837255B (zh) | 2024-04-01 |
| WO2020136045A1 (en) | 2020-07-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |