TWI837255B - 與待測裝置之間改善的接觸的垂直探針頭 - Google Patents

與待測裝置之間改善的接觸的垂直探針頭 Download PDF

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Publication number
TWI837255B
TWI837255B TW108146490A TW108146490A TWI837255B TW I837255 B TWI837255 B TW I837255B TW 108146490 A TW108146490 A TW 108146490A TW 108146490 A TW108146490 A TW 108146490A TW I837255 B TWI837255 B TW I837255B
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TW
Taiwan
Prior art keywords
guide plate
contact
lower guide
probes
guide holes
Prior art date
Application number
TW108146490A
Other languages
English (en)
Chinese (zh)
Other versions
TW202024647A (zh
Inventor
史提伐諾 費利希
Original Assignee
義大利商探針科技公司
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Application filed by 義大利商探針科技公司 filed Critical 義大利商探針科技公司
Publication of TW202024647A publication Critical patent/TW202024647A/zh
Application granted granted Critical
Publication of TWI837255B publication Critical patent/TWI837255B/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW108146490A 2018-12-27 2019-12-18 與待測裝置之間改善的接觸的垂直探針頭 TWI837255B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IT102018000021253 2018-12-27
IT102018000021253A IT201800021253A1 (it) 2018-12-27 2018-12-27 Testa di misura a sonde verticali avente un contatto perfezionato con un dispositivo da testare

Publications (2)

Publication Number Publication Date
TW202024647A TW202024647A (zh) 2020-07-01
TWI837255B true TWI837255B (zh) 2024-04-01

Family

ID=66049576

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108146490A TWI837255B (zh) 2018-12-27 2019-12-18 與待測裝置之間改善的接觸的垂直探針頭

Country Status (10)

Country Link
US (1) US11867723B2 (https=)
EP (1) EP3903111B1 (https=)
JP (1) JP2022515457A (https=)
KR (1) KR20210108436A (https=)
CN (1) CN113272661B (https=)
IT (1) IT201800021253A1 (https=)
PH (1) PH12021551509A1 (https=)
SG (1) SG11202106774PA (https=)
TW (1) TWI837255B (https=)
WO (1) WO2020136045A1 (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT202000020407A1 (it) 2020-08-25 2022-02-25 Technoprobe Spa Testa di misura per il test di dispositivi elettronici comprendenti elementi ottici integrati
IT202100032882A1 (it) * 2021-12-29 2023-06-29 Technoprobe Spa Sonda di contatto per teste di misura di dispositivi elettronici e relativa testa di misura
KR102751716B1 (ko) * 2022-02-11 2025-01-09 (주)티에스이 프리로드형 프로브 헤드
EP4261547A1 (en) * 2022-04-12 2023-10-18 Microtest S.p.A. Testing head with vertical probes for a probe card and corresponding method of assembly
TWI831307B (zh) * 2022-07-26 2024-02-01 思達科技股份有限公司 導板結構及探針陣列
KR102847367B1 (ko) * 2022-10-20 2025-08-18 주식회사 에이엠에스티 프로브 카드 제작 방법
KR102475883B1 (ko) * 2022-11-09 2022-12-08 윌테크놀러지(주) 니들 팁의 길이조절을 위한 가변형 스페이서를 갖는 니들블럭
KR102901238B1 (ko) * 2022-12-16 2025-12-17 주식회사 피코프리시젼 테스트 장치
KR102802787B1 (ko) * 2023-03-15 2025-05-07 (주)티에스이 반도체 소자 테스트용 프로브 헤드
KR102866843B1 (ko) * 2023-05-02 2025-10-01 (주)티에스이 반도체 소자 테스트용 프로브 헤드
CN119199206A (zh) * 2023-06-27 2024-12-27 迪科特测试科技(苏州)有限公司 包含不同长度探针组的探针卡结构
CN119199205A (zh) * 2023-06-27 2024-12-27 迪科特测试科技(苏州)有限公司 探针卡结构
KR102843592B1 (ko) * 2023-07-07 2025-08-07 윌테크놀러지(주) 초단 길이의 좌굴 mems 프로브를 갖는 반도체 패키지 테스트 장치

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0164672A2 (en) * 1984-06-15 1985-12-18 International Business Machines Corporation A multiple mode buckling beam probe assembly
US20010011897A1 (en) * 1999-02-11 2001-08-09 Harvey C. Hamel Metal buckling beam probe
JP2008139034A (ja) * 2006-11-30 2008-06-19 Micronics Japan Co Ltd 電気的接続装置およびその組み立て方法
TW201643441A (zh) * 2015-05-07 2016-12-16 探針科技公司 特別用於減少間距應用的具有垂直探針的測試頭
TW201833564A (zh) * 2016-12-16 2018-09-16 義大利商探針科技公司 具有增進的頻率性質的測試頭

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4506215A (en) * 1981-06-30 1985-03-19 International Business Machines Corporation Modular test probe
US5367254A (en) * 1993-02-01 1994-11-22 International Business Machines Corporation Test probe assembly using buckling wire probes within tubes having opposed overlapping slots
DE69326609T2 (de) * 1993-07-23 2000-04-27 International Business Machines Corp., Armonk Testsondenanordnung mit Knicknadeln
IT1317517B1 (it) * 2000-05-11 2003-07-09 Technoprobe S R L Testa di misura per microstrutture
ITMI20012574A1 (it) * 2001-12-06 2003-06-06 Technoprobe S R L Sonda di contattatura per una testa di misura
PL1580562T3 (pl) * 2004-03-24 2008-02-29 Technoprobe Spa Sonda kontaktowa do głowicy testującej
US7180318B1 (en) * 2004-10-15 2007-02-20 Xilinx, Inc. Multi-pitch test probe assembly for testing semiconductor dies having contact pads
JP4539681B2 (ja) * 2007-06-04 2010-09-08 三菱電機株式会社 ウエハテスト用プローブカード
CN107003335B (zh) * 2015-01-04 2020-05-22 金日 接触测试装置
WO2016146499A1 (en) * 2015-03-13 2016-09-22 Technoprobe S.P.A. Testing head with vertical probes having an improved sliding movement within respective guide holes and correct holding of the probes within the testing head under different operative conditions
IT201700017061A1 (it) * 2017-02-15 2018-08-15 Technoprobe Spa Scheda di misura perfezionata per applicazioni ad alta frequenza

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0164672A2 (en) * 1984-06-15 1985-12-18 International Business Machines Corporation A multiple mode buckling beam probe assembly
US20010011897A1 (en) * 1999-02-11 2001-08-09 Harvey C. Hamel Metal buckling beam probe
JP2008139034A (ja) * 2006-11-30 2008-06-19 Micronics Japan Co Ltd 電気的接続装置およびその組み立て方法
TW201643441A (zh) * 2015-05-07 2016-12-16 探針科技公司 特別用於減少間距應用的具有垂直探針的測試頭
TW201833564A (zh) * 2016-12-16 2018-09-16 義大利商探針科技公司 具有增進的頻率性質的測試頭

Also Published As

Publication number Publication date
CN113272661A (zh) 2021-08-17
KR20210108436A (ko) 2021-09-02
CN113272661B (zh) 2024-09-27
SG11202106774PA (en) 2021-07-29
TW202024647A (zh) 2020-07-01
US20210318355A1 (en) 2021-10-14
IT201800021253A1 (it) 2020-06-27
EP3903111B1 (en) 2024-08-07
US11867723B2 (en) 2024-01-09
EP3903111A1 (en) 2021-11-03
PH12021551509A1 (en) 2022-03-07
JP2022515457A (ja) 2022-02-18
WO2020136045A1 (en) 2020-07-02

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