IT201800021253A1 - Testa di misura a sonde verticali avente un contatto perfezionato con un dispositivo da testare - Google Patents

Testa di misura a sonde verticali avente un contatto perfezionato con un dispositivo da testare Download PDF

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Publication number
IT201800021253A1
IT201800021253A1 IT102018000021253A IT201800021253A IT201800021253A1 IT 201800021253 A1 IT201800021253 A1 IT 201800021253A1 IT 102018000021253 A IT102018000021253 A IT 102018000021253A IT 201800021253 A IT201800021253 A IT 201800021253A IT 201800021253 A1 IT201800021253 A1 IT 201800021253A1
Authority
IT
Italy
Prior art keywords
guide
contact
measuring head
guide holes
probes
Prior art date
Application number
IT102018000021253A
Other languages
English (en)
Italian (it)
Inventor
Stefano Felici
Original Assignee
Technoprobe Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Technoprobe Spa filed Critical Technoprobe Spa
Priority to IT102018000021253A priority Critical patent/IT201800021253A1/it
Priority to JP2021537176A priority patent/JP2022515457A/ja
Priority to PH1/2021/551509A priority patent/PH12021551509A1/en
Priority to KR1020217023265A priority patent/KR20210108436A/ko
Priority to EP19818146.3A priority patent/EP3903111B1/en
Priority to SG11202106774PA priority patent/SG11202106774PA/en
Priority to CN201980086156.7A priority patent/CN113272661B/zh
Priority to PCT/EP2019/085709 priority patent/WO2020136045A1/en
Priority to TW108146490A priority patent/TWI837255B/zh
Publication of IT201800021253A1 publication Critical patent/IT201800021253A1/it
Priority to US17/357,833 priority patent/US11867723B2/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
IT102018000021253A 2018-12-27 2018-12-27 Testa di misura a sonde verticali avente un contatto perfezionato con un dispositivo da testare IT201800021253A1 (it)

Priority Applications (10)

Application Number Priority Date Filing Date Title
IT102018000021253A IT201800021253A1 (it) 2018-12-27 2018-12-27 Testa di misura a sonde verticali avente un contatto perfezionato con un dispositivo da testare
JP2021537176A JP2022515457A (ja) 2018-12-27 2019-12-17 被試験デバイスとの改善された接触を有する垂直プローブヘッド
PH1/2021/551509A PH12021551509A1 (en) 2018-12-27 2019-12-17 Vertical probe head having an improved contact with a device under test
KR1020217023265A KR20210108436A (ko) 2018-12-27 2019-12-17 피검 소자와의 콘택이 향상된 수직형 프로브 헤드
EP19818146.3A EP3903111B1 (en) 2018-12-27 2019-12-17 Vertical probe head having an improved contact with a device under test
SG11202106774PA SG11202106774PA (en) 2018-12-27 2019-12-17 Vertical probe head having an improved contact with a device under test
CN201980086156.7A CN113272661B (zh) 2018-12-27 2019-12-17 具有与被测器件的改进的接触的垂直探针头
PCT/EP2019/085709 WO2020136045A1 (en) 2018-12-27 2019-12-17 Vertical probe head having an improved contact with a device under test
TW108146490A TWI837255B (zh) 2018-12-27 2019-12-18 與待測裝置之間改善的接觸的垂直探針頭
US17/357,833 US11867723B2 (en) 2018-12-27 2021-06-24 Vertical probe head having an improved contact with a device under test

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT102018000021253A IT201800021253A1 (it) 2018-12-27 2018-12-27 Testa di misura a sonde verticali avente un contatto perfezionato con un dispositivo da testare

Publications (1)

Publication Number Publication Date
IT201800021253A1 true IT201800021253A1 (it) 2020-06-27

Family

ID=66049576

Family Applications (1)

Application Number Title Priority Date Filing Date
IT102018000021253A IT201800021253A1 (it) 2018-12-27 2018-12-27 Testa di misura a sonde verticali avente un contatto perfezionato con un dispositivo da testare

Country Status (10)

Country Link
US (1) US11867723B2 (https=)
EP (1) EP3903111B1 (https=)
JP (1) JP2022515457A (https=)
KR (1) KR20210108436A (https=)
CN (1) CN113272661B (https=)
IT (1) IT201800021253A1 (https=)
PH (1) PH12021551509A1 (https=)
SG (1) SG11202106774PA (https=)
TW (1) TWI837255B (https=)
WO (1) WO2020136045A1 (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT202000020407A1 (it) 2020-08-25 2022-02-25 Technoprobe Spa Testa di misura per il test di dispositivi elettronici comprendenti elementi ottici integrati
IT202100032882A1 (it) * 2021-12-29 2023-06-29 Technoprobe Spa Sonda di contatto per teste di misura di dispositivi elettronici e relativa testa di misura
KR102751716B1 (ko) * 2022-02-11 2025-01-09 (주)티에스이 프리로드형 프로브 헤드
EP4261547A1 (en) * 2022-04-12 2023-10-18 Microtest S.p.A. Testing head with vertical probes for a probe card and corresponding method of assembly
TWI831307B (zh) * 2022-07-26 2024-02-01 思達科技股份有限公司 導板結構及探針陣列
KR102847367B1 (ko) * 2022-10-20 2025-08-18 주식회사 에이엠에스티 프로브 카드 제작 방법
KR102475883B1 (ko) * 2022-11-09 2022-12-08 윌테크놀러지(주) 니들 팁의 길이조절을 위한 가변형 스페이서를 갖는 니들블럭
KR102901238B1 (ko) * 2022-12-16 2025-12-17 주식회사 피코프리시젼 테스트 장치
KR102802787B1 (ko) * 2023-03-15 2025-05-07 (주)티에스이 반도체 소자 테스트용 프로브 헤드
KR102866843B1 (ko) * 2023-05-02 2025-10-01 (주)티에스이 반도체 소자 테스트용 프로브 헤드
CN119199206A (zh) * 2023-06-27 2024-12-27 迪科特测试科技(苏州)有限公司 包含不同长度探针组的探针卡结构
CN119199205A (zh) * 2023-06-27 2024-12-27 迪科特测试科技(苏州)有限公司 探针卡结构
KR102843592B1 (ko) * 2023-07-07 2025-08-07 윌테크놀러지(주) 초단 길이의 좌굴 mems 프로브를 갖는 반도체 패키지 테스트 장치

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0164672A2 (en) * 1984-06-15 1985-12-18 International Business Machines Corporation A multiple mode buckling beam probe assembly
US20010011897A1 (en) * 1999-02-11 2001-08-09 Harvey C. Hamel Metal buckling beam probe
US7180318B1 (en) * 2004-10-15 2007-02-20 Xilinx, Inc. Multi-pitch test probe assembly for testing semiconductor dies having contact pads
JP2008139034A (ja) * 2006-11-30 2008-06-19 Micronics Japan Co Ltd 電気的接続装置およびその組み立て方法
US20180003767A1 (en) * 2015-03-13 2018-01-04 Technoprobe S.P.A. Testing head comprising vertical probes

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4506215A (en) * 1981-06-30 1985-03-19 International Business Machines Corporation Modular test probe
US5367254A (en) * 1993-02-01 1994-11-22 International Business Machines Corporation Test probe assembly using buckling wire probes within tubes having opposed overlapping slots
DE69326609T2 (de) * 1993-07-23 2000-04-27 International Business Machines Corp., Armonk Testsondenanordnung mit Knicknadeln
IT1317517B1 (it) * 2000-05-11 2003-07-09 Technoprobe S R L Testa di misura per microstrutture
ITMI20012574A1 (it) * 2001-12-06 2003-06-06 Technoprobe S R L Sonda di contattatura per una testa di misura
PL1580562T3 (pl) * 2004-03-24 2008-02-29 Technoprobe Spa Sonda kontaktowa do głowicy testującej
JP4539681B2 (ja) * 2007-06-04 2010-09-08 三菱電機株式会社 ウエハテスト用プローブカード
CN107003335B (zh) * 2015-01-04 2020-05-22 金日 接触测试装置
WO2016177850A1 (en) * 2015-05-07 2016-11-10 Technoprobe S.P.A. Testing head having vertical probes, in particular for reduced pitch applications
TWI713807B (zh) * 2016-12-16 2020-12-21 義大利商探針科技公司 具有增進的頻率性質的測試頭
IT201700017061A1 (it) * 2017-02-15 2018-08-15 Technoprobe Spa Scheda di misura perfezionata per applicazioni ad alta frequenza

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0164672A2 (en) * 1984-06-15 1985-12-18 International Business Machines Corporation A multiple mode buckling beam probe assembly
US20010011897A1 (en) * 1999-02-11 2001-08-09 Harvey C. Hamel Metal buckling beam probe
US7180318B1 (en) * 2004-10-15 2007-02-20 Xilinx, Inc. Multi-pitch test probe assembly for testing semiconductor dies having contact pads
JP2008139034A (ja) * 2006-11-30 2008-06-19 Micronics Japan Co Ltd 電気的接続装置およびその組み立て方法
US20180003767A1 (en) * 2015-03-13 2018-01-04 Technoprobe S.P.A. Testing head comprising vertical probes

Also Published As

Publication number Publication date
CN113272661A (zh) 2021-08-17
KR20210108436A (ko) 2021-09-02
CN113272661B (zh) 2024-09-27
SG11202106774PA (en) 2021-07-29
TW202024647A (zh) 2020-07-01
US20210318355A1 (en) 2021-10-14
EP3903111B1 (en) 2024-08-07
US11867723B2 (en) 2024-01-09
EP3903111A1 (en) 2021-11-03
PH12021551509A1 (en) 2022-03-07
JP2022515457A (ja) 2022-02-18
TWI837255B (zh) 2024-04-01
WO2020136045A1 (en) 2020-07-02

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