KR20210094690A - Test tray and test handler - Google Patents

Abstract

A test tray according to an embodiment of the present invention includes a main body having a plurality of seating grooves of different sizes for accommodating a semiconductor device; inserts respectively formed on one side and the other side of the inner side of the seating groove to seat the semiconductor device; and a clip that is formed to be connected to the insert and supports the semiconductor device seated on the insert from the bottom. An object of the present invention is to provide a test tray and test handler that can respond to semiconductors of various standards.

Description

TEST TRAY AND TEST HANDLER

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to semiconductor devices, and more particularly, to a test tray and a test handler.

Semiconductor devices used as memory for computers, notebook computers, and servers have various specifications in addition to SO-DIMM, UB-DIMM, REG-DIMM, LR-DIMM, and VLP-DIMM. As such, since semiconductor devices are not produced in a single standard, test handlers for testing semiconductor devices are separately prepared for each standard in order to respond to semiconductor devices of various standards.

Accordingly, since test handlers are provided for each standard of a semiconductor device, unnecessary equipment investment cost increases, and a space for installing equipment for each standard of a semiconductor device must be secured.

An embodiment of the present invention is to provide a test tray and a test handler capable of responding to semiconductors of various standards with a single device.

A test tray according to an embodiment of the present invention includes a body having a plurality of seating grooves of different sizes for accommodating semiconductor devices; inserts respectively formed on one side and the other side of the inner side of the seating groove to seat the semiconductor device; and a clip formed to be connected to the insert and configured to support a semiconductor device seated on the insert from a lower side.

In addition, the test tray is formed to be connected to the insert and further includes a fixing part for fixing the semiconductor device seated on the insert, wherein the fixing part fixes the semiconductor device seated on the insert from both sides, respectively, or or a lever for unlocking; and a spring positioned outside the lever to press both sides of the semiconductor device in an inward direction when fixing the semiconductor device or releasing the pressure when releasing the fixing of the semiconductor device.

A test handler according to an embodiment of the present invention includes a test tray accommodating a plurality of standard semiconductor devices; and a transport unit supporting the test tray and transporting it along the test process area.

In addition, the test handler may include: a tester for performing a test on the semiconductor device accommodated in the test tray; and an aligning unit for aligning a position of the test tray so that the semiconductor device is aligned with the correct position for testing according to the standard of the semiconductor device.

In addition, the test handler may include: a loading and unloading unit positioned at the entrance and exit of the test handler to load the customer tray in which the semiconductor device is accommodated, or to unload the customer tray in which the semiconductor device has been completed; a loading unit for loading the customer tray delivered from the loading and unloading unit or the transmission unit; and a delivery unit that picks up the semiconductor device from the customer tray and delivers it to the test tray, or picks up a semiconductor device that has been tested and delivers it to the customer tray.

According to the present embodiments, since the test handler for a semiconductor device can respond to semiconductor devices of various standards with a single device, the time required for a corresponding process can be shortened, thereby reducing related costs. there is.

In addition, the present embodiment can be expected to have the effect of efficiently utilizing the installation space of the equipment by efficiently designing the circulation path of the test tray used for testing the semiconductor device.

In addition, the present embodiment can be expected to have the effect of improving the productivity by ensuring the continuity of the test process.

1 is a view showing the appearance of a test tray according to an embodiment of the present invention.
FIG. 2 is a view showing in detail a part of the test tray of FIG. 1 .
3 is a view illustrating an example of a state in which a semiconductor device is seated on the test tray of FIG. 1 .
4, 5A, and 5B are views illustrating in detail a part of the test tray of FIG. 3 .
6 is a diagram illustrating a configuration of a test handler according to an embodiment of the present invention.
7 is a view showing in detail a rotator according to an embodiment of the present invention.
8 to 10 are views showing in detail a presizer according to an embodiment of the present invention.
11 and 12 are views illustrating in detail an alignment part of a test handler according to an embodiment of the present invention.
13 is a diagram illustrating in detail a location where a test handler is unloaded according to an embodiment of the present invention.

Hereinafter, a preferred embodiment of the present invention will be described based on the accompanying drawings.

1 is a view showing the appearance of a test tray according to an embodiment of the present invention.

Hereinafter, FIGS. 2 showing a part of the test tray of FIG. 1 in detail, FIGS. 3 showing an example of a state in which a semiconductor device is seated on the test tray of FIG. 1 , and FIG. 4 showing a part of the test tray of FIG. 3 in detail , will be described with reference to FIGS. 5A and 5B.

First, in the following description, a semiconductor device may be a memory for a computer, a notebook computer, a server, such as SO-DIMM, UB-DIMM, REG-DIMM, LR-DIMM, and VLP-DIMM. As is known, these semiconductor devices may have different sizes, such as width and length, depending on their type.

Referring to FIG. 1 , the test tray 10 may include a body 11 , an insert 150 , a clip 16 , and a fixing unit.

The body 11 may have a plurality of seating grooves 12 and 13 having different sizes for accommodating the semiconductor device 20 .

The seating grooves 12 and 13 may have a shape that is penetrated vertically so that a tester (not shown) to be described later can electrically connect to the semiconductor device 20 .

A plurality of seating grooves 12 and 13 may be formed with different lengths to correspond to the specifications of various semiconductor devices 20 .

In the present embodiment, the test tray 10 has two types of seating grooves 12 and 13 alternately formed to accommodate two types of semiconductor devices, and spacing between adjacent seating grooves 12 and 13 is provided. is exemplified as having the same pitch (P in FIG. 1 ), but is not limited thereto, and the specification, pitch, number, and arrangement of the seating grooves 12 and 13 can be designed according to the specifications of the semiconductor device 20 . may be subject to change.

For example, a single test tray 10 can accommodate 16 semiconductor devices (Rdimm, Sdimm) of various standards at the same time. In this case, the number of accommodating semiconductor devices 20 is not limited to 16ea and may be changed according to an operator.

In this state, as shown in FIG. 6 , since a tester 700 to be described below can simultaneously perform a test on two test trays 10 , a total of 32 semiconductor devices 20 at a time test can be performed. In this case, it is also possible to change the tester 700 to perform a test process on the test tray 10 in addition to the two test trays 10 according to the operator's needs.

2 to 4 , the insert 15 may be respectively formed on one side and the other side of the inner side of the seating grooves 12 and 13 to seat the semiconductor device 20 .

That is, the insert 15 is formed inside the seating grooves 12 and 13 to firmly clamp the semiconductor device 20 accommodated in the seating grooves 12 and 13 .

The insert 15 is made of a flexible material to prevent damage such as scratches that may be applied to the semiconductor device 20 in advance.

Referring to FIG. 4 , the clip 16 is formed to be connected to the insert 15 and may be configured to support the semiconductor device 20 seated on the insert 15 from the bottom.

Specifically, the clip 16 is formed to extend in an annular shape in the downward direction on the side in contact with the semiconductor element 20 among both sides of the single insert 15 , and inserts the semiconductor element 20 into the insert 15 . support from the bottom.

Referring to FIGS. 5A and 5B , the fixing parts 17 and 18 may be formed to be connected to the insert 15 and configured to fix the semiconductor device 20 seated on the insert 15 .

That is, the fixing parts 17 and 18 are inserted into the insert 15 and are configured to additionally firmly fix or release the semiconductor device 20 in a state of being lower supported by the clip 16 .

Specifically, the fixing portion may include a lever 17 and a spring 18 .

5A and 5B , the lever 17 may be configured to fix or release the semiconductor device 20 seated on the insert 15 from both sides, respectively. The lever 17 is fixed in the locked state when the semiconductor element 20 is pushed toward the seated region, and is locked in the unlocked state when the lever 17 is pushed to the opposite side to the seated region of the semiconductor element 20 .

Referring to FIG. 5A , the spring 18 may be positioned outside the lever 17 to press both sides of the semiconductor device 20 inwardly when fixing the semiconductor device 20 .

Referring to FIG. 5B , the spring 18 may release the state of pressing both sides of the semiconductor device 20 in the inward direction when releasing the fixing of the semiconductor device 20 .

The above-described spring 18 may be formed to be inserted into the lever 17 to support the semiconductor device, but is not limited thereto.

The insert 15, the clip 16, and the fixing portions 17 and 18 described above may be formed to correspond to each of the plurality of seating grooves 12 and 13 in pairs.

As described above, the test tray 10 is converted ( Conversion) time can be saved and equipment utilization can be improved.

6 is a diagram illustrating a configuration of a test handler according to an embodiment of the present invention.

Hereinafter, FIG. 7 showing a rotator according to an embodiment of the present invention in detail, FIGS. 8 to 10 showing a sizer according to an embodiment of the present invention in detail, and an alignment part of a test handler according to an embodiment of the present invention It will be described with reference to FIGS. 11 and 12 showing details and FIG. 13 showing details of the unloading position of the test handler according to an embodiment of the present invention.

Referring to FIG. 6 , the test handler may include a test tray 10 and a transfer unit 400 .

In addition, the test handler further includes a customer tray (Customer Tray) 30 , a loading and unloading unit 100 , a loading unit 200 , a transfer unit 300 , a tester 700 and an alignment unit 800 . can do.

The test tray 10 may be configured to accommodate a plurality of standard semiconductor devices 20 .

Referring to FIG. 1 , the test tray 10 may include a body 11 , an insert 150 , a clip 16 , and a fixing unit.

The body 11 may have a plurality of seating grooves 12 and 13 having different sizes for accommodating the semiconductor device 20 .

The seating grooves 12 and 13 may be vertically penetrated so that a tester 700 to be described later can electrically connect to the semiconductor device 20 . A plurality of seating grooves 12 and 13 may be formed with different lengths to correspond to the specifications of various semiconductor devices 20 .

2 to 4 , the insert 15 may be respectively formed on one side and the other side of the inner side of the seating grooves 12 and 13 to seat the semiconductor device 20 . The insert 15 is formed inside the seating grooves 12 and 13 to firmly clamp the semiconductor device 20 accommodated in the seating grooves 12 and 13 . The insert 15 is made of a flexible material to prevent damage such as scratches that may be applied to the semiconductor device 20 in advance.

Referring to FIG. 4 , the clip 16 is formed to be connected to the insert 15 and may be configured to support the semiconductor device 20 seated on the insert 15 from the bottom.

5A and 5B , the fixing part is formed to be connected to the insert 15 and may be configured to fix the semiconductor device 20 seated on the insert 15 . Specifically, the fixing portion may include a lever 17 and a spring 18 . The lever 17 may be configured to fix or release the semiconductor device 20 seated on the insert 15 from both sides, respectively. Referring to FIG. 5A , the spring 18 may be positioned outside the lever 17 to press both sides of the semiconductor device 20 inwardly when fixing the semiconductor device 20 . Referring to FIG. 5B , the spring 18 may release the state of pressing both sides of the semiconductor device 20 in the inward direction when releasing the fixing of the semiconductor device 20 .

The insert 15 , the clip 16 and the fixing part described above may be formed to correspond to each of the plurality of seating grooves 12 and 13 in pairs.

The loading and unloading unit 100 is located at the entrance and exit of the test handler to load the customer tray 30 in which the semiconductor device 20 is accommodated, or the customer tray 30 in which the semiconductor device 20 that has been tested is accommodated. can be unloaded externally.

Here, the plurality of semiconductor devices 20 are accommodated in a single customer tray 30 and then transferred to the test tray 10 to perform a test, including a loading and unloading unit 100 , a loading unit 200 , It may pass through the transfer unit 300 , the transfer unit 400 , and the tester 700 .

Specifically, the loading and unloading unit 100 may include a loading module 110 , an unloading module 120 , and a buffer module 130 .

The loading module 110 may be configured to load the customer tray 30 into the loading unit 200 .

The unloading module 120 may be disposed on one side of the loading module 110 and may be configured to unload the customer tray 30 in which the semiconductor device 20 that has been tested is accommodated.

The buffer module 130 may be disposed between the loading module 110 and the unloading module 120 to carry in or take out the customer tray 30 in an emergency.

For example, the buffer module 130 can carry in or take out the customer tray 30 in an emergency, such as when a problem occurs in the loading module 110 or the unloading module 120 .

The loading module 110 , the unloading module 120 , and the buffer module 130 may be provided in the form of actuators that operate to linearly transport the customer tray 30 on a plane. At this time, the loading module 110 , the unloading module 120 , and the buffer module 130 may differ in the transport direction of the customer tray 30 according to the loading or unloading of the customer tray 30 .

The loading unit 200 may load the customer tray 30 delivered from the loading and unloading unit 100 or the transmission unit 300 . A plurality of customer trays 30 may be loaded on the loading unit 200 .

The loading unit 200 may include a loading stacker 210 , an unloading stacker 220 , and a buffer stacker 230 .

The loading stacker 210 may be connected to the loading module 110 to load the customer tray 30 in which the semiconductor device 20 is accommodated.

The unloading stacker 220 may be disposed on one side of the loading stacker 210 , and may be connected to the unloading module 120 to load the customer tray 30 in which the tested semiconductor device 20 is accommodated.

In an emergency, the buffer stacker 230 includes a loading stacker 210 and an unloading stacker ( 220) may be disposed between.

In the buffer stacker 230 , when a problem occurs in the loading stacker 210 or the unloading stacker 220 , the customer tray 30 in which the semiconductor device 20 is accommodated or the customer in which the tested semiconductor device 20 is accommodated. The tray 30 can be loaded.

The loading stacker 210 , the unloading stacker 220 , and the buffer stacker 230 elevate the customer tray 30 to enable loading of a plurality of customer trays 30 . It may be composed of a combination of actuators that operate to linearly transport the customer tray 30 located at the lowermost side of the .

At this time, the loading stacker 210 , the unloading stacker 220 , and the buffer stacker 230 may be different in the transport direction and the elevating direction of the customer tray 30 according to the loading or unloading of the customer tray 30 . can

The delivery unit 300 picks up the semiconductor device 20 from the customer tray 30 and delivers it to the test tray 10 , or picks up the semiconductor device 20 that has been tested and delivers it to the customer tray 30 . can

Specifically, the transfer unit 300 may include a loading transfer 310 and an unloading transfer 320 .

The loading transfer 310 may pick-up and place the semiconductor device 20 from the customer tray 30 to the test tray 10 .

The loading transfer 310 may pick up and place the semiconductor device accommodated in the customer tray 30 supplied as a sheet from the loading stacker 210 to the test tray 10 .

When the semiconductor device 20 is transferred to the test tray 10 by the loading transfer 310 , the position of the test tray 10 may be the loading position (IN of FIG. 6 ) of the test tray 10 .

The unloading transfer 320 may pick up and place the semiconductor device 20 on which the test has been completed from the test tray 10 to the customer tray 30 .

The position of the test tray 10 when the semiconductor device 20 that has been tested by the unloading transfer 320 is transferred to the customer tray 30 is the unloading position of the test tray 10 (OUT in FIG. 6 ). ) can be

The above-described loading transfer 310 and unloading transfer 320 are a plurality of actuators arranged to reciprocate and linearly transfer the upper side of the customer tray 30 and the upper side of the test tray 10 in two axial directions on the plane, The actuator may be operated in the vertical direction and the pick hand capable of picking and placing the semiconductor device 20 may be combined.

In this case, the loading transfer 310 and the unloading transfer 320 may be different from each other in a transport direction and an elevation direction of the pick hand according to loading or unloading of the semiconductor device 20 . It will be understood that the pick area of the pick hand may vary according to the standard of the semiconductor device accommodated in the customer tray 30 or the test tray 10 .

The semiconductor device 20 accommodated in the customer tray 30 is transferred from the customer tray 30 to the test tray 10 by the loading transfer 310 , where the position of the test tray 10 is changed to the test tray 10 . ) can be defined as the carry-in location (IN in FIG. 6).

In addition, the semiconductor device 20 that has completed the test is transferred from the test tray 10 to the customer tray 30 by the unloading transfer 320 , in which case the position of the test tray 10 is changed to the test tray 10 . ) can be defined as the take-out position (OUT in FIG. 6). As shown in FIG. 6 , the above-described carry-in position and carry-out position may be formed on the same straight line.

Here, a loading presetter 311 may be disposed at the loading position, and an unloading presetter 321 may be disposed at the unloading position, and a detailed description thereof will be described later.

The transport unit 400 may support the test tray 10 and transport it along the test process area.

Referring to FIG. 6 , the transfer unit 400 includes first, second, third, fourth, fifth, sixth and seventh transfer modules 410 and 420 for transferring the test tray 10 along a movement path. A transfer module including 430, 440, 450, 460, 470, a rotator including first and second rotators 510 and 520 for rotating the test tray 10 according to the tray reference direction, and a test tray 10 It may include an elevating module including first and second elevating modules (610, 620) for elevating the.

Referring to FIG. 6 , the first transfer module 410 may transfer the test tray 10 from the carry-in position IN to the next transfer area. The first transfer module 410 may transfer the test tray 10 in which the semiconductor device 20 is accommodated in the first direction shown in FIG. 6 from the loading position.

Referring to FIG. 7 , the first rotator 510 may rotate the test tray 10 transferred by the first transfer module 410 according to the tray reference direction of the next step. For example, the first rotator 510 may support the test tray 10 transferred by the first transfer module 410 and rotate the test tray 10 by 90 degrees on a plane.

After gripping the test tray 10, the first rotator 510 moves to a rotational position and may perform rail down to avoid interference with other components. Thereafter, the first rotator 510 may rail up the test tray 10 after transporting it to the rotation position, and rotate the test tray 10 through the provided rotator cylinder. To this end, the first rotator 510 may include a loading rail up/down cylinder 511 and a rotate cylinder (not shown).

The second transfer module 420 may transfer the test tray 10 from the first rotator 510 to the next transfer area. For example, the second transfer module 420 may transfer the test tray 10 supported by the first rotator 510 in the first direction.

The first elevating module 610 may elevate the test tray 10 transferred by the second transfer module 420 .

The third transfer module 430 may transfer the test tray 10 lifted by the first elevating module 610 to one side of the tester 700 . For example, the third transfer module 430 may transfer the test tray 10 lifted by the first lifting module 610 in the second direction shown in FIG. 6 .

The fourth transfer module 440 may transfer the test tray 10 from the third transfer module 430 to the upper side of the tester 700 .

For example, the fourth transfer module 440 may transfer the test tray 10 transferred by the third transfer module 430 in the third direction shown in FIG. 6 . At this time, the test tray 10 transferred in the third direction may be loaded into a tester 700 to be described later and positioned above the tester 700 .

The fifth transfer module 450 may transfer the test tray 10 accommodating the semiconductor device 20 on which the test has been completed from the tester 700 to the outside of the tester 700 .

When the test tray 10 is loaded into the tester 700 , a test process for the semiconductor device 20 is performed, and the fifth transfer module 450 receives the test tray 10 in which the tested semiconductor device is accommodated from the tester 700 . ) can be transferred in the third direction shown in FIG. 6 .

Referring to FIG. 7 , the second rotator 520 may rotate the test tray 10 transferred to the outside of the tester 700 by the fifth transfer module 450 according to the tray reference direction of the next step. For example, the second rotator 520 may rotate the test tray 10 90 degrees on a plane.

After gripping the test tray 10, the second rotator 520 moves to a rotational position and may perform rail down to avoid interference with other components. Thereafter, the second rotator 520 may rail up the test tray 10 after transporting it to the rotation position, and rotate the test tray 10 through the provided rotator cylinder. To this end, the second rotator 520 may include an unloading rail up/down cylinder 513 and a rotate cylinder (not shown).

The sixth transfer module 460 may transfer the test tray 10 accommodating the semiconductor device on which the test has been completed to the unloading position (OUT of FIG. 6 ). For example, the sixth transfer module 460 may transfer the test tray 10 in the second direction shown in FIG. 6 to position the test tray 10 at the unloading position.

The second elevating module 620 may elevate the empty test tray 10 at the unloading position. Specifically, when all of the semiconductor devices 20 that have been tested are unloaded by the unloading transfer 320 , the second lifting module 620 may raise and lower the test tray 10 .

The seventh transfer module 470 may be disposed above the sixth transfer module 460 to transfer the test tray 10 to the carry-in position IN. For example, the seventh transfer module 470 may transfer the test tray 10 in the fourth direction shown in FIG. 6 to be positioned at the carry-in position IN.

Referring to FIG. 13 , the test tray 10 may be transferred to the take-out position OUT after the test process is completed in the tester 700 (1-1), and the test-completed semiconductor device 20 is placed on the customer tray. After being transferred to (30), it can be transported (1-2) to the carry-in location (IN) for reuse.

At this time, since the test tray 10 rises vertically from the unloading position OUT and moves to the loading position IN, the path 1-2 from the tester 700 to the unloading position OUT and the unloading position OUT ) to the carry-in position IN overlapping the paths 1 - 2 to prevent path obstruction between the test trays 10 from occurring in advance.

In this case, the test tray 10 may be movable in all directions to prevent path obstruction that may occur between the test trays 10, such as vertically descending in addition to vertical rising from the unloading position.

Meanwhile, the transfer unit 400 may further include a loading presizer 311 disposed at the carry-in position of FIG. 6 and an unloading presizer 321 disposed at the unloading location of FIG. 6 .

The loading presizer 311 may allow the loading transfer 310 to seat the semiconductor device 20 on the test tray 10 .

Specifically, the loading presizer 311 guides the loading transfer 310 to seat the semiconductor device 20 in the correct position of the test tray 10 , but inserts the insert 15 of the test tray 10 . can be opened

Referring to FIG. 9 , the loading and unloading presizers 311 and 321 include an insert open guide 317 of the test tray 10 , and reference numerals 317a or 317b according to the size of the semiconductor device 20 . It is possible to open the insert 15 through the insert open guide of.

Specifically, the opening of the insert 15 is performed in the process in which the loading and unloading presizers 311 and 321 located under the test tray 10 are combined with the test tray 10 in a cylinder motion, the insert open guide 317. The lever 17, which is in the state of FIG. 5A, is pushed upward through At this time, the clip 16 is opened to secure a space, and loading into which the semiconductor device 20 is inserted or unloading for unloading the semiconductor device 20 is possible.

On the other hand, the lever 17 is pushed back as shown in FIG. 5B to be in the unlocked state, or to be in the locked state as shown in FIG. 5A may be possible through the force of the spring 18 . At this time, the spring 18 may push the lever 17 or may be pushed by the lever 17 .

Through the above-described principle, the clip 16 may serve to support the semiconductor device 20 and at the same time serve to fix the semiconductor device 20 through a combination of the spring 18 and the lever 17 .

For reference, FIG. 10 illustrates a state in which the semiconductor device 20 is accommodated in the test tray 10 seated on the loading and unloading presizers 311 and 321 .

The unloading presizer 321 may enable the unloading transfer 320 to unload the semiconductor device that has been tested from the test tray 10 .

The unloading presizer 321 is disposed below the test tray 10 positioned at the unloading position so that the unloading transfer 320 can unload the tested semiconductor device 20 from the test tray 10 to elevate. can be

8 to 10 , the above-described loading presizer 311 and unloading presizer 321 are disposed below the test tray 10 located at the carry-in position or the unloading position, and the plate 313 is raised and lowered. ) and a support protrusion 315 protruding from the plate 313 corresponding to the position of the semiconductor device 20 accommodated in the test tray 10 to support the semiconductor device 20 .

The tester 700 may be configured to perform a test on the semiconductor device 20 accommodated in the test tray 10 .

11 and 12 , the tester 700 may perform a test on the semiconductor device 20 accommodated in the test tray 10 . The tester 700 may perform a predetermined test on the semiconductor device 70 by electrically connecting to the semiconductor device 20 accommodated in the test tray 10 . A plurality of testers 700 may be provided to perform a test process on a large amount of the semiconductor device 70 in one process. In this case, when a plurality of testers 700 are provided, the above-described fourth transfer module 440 , second rotator 520 , and test rail 710 may be provided in proportion to the number of testers 700 . In addition, the third transfer module 430 may be provided with a length sufficient to supply the test tray 10 to each tester 700 in proportion to the quantity of the testers 700 .

Specifically, the tester 700 may include a test rail 710 and a pressing module 720 .

The test rail 710 may be disposed above the tester 700 to support the test tray 10 .

As for the test rail 710 , the test tray 10 transferred in the third direction by the fourth transfer module 440 is smoothly carried to the upper side of the tester 700 , and the third transfer module 450 uses the fifth transfer module 450 . The test tray 10 transferred in the direction may be formed of a pair of rails arranged side by side in the third direction so that the test tray 10 can be smoothly taken out from the upper side of the tester 700 .

The pressing module 720 may press the semiconductor device 20 accommodated in the test tray 10 supported by the test rail 710 .

The pressing module 720 may be lifted toward the semiconductor device 20 accommodated in the test tray 10 so that an electrical connection state between the semiconductor device 20 and the tester 700 is firmly maintained.

The alignment unit 800 may be configured to align the position of the test tray 10 so that the semiconductor device 20 is aligned to the correct position for testing according to the standard of the semiconductor device 20 .

The alignment unit 800 may include a first alignment module 810 and a second alignment module 820 .

The first alignment module 810 may adjust the position of the test tray 10 by moving the transfer unit according to the pitch between the adjacent seating grooves 12 and 13 . For example, the first alignment module 810 is connected to the third transfer module 430 to move the third transfer module 430 in the second direction or the fourth direction of FIG. position can be adjusted.

The second alignment module 820 may adjust the position of the test tray 10 by moving the test rail 710 according to the pitch between the adjacent seating grooves 12 and 13 . For example, the second alignment module 820 may be connected to the test rail 710 to move the test rail 710 in the second or fourth direction to adjust the position of the test tray 10 .

In the test tray 10 according to the present embodiment, two types of seating grooves 12 and 13 are alternately formed to accommodate the two types of semiconductor devices 20 , and intervals between the seating grooves 12 and 13 are formed. It may have the same pitch P. Accordingly, the first alignment module 810 and the second alignment module 820 have seating grooves 12 and 13 for supporting the semiconductor device 20 of the corresponding standard according to the standard of the semiconductor device 20 in the tester 700 . The third transfer module 430 and the test rail 710 may be transferred together to be aligned with the .

Although not shown, the above-described first and second alignment modules 820 may apply a position sensor to align the test tray 10 in the correct position. When the test tray 10 is aligned in place, the pressing module 720 at the top can press two test trays 10 at a time to test 32 semiconductor devices 20 at the same time. The test tray 10, on which the test is completed, is transported to the unloading area by logistics movement, a robot (not shown) performs product classification according to the test result, and the unloaded test tray 10 is logisticsly moved to the loading zone again. A cyclic operation of loading the semiconductor device may be performed.

Referring to FIG. 6 , driving in the test handler according to the present embodiment will be described.

First, the customer tray 30 may be supplied to the loading module 110 . In this case, the empty customer tray 30 is supported by the loading module 110 , and the semiconductor device 20 may be filled in the customer tray 30 by an operator or an automatic facility. Thereafter, the customer tray 30 filled with the semiconductor device 20 may be supplied to the loading module 110 by an automated facility such as a cart.

The customer tray 30 in which the semiconductor device 20 is accommodated may be transferred to the loading stacker 210 by the loading module 110 . The loading stacker 210 may directly transfer the customer tray 30 transferred by the loading module 110 to the transfer unit 300, but preferably load the customer tray 30 for process efficiency. It can be loaded in the unit 200 . When a plurality of customer trays 30 are loaded on the loading stacker 210 , the loading stacker 210 may transfer the customer tray 30 located at the lowest position toward the delivery unit 300 .

Next, the test tray 10 waits at the loading position, and the loading transfer 310 may transfer the semiconductor device 20 contained in the customer tray 30 to the test tray 10 . When the semiconductor device 20 is filled in the test tray 10 , the first transfer module 410 may transfer the test tray 10 to the first rotator 510 . The first rotator 510 may rotate the test tray 10 by 90 degrees. The second transfer module 420 may transfer the test tray 10 to the first elevating module 610 . The first elevating module 610 may lower the test tray 10 . The third transfer module 430 may transfer the test tray 10 to one side of the tester 700 . The fourth transfer module 440 may load the test tray 10 into the tester 700 . The test tray 10 brought into the tester 700 may be positioned above the tester 700 by being seated on the test rail 710 . The pressurization module 720 presses the semiconductor device 20 , and the tester 700 may electrically connect to the semiconductor device 20 to perform a predetermined test.

Next, the fifth transfer module 450 may transfer the tested semiconductor device 20 to the second rotator 520 . The second rotator 520 may rotate the test tray 10 by 90 degrees. The sixth transfer module 460 may transfer the test tray 10 to the unloading position. At the unloading position, the unloading transfer 320 may transfer the semiconductor device 20 accommodated in the test tray 10 to the customer tray 30 . The second lifting module 620 may raise the test tray 10 . The seventh transfer module 470 may transfer the empty test tray 10 to the carry-in position.

As described above, the test tray 10 of the test handler according to the present embodiment may be cycled from the loading position to the unloading position past the tester 700 . As shown in FIG. 13 , during circulation of the test tray 10 , the test tray 10 transferred from the unloading position to the loading position is transferred to the upper side of the test tray 10 supported by the second rotator 520 . Interference between the test trays 10 can be prevented. Accordingly, the test handler according to the present embodiment can improve productivity by ensuring process continuity.

In addition, the test handler according to the present embodiment transfers the semiconductor device 20 supported by the customer tray 30 to the test tray 10 , then rotates the test tray 10 by 90 degrees to load it into the tester 700 . After the test is completed, the test tray 10 is rotated 90 degrees and taken out again, so that the tester 700 can be used as it is, regardless of the size of the semiconductor device, and the space is reduced by reducing the size of the entire equipment. can be expected to use effectively.

Meanwhile, even when the semiconductor device 20 having a different standard than the semiconductor device 20 needs to be tested before, the test tray 10 may cycle through the above-described path and perform the test process.

However, since the semiconductor device 20 having a different standard from the previous semiconductor device 20 is supported in the seating groove spaced apart by 1 pitch from the seating groove in which the semiconductor device previously tested in the test tray 10 was supported. , the alignment unit 700 transfers the third transfer module 430 and the test rail 710 to a distance of one pitch of the seating grooves 12 and 13 to transfer the semiconductor device 20 of a different standard to the tester 700 . can be sorted.

As such, the test handler according to the present embodiment performs a test on the semiconductor device 20 of a plurality of standards with a single device even without providing a test handler and a tester for each standard, thereby reducing facility investment costs. can be derived

Those of ordinary skill in the art to which the present invention pertains, since the present invention can be embodied in other specific forms without changing the technical spirit or essential features thereof, the embodiments described above are illustrative in all respects and not limiting. have to understand The scope of the present invention is indicated by the following claims rather than the above detailed description, and all changes or modifications derived from the meaning and scope of the claims and their equivalent concepts should be interpreted as being included in the scope of the present invention. do.

IN: carry-in location OUT: carry-out location
10: test tray 12, 13: seating groove
20: semiconductor element 30: customer tray
100: loading and unloading unit 200: loading unit
300: transfer unit 400: transfer unit
700: tester 800: alignment unit

Claims (20)

a body having a plurality of seating grooves of different sizes for accommodating semiconductor devices;
inserts respectively formed on one side and the other side of the inner side of the seating groove to seat the semiconductor device; and
a clip formed to be connected to the insert and configured to support a semiconductor device seated on the insert from a lower side;
A test tray containing According to claim 1,
It is formed to be connected to the insert and further comprises a fixing part for fixing the semiconductor device seated on the insert,
The fixing part,
a lever for fixing or releasing the semiconductor element seated on the insert from both sides, respectively; and
a spring positioned outside the lever to press both sides of the semiconductor device inward when fixing the semiconductor device or releasing the pressure when releasing the fixing of the semiconductor device;
A test tray containing 3. The method of claim 2,
The insert, the clip, and the fixing part are formed to correspond to each of the plurality of seating grooves in pairs. According to claim 1,
The insert is a test tray made of a flexible material. a test tray accommodating a plurality of standard semiconductor devices; and
a transport unit supporting the test tray and transporting it along the test process area;
A test handler containing . 6. The method of claim 5,
The test handler is
a tester for performing a test on the semiconductor device accommodated in the test tray; and
an alignment unit for aligning a position of the test tray so that the semiconductor device is aligned with the correct position for testing according to the standard of the semiconductor device;
A test handler that further includes . 7. The method of claim 6,
The test handler is
a loading and unloading unit positioned at the entrance/exit of the test handler to load the customer tray in which the semiconductor device is accommodated or to unload the customer tray in which the semiconductor device has been completed;
a loading unit for loading the customer tray delivered from the loading and unloading unit or the transmission unit; and
a delivery unit that picks up the semiconductor device from the customer tray and delivers it to the test tray, or picks up a semiconductor device that has been tested and delivers it to the customer tray;
A test handler that further includes . 8. The method of claim 7,
The loading and unloading unit,
a loading module for loading the customer tray into the loading unit;
an unloading module disposed at one side of the loading module to unload the customer tray in which the test-completed semiconductor device is accommodated; and
a buffer module disposed between the loading module and the unloading module to carry out the loading or unloading of the customer tray in an emergency;
A test handler containing . 9. The method of claim 8,
The loading unit,
a loading stacker connected to the loading module to load the customer tray in which the semiconductor device is accommodated;
an unloading stacker disposed on one side of the loading stacker and connected to the unloading module to load the customer tray in which the test-completed semiconductor device is accommodated; and
a buffer stacker disposed between the loading stacker and the unloading stacker to load the customer tray in which the semiconductor device is accommodated or the customer tray in which the tested semiconductor device is accommodated in an emergency;
A test handler containing . 10. The method of claim 9,
The delivery unit,
a loading transfer for picking up and placing the semiconductor device from the customer tray to the test tray; and
an unloading transfer for picking up and placing the tested semiconductor device from the test tray to the customer tray;
A test handler containing . 11. The method of claim 10,
A position of the test tray when the semiconductor device is transferred to the test tray by the loading transfer is a loading position of the test tray,
A position of the test tray when the semiconductor device on which the test has been completed by the unloading transfer is transferred to the customer tray is a unloading position of the test tray,
A test handler in which the carry-in position and the carry-out position are formed on the same straight line. 12. The method of claim 11,
The transfer unit,
a transfer module for transferring the test tray along a movement path;
a rotator for rotating the test tray in a tray reference direction; and
an elevating module for elevating the test tray;
A test handler containing . 12. The method of claim 11,
The transfer unit,
a first transfer module for transferring the test tray from the carry-in position to a next transfer area;
a first rotator for rotating the test tray transported by the first transport module according to the tray reference direction of the next step;
a second transfer module for transferring the test tray from the first rotator to a next transfer area;
a first elevating module for elevating the test tray transferred by the second transfer module;
the third transfer module for transferring the test tray lifted by the first lifting module to one side of the tester; and
a fourth transfer module for transferring the test tray from the third transfer module to an upper side of the tester;
A test handler containing . 14. The method of claim 13,
The transfer unit,
a fifth transfer module for transferring the test tray in which the semiconductor device for which the test has been completed is accommodated from the tester to the outside of the tester;
a second rotator for rotating the test tray transferred to the outside of the tester by the fifth transfer module according to the tray reference direction of the next step;
a sixth transport module for transporting the test tray in which the semiconductor device of which the test has been completed is accommodated to a unloading position;
a second elevating module for elevating the empty test tray at the unloading position; and
a seventh transfer module disposed above the sixth transfer module to transfer the test tray to the carry-in position;
A test handler that further includes . 11. The method of claim 10,
The transfer unit,
a loading presetter (preciser) for guiding the loading transfer to seat the semiconductor device in a proper position of the test tray, and opening an insert of the test tray; and
an unloading presizer disposed under the test tray at a unloading position to allow the unloading transfer to unload the tested semiconductor device from the test tray and lifted;
A test handler that further includes . 7. The method of claim 6,
The tester is
a test rail disposed above the tester to support the test tray; and
a pressing module for pressing the semiconductor device accommodated in the test tray supported by the test rail;
A test handler containing . 7. The method of claim 6,
The alignment unit,
a first alignment module for adjusting the position of the test tray by moving the transfer unit according to a pitch between the adjacent seating grooves; and
a second alignment module for adjusting the position of the test tray by moving the test rail according to a pitch between the adjacent seating grooves;
A test handler containing . 6. The method of claim 5,
The test tray is
a body having a plurality of seating grooves of different sizes for accommodating semiconductor devices;
inserts respectively formed on one side and the other side of the inner side of the seating groove to seat the semiconductor device; and
a clip formed to be connected to the insert and configured to support a semiconductor device seated on the insert from a lower side;
A test handler containing . 19. The method of claim 18,
It is formed to be connected to the insert and further comprises a fixing part for fixing the semiconductor device seated on the insert,
The fixing part,
a lever for fixing or releasing the semiconductor element seated on the insert from both sides, respectively; and
a spring positioned outside the lever to press both sides of the semiconductor device inward when fixing the semiconductor device or releasing the pressure when releasing the fixing of the semiconductor device;
A test handler containing . 20. The method of claim 19,
The insert, the clip, and the fixing part are formed to correspond to each of the plurality of seating grooves in pairs.

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