KR20170096750A - A buffer for mounting the modules of different sizes - Google Patents

Abstract

Provided is a buffer for mounting modules, which can mount modules of different sizes and does not require replacement, disassembling, or remounting of the modules in equipment even if a target module is changed. The buffer for mounting modules according to an embodiment of the present invention may comprise a plate-shaped body part; a first jig part protruding from both side edges of the body part and providing a first module mounting space having a first width; and a second jig part protruding from both side edges of the body part and providing a second module mounting space having a second width larger than the first width.

Description

[0001] The present invention relates to a buffer for mounting modules of various sizes,

This document discloses a module buffer for storing a module. And more particularly to a module buffer for integrating modules of various sizes.

The module consists of several parts or semiconductor elements with regularity and separability. Typically, the module is in the form of a component or a semiconductor device mounted on a printed circuit board (PCB). Memory modules are SOK-DIMMs, desktop and server modules (UB-DIMM, Reg-DIMM), and each module is different in size.

In the semiconductor assembly process, a buffer is required as a device for storing and storing a memory module for various reasons such as ease of handling, convenience of operation, and process automation. For example, the automation line includes a buffer for temporary standby of the memory module in the apparatus, such as a shuttle buffer, a general buffer, and a re-test buffer.

Conventional buffers are manufactured for each module according to the size of the corresponding memory module. For example, a buffer for SO-DIMM and a buffer for UB-DIMM (Reg-DIMM) are manufactured.

Therefore, when performing a specific task (for example, testing) on an SO-DIMM and a UB-DIMM (Reg-DIMM) in an automation line, buffers must be changed each time the target module is changed. That is, when the type and size of the target module are changed, the buffer used in the equipment of the automated line must be disassembled and a different buffer must be mounted.

However, it takes a long time to replace the buffer, and it is not possible to operate the equipment during the replacement time, thereby reducing the production.

On the other hand, Korean Patent Registration No. 10-0639557 (entitled: Module tray) discloses a tray capable of accommodating modules of various sizes. However, since the conventional tray described here is configured to manually adjust the space in which the module is inserted, when the type and size of the module to be operated are changed, the tray being used in the equipment of the automated line is disassembled and the jig is adjusted, There is a problem in that the tray must be attached to the equipment again.

Embodiments of the present invention can accommodate modules of various sizes and can eliminate the need to replace, disassemble, or remount the module in the equipment even if the module to be worked on changes, thereby facilitating cost reduction, handling and management And a buffer capable of increasing the work production amount.

According to an embodiment of the present invention, there is provided a module storage buffer comprising: a plate-shaped body portion; A first jig part protruding from both side edges of the body part and providing a first module accommodation space having a first width; And a second jig portion protruding from both side edge portions of the body portion and providing a second module receiving space having a second width larger than the first width.

Preferably, the first jig includes a pair of first jigs which are disposed opposite to the opposite side edge portions of the body portion and provide the first module accommodation space therebetween, and are arranged opposite to the opposite side edge portions of the body portion And a pair of second jigs for providing the second module accommodation space therebetween.

Preferably, the pair of first and second jigs may include module insertion grooves formed in mutually opposing side walls. The plurality of module insertion grooves may be arranged at regular intervals.

Preferably, the body portion, the first jig portion, and the second jig portion are formed as a single unitary molded product, or they are made of different members and coupled to each other to constitute a buffer.

Preferably, the first and second jigs may be surface treated aluminum materials.

The buffer according to the embodiment of the present invention can accommodate all the modules having different sizes so that it is not necessary to replace the module in the equipment of the automation line even if the module to be operated is changed into a different module. As a result, cost reduction, handling and management is easy, and work production can be increased.

FIG. 1 is a perspective view showing a buffer according to an embodiment of the present invention, showing that first and second modules of different sizes can be accommodated.
2 is a cross-sectional view of the buffer.

Hereinafter, a buffer according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

2 is a cross-sectional view of a buffer 100. The buffer 100 includes a first module MODULE 1 and a second module MODULE 2, As shown in Fig.

The first module MODULE 1 has a first length L 1 and the second module MODULE has a second length L 2 that is greater than the first length L 1. . The first module MODULE 1 may be a notebook module (SO-DIMM) and the second module MODULE 2 may be a module for a desktop and a server (UB-DIMM, Reg-DIMM).

Specifically, the buffer 100 may have a plate-shaped body portion 10 and at least two jig portions 20 and 30 located on both sides of the body portion 10. 1 shows the two stages of jigs 20 and 30. FIG.

The first jig part 20 may be formed on both edges of the body 10 so that the first module housing space P1 is provided on the upper part of the body part 10. [ The first module receiving space P1 may have a width PW1 corresponding to the first length L1 of the first module MODULE 1. The first jig 20 may include a pair of first jigs 20A and 20B which are symmetrical with respect to the first module housing space P1. A plurality of module insertion grooves 20H may be formed on the side walls of the first jigs 20A and 20B. A plurality of module insertion grooves 20H may be arranged in the first jig 20A and 20B at regular intervals.

The second jig portion 30 is formed on both edges of the body 10 or the first jig portion 20 so that the second module housing space P2 is provided on the upper portion of the body portion 10 and the first jig portion 20, As shown in FIG. The second module receiving space P2 may have a width PW2 corresponding to the second length L2 of the second module MODULE2. The second jig 30 may include a pair of second jigs 30A and 30B symmetrical with each other with the second module housing space P2 therebetween. A plurality of module insertion grooves 30H can be formed on the side walls of the second jigs 30A and 30B. The module insertion grooves 30H may be arranged in the plurality of second jigs 30A and 30B at regular intervals.

Here, although the jigs 20 and 30 are shown as two stages, the number and location of the jigs 20 and 30 may be changed according to the type of the module, and the shape thereof may be changed according to the type of the module. For example, the jig may have three or more stages, and the buffer may be configured to accommodate three or more modules having mutually different sizes.

The buffer 100 may be formed by integrally molding the body 10 and the first and second jig portions 20 and 30 or by integrally molding the body portion 10 and the first jig portion 20, And the second jig 30 may be manufactured from different members, and then combined to form a final buffer.

On the other hand, the material of the buffer 100 should be free from abrasion due to the contact of the module with the PCB material, and the surface of the module should be smoothly loaded and the buffer of the transmission buffer should not be damaged. For this purpose, the first and second jig portions 20 and 30 can be fabricated by processing with an aluminum-based metal material and performing surface treatment.

The memory module requires a process to determine good and defective parts through testing. The test process includes electrical test (ET) and functional test (AT) process. These test processes are constructed as automated lines, and when the module is loaded into the ET process, the AT process is automatically performed. There are several devices between these devices.

Between these devices or in the equipment there is a buffer for storing the module, and the buffer may be a shuttle buffer for moving the module between the equipment and a general buffer that is kept in the equipment. In addition, the general buffer includes a buffer for retesting a module that has a primary failure.

In the automation process as described above, the buffer 100 according to the embodiment of the present invention can accommodate both the first module (MODULE 1) and the second module (MODULE 2) having different sizes. The first modules MODULE 1 may be housed in the first module receiving space P1 of the buffer 100 when the first modules MODULE 1 are operated in the equipment. (I.e., the first jig 20A, 20B). On the other hand, the second modules (MODULE 2) may be housed in the second module receiving space P2 of the buffer 100 when the operation of the second modules (MODULE 2) is performed in the equipment. That is, the module jig 30H of the second jig 30A, 30B). At this time, the buffer 100 does not need to be replaced in the equipment, and it is not necessary to perform work involving disassembly and re-mounting such as adjustment of the spacing of the jig portions 20 and 30.

Therefore, the buffer according to the embodiment of the present invention is easy to reduce cost, to handle and manage, and to increase the work production amount.

The technical idea of the present invention has been specifically described according to the above embodiments, but it should be noted that the embodiments described above are for explanation purposes only and not for the purpose of limitation. It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention.

100: buffer 10:
20: first jig 30: second jig
20A, 20B: first jig 30A, 30B: second jig
20H: first module insertion groove 30H: second module insertion groove
P1: first module storage space P2: second module storage space

Claims (7)

A plate-shaped body portion;
A first jig part protruding from both side edges of the body part and providing a first module accommodation space having a first width; And
And a second jig portion protruding from both side edge portions of the body portion and providing a second module accommodation space having a second width larger than the first width,
Buffer for module storage.
The method according to claim 1,
Wherein the first jig includes a pair of first jigs disposed opposite the side edge portions of the body portion to provide the first module accommodation space therebetween,
And a pair of second jigs arranged opposite to the opposite side edge portions of the body portion to provide the second module accommodation space therebetween
Buffer for module storage.
The method according to claim 1,
The pair of the first and second jigs includes a module insertion groove formed in mutually opposing side walls
Buffer for module storage.
The method of claim 3,
Wherein the plurality of module insertion grooves are arranged at regular intervals.
The method according to claim 1,
Wherein the body portion, the first jig portion, and the second jig portion are integrally molded articles.
The method according to claim 1,
Wherein the body portion and the first and second jig portions are mutually coupled as one another.
The method of claim 3,
Wherein the first and second jigs are made of a surface-treated aluminum material.

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