KR20210048411A - 플라즈마원 - Google Patents
플라즈마원 Download PDFInfo
- Publication number
- KR20210048411A KR20210048411A KR1020200133422A KR20200133422A KR20210048411A KR 20210048411 A KR20210048411 A KR 20210048411A KR 1020200133422 A KR1020200133422 A KR 1020200133422A KR 20200133422 A KR20200133422 A KR 20200133422A KR 20210048411 A KR20210048411 A KR 20210048411A
- Authority
- KR
- South Korea
- Prior art keywords
- antenna
- plasma source
- frame
- insulating material
- vacuum container
- Prior art date
Links
- 239000000853 adhesive Substances 0.000 claims description 24
- 230000001070 adhesive effect Effects 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 15
- 239000012212 insulator Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 238000001816 cooling Methods 0.000 abstract description 12
- 239000003507 refrigerant Substances 0.000 abstract description 11
- 238000009616 inductively coupled plasma Methods 0.000 abstract description 5
- 239000007788 liquid Substances 0.000 abstract description 4
- 239000011810 insulating material Substances 0.000 description 67
- 239000007789 gas Substances 0.000 description 27
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 7
- 230000005672 electromagnetic field Effects 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 239000003566 sealing material Substances 0.000 description 5
- 229910052786 argon Inorganic materials 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 3
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 230000002500 effect on skin Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 230000008719 thickening Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001485 argon Chemical class 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
- H01J37/3211—Antennas, e.g. particular shapes of coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32192—Microwave generated discharge
- H01J37/32211—Means for coupling power to the plasma
- H01J37/32238—Windows
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32467—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32513—Sealing means, e.g. sealing between different parts of the vessel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32522—Temperature
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Plasma Technology (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019192663 | 2019-10-23 | ||
| JPJP-P-2019-192663 | 2019-10-23 | ||
| JP2020073434A JP7426709B2 (ja) | 2019-10-23 | 2020-04-16 | プラズマ源 |
| JPJP-P-2020-073434 | 2020-04-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20210048411A true KR20210048411A (ko) | 2021-05-03 |
Family
ID=75637576
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020200133422A KR20210048411A (ko) | 2019-10-23 | 2020-10-15 | 플라즈마원 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7426709B2 (ja) |
| KR (1) | KR20210048411A (ja) |
| TW (1) | TW202118356A (ja) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010212105A (ja) | 2009-03-11 | 2010-09-24 | Emd:Kk | プラズマ処理装置 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0963793A (ja) * | 1995-08-25 | 1997-03-07 | Tokyo Electron Ltd | プラズマ処理装置 |
| US5993594A (en) * | 1996-09-30 | 1999-11-30 | Lam Research Corporation | Particle controlling method and apparatus for a plasma processing chamber |
| JP2007149638A (ja) * | 2005-10-27 | 2007-06-14 | Nissin Electric Co Ltd | プラズマ生成方法及び装置並びにプラズマ処理装置 |
| KR101591404B1 (ko) * | 2008-05-22 | 2016-02-03 | 가부시키가이샤 이엠디 | 플라즈마 생성장치 및 플라즈마 처리장치 |
| JP5189999B2 (ja) * | 2009-01-29 | 2013-04-24 | 東京エレクトロン株式会社 | マイクロ波プラズマ処理装置、及びマイクロ波プラズマ処理装置のマイクロ波給電方法 |
| JP5400434B2 (ja) * | 2009-03-11 | 2014-01-29 | 株式会社イー・エム・ディー | プラズマ処理装置 |
| CN103155718B (zh) * | 2010-09-06 | 2016-09-28 | Emd株式会社 | 等离子处理装置 |
| JP6468521B2 (ja) * | 2016-12-19 | 2019-02-13 | 株式会社プラズマイオンアシスト | 誘導結合型アンテナユニット及びプラズマ処理装置 |
-
2020
- 2020-04-16 JP JP2020073434A patent/JP7426709B2/ja active Active
- 2020-09-02 TW TW109130051A patent/TW202118356A/zh unknown
- 2020-10-15 KR KR1020200133422A patent/KR20210048411A/ko unknown
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010212105A (ja) | 2009-03-11 | 2010-09-24 | Emd:Kk | プラズマ処理装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7426709B2 (ja) | 2024-02-02 |
| TW202118356A (zh) | 2021-05-01 |
| JP2021068694A (ja) | 2021-04-30 |
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