KR20210042254A - 절삭 블레이드의 식별 방법 및 가공 장치 - Google Patents

절삭 블레이드의 식별 방법 및 가공 장치 Download PDF

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Publication number
KR20210042254A
KR20210042254A KR1020200129290A KR20200129290A KR20210042254A KR 20210042254 A KR20210042254 A KR 20210042254A KR 1020200129290 A KR1020200129290 A KR 1020200129290A KR 20200129290 A KR20200129290 A KR 20200129290A KR 20210042254 A KR20210042254 A KR 20210042254A
Authority
KR
South Korea
Prior art keywords
blade
cutting
unit
cutting blade
information
Prior art date
Application number
KR1020200129290A
Other languages
English (en)
Korean (ko)
Inventor
사토시 사와키
Original Assignee
가부시기가이샤 디스코
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시기가이샤 디스코 filed Critical 가부시기가이샤 디스코
Publication of KR20210042254A publication Critical patent/KR20210042254A/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • G06K9/20—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Automatic Tool Replacement In Machine Tools (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020200129290A 2019-10-09 2020-10-07 절삭 블레이드의 식별 방법 및 가공 장치 KR20210042254A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2019-185951 2019-10-09
JP2019185951A JP7316901B2 (ja) 2019-10-09 2019-10-09 切削ブレードの識別方法及び加工装置

Publications (1)

Publication Number Publication Date
KR20210042254A true KR20210042254A (ko) 2021-04-19

Family

ID=75379484

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020200129290A KR20210042254A (ko) 2019-10-09 2020-10-07 절삭 블레이드의 식별 방법 및 가공 장치

Country Status (3)

Country Link
JP (1) JP7316901B2 (ja)
KR (1) KR20210042254A (ja)
SG (1) SG10202009276RA (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI765709B (zh) * 2021-05-19 2022-05-21 佳陞科技有限公司 換刀裝置及換刀裝置操作方法
CN116021654B (zh) * 2023-04-02 2023-07-25 西北电子装备技术研究所(中国电子科技集团公司第二研究所) 一种晶片切割自动换刀装置的换刀方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011079098A (ja) 2009-10-07 2011-04-21 Disco Abrasive Syst Ltd ブレード交換装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63123660A (ja) * 1986-11-10 1988-05-27 Toyota Motor Corp 物品識別装置
JP2000061783A (ja) * 1998-08-14 2000-02-29 Japan Nuclear Fuel Co Ltd(Jnf) 研削砥石の表面状態診断方法及び診断装置
JP4791813B2 (ja) * 2005-12-08 2011-10-12 株式会社ディスコ 切削装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011079098A (ja) 2009-10-07 2011-04-21 Disco Abrasive Syst Ltd ブレード交換装置

Also Published As

Publication number Publication date
JP2021058986A (ja) 2021-04-15
SG10202009276RA (en) 2021-05-28
JP7316901B2 (ja) 2023-07-28

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