KR20200140823A - 폴리이미드 수지, 폴리이미드 바니시 및 폴리이미드 필름 - Google Patents

폴리이미드 수지, 폴리이미드 바니시 및 폴리이미드 필름 Download PDF

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Publication number
KR20200140823A
KR20200140823A KR1020207028633A KR20207028633A KR20200140823A KR 20200140823 A KR20200140823 A KR 20200140823A KR 1020207028633 A KR1020207028633 A KR 1020207028633A KR 20207028633 A KR20207028633 A KR 20207028633A KR 20200140823 A KR20200140823 A KR 20200140823A
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KR
South Korea
Prior art keywords
structural unit
polyimide
mol
film
polyimide resin
Prior art date
Application number
KR1020207028633A
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English (en)
Korean (ko)
Inventor
요헤이 아비코
신지 세키구치
슈야 스에나가
Original Assignee
미쯔비시 가스 케미칼 컴파니, 인코포레이티드
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Application filed by 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 filed Critical 미쯔비시 가스 케미칼 컴파니, 인코포레이티드
Publication of KR20200140823A publication Critical patent/KR20200140823A/ko

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Wire Bonding (AREA)
KR1020207028633A 2018-04-10 2019-04-09 폴리이미드 수지, 폴리이미드 바니시 및 폴리이미드 필름 KR20200140823A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018075508 2018-04-10
JPJP-P-2018-075508 2018-04-10
PCT/JP2019/015454 WO2019198709A1 (ja) 2018-04-10 2019-04-09 ポリイミド樹脂、ポリイミドワニス及びポリイミドフィルム

Publications (1)

Publication Number Publication Date
KR20200140823A true KR20200140823A (ko) 2020-12-16

Family

ID=68164139

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020207028633A KR20200140823A (ko) 2018-04-10 2019-04-09 폴리이미드 수지, 폴리이미드 바니시 및 폴리이미드 필름

Country Status (5)

Country Link
JP (1) JP7371621B2 (zh)
KR (1) KR20200140823A (zh)
CN (1) CN111936554B (zh)
TW (1) TWI804604B (zh)
WO (1) WO2019198709A1 (zh)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005232383A (ja) 2004-02-20 2005-09-02 Asahi Kasei Electronics Co Ltd ポリアミド酸誘導体

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101869173B1 (ko) 2014-02-14 2018-06-19 아사히 가세이 가부시키가이샤 폴리이미드 전구체 및 그것을 함유하는 수지 조성물
EP3208313B1 (en) * 2014-10-17 2019-01-30 Mitsubishi Gas Chemical Company, Inc. Polyimide resin composition, polyimide film and laminate
JP6492934B2 (ja) * 2015-04-27 2019-04-03 宇部興産株式会社 ポリアミック酸溶液組成物およびポリイミドフィルム
JP6919564B2 (ja) 2015-06-12 2021-08-18 宇部興産株式会社 ポリイミド前駆体組成物、及びポリイミド組成物
JP6292351B1 (ja) * 2016-06-24 2018-03-14 東レ株式会社 ポリイミド樹脂、ポリイミド樹脂組成物、それを用いたタッチパネルおよびその製造方法、カラーフィルタおよびその製造方法、液晶素子およびその製造方法、有機el素子およびその製造方法
JP6966847B2 (ja) 2016-08-10 2021-11-17 日鉄ケミカル&マテリアル株式会社 透明ポリイミドフィルムの製造方法
WO2018066522A1 (ja) * 2016-10-07 2018-04-12 Jxtgエネルギー株式会社 ポリイミド、ポリイミド前駆体樹脂、それらの溶液、ポリイミドの製造方法、及び、ポリイミドを用いたフィルム
WO2018143314A1 (ja) 2017-02-03 2018-08-09 東京応化工業株式会社 ポリイミド前駆体組成物
JP2018172669A (ja) * 2017-03-30 2018-11-08 Jxtgエネルギー株式会社 ポリアミドイミド、樹脂溶液、及び、フィルム
CN111133033B (zh) * 2017-09-29 2022-06-28 三菱瓦斯化学株式会社 聚酰亚胺树脂、聚酰亚胺清漆和聚酰亚胺薄膜
JP2018044180A (ja) 2017-12-26 2018-03-22 Jxtgエネルギー株式会社 ポリイミド樹脂組成物及びポリイミドワニス

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005232383A (ja) 2004-02-20 2005-09-02 Asahi Kasei Electronics Co Ltd ポリアミド酸誘導体

Also Published As

Publication number Publication date
CN111936554A (zh) 2020-11-13
CN111936554B (zh) 2023-04-28
JPWO2019198709A1 (ja) 2021-04-15
TW201943766A (zh) 2019-11-16
WO2019198709A1 (ja) 2019-10-17
TWI804604B (zh) 2023-06-11
JP7371621B2 (ja) 2023-10-31

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