KR20200135175A - 양면연마장치용 캐리어 및 그의 제조방법 - Google Patents

양면연마장치용 캐리어 및 그의 제조방법 Download PDF

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Publication number
KR20200135175A
KR20200135175A KR1020200053966A KR20200053966A KR20200135175A KR 20200135175 A KR20200135175 A KR 20200135175A KR 1020200053966 A KR1020200053966 A KR 1020200053966A KR 20200053966 A KR20200053966 A KR 20200053966A KR 20200135175 A KR20200135175 A KR 20200135175A
Authority
KR
South Korea
Prior art keywords
insert member
carrier
double
polishing apparatus
sided polishing
Prior art date
Application number
KR1020200053966A
Other languages
English (en)
Korean (ko)
Inventor
다이치 키타즈메
Original Assignee
신에쯔 한도타이 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 신에쯔 한도타이 가부시키가이샤 filed Critical 신에쯔 한도타이 가부시키가이샤
Publication of KR20200135175A publication Critical patent/KR20200135175A/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
    • B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14467—Joining articles or parts of a single article
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/736—Grinding or polishing equipment

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020200053966A 2019-05-22 2020-05-06 양면연마장치용 캐리어 및 그의 제조방법 KR20200135175A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019095777A JP2020191376A (ja) 2019-05-22 2019-05-22 両面研磨装置用キャリアおよびその製造方法
JPJP-P-2019-095777 2019-05-22

Publications (1)

Publication Number Publication Date
KR20200135175A true KR20200135175A (ko) 2020-12-02

Family

ID=73441852

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020200053966A KR20200135175A (ko) 2019-05-22 2020-05-06 양면연마장치용 캐리어 및 그의 제조방법

Country Status (4)

Country Link
JP (1) JP2020191376A (zh)
KR (1) KR20200135175A (zh)
CN (1) CN111975626A (zh)
TW (1) TW202045303A (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115008318A (zh) * 2022-06-16 2022-09-06 南京工业职业技术大学 一种气动加载式双面环抛机

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS465564Y1 (zh) 1967-02-28 1971-02-26
JP2002018708A (ja) 2000-07-10 2002-01-22 Sumitomo Bakelite Co Ltd 被研磨物保持材及びその製造方法
JP2003109925A (ja) 2001-09-28 2003-04-11 Kida Kogyo:Kk ウエハ研磨装置
JP2009012086A (ja) 2007-07-02 2009-01-22 Speedfam Co Ltd ワークキャリア
JP2010179375A (ja) 2009-02-03 2010-08-19 Sumco Corp 被研磨物キャリア及び研磨製品の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5057331B2 (ja) * 2007-12-28 2012-10-24 ニッタ・ハース株式会社 被研磨物保持具
JP6447332B2 (ja) * 2015-04-13 2019-01-09 信越半導体株式会社 両面研磨装置用のキャリアの製造方法およびウェーハの両面研磨方法
JP6865628B2 (ja) * 2016-05-06 2021-04-28 三井化学株式会社 金属樹脂複合ギヤ
WO2018143027A1 (ja) * 2017-02-03 2018-08-09 住友ベークライト株式会社 ディスクブレーキ用のブレーキパッドおよびその製造方法
JP2021037552A (ja) * 2017-10-17 2021-03-11 冨士ベークライト株式会社 研磨治具及びその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS465564Y1 (zh) 1967-02-28 1971-02-26
JP2002018708A (ja) 2000-07-10 2002-01-22 Sumitomo Bakelite Co Ltd 被研磨物保持材及びその製造方法
JP2003109925A (ja) 2001-09-28 2003-04-11 Kida Kogyo:Kk ウエハ研磨装置
JP2009012086A (ja) 2007-07-02 2009-01-22 Speedfam Co Ltd ワークキャリア
JP2010179375A (ja) 2009-02-03 2010-08-19 Sumco Corp 被研磨物キャリア及び研磨製品の製造方法

Also Published As

Publication number Publication date
CN111975626A (zh) 2020-11-24
TW202045303A (zh) 2020-12-16
JP2020191376A (ja) 2020-11-26

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