KR20200110135A - 성막 장치, 성막 시스템 - Google Patents
성막 장치, 성막 시스템 Download PDFInfo
- Publication number
- KR20200110135A KR20200110135A KR1020190146862A KR20190146862A KR20200110135A KR 20200110135 A KR20200110135 A KR 20200110135A KR 1020190146862 A KR1020190146862 A KR 1020190146862A KR 20190146862 A KR20190146862 A KR 20190146862A KR 20200110135 A KR20200110135 A KR 20200110135A
- Authority
- KR
- South Korea
- Prior art keywords
- film forming
- forming apparatus
- vacuum chamber
- substrate
- film
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims description 56
- 230000007246 mechanism Effects 0.000 claims description 19
- 238000001704 evaporation Methods 0.000 claims description 18
- 230000008020 evaporation Effects 0.000 claims description 16
- 239000011368 organic material Substances 0.000 claims description 11
- 238000006073 displacement reaction Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 7
- 238000007740 vapor deposition Methods 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 abstract description 15
- 230000008859 change Effects 0.000 abstract description 11
- 230000006837 decompression Effects 0.000 description 10
- 239000000463 material Substances 0.000 description 8
- 230000005484 gravity Effects 0.000 description 6
- 238000000151 deposition Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000008021 deposition Effects 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 2
- 239000012779 reinforcing material Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 229910001374 Invar Inorganic materials 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 238000007726 management method Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- H01L51/001—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2019-048607 | 2019-03-15 | ||
| JP2019048607A JP7299725B2 (ja) | 2019-03-15 | 2019-03-15 | 成膜装置、成膜システム |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20200110135A true KR20200110135A (ko) | 2020-09-23 |
Family
ID=72430393
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020190146862A KR20200110135A (ko) | 2019-03-15 | 2019-11-15 | 성막 장치, 성막 시스템 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7299725B2 (zh) |
| KR (1) | KR20200110135A (zh) |
| CN (1) | CN111690895B (zh) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2024054768A (ja) | 2022-10-05 | 2024-04-17 | キヤノントッキ株式会社 | 成膜装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007222431A (ja) | 2006-02-24 | 2007-09-06 | Hitachi Ltd | 磁気共鳴イメージング装置 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06240443A (ja) * | 1992-12-26 | 1994-08-30 | Sony Corp | 真空薄膜製造装置及びこれを用いた磁気記録媒体の製造方法 |
| JP2004335510A (ja) | 2003-04-30 | 2004-11-25 | Nikon Corp | ステージ装置及び露光装置 |
| JP5277059B2 (ja) * | 2009-04-16 | 2013-08-28 | 株式会社日立ハイテクノロジーズ | 成膜装置及び成膜システム |
| JP5783811B2 (ja) * | 2010-07-06 | 2015-09-24 | キヤノン株式会社 | 成膜装置 |
| JP6008731B2 (ja) | 2012-12-18 | 2016-10-19 | キヤノントッキ株式会社 | 成膜装置 |
| JP6394220B2 (ja) * | 2014-09-17 | 2018-09-26 | 東京エレクトロン株式会社 | アライメント装置及び基板処理装置 |
| CN107002224B (zh) * | 2014-11-17 | 2019-07-02 | 夏普株式会社 | 蒸镀装置、蒸镀方法及有机电致发光元件的制造方法 |
| JP2016156052A (ja) | 2015-02-24 | 2016-09-01 | 東レエンジニアリング株式会社 | 搬送装置 |
| JP6262811B2 (ja) * | 2016-07-08 | 2018-01-17 | キヤノントッキ株式会社 | 真空成膜装置 |
| JP6890968B2 (ja) | 2016-12-26 | 2021-06-18 | キヤノントッキ株式会社 | 圧力容器 |
-
2019
- 2019-03-15 JP JP2019048607A patent/JP7299725B2/ja active Active
- 2019-11-15 CN CN201911115831.2A patent/CN111690895B/zh active Active
- 2019-11-15 KR KR1020190146862A patent/KR20200110135A/ko not_active Application Discontinuation
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007222431A (ja) | 2006-02-24 | 2007-09-06 | Hitachi Ltd | 磁気共鳴イメージング装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111690895B (zh) | 2023-11-03 |
| JP7299725B2 (ja) | 2023-06-28 |
| CN111690895A (zh) | 2020-09-22 |
| JP2020147830A (ja) | 2020-09-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| E902 | Notification of reason for refusal |