JP6890968B2 - 圧力容器 - Google Patents
圧力容器 Download PDFInfo
- Publication number
- JP6890968B2 JP6890968B2 JP2016251333A JP2016251333A JP6890968B2 JP 6890968 B2 JP6890968 B2 JP 6890968B2 JP 2016251333 A JP2016251333 A JP 2016251333A JP 2016251333 A JP2016251333 A JP 2016251333A JP 6890968 B2 JP6890968 B2 JP 6890968B2
- Authority
- JP
- Japan
- Prior art keywords
- pressure vessel
- ring
- bottom plate
- sealing
- connecting portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000007789 sealing Methods 0.000 claims description 23
- 230000002093 peripheral effect Effects 0.000 claims description 10
- 230000000694 effects Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000000470 constituent Substances 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000036316 preload Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16J—PISTONS; CYLINDERS; SEALINGS
- F16J12/00—Pressure vessels in general
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16J—PISTONS; CYLINDERS; SEALINGS
- F16J15/00—Sealings
- F16J15/02—Sealings between relatively-stationary surfaces
- F16J15/06—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces
- F16J15/10—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces with non-metallic packing
- F16J15/104—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces with non-metallic packing characterised by structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Gasket Seals (AREA)
- Pressure Vessels And Lids Thereof (AREA)
- Sealing Devices (AREA)
- Packages (AREA)
Description
2 一端側シール部材(第一のOリング)
3 他端側シール部材(第二のOリング)
4 連結部
Claims (4)
- 内部が真空状態になる圧力容器本体と、前記圧力容器本体内に配された搬送用ロボットと、前記搬送用ロボットが設けられ前記圧力容器本体の下部の開口を閉塞する底板体と、前記圧力容器本体と前記底板体との間をシールするシール部材と、を備えた圧力容器において、
前記圧力容器本体の剛性は前記底板体の剛性より低く、
前記シール部材は、前記開口の周囲に取り付けられる第1のシール部と、前記底板体の外周面に取り付けられる第2のシール部と、前記第1のシール部と前記第2のシール部とを連結し可撓性を有する連結部と、を備えることを特徴とする圧力容器。 - 前記第1のシール部は第1のOリングであり、前記第2のシール部は第2のOリングであることを特徴とする請求項1に記載の圧力容器。
- 前記第1のOリングの周長と前記第2のOリングの周長とは異なることを特徴とする請求項2に記載の圧力容器。
- 前記連結部の硬度は前記第1のOリング及び前記第2のOリングの硬度より低く、前記連結部の伸び率は前記第1のOリング及び前記第2のOリングの伸び率より高いことを特徴とする請求項2または3に記載の圧力容器。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016251333A JP6890968B2 (ja) | 2016-12-26 | 2016-12-26 | 圧力容器 |
KR1020170171967A KR102397291B1 (ko) | 2016-12-26 | 2017-12-14 | 압력 용기 및 시일 부재 |
CN201711379416.9A CN108240471B (zh) | 2016-12-26 | 2017-12-20 | 压力容器以及密封构件 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016251333A JP6890968B2 (ja) | 2016-12-26 | 2016-12-26 | 圧力容器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018105389A JP2018105389A (ja) | 2018-07-05 |
JP6890968B2 true JP6890968B2 (ja) | 2021-06-18 |
Family
ID=62700630
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016251333A Active JP6890968B2 (ja) | 2016-12-26 | 2016-12-26 | 圧力容器 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6890968B2 (ja) |
KR (1) | KR102397291B1 (ja) |
CN (1) | CN108240471B (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7299725B2 (ja) * | 2019-03-15 | 2023-06-28 | キヤノントッキ株式会社 | 成膜装置、成膜システム |
CN111609137B (zh) * | 2020-05-28 | 2022-07-12 | 中国电子工程设计院有限公司 | 一种柔性密封装置 |
CN111609079B (zh) * | 2020-05-28 | 2022-07-12 | 中国电子工程设计院有限公司 | 一种隔振密封系统 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5552129Y2 (ja) * | 1975-05-27 | 1980-12-03 | ||
JPH11132336A (ja) * | 1997-10-30 | 1999-05-21 | Uniden Corp | ハウジングの接合部のシール構造、シール部材およびシール構造を備えた筐体 |
US5931626A (en) * | 1998-01-16 | 1999-08-03 | Brooks Automation Inc. | Robot mounting de-coupling technique |
JPH11311334A (ja) * | 1998-04-27 | 1999-11-09 | Mitsubishi Cable Ind Ltd | シール |
JP2000161495A (ja) * | 1998-11-25 | 2000-06-16 | Japan Organo Co Ltd | 連結箇所のシール方法及びシール部材 |
JP2011202744A (ja) * | 2010-03-25 | 2011-10-13 | Nissin Electric Co Ltd | 真空シール構造、真空シール方法および真空装置 |
JP6381191B2 (ja) * | 2013-09-11 | 2018-08-29 | 三菱重工業株式会社 | 燃料タンク用ダム |
US20150176744A1 (en) * | 2013-12-20 | 2015-06-25 | Onesubsea Ip Uk Limited | Gasket |
-
2016
- 2016-12-26 JP JP2016251333A patent/JP6890968B2/ja active Active
-
2017
- 2017-12-14 KR KR1020170171967A patent/KR102397291B1/ko active IP Right Grant
- 2017-12-20 CN CN201711379416.9A patent/CN108240471B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN108240471A (zh) | 2018-07-03 |
KR20180075389A (ko) | 2018-07-04 |
JP2018105389A (ja) | 2018-07-05 |
KR102397291B1 (ko) | 2022-05-11 |
CN108240471B (zh) | 2021-11-16 |
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