KR20200107994A - 실장체 - Google Patents

실장체 Download PDF

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Publication number
KR20200107994A
KR20200107994A KR1020207021743A KR20207021743A KR20200107994A KR 20200107994 A KR20200107994 A KR 20200107994A KR 1020207021743 A KR1020207021743 A KR 1020207021743A KR 20207021743 A KR20207021743 A KR 20207021743A KR 20200107994 A KR20200107994 A KR 20200107994A
Authority
KR
South Korea
Prior art keywords
mounting body
conductive member
conductive
insulating substrate
curable composition
Prior art date
Application number
KR1020207021743A
Other languages
English (en)
Korean (ko)
Inventor
유스케 오카베
Original Assignee
세메다인 가부시키 가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 세메다인 가부시키 가이샤 filed Critical 세메다인 가부시키 가이샤
Publication of KR20200107994A publication Critical patent/KR20200107994A/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Wire Bonding (AREA)
KR1020207021743A 2018-01-17 2018-10-23 실장체 KR20200107994A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2018-005369 2018-01-17
JP2018005369 2018-01-17
PCT/JP2018/039273 WO2019142423A1 (ja) 2018-01-17 2018-10-23 実装体

Publications (1)

Publication Number Publication Date
KR20200107994A true KR20200107994A (ko) 2020-09-16

Family

ID=67301385

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020207021743A KR20200107994A (ko) 2018-01-17 2018-10-23 실장체

Country Status (5)

Country Link
JP (1) JPWO2019142423A1 (zh)
KR (1) KR20200107994A (zh)
CN (1) CN111566787A (zh)
TW (1) TW201933556A (zh)
WO (1) WO2019142423A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230129720A (ko) * 2022-03-02 2023-09-11 서울대학교산학협력단 전자 장치, 측정 장치, 측정 시스템 및 전자 장치의 제조 방법

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3858705B2 (ja) * 2001-01-29 2006-12-20 宇部興産株式会社 Ｃｏｆ実装用アンダ−フィル材および電子部品
US20050029666A1 (en) * 2001-08-31 2005-02-10 Yasutoshi Kurihara Semiconductor device structural body and electronic device
JP3910527B2 (ja) * 2002-03-13 2007-04-25 シャープ株式会社 液晶表示装置およびその製造方法
JP5464463B2 (ja) * 2008-09-25 2014-04-09 パナソニック株式会社 熱硬化性樹脂組成物及び回路基板
CN102282660A (zh) * 2009-01-09 2011-12-14 长瀬化成株式会社 半导体封装的制造方法、半导体封装方法和溶剂型半导体封装环氧树脂组合物
WO2011129272A1 (ja) * 2010-04-13 2011-10-20 積水化学工業株式会社 半導体チップ接合用接着材料、半導体チップ接合用接着フィルム、半導体装置の製造方法、及び、半導体装置
JP5644286B2 (ja) * 2010-09-07 2014-12-24 オムロン株式会社 電子部品の表面実装方法及び電子部品が実装された基板
JP2013118276A (ja) * 2011-12-02 2013-06-13 Namics Corp 半導体装置
CN107353586A (zh) * 2011-12-27 2017-11-17 日立化成工业株式会社 电子部件用液状树脂组合物及其制造方法、以及电子部件装置
JP6518451B2 (ja) * 2015-02-02 2019-05-22 株式会社フジクラ 伸縮性回路基板
WO2016125737A1 (ja) * 2015-02-04 2016-08-11 ナミックス株式会社 熱伝導性ペースト及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230129720A (ko) * 2022-03-02 2023-09-11 서울대학교산학협력단 전자 장치, 측정 장치, 측정 시스템 및 전자 장치의 제조 방법

Also Published As

Publication number Publication date
TW201933556A (zh) 2019-08-16
JPWO2019142423A1 (ja) 2021-01-14
CN111566787A (zh) 2020-08-21
WO2019142423A1 (ja) 2019-07-25

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A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application