KR20200103043A - 접속 구조체 및 그의 제조 방법 - Google Patents

접속 구조체 및 그의 제조 방법 Download PDF

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KR20200103043A
KR20200103043A KR1020207020835A KR20207020835A KR20200103043A KR 20200103043 A KR20200103043 A KR 20200103043A KR 1020207020835 A KR1020207020835 A KR 1020207020835A KR 20207020835 A KR20207020835 A KR 20207020835A KR 20200103043 A KR20200103043 A KR 20200103043A
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conductive particles
substrate
adhesive
electrode
conductive
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KR1020207020835A
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English (en)
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데츠유키 시라카와
다카히로 후쿠이
신노스케 이와모토
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히타치가세이가부시끼가이샤
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Publication of KR20200103043A publication Critical patent/KR20200103043A/ko

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Abstract

본 발명은 일 형태에 있어서, 제1 기판 및 제1 기판 상에 형성된 제1 전극을 갖는 제1 전자 부재와, 제2 기판 및 제2 기판 상에 형성된 제2 전극을 갖는 제2 전자 부재 사이에 접착제층을 배치하고, 제1 전극과 제2 전극이 서로 전기적으로 접속하도록, 제1 전자 부재와 제2 전자 부재를 접착제층을 통하여 압착하는 공정을 구비하는, 접속 구조체의 제조 방법이며, 제1 전자 부재는, 제1 전극의 제1 기판과 반대측에 형성된 절연층을 더 갖고, 접착제층은, 덴드라이트상의 도전 입자인 제1 도전 입자와, 제1 도전 입자 이외의 도전 입자이며, 비도전성의 핵체 및 해당 핵체 상에 마련된 도전층을 갖는 도전 입자인 제2 도전 입자를 함유하는, 제조 방법이다.

Description

접속 구조체 및 그의 제조 방법
본 발명은 접속 구조체 및 그의 제조 방법에 관한 것이다.
근년, 반도체, 액정 디스플레이 등의 분야에 있어서, 전자 부품의 고정, 회로의 접속 등을 위하여 각종 접착제가 사용되고 있다. 이들 용도에서는, 전자 부품, 회로 등의 고밀도화 및 고정밀화가 진행하고, 접착제에도 보다 높은 수준의 성능이 요구되고 있다.
예를 들어, 액정 디스플레이와 TCP(Tape Carrier Package(테이프 캐리어 패키지))의 접속, FPC(Flexible Printed Circuit(연성 인쇄 회로))와 TCP의 접속, 또는, FPC와 프린트 배선판의 접속에는, 접착제 중에 도전 입자를 분산시킨 접착제가 사용되고 있다. 이러한 접착제에서는, 피착체 간의 도전성 및 신뢰성을 보다 한층 높일 것이 요구된다.
예를 들어 특허문헌 1에는, 기재 필름 상에, 소정의 덴드라이트상 은 피복 구리 분말 입자를 함유하는 도전막을 구비한 도전성 필름이 기재되어 있고, 이러한 도전성 필름에 의해, 은 분말을 배합하지 않아도 충분한 도전 특성이 얻어지는 것이 개시되어 있다.
국제 공개 제2014/021037호
그런데, 전자 부재의 제조 공정에 있어서, 전극 상에 절연층을 형성하는 경우가 있다. 이 경우, 전자 부재끼리를 접속할 때에는, 전극끼리를 양호하게 접속하기 위하여 절연층을 미리 제거하는 것이 일반적이다. 그러나, 절연층을 제거하는 공정은 전자 부재의 제조 공정에 있어서 부담이 되기 때문에, 절연층을 제거하지 않고 전자 부재끼리를 접속할 수 있을 것이 요구되고 있고, 또한, 그 접속 시의 압력이 낮을수록(예를 들어 1.0MPa 정도) 바람직하다.
그래서, 본 발명의 목적은, 절연층이 형성된 전자 부재를 저압에서 접속할 수 있는 접속 구조체의 제조 방법 및 접속 구조체를 제공하는 데 있다.
본 발명은 일 형태에 있어서, 제1 기판 및 제1 기판 상에 형성된 제1 전극을 갖는 제1 전자 부재와, 제2 기판 및 제2 기판 상에 형성된 제2 전극을 갖는 제2 전자 부재 사이에 접착제층을 배치하고, 제1 전극과 제2 전극이 서로 전기적으로 접속하도록, 제1 전자 부재와 제2 전자 부재를 접착제층을 통하여 압착하는 공정을 구비하는, 접속 구조체의 제조 방법이며, 제1 전자 부재는, 제1 전극의 제1 기판과 반대측에 형성된 절연층을 더 갖고, 접착제층은, 덴드라이트상의 도전 입자인 제1 도전 입자와, 제1 도전 입자 이외의 도전 입자이며, 비도전성의 핵체 및 해당 핵체 상에 마련된 도전층을 갖는 도전 입자인 제2 도전 입자를 함유하는, 제조 방법이다.
본 발명은 다른 일 형태에 있어서, 제1 기판, 제1 기판 상에 형성된 제1 전극, 및 제1 전극의 제1 기판과 반대측에 형성된 절연층을 갖는 제1 전자 부재와, 제2 기판, 및 제2 기판 상에 형성된 제2 전극을 갖는 제2 전자 부재와, 제1 전극과 제2 전극을 서로 전기적으로 접속하는 접속 부재를 구비하고, 접속 부재는, 덴드라이트상의 도전 입자인 제1 도전 입자와, 제1 도전 입자 이외의 도전 입자이며, 비도전성의 핵체 및 해당 핵체 상에 마련된 도전층을 갖는 도전 입자인 제2 도전 입자를 함유하는, 접속 구조체이다.
상기 각 양태에 있어서, 도전층은, 바람직하게는, 금, 니켈 및 팔라듐으로 이루어지는 군에서 선택되는 적어도 1종을 함유한다.
본 발명에 따르면, 절연층이 형성된 전자 부재를 저압에서 접속할 수 있는 접속 구조체의 제조 방법 및 접속 구조체를 제공할 수 있다.
도 1은 접속 구조체의 제조 방법의 일 실시 형태를 도시하는 모식 단면도이다.
도 2는 접속 구조체의 일 실시 형태를 도시하는 모식 단면도이다.
도 3은 실시예에 있어서의 평가용의 접속 구조체의 제작 방법을 도시하는 모식도이다.
도 4는 실시예에 있어서의 접속 저항의 측정 방법을 도시하는 모식도이다.
이하, 도면을 적절히 참조하면서, 본 발명의 실시 형태에 대하여 상세하게 설명한다.
도 1은, 접속 구조체의 제조 방법의 일 실시 형태를 도시하는 모식 단면도이다. 도 1에 도시한 바와 같이, 이 제조 방법에서는, 먼저, 제1 전자 부재(1)와, 제2 전자 부재(2)와, 접착제 필름(접착제층)(3)을 준비한다.
제1 전자 부재(1)는 제1 기판(4)과, 제1 기판(4)의 주면 상에 형성된 제1 전극(5)과, 제1 전극(5)의 제1 기판(4)과 반대측에 형성된 절연층(6)을 구비하고 있다. 제2 전자 부재(2)는 제2 기판(7)과, 제2 기판(7)의 주면 상에 형성된 제2 전극(8)을 구비하고 있다. 제2 전자 부재도, 제1 전자 부재(1)와 마찬가지의 절연층을, 제2 전극(8)의 제2 기판(7)과 반대측에 더 구비하고 있어도 된다. 제2 전자 부재가 절연층을 더 구비하는 경우, 제1 전자 부재와 제2 전자 부재는, 서로 동종이어도 되고 이종이어도 된다.
제1 기판(4) 및 제2 기판(7)은 각각, 유리, 세라믹, 폴리이미드, 폴리카르보네이트, 폴리에스테르, 폴리에테르술폰 등으로 형성된 기판이면 된다. 제1 전극(5) 및 제2 전극(8)은 각각, 금, 은, 구리, 주석, 알루미늄, 루테늄, 로듐, 팔라듐, 오스뮴, 이리듐, 백금, 인듐 주석 산화물(ITO) 등으로 형성된 전극이면 된다. 제1 전극(5) 및 제2 전극(8)의 두께는, 각각, 예를 들어, 5㎛ 이상, 10㎛ 이상, 또는 20㎛ 이상이면 되고, 200㎛ 이하, 100㎛ 이하, 또는 50㎛ 이하이면 된다.
절연층(6)은 예를 들어, 폴리프로필렌 등의 폴리올레핀, 나일론 등의 폴리아미드 등의 폴리머로 형성되어 있다. 절연층(6)의 두께는, 예를 들어, 1㎛ 이상, 2㎛ 이상, 또는 3㎛ 이상이면 되고, 8㎛ 이하, 6㎛ 이하, 또는 4㎛ 이하이면 된다. 이러한 절연층(6)은 예를 들어, 제1 기판(4)의 주면 상에 형성된 제1 전극(5) 상에, 상기 폴리머의 필름 같은 절연성 필름을 배치함으로써 형성된다.
접착제 필름(3)은 일 실시 형태에 있어서, 접착제 성분(9)과, 접착제 성분(9) 중에 분산된 제1 도전 입자(10) 및 제2 도전 입자(11)를 함유하는 접착제층으로 구성되어 있다.
접착제 성분(9)은 예를 들어 열 또는 광에 의해 경화성을 나타내는 재료로 구성되어 있고, 에폭시계 접착제, 라디칼 경화형의 접착제, 폴리우레탄, 폴리비닐에스테르 등을 함유하는 열가소성 접착제 등이면 된다. 접착제 성분(9)은 접착 후의 내열성 및 내습성이 우수하다는 점에서, 가교성 재료로 구성되어 있어도 된다. 에폭시계 접착제는, 열경화성 수지인 에폭시 수지를 주성분으로서 함유한다. 에폭시계 접착제는, 단시간 경화가 가능하여 접속 작업성이 좋고, 접착성이 우수한 등의 점에서 바람직하게 사용된다. 라디칼 경화형의 접착제는, 에폭시계 접착제보다도 저온 단시간에의 경화성이 우수한 등의 특징을 갖기 때문에, 용도에 따라서 적절히 사용된다.
에폭시계 접착제는, 예를 들어, 에폭시 수지(열경화성 재료) 및 경화제를 함유하고, 필요에 따라, 열가소성 수지, 커플링제, 충전제 등을 더 함유하고 있어도 된다.
에폭시 수지로서는, 예를 들어, 비스페놀 A형 에폭시 수지, 비스페놀 F형 에폭시 수지, 비스페놀 S형 에폭시 수지, 페놀노볼락형 에폭시 수지, 크레졸노볼락형 에폭시 수지, 비스페놀 A 노볼락형 에폭시 수지, 비스페놀 F 노볼락형 에폭시 수지, 지환식 에폭시 수지, 글리시딜에스테르형 에폭시 수지, 글리시딜아민형 에폭시 수지, 히단토인형 에폭시 수지, 이소시아누레이트형 에폭시 수지, 지방족 쇄상 에폭시 수지 등을 들 수 있다. 이들 에폭시 수지는, 할로겐화되어 있어도 되고, 수소 첨가되어 있어도 되고, 아크릴로일기 또는 메타크릴로일기가 측쇄에 부가된 구조를 갖고 있어도 된다. 이들 에폭시 수지는, 1종을 단독으로 또는 2종 이상을 조합하여 사용된다.
경화제로서는, 에폭시 수지를 경화시킬 수 있는 것이면 특별히 제한은 없고, 예를 들어, 음이온 중합성의 촉매형 경화제, 양이온 중합성의 촉매형 경화제, 중부가형의 경화제 등을 들 수 있다. 이들 중, 속경화성에 있어서 우수하고, 화학당량적인 고려가 불필요한 점에서, 음이온 또는 양이온 중합성의 촉매형 경화제가 바람직하다.
음이온 또는 양이온 중합성의 촉매형 경화제로서는, 예를 들어, 이미다졸, 히드라지드, 3불화붕소-아민 착체, 오늄염(방향족 술포늄염, 방향족 디아조늄염, 지방족 술포늄염 등), 아민이미드, 디아미노말레오니트릴, 멜라민 및 그의 유도체, 폴리아민의 염, 디시안디아미드 등을 들 수 있고, 이들의 변성물도 사용할 수 있다. 중부가형의 경화제로서는, 예를 들어, 폴리아민, 폴리머캅탄, 폴리페놀, 산 무수물 등을 들 수 있다.
이들 경화제는, 폴리우레탄계, 폴리에스테르계 등의 고분자 물질, 니켈, 구리 등의 금속 박막, 규산칼슘 등의 무기물 등으로 피복되어서, 마이크로캡슐화된 잠재성 경화제이면 된다. 잠재성 경화제는, 가사 시간을 연장할 수 있기 때문에 바람직하다. 경화제는, 1종을 단독으로 또는 2종 이상을 조합하여 사용된다.
경화제의 함유량은, 열경화성 재료와 필요에 따라 배합되는 열가소성 수지의 합계량 100질량부에 대하여 0.05 내지 20질량부이면 된다.
라디칼 경화형의 접착제는, 예를 들어, 라디칼 중합성 재료 및 라디칼 중합 개시제(경화제라고도 불린다)를 함유하고, 필요에 따라, 열가소성 수지, 커플링제, 충전제 등을 더 함유하고 있어도 된다.
라디칼 중합성 재료로서는, 예를 들어, 라디칼에 의해 중합하는 관능기를 갖는 물질이면 특별히 제한없이 사용할 수 있다. 구체적으로는, 예를 들어, 아크릴레이트(대응하는 메타크릴레이트도 포함한다. 이하 동일하다.) 화합물, 아크릴옥시(대응하는 메타아크릴옥시도 포함한다. 이하 동일하다.) 화합물, 말레이미드 화합물, 시트라콘이미드 수지, 나디이미드 수지 등의 라디칼 중합성 재료를 들 수 있다. 이들 라디칼 중합성 재료는, 모노머 또는 올리고머의 상태이면 되고, 모노머와 올리고머의 혼합물의 상태여도 된다.
아크릴레이트 화합물로서는, 예를 들어, 메틸아크릴레이트, 에틸아크릴레이트, 이소프로필아크릴레이트, 이소부틸아크릴레이트, 에틸렌글리콜디아크릴레이트, 디에틸렌글리콜디아크릴레이트, 트리메틸올프로판트리아크릴레이트, 테트라메틸올메탄테트라아크릴레이트, 2-히드록시-1,3-디아크릴옥시프로판, 2,2-비스[4-(아크릴옥시메톡시)페닐]프로판, 2,2-비스[4-(아크릴옥시폴리에톡시)페닐]프로판, 디시클로펜테닐아크릴레이트, 트리시클로데카닐아크릴레이트, 트리스(아크릴로일옥시에틸)이소시아누레이트, 우레탄아크릴레이트, 인산에스테르디아크릴레이트 등을 들 수 있다.
아크릴레이트 화합물 등의 라디칼 중합성 재료는, 필요에 따라, 하이드로퀴논, 메틸에테르하이드로퀴논 등의 중합 금지제와 함께 사용되어도 된다. 아크릴레이트 화합물 등의 라디칼 중합성 재료는, 내열성의 향상의 관점에서, 바람직하게는, 디시클로펜테닐기, 트리시클로데카닐기, 트리아진환 등의 치환기를 적어도 1종 갖는다. 아크릴레이트 화합물 이외의 라디칼 중합성 재료로서는, 예를 들어, 국제 공개 제2009/063827호에 기재된 화합물을 적합하게 사용하는 것이 가능하다. 라디칼 중합성 재료는, 1종을 단독으로 또는 2종 이상을 조합하여 사용된다.
라디칼 중합 개시제로서는, 예를 들어, 가열 또는 광의 조사에 의해 분해되어 유리 라디칼을 발생하는 화합물이면 특별히 제한없이 사용할 수 있다. 구체적으로는, 예를 들어, 과산화 화합물, 아조계 화합물 등을 들 수 있다. 이들 화합물은, 목적으로 하는 접속 온도, 접속 시간, 가용 시간 등에 따라 적절히 선정된다.
라디칼 중합 개시제로서, 보다 구체적으로는, 디아실퍼옥사이드, 퍼옥시디카르보네이트, 퍼옥시에스테르, 퍼옥시케탈, 디알킬퍼옥사이드, 하이드로퍼옥사이드, 실릴퍼옥사이드 등을 들 수 있다. 이들 중에서도, 퍼옥시에스테르, 디알킬퍼옥사이드, 하이드로퍼옥사이드, 실릴퍼옥사이드 등이 바람직하고, 고반응성이 얻어지는 퍼옥시에스테르가 보다 바람직하다. 이들 라디칼 중합 개시제로서는, 예를 들어, 국제 공개 제2009/063827호에 기재된 화합물을 적합하게 사용하는 것이 가능하다. 라디칼 중합 개시제는, 1종을 단독으로 또는 2종 이상을 조합하여 사용된다.
라디칼 중합 개시제의 함유량은, 라디칼 중합성 재료와 필요에 따라 배합되는 열가소성 수지의 합계량 100질량부에 대하여 0.1 내지 10질량부이면 된다.
에폭시계 접착제 및 라디칼 경화형의 접착제에 있어서 필요에 따라 배합되는 열가소성 수지는, 예를 들어, 접착제를 필름상으로 성형하기 쉽게 한다. 열가소성 수지로서는, 예를 들어, 페녹시 수지, 폴리비닐포르말 수지, 폴리스티렌 수지, 폴리비닐부티랄 수지, 폴리에스테르 수지, 폴리아미드 수지, 크실렌 수지, 폴리우레탄 수지, 폴리에스테르우레탄 수지, 페놀 수지, 테르펜페놀 수지 등을 들 수 있다. 열가소성 수지로서는, 예를 들어, 국제 공개 제2009/063827호에 기재된 화합물을 적합하게 사용하는 것이 가능하다. 이들 중에서도, 접착성, 상용성, 내열성, 기계적 강도 등이 우수하다는 점에서, 페녹시 수지가 바람직하다. 열가소성 수지는, 1종을 단독으로 또는 2종 이상을 조합하여 사용된다.
열가소성 수지의 함유량은, 에폭시계 접착제에 배합되는 경우, 열가소성 수지 및 열경화성 재료의 합계량 100질량부에 대하여 5 내지 80질량부이면 된다. 열가소성 수지의 함유량은, 라디칼 경화형의 접착제에 배합되는 경우, 열가소성 수지 및 라디칼 중합성 재료의 합계량 100질량부에 대하여 5 내지 80질량부이면 된다.
접착제 성분(9)의 다른 예로서, 열가소성 수지와, 30℃에서 라디칼 중합성 재료와, 라디칼 중합 개시제를 함유하는 열라디칼 경화형 접착제를 들 수 있다. 열라디칼 경화형 접착제는, 상술한 접착제에 비하여 저점도이다. 열라디칼 경화형 접착제에 있어서의 라디칼 중합성 재료의 함유량은, 열가소성 수지 및 라디칼 중합성 재료의 합계량 100질량부에 대하여, 바람직하게는 20 내지 80질량부, 보다 바람직하게는 30 내지 80질량부, 더욱 바람직하게는 40 내지 80질량부이다.
접착제 성분(9)은 열가소성 수지와, 30℃에서 액상인 에폭시 수지를 포함하는 열경화성 재료와, 경화제를 함유하는 에폭시계 접착제여도 된다. 이 경우, 에폭시계 접착제에 있어서의 에폭시 수지의 함유량은, 열가소성 수지 및 열경화성 재료의 합계량 100질량부에 대하여, 바람직하게는 20 내지 80질량부, 보다 바람직하게는 40 내지 80질량부, 더욱 바람직하게는 30 내지 80질량부이다.
접착제 필름(3)이 IC 칩과, 유리 기판, 플렉시블 프린트 기판(FPC) 등의 접속에 사용되는 경우, IC 칩과 기판의 선팽창 계수의 차에 기인하는 기판의 휨을 억제하는 관점에서, 접착제 성분(9)은 바람직하게는, 내부 응력의 완화 작용을 발휘하는 성분을 더 함유한다. 이러한 성분으로서는, 구체적으로는, 아크릴 고무, 엘라스토머 성분 등을 들 수 있다. 혹은, 접착제 성분(9)은 국제 공개 제98/44067호에 기재되어 있는 라디칼 경화형 접착제여도 된다.
접착제 필름(3)에 차지하는 접착제 성분(9)의 체적 비율은, 접착제 필름(3)의 전체 체적 기준으로, 예를 들어, 55체적％ 이상 또는 65체적％ 이상이어도 되고, 95체적％ 이하 또는 85체적％ 이하여도 된다.
제1 도전 입자(10)는 덴드라이트상(수지상이라고도 불린다)을 나타내고 있고, 1개의 주축과, 해당 주축으로부터 이차원적 또는 3차원적으로 분기하는 복수의 가지를 구비하고 있다. 제1 도전 입자(10)는 구리, 은 등의 금속으로 형성되어 있어도 되고, 예를 들어 구리 입자가 은으로 피복되어 이루어지는 은 피복 구리 입자이면 된다.
제1 도전 입자(10)는 공지된 것이어도 되고, 구체적으로는, 예를 들어 ACBY-2(미츠이 긴조쿠 고교 가부시키가이샤), CE-1110(후쿠다 킨조쿠 하쿠훈 고교 가부시키가이샤), #FSP(JX 금속 가부시키가이샤), #51-R(JX 금속 가부시키가이샤) 등으로서 입수 가능하다. 혹은, 제1 도전 입자(10)는 공지된 방법(예를 들어, 상술한 특허문헌 1에 기재된 방법)에 의해 제조하는 것도 가능하다.
접착제 필름(3)에 있어서의 제1 도전 입자(10)의 함유량(접착제 필름(3)에 차지하는 제1 도전 입자(10)의 체적 비율)은 접착제 필름(3)의 전체 체적 기준으로, 2체적％ 이상 또는 8체적％ 이상이어도 되고, 25체적％ 이하 또는 15체적％ 이하여도 된다.
제2 도전 입자(11)는 비도전성의 핵체와, 해당 핵체 상에 마련된 도전층을 갖고 있다. 핵체는, 유리, 세라믹, 수지 등의 비도전성 재료로 형성되어 있고, 바람직하게는 수지로 형성되어 있다. 수지로서는, 예를 들어, 아크릴 수지, 스티렌 수지, 실리콘 수지, 폴리부타디엔 수지 또는 이들 수지를 구성하는 모노머의 공중합체를 들 수 있다. 핵체의 평균 입경은, 예를 들어 2 내지 30㎛이면 된다.
도전층은, 예를 들어, 금, 은, 구리, 니켈, 팔라듐 또는 이들의 합금으로 형성되어 있다. 도전층은, 도전성이 우수한 관점에서, 바람직하게는, 금, 니켈 및 팔라듐으로부터 선택되는 적어도 1종을 함유하고, 보다 바람직하게는 금 또는 팔라듐을 함유하고, 더욱 바람직하게는 금을 함유한다. 도전층은, 예를 들어 핵체에 상기 금속을 도금함으로써 형성된다. 도전층의 두께는, 예를 들어 10 내지 400㎚이면 된다.
제2 도전 입자(11)의 평균 입경은, 필름을 적합하게 박막화할 수 있는 관점에서, 바람직하게는 30㎛ 이하, 보다 바람직하게는 25㎛ 이하, 더욱 바람직하게는 20㎛ 이하이다. 제2 도전 입자(11)의 평균 입경은, 예를 들어 1㎛ 이상이면 된다. 제2 도전 입자(11) 및 그것을 구성하는 핵체의 평균 입경은, 레이저 회절·산란법을 사용한 입도 분포 측정 장치(마이크로트랙(제품명, 닛키소 가부시키가이샤))에 의해 측정된다.
접착제 필름(3)에 있어서의 제2 도전 입자(11)의 함유량(접착제 필름(3)에 차지하는 제2 도전 입자(11)의 체적 비율)은 접착제 필름(3)의 전체 체적 기준으로, 2체적％ 이상 또는 5체적％ 이상이어도 되고, 20체적％ 이하 또는 10체적％ 이하여도 된다.
접착제 필름(3)의 두께는, 예를 들어, 5㎛ 이상, 7㎛ 이상, 또는 10㎛ 이상이면 되고, 30㎛ 이하, 25㎛ 이하, 또는 20㎛ 이하이면 된다.
접착제층은, 예를 들어 페이스트상의 접착제 조성물을 제1 전자 부재(1) 또는 제2 전자 부재(2) 상에 도포함으로써 준비해도 된다. 페이스트상의 접착제 조성물은, 예를 들어, 접착제 성분, 제1 도전 입자 및 제2 도전 입자를 포함하는 혼합물을, 가열하거나 또는 용제에 용해시킴으로써 얻어진다. 용제로서는, 예를 들어 대기압 하에서의 비점이 50 내지 150℃인 용제가 사용된다.
접속 구조체의 제조 방법에서는, 계속해서, 제1 전자 부재(1)와 제2 전자 부재(2) 사이에 접착제 필름(접착제층)(3)을 배치하고, 제1 전자 부재(1)와 제2 전자 부재(2)를 접착제 필름(접착제층)(3)을 통하여 압착한다. 구체적으로는, 제1 전극(5)과 제2 전극(8)이 서로 전기적으로 접속되도록, 제1 전자 부재(1), 접착제 필름(접착제층)(3), 및 제2 전자 부재(2)의 적층 방향으로 가압함과 함께 가열한다. 가열 온도는, 예를 들어 50 내지 190℃이다. 압력은, 예를 들어 0.1 내지 30MPa이다. 이들 가열 및 가압은, 예를 들어 0.5초간 내지 120초간의 범위에서 행하여진다.
이상의 제조 방법에 의해, 접속 구조체가 얻어진다. 도 2는, 접속 구조체의 일 실시 형태를 도시하는 모식 단면도이다. 도 2에 도시한 바와 같이, 접속 구조체(20)는 제1 기판(4), 제1 기판(4) 상에 형성된 제1 전극(5), 및 제1 전극(5)의 제1 기판(4)과 반대측에 형성된 절연층(6)을 갖는 제1 전자 부재(1)와, 제2 기판(7), 및 제2 기판(7) 상에 형성된 제2 전극(8)을 갖는 제2 전자 부재(2)와, 제1 전극(5)과 제2 전극(8)을 서로 전기적으로 접속하는 접속 부재(21)를 구비하고 있다.
접속 부재(21)는 접착제 성분(9)의 경화물(22)과, 해당 경화물(22) 중에 분산된 제1 도전 입자(10) 및 제2 도전 입자(11)를 포함하고 있다. 즉, 접속 부재(21)는 상술한 접착제 필름(3)을 경화하여 이루어지는 것이다.
본 실시 형태에 관계되는 접속 구조체의 제조 방법에서는, 제1 도전 입자(10)와 제2 도전 입자(11)를 병용함으로써, 절연층(6)이 형성된 제1 전자 부재(1)를 적합하게 접속할 수 있다. 즉, 접착제 필름(3)에 포함되는 제1 도전 입자(10)가 덴드라이트상이기 때문에, 전자 부재(1, 2)끼리를 압착할 때에 도 2에 도시한 바와 같이, 제1 도전 입자(10)가 절연층(6)을 뚫어서 제1 전극(5)과 전기적으로 접속하는 것이 가능하게 된다. 추가로, 제2 도전 입자(11)가 제1 전극(5)과 제2 전극(8)을 도통시키는 주된 도통 경로가 되기 때문에, 예를 들어 제1 도전 입자(10)만을 함유하는 접착제 필름을 사용한 경우에 비하여, 저압에서도 적합한 접속이 실현됨과 함께, 신뢰성의 점에서도 우수하다.
상기 실시 형태에서는, 접착제 필름(3)이 접착제 성분(9), 제1 도전 입자(10) 및 제2 도전 입자(11)를 함유하는 접착제층 1층으로 구성되어 있지만, 다른 일 실시 형태에서는, 접착제 필름은, 2층 이상으로 구성되어 있어도 된다. 이 경우, 제1 도전 입자(10) 및 제2 도전 입자(11)는 2층 이상 중 적어도 1층에 포함되어 있으면 되고, 서로 동일한 층에 포함되어 있어도 되고, 다른 층에 포함되어 있어도 된다. 또한, 2층 이상에 포함되는 접착제 성분(9), 제1 도전 입자(10) 및 제2 도전 입자(11) 각각은, 서로 동일해도 되고 달라도 된다.
다른 일 실시 형태에서는, 접착제 필름은, 제1 도전 입자(10)를 함유하는 제1 접착제층과, 제2 도전 입자(11)를 함유하는 제2 접착제층을 구비하고 있어도 된다. 이 경우, 제1 접착제층은 제2 도전 입자(11)를 함유하고 있지 않아도 되고, 제2 접착제층은 제1 도전 입자(10)를 함유하고 있지 않아도 된다. 이 실시 형태에 관계되는 접착제 필름을 사용하는 경우, 제1 도전 입자(10)가 절연층(6)을 뚫는다는 상술한 효과가 보다 적합하게 얻어지는 관점에서, 전자 부재(1, 2) 사이에 접착제 필름을 배치할 때에 제1 도전 입자(10)를 함유하는 제1 접착제층을, 절연층(6)을 갖는 제1 전자 부재(1)측을 향하여 배치하는 것이 바람직하다.
다른 일 실시 형태에서는, 접착제 필름은, 제1 도전 입자(10) 및 제2 도전 입자(11)를 함유하는 제1 접착제층과, 도전 입자를 함유하지 않는(접착제 성분만을 포함하는) 제2 접착제층을 구비하고 있어도 된다. 이 실시 형태에 관계되는 접착제 필름을 사용하는 경우, 제1 도전 입자(10)가 절연층(6)을 뚫는다는 상술한 효과가 보다 적합하게 얻어지는 관점에서, 전자 부재(1, 2) 사이에 접착제 필름을 배치할 때에 제1 도전 입자(10)를 함유하는 제1 접착제층을, 절연층(6)을 갖는 제1 전자 부재(1)측을 향하여 배치하는 것이 바람직하다.
또한, 이 접착제 필름은, 예를 들어 제2 전자 부재(2)에 있어서의 제2 전극(8)이 요철 형상을 갖고 있는 경우에 적합하게 사용된다. 즉, 이 접착제 필름에서는, 도전 입자를 함유하지 않는 제2 접착제층(접착제 성분)이 유동하기 쉽게 되어 있기 때문에, 전자 부재(1, 2)의 압착 시에 제2 전극(8)의 요철 형상을 따라서 유동할 수 있다. 따라서, 전자 부재(1, 2) 사이에 접착제 성분이 양호하게 충전됨으로써, 전자 부재(1, 2)끼리의 적합한 접착이 가능하게 된다.
다른 일 실시 형태에서는, 접착제 필름은, 제1 도전 입자(10)를 함유하는 제1 접착제층과, 제2 도전 입자(11)를 함유하는 제2 접착제층과, 제1 도전 입자(10)를 함유하는 제3 접착제층을 이 순으로 구비하고 있어도 된다. 이 경우, 제1 접착제층 및 제3 접착제층은 제2 도전 입자(11)를 함유하고 있지 않아도 되고, 제2 접착제층은 제1 도전 입자(10)를 함유하고 있지 않아도 된다. 이 실시 형태에 관계되는 접착제 필름은, 제2 전자 부재에도 절연층(6)이 마련되어 있는 경우에 적합하게 사용된다. 즉, 이 접착제 필름에서는, 제1 도전 입자(10)가 접착제 필름의 양측에 배치되어 있기 때문에, 제2 전자 부재에 절연층(6)이 마련되어 있는 경우에도, 제1 도전 입자(10)가 적합하게 당해 절연층(6)을 뚫을 수 있다.
실시예
이하, 실시예에 기초하여 본 발명을 더욱 구체적으로 설명하지만, 본 발명은 이하의 실시예에 한정되는 것은 아니다.
(용액 A1의 조제)
페녹시 수지(유니온 카바이드 가부시키가이샤제, 제품명: PKHC, 중량 평균 분자량: 45000) 50g을, 톨루엔(비점: 110.6℃)과 아세트산에틸(비점: 77.1℃)의 혼합 용제(질량비로 톨루엔:아세트산에틸=1:1)에 용해하여, 고형분 40질량％의 페녹시 수지 용액을 얻었다. 이 페녹시 수지 용액에, 라디칼 중합성 재료로서, 우레탄아크릴레이트(네가미 고교 가부시키가이샤제, 제품명: UN7700) 및 인산에스테르디메타크릴레이트(교에샤 가가꾸 가부시키가이샤제, 제품명: 라이트 에스테르 P-2M)와, 경화제로서 1,1-비스(t-헥실퍼옥시)-3,3,5-트리메틸시클로헥산(니찌유 가부시끼가이샤제, 제품명: 퍼헥사 TMH)을 페녹시 수지:우레탄아크릴레이트:인산에스테르디메타크릴레이트:경화제=10:10:3:2의 고형 질량비로 배합하여 용액 A1을 얻었다.
도전 입자 B1(제1 도전 입자)로서, 덴드라이트상의 도전 입자(은 피복 구리 입자, 미츠이 긴조쿠 고교 가부시키가이샤제, 제품명: ACBY-2)를 사용하였다.
(도전 입자 C1의 제작)
먼저, 디비닐벤젠, 스티렌 모노머 및 부틸메타크릴레이트의 혼합 용액에, 중합 개시제로서 벤조일퍼옥사이드를 투입하고, 고속으로 균일 교반하면서 가열하여 중합 반응을 행함으로써 미립자 분산액을 얻었다. 이 미립자 분산액을 여과하고 감압 건조함으로써, 미립자의 응집체인 블록체를 얻었다. 또한, 이 블록체를 분쇄함으로써, 각각 가교 밀도가 다른 평균 입자경 20㎛의 핵체(수지 입자)를 제작하였다.
이어서, 상기 핵체의 표면에, 팔라듐 촉매(무로마치 테크노스 가부시키가이샤제, 제품명: MK-2605)를 담지시키고, 촉진제(무로마치 테크노스 가부시키가이샤제, 제품명: MK-370)로 활성화시킨 핵체를, 60℃로 가온된, 황산니켈 수용액, 차아인산나트륨 수용액 및 타르타르산나트륨 수용액의 혼합액 중에 투입하고, 무전해 도금 전공정을 행하였다. 이 혼합물을 20분간 교반하고, 수소의 발포가 정지하는 것을 확인하였다. 이어서, 황산니켈, 차아인산나트륨, 시트르산나트륨 및 도금 안정제의 혼합 용액을 첨가하고, pH가 안정될 때까지 교반하고, 수소의 발포가 정지할 때까지 무전해 도금 후공정을 행하였다. 계속해서, 도금액을 여과하고, 여과물을 물로 세정한 후, 80℃의 진공 건조기로 건조시켜서 니켈 도금된 도전 입자 C1(제2 도전 입자)을 제작하였다.
[실시예 1]
<접착제 필름의 제작>
100체적부의 용액 A1에 대하여 45체적부의 도전 입자 B1과 15체적부의 도전 입자 C1을 분산시켜서, 혼합 용액을 얻었다. 얻어진 혼합 용액을, 두께 80㎛의 불소 수지 필름 상에 도포하고, 70℃에서 10분간 열풍 건조시킴으로써 용제를 제거하여, 불소 수지 필름 상에 형성된 두께 20㎛의 접착제 필름(접착제층)을 얻었다.
얻어진 접착제 필름을 접속 부재에 사용했을 때의 특성을 이하에 나타내는 수순으로 평가하였다.
<접속 구조체의 제작 및 평가>
(저압 접속 시의 도전성의 평가)
도 3의 (a), (b)에 도시하는 바와 같이, 얻어진 필름상의 접착제 조성물을 6㎜×6㎜로 잘라낸 접착제 필름(31)을 6㎜×50㎜의 구리박(32)의 대략 중앙에 배치하고, 가부시키가이샤 오하시 세이사쿠쇼제 BD-07을 사용하여 가열 가압(50℃, 0.1MPa, 2초간)을 행하여 첩부하였다. 계속해서, 도 3의 (c), (d)에 도시하는 바와 같이, 50㎜×6㎜의 알루미늄박 표면에, 절연층으로서 두께 2㎛의 폴리프로필렌층을 형성한 알루미늄 적층 필름(후지모리 고교 가부시키가이샤제, 제품명: 알루미나미네이트 필름 ZBP-0513)(33)을 준비하였다. 구리박(32)과 접착제 필름(31)의 적층체에 대하여 접착제 필름(31)을 덮도록 알루미늄 적층 필름(33)을 겹치고, 가부시키가이샤 오하시 세이사쿠쇼제 BD-07로 가열 가압(150℃, 1.0MPa, 10초간)을 행하였다. 이에 의해, 구리박(32), 접착제 필름(31), 절연층(폴리프로필렌층) 및 알루미늄박이 이 순으로 적층된 평가용의 접속 구조체를 얻었다. 얻어진 접속 구조체에 대하여 도 4에 도시한 바와 같이 전류계 및 전압계를 접속하고, 4 단자법으로 접속 저항(초기)을 측정하였다. 결과를 표 1에 나타내었다.
(신뢰성의 평가)
도 3의 (a), (b)에 도시하는 바와 같이, 얻어진 필름상의 접착제 조성물을 6㎜×6㎜로 잘라낸 접착제 필름(31)을 6㎜×50㎜의 구리박(32)의 대략 중앙에 배치하고, 가부시키가이샤 오하시 세이사쿠쇼제 BD-07을 사용하여 가열 가압(50℃, 0.5MPa, 2초간)을 행하여 첩부하였다. 계속해서, 도 3의 (c), (d)에 도시하는 바와 같이, 50㎜×6㎜의 알루미늄박 표면에, 절연층으로서 두께 2㎛의 폴리프로필렌층을 형성한 알루미늄 적층 필름(후지모리 고교 가부시키가이샤제, 제품명: 알루미나미네이트 필름 ZBP-0513)(33)을 준비하였다. 구리박(32)과 접착제 필름(31)의 적층체에 대하여 접착제 필름(31)을 덮도록 알루미늄 적층 필름(33)을 겹치고, 가부시키가이샤 오하시 세이사쿠쇼제 BD-07로 가열 가압(150℃, 3.0MPa, 10초간)을 행하였다. 이에 의해, 구리박(32), 접착제 필름(31), 절연층(폴리프로필렌층) 및 알루미늄박이 이 순으로 적층된 평가용의 접속 구조체를 얻었다.
얻어진 접속 구조체에 대하여 도 4에 도시한 바와 같이 전류계, 전압계를 접속하고, 4 단자법으로 접속 저항(초기)을 측정하였다. 또한, 단자를 알루미늄 적층 필름(33)에 접속할 때에는, 단자를 강하게 압박하여 충분히 도통시킨 후에 저항을 측정하였다. 또한, 에스펙 가부시키가이샤제 TSA-43EL을 사용하고, -20℃에서 30분간 유지, 10분간에 걸쳐서 100℃까지 승온, 100℃에서 30분간 유지, 10분간에 걸쳐서 -20℃까지 강온과 같은 히트 사이클을 500회 반복하는 히트 사이클 시험을 접속 구조체에 대하여 행한 후에, 상기와 마찬가지로 하여 접속 저항(히트 사이클 시험 후)을 측정하였다. 결과를 표 1에 나타내었다.
[비교예 1]
제1 접착제층 및 제2 접착제층에 있어서, 도전 입자 B1(제1 도전 입자)을 사용하지 않는 것 이외에는, 실시예 1과 마찬가지로 하여, 접착제 필름의 제작, 그리고, 접속 구조체의 제작 및 평가를 행하였다.
[비교예 2]
제1 접착제층 및 제2 접착제층에 있어서, 도전 입자 C1(제2 도전 입자)을 사용하지 않는 것 이외에는, 실시예 1과 마찬가지로 하여, 접착제 필름의 제작, 그리고, 접속 구조체의 제작 및 평가를 행하였다.
Figure pct00001
1: 제1 전자 부재
2: 제2 전자 부재
3: 접착제 필름(접착제층)
4: 제1 기판
5: 제1 전극
6: 절연층
7: 제2 기판
8: 제2 전극
10: 제1 도전 입자
11: 제2 도전 입자
20: 접속 구조체
21: 접속 부재

Claims (4)

  1. 제1 기판 및 상기 제1 기판 상에 형성된 제1 전극을 갖는 제1 전자 부재와, 제2 기판 및 상기 제2 기판 상에 형성된 제2 전극을 갖는 제2 전자 부재 사이에 접착제층을 배치하고, 상기 제1 전극과 상기 제2 전극이 서로 전기적으로 접속하도록, 상기 제1 전자 부재와 상기 제2 전자 부재를 상기 접착제층을 통하여 압착하는 공정을 구비하는, 접속 구조체의 제조 방법이며,
    상기 제1 전자 부재는, 상기 제1 전극의 상기 제1 기판과 반대측에 형성된 절연층을 더 갖고,
    상기 접착제층은, 덴드라이트상의 도전 입자인 제1 도전 입자와, 상기 제1 도전 입자 이외의 도전 입자이며, 비도전성의 핵체 및 해당 핵체 상에 마련된 도전층을 갖는 도전 입자인 제2 도전 입자를 함유하는, 제조 방법.
  2. 제1항에 있어서, 상기 도전층이, 금, 니켈 및 팔라듐으로 이루어지는 군에서 선택되는 적어도 1종을 함유하는, 제조 방법.
  3. 제1 기판, 상기 제1 기판 상에 형성된 제1 전극, 및 상기 제1 전극의 상기 제1 기판과 반대측에 형성된 절연층을 갖는 제1 전자 부재와,
    제2 기판, 및 상기 제2 기판 상에 형성된 제2 전극을 갖는 제2 전자 부재와,
    상기 제1 전극과 상기 제2 전극을 서로 전기적으로 접속하는 접속 부재를 구비하고,
    상기 접속 부재는, 덴드라이트상의 도전 입자인 제1 도전 입자와, 상기 제1 도전 입자 이외의 도전 입자이며, 비도전성의 핵체 및 해당 핵체 상에 마련된 도전층을 갖는 도전 입자인 제2 도전 입자를 함유하는, 접속 구조체.
  4. 제3항에 있어서, 상기 도전층이, 금, 니켈 및 팔라듐으로 이루어지는 군에서 선택되는 적어도 1종을 함유하는, 접속 구조체.
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