KR20200098411A - 다이 본딩용 유기 변성 실리콘 수지 조성물, 그의 경화물 및 광반도체 소자 - Google Patents

다이 본딩용 유기 변성 실리콘 수지 조성물, 그의 경화물 및 광반도체 소자 Download PDF

Info

Publication number
KR20200098411A
KR20200098411A KR1020200014599A KR20200014599A KR20200098411A KR 20200098411 A KR20200098411 A KR 20200098411A KR 1020200014599 A KR1020200014599 A KR 1020200014599A KR 20200014599 A KR20200014599 A KR 20200014599A KR 20200098411 A KR20200098411 A KR 20200098411A
Authority
KR
South Korea
Prior art keywords
group
component
resin composition
silicone resin
formula
Prior art date
Application number
KR1020200014599A
Other languages
English (en)
Korean (ko)
Inventor
마사나리 모테키
유키토 고바야시
Original Assignee
신에쓰 가가꾸 고교 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 신에쓰 가가꾸 고교 가부시끼가이샤 filed Critical 신에쓰 가가꾸 고교 가부시끼가이샤
Publication of KR20200098411A publication Critical patent/KR20200098411A/ko

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/50Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/06Preparatory processes
    • C08G77/08Preparatory processes characterised by the catalysts used
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/50Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
    • C08G77/52Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages containing aromatic rings
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40Additives
    • C09D7/60Additives non-macromolecular
    • C09D7/61Additives non-macromolecular inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40Additives
    • C09D7/60Additives non-macromolecular
    • C09D7/63Additives non-macromolecular organic
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • H01L33/56Materials, e.g. epoxy or silicone resin
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00Properties
    • C08L2201/08Stabilised against heat, light or radiation or oxydation
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00Applications
    • C08L2203/20Applications use in electrical or conductive gadgets
    • C08L2203/206Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/02Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/03Polymer mixtures characterised by other features containing three or more polymers in a blend
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/03Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
KR1020200014599A 2019-02-12 2020-02-07 다이 본딩용 유기 변성 실리콘 수지 조성물, 그의 경화물 및 광반도체 소자 KR20200098411A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2019-022786 2019-02-12
JP2019022786A JP7021137B2 (ja) 2019-02-12 2019-02-12 ダイボンディング用有機変性シリコーン樹脂組成物、その硬化物及び光半導体素子

Publications (1)

Publication Number Publication Date
KR20200098411A true KR20200098411A (ko) 2020-08-20

Family

ID=71999956

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020200014599A KR20200098411A (ko) 2019-02-12 2020-02-07 다이 본딩용 유기 변성 실리콘 수지 조성물, 그의 경화물 및 광반도체 소자

Country Status (4)

Country Link
JP (1) JP7021137B2 (zh)
KR (1) KR20200098411A (zh)
CN (1) CN111548729A (zh)
TW (1) TWI825270B (zh)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006342200A (ja) 2005-06-07 2006-12-21 Shin Etsu Chem Co Ltd ダイボンディング用シリコーン樹脂組成物
JP2011086844A (ja) 2009-10-19 2011-04-28 Shin-Etsu Chemical Co Ltd 発光ダイオード用ダイボンド材
JP2015140372A (ja) 2014-01-28 2015-08-03 信越化学工業株式会社 有機変性シリコーン樹脂組成物

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012046604A (ja) * 2010-08-26 2012-03-08 Shin-Etsu Chemical Co Ltd 多環式炭化水素骨格含有成分を含む硬化性シリコーン系組成物
TWI475050B (zh) * 2011-03-30 2015-03-01 Asahi Kasei Chemicals Corp 有機聚矽氧烷、其製造方法及含有有機聚矽氧烷之硬化性樹脂組成物
JP5805348B1 (ja) * 2014-02-07 2015-11-04 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 付加硬化型シリコーン組成物
JP6642740B2 (ja) * 2017-01-16 2020-02-12 信越化学工業株式会社 剥離シート用重剥離組成物及び剥離シート
JP6754318B2 (ja) * 2017-05-10 2020-09-09 信越化学工業株式会社 ダイボンディング用シリコーン樹脂組成物、ダイボンド材及び光半導体装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006342200A (ja) 2005-06-07 2006-12-21 Shin Etsu Chem Co Ltd ダイボンディング用シリコーン樹脂組成物
JP2011086844A (ja) 2009-10-19 2011-04-28 Shin-Etsu Chemical Co Ltd 発光ダイオード用ダイボンド材
JP2015140372A (ja) 2014-01-28 2015-08-03 信越化学工業株式会社 有機変性シリコーン樹脂組成物

Also Published As

Publication number Publication date
JP2020136281A (ja) 2020-08-31
TWI825270B (zh) 2023-12-11
CN111548729A (zh) 2020-08-18
TW202043420A (zh) 2020-12-01
JP7021137B2 (ja) 2022-02-16

Similar Documents

Publication Publication Date Title
KR101722089B1 (ko) 경화성 오가노폴리실록산 조성물 및 광반도체 장치
KR101722123B1 (ko) 경화성 오가노폴리실록산 조성물 및 광반도체 장치
JP5587148B2 (ja) 自己接着性ポリオルガノシロキサン組成物
KR101758384B1 (ko) 저가스투과성 실리콘 수지 조성물 및 광 반도체 장치
JP4300418B2 (ja) エポキシ・シリコーン混成樹脂組成物及び発光半導体装置
JP4586967B2 (ja) 発光半導体被覆保護材及び発光半導体装置
KR101136643B1 (ko) 발광 다이오드용 실리콘 수지 조성물
JP4614075B2 (ja) エポキシ・シリコーン混成樹脂組成物及びその製造方法、並びに発光半導体装置
US8895678B2 (en) Cross-linkable silicone composition and cross-linked product thereof
EP2758473B1 (en) Curable silicone composition for sealing an optical semiconductor element, method of producing a resin-sealed optical semiconductor element, and resin-sealed optical semiconductor element
JP2008019385A (ja) 硬化性シリコーンゴム組成物及びその硬化物
CN109749459B (zh) 加成固化型有机硅组合物、固化物、光学元件
JP4844732B2 (ja) 発光半導体装置
KR20220123417A (ko) 경화성 오가노폴리실록산 조성물 및 그의 경화물, 보호제 또는 접착제 및 전기·전자 기기
TWI767988B (zh) 固化性有機聚矽氧烷組成物以及半導體裝置
CN108864429B (zh) 固晶用硅酮树脂组合物、固晶材料及光半导体装置
CN111138860B (zh) 加成固化型硅酮树脂组合物、其固化物及光半导体装置
KR20220121847A (ko) 경화성 오가노폴리실록산 조성물 및 그의 경화물, 보호제 또는 접착제 및 전기·전자 기기
KR20200098411A (ko) 다이 본딩용 유기 변성 실리콘 수지 조성물, 그의 경화물 및 광반도체 소자
KR20210027139A (ko) 부가 경화형 실리콘 조성물 및 광학 소자
KR20200024719A (ko) 부가 경화형 실리콘 조성물 및 반도체 장치
JP2020070324A (ja) 付加硬化型シリコーン樹脂組成物、その硬化物、及び光半導体装置
KR20200096871A (ko) 다이 본딩용 유기 변성 실리콘 수지 조성물, 그의 경화물 및 광반도체 소자
KR20200103548A (ko) 부가 경화형 실리콘 조성물, 광반사재용 실리콘 경화물, 광반사재 및 광반도체 장치
WO2022172614A1 (ja) 硬化性シリコーン組成物及び接着剤

Legal Events

Date Code Title Description
A201 Request for examination