KR20200096985A - Shutter disk assembly, semiconductor processing apparatus and method - Google Patents

Abstract

The present disclosure provides a shutter disk assembly and a semiconductor processing apparatus and method. The shutter disk assembly includes a connecting member and a shutter pressing disk, wherein the connecting member moves the shutter pressing disk upward to a first position of the supporting surface of the base or a first position that does not overlap with the supporting surface of the base in a vertical direction. Covering the two positions, the rim portion of the shutter pressing disk contacts each other with the rim region of the upper surface of the work piece mounted on the base when the shutter pressing disk is located in the first position and the base is located in the cooling position. The shutter disk assembly provided by the present disclosure can deposit a thin film on the entire surface of a work piece when performing a process, and can implement effective and highly efficient cooling of the work object to be processed, thereby improving productivity.

Description

Shutter disk assembly, semiconductor processing apparatus and method

Embodiments of the present disclosure relate to a shutter disk assembly and a semiconductor processing apparatus and method.

Physical Vapor Deposition (PVD) technology uses a physical method in a vacuum condition to vaporize the surface of a material source (solid or liquid) into atoms or molecules in the form of gas, or ionize some of it into ions, and use a low pressure gas (or plasma). ) Process to deposit a thin film with some special functions on the surface of the substrate. Currently, not only metal films and alloy films can be deposited using PVD technology, but also compounds, ceramics, semiconductors, polymer films, and the like can be deposited.

The performance of the PVD device itself directly affects the quality and productivity of the film layer to be deposited, and as the demand for precision, quality and productivity of the film layer of various parts continues to increase, the performance of the PVD device itself is improved. Provided a lasting momentum to

According to an embodiment of the present disclosure, it includes a connecting member and a shutter pressing disk, wherein,

The connecting member moves the shutter pressing disk upwards of the base to cover a first position of the support surface of the base or a second position that does not overlap with the support surface of the base in a vertical direction;

In the rim portion of the shutter pressing disk, when the shutter pressing disk is located in the first position and the base is located in the cooling position, the rim portion of the shutter pressing disk is on the upper surface of the workpiece mounted on the base. A shutter disk assembly in contact with the rim area is provided.

In some examples, the shutter pressurizing disk is movably connected to the connecting member, so that when the base is lower than the cooling position, the rim portion is separated from each other, and the base is moved to the cooling position. In the ascending process, the base supports the shutter pressing disk so that the rim portion presses the rim region of the workpiece.

In some examples, the connection member is provided with a position fixing hole penetrating the connection member in a vertical direction. A position fixing protrusion is installed on an upper surface of the shutter pressing disk, and the position fixing protrusion is coupled to the position fixing hole, and when the base is lower than the cooling position, the shutter pressing disk passes through the position fixing protrusion. Try to hang on the connecting member. In the process of raising the base to the cooling position to support the shutter pressing disk, the position fixing protrusion is allowed to move upward with respect to the position fixing hole.

In some examples, the position fixing hole is a conical hole, and the diameter of the conical hole is gradually decreased from top to bottom.

In some examples, the position fixing protrusion includes a coupling portion, and the coupling portion is conical, and when the base is lower than the cooling position, the outer peripheral wall of the coupling portion is coupled to the hole wall of the conical hole.

In some examples, the position fixing hole is a direct hole, a step portion is installed on the hole wall of the direct hole, and the position fixing protrusion includes a coupling portion, and when the base is lower than the cooling position, at least a portion of the coupling portion is It is laminated and installed on the stepped portion.

In some examples, the position fixing protrusion further includes a columnar extension, the extension is installed vertically, the upper end of the extension is connected to the coupling part, and the lower end of the extension is connected to the shutter pressing disk, The outer diameter of the extension is smaller than the minimum diameter of the conical hole.

In some examples, further comprising a rotation mechanism, wherein the rotation mechanism is installed vertically on one side of the base to rotate the rotation shaft and the rotation shaft connected to the connection member so that the connection member is the first And a driving source that drives to rotate to the position or the second position.

In some examples, the shutter pressing disk includes a pressing disk body, a ring-shaped protrusion is formed in a lower surface rim region of the pressing disk main body to be used as the rim, and the ring-shaped protrusion is a closed ring-shaped shutter pressing disk. It is installed along the circumferential direction of, or the ring-shaped protrusion includes a plurality of sub protrusions, and a plurality of sub protrusions are installed to be spaced apart along the circumferential direction of the shutter pressing disk.

In some examples, the shutter pressing disk includes a pressing disk main body, and a ring-shaped protrusion is formed on an outer circumferential wall of the pressing disk main body, and the ring-shaped protrusion protrudes with respect to the lower surface of the pressing disk main body to the edge portion. Is used, and the ring-shaped protrusion is installed along the circumferential direction of the shutter pressing disk in a closed ring shape, or the ring-shaped protrusion includes a plurality of sub-protrusions, and a plurality of sub-protrusions are spaced along the circumferential direction of the shutter pressing disk. Is installed.

As another technical solution, the present disclosure further provides a semiconductor processing apparatus including a chamber, the chamber including a base and the shutter disk assembly provided in the present disclosure.

In the base, a bag blow pipe for introducing a bag blow gas into a gap between the support surface of the base and the lower surface of the workpiece is provided.

The base is elevating and lowering to move to the cooling position, loading/unloading position, or process position, the loading/unloading position is lower than the cooling position, and the process position is higher than the cooling position.

In some examples, the chamber,

A limit ring installed on the base and surrounded by the support surface to limit the position of the workpiece on the base;

A shielding member that is installed to be surround inside the sidewall of the chamber;

When the base is positioned at the process position, a gap between the limit ring and the shield member is blocked, and a baffle ring supported by the shield member after the base is lowered from the process position is further included.

In some examples, further comprising a shutter disk warehouse installed on one side of the chamber to communicate with the inside of the chamber, and accommodating the shutter pressing disk when the shutter pressing disk is located in the second position.

As another technical solution, the present disclosure is in a semiconductor processing method for processing a workpiece using the semiconductor processing apparatus provided in the present disclosure,

A process treatment step of maintaining the shutter pressing disk in the second position and raising the base to the process position to perform a process treatment on the entire upper surface of the work piece;

After stopping the process process, lowering the base from the process position to the loading/unloading position, moving the shutter pressing disk from the second position to the first position, and then raising the base to the cooling position So that the rim portion of the shutter pressurizing disk contacts each other with the rim region of the upper surface of the workpiece mounted on the base, and then, the support surface of the base and the lower surface of the workpiece using the back blow pipe It further provides a semiconductor processing method comprising a cooling step of introducing a bag blow gas into a gap therebetween.

In some examples, in the cooling step, the height of the cooling position is such that while the base is raised to the cooling position, the base moves upward with respect to the connecting member movably connected thereto. As the shutter pressing disk can be supported, the rim portion is set to press the rim region of the upper surface of the work piece.

In some examples, in the process treatment step, the process treatment includes a PVD process.

In the technical solution of the shutter disk assembly and semiconductor processing apparatus and method provided by the embodiment of the present disclosure, the shutter pressing disk is moved to a second position not overlapping with the support surface of the base in the vertical direction through the connection member, and the workpiece Since the surface may not be blocked at all, a thin film can be deposited on the entire surface of the work piece during the process. In addition, when the shutter pressing disk is located in the first position covering the support surface of the base and the base is located in the cooling position, the rim portion of the shutter pressing disk is in contact with the rim area of the upper surface of the workpiece mounted on the base. Therefore, when the bag blow gas flows into the gap between the support surface of the base and the lower surface of the work piece, the work piece is fixed to the base and ensures that it is not blown away by the wind, thereby providing effective and efficient cooling for the work piece to be processed. It can be implemented, and productivity can be improved.

In order to more clearly describe the technical solutions of the embodiments of the present invention, the drawings of the embodiments will be briefly described below. It is apparent that the drawings described below are only some embodiments of the present invention, and are not limited to the present invention.
Fig. 1 is a diagram showing the shutter disk being brought into the chamber;
Fig. 2 is a diagram showing that the shutter disk is withdrawn from the chamber;
3 is a diagram showing a cross section of a PVD device;
Fig. 4 is a view showing a base (no back blow duct is provided);
5 is a diagram showing a cross section of another PVD device;
6A is a view showing a cross section of a shutter disk assembly according to an embodiment of the present disclosure;
6B is a view showing a cross section of a position fixing part of a shutter disk assembly according to an embodiment of the present disclosure separated from a rotation arm/position fixing hole;
7A is a view showing a cross section of a shutter disk assembly according to an embodiment of the present disclosure;
7B is a view showing a cross-section of a shutter disk assembly according to an embodiment of the present disclosure;
8A is a view showing a cross section of a shutter disk assembly according to another embodiment of the present disclosure;
8B is a view showing a cross section of a shutter disk assembly according to another embodiment of the present disclosure;
8C is a view showing a cross-section of a shutter disk assembly according to another embodiment of the present disclosure;
9A is a view showing a cross section of a semiconductor processing apparatus according to an embodiment of the present disclosure (the base is positioned at a process position);
9B is a view showing a base (back blow pipe is provided) of a semiconductor processing apparatus according to an embodiment of the present disclosure;
10 is a view showing a cross section of a semiconductor processing apparatus according to an embodiment of the present disclosure (the base is located in a loading/unloading position); And
11 is a diagram illustrating a cross section of a semiconductor processing apparatus according to an embodiment of the present disclosure (the base is positioned at a cooling position).

Hereinafter, the technical solutions of the embodiments of the present invention will be described clearly and completely by combining the drawings of the embodiments of the present invention so that the objects, technical solutions, and advantages of the embodiments of the present invention are more clear. Apparently, the embodiments described therein are only some embodiments of the present invention, not all embodiments. All other examples obtained on the basis of the described embodiments of the present invention on the premise that a person skilled in the art does not require progressive labor falls within the scope of the present invention.

Unless otherwise defined, technical terms or scientific terms used in the present disclosure have a common meaning understood by a person having a general function in the field to which the present disclosure corresponds. The “first”, “second” and similar words used in the present disclosure do not indicate any order, quantity, or importance, but are intended to distinguish different constituent parts. Similar words such as “comprising” or “comprising” are interpreted as including the element or member listed after the word and the same as the element or member described before the word, and do not exclude other elements or members.

It will be described in more detail below by some embodiments disclosed in the present invention. In the specification disclosed in the present invention, the support surface of the base may mean a plane of one side of the base that is far from the chamber bottom wall. By defining the support surface as such a plane, the positional relationship between other members and the support surface can be more accurately described. In addition, when the semiconductor processing apparatus is mounted on the base, it may be arranged to move in a direction perpendicular to the support surface. In the direction perpendicular to the support surface, that is, in the vertical direction, the direction from the opposite side of the support surface of the base to the support surface is referred to as "up" direction, and the direction from the support surface to the opposite side of the support surface of the base is referred to as "down". It is called a direction. This gives a clear meaning to various positional relationships expressed as "top" and "bottom", or "top" and "bottom", such as, for example, upper surface, lower surface, rise, fall, upper wall, and floor wall. Is done. Further, for example, in the two surfaces of the work piece, the surface on which the base and the back are separated is referred to as “upper surface”, and the surface facing the base is referred to as “lower surface”. In addition, a direction parallel to the support surface, that is, a horizontal direction, a direction from the edge of the base toward the center is referred to as an "inward" direction, and a direction from the center of the base toward the edge is referred to as an "outward" direction. . Therefore, a clear meaning is also given to the relative positional relationship expressed as "inside" and "outside", such as "inside" and "outside". In addition, it should be noted that the terms indicating the orientation in the above are merely exemplary and represent the relative positional relationship of each member, and the combination of parts or the entire device or equipment among various devices or equipment disclosed in the present invention may rotate at a certain angle as a whole. I can.

The workpiece disclosed in the present invention may be, for example, a tray supporting a wafer to be deposited, or a single wafer to be deposited or a combination structure in which the wafer is attached to the tray, according to the embodiment disclosed in the present invention. Do not limit.

In the PVD process, a process gas including an inert gas and a reactive gas is introduced into the process chamber, and DC or RF power is applied to the target material to excite the gas in the chamber to form a plasma to impact the target material, The target material particles sputtered by the impact fall on the surface of the workpiece to form a thin film. In addition to depositing the target material particles on the surface of the workpiece, they are also deposited on members such as the walls of the chamber. In order to prevent the sputtering material from being deposited directly on members such as the wall of the chamber, a process kit is generally added inside the PVD chamber to protect the inner wall of the chamber. In order to ensure the process result, when the deposited film of the process kit reaches a certain thickness, the process chamber is opened and the process kit therein is replaced.

The process chamber must always be kept in a vacuum state, and it is opened only when the target material or process kit is replaced, and the chamber is restored to a vacuum state when the replacement is completed. Target materials exposed to the atmosphere cause a reaction with the atmosphere to oxidize the surface. Therefore, at the initial stage of recovery of the chamber, defects exist on the surface of the target material and cannot be used in a normal process. Typically, a shutter disk can be used to block the base, and a high-temperature burn-in process is then performed to sputter defects on the surface of the target material to the shutter disk. After the defective part is sputtered, the normal process can be performed immediately by removing the shutter disk.

1 and 2 are views showing that the shutter disk is drawn into and out of the chamber, respectively. 1 is a perspective view showing a case where the shutter disk is positioned above the base, and FIG. 2 is a bird's eye view showing a case where the shutter disk is removed from the upper side of the base. 1 and 2, the shutter disk 121 is located on the shutter disk tray 122, the shutter disk tray 122, the shutter disk 121 is a chamber together with the shutter disk tray 122 It is connected to the tray rotation shaft 123 so as to be drawn in or withdrawn to the tray 10 and rotated along the tray rotation shaft 123 by the tray rotation shaft 123. The shutter disk 121 is inserted into the chamber 10 and is positioned above the base 124 to block the base during the high-temperature burn-in process. In FIG. 1, the base mounting screw 125 is further shown.

PVD technology mainly uses an electrostatic chuck (ESC) or mechanical chuck to support the work piece. In the process of performing the PVD process on the wafer, the work piece generally generates heat, and heat energy is difficult to transfer in a vacuum. In order to induce thermal energy of the work piece, in general, an electrostatic chuck or a mechanical chuck is used to fix the work piece, and at the same time, a back blow gas is transferred to the back of the work piece to cool the wafer.

3 is a diagram showing a cross section of the DC magnetron sputtering device 1. The DC magnetron sputtering apparatus 1 includes a chamber body 100, and a space limited by the chamber body 100 constitutes the chamber 10. For example, the chamber body 100 includes a bottom wall 1001 and a side wall 1002. A base 101 is installed in the chamber 10, and the base 101 may be installed on the bottom wall 1001. The base 101 may be a chuck for a machine on which the workpiece 102 is mounted, and the base 101 can be raised and lowered so that it can be raised to a process position or lowered to a loading/unloading position. When the base 101 is located in the process position, by pressing the upper surface edge area of the workpiece 102 using a cover ring 103 having a constant weight, the workpiece 102 ) Is fixed to the base 101 to perform a sputtering process. The shielding member 104 is disposed to surround at least a part of the side wall 1002 of the chamber body 100 and is connected to the side wall 1002 of the chamber body 100, and when the base 101 descends from the process position, the cover ring ( 103) can be arranged to support. The target material 105 is sealed to the vacuum chamber body 100, the target material 105 may be seated on the upper portion of the chamber 10, and a direct current power supply (not shown) installed outside the chamber 10 and electrical The direct current power source may provide a bias voltage to the target material 105. The insulating material 107 and the target material 105 constitute a sealed chamber, and the deionized water 106 is filled in the chamber, and the insulating material 107 can use a material of high insulating performance, for example It includes glass fiber and resin composites, and G10 can be used as an additional example. During sputtering, a direct current (DC) power source applies a bias voltage to the target material 105 so that it becomes a negative pressure with respect to the grounded chamber body 100, thereby exciting and discharging argon gas to generate plasma. Argon ions having positive electricity are attracted to the target material 105 of negative bias. When the energy of the argon ions is sufficiently high, metal atoms protrude from the surface of the target material and are deposited on the workpiece 102. The above has been described with the introduction of argon gas as an example, and other process gases such as nitrogen gas may also be introduced. In FIG. 3, a magnetron 108 and a motor 109 for driving and moving the magnetron 108 are further illustrated. The magnetron 108 is installed on the upper side of the target material 105 and scans the surface of the target material 105 by driving the motor 109, so that plasma can be aggregated under the target material 105.

In addition, during sputtering, a certain amount of bag blow gas is introduced to the rear surface of the workpiece 102 through the conduit 110 located at the center of the base 101, so that the thermal energy of the workpiece 102 is transmitted through a gas heat transfer method. By transferring to the base 101, it is possible to implement cooling of the workpiece 102.

However, in PVD equipment in the field of encapsulation, since the cover ring 103 presses the upper surface edge area of the work piece 102, the thin film cannot be deposited on the upper surface edge area of the work piece 102 during deposition. Since the process (eg, electroplating) is affected, the method of fixing and cooling the workpiece 102 used in the PVD equipment is relatively limited in application. The electrostatic chuck cannot be applied on a large scale to PVD equipment in the field of encapsulation due to its high cost and complex technology.

4 shows a structure diagram of a base assembly without a back blow, and a thin film can be deposited on the edge of a wafer by the base structure without a back blow. The base 126 may include a base body 1261 and an upper plate 1262 installed on the base body 1261. In FIG. 4, a limit ring 127 positioned at an edge of the upper plate 1262 is further illustrated. The base body 1261, the top plate 1262 and the limit ring 127 are assembled together to support and position the wafer. In a normal process, the wafer can be seated on the top plate 1262. The base 126 is a carrier of the wafer. The upper plate 1262 is a component on the uppermost surface of the base 126 and may be fixed to the base body 1261 through screws. The limit ring 127 may be fixed to the upper plate 1262 through screws to limit the position of the wafer on the upper plate 1262.

5 shows a diagram showing a chamber structure without a bag blow. A limit ring 127 is installed on the edge of the base 126, and a shielding member 104 is further included in the chamber 10, and the shielding member 104 is at least partially surrounded in the sidewall of the chamber body 100. It is connected to the sidewall of the chamber body 100 and may be disposed to support a baffle ring 128. The baffle ring 128 may be lifted while the base 126 is raised to the process position, and may be supported by the shielding member 104 when the base 126 is lowered from the process position. The baffle ring 128 blocks a gap between the limit ring 127 and the shield member 104 when the base 126 is positioned at the process position, and a detailed structure of the baffle ring 128 will be described in detail below. To In a normal process, the baffle ring 128 only acts as a blocking action, and does not press the rim of the work piece 102 to ensure that a thin film can be deposited on the entire surface of the work piece 102. However, since the workpiece 102 is only seated on the base 126 and not fixed, the workpiece 102 cannot be cooled using a back blow. In order to solve such a cooling problem of the chamber, the cooling of the workpiece 102 is currently implemented using the following method. First, a process step is performed to deposit a thin film having a predetermined thickness on the work piece 102, and after the temperature of the work piece 102 rises, the process step is stopped to perform a cooling step. That is, by directly filling a large amount of gas into the chamber, the pressure of the chamber is increased by 1 torr and is maintained for a certain period of time so that heat exchange between the work piece 102 and the upper plate 1262 proceeds, thereby causing the work piece 102 ) Is cooled, and then the gas is extracted. Subsequently, the process step is performed, the cooling step is repeated after the temperature rises, and the thin film deposition at a constant temperature is completed by circulating in this way.

However, in the semiconductor processing method, the gas-filled cooling has a relatively slow cooling rate, the gas pressure at the back of the wafer reaches a maximum of 1 torr, and a long time is required for the holding process to sufficiently cool the wafer. When filling at a higher pressure, more time is required for the gas filling and extraction process, which affects the overall productivity. In addition, due to the process, the load of the vacuum condensing pump in the chamber is excessively increased, and the regeneration cycle of the vacuum pump is shortened.

In order to solve the above problem, an embodiment of the present disclosure provides a shutter disk assembly, a semiconductor processing apparatus and a method for depositing a thin film on the entire surface of the work piece, effectively cooling the work piece, and improving productivity.

6A illustrates a shutter disk assembly 11 provided by an embodiment of the present disclosure, which includes a connecting member 1112 and a shutter pressing disk 113, wherein the connecting member 1112 is a shutter pressing disk 113 ) To the upper side of the base 116 (not shown in FIG. 6A, and may refer to the base 116 shown in FIG. 10), and the support surface 11601 of the base 116 (see FIG. 6A) Not shown, reference may be made to the support surface 11601 shown in FIG. 9B) at a first position L1 (not shown in FIG. 6A, see the first position L1 shown in FIG. 11) Can be), so that when performing a high-temperature burn-in process on the target material, the defective portion of the target material surface can be sputtered onto the shutter pressing disk 113. Specifically, the projection of the shutter pressing disk 113 from the support surface 11601 of the base 116 completely covers the support surface 11601. Alternatively, the connecting member 1112 holds the shutter pressing disk 113 in a second position L2 that does not overlap with the support surface 11601 of the base 116 in the vertical direction (not shown in FIG. 6A, but in FIG. 9A). It is moved to the second position (L2) shown) so that the support surface 11601 of the base 116 is not blocked at all, so that the entire area of the workpiece surface on the support surface during the thin film deposition process is Allows a thin film to be deposited.

6A, in some examples, the shutter disk assembly 11 is vertically installed on one side of the base 116 and includes a rotation shaft 111 and a driving source (not shown) connected to the connection member 1112. It further includes a rotating mechanism that includes. Optionally, the connecting member 1112 is in the form of a cantilever. The driving source rotates the rotation shaft 111 to drive the connecting member 1112 to rotate to the first position L1 or the second position L2 along the rotation shaft 111. Although the rotation direction of the rotation shaft 111 is shown in FIG. 6A, in practical applications, the rotation direction of the rotation shaft 111 is not limited to that shown in the drawings.

The edge portion (E) of the shutter pressing disk 113 indicates the position where the shutter pressing disk 113 is located at the first position L1 and the base 116 is at a cooling position (the base 116 shown in FIG. 11 is located). If located in), the rim portion (E) of the shutter pressing disk 113 is in contact with the rim region of the upper surface of the work piece seated on the support surface 11601 of the base 116, and the base When the bag blow gas is introduced into the gap between the support surface 11601 of 116 and the lower surface of the work piece, the work piece is fixed to the base 116 and is guaranteed not to be blown away by the wind. Effective and highly efficient cooling can be implemented, thereby improving productivity.

In this embodiment, the shutter pressing disk 113 includes a direct plate type pressing disk body, and a ring-shaped protrusion 1132 is formed in the rim area of the lower surface 11302 of the pressing disk body to be used as the rim portion E. , When the shutter pressing disk 113 is located in the first position (L1) and the base 116 is located in the cooling position, the lower surface 11320 of the ring-shaped protrusion 1132 is the support surface 11601 of the base 116 The concave portions 0113 located inside the ring-shaped protrusions 1132 and in contact with the rim regions of the upper surface of the workpiece to be seated on the workpiece 102 do not contact the workpiece 102. The formation of the concave portion (0113) is advantageous for protection of the upper surface of the work piece and is to prevent breakage of the effective area of the work piece.

In this embodiment, the ring-shaped protrusion 1132 is installed along the circumferential direction of the shutter pressing disk 113 in a closed ring shape. Of course, in practical applications, the ring-shaped protrusion 1132 may have a non-continuous ring-shaped structure. For example, the ring-shaped protrusion 1132 includes a plurality of sub-protrusions, and a plurality of sub-protrusions are installed to be spaced apart along the circumferential direction of the shutter pressing disk 113.

6A, in some examples, in order to facilitate manufacturing and reduce the occupied space of the shutter pressing disk 113, the upper surface 11301 and the lower surface 11302 of the shutter pressing disk 113 are Each may be a flat surface, but the present invention is not limited thereto. For example, the upper surface 11301 and the lower surface 11302 may be curved or arc-shaped.

6A and 6B, in some examples, the shutter pressing disk 113 is movably connected with the connecting member 1112, so that the base 116 is in a cooling position (the base shown in FIG. If it is lower than the position where 116 is located), the shutter pressurizing disk 113 is made so that the edge portion E (that is, the ring-shaped protrusion 1132) of the shutter pressing disk 113 is separated from the work piece. ) Can still move with the connecting member 1112; Alternatively, in the process of ascending the base 116 to the cooling position, the base 116 supports the shutter pressing disk 113 so that the rim portion E presses the rim of the workpiece. In other words, the shutter pressing disk 113 is raised by a certain distance along the base 116, whereby the shutter pressing disk 113 can pressurize the workpiece by using its own gravity.

Hereinafter, a specific method in which the shutter pressing disk 113 and the connection member 1112 are movably connected will be described in detail. Specifically, as shown in FIG. 6B, the connection member 1112 is provided with a position fixing hole 1120 penetrating the connection member 1112 in the vertical direction. A position fixing protrusion 1131 is installed on the upper surface 11301 of the shutter pressing disk 113, and the position fixing protrusions 1131 are coupled to each other with the position fixing hole 1120, so that the base 116 is lower than the cooling position. When it is low, the shutter pressing disk 113 is suspended from the connection member 1112 through the position fixing protrusion 1131. In the process of raising the base 116 to the cooling position to support the shutter pressing disk 113, the position fixing protrusion 1131 is allowed to move upward with respect to the position fixing hole 1120. The movable connection has a relatively simple structure and is easy to manufacture.

Preferably, the position fixing hole 1120 is a conical hole, and the diameter of the conical hole is gradually decreased from top to bottom. When the size of the position fixing protrusion 1131 is larger than the minimum diameter of the conical hole, it may be suspended from the connection member 1112. The conical hole has a simple structure and is easy to manufacture, and the centering of the shutter pressing disk 113 is convenient.

In addition, as shown in FIG. 6A, in some examples, the position fixing protrusion 1131 includes a coupling portion 11311, and the coupling portion 11311 is conical, and the base 116 is more than the cooling position. When it is low, the outer circumferential wall of the coupling portion 11311 is coupled to the hole wall of the conical hole, so that a function capable of centering and activating the shutter pressing disk 113 can be implemented. Specifically, the inclination angle of the outer circumferential wall of the coupling portion 11311 is the same as the inclination angle of the hole wall of the conical hole, whereby the coupling portion 11311 is advantageous for leaving the position fixing hole 1120, and the shutter pressing disk 113 ) Is limited to the position fixing hole 1120 when descending, so that the position of the shutter pressing disk 113 in the position fixing hole 1120 is unique, so that the shutter pressing disk 113 is It is possible to ensure that the pressurization does not come off when the pressure is pressed, and in addition, when the shutter pressurizing disk 113 is positioned at the first position L1, it is advantageous to be positioned directly above the base 116.

In addition, a constant vertical gap is provided between the shutter pressing disk 113 and the connecting member 1112 to allow the shutter pressing disk 113 to move upward by being supported by the base 116, and the position fixing protrusion 1131 Further includes an extension part 11312, the extension part 11312 is installed vertically, the upper end of the extension part 11312 is connected to the coupling part 11311, and the lower end of the extension part 11312 presses the shutter It is connected to the disk 113. In addition, the outer diameter of the extension part 11312 is smaller than the minimum diameter of the conical hole, so that the extension part 11312 can penetrate the conical hole.

Optionally, a method in which the extension portion 11312 is connected to the coupling portion 11311 and the shutter pressing disk 113 may be welded, buckled, screwed, or the like.

It should be explained that in this embodiment, the position fixing hole 1120 is a conical hole, but the present invention is not limited thereto, and in practical applications, the position fixing hole 1120 may apply other arbitrary structures. For example, the position fixing hole 1120 is a direct hole, and a step portion is installed on the hole wall of the direct hole, and when the base is lower than the cooling position, at least a portion of the coupling portion 11311 is stacked and installed on the step portion.

As shown in FIG. 6B, in some examples, the position fixing protrusion 1131 may be located at a center position of the shutter pressing disk 113 to maintain equilibrium when the shutter pressing disk 113 is stopped or rotated. .

It should be explained that in this embodiment, the pressurizing disk body is a direct plate type, but the present invention is not limited thereto, and in practical application, as shown in Fig. 7A, in some examples, the pressurizing disk main body is an arc-shaped plate It may have a shape, and the arc-shaped plate is concave in a direction away from the support surface 11601 of the base 116.

It should be described further that, in this embodiment, a ring-shaped protrusion 1132 is formed in the rim region of the lower surface 11302 of the pressing disk main body to be used as the rim portion E, but the present invention is not limited thereto, In practical application, as shown in FIG. 7B, in some examples, a ring-shaped protrusion 1132 is formed on the outer peripheral wall of the pressing disk main body, and the corresponding ring-shaped protrusion 1132 protrudes from the lower surface of the pressing disk main body. It is used as the border part (E). Specifically, the pressing disk body has an arc-shaped plate shape, and the arc-shaped plate is concave in a direction away from the support surface 11601 of the base 116 to form a concave portion 0113. The ring-shaped protrusion 1132 protrudes in a horizontal direction away from the center of the pressing disk body with respect to the outer peripheral wall of the pressing disk body. Since the pressure disk body is in the form of an arc plate, the lower surface 11320 of the ring-shaped protrusion 1132 becomes lower than the lower surface 11302 (arc concave surface) of the pressure disk body, thereby contacting the edge area of the upper surface of the workpiece. Can be. Of course, in practical applications, the pressing disk body may be in the form of a direct plate, and the ring-shaped protrusion 1132 is installed on the outer peripheral wall of the pressing disk body and protrudes from the lower surface of the pressing disk body, which is the same as the upper surface of the workpiece. Can be in contact with each other with the border area of

In an actual application, the ring-shaped protrusion 1132 is a closed ring shape and is installed along the circumferential direction of the shutter pressing disk 113, or the ring-shaped protrusion 1132 includes a plurality of sub protrusions, and a plurality of sub protrusions It is installed to be spaced apart along the circumferential direction of the shutter pressing disk 113.

It should be described that the shape of the shutter pressing disk 113 is not limited to those listed in the above example, for example, the shutter pressing disk 113 further includes a conical disk having a concave portion and a rim protrusion. It may be possible, and the rim portion of the shutter pressing disk 113 and the rim region of the upper surface of the workpiece should be in contact with each other, and the remaining portions should not be in contact with the workpiece.

It should be further explained that the structure and the coupling method of the position fixing hole 1120 and the position fixing protrusion 1131 are not limited to those listed in the above example, for example, as shown in FIG. 8A, The position fixing hole 1120 is a conical hole, and the position fixing protrusion includes a coupling part 11311 and an extension part 11312, and both are integrally formed to form one conical column, and the outer diameter of the conical column is upper When the base 116 is lower than the cooling position, the outer circumferential wall of the coupling portion 11311 is completely in close contact with the hole wall of the conical hole, and the extension portion 11312 is at the lower side of the connection member 1112 It is positioned so that a constant vertical gap can be provided between the shutter pressing disk 113 and the connecting member 1112.

In addition, as shown in FIG. 8B, the position fixing hole 1120 is a direct hole, and the position fixing protrusion 1131 includes a coupling part 11311 and an extension part 1312, both of which are column-shaped, Here, the outer diameter of the coupling portion 11311 is larger than the diameter of the direct hole, the coupling portion 11311 is laminated and installed on the upper surface of the connection member 1112, and the outer diameter of the extension portion 11312 is smaller than the diameter of the straight hole, The upper end of the extension part 11312 is connected to the coupling part 11311, and the lower end of the extension part 11312 is connected to the shutter pressurizing disk 113 by vertically penetrating the position fixing hole 1120 toward the bottom. A constant vertical gap may be provided between the shutter pressing disk 113 and the connecting member 1112.

In addition, as shown in FIG. 8C, the position fixing hole 1120 is a conical hole, and the position fixing protrusion includes a first coupling part 11311 and a second coupling part 11312. Here, the first coupling portion 11311 is a columnar shape, the outer space is larger than the maximum diameter of the direct hole, and the first coupling portion 11311 is stacked and installed on the upper surface of the connection member 1112. The second coupling portion 11312 has a conical column shape, and when the base 116 is lower than the cooling position, the outer circumferential wall of the second coupling portion 11311 is completely in close contact with the hole wall of the conical hole, and the second coupling portion 11312 The rest of the part is located under the connection member 1112, the upper end of the second coupling part 11312 is connected to the first coupling part 11311, and the lower end of the second coupling part 11312 is a shutter pressing disk ( 113), a constant vertical gap may be provided between the shutter pressing disk 113 and the connection member 1112.

As described above, in the shutter disk assembly provided by the embodiment of the present disclosure, the shutter pressing disk is moved to a second position not overlapping with the support surface of the base in the vertical direction through the connecting member, so that the surface of the workpiece is not blocked at all. As a result, it is possible to deposit a thin film on the entire surface of the workpiece when performing the process. In addition, the rim portion of the shutter pressing disk is in contact with the rim area of the upper surface of the workpiece mounted on the base when the shutter pressing disk is located in the first position covering the support surface of the base and the base is located in the cooling position. , When the bag blow gas is introduced into the gap between the support surface of the base and the lower surface of the work piece, it ensures that the work piece is fixed to the base and does not blow away by the wind, thereby providing effective and highly efficient cooling for the work piece to be processed. It can be implemented, and productivity can be improved.

As another technical solution, an embodiment of the present disclosure further provides a semiconductor processing apparatus. For example, the semiconductor processing device may be a PVD device.

In this embodiment, as shown in FIG. 9A, the semiconductor processing apparatus includes a chamber 10, and the chamber 10 includes a base 116 and a shutter disk assembly provided in any of the above embodiments of the present disclosure. It includes (11). Here, in the base 116, a back blow pipe 110 for introducing the back blow gas into the gap between the support surface 11601 of the base 116 and the lower surface of the workpiece 102 is provided. The base 116 is elevating and lowering, that is, a cooling position (not shown in Fig. 9A, but may refer to a position where the base 116 shown in Fig. 11 is located) or a loading/unloading position (Fig. 9A. Although not shown in, it is supported to move to the position where the base 116 shown in Fig. 10 is located) or the process position (refer to the position where the base 116 shown in Fig. 9A is located) It can move in a direction perpendicular to the surface 11601, and the loading/unloading position is lower than the cooling position, and the process position is higher than the cooling position. In the drawing of the exemplary embodiment of the present disclosure, an elevating mechanism capable of moving the base 116 in a direction perpendicular to the support surface 11601 is omitted.

It should be described that the back blow conduit 110 may be installed according to demand, is not limited to that shown in the drawings, and any one capable of implementing a back blow is sufficient. In the embodiment of the present disclosure, the bag blow gas introduced into the bag blow pipe is used to cool the workpiece 102, and of course, in practical applications, according to different process demands, the bag blow gas is used for the workpiece 102 ) Can also be used for heating.

It should be described that the shutter disk assembly provided in the embodiment of the present disclosure is not limited to being applied to a PVD device, and may be applied to other semiconductor manufacturing processes.

9A, in some examples, the semiconductor processing apparatus is installed on one side of the chamber 10 and communicates with the interior of the chamber 10, and the shutter pressing disk 113 is at the second position L2. If located, it further includes a shutter disk warehouse (010) that accommodates the shutter pressing disk (113).

9A, in some examples, the chamber 10 further includes a limit ring 127, a shield member 104 and a baffle ring 128, wherein the limit ring 127 is a base 116 ) And surrounds the periphery of the support surface 11601, limiting the position of the workpiece 102 at the base 116. For example, the limit ring 127 may have a stepped portion in the vicinity of the workpiece 102 seated on the base 116, which is advantageous in limiting the workpiece 102. When the work piece 102 is seated on the limit ring 127, the surface away from the base 116 of the work piece 102 is completely exposed, that is, the limit ring 127 is any part of the work piece 102. Does not cover the upper side. Thereby, it is advantageous to deposit a thin film over the entire area of the upper surface of the workpiece 102.

The baffle ring 128 blocks the gap between the limit ring 127 and the shield member 104 when the base 116 is positioned at the process position, and after the base 116 is lowered from the process position, the baffle ring 128 is supported by the shielding member 104. In addition, the target material 105, the shielding member 104, the baffle ring 128 and the workpiece 102 are surrounded to form one process zone, and plasma is generated in the process zone. The baffle ring 128 and the shielding member 104 serve to form a relatively sealed reaction environment and prevent deposits from contaminating the inner wall of the chamber. For example, the inner diameter of the baffle ring 128 is larger than the diameter of the workpiece 102 and smaller than the outer diameter of the limit ring 127. When the baffle ring 128 presses the limit ring 127, the value of the gap between the baffle ring 128 and the shielding member 104 is within a limited range, and when the baffle ring 128 is lifted, plasma Becomes more favorable for sealing of

In the example shown in FIG. 9B, a perspective view showing the base 116 and the limit ring 127 is shown. The base 116 may include a base body 1161 and an upper plate 1162 installed on the base body 1161. In FIG. 9B, a limit ring 127 positioned at the edge of the upper plate 1162 is further illustrated. The base body 1161, the top plate 1162, and the limit ring 127 are assembled together to support the workpiece 102 and limit the position. In a normal process, the workpiece 102 may be seated on the top plate 1162. The base 116 is a carrier for the workpiece 102. The upper plate 1162 is a component on the uppermost surface of the base 116 and may be fixed to the base body 1161 through screws. The limit ring 127 may be fixed to the upper plate 1162 through screws.

In the semiconductor processing apparatus provided in the embodiment of the present disclosure, by using the shutter disk assembly provided in the embodiment of the present disclosure, the surface of the work piece can be prevented from being blocked at all, so that the entire surface of the work piece is Thin films can be deposited. In addition, when the bag blow gas is introduced into the gap between the support surface of the base and the lower surface of the work piece, the work piece is fixed to the base and ensures that it is not blown away by the wind, thereby providing effective and highly efficient cooling for the work piece to be processed. It can be implemented, and productivity can be improved.

As another technical solution, the embodiment of the present disclosure further provides a semiconductor processing method, which processes the workpiece 102 using the semiconductor processing apparatus provided in any of the above-described embodiments, but is not limited thereto. . The semiconductor processing method,

A process treatment step of performing a process treatment on the entire upper surface of the work piece 102 by holding the shutter pressing disk 113 at the second position L2 and raising the base 116 to the process position;

After stopping the process process, lowering the base 116 from the process position to the loading/unloading position, and moving the shutter pressing disk 113 from the second position L2 to the first position L1, the base ( 116) is raised to the cooling position, so that the rim portion E of the shutter pressing disk 113 contacts each other with the rim region of the upper surface of the workpiece 102 mounted on the base 116, and then, back blow And a cooling step of introducing a bag blow gas into the gap between the support surface 11601 of the base 116 and the lower surface of the workpiece 102 using the conduit 110.

In the process processing step, the back blow pipe 110 is closed, if not closed, the workpiece 102 may fly away, and the temperature rise of the workpiece 102 during the thin film deposition process is very rapid and reaches the upper temperature range. It should switch to the cooling stage.

Optionally, in the process treatment step, the process treatment comprises a PVD process.

Optionally, in the cooling step, the height of the cooling position is, while the base 116 rises to the cooling position, the base 116 is a connecting member 1112 to which the shutter pressing disk 113 is movably connected thereto. The shutter pressing disk 113 can be raised to move upward relative to ), so that the rim portion E of the shutter pressing disk 113 is set to press the rim region of the upper surface of the workpiece 102. Thus, the shutter pressing disk 113 can press the workpiece 102 using its own gravity.

In some examples, the method involves replacing the process assembly in the chamber 10 (e.g., replacing at least one of the shielding member 104, the baffle ring 128, and the limit ring 127 in the chamber) and then hot burn-in. When performing the process, it further includes blocking the base 116 using the shutter pressing disk 113. Thereby, the shutter pressing disk 113 can aggregate the functions of the covering ring and the shutter disk, so that the performance of the device is improved and the device structure is simplified.

In the above, steps related to the cooling process in the semiconductor processing method according to the embodiment of the present disclosure have been described, and other steps such as thin film deposition may refer to conventional PVD operation steps. In order to more clearly describe a semiconductor processing method according to an embodiment of the present disclosure, an example of a semiconductor processing method applied to a corresponding device will be described in detail below.

Thin film deposition step: When the work piece 102 performs a process, the base 116 supports the work piece 102 and raises it to a process position (as shown in FIG. 9A), and the limit ring 127 is the work piece. The left and right positions of the baffle ring 128 are limited, and the target material (for example, metal) sputtered by the baffle ring 128 is blocked from flowing into other parts of the chamber, and the target material 105, which is a sputtered material, is used in the chamber 10 ) Is seated on the upper side, at this time, the shutter pressing disk 113 enters the shutter disk warehouse 010 according to the rotation of the rotation shaft 111.

Back blow cooling step: As shown in FIG. 10, the base 116 is lowered to the loading/unloading position, the work piece 102 is lowered to the lower position along the base 116, and then the shutter pressurizing disk (113) is inserted above the work piece (102). Since the loading/unloading position where the base 116 is located is lower than the cooling position, interference between the base 116 and the shutter pressing disk 113 can be prevented.

When the above operation is completed, as shown in FIG. 11, the base 116 is raised to the cooling position, and the workpiece 102 is raised along the base 116 to lift the shutter pressing disk 113, and the shutter The pressing disk 113 is moved upward by a certain distance with respect to the connection member 1112, whereby the rim portion E of the shutter pressing disk 113 presses the rim area of the upper surface of the workpiece 102, and this When the weight of the shutter pressing disk 113 presses the workpiece 102, the gap between the support surface 11601 of the base 116 and the lower surface of the workpiece 102 using the back blow pipe 110 The bag blow gas can be introduced. For example, the weight of the shutter pressurizing disk 113 may be greater than the product of the area of the workpiece 102 and the gas pressure on the rear surface thereof, and for example, the corresponding gas pressure may be within 7 torr. Not limited.

When cooling is complete, gas inflow is stopped, the base 116 is lowered while supporting the workpiece 102, and the base 116 is held until the shutter pressing disk 113 is also suspended from the connecting member 1112. It descends accordingly (as shown in FIG. 10). Next, the shutter pressing disk 113 is brought into the shutter disk storage 010, and the base 116 is raised to the process position (as shown in Fig. 9A), and a thin film deposition process is continuously performed. In this way, the thin film deposition step and the back blow cooling step are cyclically performed.

Some explanations are needed below.

(1) Embodiments disclosed in the present invention In the drawings, only structures related to embodiments of the present disclosure are described, and other structures may refer to conventional designs.

(2) As long as there is no conflict, features in the same embodiment and different embodiments disclosed in the present invention can be combined with each other.

The above is merely an exemplary implementation manner of the present invention, and is not intended to limit the protection scope of the present invention, and the protection scope of the present invention will be determined by the appended claims.

Claims (16)

Including a connecting member and a shutter pressing disk,
The connecting member moves the shutter pressing disk upwards of the base to cover a first position of the support surface of the base or a second position that does not overlap with the support surface of the base in a vertical direction;
In the rim portion of the shutter pressing disk,
When the shutter pressing disk is located in the first position and the base is located in the cooling position, the rim of the shutter pressing disk is in contact with the rim area of the upper surface of the workpiece mounted on the base. Shutter disc assembly. The method of claim 1,
The shutter pressing disk is movably connected to the connection member, and when the base is lower than the cooling position, the edge portion is separated from each other and the base rises to the cooling position, the A shutter disk assembly, wherein a base supports the shutter pressing disk, and the rim portion presses the rim region of the work piece. The method of claim 2,
The connection member is provided with a position fixing hole penetrating the connection member in a vertical direction, a position fixing protrusion is installed on an upper surface of the shutter pressing disk, and the position fixing protrusion is coupled with the position fixing hole to each other, When the base is lower than the cooling position, the shutter pressing disk is suspended from the connecting member through the position fixing protrusion, and the base is raised to the cooling position to support the shutter pressing disk, and the position is fixed. Shutter disk assembly, characterized in that allowing the projection to move upward relative to the position fixing hole. The method of claim 3,
The position fixing hole is a conical hole, and the diameter of the conical hole is gradually decreased from top to bottom. The method of claim 4,
Wherein the position fixing protrusion includes a coupling portion, and the coupling portion has a conical shape, and when the base is lower than the cooling position, an outer circumferential wall of the coupling portion is coupled to the hole wall of the conical hole. The method of claim 3,
The position fixing hole is a direct hole, and a step portion is installed on the hole wall of the direct hole;
The position fixing protrusion includes a coupling portion, and when the base is lower than the cooling position, at least a portion of the coupling portion is stacked and installed on the stepped portion. The method according to claim 5 or 6,
The position fixing protrusion further includes a columnar extension,
The extension part is installed vertically, the upper end of the extension part is connected to the coupling part, the lower part of the extension part is connected to the shutter pressing disk, and the outer diameter of the extension part is smaller than the minimum diameter of the conical hole. Disk assembly. The method of claim 3,
Further comprising a rotation mechanism, the rotation mechanism,
A rotating shaft installed vertically on one side of the base and connected to the connection member, and
And a driving source for driving the connection member to rotate to the first position or the second position along the rotation axis by rotating the rotation shaft. The method of claim 1,
The shutter pressing disk includes a pressing disk body,
A ring-shaped protrusion is formed in the lower surface rim region of the pressurizing disk main body to be used as the rim, and the ring-shaped protrusion has a closed ring shape and is installed along the circumferential direction of the shutter pressing disk; Or the ring-shaped protrusion includes a plurality of sub-protrusions, and the plurality of sub-protrusions are installed to be spaced apart along the circumferential direction of the shutter pressing disk. The method of claim 1,
The shutter pressing disk includes a pressing disk main body, and a ring-shaped protrusion is formed on an outer circumferential wall of the pressing disk main body, and the ring-shaped protrusion protrudes from the lower surface of the pressing disk main body and is used as the rim portion, and the ring-shaped protrusion part Is a closed ring type installed along the circumferential direction of the shutter pressing disk, or the ring-shaped protrusion includes a plurality of sub protrusions, and a plurality of sub protrusions are installed to be spaced apart along the circumferential direction of the shutter pressing disk. Shutter disk assembly made by. In the semiconductor processing apparatus comprising a chamber,
The chamber comprises a base and a shutter disk assembly according to any one of claims 1 to 10;
A back blow pipe for introducing a back blow gas into the gap between the support surface of the base and the lower surface of the workpiece is installed in the base;
The base is elevating and descending to move to the cooling position, loading/unloading position, or process position, and the loading/unloading position is lower than the cooling position, and the process position is higher than the cooling position. Semiconductor processing equipment. The method of claim 11,
The chamber,
A limit ring installed on the base and surrounded by the support surface to limit the position of the workpiece on the base,
A shielding member that is surround and installed inside the sidewall of the chamber, and
When the base is located in the process position, the gap between the limit ring and the shield member is blocked, and the baffle ring is supported by the shield member after the base is lowered from the process position. Semiconductor processing equipment. The method of claim 11,
And a shutter disk warehouse installed on one side of the chamber and communicating with the interior of the chamber, and accommodating the shutter pressing disk when the shutter pressing disk is positioned at the second position. In a semiconductor processing method for processing a work piece using the semiconductor processing device according to any one of claims 11 to 13,
A process treatment step of maintaining the shutter pressing disk in the second position and raising the base to the process position to perform a process treatment on the entire upper surface of the work piece; and
After stopping the process process, lowering the base from the process position to the loading/unloading position, moving the shutter pressing disk from the second position to the first position, and then raising the base to the cooling position So that the edge portion of the shutter pressing disk contacts each other with the edge area of the upper surface of the workpiece mounted on the base, and then between the support surface of the base and the lower surface of the workpiece by using the back blow pipe A semiconductor processing method comprising a cooling step of introducing a bag blow gas into the gap of. The method of claim 14,
In the cooling step, the height of the cooling position, while the base is raised to the cooling position, the base moves the shutter pressing disk upward with respect to the connection member movably connected thereto. A semiconductor processing method, characterized in that the rim portion of the shutter pressing disk is set to press the rim region of the upper surface of the workpiece as it can be raised. The method of claim 14,
In the process treatment step, the process treatment comprises a PVD process.

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