KR20200094669A - 클리닝 시트 및 클리닝 기능 부가 반송 부재 - Google Patents

클리닝 시트 및 클리닝 기능 부가 반송 부재 Download PDF

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Publication number
KR20200094669A
KR20200094669A KR1020200008394A KR20200008394A KR20200094669A KR 20200094669 A KR20200094669 A KR 20200094669A KR 1020200008394 A KR1020200008394 A KR 1020200008394A KR 20200008394 A KR20200008394 A KR 20200008394A KR 20200094669 A KR20200094669 A KR 20200094669A
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KR
South Korea
Prior art keywords
cleaning
layer
cleaning sheet
cleaning layer
sheet
Prior art date
Application number
KR1020200008394A
Other languages
English (en)
Korean (ko)
Inventor
유이치 후카미치
Original Assignee
닛토덴코 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 닛토덴코 가부시키가이샤 filed Critical 닛토덴코 가부시키가이샤
Publication of KR20200094669A publication Critical patent/KR20200094669A/ko

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00Cleaning by methods involving the use of tools
    • B08B1/10Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/14Wipes; Absorbent members, e.g. swabs or sponges
    • B08B1/143Wipes
    • B08B1/006
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0028Cleaning by methods not provided for in a single other subclass or a single group in this subclass by adhesive surfaces
    • B08B1/02
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00Cleaning by methods involving the use of tools
    • B08B1/20Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0014Cleaning by methods not provided for in a single other subclass or a single group in this subclass by incorporation in a layer which is removed with the contaminants
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02Physical, chemical or physicochemical properties
    • B32B7/022Mechanical properties
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
KR1020200008394A 2019-01-30 2020-01-22 클리닝 시트 및 클리닝 기능 부가 반송 부재 KR20200094669A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2019-014552 2019-01-30
JP2019014552A JP7165065B2 (ja) 2019-01-30 2019-01-30 クリーニングシートおよびクリーニング機能付搬送部材

Publications (1)

Publication Number Publication Date
KR20200094669A true KR20200094669A (ko) 2020-08-07

Family

ID=71877405

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020200008394A KR20200094669A (ko) 2019-01-30 2020-01-22 클리닝 시트 및 클리닝 기능 부가 반송 부재

Country Status (4)

Country Link
JP (1) JP7165065B2 (ja)
KR (1) KR20200094669A (ja)
CN (1) CN111495878A (ja)
TW (1) TW202031372A (ja)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10154686A (ja) 1996-11-22 1998-06-09 Toshiba Corp 半導体基板処理装置のクリーニング方法
JPH1187458A (ja) 1997-09-16 1999-03-30 Hitachi Ltd 異物除去機能付き半導体製造装置
JP2007307521A (ja) 2006-05-22 2007-11-29 Nitto Denko Corp クリーニングシート、クリーニング機能付搬送部材、および基板処理装置のクリーニング方法
JP2010259970A (ja) 2009-04-30 2010-11-18 Nitto Denko Corp クリーニングシート、クリーニング機能付搬送部材、基板処理装置のクリーニング方法、および基板処理装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0752019A (ja) * 1993-08-10 1995-02-28 Fuji Photo Film Co Ltd 研磨テープを用いた清浄方法
JP2006049827A (ja) * 2004-07-08 2006-02-16 Nitto Denko Corp クリーニング部材および基板処理装置のクリーニング方法
WO2007049462A1 (ja) * 2005-10-25 2007-05-03 Nitto Denko Corporation クリーニングシート、クリーニング機能付搬送部材および基板処理装置のクリーニング方法
JP5833324B2 (ja) * 2011-03-16 2015-12-16 帝人株式会社 定着装置のクリーニングシート
JP2012233811A (ja) * 2011-05-06 2012-11-29 Nitto Denko Corp クリーニングシート、クリーニング部材、クリーニング方法、および、導通検査装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10154686A (ja) 1996-11-22 1998-06-09 Toshiba Corp 半導体基板処理装置のクリーニング方法
JPH1187458A (ja) 1997-09-16 1999-03-30 Hitachi Ltd 異物除去機能付き半導体製造装置
JP2007307521A (ja) 2006-05-22 2007-11-29 Nitto Denko Corp クリーニングシート、クリーニング機能付搬送部材、および基板処理装置のクリーニング方法
JP2010259970A (ja) 2009-04-30 2010-11-18 Nitto Denko Corp クリーニングシート、クリーニング機能付搬送部材、基板処理装置のクリーニング方法、および基板処理装置

Also Published As

Publication number Publication date
JP7165065B2 (ja) 2022-11-02
JP2020121272A (ja) 2020-08-13
CN111495878A (zh) 2020-08-07
TW202031372A (zh) 2020-09-01

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