CN111495878A - 清洁片及带清洁功能的输送构件 - Google Patents

清洁片及带清洁功能的输送构件 Download PDF

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Publication number
CN111495878A
CN111495878A CN202010074554.1A CN202010074554A CN111495878A CN 111495878 A CN111495878 A CN 111495878A CN 202010074554 A CN202010074554 A CN 202010074554A CN 111495878 A CN111495878 A CN 111495878A
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CN
China
Prior art keywords
cleaning
layer
cleaning sheet
conveying member
cleaning layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010074554.1A
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English (en)
Chinese (zh)
Inventor
深道佑一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of CN111495878A publication Critical patent/CN111495878A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges
    • B08B1/143—Wipes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0028—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by adhesive surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/20—Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0014—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by incorporation in a layer which is removed with the contaminants
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/022—Mechanical properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
CN202010074554.1A 2019-01-30 2020-01-22 清洁片及带清洁功能的输送构件 Pending CN111495878A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019014552A JP7165065B2 (ja) 2019-01-30 2019-01-30 クリーニングシートおよびクリーニング機能付搬送部材
JP2019-014552 2019-01-30

Publications (1)

Publication Number Publication Date
CN111495878A true CN111495878A (zh) 2020-08-07

Family

ID=71877405

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010074554.1A Pending CN111495878A (zh) 2019-01-30 2020-01-22 清洁片及带清洁功能的输送构件

Country Status (4)

Country Link
JP (1) JP7165065B2 (ja)
KR (1) KR20200094669A (ja)
CN (1) CN111495878A (ja)
TW (1) TW202031372A (ja)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0752019A (ja) * 1993-08-10 1995-02-28 Fuji Photo Film Co Ltd 研磨テープを用いた清浄方法
JP2006049827A (ja) * 2004-07-08 2006-02-16 Nitto Denko Corp クリーニング部材および基板処理装置のクリーニング方法
CN101297395A (zh) * 2005-10-25 2008-10-29 日东电工株式会社 清洁片材，附有清洁功能的输送构件及基板处理装置的清洁方法
CN102413951A (zh) * 2009-04-30 2012-04-11 日东电工株式会社 清洁片、带清洁功能的搬送构件、基板处理装置的清洁方法及基板处理装置
JP2012193470A (ja) * 2011-03-16 2012-10-11 Teijin Techno Products Ltd 定着装置のクリーニングシート
CN102768966A (zh) * 2011-05-06 2012-11-07 日东电工株式会社 清洁片、清洁构件、清洁方法以及导通测试装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10154686A (ja) 1996-11-22 1998-06-09 Toshiba Corp 半導体基板処理装置のクリーニング方法
JPH1187458A (ja) 1997-09-16 1999-03-30 Hitachi Ltd 異物除去機能付き半導体製造装置
JP2007307521A (ja) 2006-05-22 2007-11-29 Nitto Denko Corp クリーニングシート、クリーニング機能付搬送部材、および基板処理装置のクリーニング方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0752019A (ja) * 1993-08-10 1995-02-28 Fuji Photo Film Co Ltd 研磨テープを用いた清浄方法
JP2006049827A (ja) * 2004-07-08 2006-02-16 Nitto Denko Corp クリーニング部材および基板処理装置のクリーニング方法
CN101297395A (zh) * 2005-10-25 2008-10-29 日东电工株式会社 清洁片材，附有清洁功能的输送构件及基板处理装置的清洁方法
CN102413951A (zh) * 2009-04-30 2012-04-11 日东电工株式会社 清洁片、带清洁功能的搬送构件、基板处理装置的清洁方法及基板处理装置
JP2012193470A (ja) * 2011-03-16 2012-10-11 Teijin Techno Products Ltd 定着装置のクリーニングシート
CN102768966A (zh) * 2011-05-06 2012-11-07 日东电工株式会社 清洁片、清洁构件、清洁方法以及导通测试装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
冯新德: "高分子辞典", pages: 300 - 301 *

Also Published As

Publication number Publication date
JP7165065B2 (ja) 2022-11-02
KR20200094669A (ko) 2020-08-07
TW202031372A (zh) 2020-09-01
JP2020121272A (ja) 2020-08-13

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Effective date of abandoning: 20240524