TW202031372A - 清潔片及具清潔功能之搬送構件 - Google Patents

清潔片及具清潔功能之搬送構件 Download PDF

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Publication number
TW202031372A
TW202031372A TW109101071A TW109101071A TW202031372A TW 202031372 A TW202031372 A TW 202031372A TW 109101071 A TW109101071 A TW 109101071A TW 109101071 A TW109101071 A TW 109101071A TW 202031372 A TW202031372 A TW 202031372A
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TW
Taiwan
Prior art keywords
cleaning
layer
cleaning sheet
cleaning layer
sheet
Prior art date
Application number
TW109101071A
Other languages
English (en)
Chinese (zh)
Inventor
深道佑一
Original Assignee
日商日東電工股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日東電工股份有限公司 filed Critical 日商日東電工股份有限公司
Publication of TW202031372A publication Critical patent/TW202031372A/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges
    • B08B1/143—Wipes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0028—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by adhesive surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/20—Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0014—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by incorporation in a layer which is removed with the contaminants
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/022—Mechanical properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
TW109101071A 2019-01-30 2020-01-13 清潔片及具清潔功能之搬送構件 TW202031372A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-014552 2019-01-30
JP2019014552A JP7165065B2 (ja) 2019-01-30 2019-01-30 クリーニングシートおよびクリーニング機能付搬送部材

Publications (1)

Publication Number Publication Date
TW202031372A true TW202031372A (zh) 2020-09-01

Family

ID=71877405

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109101071A TW202031372A (zh) 2019-01-30 2020-01-13 清潔片及具清潔功能之搬送構件

Country Status (4)

Country Link
JP (1) JP7165065B2 (ja)
KR (1) KR20200094669A (ja)
CN (1) CN111495878A (ja)
TW (1) TW202031372A (ja)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0752019A (ja) * 1993-08-10 1995-02-28 Fuji Photo Film Co Ltd 研磨テープを用いた清浄方法
JPH10154686A (ja) 1996-11-22 1998-06-09 Toshiba Corp 半導体基板処理装置のクリーニング方法
JPH1187458A (ja) 1997-09-16 1999-03-30 Hitachi Ltd 異物除去機能付き半導体製造装置
JP2006049827A (ja) 2004-07-08 2006-02-16 Nitto Denko Corp クリーニング部材および基板処理装置のクリーニング方法
WO2007049462A1 (ja) * 2005-10-25 2007-05-03 Nitto Denko Corporation クリーニングシート、クリーニング機能付搬送部材および基板処理装置のクリーニング方法
JP2007307521A (ja) 2006-05-22 2007-11-29 Nitto Denko Corp クリーニングシート、クリーニング機能付搬送部材、および基板処理装置のクリーニング方法
JP5167195B2 (ja) 2009-04-30 2013-03-21 日東電工株式会社 クリーニングシート、クリーニング機能付搬送部材、基板処理装置のクリーニング方法、および基板処理装置
JP5833324B2 (ja) * 2011-03-16 2015-12-16 帝人株式会社 定着装置のクリーニングシート
JP2012233811A (ja) * 2011-05-06 2012-11-29 Nitto Denko Corp クリーニングシート、クリーニング部材、クリーニング方法、および、導通検査装置

Also Published As

Publication number Publication date
CN111495878A (zh) 2020-08-07
JP2020121272A (ja) 2020-08-13
KR20200094669A (ko) 2020-08-07
JP7165065B2 (ja) 2022-11-02

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