KR20200085571A - Apparatus for Lifting Substrate of Mask Aligner - Google Patents

Abstract

The present invention relates to a substrate lifting device for a mask aligner. The substrate lifting device for a mask aligner comprises: a variable lift pin supporting a substrate; a pin plate installed to be elevated and descended; an elevation unit elevating and descending the pin plate; a variable pin plate to which the variable lift pin is coupled; and a switching unit coupled to the variable pin plate. The switching unit includes a switching mechanism coupled to a switching body to be rotatable between a support position supported at the pin plate to be elevated and descended with the variable pin plate as the pin plate is elevated and descended and a spaced position spaced from the pin plate so that the pin plate is independently elevated and descended with respect to the variable pin plate.

Description

Substrate lift device for mask alignment device {Apparatus for Lifting Substrate of Mask Aligner}

The present invention relates to a substrate lift device used to elevate or move a substrate in a mask alignment device.

In general, displays such as liquid crystal displays (LCDs), organic light emitting diodes (OLEDs), plasma display panels (PDPs), electrophoretic displays (EPDs), etc. Products such as devices and solar cells are manufactured through various processes.

The manufacturing process includes a deposition process for depositing a thin film on a substrate, an etching process for etching a thin film deposited on a substrate, and the like. In forming a thin film of a desired shape on a substrate through a deposition process, an etching process, or the like, a mask is used. In this case, a deposition process, an etching process, etc. are performed on the substrate while the substrate and the mask are bonded to each other.

Here, in performing the process of bonding the substrate and the mask by aligning the positions between the substrate and the mask, a mask alignment device is used. The mask alignment device includes a substrate lift device to align positions between the substrate and the mask. The background technology for the mask alignment device is disclosed in Korean Patent Publication No. 10-2014-0021832 (published on February 21, 2014).

1 is a schematic plan view of a substrate lift apparatus according to the prior art, and FIGS. 2 and 3 are schematic bottom views illustrating exemplary substrates and masks.

1 to 3, the substrate lift apparatus 100 according to the prior art includes a pin plate 110 that is elevated and lowered by an elevating unit (not shown), and a lift pin coupled to the pin plate 110 ( 120).

The lift pin 120 supports the substrate 200. The lift pin 120 raises and lowers the substrate 200 as the pin plate 110 moves up and down while the substrate 200 is supported. A plurality of lift pins 120 are coupled to the pin plate 110. The lift pins 120 are coupled to the pin plate 110 to be located at different positions to support different positions of the substrate 200.

Here, the portion supported by the lift pins 120 on the substrate 200 cannot be used as an effective area. Therefore, in order to increase the size of the effective area on the substrate 200, the lift pins 120 are arranged to support the portion covered by the mask 300 on the substrate 200.

However, as shown in FIGS. 2 and 3, the effective area of the substrate 200 is changed according to the type and size of the product. Accordingly, since the shape of the mask 300 adhered to the substrate 200 is also changed, the lift pins 120 must be changed in position to correspond to the effective region and the shape change of the mask 300.

To this end, the substrate lift apparatus 100 according to the prior art is implemented such that the lift pins 120 are detachably attached to the pin plate 110. However, the substrate lift apparatus 100 according to the prior art performed an operation for detaching and attaching the lift pins 110, which requires an operator to manually change the position.

For example, when aligning the position between the substrate 200 and the mask 300 as shown in FIG. 2, the operator directly manually lifts the pins 120 to the first area 111 of the pin plate 110. Had to be combined. Then, when the substrate 200 and the mask 300 as shown in FIG. 3 are changed, the operator directly manually separates the lift pins 120 from the first region 111 of the pin plate 110, The lift pins 120 had to be coupled to the second region 112 of the pin plate 110.

Therefore, the substrate lift apparatus 100 according to the prior art not only has difficulty in changing the position of the lift pin 120, but also increases the time required for the change operation to change the position of the lift pin 120. Due to this, there was a problem that the utilization rate was lowered.

The present invention has been devised to solve the problems as described above, and is to provide a substrate lift device for a mask alignment device that can solve the difficulty of a change operation for changing the position of a lift pin.

The present invention is to provide a substrate lift device for a mask alignment device that can reduce the degree of decrease in the operation rate by reducing the time taken to change the position of the lift pin.

In order to solve the above problems, the present invention may include the following configuration.

A substrate lift device for a mask alignment device according to the present invention includes a variable lift pin for supporting a substrate; A pin plate installed to be able to move up and down; An elevating unit for elevating and elevating the pin plate; A variable pin plate to which the variable lift pin is coupled; And a switching part coupled to the variable pin plate. The conversion unit may include a conversion body coupled to the variable pin plate, and a conversion mechanism rotatably coupled to the conversion body. The switching mechanism is spaced apart from the pin plate so that the support position supported by the pin plate so that the variable pin plate moves up and down as the pin plate moves up and down and the pin plate independently moves up and down relative to the variable pin plate. It can be coupled to the switching body so that it can be rotated between spaced positions. The variable lift pin is disposed in a position to support the substrate when the pin plate rises while the switch mechanism is in the support position, and when the pin plate rises while the switch mechanism is in the spaced position, It may be disposed at a position spaced from the substrate.

According to the present invention, the following effects can be achieved.

The present invention improves the accuracy of the switching operation for converting the variable lift pin to support the substrate variably by preventing the pinching and friction forces from acting during the process of converting the variable lift pin to support the substrate variably. I can do it.

1 is a schematic plan view of a substrate lift apparatus according to the prior art
2 and 3 are schematic bottom views exemplarily showing a general substrate and a mask.
Figure 4 is a schematic side view of the substrate lift device for a mask alignment device according to the present invention
5 is a schematic plan view of a pin plate, a lift pin, and a variable lift pin in the substrate lift device for a mask alignment device according to the present invention
Figure 6 is a schematic side view of the switching unit in the substrate lift device for a mask alignment device according to the present invention
Figure 7 is a schematic plan view of the pin plate and the switching unit in the substrate lift device for a mask alignment device according to the present invention
8 to 14 is a schematic cross-sectional view showing the operation of the switching unit in the substrate lift device for a mask alignment device according to the present invention with reference to line II of FIG. 7
15 is a schematic side view of a substrate lift device for a mask alignment device according to a modified embodiment of the present invention

Hereinafter, an embodiment of the substrate lift device for a mask alignment device according to the present invention will be described in detail with reference to the accompanying drawings.

Referring to FIG. 4, the substrate lift device 1 for a mask alignment device according to the present invention aligns the positions between the substrate 200 and the mask 300 to mask the substrate 200 and the mask 300. It is installed in the alignment device. The substrate lift device 1 for a mask alignment device according to the present invention is responsible for supporting and lifting the substrate 200 in the mask alignment device. Substrate lift device 1 for a mask alignment device according to the present invention includes a pin plate 3, an elevation part 4, a variable lift pin 5, a variable pin plate 6, and a switching part 7 Can. The substrate lift device 1 for a mask alignment device according to the present invention may further include a lift pin 2 as necessary.

Hereinafter, attached to the lift pin 2, the pin plate 3, the lifting part 4, the variable lift pin 5, the variable pin plate 6, and the switching part 7 It will be described in detail with reference to the drawings.

4 and 5, the lift pin 2 supports the substrate 200. The lift pin 2 may be coupled to the pin plate 3. Accordingly, the lift pin 2 may be moved up and down together as the pin plate 3 moves up and down. The lift pin 2 may be coupled to the pin plate 3 so as to protrude upward from the pin plate 3. The lift pin 2 may be inserted into a through hole (not shown) formed in the mask 300 to support the substrate 200 positioned above the mask 300.

The lift pin 2 may be fixedly coupled to the pin plate 3 so that the pin plate 3 moves up and down together as it moves up and down. The lift pin 2 may be arranged to support a portion of the substrate 200 covered by the mask 300 (hereinafter referred to as an'ineffective area'). The non-effective area is a part that cannot be used as an effective area. For example, the ineffective region may be a portion that is removed by cutting or the like in a subsequent process, a portion that does not affect the function of the final product. When the final product is a display device, the effective area may be a portion where an image is displayed, and the non-effective area may be a portion where an image is not displayed. The effective area and the non-effective area may be changed in position depending on the type and size of the product.

The lift pin 2 may be coupled to the pin plate 3 to be located in a fixed area (FA, shown in FIG. 5). The fixed area FA may be located at a position corresponding to a fixed non-effective area in the substrate 200. The fixed non-effective area is a portion that is always maintained as the non-effective area without changing to the effective area, even if the product type, size, or the like is changed. For example, the fixed ineffective region may be set in a range from a periphery of the substrate 200 to a position spaced apart a predetermined distance inward. In this case, the fixed area FA may correspond to an outer area on the upper surface of the pin plate 3. For example, as illustrated in FIG. 5, the fixed area FA may be formed in a square ring shape.

The lift pin 2 may be formed in a rectangular rod shape as a whole, but is not limited thereto, and may be formed in another shape as long as it can support the substrate 200.

The substrate lift device 1 for a mask alignment device according to the present invention may include a plurality of the lift pins 2. The lift pins 2 may be coupled to the pin plate 3 so as to be positioned at positions spaced apart from each other. Accordingly, the lift device 1 for a mask alignment device according to the present invention is implemented such that the lift pins 2 support different parts of the substrate 200, thereby stably supporting the substrate 200. have. The lift pins 2 may be coupled to the pin plate 3 so as to be located at positions spaced apart from each other in the fixed area FA. When the mask alignment device uses various types of masks 300 according to the type, size, etc. of the product, the substrate lift device 1 for the mask alignment device according to the present invention overlaps the areas of all the masks 300 The lift pin 2 may be installed, and the variable lift pin 5 may be installed in an area changed according to the masks 300. The substrate lift device 1 for a mask alignment device according to the present invention may be implemented to support the substrate 200 with only the variable lift pins 5 without the lift pins 2.

4 and 5, the pin plate 3 is installed to be able to move up and down. When the lift pin 2 is provided, the pin plate 3 may support the lift pin 2. The pin plate 3 may be coupled to the lift 4. The pin plate 3 may be moved up and down by the lifting part 4. When the lift pin 2 is provided, the pin plate 3 may move the lift pin 2 up and down as it is moved up and down by the lift 4. The pin plate 3 may be formed in a rectangular plate shape as a whole, but is not limited thereto, and may be formed in another shape as long as it is a shape capable of supporting the lift pin 2.

Referring to Figures 4 to 6, the lifting unit 4 is to raise and lower the pin plate (3). When the lift pin 2 is provided, the lifting part 4 may raise and lower the lift pin 3 coupled to the pin plate 3 by raising and lowering the pin plate 3. When the lift pin 3 supports the substrate 200, the lifting unit 4 may move the substrate 200 up and down by raising and lowering the pin plate 3.

The lifting unit 4 may include a stage 41 and a driving unit 42.

The pin plate 3 may be coupled to the stage 41 to be able to move up and down. The stage 41 may be installed to be positioned below the pin plate 3.

The driving unit 42 may be coupled to the stage 41. The driving unit 42 may elevate the pin plate 3. Accordingly, the pin plate 3 may be moved up and down based on the stage 41. The drive unit 42 is a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a ball screw method using a motor and a ball screw, a gear method using a motor and a rack gear and a pinion gear, a belt using a motor, pulley and belt, etc. The pin plate 3 may be moved up and down using a method, a linear motor method using a coil and a permanent magnet, or the like.

4 to 6, the variable lift pin 5 is to support the substrate 200. When the lift pin 2 is provided, the variable lift pin 5 may be arranged to be located at a position spaced apart from the lift pin 2. Accordingly, the variable lift pin 5 and the lift pin 2 may support different parts of the substrate 200. Therefore, the substrate lift device 1 for a mask alignment device according to the present invention can more stably support the substrate 200. When the mask alignment device uses various types of masks 300 according to the type, size, etc. of the product, the substrate lift device 1 for the mask alignment device according to the present invention is an area overlapped in all of the masks 300 The lift pin 2 may be installed, and the variable lift pin 5 may be installed in an area changed according to the masks 300. The substrate lift device 1 for a mask alignment device according to the present invention may be implemented to support the substrate 200 with only the variable lift pins 5 without the lift pins 2.

The variable lift pin 5 may variably support the substrate 200 by the switching unit 7. When the variable lift pin (5) is switched to move up and down together with the pin plate (3) by the switching unit (7), the variable lift pin (5) as the pin plate (3) moves up and down Together, the substrate 200 may be supported by elevating and descending. When the variable lift pin 5 is switched so as not to move up and down together with the pin plate 3 by the switching unit 7, the variable lift pin 5 moves up and down even if the pin plate 3 moves up and down. Not strong Accordingly, since the variable lift pin 5 is disposed at a position spaced apart from the substrate 200, the substrate 200 is not supported.

The variable lift pin 5 may be located in a variable region (CA, shown in FIG. 5). The variable region CA may be located at a position corresponding to the variable ineffective region in the substrate 200. The variable non-effective area is a part that changes between the effective area and the non-effective area when a product type, size, or the like is changed. The variable ineffective region may be located inside the fixed ineffective region. In this case, the variable region CA may correspond to an inner region on the top surface of the pin plate 3. The variable area CA may be arranged to be located inside the fixed area FA on the upper surface of the pin plate 3. For example, as illustrated in FIG. 5, the variable region CA may be formed in a rectangular shape.

The variable lift pin 5 may be formed in a rectangular rod shape as a whole, but is not limited thereto, and may be formed in another shape as long as it is a shape capable of supporting the substrate 200.

The substrate lift device 1 for a mask alignment device according to the present invention may include a plurality of the variable lift pins 5. In this case, the variable lift pins 5 may be arranged at positions spaced apart from each other.

4 to 6, the variable pin plate 6 is to support the variable lift pin (5). The variable lift pin 5 may be coupled to the variable pin plate 6. The variable pin plate 6 may be variably raised and lowered by the switching unit 7. When the variable pin plate 6 is switched to move up and down together with the pin plate 3 by the switching unit 7, the variable lift pin 5 as the variable pin plate 6 moves up and down You can also go up and down. When the variable pin plate 6 is switched by the switching unit 7 so as not to move up and down together with the pin plate 3, the variable lift pin 5 according to the variable pin plate 6 does not move up and down ) Also does not go up and down. Accordingly, since the variable lift pin 5 is disposed at a position spaced apart from the substrate 200, the substrate 200 is not supported. In this case, the pin plate 3 can be raised and lowered independently of the variable pin plate 6.

The variable pin plate 6 may be disposed under the pin plate 3. When the variable pin plate 6 is switched to move up and down together with the pin plate 3 by the switching unit 7, the variable pin plate 6 is the pin plate through the switching unit 7 (3) can be supported. When the variable pin plate 6 is switched so as not to move up and down together with the pin plate 3 by the switching unit 7, the variable pin plate 6 may be supported on the stage 41. In this case, the variable pin plate 6 may be supported by a supporting member 43 coupled to the stage 41. The support member 43 may protrude upward from the stage 41. The variable pin plate 6 may be supported by a plurality of supporting members 43. In this case, the supporting members 43 may be spaced apart from each other on the stage 41 to support different portions of the variable pin plate 6. The variable pin plate 6 may be formed in a rectangular plate shape as a whole, but is not limited thereto, and may be formed in another form as long as it is a form capable of supporting the variable lift pin 5.

4 to 6, the switching unit 7 is to switch the variable pin plate 6 to variably move up and down as the pin plate 3 moves up and down. The switching unit 7 may be coupled to the variable pin plate 6. Accordingly, when the switching unit 7 is switched so that the pin plate 3 moves up and down together with the variable pin plate 6, the variable lift pin 6 increases as the pin plate 3 rises. It may rise together and be disposed at a position supporting the substrate 200. If the switching unit 7 is switched so that the pin plate 3 is raised and lowered independently of the variable pin plate 6, the variable lift pin 6 is the substrate even if the pin plate 3 is raised. It may be disposed at a position spaced from the (200). This is because the variable pin plate 6 does not rise even if the pin plate 3 is raised. In this case, the variable pin plate 6 may be maintained in a state supported by the stage 41.

Accordingly, the substrate lift device 1 for a mask alignment device according to the present invention can achieve the following operational effects.

First, in the substrate alignment device 1 for a mask alignment device according to the present invention, the variable lift pin 5 supports the substrate 200 or does not support the substrate 200 by using the switching unit 7. Can be switched. Accordingly, the substrate lift device 1 for a mask alignment device according to the present invention, the variable lift 5 is variably and without an operator manually removing or installing the variable lift pin 5. It is implemented to support the substrate 200. Accordingly, the substrate lift device 1 for a mask alignment device according to the present invention can improve the ease of the operation of changing the position to support the substrate 200 using the variable lift pin 5.

Second, the substrate lift device 1 for a mask alignment device according to the present invention is implemented so that the variable lift pin 5 supports the substrate 200 variably by using the switching part 7, so that the variable lift The time taken to change the position of supporting the substrate 200 by using the pin 5 can be reduced. Therefore, since the substrate lift device 1 for a mask alignment device according to the present invention can increase an operation rate for the mask alignment device, productivity for the substrate assembly in which the substrate 200 and the mask 300 are bonded is improved. It can contribute to augmentation.

Referring to FIGS. 4 to 11, the switching unit 7 may include a switching body 71 and a switching mechanism 72. Dot hatching in FIG. 7 is not shown in cross section, but is shown in order to distinguish the structure from the space.

The conversion body 71 is coupled to the variable pin plate (6). The switching body 71 may protrude upward from the variable pin plate 6. Accordingly, the switching body 71 may protrude toward the pin plate 3.

The switching mechanism 72 is rotatably coupled to the switching body 71. The switching mechanism 72 may rotate between the support position SP and the separation position DP.

8 and 9, when the switch mechanism 72 is located in the support position SP, the switch mechanism 72 may be disposed in a position that can be supported by the pin plate 3. have. Accordingly, the switching mechanism 72 may move up and down together as the pin plate 3 moves up and down. Therefore, the switching body 72 to which the switching mechanism 72 is coupled and the variable pin plate 6 to which the switching body 71 is coupled, can be moved up and down together as the pin plate 3 moves up and down. . Accordingly, the variable lift pins 5 (shown in FIG. 4) coupled to the variable pin plate 6 may move up and down together as the pin plate 3 moves up and down. Accordingly, when the pin plate 3 is raised while the switching mechanism 72 is located in the support position SP, as shown in FIG. 6, the variable lift pin 5 is used to lift the substrate 200. It can be placed in a supporting position.

10 and 11, when the switching mechanism 72 is located at the separation position DP, the switching mechanism 72 may be disposed at a position spaced apart from the pin plate 3. Accordingly, even if the pin plate 3 moves up and down, the switching mechanism 72 does not move up or down. Accordingly, the switching body 71 to which the switching mechanism 72 is coupled and the variable pin plate 6 to which the switching body 71 is coupled do not move up or down even when the pin plate 3 is raised or lowered. Accordingly, the variable lift pin 5 (shown in FIG. 4) coupled to the variable pin plate 6 does not elevate even when the pin plate 3 moves up and down. That is, when the switching mechanism 72 is located in the separation position DP, the pin plate 3 may be independently raised and lowered relative to the variable pin plate 6. Accordingly, when the pin plate 3 is raised while the switching mechanism 72 is positioned at the separation position DP, as shown in FIG. 4, the variable lift pin 5 is from the substrate 200. It can be placed in a spaced location.

As described above, the switching unit 7 converts the switching mechanism 72 to be variably supported by the pin plate 3 by using the rotation of the switching mechanism 72, so that the variable lift pin 5 The substrate 200 can be switched to support variably. In this regard, the comparative example is implemented with a structure for converting the variable lift pin 5 to variably support the substrate 200 by using an inclined surface and a self-weight. In contrast to this comparative example, the substrate lift device 1 for a mask alignment device according to the present invention can achieve the following operational effects.

First, in the case of the comparative example, the variable lift pin 5 is switched to variably support the substrate 200 by using the principle that the switching mechanism descends along an inclined surface using its own weight. , Due to the action of frictional force, it may happen that self-weight alone cannot descend along the inclined surface. Accordingly, in the comparative example, there is a problem in that the accuracy of the switching operation for converting the variable lift pin 5 to variably support the substrate 200 is deteriorated.

Next, in the case of the embodiment, as the switching mechanism 72 rotates between the support position SP and the separation position DP, the variable lift pin 5 switches to support the substrate 200 variably, It is implemented so that the pinching, friction, and the like do not act on the switching mechanism 72. Therefore, the embodiment can improve the accuracy of the switching operation for converting the variable lift pin 5 to support the substrate 200 variably when compared with the comparative example.

8 and 9, the switching mechanism 72 may protrude out of the through hole 31 at the support position SP. The through hole 31 is formed through the pin plate 3. The through hole 31 may be formed to a size that allows the conversion body 71 to pass through. In this case, the cross-sectional area of the through hole 31 based on the horizontal cross-section can be formed larger than the cross-sectional area of the switching body 71. The horizontal section is a section based on a horizontal direction perpendicular to the vertical direction in which the pin plate 3 moves up and down.

When the switching mechanism 72 protrudes out of the through hole 31 at the support position SP, the switching mechanism 72 may be disposed above the pin plate 3. Accordingly, when the lifting mechanism 4 (shown in FIG. 4) raises and lowers the pin plate 3 in the state where the switching mechanism 72 is located in the support position SP, the pin plate 3 Supports the switching mechanism 72 protruding outwardly of the through hole 31 to move up and down together with the switching mechanism 72. When the switching mechanism 72 protrudes outward from the through hole 31 at the support position SP, the switching mechanism 72 may protrude outward from the switching body 71.

The switching mechanism 72 may be positioned at the support position SP by rotating in the support direction (SR arrow direction, shown in FIG. 8) about the rotation shaft 721. The switching mechanism 72 may lie down as it rotates in the support direction (in the direction of the SR arrow) around the rotating shaft 721 and protrude outward from the through hole 31. The rotating shaft 721 may be disposed parallel to the horizontal direction.

10 and 11, the switching mechanism 72 may be disposed only inside the through hole 31 at the separation position DP. Accordingly, since the switching mechanism 72 is not disposed above the pin plate 3 at the spaced apart position DP, it can be disposed at a position that does not interfere with the pin plate 3. Accordingly, when the lifting mechanism 4 (shown in FIG. 4) raises and lowers the pin plate 3 in the state where the switching mechanism 72 is located at the separation position DP, the pin plate 3 is It is possible to independently move up and down with respect to the switching mechanism 72 by passing through the switching mechanism 72 disposed only inside the through hole 31. When the switching mechanism 72 is disposed only inside the passage hole 31 at the separation position DP, the switching mechanism 72 does not protrude outside the switching body 71.

The switching mechanism 72 may be positioned at the separation position DP by rotating in the separation direction (DR arrow direction, shown in FIG. 10) about the rotation axis 721. The switching mechanism 72 may be erected as it rotates in the separation direction (DR arrow direction) around the rotation shaft 721 and may be disposed only inside the through hole 31.

4 to 12, the conversion mechanism 72 may include a conversion member 722. The switching member 722 is disposed to protrude to one side based on the rotating shaft 721. As shown by the solid line in FIG. 12, when the switching mechanism 72 rotates in the support direction (SR arrow direction) around the rotation shaft 721, the switching member 722 is provided with the through hole 31. It can protrude outward. 12, when the switching mechanism 72 rotates in the separation direction (DR arrow direction) around the rotating shaft 721, the switching member 722 is provided with the through hole 31. It can only be placed inside.

In this case, a support mechanism 32 may be coupled to the pin plate 3. The support mechanism 32 is for supporting the switching mechanism 72 located in the support position (SP). The support mechanism 32 may protrude above the pin plate 3. The support mechanism 32 may be disposed outside the through hole 31.

The support mechanism 32 may include a first support member 321. The first support member 321 may support the switch member 722 such that the angle at which the switch mechanism 72 is rotatable in the support direction (SR arrow direction) is limited. In this case, the first support member 321 supports the switch mechanism 72 to prevent further rotation in the support direction (SR arrow direction) while the switch mechanism 72 is located in the support position SP. can do. Accordingly, the switching mechanism 72 is supported by the first support member 321 even when the pin plate 3 moves up and down as it moves up and down, so that it is located in the support position SP. It can be kept stable. When the switch mechanism 72 is located in the support position SP, the first support member 321 may be arranged to be positioned outside the switch member 722. In this case, the first support member 321 may be disposed in the support direction (SR arrow direction) with respect to the switching member 722. 12, since the separation direction (DR arrow direction) is counterclockwise with respect to the rotating shaft 721, the first supporting member 321 is the switching member (relative to the rotating shaft 721) 722).

The support mechanism 32 may include a second support member 322. The second support member 322 is disposed below the conversion member 722 supported by the first support member 321. The second support member 322 may protrude from the pin plate 3 at a lower height than the first support member 321. Accordingly, the support mechanism 32 may be formed such that the inner side toward the through hole 31 is opened. The switching member 722 may be supported by the first support member 321 at the support position SP and may be spaced apart from the second support member 322. Accordingly, between the switching member 722 and the second supporting member 322 located in the support position SP, the switching member 722 can pass through to rotate to the separation position DP. Space can be secured. Therefore, the switching member 722 may rotate from the support position SP to the spaced position DP through the open inner side of the support mechanism 32. In this case, the switching member 722 may be spaced upward from the second support member 322.

As shown in FIG. 8, when the switching mechanism 72 is located in the support position SP, the switching member 722 is supported by the first support member 321 and the second support member 322 ) Can be arranged to be spaced upward. When the pin plate 3 is raised in this state, as shown in FIG. 9, the second support member 322 is raised while contacting the switching member 722. Then, if the pin plate 3 continues to rise, the second support member 322 rises and pushes the switch member 722 upwards, thereby increasing the switch mechanism 72, the switch body 71, and The variable pin plate 6 can be raised. As described above, in the process of the second support member 322 rising and contacting the conversion member 722 and the process of the second support member 322 pushing the conversion member 722 upward, the first support The member 71 may support the switch member 722 to prevent the switch mechanism 72 from further rotating in the support direction (SR arrow direction).

When the support mechanism 32 includes the second support member 322, the first support member 321 is the second support member 322 so as to protrude upward from the second support member 322 Can be coupled to. The first support member 321 may be directly coupled to the pin plate 3 so as to protrude upward from the pin plate 3. That is, the support mechanism 32 may not include the second support member 322. In this case, when the switch mechanism 72 is located in the support position SP, the switch member 722 is supported by the first support member 321 and spaced upward from the pin plate 3. Can be deployed.

The support mechanism 32 may include an attachment member (323, shown in FIG. 12). The attachment member 323 is coupled to the first support member 321. The attachment member 323 may attach a switching member 722 protruding outward of the through hole 31 to the first support member 321 using magnetism. In this case, when the switching mechanism 72 rotates in the support direction (in the direction of the SR arrow), an attraction force acts between the attachment member 323 and the switching member 722, so that the switching mechanism 72 ) May be smoothly rotated in the support direction (SR arrow direction) to be located at the support position SP. In addition, while the switching mechanism 72 is attached to the first support member 321 and spaced apart from the second support member 322, the attachment member 323 is the switching member 722 to the It can be maintained in a state attached to the first support member 321. Accordingly, the attachment member 323 can prevent the switching member 722 from repeatedly contacting and spaced apart from the first support member 321 due to vibration, shaking, or the like. Therefore, the attachment member 322 can prevent the noise from being generated in the switching member 722 and the first support member 321, and the switching member 722 and the first support member 321 It can reduce the wear that occurs. The attachment member 322 may be formed of a magnetic material. For example, the attachment member 322 may be formed of a magnet. In this case, the conversion member 722 may be formed of a material that can be attached by magnetism. For example, the conversion member 722 may be formed of metal.

Here, the conversion member 722 may include a conversion roller (722a, shown in Figure 12). The conversion roller 722a is for contacting the support mechanism 32. In the process in which the switching mechanism 72 rotates between the support position SP and the separation position DP, the conversion roller 722a may rotate by friction with the support mechanism 32. Accordingly, the switching roller 722a is a malfunction caused by friction between the support mechanism 32 and particles during the process in which the switching mechanism 72 rotates between the support position SP and the separation position DP. (Paricle), wear, noise, etc. can be reduced. In addition, as the pin plate 3 rises in a state where the switching mechanism 72 is supported by the first support member 321 and spaced apart from the second support member 322, the second support member ( In a process in which 322) is in contact with the switching member 722, the switching roller 722a may be rotated by friction with the first support member 321 to reduce malfunction, particles, wear, noise, and the like. The conversion roller 722a may be rotatably coupled to the conversion mechanism 72.

4 to 14, the switching unit 7 may include a lifting mechanism 73.

The lifting mechanism 73 is coupled to the switching body 71 so as to be able to move up and down. The lifting mechanism 73 may rotate the lifting mechanism 72 between the support position SP and the separation position DP while moving up and down while being coupled to the switching body 71.

8 and 9, in the state where the switching mechanism 72 is located in the support position SP, the lifting mechanism 73 is the switching mechanism 72 at the lower side of the switching mechanism 72. Can support. Accordingly, the lifting mechanism 73 may limit the angle at which the switching mechanism 72 is rotatable in the support direction (SR arrow direction). Accordingly, the lifting mechanism 73 may be stably maintained in a state where the switching mechanism 72 is located in the support position SP. Accordingly, the pin plate 3 is lifted together by supporting the switching mechanism 72, so that the variable pin plate 6 and the variable lift coupled to the variable pin plate 6 as shown in FIG. The pin 5 can be raised.

As shown in FIGS. 10 and 11, the lifting mechanism 73 may rise to press the switching mechanism 72. The switching mechanism 72 may be positioned in the separation position DP by rotating in the separation direction (DR arrow direction) around the rotation shaft 721 as it is pressed by the lifting mechanism 73. Therefore, the pin plate 3 can be raised independently of the switching mechanism 72 without interfering with the switching mechanism 72. Accordingly, as shown in FIG. 4, the switching unit 7, the variable pin plate 6, and the variable lift pin 5 do not rise even when the pin plate 3 is raised.

The lifting mechanism 73 may be moved up and down by the lifting unit 8. The lifting unit 8 may be disposed below the lifting mechanism 73. The lifting unit 8 may be coupled to the stage 41.

10 and 11, when the elevating unit 8 raises the elevating mechanism 73, the elevating mechanism 73 presses the switching mechanism 72 while rising, and the separation direction DR Arrow direction). In this case, the lifting unit 8 may raise the rod 8a so that the rod 8a presses and raises the lifting mechanism 73. The elevating unit 8 may support the elevating mechanism 73 such that after the elevating mechanism 73 is raised, the switching mechanism 72 is maintained in the spaced apart position DP. In this state, the pin plate (4) can be moved up and down independently of the switching unit (7) and the variable pin plate (6).

8 and 9, when the lifting unit 8 is spaced apart from the lifting mechanism 73, the lifting mechanism 73 may descend. In this case, the lifting unit 8 may lower the rod 8a so that the support force for the rod 8a to support the lifting mechanism 73 is removed. As the lifting mechanism 73 descends, the switching mechanism 72 may rotate in the support direction (SR arrow direction) to be positioned at the support position SP. In this state, the lifting mechanism 73 may rise together as the pin plate 73 rises to be spaced apart from the lifting unit 8. Accordingly, as shown in FIG. 6, when the variable lift pin 5 is raised, the lifting unit 8 may be implemented not to rise together with the switching unit 7. Accordingly, the substrate lift device 1 for a mask alignment device according to the present invention can reduce the load applied to the lifting part 4 when the variable lift pin 5 is raised.

The elevating unit 8 may be embodied as a hydraulic cylinder that elevates and moves the rod 8a using hydraulic pressure. The elevating unit 8 is a pneumatic cylinder that elevates and moves the rod 8a using air pressure. It may be implemented. Although not shown, the lifting unit 8 includes a ball screw method using a motor and a ball screw, a gear method using a motor and a rack gear and a pinion gear, a belt method using a motor, a pulley and a belt, a coil and a permanent magnet. The rod 8a may be moved up and down using a linear motor method or the like.

The lifting mechanism 73 may include a guide member 731. The guide member 731 is in contact with the switching mechanism 72. The lifting mechanism 73 may be coupled to the switching body 71 so that the guide member 731 can be moved up and down so as to be disposed above the switching body 71. The switching main body 71 supports the guide member 731, thereby limiting the distance that the lifting mechanism 73 can descend. The switching mechanism 72 may rotate around the rotating shaft 721 as the lifting mechanism 73 moves up and down while in contact with the guide member 731.

The guide member 731 may be formed to decrease in diameter as it extends upward. The upward direction means a direction in which the lifting mechanism 73 rises. Accordingly, when the lifting mechanism 73 is lifted while the switching mechanism 72 is located in the support position SP, the switching mechanism 72 has a diameter from the small diameter portion of the guide member 731. The location in contact with this large portion can be changed. Accordingly, the switching mechanism 72 is smoothly rotated in the separation direction (DR arrow direction) along the inclined surface 731a of the guide member 731 (shown in FIG. 14) to be positioned at the separation position DP. can do. When the lifting mechanism 73 is lowered while the switching mechanism 72 is in the spaced apart position DP, the switching mechanism 72 is a part of the guide member 731 with a smaller diameter from a larger diameter. The contacted position can be changed. Accordingly, the switching mechanism 72 may be smoothly rotated in the support direction (SR arrow direction) along the inclined surface 731a of the guide member 731 to be positioned at the support position SP.

The guide member 731 may be embodied as a combination of a first portion having a reduced diameter and a second portion having no change in diameter as it extends in the upper direction. The second portion may be formed in a cylindrical shape. The first portion may be formed in the form of a truncated cone. The first portion may be disposed above the second portion. The first portion and the second portion may be integrally formed.

The lifting mechanism 73 may include a protruding member 732. The protruding member 732 may protrude downward from the guide member 731. The downward direction is a direction opposite to the upward direction. The protruding member 732 may be inserted into a through hole formed in the conversion body 71. Accordingly, when the lifting mechanism 73 moves up and down, the switching body 71 may guide the inner wall in which the through hole is formed so that the protruding member 732 moves up and down in a straight line. Therefore, the lifting mechanism 73 may move up and down in a straight line. The lifting unit 8 may raise the lifting mechanism 73 by pressing and raising the protruding member 732.

Here, the switching mechanism 72 may include a pressing member 723 for being pressed by the lifting mechanism 73.

The pressing member 723 is disposed to protrude to the other side with respect to the rotating shaft 721. The pressing member 723 and the switching member 722 may be disposed opposite to each other based on the rotating shaft 721. As shown in Figure 13, when the lifting member 73 rises toward the pressing member 723 while the pressing member 723 is located above the lifting mechanism 73, as shown in Figure 14 The lifting mechanism 73 may rotate the switching mechanism 72 in the separation direction (DR arrow direction) by pressing the pressing member 723. Accordingly, the switching mechanism 72 may be located at the separation position DP. In this state, as the lifting mechanism 73 descends, the switching mechanism 72 may be positioned at the support position SP by rotating in the support direction (SR arrow direction). In this case, the lifting mechanism 73 may descend to a height positioned below the pressing member 723.

The pressing member 723 and the switching member 722 may be disposed such that an included angle forms an obtuse angle based on the rotating shaft 721. Accordingly, the switching mechanism 72 may be formed in a shape in which the switching member 722 is bent toward the lifting mechanism 73 based on the rotation shaft 721. Therefore, when compared with the conversion mechanism 72 is formed in a straight line, the elevating distance that the elevating mechanism 73 must elevate to reduce the elevating mechanism 73 in order to position the diverting member 722 in the spaced apart position DP is reduced. Can.

The pressing member 723 may include a pressing roller 723a (shown in FIG. 13). The pressure roller (723a) is to be in contact with the lifting mechanism (73). In the course of the elevating and descending of the elevating mechanism 73, the pressure roller 723a may rotate by friction with the elevating mechanism 73. Accordingly, the pressure roller (723a) is a malfunction caused by the friction between the lifting mechanism (73) in the process of the switching mechanism (72) rotating between the support position (SP) and the separation position (DP), particles , Can reduce wear and noise. The pressure roller 723a may be rotatably coupled to the switching mechanism 72.

4 to 14, the switching unit 7 may include an elastic member 74 (shown in FIG. 13 ).

The elastic member 74 elastically presses the switch mechanism 72 so that the switch mechanism 72 rotates in the support direction (SR arrow direction). The elastic member 74 has a restoring force as it is deformed as it is pressed by the switching mechanism 72 that rotates in the separation direction (DR arrow direction), and the switching mechanism 72 supports the SR in the supporting direction (SR). The switching mechanism 72 may be elastically pressed to rotate in the direction of the arrow).

For example, as illustrated in FIG. 13, the elastic member 74 may be coupled to the switching body 71 so as to protrude upward from the switching body 71. In this case, the elastic member 74 may be disposed between the switching member 722 and the lifting mechanism (73). In this state, when the lifting mechanism 73 is raised while pressing the pressing member 723, as shown in Figure 14, the switching member 722 rotates in the separation direction (DR arrow direction) the elastic member It can be deformed by pressing (74). In this case, a portion protruding from the elastic member 74 to the upper side of the switching body 71 may be bent. In this state, when the lifting mechanism 73 descends and removes the pressing force against the pressing member 723, the elastic member 74 elastically presses the switching member 722 using a restoring force to convert the The member 722 may be rotated in the support direction (SR arrow direction). Therefore, the switching mechanism 72 may be rotated in the support direction (SR arrow direction) to be positioned at the support position SP. In this case, the elastic member 74 may be implemented as a leaf spring (Leaf Spring).

Although not shown, the elastic member 74 may be implemented with a torsion spring. In this case, the elastic member 74 may be coupled to the rotating shaft 721 of the switching mechanism 72. If the pressing member 723 is pressed while the lifting mechanism 73 is raised, the elastic member 74 has a restoring force as torsional deformation occurs. In this state, when the lifting mechanism 73 descends and removes the pressing force against the pressing member 723, the elastic member 74 elastically presses the switching mechanism 72 using a restoring force to switch the The mechanism 72 can be rotated in the support direction (SR arrow direction).

The switching mechanism 72 may be implemented to rotate in the support direction (SR arrow direction) by using a weight difference between the pressing member 723 and the switching member 722. In this case, the pressing member 723 may be formed to have a heavier weight than the switching member 722. Accordingly, when the lifting mechanism 73 descends while the switching mechanism 72 is located at the separation position DP, the pressing member 723 uses a heavier weight than the switching member 722. To descend. Therefore, the switching mechanism 72 may be rotated in the support direction (SR arrow direction) to be positioned at the support position SP. The pressing member 723 may be formed to have a longer length than the switching member 722 based on the rotating shaft 721, and thus may be formed to be heavier than the switching member 722. A weight (not shown) may be coupled to the pressing member 723. The switching unit 7 may be implemented to use only the difference in weight between the pressing member 723 and the switching member 722 without the elastic member 74, the restoring force of the elastic member 74 and the pressing member It may be implemented to use both the weight difference between the (723) and the switching member (722).

4 to 14, the switching unit 7 may include an elastic mechanism 75 (shown in FIG. 8 ).

The elastic mechanism 75 is to press the lifting mechanism 73 elastically. The elastic mechanism 75 may elastically press the lifting mechanism 73 in a direction to lower the lifting mechanism 73. Accordingly, when the lifting mechanism 73 and the lifting unit 8 are separated, the lifting mechanism 73 may be smoothly lowered by the elastic mechanism 75. Accordingly, the switching mechanism 72 may be smoothly rotated in the support direction (SR arrow direction) to be positioned at the support position SP.

As shown in FIG. 10, when the lifting unit 8 raises the rod 8a and presses and raises the lifting mechanism 73, the elastic mechanism 75 is elastically compressed and has a restoring force. . In this state, when the lifting unit 8 lowers the rod 8a, as shown in FIG. 8, the elastic mechanism 75 is elastically tensioned and pulled to press the lifting mechanism 73. You can descend. Accordingly, the switching mechanism 72 may be positioned in the support position SP by rotating in the support direction (SR arrow direction).

One side of the elastic mechanism 75 may be supported by the switching body 71 and the other side may be supported by the lifting mechanism 73. One side of the elastic mechanism 75 may be supported by a protrusion formed on the protruding member 732. The elastic mechanism 75 may be disposed between the lower surface of the switching body 71 and the upper surface of the projection based on the vertical direction. Accordingly, when the lifting unit 8 raises the rod 8a by pressing the protruding member 732 to rise, the elastic mechanism 75 is in a state where one side is supported by the switching body 71 The other side may be compressed according to the pushing of the projection. When the lifting unit 8 lowers the rod 8a, the elastic mechanism 75 can be tensioned while the other side pushes the protrusion while one side is supported by the switching body 71. The elastic mechanism 75 may be implemented as a coil spring.

The elastic mechanism 75 may include an insertion hole 751 (shown in FIG. 9). The lifting mechanism 73 may be inserted into the insertion hole 751 and disposed. That is, the lifting mechanism 73 is disposed inside the elastic mechanism 75. Accordingly, the elastic mechanism 75 may guide the lifting mechanism 73 inserted into the insertion hole 751 to move up and down in a straight line. Thus, the elastic mechanism 75 can contribute to improving the accuracy of the switching operation for converting the variable lift pin 5 to variably support the substrate 200.

Referring to FIG. 7, the switching unit 7 may include a plurality of the switching mechanisms 72. In this case, a plurality of conversion mechanisms 72 may be coupled to the conversion body 71. The switching mechanisms 72, 72', 72'', 72''' are spaced apart from each other so as to be supported by different parts of the pin plate 3 in the support position (SP, shown in FIG. 8). In the can be coupled to the conversion body (72). Accordingly, as the pin plate 3 rises, the variable pin plate 6 (shown in FIG. 8) rises together, in the process of switching, the switching unit 7 is connected to the variable pin plate 6, FIG. ). Although the switching unit 7 is illustrated in FIG. 7 as including four switching mechanisms 72, the present invention is not limited thereto, and the switching unit 7 includes two, three, or five or more switching mechanisms 72. ). In this case, the pin plate 3 may be coupled with the same number of supporting mechanisms 32 as the number of the switching mechanisms 72.

Referring to FIG. 15, the substrate lift device 1 for a mask alignment device according to a modified embodiment of the present invention may be implemented such that one switching part 7 is coupled to the variable pin plate 6. In this case, the substrate lift device 1 for a mask alignment device according to a modified embodiment of the present invention includes the variable pin plate 6, the switching part 7, the variable lift pin 5, and the lifting unit ( 8) may be implemented to include a plurality of each. The variable pin plates 6 and 6'may be disposed at positions spaced apart from each other. The variable lift pins 5 and 5'and the switching parts 7 and 7'may be coupled to the variable pin plates 6 and 6'. The switching parts 7 and 7'may be individually operated by the lifting units 8 and 8'. Support mechanisms 32 and 32 ′ may be coupled to the pin plate 3 at positions corresponding to the switching parts 7 and 7 ′. Accordingly, some of the variable pin plates 6 and 6 ′ may rise together with the pin plate 3, and the other portions may not rise together with the pin plate 3. 4 and 6, the substrate lift device 1 for a mask alignment device according to the present invention may be implemented such that a plurality of switching parts 7 are coupled to the variable pin plate 6.

The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and it is common in the technical field to which the present invention pertains that various substitutions, modifications and changes are possible without departing from the spirit of the present invention It will be clear to those who have the knowledge of

1: Board lift device for mask alignment device 2: Lift pin
3: Pin plate 4: Elevator
5: variable lift pin 6: variable pin plate
7: Switching unit 8: Lifting unit
31: passing hole 32: support mechanism
41: stage 42: drive unit
43: support member 71: switching body
72: switching mechanism 73: lifting mechanism
74: elastic member 75: elastic mechanism

Claims (20)

A variable lift pin for supporting the substrate;
A pin plate installed to be able to move up and down;
An elevating unit for elevating and elevating the pin plate;
A variable pin plate to which the variable lift pin is coupled; And
It includes a switching portion coupled to the variable pin plate,
The conversion unit includes a conversion body coupled to the variable pin plate, and a conversion mechanism rotatably coupled to the conversion body,
The switching mechanism is spaced apart from the pin plate such that the support position supported by the pin plate so that the variable pin plate moves up and down as the pin plate moves up and down and the pin plate independently moves up and down relative to the variable pin plate. It is coupled to the switching body so as to be rotatable between the separation positions,
The variable lift pin is disposed in a position to support the substrate when the pin plate rises while the switch mechanism is in the support position, and when the pin plate rises while the switch mechanism is in the spaced position, A substrate lift device for a mask alignment device, which is arranged at a position spaced apart from the substrate. According to claim 1,
The through hole is formed in the pin plate,
The switching mechanism is rotatably coupled to the switching body so as to protrude outward from the through hole in the support position and to be disposed only inside the through hole in the spaced position,
The elevating unit elevates and lowers the pin plate in a state in which the switching mechanism is located in the support position so that the pin plate supports the switching mechanism protruding outward of the through hole and moves up and down together with the switching mechanism. For the mask alignment device, characterized in that the pin plate is moved up and down in a state where the switch mechanism is located at the spaced apart position so as to independently move up and down with respect to the switch mechanism through a switch mechanism disposed only inside the through hole. Substrate lift device. According to claim 2,
The switching mechanism is laid out so as to protrude outward of the through-hole, and is placed in the support position, and is placed so as to be disposed only inside the through-hole, and thus the substrate lift device for a mask alignment device. According to claim 2,
The pin plate is coupled with a support mechanism for supporting the switching mechanism located in the support position,
The switching mechanism includes a switching member that protrudes outward from the through hole at the support position and is disposed only inside the passage hole in the spaced apart position, and centers a rotation axis so that the conversion member protrudes outside the through hole. Rotate in the support direction,
The support mechanism is a substrate lift device for a mask alignment device, characterized in that it comprises a first support member for supporting the switch member so that the angle at which the switch mechanism is rotatable in the support direction is limited. According to claim 4,
The support mechanism includes a second support member disposed below the conversion member supported by the first support member, wherein the inner side toward the through hole is formed to open,
The switching member is supported by the first support member in the support position and spaced apart from the second support member, and rotates to the separation position through the open inner side of the support mechanism. Lift device. According to claim 4,
The support mechanism includes an attachment member coupled to the first support member,
The attachment member is a substrate lift device for a mask aligning device, characterized in that a conversion member protruding outward of the through hole is attached to the first support member by using a magnetic property. According to claim 4,
The conversion member includes a conversion roller for contacting the support mechanism,
The conversion roller is a substrate lift device for a mask alignment device, characterized in that rotates by friction with the support mechanism. According to claim 1,
The switching unit includes a lifting mechanism coupled to the switching body to be elevated and lowered,
The lifting mechanism rises toward the switching mechanism located in the support position and presses the switching mechanism,
The switch mechanism is located in the support position, the substrate lift device for a mask alignment device, characterized in that it is located in the spaced apart by rotating in a spaced direction around the rotation axis as being pressed by the lifting mechanism. The method of claim 8,
The switching mechanism includes a pressing member for being pressed by the lifting mechanism, and a switching member supported on the pin plate in the support position,
The pressing member and the switching member are disposed opposite to each other based on the rotation axis,
The lifting mechanism is lifted toward the pressing member so that the switching mechanism rotates in the separation direction around the rotation axis, thereby pressing the pressing member. The method of claim 9,
And the switching unit includes an elastic member that elastically presses the switching mechanism so that the switching mechanism rotates in a support direction opposite to the separation direction about the rotation axis. The method of claim 10,
The elastic member is coupled to the switching body so as to protrude upward from the switching body,
The switching mechanism rotates in the separation direction around the rotation axis so that the switching member presses and deforms the elastic member as the lifting mechanism is pressed while the lifting mechanism is raised, and the elastic when the lifting mechanism descends A substrate lift device for a mask alignment device, characterized in that as the member is restored, the switching member is pressed to rotate in the support direction about the rotation axis. The method of claim 9,
The pressing member is formed to have a heavier weight than the switching member,
The switching mechanism rotates in the separation direction around the rotating shaft as the lifting mechanism is pressed while the lifting mechanism is raised, and when the lifting mechanism descends, the separation is centered around the rotating shaft using the weight of the pressing member. A substrate lift device for a mask alignment device, which rotates in a support direction opposite to a direction. The method of claim 8,
The switching mechanism includes a pressing member for being pressed by the lifting mechanism,
The pressing member includes a pressing roller for contacting the lifting mechanism,
The pressure roller is a substrate lift device for a mask alignment device, characterized in that the lifting mechanism rotates by friction with the lifting mechanism in the process of lifting and lowering. The method of claim 8,
The lifting mechanism includes a guide member whose diameter decreases as it extends in an upward direction,
The switching mechanism is a substrate lift device for a mask alignment device, characterized in that as the lifting mechanism moves up and down while in contact with the guide member, it rotates about the rotation axis. The method of claim 8,
It includes a lifting unit disposed on the lower side of the lifting mechanism,
The elevating unit supports the elevating mechanism such that after the elevating mechanism is raised so that the converting mechanism rotates to the separating position, the converting mechanism remains in the distant position.
The lifting mechanism is lifted together as the pin plate rises while the switching mechanism is located in the support position and is spaced apart from the lifting unit. The method of claim 15,
When the lifting unit and the lifting unit are spaced apart from each other, the switching unit includes an elastic mechanism that elastically presses the lifting mechanism in a direction of descending the lifting mechanism. The method of claim 16,
The elastic mechanism includes an insertion hole into which the lifting mechanism is inserted, and the substrate lift device for a mask alignment device, characterized in that the lifting mechanism inserted into the insertion hole guides to move up and down in a straight line. The method of claim 16,
A plurality of the switching portion is coupled to the variable pin plate,
The switching unit is a substrate lift device for a mask alignment device, characterized in that coupled to the variable plate to be located at a position spaced from each other. According to claim 1,
A plurality of conversion mechanisms are coupled to the conversion body,
The switching mechanism is a substrate lift device for a mask alignment device, characterized in that coupled to the switching body at a position spaced apart from each other so as to be supported on different parts of the pin plate in the support position. According to claim 1,
It includes a lift pin for supporting the substrate,
The lift pin is coupled to the pin plate,
The variable lift pin is a substrate lift device for a mask alignment device, characterized in that arranged to be located at a position spaced from the lift pin.

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