KR20200019514A - 발광 다이오드 패키지 및 발광 다이오드 패키지를 포함하는 디스플레이 장치 - Google Patents
발광 다이오드 패키지 및 발광 다이오드 패키지를 포함하는 디스플레이 장치 Download PDFInfo
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- KR20200019514A KR20200019514A KR1020180095132A KR20180095132A KR20200019514A KR 20200019514 A KR20200019514 A KR 20200019514A KR 1020180095132 A KR1020180095132 A KR 1020180095132A KR 20180095132 A KR20180095132 A KR 20180095132A KR 20200019514 A KR20200019514 A KR 20200019514A
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- emitting diode
- light emitting
- light
- wavelength conversion
- diode chip
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020180095132A KR20200019514A (ko) | 2018-08-14 | 2018-08-14 | 발광 다이오드 패키지 및 발광 다이오드 패키지를 포함하는 디스플레이 장치 |
PCT/KR2019/008763 WO2020036320A1 (ko) | 2018-08-14 | 2019-07-16 | 발광 다이오드 패키지 및 발광 다이오드 패키지를 포함하는 디스플레이 장치 |
CN201910749687.1A CN110828638A (zh) | 2018-08-14 | 2019-08-08 | 发光二极管封装件及具备发光二极管封装件的显示装置 |
CN201910728600.2A CN110828637A (zh) | 2018-08-14 | 2019-08-08 | 发光二极管封装件及具备发光二极管封装件的显示装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020180095132A KR20200019514A (ko) | 2018-08-14 | 2018-08-14 | 발광 다이오드 패키지 및 발광 다이오드 패키지를 포함하는 디스플레이 장치 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20200019514A true KR20200019514A (ko) | 2020-02-24 |
Family
ID=69525553
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020180095132A KR20200019514A (ko) | 2018-08-14 | 2018-08-14 | 발광 다이오드 패키지 및 발광 다이오드 패키지를 포함하는 디스플레이 장치 |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR20200019514A (zh) |
CN (2) | CN110828638A (zh) |
WO (1) | WO2020036320A1 (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022173005A1 (ja) * | 2021-02-12 | 2022-08-18 | 味の素株式会社 | 発光素子パッケージ及びその製造方法 |
CN113659058B (zh) * | 2021-08-20 | 2023-10-20 | 京东方科技集团股份有限公司 | 一种发光器件及其制备方法、显示装置 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101323401B1 (ko) * | 2006-12-29 | 2013-10-29 | 엘지디스플레이 주식회사 | 광원소자, 그 제조방법, 이를 구비한 백라이트 유닛 및액정표시장치 |
EP2207993A4 (en) * | 2007-11-08 | 2013-09-04 | Innovations In Optics Inc | LED LIGHTING SYSTEM |
EP2347170A4 (en) * | 2008-11-06 | 2017-12-27 | Innovations in Optics, Inc. | Light emitting diode emergency lighting module |
KR101615497B1 (ko) * | 2009-11-27 | 2016-04-27 | 삼성전자주식회사 | 발광소자 패키지 및 그 제조방법 |
CN102749757A (zh) * | 2011-04-18 | 2012-10-24 | 友达光电股份有限公司 | 防漏光显示装置及其背光模组 |
KR20130121204A (ko) * | 2012-04-25 | 2013-11-06 | 엘지디스플레이 주식회사 | 엘이디 패키지 및 이를 이용한 액정표시장치 |
KR20140089765A (ko) * | 2013-01-07 | 2014-07-16 | 엘지이노텍 주식회사 | 발광 소자 패키지 |
KR102426861B1 (ko) * | 2015-12-02 | 2022-07-29 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 발광 소자 패키지 |
CN107039572B (zh) * | 2016-02-03 | 2019-05-10 | 行家光电股份有限公司 | 具非对称性光形的发光装置及其制造方法 |
CN205723605U (zh) * | 2016-03-31 | 2016-11-23 | 首尔半导体股份有限公司 | 发光元件、包括其的发光模块、背光单元及显示装置 |
KR20170121777A (ko) * | 2016-04-25 | 2017-11-03 | 삼성전자주식회사 | 반도체 발광장치 |
KR102516693B1 (ko) * | 2016-04-29 | 2023-03-31 | 엘지디스플레이 주식회사 | Led 패키지 모듈 및 이를 갖는 디스플레이 장치 |
KR20170139942A (ko) * | 2016-06-10 | 2017-12-20 | 서울반도체 주식회사 | 발광 다이오드 패키지 및 그의 제조 방법 |
US10121945B2 (en) * | 2016-12-16 | 2018-11-06 | Samsung Electronics Co., Ltd. | Semiconductor light emitting device |
-
2018
- 2018-08-14 KR KR1020180095132A patent/KR20200019514A/ko not_active Application Discontinuation
-
2019
- 2019-07-16 WO PCT/KR2019/008763 patent/WO2020036320A1/ko active Application Filing
- 2019-08-08 CN CN201910749687.1A patent/CN110828638A/zh active Pending
- 2019-08-08 CN CN201910728600.2A patent/CN110828637A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
CN110828638A (zh) | 2020-02-21 |
WO2020036320A1 (ko) | 2020-02-20 |
CN110828637A (zh) | 2020-02-21 |
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