KR20200016623A - Mask set and method for changing mask of mask integrated frame - Google Patents

Abstract

The present invention relates to a mask set and a method for replacing a mask of a frame-integrated mask which can improve position precision. According to the present invention, the mask set (100-1, 100-2, 100-3, ...) is used in a frame-integrated mask in which a plurality of masks (100) and a frame (200) supporting the masks (100) are integrally formed. The mask set (100-1, 100-2, 100-3, ...) comprises a mask cell (C) having a plurality of mask patterns (P), and a plurality of masks (100-1, 100-2, 100-3) including a dummy (DM) around the mask cell (C). Each mask (100-1, 100-2, 100-3) has a plurality of welding portions (WP-1, WP-2, WP-3) formed at regular intervals on at least a portion of the dummy (DM). The positions where the welding portions (WP-1, WP-2, WP-3) are formed are different for each mask (100-1, 100-2, 100-3).

Description

MASK SET AND METHOD FOR CHANGING MASK OF MASK INTEGRATED FRAME}

The present invention relates to a mask replacement method of a mask set and a frame integrated mask. More specifically, a mask set and a mask replacement method of the frame-integrated mask can be made integral with the frame, and the alignment between the masks can be clarified in the process of separating and replacing the mask from the frame. It is about.

Recently, studies on electroforming methods have been underway in thin plate manufacturing. The electroplating method is to immerse the positive electrode and the negative electrode in the electrolyte, and to apply the power to electrodeposit the metal thin plate on the surface of the negative electrode, it is possible to manufacture the ultra-thin plate, the mass production is expected.

Meanwhile, as a technology of forming pixels in an OLED manufacturing process, a fine metal mask (FMM) method of depositing an organic material at a desired position by closely attaching a thin metal mask to a substrate is mainly used.

In the conventional OLED manufacturing process, the mask is manufactured in the form of a stick, a plate, and the like, and then the mask is welded and fixed to the OLED pixel deposition frame. Each mask may include a plurality of cells corresponding to one display. In addition, in order to manufacture a large area OLED, several masks may be fixed to the OLED pixel deposition frame. In the process of fixing to the frame, each mask is tensioned to be flat. Adjusting the tension to make the entire part of the mask flat is a very difficult task. In particular, in order to align the mask pattern having a size of only a few to several tens of micrometers while flattening each cell, a high-level operation of checking the alignment in real time while finely adjusting the tension applied to each side of the mask is required. do.

Nevertheless, in the process of fixing several masks in one frame, there is a problem in that the alignment between the mask cells and the mask cells is not good. In addition, the mask film is too thin and large in the process of welding and fixing the mask to the frame, which causes the mask to be squeezed or distorted due to the load, wrinkles, burrs, etc. generated in the welded part in the welding process. There was a problem of misalignment.

In the case of ultra-high definition OLED, QHD image quality is 500 ~ 600 pixel per inch (PPI), and the pixel size is about 30 ~ 50㎛, and 4K UHD, 8K UHD high definition is higher than 860 PPI, ~ 1600 PPI, etc. It has a resolution of. As such, in consideration of the pixel size of the ultra-high-definition OLED, the alignment error between the cells must be reduced to several micrometers, and the error beyond this can lead to product failure, resulting in very low yield. Therefore, there is a need for development of a technique for preventing deformation, such as knocking or twisting of a mask and making alignment clear, a technique for fixing a mask to a frame, and the like.

Therefore, the present invention has been made to solve the above-mentioned problems of the prior art, the mask of the mask set and the frame-integrated mask to improve the position accuracy by preventing deformation of the mask when the mask is bonded to the frame Its purpose is to provide a replacement method.

The above object of the present invention is a mask set used in a frame-integrated mask in which a plurality of masks and a frame for supporting the mask are integrally formed, wherein the mask set includes a mask cell in which a plurality of mask patterns are formed, and a dummy around the mask cell. And a plurality of masks including a plurality of masks, wherein each mask is formed by at least a portion of the dummy with a plurality of welds spaced apart from each other, and a position of the welds formed for each mask is different by a mask set.

For each mask a weld may be formed at the shifted position.

An anti-wrinkle pattern may be formed around each weld portion of the mask at predetermined intervals.

An anti-wrinkle pattern may be formed at each shifted position for each mask.

The anti-wrinkle pattern may occupy at least a circumferential region that is concentric with the weld and has a larger diameter than the weld.

A plurality of buffer patterns may be further formed between the anti-wrinkle pattern and the mask pattern and have a width greater than that of the mask pattern.

The above object of the present invention is a method of replacing a mask in a frame-integrated mask in which a plurality of masks and a frame for supporting the mask are integrally formed, comprising: (a) at least a portion of an upper portion of the frame having a plurality of mask cell regions; Providing a frame integrated mask having a plurality of masks bonded thereto; (b) detaching from the frame a first mask adhered to a predetermined mask cell area; (c) corresponding to the second mask on a predetermined mask cell area, and irradiating a welding portion of the second mask to a frame by irradiating a laser, wherein each of the first mask and the second mask includes a plurality of mask patterns; A formed mask cell, and a dummy around the mask cell, wherein a plurality of welds are formed at intervals on at least a part of the dummy, and each of the first mask and the second mask has a different position at which the weld is formed. Is achieved by a mask replacement method.

The frame may include a mask cell sheet part having an edge frame portion and a plurality of mask cell regions and connected to the edge frame portion.

The mask cell sheet unit may include a plurality of mask cell regions in at least one of a first direction and a second direction perpendicular to the first direction.

The mask cell sheet portion includes an edge sheet portion; At least one first grid sheet portion extending in a first direction and connected at both ends to the edge sheet portion; And at least one second grid sheet portion extending in a second direction perpendicular to the first direction and intersecting with the first grid sheet portion, and both ends connected to the edge sheet portion.

Each mask may correspond to each mask cell region.

In step (b), the outer portion of at least one edge of the first mask may be compressed and an external force may be applied to one edge of the mask to separate the first mask from the frame.

In the step (b), the upper and lower surfaces of the frame disposed on the outer side of one edge of the first mask may be compressed.

The upper surface of the corner of the frame corresponding to the one side edge of the first mask may be pressed with the pressing bar.

The support formed on the upper surface of the frame support groove corresponding to the frame shape may be disposed under the frame.

In step (b), one side edge of the first mask is removed from the frame by applying external force to one edge of the first mask, and then the other edge is removed from the frame by applying external force to the other edge opposite to one side of the first mask. The first mask can be separated from the frame.

In step (c), a weld bead is formed on a portion of the welded portion of the second mask to which the laser is irradiated, and the weld bead may be mediated so that the second mask and the frame are integrally connected.

The position of the welded portion of the second mask may be formed at a position shifted in the welded portion of the first mask.

An anti-wrinkle pattern may be formed around each weld portion of the mask at predetermined intervals.

The position of the anti-wrinkle pattern of the second mask may be formed at a position shifted from the anti-wrinkle pattern portion of the first mask.

The anti-wrinkle pattern may occupy at least a circumferential region that is concentric with the weld and has a larger diameter than the weld.

A plurality of buffer patterns may be further formed between the anti-wrinkle pattern and the mask pattern and have a width greater than that of the mask pattern.

According to the present invention configured as described above, when the mask is adhered to the frame, there is an effect that can prevent the deformation to occur in the mask to improve the position accuracy.

1 is a schematic view showing a conventional mask for OLED pixel deposition.
2 is a schematic diagram illustrating a process of adhering a conventional mask to a frame.
3 is a schematic view showing that alignment errors between cells occur in the process of tensioning a conventional mask.
4 is a front and side cross-sectional view showing a frame-integrated mask according to an embodiment of the present invention.
5 is a front and side cross-sectional view showing a frame according to an embodiment of the present invention.
6 is a schematic diagram illustrating a manufacturing process of a frame according to an embodiment of the present invention.
7 is a schematic diagram illustrating a manufacturing process of a frame according to another embodiment of the present invention.
8 is a schematic view showing the shape of a mask according to an embodiment of the present invention and a state in which a mask is attached on a tray.
9 to 12 are schematic views illustrating a wrinkle prevention pattern of a mask according to various embodiments of the present disclosure.
It is a schematic diagram which shows the state which attached the mask which concerns on a comparative example on a tray.
14 is a schematic view showing a state in which a mask according to a comparative example is attached to a cell region of a frame.
15 is a schematic diagram illustrating a state in which a mask is adhered to a cell region of a frame according to an embodiment of the present invention.
16 is a schematic diagram illustrating a state in which a tray is loaded onto a frame according to a comparative example to correspond to a mask cell area of the frame.
17 is a schematic diagram illustrating a process of bonding a mask to a cell region of a frame by loading a tray on a frame according to a comparative example, and an interface state between the mask and the tray.
18 is a schematic diagram illustrating a process of bonding a mask to a cell region of a frame by loading a tray onto a frame according to an embodiment of the present invention, and an interface state between the mask and the tray.
19 is a schematic diagram illustrating a tray according to an embodiment of the present invention.
20 is a schematic diagram illustrating a state in which a tray is loaded onto a frame and a mask corresponds to a cell area of the frame according to an embodiment of the present invention.
21 is a schematic diagram illustrating a process of sequentially attaching a mask to a cell region according to an embodiment of the present invention.
22 is a schematic diagram illustrating a process of lowering a temperature of a process region after attaching a mask to a cell region of a frame according to an embodiment of the present invention.
23 is a schematic diagram illustrating an OLED pixel deposition apparatus using a frame-integrated mask according to an embodiment of the present invention.
24 is a schematic diagram illustrating a process of separating a mask from a frame-integrated mask according to an embodiment of the present invention.
25 is a schematic diagram illustrating a mask set according to an embodiment of the present invention.
26 is a schematic diagram illustrating a state in which a mask is replaced in a frame-integrated mask according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION The following detailed description of the invention refers to the accompanying drawings that show, by way of illustration, specific embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention. It is to be understood that the various embodiments of the invention are different but need not be mutually exclusive. For example, certain shapes, structures, and characteristics described herein may be embodied in other embodiments without departing from the spirit and scope of the invention with respect to one embodiment. In addition, it is to be understood that the location or arrangement of individual components within each disclosed embodiment may be changed without departing from the spirit and scope of the invention. The following detailed description, therefore, is not to be taken in a limiting sense, and the scope of the present invention is defined only by the appended claims, along with the full scope of equivalents to which such claims are entitled. In the drawings, like reference numerals refer to the same or similar functions throughout the several aspects, and length, area, thickness, and the like may be exaggerated for convenience.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily implement the present invention.

1 is a schematic diagram showing a conventional mask for OLED pixel deposition 10.

Referring to FIG. 1, the mask 10 may be manufactured in a stick type or a plate type. The mask 10 shown in FIG. 1A is a stick type mask, and both sides of the stick may be welded and fixed to the OLED pixel deposition frame. The mask 100 illustrated in FIG. 1B is a plate-type mask and may be used in a large area pixel forming process.

A plurality of display cells C are provided in the body (or mask film 11) of the mask 10. One cell C corresponds to one display such as a smartphone. In the cell C, a pixel pattern P is formed to correspond to each pixel of the display. When the cell C is enlarged, a plurality of pixel patterns P corresponding to R, G, and B appear. For example, the pixel pattern P is formed in the cell C to have a resolution of 70 × 140. That is, a large number of pixel patterns P may be clustered to form one cell C, and a plurality of cells C may be formed in the mask 10.

2 is a schematic diagram illustrating a process of adhering the mask 10 to the frame 20. 3 is a schematic view showing that alignment errors between cells occur in the process of tensioning the mask 10 (F1 to F2). A stick mask 10 having six cells C: C1 to C6 shown in FIG. 1A will be described as an example.

Referring to FIG. 2A, first, the stick mask 10 should be flattened. The stick mask 10 is unfolded as the tensile force F1 to F2 is applied in the major axis direction of the stick mask 10 and pulled. In this state, the stick mask 10 is loaded onto the frame 20 having a rectangular frame shape. The cells C1 to C6 of the stick mask 10 are positioned in the empty area of the frame 20 of the frame 20. The frame 20 may be large enough so that the cells C1 to C6 of one stick mask 10 are located in an empty area inside the frame, and the cells C1 to C6 of the plurality of stick masks 10 are framed. It may also be large enough to fit inside the empty area.

Referring to (b) of FIG. 2, after aligning while finely adjusting the tensile forces F1 to F2 applied to each side of the stick mask 10, a part of the side surface of the stick mask 10 is welded (W). Accordingly, the stick mask 10 and the frame 20 are interconnected. 2 (c) shows the side surface of the stick mask 10 and the frame connected to each other.

Referring to FIG. 3, in spite of finely adjusting the tensile forces F1 to F2 applied to each side of the stick mask 10, problems of misalignment of the mask cells C1 to C3 appear. For example, the distances D1 to D1 ″ and D2 to D2 ″ may be different from each other or the patterns P may be skewed between the patterns P of the cells C1 to C3. The stick mask 10 is a large area including a plurality of (eg, six) cells C1 to C6 and has a very thin thickness on the order of tens of micrometers, and thus is easily struck or warped by a load. In addition, it is very difficult to check the alignment between the cells C1 to C6 in real time through a microscope while adjusting the tensile forces F1 to F2 to flatten each of the cells C1 to C6.

Therefore, the minute error of the tensile force (F1 ~ F2) may cause an error in the extent that the cells (C1 ~ C3) of the stick mask 10 is extended or unfolded, and thus the distance (D1) between the mask pattern (P) ~ D1 ", D2-D2") cause a problem that becomes different. Of course, it is difficult to perfectly align the error to 0, but in order that the mask pattern P having a size of several to several tens of micrometers does not adversely affect the pixel process of the ultra-high definition OLED, the alignment error does not exceed 3 micrometers. It is preferable not to. This alignment error between adjacent cells is referred to as pixel position accuracy (PPA).

In addition, between the plurality of stick masks 10 and the plurality of cells C of the stick masks 10 while connecting the plurality of stick masks 10 of about 6 to 20 to each of the frames 20, respectively. It is also very difficult to clarify the alignment between ~ C6), and the process time due to alignment is inevitably increased, which is a significant reason for reducing productivity.

On the other hand, after fixing the stick mask 10 to the frame 20, the tensile force (F1 ~ F2) applied to the stick mask 10 may act inversely to the frame 20. That is, the stick mask 10, which is stretched by the tension forces F1 to F2, may be tensioned to the frame 20 after being connected to the frame 20. In general, the tension may not be large and may not have a large influence on the frame 20. However, when the size of the frame 20 is miniaturized and the rigidity is low, the tension may slightly change the frame 20. Thus, a problem may arise in that the alignment state is changed between the plurality of cells C to C6.

Accordingly, the present invention proposes a frame 200 and a frame integrated mask that allow the mask 100 to form an integrated structure with the frame 200. The mask 100 integrally formed in the frame 200 may be prevented from being deformed or warped, and may be clearly aligned with the frame 200. Since no tensile force is applied to the mask 100 when the mask 100 is connected to the frame 200, the tension may not be applied to the frame 200 after the mask 100 is connected to the frame 200. . In addition, the manufacturing time for integrally connecting the mask 100 to the frame 200 may be significantly reduced, and the yield may be significantly increased.

4 is a front view (FIG. 4 (a)) and a side cross-sectional view (FIG. 4 (b)) showing a frame-integrated mask according to an embodiment of the present invention, Figure 5 is according to an embodiment of the present invention It is a front view (FIG. 5 (a)) and a side cross-sectional view (FIG. 5 (b)) which show a frame.

4 and 5, the frame integrated mask may include a plurality of masks 100 and one frame 200. In other words, each of the plurality of masks 100 is bonded to the frame 200. Hereinafter, for convenience of description, the rectangular mask 100 will be described as an example, but the masks 100 may be in the form of a stick mask having protrusions clamped at both sides before being bonded to the frame 200, and the frame 200. The protrusions can be removed after they have been glued to them.

A plurality of mask patterns P may be formed in each mask 100, and one cell C may be formed in one mask 100. One mask cell C may correspond to one display such as a smartphone. In order to form a thin thickness, the mask 100 may be formed by electroforming. The mask 100 may be an invar having a thermal expansion coefficient of about 1.0 × 10 ⁻⁶ / ° C. and a super invar material having about 1.0 × 10 ⁻⁷ / ° C. Since the mask 100 of this material has a very low coefficient of thermal expansion, there is little possibility that the pattern shape of the mask is deformed by thermal energy, and thus, the mask 100 may be used as a fine metal mask (FMM) or a shadow mask in high-resolution OLED manufacturing. In addition, in consideration of the recent development of techniques for performing the pixel deposition process in a range where the temperature change is not large, the mask 100 has a slightly larger thermal expansion coefficient than that of nickel (Ni) and nickel-cobalt (Ni-Co). It may be a material such as). The thickness of the mask may be formed to about 2 to 50㎛.

The frame 200 is formed to bond the plurality of masks 100. The frame 200 may include various edges formed in a first direction (eg, a horizontal direction) and a second direction (eg, a vertical direction) including an outermost edge. These various corners may define the area to which the mask 100 is to be bonded on the frame 200.

The frame 200 may include an edge frame portion 210 having a substantially rectangular shape and a rectangular frame shape. The inside of the frame frame 210 may be hollow. That is, the frame frame 210 may include a hollow region (R). The frame 200 may be made of a metal material such as Invar, Super Invar, Aluminum, Titanium, etc., and may be made of Inbar, Super Invar, Nickel, or Nickel-Cobalt having the same thermal expansion coefficient as a mask in consideration of thermal deformation. Preferably, the materials may be applied to both the edge frame portion 210 and the mask cell sheet portion 220 which are components of the frame 200.

In addition, the frame 200 may include a plurality of mask cell regions CR and may include a mask cell sheet portion 220 connected to the edge frame portion 210. Like the mask 100, the mask cell sheet part 220 may be formed by electroplating or may be formed using another film forming process. In addition, the mask cell sheet part 220 may be connected to the edge frame part 210 after forming a plurality of mask cell areas CR through laser scribing, etching, etc. on a flat sheet. Alternatively, the mask cell sheet unit 220 may form a plurality of mask cell regions CR through laser scribing, etching, etc. after connecting the planar sheet to the edge frame unit 210. In the present specification, a plurality of mask cell regions CR are first formed in the mask cell sheet part 220, and then the main parts of the mask cell sheet part 220 are connected to the edge frame part 210.

The mask cell sheet unit 220 may include at least one of the edge sheet unit 221 and the first and second grid sheet units 223 and 225. The edge sheet portion 221 and the first and second grid sheet portions 223 and 225 refer to respective portions partitioned from the same sheet, which are integrally formed with each other.

The edge sheet portion 221 may be substantially connected to the edge frame portion 210. Accordingly, the edge sheet part 221 may have a substantially rectangular shape and a rectangular frame shape corresponding to the edge frame part 210.

In addition, the first grid sheet part 223 may extend in a first direction (horizontal direction). The first grid sheet part 223 may be formed in a straight line shape and both ends thereof may be connected to the edge sheet part 221. When the mask cell sheet portion 220 includes a plurality of first grid sheet portions 223, each of the first grid sheet portions 223 may be equally spaced apart.

In addition, in addition, the second grid sheet part 225 may be formed to extend in a second direction (vertical direction). The second grid sheet part 225 may be formed in a straight line shape and both ends thereof may be connected to the edge sheet part 221. The first grid sheet part 223 and the second grid sheet part 225 may vertically cross each other. When the mask cell sheet portion 220 includes a plurality of second grid sheet portions 225, each of the second grid sheet portions 225 may be equally spaced apart.

Meanwhile, the spacing between the first grid sheet portions 223 and the spacing between the second grid sheet portions 225 may be the same or different according to the size of the mask cell C. FIG.

The first grid sheet portion 223 and the second grid sheet portion 225 have a thin thickness in the form of a thin film, but the shape of the cross section perpendicular to the longitudinal direction may be a rectangle, a square shape such as a parallelogram, a triangular shape, or the like. The edges, edges and corners may be partially rounded. The cross-sectional shape is adjustable in the process of laser scribing, etching and the like.

The thickness of the edge frame portion 210 may be thicker than the thickness of the mask cell sheet portion 220. The edge frame part 210 may be formed to a thickness of several mm to several cm because it is responsible for the overall rigidity of the frame 200.

In the case of the mask cell sheet portion 220, a process of manufacturing a substantially thick sheet is difficult, and if the thickness is too thick, a path through which the organic source 600 (see FIG. 23) passes through the mask 100 in the OLED pixel deposition process. This can cause problems. On the contrary, if the thickness is too thin, it may be difficult to secure rigidity enough to support the mask 100. Accordingly, the mask cell sheet portion 220 is thinner than the thickness of the edge frame portion 210, but preferably thicker than the mask 100. The mask cell sheet part 220 may have a thickness of about 0.1 mm to about 1 mm. In addition, the widths of the first and second grid sheet parts 223 and 225 may be formed to about 1 to 5 mm.

A plurality of mask cell areas CR: CR11 to CR56 may be provided except for an area occupied by the edge sheet part 221 and the first and second grid sheet parts 223 and 225 in the planar sheet. In another aspect, the mask cell region CR is a region occupied by the edge sheet portion 221 and the first and second grid sheet portions 223 and 225 in the hollow region R of the edge frame portion 210. Except for, it may mean an empty area.

As the cell C of the mask 100 corresponds to the mask cell region CR, the mask C may be used as a passage through which the pixels of the OLED are deposited through the mask pattern P. FIG. As described above, one mask cell C corresponds to one display such as a smartphone. Mask patterns P that form one cell C may be formed in one mask 100. Alternatively, one mask 100 may include a plurality of cells C and each cell C may correspond to each cell region CR of the frame 200. It is necessary to avoid the large area mask 100, and the small area mask 100 provided with one cell C is preferable. Alternatively, one mask 100 having a plurality of cells C may correspond to one cell region CR of the frame 200. In this case, for the sake of clear alignment, it may be considered to correspond to the mask 100 having a few cells C of about 2-3.

The frame 200 may include a plurality of mask cell regions CR, and each mask 100 may be bonded such that one mask cell C corresponds to the mask cell region CR. Each mask 100 may include a mask cell C on which a plurality of mask patterns P are formed and a dummy (corresponding to a portion of the mask film 110 except for the cell C) around the mask cell C. have. The dummy may include only the mask film 110 or the mask film 110 having a predetermined dummy pattern having a similar shape to the mask pattern P. FIG. The mask cell C may correspond to the mask cell region CR of the frame 200, and part or all of the dummy may be adhered to the frame 200 (mask cell sheet portion 220). Accordingly, the mask 100 and the frame 200 may form an integrated structure.

On the other hand, according to another embodiment, the frame is not manufactured by adhering the mask cell sheet portion 220 to the edge frame portion 210, the frame frame portion 210 in the hollow region (R) portion of the edge frame portion 210 ), A frame in which a grid frame (corresponding to the grid sheet portions 223 and 225) which is integral with the frame) is formed immediately. The frame of this type also includes at least one mask cell region CR, and the mask integrated region may be manufactured by corresponding the mask 100 to the mask cell region CR.

Hereinafter, the process of manufacturing a frame integrated mask is demonstrated.

First, the frame 200 described above with reference to FIGS. 4 and 5 may be provided. 6 is a schematic diagram illustrating a manufacturing process of the frame 200 according to an embodiment of the present invention.

Referring to FIG. 6A, an edge frame unit 210 is provided. The edge frame portion 210 may have a rectangular frame shape including the hollow area R.

Next, referring to FIG. 6B, a mask cell sheet part 220 is manufactured. The mask cell sheet unit 220 may be manufactured by fabricating a flat sheet using pre-plating or other film forming process, and then removing the mask cell region CR through laser scribing or etching. have. In the present specification, a description is given taking an example of forming a 6 × 5 mask cell region (CR: CR11 to CR56). There may be five first grid sheet portions 223 and four second grid sheet portions 225.

Next, the mask cell sheet part 220 may correspond to the edge frame part 210. In the corresponding process, all the sides of the mask cell sheet part 220 are stretched (F1 to F4), and the edge sheet part 221 is connected to the edge frame part 210 while the mask cell sheet part 220 is flattened. It can respond. On one side, the mask cell sheet part 220 may be grasped and tensioned at various points (for example, 1 to 3 points in FIG. 6B). On the other hand, the mask cell sheet portion 220 may be stretched (F1, F2) not in all sides but in some lateral direction.

Next, when the mask cell sheet part 220 corresponds to the border frame part 210, the edge sheet part 221 of the mask cell sheet part 220 may be welded (W) and bonded. It is preferable to weld (W) all sides so that the mask cell sheet portion 220 can be firmly adhered to the edge frame portion 220. Welding (W) should be performed as close as possible to the edge of the edge frame portion 210 as much as possible to reduce the excited space between the edge frame portion 210 and the mask cell sheet portion 220 as much as possible to increase the adhesion. The welding (W) portion may be generated in a line or spot form, and may have the same material as the mask cell sheet portion 220 and integrate the edge frame portion 210 and the mask cell sheet portion 220. It can be a medium to connect to.

7 is a schematic diagram illustrating a manufacturing process of a frame according to another embodiment of the present invention. In the embodiment of FIG. 6, the mask cell sheet part 220 having the mask cell area CR is first manufactured and adhered to the edge frame part 210. However, the embodiment of FIG. After adhesion to 210, the mask cell region CR is formed.

First, as shown in FIG. 6A, the edge frame part 210 including the hollow area R is provided.

Next, referring to FIG. 7A, the edge frame portion 210 may correspond to a planar sheet (the plane mask cell sheet portion 220 ′). The mask cell sheet portion 220 ′ is in a planar state in which the mask cell region CR is not yet formed. In the corresponding process, all sides of the mask cell sheet part 220 'may be stretched (F1 to F4) to correspond to the edge frame part 210 in a state where the mask cell sheet part 220' is flattened. On one side, the mask cell sheet portion 220 'may be grasped and tensioned at several points (for example, 1 to 3 points in FIG. 7A). On the other hand, the mask cell sheet portion 220 'may be stretched (F1, F2) not in all sides but in some lateral direction.

Next, when the mask cell sheet portion 220 'corresponds to the edge frame portion 210, the edge portion of the mask cell sheet portion 220' may be welded (W) and bonded. It is preferable to weld (W) all sides so that the mask cell sheet portion 220 ′ can be firmly adhered to the edge frame portion 220. Welding (W) should be performed as close as possible to the edge of the edge frame portion 210 as much as possible to reduce the excited space between the edge frame portion 210 and the mask cell sheet portion 220 'as much as possible to increase the adhesion. The welded W portion may be formed in a line or spot shape, and may have the same material as that of the mask cell sheet portion 220 ′ and have an edge frame portion 210 and a mask cell sheet portion 220 ′. It can be a medium to connect the integrally.

Next, referring to FIG. 7B, a mask cell region CR is formed in a planar sheet (planar mask cell sheet portion 220 ′). The mask cell region CR may be formed by removing the sheet of the mask cell region CR through laser scribing or etching. In the present specification, a description is given taking an example of forming a 6 × 5 mask cell region (CR: CR11 to CR56). When the mask cell region CR is formed, a portion welded to the edge frame portion 210 becomes the edge sheet portion 221, and five first grid sheet portions 223 and four second grids are formed. The mask cell sheet part 220 having the sheet part 225 may be configured.

8 is a schematic view showing the shape of the mask 100 and the state in which the mask 100 is attached on the tray 50 according to an embodiment of the present invention.

Referring to FIG. 8A, a mask 100 having a plurality of mask patterns P may be provided. The mask 100 may include a mask cell C on which a plurality of mask patterns P are formed and a dummy DM around the mask cell C. FIG. The dummy DM corresponds to a portion of the mask layer 110 except for the cell C, includes only the mask layer 110, or the mask layer 110 in which a predetermined dummy pattern having a shape similar to the mask pattern P is formed. It may include. In the dummy DM, a part or all of the dummy DM may be attached to the frame 200 (the mask cell sheet 220) in correspondence with the edge of the mask 100. It is possible to manufacture a mask 100 of the Invar, super Invar material by electroplating method.

The mother plate used as a cathode in electroplating is made of a conductive material. As the conductive material, in the case of metal, metal oxides may be generated on the surface, impurities may be introduced during the metal manufacturing process, and in the case of the polycrystalline silicon substrate, inclusions or grain boundaries may exist, and the conductive polymer may be present. In the case of a base material, it is highly likely to contain an impurity, and strength. Acid resistance may be weak. Elements that interfere with the uniform formation of an electric field on the surface of the substrate (or negative electrode body), such as metal oxides, impurities, inclusions, grain boundaries, etc., are referred to as "defects." Due to the defect, a uniform electric field may not be applied to the negative electrode body of the above-described material, so that a part of the plating film (mask 100) may be unevenly formed.

Non-uniformity of the plating film and the plating film pattern (mask pattern P) may adversely affect the formation of the pixel in implementing a UHD-class or higher definition pixel. For example, QHD image quality is 500 ~ 600 pixel per inch (PPI), and the size of pixel is about 30 ~ 50㎛. For 4K UHD and 8K UHD high definition, it is higher than 860 PPI and ~ 1600 PPI. Have the same resolution. The micro display applied directly to the VR device, or the micro display used in the VR device, aims at an ultra high resolution of about 2,000 PPI or more, and the size of the pixel reaches about 5 to 10 μm. The pattern width of the FMM and shadow mask applied to this may be formed in a size of several to several tens of micrometers, preferably smaller than 30 micrometers, so that even a defect having a size of several micrometers occupies a large proportion in the pattern size of the mask. to be. In addition, an additional process for removing metal oxides, impurities, and the like may be performed to remove the defects in the cathode material of the material described above, and another defect such as etching of the anode material may be caused in this process. have.

Therefore, in the present invention, a mother plate (or a negative electrode body) of a single crystal material can be used. In particular, it is preferable that it is a single crystal silicon material. In order to have conductivity, a high concentration doping of 10 ¹⁹ / cm ³ or more may be performed on the single crystal silicon base plate. Doping may be performed on the entirety of the mother plate or only on the surface portion of the mother plate.

On the other hand, the single crystal material is a metal such as Ti, Cu, Ag, carbon-based materials such as semiconductors such as GaN, SiC, GaAs, GaP, AlN, InN, InP, Ge, graphite, graphene , such as _{CH 3 NH 3 PbCl 3, CH} 3 NH 3 PbBr 3, CH3NH 3 PbI 3, SrTiO 3 , etc. page containing the perovskite single crystal ceramic, aircraft single crystal second heat-resistant alloy for components for a superconductor, such as (perovskite) structure Can be used. Metal and carbon-based materials are basically conductive materials. In the case of a semiconductor material, high concentration doping of 1019 or more may be performed to have conductivity. In the case of other materials, conductivity may be formed by performing doping or forming oxygen vacancies. Doping may be performed on the entirety of the mother plate or only on the surface portion of the mother plate.

Since there is no defect in the case of a single crystal material, there is an advantage that a uniform plating film (mask 100) can be generated due to the formation of a uniform electric field on the entire surface during electroplating. The frame integrated masks 100 and 200 manufactured through the uniform plating layer may further improve the image quality level of the OLED pixel. In addition, since an additional process of removing and eliminating defects does not have to be performed, there is an advantage in that process costs are reduced and productivity is improved.

In addition, if the silicon material or a single crystal material capable of forming an insulating film on the surface by oxidation and nitridation, there is an advantage that the insulating portion can be formed only by oxidizing and nitriding the surface of the mother plate as needed. have. The insulating portion may be formed using a photoresist. Electrodeposition of the plating film (mask 100) is prevented in the part in which the insulation part was formed, and a pattern (mask pattern P) is formed in a plating film.

On the other hand, the material of the mother plate of the present invention is not limited to the above-described single crystal material as long as it is within the range for reducing the defect of the negative electrode body.

The width of the mask pattern P may be smaller than 40 μm, and the thickness of the mask 100 may be about 2 to 50 μm. Since the frame 200 includes a plurality of mask cell regions CR11 to CR56, the mask 100 having mask cells C11 to C56 corresponding to the respective mask cell regions CR11 to CR56. ) Can also be provided in plurality.

The mask 100 may be attached to the frame 200 by laser welding. The laser L may be irradiated to the welding portion WP of the mask 100. The welding part WP may mean a target area in which the welding bead WB is formed by irradiation of the laser L0. The welding part WP is at least part of the edge or dummy DM of the mask 100. In the following description, it is assumed that a plurality of welds WP are disposed at regular intervals in the dummy DM region of the mask 100, and the shape of the welds WP is approximately circular. However, it is not necessarily limited thereto.

On the other hand, the mask 100 of the present invention is characterized in that the anti-wrinkle pattern (150 ~ 170) is formed around the weld (WP). The anti-wrinkle patterns 150 to 170 prevent the deformation of the periphery of the welded portion WP from being warped or shrunk during the process in which the laser L is irradiated onto the welded portion WP to form the weld bead WB. It is characterized in that (see Fig. 14 and 15).

The anti-wrinkle patterns 150 to 170 are similar to the holes formed in the dummy DM (or the edge portion) of the mask 100 similarly to the mask pattern P, and are formed in the process of forming the mask pattern P. The same can be formed. For example, the plating layer 110 may not be formed in the pre-plating process of the mask 100, such as the mask pattern P, or may be a portion formed through the pattern forming process after the pre-plating of the mask 100.

The anti-wrinkle patterns 150 to 170 may be formed around the weld WP at predetermined intervals, and may be disposed to surround the weld WP as a whole, or may be disposed at both sides of the weld WP. For convenience of description, the anti-wrinkle patterns 150 to 170 are illustrated in a simple figure in FIG. 8A, but specific shapes according to various embodiments will be described later with reference to FIGS. 9 through 12.

Next, referring to FIGS. 8B and 8C, the prepared mask 100 may be attached onto a tray 50 ′. The electrodeposited mask 100 on the mother plate may be removed and attached on the tray 50 '. On one surface of the tray 50 ′, an electrostatic force, a magnetic force, a vacuum, or the like may be used so that the mask 100 is unfolded and attached flat without wrinkles or wrinkles. The tray 50 ′ may be a glass material through which the laser light L may pass.

9 to 12 are schematic views illustrating anti-wrinkle patterns 150 to 170 of masks according to various embodiments of the present disclosure. 9 to 12 are enlarged portions of part D of FIG. 8. Although the mask cell C including the mask pattern P is illustrated on the right side for convenience of understanding, the pattern size and pattern of the anti-wrinkle patterns 150 to 170 and the buffer pattern 190 in contrast to the mask pattern P are shown. Note that the arrangement position and the like are not limited to the illustration of FIGS. 9 to 12.

9 to 12, the anti-wrinkle patterns 150 to 170 may be formed around the weld WP at predetermined intervals. According to an embodiment, the anti-wrinkle patterns 150 to 170 are concentric with the weld WP and have a virtual circle having diameters R2 and R3 larger than the diameter R1 of the weld WP. It may occupy an area on the circumference of (AC). The form occupying the area on the circumferences R2 and R3 having a diameter larger than the diameter R1 of the weld portion WP is, when the unit wrinkle prevention pattern is disposed on the circumference, the unit wrinkle prevention pattern is It may be implemented by including the case itself.

9, the anti-wrinkle pattern 150 according to the first embodiment may include a plurality of unit anti-wrinkle patterns 151. In order to easily disperse stress, tension, and the like applied to the mask 100, the plurality of unit anti-wrinkle patterns 151 may have a curvature such as a circle or an ellipse rather than a shape including angled edges.

The plurality of unit anti-wrinkle patterns 151 are disposed to be spaced apart from each other, and a virtual circle AC having a diameter R2 larger than the diameter R1 of the weld portion WP and the concentric portion WPC and the weld portion WP. It can be arranged on the circumference of the. The unit anti-wrinkle pattern 151 may be disposed in a single area around the weld portion WP, but may be disposed in a double or triple manner.

In addition to the anti-wrinkle pattern 150, a plurality of buffer patterns 190 may be further formed. The buffer pattern 190 may be formed with a mutual gap between the anti-wrinkle pattern 150 and the mask pattern P. FIG. The buffer pattern 190 may be disposed along an inner edge of the dummy DM area.

Since the buffer pattern 190 does not surround the weld WP, the buffer pattern 190 distributes stress, tension, and the like applied to the mask 100 in a larger range. Accordingly, the width of the mask pattern P may be larger than that of the mask pattern P, and the width of the mask pattern P may be larger than that of the anti-wrinkle patterns 150 to 170. The buffer pattern 190 includes a plurality of unit buffer patterns 191 and 192, and the unit buffer patterns 191 and 192 may also have a curvature such as a circle or an ellipse rather than a shape including an angled corner. Do.

According to an embodiment, the first unit buffer patterns 191 may be disposed on a horizontal axis passing through the middle of the pair of anti-wrinkle patterns 150. The second unit buffer patterns 192 may be disposed on the same horizontal axis as the first unit buffer pattern 191, and may be further disposed on the horizontal axis passing through the middle of the pair of first unit buffer patterns 191. have. However, the arrangement form is not necessarily limited thereto.

Referring to FIG. 10, the anti-wrinkle pattern 160 according to the second embodiment may include a plurality of unit anti-wrinkle patterns 161.

The plurality of unit anti-wrinkle patterns 161 are spaced apart from each other, and a virtual circle AC having a diameter R2 larger than the diameter R1 of the weld portion WP and the concentric portion WPC and the weld portion WP. It may be a shape including at least a portion (162, 163) of the circumference of the. In other words, one unit anti-wrinkle pattern 161 includes at least a portion 162 of the circumference having a diameter R2 concentric with the specific weld WP1 and larger than the specific weld WP1, and the specific weld WP1. It may have a shape including at least a portion 163 of the circumference of the weld portion (WP2) and concentric (WPC) adjacent to the () and having a diameter (R2) larger than the neighboring weld (WP2). The unit anti-wrinkle pattern 161 may have a closed figure shape in addition to at least a portion 162 and 163 of the circumference, and further include edges 164 and 165 connecting them. Since the unit anti-wrinkle pattern 161 includes portions of the curvature 162 and 163 having a predetermined distance from the weld WP, the unit wrinkle prevention pattern 161 may easily disperse the stress, tension, and the like applied to the weld WP.

Referring to FIG. 11, the anti-wrinkle pattern 160 ′ according to the third embodiment may include a plurality of unit anti-wrinkle patterns 161 ′.

 The anti-wrinkle pattern 160 ′ according to the third embodiment may include portions of curvature 162 and 163 similar to the anti-wrinkle pattern 160 according to the second embodiment. However, in addition to the curvature portions 162 and 163 and the corners 164 and 165 connecting the curvatures 162 and 163, the closed figure may further include mutually opposite and parallel sides 166. Since the unit anti-wrinkle pattern 161 includes portions of the curvature 162 and 163 having a predetermined distance from the weld WP, the unit wrinkle prevention pattern 161 may easily disperse the stress, tension, and the like applied to the weld WP.

12, the anti-wrinkle pattern 170 according to the fourth embodiment may include a plurality of unit anti-wrinkle patterns 171.

The unit anti-wrinkle pattern 171 is at least a portion 172 of a virtual circumference having a first diameter R2 that is concentric with the weld portion WP and is larger than the diameter R1 of the weld portion WP, and the first portion; It may have a shape including at least a portion 173 of an imaginary circumference having a second diameter R3 larger than the diameter R1. The unit anti-wrinkle pattern 171 may have a closed figure shape by further including edges 174 and 175 connecting them in addition to at least portions 172 and 173 of the circumference.

The plurality of unit anti-wrinkle patterns 171 may be spaced apart from each other and may be disposed to surround one weld part WP. The unit anti-wrinkle pattern 171 may be disposed in a single area around the weld portion WP, but may be disposed in a double or triple manner. The unit anti-wrinkle pattern 171 includes portions of curvature 172 and 173 having a predetermined distance from the weld WP, and is disposed to surround the weld WP, thereby distributing stress, tension, and the like applied to the weld WP. There is an advantage that is easy to make.

FIG. 13 is a plan view (FIG. 13A) of the mask 100 'according to the comparative example and a state in which the mask 100' according to the comparative example is attached on the tray 50 '(FIG. b)] and a side cross-sectional view (FIG. 13C). 14 is a side sectional view showing the state in which the mask 100 according to the comparative example is adhered to the cell region CR of the frame 200 (FIG. 14A) and an enlarged plan view of E (FIG. 14B). ]to be.

Referring to FIG. 13A, the mask 100 ′ according to the comparative example, which is contrasted with the mask 100 of the embodiment of the present invention described above with reference to FIG. 8, has a plurality of mask patterns (or masks) formed in the mask cell (C). It includes P) and the dummy DM has no shape. Subsequently, referring to FIGS. 13B and 13C, the mask 100 ′ may be attached onto a tray 50 ′. The electrodeposited mask 100 on the mother plate may be removed and attached on the tray 50 '.

Referring to FIG. 14A, some or all of the edges of the mask 100 may be adhered to the frame 200 (the first grid sheet portion 223 or the second grid sheet portion 225). The adhesion can be carried out by welding, preferably by laser welding. Laser welding should be performed as close to the edge of the frame 200 as possible to reduce the excitement space between the mask 100 and the frame 200 as much as possible to increase the adhesion.

When the laser L is irradiated to the weld WP from the upper portion of the mask 100 ′, the laser L may melt a portion of the mask 100 ′ in the weld WP region. A portion of the mask 100 ′ may be melted to form a weld bead WB. The welding bead WB may be a medium for integrally connecting the mask 100 ′ and the frame 200.

In this case, a tension T may be applied in which the periphery of the weld bead WB is contracted while the mask 100 ′ of the portion where the weld bead WB is formed is melted and solidified. Due to the contracted tension T, deformation 105 ′ such as wrinkles, distortions, and bleeds may occur around the weld bead WB. In addition, deformation 106 'such as wrinkles, warpage, etc. in the space between the weld bead WB and the mask cell C may occur. As a result, the deformations 105 'and 106' are generated by the tension T, and the deformations 105 'and 106' cause the alignment between the mask pattern P and the cells C to be distorted. Can cause problems.

The mask 100 of the present invention may prevent the above problem as the anti-wrinkle patterns 150 to 170 and the buffer pattern 190 are formed.

15 is a schematic diagram illustrating a state in which the mask 100 is adhered to the cell region CR of the frame 200 according to an embodiment of the present invention.

Referring to FIG. 15A, the laser L may be irradiated onto the weld WP of the dummy DM (or the edge region) of the mask 100 from the upper portion of the mask 100. A portion of the mask 100 may be melted to form a weld bead WB. The welding bead WB may be a medium for integrally connecting the mask 100 and the frame 200 (or the edge sheet portion 221 and the first and second grid sheet portions 223 and 225). have.

In this case, a tension T may be applied in which the periphery of the weld bead WB is contracted while the mask 100 of the portion where the weld bead WB is formed is melted and solidified. The contracted tension T applied around the welding bead WB may be dispersed in the anti-wrinkle patterns 150 to 170, respectively. Since the tension T is distributed in the plurality of anti-wrinkle patterns 150 to 170, deformations 105 ′ such as wrinkles, distortions, and bleeds around the weld bead WB may be eliminated.

In addition, the contracted tension T applied in the space between the welding bead WB and the mask cell C may be distributed in the buffer patterns 190, respectively. Since the tension T is distributed in the plurality of buffer patterns 190, the deformation 106 ′ such as wrinkles, warpage, etc. of the space between the welding bead WB and the mask cell C may be eliminated.

As described above, since the deformations 105 'and 106' are eliminated by the plurality of anti-wrinkle patterns 150 to 170 and the buffer pattern 190, or are deformed only at a level at which the alignment of the mask pattern P is hardly affected. In the process of adhering the mask 100 to the frame 200, the alignment state between the mask pattern P and the cells C may be maintained.

16 is a plan view of a state in which the tray 50 'according to the comparative example is loaded on the frame 200 so that the mask 100' corresponds to the cell region CR of the frame 200 (FIG. 16A). ] And a side cross-sectional view (FIG. 16B). 17 shows a process of bonding the mask 100 'to the cell region CR of the frame 200 by loading the tray 50' on the frame 200 according to the comparative example, and the mask 100 and the tray 50. A side cross-sectional view and a partially enlarged side cross-sectional view showing an interface state of ') are shown.

Referring to FIGS. 16A and 16B, the mask 100 ′ may correspond to one mask cell region CR of the frame 200. Reversing the tray 50 'with the mask 100' attached thereon and loading the tray 50 'onto the frame 200 (or the mask cell sheet portion 220) is performed. It may correspond to the mask cell region CR. When the tray 50 'is loaded on the frame 200 (or the mask cell sheet portion 220), the mask 100' is formed by the tray 50 'and the frame 200 (or the mask cell sheet portion ( 220), which may be compressed by the tray 50 '.

Referring to FIG. 17, the mask 100 ′ may be irradiated with the laser L to bond the mask 100 ′ to the frame 200 by laser welding. The welding bead WB is generated in the welding portion WP of the laser welded mask, and the welding bead WB may be integrally connected with the same material as that of the mask 100 / frame 200.

On the other hand, in addition to pressing the mask 100 'by the tray 50', the mask 100 and the frame 200 (or the edge sheet portion 221, the first and second grid sheet portions 223 and 225). ) Can be pressed against the pressing body M at the upper part of the tray 50 'so as to be in close contact with each other. In addition to the load by the weight of the press body (M) may further comprise a means for pressing the press body (M). A through hole (MH) through which the laser (L) passes may be formed in the compressed body (M), and the laser (L) passes through the transparent tray (50 ') after passing through the through hole (MH) and the mask (100). Can be irradiated to the weld portion (area to be welded).

However, in spite of the load of the tray 50 'and the pressing body M as described above, a fine air gap AG may exist on the interface between the tray 50' and the mask 100. Since the glass 50 'of the glass tray 50 has a surface roughness Ra of about 20 to 30 μm, when the surface of the tray 50' is examined at a micrometer scale, there is a slight curvature. Accordingly, even when the mask 100 'is pressed, there may be a portion where the tray 50' and the mask 100 'are not in close contact with each other, and the compressive load is not transmitted well at this portion, so that the mask 100' and the frame are not. The 200 (or the edge sheet portion 221, the first and second grid sheet portions 223 and 225) may also be in intimate contact.

In the part where the tray 50 'and the mask 100' are in close contact with each other without the air gap AG, the weld bead WB is well formed between the mask 100 'and the frame 200 by the laser L1 irradiation. Generated, the mask 100 'and the frame 200 are integrally connected, so that welding can be performed well. However, in the part where the air gap AG exists between the tray 50 'and the mask 100 and does not come in close contact with each other, the welding bead between the mask 100 and the frame 200 is irradiated by the laser L2. WB) is not generated well, and as a result, welding is not performed well.

Accordingly, the present invention is characterized by providing a tray 50 that can be in close contact with the mask 100 without an air gap AG.

18 shows a process of bonding the mask 100 to the cell region CR of the frame 200 by loading the tray 50 on the frame 200 according to an embodiment of the present invention, and the mask 100 and the tray. A side cross-sectional view and a partially enlarged side cross-sectional view of the interface state of (50) are shown. FIG. 19 is a plan view (FIG. 19A) and a rear view (FIG. 19B) showing a tray 50 according to an embodiment of the present invention. 20 is a schematic diagram illustrating a state in which the tray 100 is loaded on the frame 200 and the mask 100 corresponds to the cell region CR of the frame 200 according to an embodiment of the present invention.

18 and 19, a mask 100 may be attached to a tray 50. The electrodeposited mask 100 may be detached from the mother plate and attached to the tray 50. The tray 50 is preferably flat in shape so that the mask 100 can be attached flat. The tray 50 may have a flat plate shape larger than that of the mask 100 so that the mask 100 may be flatly attached to the entire surface.

An electrostatic force, magnetic force, vacuum, or the like may be used so that the mask 100 may be unfolded and attached flat without wrinkles or wrinkles on one surface of the tray 50. The method of using the electrostatic force is a method of inducing static electricity by rubbing the whole surface of the tray 50. In addition, in the method using the electrostatic force, a voltage is applied to the transparent electrode disposed on the upper or lower surface of the tray 50, and when a voltage is applied to the mask 100, the static electricity is induced to spread the mask 100 flat. It is a method of attaching to one surface of the tray 50 while having a predetermined adhesive force. The magnetic force is a method of unfolding while grasping and moving the mask 100 by magnetic force using a plurality of magnets on the opposite side of the tray 50 on which the mask 100 is disposed. The method of using the vacuum is a method of unfolding while grasping and moving the mask 100 using a vacuum device from one end to the other end of the mask 100 disposed on the tray 50.

In particular, the tray 50 of the present invention is characterized in that one surface in contact with the mask 100 is specular so that no air gap AG is generated between the interface with the mask 100. Specifically, the surface roughness Ra of one surface of the tray 50 may be 100 nm or less. Since the surface roughness Ra of the general glass tray 50 ′ described above with reference to FIG. 17 is about 20 to 30 μm, the presence of the air gap AG affects the alignment error of the mask pattern P having a μm scale. It is enough to give. However, the tray 50 of the present invention does not affect the alignment error of the mask pattern P to a level where the surface roughness Ra is nm scale and there is no or little air gap AG.

In order to implement the tray 50 having the surface roughness Ra of 100 nm or less, the tray 50 may use a wafer. Since the wafer has a surface roughness Ra of about 10 nm, many products on the market, and many surface treatment processes are known, the wafer is suitable for use as the tray 50. In addition, if the surface roughness (Ra) can satisfy the surface roughness (Ra) of 100nm or less, the tray 50 is made of glass, silica, heat-resistant glass, quartz, alumina (Al ₂ O ₃ ) may be used. The following description assumes the use of the wafer as the tray 50.

Referring to the enlarged portion of FIG. 18, it can be seen that the surface roughness Ra is in intimate contact between the tray 50 having the 50 nm or less and the interface of the mask 100 without the air gap AG. Laser welding may be performed by irradiating the laser L on the welding portion WP of the mask 100.

On the other hand, the tray 50 of the wafer material may be opaque to the laser (L) light. As a result, the tray 50 of the present invention has a laser passing hole in the tray 50 so that the laser L irradiated from the upper portion of the tray 50 can reach the welded portion WP of the mask 100. 51) is formed.

  Referring to (a) and (b) of FIG. 19, the laser through hole 51 may be formed in the tray 50 to correspond to the position and the number of welds WP. Since a plurality of welding portions WP are disposed along a predetermined interval at edges or dummy DM portions of the mask 100, a plurality of laser passing holes 51 may also be formed along the predetermined interval to correspond thereto. For example, since a plurality of welding portions WP are disposed at both sides (left / right) dummy DM portions of the mask 100 at predetermined intervals, the laser passing holes 51 also have trays 50 on both sides (left / left). The right side may be formed in plural along a predetermined interval.

The laser through hole 51 does not necessarily correspond to the position and the number of welds. For example, welding may be performed by irradiating the laser L only to a part of the laser passing holes 51. In addition, some of the laser through holes 51 which do not correspond to the welding part may be used in place of the alignment mark when the mask 100 and the tray 50 are aligned. If the material of the tray 50 is transparent to the laser light, the laser through hole 51 may not be formed.

The pressing body M is placed on the tray 50 so that the mask 100 and the frame 200 (or the edge sheet portion 221, the first and second grid sheet portions 223 and 225) come into close contact with each other. You can add more compression. In addition to the load by the weight of the press body (M) may further comprise a means for pressing the press body (M). A through hole MH through which the laser L passes may be formed in the compressed body M, and a region where the through hole MH is formed may overlap with a region where the laser through hole 51 of the tray 50 is formed. Can be. The laser L may pass through the laser through hole 51 of the tray 50 after passing through the through hole MH, and may be irradiated to the weld WP of the mask 100. Laser welding should be performed as close to the edge of the frame 200 as possible to reduce the excitement space between the mask 100 and the frame 200 as much as possible to increase the adhesion.

The tray 50 and the mask 100 can be brought into close contact with each other without the air gap AG, and the pressing process by the load of the upper pressing body M and the tray 50 itself is added to the tray 50 and the mask ( 100, the mask 100 and the frame 200 (or the edge sheet portion 221, the first and second grid sheet portions 223 and 225) may be in close contact with each other. Accordingly, the welding bead WB may be well generated between the mask 100 and the frame 200 by the laser L irradiation. The welding bead WB may be viewed as a part in which a part of the mask 100 is molten, has a spot or line shape, and is used to integrally connect the mask 100 and the frame 200. As a result, welding can be performed well.

Next, referring to FIGS. 20A and 20B, the mask 100 may correspond to one mask cell region CR of the frame 200. The mask 100 is turned over by turning the tray 50 with the mask 100 attached thereon and loading the tray 50 onto the frame 200 (or the mask cell sheet part 220). CR). While controlling the position of the tray 50, the microscope 100 may check whether the mask 100 corresponds to the mask cell region CR. When the tray 50 is loaded on the frame 200 (or the mask cell sheet part 220), the mask 100 is the tray 50 and the frame 200 (or the mask cell sheet part 220). While being disposed therebetween, it may be compressed by the tray 50.

Meanwhile, the lower supporter 70 may be further disposed below the frame 200. The lower supporter 70 may have a size enough to fit into the hollow region R of the frame rim 210 and may have a flat plate shape. In addition, a predetermined support groove (not shown) corresponding to the shape of the mask cell sheet part 220 may be formed on the upper surface of the lower supporter 70. In this case, the edge sheet part 221 and the first and second grid sheet parts 223 and 225 are fitted into the support groove, so that the mask cell sheet part 220 may be more securely fixed.

The lower supporter 70 may compress the opposite surface of the mask cell region CR that the mask 100 contacts. That is, the lower supporter 70 may support the mask cell sheet part 220 in the upper direction to prevent the mask cell sheet part 220 from sagging in the lower direction during the bonding process of the mask 100. At the same time, the edge of the mask 100 and the frame 200 (or the mask cell sheet part 220) are pressed in a direction in which the lower support 70 and the tray 50 are opposite to each other, so that the mask 100 is pressed. The alignment state of the can be maintained without being disturbed.

According to the present invention, the mask 100 is attached to the mask cell region CR of the frame 200 by simply attaching the mask 100 to the tray 50 and loading the tray 50 onto the frame 200. Since the process is completed, no tensile force is applied to the mask 100 in this process.

Since the mask cell sheet portion 220 of the frame 200 has a thin thickness, when the mask cell sheet portion 220 is bonded to the mask cell sheet portion 220 while the tensile force is applied to the mask 100, the tensile force remaining in the mask 100 is masked. The cell sheet 220 and the mask cell region CR may act on the cell sheet 220 and may be modified. Therefore, the mask 100 should be adhered to the mask cell sheet part 220 without applying a tensile force to the mask 100. Thus, it is possible to prevent the tensile force applied to the mask 100 from acting as a tension on the frame 200 to deform the frame 200 (or the mask cell sheet part 220).

However, there is one problem when the frame integrated mask is manufactured by adhering to the frame 200 (or the mask cell sheet part 220) without applying a tensile force to the mask 100, and using the frame integrated mask in a pixel deposition process. May occur. In the pixel deposition process performed at about 25-45 ° C., the mask 100 thermally expands by a predetermined length. Even in the mask 100 made of Invar, a length of about 1 to 3 ppm may be changed according to a temperature rise of about 10 ° C. for forming a pixel deposition process atmosphere. For example, when the total length of the mask 100 is 500 mm, a length of about 5 to 15 μm may be increased. Then, a problem arises in that the alignment error of the patterns P becomes large while causing deformation such as the mask 100 is struck by its own weight or stretched and twisted while being fixed in the frame 200.

Accordingly, the present invention may correspond to and adhere to the mask cell region CR of the frame 200 without applying a tensile force to the mask 100 at a temperature higher than the normal temperature. In the present specification, after the temperature of the process region is raised to the first temperature (ET), the mask 100 is expressed to correspond to and adhere to the frame 200.

The “process area” may refer to a space in which components such as the mask 100 and the frame 200 are located and an adhesion process of the mask 100 is performed. The process region may be a space in a closed chamber or may be an open space. In addition, “first temperature” may mean a temperature that is higher than or equal to the pixel deposition process temperature when the frame integrated mask is used in the OLED pixel deposition process. Considering that the pixel deposition process temperature is about 25 ° C to 45 ° C, the first temperature may be about 25 ° C to 60 ° C. The temperature rise in the process region may be performed by providing a heating means in the chamber, or installing a heating means around the process region.

Referring back to FIG. 13, after the mask 100 corresponds to the mask cell region CR, the temperature of the process region including the frame 200 may be raised to the first temperature (ET). Alternatively, after the temperature ET of the process region including the frame 200 is raised to the first temperature, the mask 100 may correspond to the mask cell region CR. Although only one mask 100 corresponds to one mask cell region CR in the drawing, the temperature of the process region is increased to the first temperature after the masks 100 correspond to each mask cell region CR. (ET).

Since the mask 10 of FIG. 1 includes six cells C1 to C6, the mask 10 has a long length, whereas the mask 100 of the present invention has a short length including one cell C. The degree of distortion of the pixel position accuracy (PPA) can be reduced. For example, assuming that the length of the mask 10 including the plurality of cells C1 to C6, ... is 1 m, and a PPA error of 10 µm occurs in the entire 1 m, the mask 100 of the present invention May reduce the above error range by 1 / n according to the reduction of the relative length (corresponding to the reduction of the number of cells C). For example, if the length of the mask 100 of the present invention is 100mm, it has a length reduced to 1/10 at 1m of the conventional mask 10, the PPA error of 1㎛ occurs in the entire 100mm length As a result, the alignment error is significantly reduced.

On the other hand, if the mask 100 is provided with a plurality of cells (C), each cell (C) corresponding to each cell region (CR) of the frame 200 within the range that the alignment error is minimized, The mask 100 may correspond to the plurality of mask cell regions CR of the frame 200. Alternatively, the mask 100 having the plurality of cells C may correspond to one mask cell region CR. Also in this case, in consideration of the process time and productivity according to the alignment, the mask 100 preferably has as few cells C as possible.

In the case of the present invention, since only one cell C of the mask 100 needs to be corresponded and the alignment state is confirmed, the plurality of cells C: C1 to C6 must be simultaneously associated and the alignment state must be confirmed. In comparison with the conventional method (see Fig. 2), the production time can be significantly reduced.

That is, according to the method of manufacturing a frame-integrated mask of the present invention, each cell C11 to C16 included in the six masks 100 corresponds to one cell region CR11 to CR16 and checks the alignment state. Through the process, the time can be much shorter than the conventional method of simultaneously matching six cells C1 to C6 and confirming the alignment of all six cells C1 to C6 at the same time.

In addition, in the method of manufacturing a frame-integrated mask of the present invention, the product yield in 30 processes of matching and aligning 30 masks 100 with 30 cell areas CR: CR11 to CR56 respectively is 6 cells (C1). 5 masks 10 (see FIG. 2A), each comprising ˜C6), may appear much higher than the conventional product yield in 5 steps of matching and aligning the frame 20. Since the conventional method of aligning six cells C1 to C6 in a region corresponding to six cells C at a time is a much more cumbersome and difficult task, product yield is low.

Meanwhile, after the mask 100 corresponds to the frame 200, the mask 100 may be temporarily fixed to the frame 200 through a predetermined adhesive. Thereafter, the bonding step of the mask 100 may be performed.

FIG. 21 is a plan view (FIG. 21A) and a side cross-sectional view (FIG. 21 (A)] illustrating a process of bonding the mask 100 according to an embodiment of the present invention to the cell regions CR11 to CR56 sequentially. b)].

Referring to FIG. 21, the mask 100 may be adhered to the mask cell region CR11 correspondingly, and then the mask 100 may be adhered to the mask cell region CR12 adjacent thereto. Although only two masks 100 are bonded to each other in FIG. 21, the masks 100 may be correspondingly attached to all mask cell regions CR.

On the upper surface of the first grid sheet portion 223 (or the second grid sheet portion 225), one edge of two neighboring masks 100 is adhered to each other (forming a welding bead WB). The width and thickness of the first grid sheet portion 223 (or the second grid sheet portion 225) may be formed to about 1 to 5 mm, and to improve product productivity, the first grid sheet portion 223 [ Alternatively, it is necessary to reduce the width where the edges of the second grid sheet portion 225 and the mask 100 overlap with each other by about 0.1 to 2.5 mm.

Since welding LW is performed on the mask cell sheet portion 220 without applying a tensile force to the mask 100, the mask cell sheet portion 220 (or the edge sheet portion 221, the first and second grid sheets) is applied. (223, 225) is not applied to the tension.

After the one mask 100 is adhered to the frame 200, the remaining masks 100 may be sequentially corresponded to the remaining mask cells C, and the process of adhering to the frame 200 may be repeated. Since the mask 100 already bonded to the frame 200 may present a reference position, the time required to sequentially match the remaining masks 100 to the cell region CR and to confirm the alignment state is significantly reduced. There is an advantage that can be. In addition, the pixel position accuracy (PPA) between the mask 100 adhered to one mask cell region and the mask 100 adhered to the mask cell region adjacent thereto does not exceed 3 μm, and the alignment is very high. There is an advantage that a mask for forming an OLED pixel can be provided.

22 is a schematic diagram illustrating a process of lowering the temperature (LT) of the process region after adhering the mask 100 according to an embodiment of the present invention to the cell region CR of the frame 200.

Next, referring to FIG. 22, the temperature of the process region may be lowered to the second temperature LT. The “second temperature” may mean a temperature lower than the first temperature. Considering that the first temperature is about 25 ° C. to 60 ° C., the second temperature may be about 20 ° C. to 30 ° C. provided that it is lower than the first temperature, and preferably, the second temperature may be room temperature. The temperature drop in the process region can be performed by providing a cooling means in the chamber, installing a cooling means around the process region, naturally cooling to room temperature, or the like.

When the temperature of the process region is lowered to the second temperature LT, the mask 100 may heat shrink by a predetermined length. The mask 100 may be thermally contracted isotropically along all lateral directions. However, since the mask 100 is fixedly connected to the frame 200 (or the mask cell sheet part 220) by welding, the thermal contraction of the mask 100 is itself tensioned with the surrounding mask cell sheet part 220. (TS) is applied. By applying a tension (TS) of the mask 100, the mask 100 may be more tightly adhered to the frame 200.

In addition, since each of the masks 100 is bonded onto the corresponding mask cell region CR, the temperature of the process region is lowered to the second temperature (LT), so that all the masks 100 simultaneously cause thermal contraction. The problem that the 200 is deformed or the patterns P are misaligned can be prevented. In more detail, even when the tension TS is applied to the mask cell sheet part 220, since the plurality of masks 100 apply the tension TS in opposite directions, the force is canceled to the mask cell sheet part. Deformation does not occur at 220. For example, the first grid sheet portion 223 between the mask 100 attached to the CR11 cell region and the mask 100 attached to the CR12 cell region may move in the right direction of the mask 100 attached to the CR11 cell region. The acting tension TS and the acting tension TS in the left direction of the mask 100 attached to the CR12 cell region may be offset. Therefore, the deformation is minimized in the frame 200 (or the mask cell sheet part 220) due to the tension TS, thereby minimizing the alignment error of the mask 100 (or the mask pattern P). There is this.

FIG. 23 is a schematic diagram illustrating an OLED pixel deposition apparatus 1000 using frame integrated masks 100 and 200 according to an exemplary embodiment of the present disclosure.

Referring to FIG. 23, the OLED pixel deposition apparatus 1000 includes a magnet plate 300 in which a magnet 310 is accommodated and a coolant line 350 is disposed, and an organic material source 600 from a lower portion of the magnet plate 300. And a deposition source supply unit (500) for supplying ().

A target substrate 900, such as glass, on which the organic source 600 is deposited may be interposed between the magnet plate 300 and the source deposition unit 500. The frame integrated masks 100 and 200 (or FMMs) for allowing the organic material source 600 to be deposited pixel by pixel may be disposed on or close to the target substrate 900. The magnet 310 may generate a magnetic field and may be in close contact with the target substrate 900 by the magnetic field.

The deposition source supply unit 500 may supply the organic source 600 while reciprocating the left and right paths, and the organic source 600 supplied from the deposition source supply unit 500 may have patterns P formed in the frame integrated masks 100 and 200. Pass through) may be deposited on one side of the target substrate (900). The deposited organic source 600 passing through the pattern P of the frame-integrated masks 100 and 200 may serve as the pixel 700 of the OLED.

In order to prevent uneven deposition of the pixel 700 by the shadow effect, the pattern of the frame-integrated masks 100 and 200 may be formed to be inclined S (or formed into a tapered shape S). . Since the organic sources 600 passing through the pattern in the diagonal direction along the inclined surface may also contribute to the formation of the pixel 700, the pixel 700 may be uniformly deposited in overall thickness.

Since the mask 100 is adhesively fixed to the frame 200 at a first temperature higher than the pixel deposition process temperature, even if the mask 100 is raised to the process temperature for pixel deposition, the position of the mask pattern P is hardly affected. The PPA between the 100 and the neighboring mask 100 may be maintained not to exceed 3 μm.

24 is a schematic diagram illustrating a process of separating a mask from a frame-integrated mask according to an embodiment of the present invention. 24A is a plan view of two mask cells C11 and C12, and FIGS. 24B to 24D are cross-sectional views of FIG. 24A.

Meanwhile, when a defect such as a foreign material is interposed in the mask 100 adhered to the frame 200 or a damage occurs in the mask pattern P, it is necessary to replace the mask 100. Alternatively, even when the mask 100 is bonded to the frame 200 so that some alignment of the mask pattern P is not clear, it is necessary to replace only the mask 100 to make the alignment clear.

In the related art (see FIG. 2), the stick mask 10 is separated from the frame 20 by applying a physical force to the stick mask 10 welded to the frame 20. For example, the stick mask 10 is removed from the frame 20 through a pliers, nippers, etc. In this process, a force may be applied to the frame 20 to cause fine deformation in the frame 20. Even fine deformation at a μm level may cause a misalignment between mask cells C: C1 to C6 of the stick masks 10.

The present invention prevents the frame 200 from being deformed in the process of separating / replacing the mask 100 from the frame 200, and in the process of re-attaching the mask 100 to the frame 200. The mask set 100-1, 100-2, 100-3 and replacement method of the mask 100 which can prevent a deformation | transformation and improve a position precision are proposed.

Referring to FIGS. 24A and 24B, frame-integrated masks 100 and 200 to which a mask 100a to be replaced due to defects are prepared are prepared. It is assumed that the mask 100a including the mask cell C11 is separated. The mask 100a assumes that the left edge 101a and the right edge 102a are bonded to the frame 200 (mask cell sheet portion 220) as the weld bead WB is formed by welding. Of course, all four edges of the mask 100 may be welded and bonded to the frame 200 (mask cell sheet portion 220). In this case, the remaining edges of the four edges may be removed. The edges need to be squeezed.

After removing one side edge 102a (the right edge) of the mask 100a including the mask cell C11 from the frame 200, the other edge 101a (the left edge) may be removed from the frame 200. In detail, one edge 102a of the mask 100a may be in a state of being bonded to the first grid sheet portion 223a that is the right edge of the mask cell region CR11. Thus, when the external force SP is applied to and removed from one side edge 102a of the mask 100a, the first grid sheet portion is formed by the adhesive force between the mask 100a and the frame 200 (first grid sheet portion 223a). There is a problem that deformation is issued at part of 223a. Therefore, it is necessary to remove the mask 100a after fixing the frame 200 (first grid sheet portion 223a) firmly.

In order to firmly fix the frame 200 with respect to the external force SP, an outer portion of one edge 102a of the mask 100a directly acting on the external force SP may be compressed. That is, the first grid sheet portion 223a to which the mask 100a is attached and / or the left edge portion 101b of the mask 100b adjacent to the right side of the mask 100a may be compressed. As the upper and lower surfaces of the left edge portion 101b of the first grid sheet portion 223a and / or the mask 100b are compressed, they can be firmly fixed to the external force SP.

In the upper portion, the first grid sheet portion 223a and the upper surface of the left edge portion 101b of the mask 100b may be compressed through the pressing bar 260. The lower surface of the left edge portion 101b of the first grid sheet portion 223a and the mask 100b may be pressed through the pressing bar (not shown). In FIG. 24, although there is a step in the end contacting the crimping bar 260, the first grid sheet part 223a, and the mask 100b, the thickness and the width are exaggerated for convenience of description. Since the thickness of the mask 100b is about several micrometers, and the part of the welding bead WB hardly protrudes and is contained in the mask 100, the end of the crimping bar 260 may be understood to be flat.

On the other hand, the supporter 250 for supporting the frame 200 can be used without using a crimping bar (not shown). The support 250 may correspond to the lower support 70 described above with reference to FIG. 20. The supporter 250 may support the lower portion of the frame 200. The support member 250 may have a plate shape to support the frame 200, and may be formed to be substantially the same as or smaller than the area of the frame 200. The support member 250 preferably uses the same material as the frame 200 in consideration of the coefficient of thermal expansion, but may be a material having high rigidity. Frame support grooves 251 and 253 corresponding to the shape of the frame 200 may be formed on the support 250. The frame support grooves 251 and 253 include an edge support groove 251 and a grid support groove 253. The edge support groove 251 may be a groove having a shape corresponding to the edge frame portion 210 and the edge sheet portion 221. The grid support groove 253 may be formed in a first direction (x direction) and a second direction (y direction) corresponding to the first and second grid sheet portions 223 and 225. The grid support groove 253 is formed in a straight shape so that both ends may be connected to the edge support groove 251. Like the first and second grid sheet portions 223 and 225, the grid support grooves 253 may be equally spaced. The shape of the cross section perpendicular to the longitudinal direction of the grip support groove 253 may be a groove having a shape corresponding to the first and second grid sheet portions 223 and 235.

Since the thickness of the edge frame portion 210 and the edge sheet portion 221 may be thicker than the thicknesses of the first and second grid sheet portions 223 and 225, the edge supporting groove 251 is deeper than the grid supporting groove 253. It can be formed in thickness.

The frame 200 may be accommodated in the frame support grooves 251 and 253 of the support 250 to be seated and supported. The top surface of the frame 200, that is, the surface to which the mask 100 is bonded, may be the same or higher than the top surface of the support body 250 while the frame 200 is seated and supported by the support body 250. Thus, the support 250 can support only the frame 200 without affecting the mask 100.

Next, referring to FIG. 24C, an external force SP may be applied to one edge 102a of the mask 100a to be detached from the first grid sheet part 223a. At this time, the pressing bar 260 compresses the upper surface of the first grid sheet portion 223a, which is the outer side of the one corner 102a, and the upper left corner 101b of the mask 100b at the upper portion, and the support 250 at the lower portion thereof. ) Receives the frame 200 (first grid sheet portion 223a) in the supporting grooves 251 and 253 and stably supports the frame 200 (first grid sheet portion) even when the external force SP is applied. 223a)] can be prevented from being deformed.

In addition, since the pressing bar 260 ′ also compresses the other edge 101a and the edge sheet portion 221a of the mask 100a, only the right edge 102b can be peeled off by the external force SP. Of course, the pressing bar (not shown) may be applied to the upper and lower edges in addition to the other edge 101a.

Next, referring to FIG. 24D, an external force SP may be applied to the other edge 101a of the mask 100a to be removed from the edge sheet portion 221a. At this time, the pressing bar 260 "compresses the upper surface of the edge sheet portion 221a, which is the outer side of the other edge 101a, and the support 250 is supported by the support grooves 251 and 253 in the lower portion. ) (Border sheet portion 221a) is accommodated and supported stably, so that the frame 200 (border sheet portion 221a) can be prevented from being deformed even when the external force SP is applied.

After removing the mask 100a from the frame 200, the new mask 100 may correspond to and adhere to the cell region CR11 of the frame 200. The corresponding and bonding process is as described above.

On the other hand, after removing the mask 100a from the frame 200, on the frame 200, a burr, a residue of the welding bead WB, etc., generated during the laser welding process may remain. see d) weld beads (WB)]. When the new mask 100 is corresponded to the bleeding and the residue of the welding bead WB, and the welding bead WB is regenerated by welding, the adhesion between the mask 100 and the frame 200 is lowered and the welding bead WB is May not be created correctly. As described above with reference to FIG. 17, the mask 100 and the frame 200 do not come into close contact with each other by the remaining material, and thus may exist as an air gap. In addition, the mask 100 may be deformed by the remaining material in the process of adhering the mask 100 to the frame 200, or the wrinkles may be more severely generated.

Therefore, the present invention is a mask set (100-1, 100-2, 100) in which the weld (WP-1, WP-2, WP-3, ...) is formed in each different position in the process of replacing the mask 100 -3, ...). Hereinafter, a mask set including three types of masks 100-1, 100-2, and 100-3 will be described as an example, but the number of mask types is not limited. In addition, below, the example which forms the welding part WP in the both sides of the mask 100, and performs laser welding is demonstrated.

25 is a schematic diagram illustrating a mask set 100-1, 100-2, 100-3,... According to an embodiment of the present invention.

Referring to FIG. 25A, weld portions WP-1 may be formed at both sides of the dummy DM at both sides of the first mask 100-1. The first mask 100-1 may be understood as a mask 100 that is first adhered to the cell region CR of the frame 200. The first masks 100-1 may be bonded to the cell regions CR of the frame 200 along the first and second directions.

Next, referring to FIG. 25B, the weld portions WP-2 may be formed at both sides of the dummy DM at both sides of the second mask 100-2. Preferably, the spacing between the weld portions WP-1 and WP-2 of the first mask 100-1 and the second mask 100-2 is the same. However, the position where the welded portion WP-1 of the first mask 100-1 is formed is different from the position where the welded portion WP-2 of the second mask 100-2 is formed. For example, the weld WP-2 may be formed at a position shifted downward from the position of the weld WP-1. In order to arrange the weld WP-2 in the shifted position, the anti-wrinkle patterns 150, 160, and 170 of the second mask 100-2 may also be anti-wrinkle patterns of the first mask 100-1. It may be shifted down compared to the position of 150, 160, 170. Thus, the weld WP-2 positioned at the center of the anti-wrinkle patterns 150, 160, and 170 may be disposed at the shifted position.

Next, referring to FIG. 25C, the weld parts WP-3 may be formed at both sides of the dummy DM at both sides of the third mask 100-3. It is preferable that the spacing between the weld portions WP-1, WP-2, and WP-3 of the first mask 100-1, the second mask 100-2, and the third mask 100-3 be the same. However, the position where the welded portion WP-1 of the first mask 100-1 and the welded portion WP-2 of the second mask 100-2 are formed, and the welded portion WP of the third mask 100-3 is formed. The position at which -3) is formed is different. For example, the weld WP-3 may be formed at a position shifted downward from the position of the weld WP-2. In order to arrange the weld WP-3 in the shifted position, the anti-wrinkle patterns 150, 160, and 170 of the third mask 100-3 may also be anti-wrinkle patterns of the second mask 100-2. It may be shifted down compared to the position of 150, 160, 170. Thus, the weld WP-3 positioned at the center of the anti-wrinkle patterns 150, 160, and 170 may be disposed at the shifted position.

26 is a schematic diagram illustrating a state in which a mask is replaced in a frame-integrated mask according to an embodiment of the present invention. In FIG. 26, the masks 100 adhered to the two cell regions CR will be described as an example.

FIG. 26A illustrates the first frame-integrated mask in which the first mask 100-1 is bonded to the cell regions CR of the frame 200. As the laser is irradiated to the welding portion WP-1 of the first mask 100-1, the welding bead WB-1 is formed between the frames of the first masks 100-1 and the first mask 100. 100-1) and the frame 200 may be integrally connected. In the frame integrated mask, when a defect such as foreign matter is interposed in the mask 100 adhered to the frame 200 or damage occurs in the mask pattern P, the mask 100 should be replaced. Separation process is as described above in FIG.

Referring to FIG. 26B, a state in which the first mask 100-1 is separated from the first cell region CR11 and the second mask 100-2 is adhered to each other is confirmed. As the laser is irradiated to the welding portion WP-2 of the second mask 100-2, a welding bead WB-2 is formed between the second mask 100-2 and the frame 200 to form a second mask ( 100-2) and the frame 200 may be integrally connected. At this time, the position where the weld bead WB-2 of the second mask 100-2 is formed is different from the position where the weld bead WB-1 of the first mask 100-1 before replacement is formed. Therefore, the welding bead WB-2 is not affected by the welding bead WB-1 or the burr of the welding bead WB-1 position remaining on the frame 200, and the second closely contacted. It may be stably formed between the mask 100-2 and the frame 200.

Referring to FIG. 26C, a situation in which the second mask 100-2 needs to be replaced occurs, the second mask 100-2 is separated from the first cell region CR11, and the third mask ( 100-3) can be confirmed. As the laser is irradiated to the welding portion WP-3 of the third mask 100-3, a welding bead WB-3 is formed between the third mask 100-3 and the frame 200 to form a third mask ( 100-3) and the frame 200 may be integrally connected. At this time, the position where the weld bead WB-3 of the third mask 100-3 is formed is the weld bead WB-1 of the first mask 100-1 and the second mask 100-2 before the replacement. It differs from the position where WB-2) was formed. Therefore, the weld bead WB-3 is affected by the spread of the weld bead WB-1 and WB-2 or the weld bead WB-1 and WB-2 remaining on the frame 200. It may be stably formed between the third mask 100-3 and the frame 200 in close contact with each other.

As described above, the present invention provides a mask set 100-1, 100-2, in which welds WP-1, WP-2, WP-3, ... are formed at different positions in the process of replacing the mask 100, respectively. 100-3, ...), there is an advantage that the welding bead (WB) can be stably formed between the mask 100 and the frame 200 before and after replacement.

Although the present invention has been shown and described with reference to preferred embodiments as described above, it is not limited to the above embodiments and various modifications made by those skilled in the art without departing from the spirit of the present invention. Modifications and variations are possible. Such modifications and variations are intended to fall within the scope of the invention and the appended claims.

50: tray
51: laser through hole
70: lower support
100: mask
100-1, 100-2, 100-3, ...: mask set
110: mask film
150, 160, 160 ', 170: anti wrinkle pattern
151, 161, 161 ', 171: unit anti wrinkle pattern
190: buffer pattern
191, 192: unit buffer pattern
200: frame
210: border frame portion
220: mask cell sheet portion
221: border sheet portion
223: first grid sheet portion
225: second grid sheet portion
1000: OLED pixel deposition device
C: cell, mask cell
CR: mask cell area
DM: Dummy, Mask Dummy
ET: raise the temperature of the process region to the first temperature
L: laser
LT: Lower the temperature of the process area to the second temperature
M: upper press
R: Hollow area of the border frame portion
P: mask pattern
TS: tension
W: welding
WB: welding bead
WP: weld
WPC: Weld Center Point

Claims (22)

A mask set used for a frame-integrated mask in which a plurality of masks and a frame for supporting the mask are integrally formed,
The mask set includes a mask cell in which a plurality of mask patterns are formed, and a plurality of masks including a dummy around the mask cell,
Each mask is formed with a plurality of welds spaced apart in at least a portion of the dummy, each mask having a different position where the welds are formed. The method of claim 1,
A mask set, in which a weld is formed at each shifted position for each mask. The method of claim 1,
A mask set, wherein an anti-wrinkle pattern is formed around each weld portion of the mask at predetermined intervals. The method of claim 3,
A mask set, wherein a wrinkle prevention pattern is formed at each shifted position in each mask. The method of claim 3,
The anti-wrinkle pattern is a mask set that occupies at least a circumferential region having a diameter concentric with the weld and having a larger diameter than the weld. The method of claim 3,
And a plurality of buffer patterns formed to form a mutual gap between the anti-wrinkle pattern and the mask pattern, the buffer patterns having a width greater than that of the mask pattern. A method of replacing a mask in a frame-integrated mask in which a plurality of masks and a frame supporting the mask are integrally formed,
(a) providing a frame integrated mask having a plurality of masks bonded to at least a portion of an upper portion of the frame having a plurality of mask cell regions;
(b) detaching from the frame a first mask adhered to a predetermined mask cell area;
(c) attaching the second mask to a predetermined mask cell area and irradiating a weld to the welding portion of the second mask to the frame;
Including,
Each of the first mask and the second mask includes a mask cell in which a plurality of mask patterns are formed, and a dummy around the mask cell, and a plurality of welds are formed on at least a part of the dummy at intervals, and each of the first mask and The mask replacement method of the frame-integrated mask, wherein the second mask is different in the position where the weld is formed. The method of claim 7, wherein
The frame includes a mask cell sheet portion having an edge frame portion and a plurality of mask cell regions and connected to the edge frame portion. The method of claim 8,
The mask cell sheet method according to claim 1, further comprising a plurality of mask cell regions in at least one of a first direction and a second direction perpendicular to the first direction. The method of claim 8,
The mask cell sheet part,
Border sheet portion;
At least one first grid sheet portion extending in a first direction and connected at both ends to the edge sheet portion; And
At least one second grid sheet portion extending in a second direction perpendicular to the first direction and intersecting with the first grid sheet portion and having both ends connected to the edge sheet portion;
Including, the mask replacement method of the frame-integrated mask. The method of claim 7, wherein
And a mask corresponding to each mask cell region. The method of claim 7, wherein
In step (b), the outer part of at least one edge of the first mask is pressed, and an external force is applied to one edge of the mask to separate the first mask from the frame. The method of claim 12,
In step (b), the upper surface and the lower surface of the frame disposed on the outside of the one side edge of the first mask, the mask replacement method of the frame-integrated mask. The method of claim 13,
Method of replacing the mask of the frame-integrated mask by pressing the upper edge of the edge of the frame corresponding to the one side edge of the first mask. The method of claim 14,
A method of replacing a mask of a frame-integrated mask, wherein a support having a frame support groove corresponding to a frame shape is disposed on a lower portion of a frame. The method of claim 7, wherein
In step (b), one edge of the first mask is removed from the frame by applying external force to one edge of the first mask, and then the other edge is removed from the frame by applying external force to the other edge opposite to one side of the first mask. And a method of replacing the first mask from the frame. The method of claim 7, wherein
In step (c), a weld bead is formed in a portion of the welded portion of the second mask to which the laser is irradiated, and the weld bead mediates the second mask and the frame to be integrally connected. . The method of claim 7, wherein
The position of the welded portion of the second mask is formed at a shifted position in the welded portion of the first mask. The method of claim 7, wherein
A method of replacing a mask of a frame-integrated mask, wherein an anti-wrinkle pattern is formed around each weld portion of the mask at a predetermined interval. The method of claim 19,
The position of the anti-wrinkle pattern of the second mask is formed at the position shifted in the anti-wrinkle pattern portion of the first mask, the mask replacement method of the frame-integrated mask. The method of claim 19,
The anti-wrinkle pattern is a mask replacement method for a frame-integrated mask, which occupies at least a circumferential region concentric with the weld and having a diameter larger than the weld. The method of claim 19,
And a plurality of buffer patterns formed to form a mutual gap between the anti-wrinkle pattern and the mask pattern, the buffer patterns having a width greater than the width of the mask pattern.

Images