KR20210120940A - Mask set and method for changing mask of mask integrated frame - Google Patents

Abstract

The present invention relates to a mask set and a method for changing a mask of a frame-integrated mask. In accordance with the present invention, the mask set (100-1, 100-2, 100-3, ...) is used for the frame-integrated mask in which a plurality of masks (100) and a frame (200) supporting the masks (100) are integrated with each other. The mask set (100-1, 100-2, 100-3, ...) includes: a mask cell (C) with a plurality of mask patterns (P); and the plurality of masks (100-1, 100-2, 100-3) including a dummy (DM) around the mask cell (C). Each of the masks (100-1, 100-2, 100-3) includes a plurality of welding units (WP-1, WP-2, WP-3) formed at least a part of the dummy (DM) at intervals, and the masks (100-1, 100-2, 100-3) have the welding units (WP-1, WP-2, WP-3) formed at different positions. The present invention aims to provide a mask set and a method for changing a mask of a frame-integrated mask, which are capable of enhancing position precision.

Description

{MASK SET AND METHOD FOR CHANGING MASK OF MASK INTEGRATED FRAME}

The present invention relates to a mask set and a mask replacement method of a frame-integrated mask. More specifically, a mask set and a mask replacement method of a frame-integrated mask that can make the mask integral with the frame, and can clearly align each mask in the process of removing and replacing the mask from the frame is about

Recently, in the manufacture of thin plates, research on an electroforming method has been conducted. The electroplating method immerses the anode body and the cathode body in an electrolyte, and applies power to electrodeposit a thin metal plate on the surface of the cathode body, so that an ultra-thin plate can be manufactured and mass production can be expected.

On the other hand, as a technology for forming a pixel in the OLED manufacturing process, the FMM (Fine Metal Mask) method is mainly used to deposit an organic material at a desired position by attaching a thin metal mask to the substrate.

In the existing OLED manufacturing process, the mask is manufactured in the form of a stick or plate, and then the mask is welded and fixed to the OLED pixel deposition frame. A plurality of cells corresponding to one display may be provided in one mask. In addition, for large-area OLED manufacturing, multiple masks can be fixed to the OLED pixel deposition frame, and in the process of fixing to the frame, each mask is stretched so that it is flat. Adjusting the tension so that the entire part of the mask is flat is a very difficult task. In particular, in order to align a mask pattern with a size of only a few to several tens of μm while flattening each cell, it is necessary to finely control the tensile force applied to each side of the mask and check the alignment state in real time. do.

Nevertheless, in the process of fixing a plurality of masks to one frame, there is a problem in that the masks are not well aligned with each other and between the mask cells. In addition, in the process of welding and fixing the mask to the frame, since the thickness of the mask film is too thin and large, the mask is sagged or distorted by load There were problems such as misalignment of the alignment.

In the case of ultra-high-definition OLED, the current QHD image quality is 500-600 PPI (pixel per inch), with a pixel size of about 30-50 μm. has a resolution of As such, it is necessary to reduce the alignment error between cells by several μm in consideration of the pixel size of the ultra-high-definition OLED, and an error outside of this may lead to product failure, and thus the yield may be very low. Therefore, there is a need to develop a technology capable of preventing deformation such as sagging or twisting of the mask, and clarifying alignment, and a technology of fixing the mask to a frame.

Accordingly, the present invention has been devised to solve the problems of the prior art as described above, and when the mask is attached to the frame, the mask of the mask set and the frame-integrated mask that prevents deformation of the mask and improves positioning accuracy Its purpose is to provide a replacement method.

The above object of the present invention is a mask set used for a frame-integrated mask in which a plurality of masks and a frame for supporting the masks are integrally formed, the mask set comprising: a mask cell on which a plurality of mask patterns are formed, and a dummy around the mask cell A mask set comprising a plurality of masks comprising

For each mask, a welding portion may be formed at a shifted position.

An anti-wrinkle pattern may be formed around each weld portion of the mask spaced apart from each other by a predetermined distance.

An anti-wrinkle pattern may be formed at a shifted position for each mask.

The anti-wrinkle pattern may occupy at least a circumferential area concentric with the weld and having a larger diameter than the weld.

A plurality of buffer patterns formed to form a mutual gap between the anti-wrinkle pattern and the mask pattern and having a width greater than the width of the mask pattern may be further included.

And, the above object of the present invention is a method of replacing a mask in a frame-integrated mask in which a plurality of masks and a frame supporting the masks are integrally formed, (a) at least a portion of an upper portion of a frame having a plurality of mask cell regions providing a frame-integrated mask having a plurality of masks attached thereto; (b) separating the first mask adhered on the predetermined mask cell region from the frame; (c) applying a second mask to a predetermined mask cell region, and irradiating a laser to a welding part of the second mask to adhere to the frame, wherein each of the first mask and the second mask has a plurality of mask patterns A frame-integrated mask including the formed mask cell and a dummy around the mask cell, wherein a plurality of welds are formed at least in part of the dummy with a gap therebetween, and each of the first mask and the second mask have different positions at which the welds are formed. is achieved by the method of mask replacement.

The frame may include an edge frame part and a mask cell sheet part having a plurality of mask cell areas and connected to the edge frame part.

The mask cell sheet unit may include a plurality of mask cell regions along at least one of a first direction and a second direction perpendicular to the first direction.

The mask cell sheet unit includes: an edge sheet unit; at least one first grid sheet portion extending in a first direction and having both ends connected to the edge sheet portion; and at least one second grid sheet portion extending in a second direction perpendicular to the first direction, intersecting the first grid sheet portion, and having both ends connected to the edge sheet portion.

Each mask may correspond to each mask cell region.

In step (b), the first mask may be separated from the frame by pressing the outer portion of at least one edge of the first mask and applying an external force to the one edge of the mask.

In step (b), the upper surface and the lower surface of the frame disposed on the outside of one edge of the first mask may be compressed.

The upper surface of the edge of the frame corresponding to one edge of the first mask may be pressed with a pressing bar.

A support having a frame support groove corresponding to the shape of the frame formed on the upper surface may be disposed at the lower portion of the frame.

In step (b), after removing one edge of the first mask from the frame by applying an external force to one edge of the first mask, applying an external force to the other edge opposite to one side of the first mask while removing the other edge from the frame , the first mask may be separated from the frame.

In step (c), a welding bead (bead) is formed in a portion of the welding portion of the second mask irradiated with a laser, the welding bead may mediate so that the second mask and the frame are integrally connected.

The position of the welding part of the second mask may be formed at a position shifted from the welding part of the first mask.

An anti-wrinkle pattern may be formed around each weld portion of the mask spaced apart from each other by a predetermined distance.

The position of the anti-wrinkle pattern of the second mask may be formed at a position shifted from the anti-wrinkle pattern part of the first mask.

The anti-wrinkle pattern may occupy at least a circumferential area concentric with the weld and having a larger diameter than the weld.

A plurality of buffer patterns formed to form a mutual gap between the anti-wrinkle pattern and the mask pattern and having a width greater than the width of the mask pattern may be further included.

According to the present invention configured as described above, when the mask is adhered to the frame, it is possible to prevent deformation of the mask and improve the positioning accuracy.

1 is a schematic diagram showing a conventional mask for OLED pixel deposition.
2 is a schematic diagram illustrating a process of bonding a conventional mask to a frame.
3 is a schematic diagram illustrating that an alignment error occurs between cells in a process of tensioning a conventional mask.
4 is a front view and a side cross-sectional view showing a frame-integrated mask according to an embodiment of the present invention.
5 is a front view and a side cross-sectional view showing a frame according to an embodiment of the present invention.
6 is a schematic diagram illustrating a manufacturing process of a frame according to an embodiment of the present invention.
7 is a schematic diagram showing a manufacturing process of a frame according to another embodiment of the present invention.
8 is a schematic diagram illustrating a shape of a mask and a state in which the mask is attached on a tray according to an embodiment of the present invention.
9 to 12 are schematic views showing anti-wrinkle patterns of masks according to various embodiments of the present invention.
13 is a schematic view showing a state in which a mask according to a comparative example is attached on a tray.
14 is a schematic diagram illustrating a state in which a mask according to a comparative example is adhered to a cell region of a frame.
15 is a schematic diagram illustrating a state in which a mask is adhered to a cell region of a frame according to an embodiment of the present invention.
16 is a schematic diagram illustrating a state in which a tray according to a comparative example is loaded onto a frame and a mask corresponds to a cell region of the frame.
17 is a schematic diagram illustrating a process of loading a tray on a frame and adhering a mask to a cell region of the frame and an interface state between the mask and the tray according to a comparative example.
18 is a schematic diagram illustrating a process of loading a tray on a frame and adhering a mask to a cell region of the frame and an interface state between the mask and the tray according to an embodiment of the present invention.
19 is a schematic diagram illustrating a tray according to an embodiment of the present invention.
20 is a schematic diagram illustrating a state in which a tray is loaded onto a frame and a mask corresponds to a cell region of the frame according to an embodiment of the present invention.
21 is a schematic diagram illustrating a process of sequentially adhering a mask to a cell region according to an embodiment of the present invention.
22 is a schematic diagram illustrating a process of lowering the temperature of a process region after attaching a mask to a cell region of a frame according to an embodiment of the present invention.
23 is a schematic diagram illustrating an OLED pixel deposition apparatus using a frame-integrated mask according to an embodiment of the present invention.
24 is a schematic diagram illustrating a process of separating a mask from a frame-integrated mask according to an embodiment of the present invention.
25 is a schematic diagram illustrating a mask set according to an embodiment of the present invention.
26 is a schematic view showing a state in which the mask is replaced in the frame-integrated mask according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS [0010] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS [0010] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS [0023] Reference is made to the accompanying drawings, which show by way of illustration specific embodiments in which the present invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the present invention. It should be understood that the various embodiments of the present invention are different but need not be mutually exclusive. For example, certain shapes, structures, and characteristics described herein with respect to one embodiment may be embodied in other embodiments without departing from the spirit and scope of the invention. In addition, it should be understood that the location or arrangement of individual components within each disclosed embodiment may be changed without departing from the spirit and scope of the present invention. Accordingly, the detailed description set forth below is not intended to be taken in a limiting sense, and the scope of the invention, if properly described, is limited only by the appended claims, along with all scope equivalents to those claimed. In the drawings, like reference numerals refer to the same or similar functions in various aspects, and the length, area, thickness, and the like may be exaggerated for convenience.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings in order to enable those of ordinary skill in the art to easily practice the present invention.

1 is a schematic diagram showing a conventional mask 10 for OLED pixel deposition.

Referring to FIG. 1 , the conventional mask 10 may be manufactured in a stick-type or plate-type shape. The mask 10 shown in FIG. 1A is a stick-type mask, and can be used by welding and fixing both sides of the stick to the OLED pixel deposition frame. The mask 100 illustrated in FIG. 1B is a plate-type mask and may be used in a process of forming a large area pixel.

A plurality of display cells C are provided in the body of the mask 10 (or the mask film 11 ). One cell C corresponds to one display such as a smart phone. A pixel pattern P is formed in the cell C to correspond to each pixel of the display. When the cell C is enlarged, a plurality of pixel patterns P corresponding to R, G, and B appear. For example, a pixel pattern P is formed in the cell C to have a resolution of 70×140. That is, numerous pixel patterns P form a group to constitute one cell C, and a plurality of cells C may be formed on the mask 10 .

2 is a schematic diagram illustrating a process of bonding the conventional mask 10 to the frame 20 . 3 is a schematic diagram illustrating that an alignment error occurs between cells in the process of stretching (F1 to F2) the conventional mask 10 . The stick mask 10 including six cells (C: C1 to C6) shown in FIG. 1A will be described as an example.

Referring to FIG. 2A , first, the stick mask 10 should be flattened. The stick mask 10 is unfolded as it is pulled by applying tensile forces F1 to F2 in the long axis direction of the stick mask 10 . In this state, the stick mask 10 is loaded on the frame 20 in the form of a square frame. The cells C1 to C6 of the stick mask 10 are located in the blank area inside the frame 20 of the frame 20 . The frame 20 may have a size such that the cells C1 to C6 of one stick mask 10 are located in an empty area inside the frame, and the cells C1 to C6 of the plurality of stick masks 10 are placed in the frame. It may be large enough to be located in the inner blank area.

Referring to Figure 2 (b), after aligning while finely adjusting the tensile force (F1 ~ F2) applied to each side of the stick mask 10, a part of the side of the stick mask 10 is welded (W) Accordingly, the stick mask 10 and the frame 20 are interconnected. FIG. 2(c) shows a cross-section of the stick mask 10 and the frame connected to each other.

Referring to FIG. 3 , in spite of finely adjusting the tensile forces F1 to F2 applied to each side of the stick mask 10 , there is a problem in that the mask cells C1 to C3 are not well aligned with each other. For example, the distances D1 to D1″ and D2 to D2″ between the patterns P of the cells C1 to C3 are different from each other, or the patterns P are skewed. Since the stick mask 10 has a large area including a plurality of (eg, six) cells C1 to C6 and has a very thin thickness of several tens of μm, it is easily sagged or twisted by a load. In addition, it is very difficult to check the alignment state between the cells C1 to C6 in real time through a microscope while adjusting the tensile force F1 to F2 to flatten all the cells C1 to C6.

Accordingly, a minute error in the tensile force F1 to F2 may cause an error in the extent to which each cell C1 to C3 of the stick mask 10 is stretched or unfolded, and accordingly, the distance D1 between the mask patterns P ~D1", D2~D2") causes a problem that becomes different. Of course, it is difficult to align perfectly so that the error is 0, but in order to prevent the mask pattern P having a size of several to several tens of μm from adversely affecting the pixel process of the ultra-high-definition OLED, the alignment error should not exceed 3 μm. It is preferable not to This alignment error between adjacent cells is referred to as pixel position accuracy (PPA).

In addition, approximately 6 to 20 of a plurality of stick masks 10 are connected to one frame 20 , respectively, between the plurality of stick masks 10 and a plurality of cells C of the stick mask 10 . It is also very difficult to clarify the alignment state between ~C6), and the processing time according to alignment is inevitably increased, which is a significant reason for reducing productivity.

Meanwhile, after the stick mask 10 is connected and fixed to the frame 20 , the tensile forces F1 to F2 applied to the stick mask 10 may reversely act on the frame 20 . That is, after the stick mask 10 , which has been stretched taut by the tensile forces F1 to F2 , is connected to the frame 20 , a tension may be applied to the frame 20 . Usually, this tension is not large, so it may not have a significant effect on the frame 20 , but when the size of the frame 20 is reduced in size and rigidity is lowered, this tension may slightly deform the frame 20 . In this way, a problem in which the alignment state is misaligned among the plurality of cells C to C6 may occur.

Accordingly, the present invention proposes a frame 200 and a frame-integrated mask that allows the mask 100 to form an integrated structure with the frame 200 . The mask 100 integrally formed with the frame 200 is prevented from being deformed such as sagging or twisting, and can be clearly aligned with the frame 200 . Since no tensile force is applied to the mask 100 when the mask 100 is connected to the frame 200, a tension sufficient to deform the frame 200 after the mask 100 is connected to the frame 200 may not be applied. . And, it has the advantage of significantly reducing the manufacturing time for integrally connecting the mask 100 to the frame 200 and significantly increasing the yield.

4 is a front view [FIG. 4 (a)] and a side cross-sectional view [FIG. 4 (b)] showing a frame-integrated mask according to an embodiment of the present invention, and FIG. 5 is a frame-integrated mask according to an embodiment of the present invention. It is a front view [FIG. 5(a)] and a side cross-sectional view [FIG. 5(b)] which show a frame.

4 and 5 , the frame-integrated mask may include a plurality of masks 100 and one frame 200 . In other words, a plurality of masks 100 are adhered to the frame 200 one by one. Hereinafter, for convenience of explanation, the mask 100 having a rectangular shape will be described as an example, but the masks 100 may be in the form of a stick mask having protrusions clamped on both sides before being adhered to the frame 200 , and the frame 200 . ), after which the protrusion can be removed.

A plurality of mask patterns P may be formed on each mask 100 , and one cell C may be formed on one mask 100 . One mask cell C may correspond to one display such as a smart phone. To form a thin film, the mask 100 may be formed by electroforming. Mask 100 may be a coefficient of thermal expansion of about 1.0 X 10 ^-6 / ℃ of invar (invar), about 1.0 X 10 ^-7 / ℃ Super Invar (super invar) material. Since the mask 100 made of this material has a very low coefficient of thermal expansion, there is little risk of the pattern shape of the mask being deformed by thermal energy, so it can be used as a fine metal mask (FMM) or a shadow mask in high-resolution OLED manufacturing. In addition, considering that technologies for performing a pixel deposition process in a range where the temperature change value is not large recently, the mask 100 may have a slightly larger coefficient of thermal expansion than nickel (Ni) and nickel-cobalt (Ni-Co). ) may be a material such as The thickness of the mask may be about 2 μm to 50 μm.

The frame 200 is formed to adhere the plurality of masks 100 to each other. The frame 200 may include several corners formed in a first direction (eg, a horizontal direction) and a second direction (eg, a vertical direction) including an outermost edge. These various corners may define a region to which the mask 100 is to be adhered on the frame 200 .

The frame 200 may include an edge frame portion 210 having a substantially rectangular shape or a rectangular frame shape. The inside of the edge frame part 210 may have a hollow shape. That is, the edge frame portion 210 may include the hollow region (R). The frame 200 may be made of a metal material such as Invar, Super Invar, aluminum, or titanium, and is made of Invar, Super Invar, Nickel, Nickel-Cobalt, etc., having the same coefficient of thermal expansion as the mask in consideration of thermal deformation. Preferably, these materials may be applied to both the edge frame part 210 and the mask cell sheet part 220 that are components of the frame 200 .

In addition, the frame 200 may include a plurality of mask cell regions CR, and may include a mask cell sheet unit 220 connected to the edge frame unit 210 . Like the mask 100 , the mask cell sheet unit 220 may be formed by electroplating, or may be formed using other film forming processes. In addition, the mask cell sheet unit 220 may be connected to the edge frame unit 210 after forming a plurality of mask cell regions CR on a flat sheet through laser scribing, etching, or the like. Alternatively, the mask cell sheet unit 220 may form a plurality of mask cell regions CR through laser scribing, etching, or the like after connecting a flat sheet to the edge frame unit 210 . In the present specification, it is mainly assumed that a plurality of mask cell regions CR are first formed on the mask cell sheet part 220 and then connected to the edge frame part 210 .

The mask cell sheet part 220 may include at least one of the edge sheet part 221 and the first and second grid sheet parts 223 and 225 . The edge sheet portion 221 and the first and second grid sheet portions 223 and 225 refer to partitioned portions of the same sheet, and they are integrally formed with each other.

The edge sheet part 221 may be substantially connected to the edge frame part 210 . Accordingly, the edge sheet part 221 may have a substantially rectangular shape or a rectangular frame shape corresponding to the edge frame part 210 .

Also, the first grid sheet part 223 may be formed to extend in a first direction (horizontal direction). The first grid sheet part 223 may be formed in a straight shape so that both ends thereof may be connected to the edge sheet part 221 . When the mask cell sheet part 220 includes a plurality of first grid sheet parts 223 , it is preferable that each of the first grid sheet parts 223 form equal intervals.

In addition, the second grid sheet part 225 may be formed to extend in the second direction (vertical direction). The second grid sheet part 225 may be formed in a straight shape so that both ends thereof may be connected to the edge sheet part 221 . The first grid sheet part 223 and the second grid sheet part 225 may vertically cross each other. When the mask cell sheet part 220 includes a plurality of second grid sheet parts 225 , it is preferable that the respective second grid sheet parts 225 form equal intervals.

Meanwhile, the distance between the first grid sheet parts 223 and the distance between the second grid sheet parts 225 may be the same or different depending on the size of the mask cell C. As shown in FIG.

Although the first grid sheet part 223 and the second grid sheet part 225 have a thin thickness in the form of a thin film, the shape of the cross-section perpendicular to the longitudinal direction may be a rectangle, a rectangular shape such as a parallelogram, a triangular shape, etc. , sides and corners may be partially rounded. The cross-sectional shape can be adjusted in the process of laser scribing, etching, etc.

The thickness of the edge frame part 210 may be thicker than the thickness of the mask cell sheet part 220 . The edge frame portion 210 may be formed to a thickness of several mm to several cm because it is responsible for the overall rigidity of the frame (200).

In the case of the mask cell sheet unit 220 , the process of manufacturing a substantially thick sheet is difficult, and if it is too thick, the organic material source 600 (see FIG. 23 ) passes through the mask 100 in the OLED pixel deposition process. It may cause clogging problems. Conversely, if the thickness is too thin, it may be difficult to secure enough rigidity to support the mask 100 . Accordingly, the mask cell sheet portion 220 is thinner than the thickness of the edge frame portion 210 , but preferably thicker than the mask 100 . The thickness of the mask cell sheet part 220 may be about 0.1 mm to about 1 mm. In addition, the width of the first and second grid sheet parts 223 and 225 may be about 1 to 5 mm.

In the flat sheet, a plurality of mask cell regions CR: CR11 to CR56 may be provided except for regions occupied by the edge sheet part 221 and the first and second grid sheet parts 223 and 225 . From another point of view, the mask cell region CR refers to an area occupied by the edge sheet part 221 and the first and second grid sheet parts 223 and 225 in the hollow region R of the edge frame part 210 . , but may mean an empty area.

As the cell C of the mask 100 corresponds to the mask cell region CR, it can be used as a path through which pixels of the OLED are deposited substantially through the mask pattern P. As described above, one mask cell C corresponds to one display such as a smart phone. Mask patterns P constituting one cell C may be formed on one mask 100 . Alternatively, one mask 100 may include a plurality of cells C, and each cell C may correspond to each cell region CR of the frame 200, but the mask 100 may be clearly aligned. For this, it is necessary to avoid the large-area mask 100 , and the small-area mask 100 including one cell C is preferable. Alternatively, one mask 100 having a plurality of cells C may correspond to one cell region CR of the frame 200 . In this case, it may be considered to correspond to the mask 100 having a small number of cells C of about 2-3 for clear alignment.

The frame 200 includes a plurality of mask cell regions CR, and each mask 100 may be bonded such that one mask cell C corresponds to the mask cell region CR. Each mask 100 may include a mask cell C on which a plurality of mask patterns P are formed and a dummy (corresponding to a portion of the mask film 110 excluding the cell C) around the mask cell C. have. The dummy may include only the mask layer 110 or the mask layer 110 on which a predetermined dummy pattern similar to the mask pattern P is formed. The mask cell C corresponds to the mask cell region CR of the frame 200 , and a part or all of the dummy may be adhered to the frame 200 (mask cell sheet unit 220 ). Accordingly, the mask 100 and the frame 200 can form an integrated structure.

Meanwhile, according to another embodiment, the frame is not manufactured by bonding the mask cell sheet part 220 to the edge frame part 210 , but the edge frame part 210 in the hollow region R of the edge frame part 210 . ) and a grid frame (corresponding to the grid sheet portions 223 and 225) integrally formed thereon may be used. This type of frame also includes at least one mask cell region CR, and by matching the mask 100 to the mask cell region CR, a frame-integrated mask can be manufactured.

Hereinafter, a process for manufacturing the frame-integrated mask will be described.

First, the frame 200 described above with reference to FIGS. 4 and 5 may be provided. 6 is a schematic diagram illustrating a manufacturing process of the frame 200 according to an embodiment of the present invention.

Referring to (a) of FIG. 6 , an edge frame part 210 is provided. The edge frame part 210 may have a rectangular frame shape including the hollow region R.

Next, referring to FIG. 6B , the mask cell sheet part 220 is manufactured. The mask cell sheet part 220 can be manufactured by manufacturing a flat sheet using electroplating or other film forming process, and then removing the mask cell region CR part through laser scribing, etching, etc. have. In the present specification, a case in which 6 X 5 mask cell regions CR: CR11 to CR56 are formed will be described as an example. Five first grid sheet parts 223 and four second grid sheet parts 225 may exist.

Next, the mask cell sheet part 220 may correspond to the edge frame part 210 . In the process of matching, all sides of the mask cell sheet part 220 are stretched (F1 to F4), and the edge sheet part 221 is attached to the edge frame part 210 in a state where the mask cell sheet part 220 is flattened. can respond. One side may also hold the mask cell sheet 220 at several points (eg, 1 to 3 points in FIG. 6(b) ) and tension it. Meanwhile, the mask cell sheet unit 220 may be stretched (F1, F2) along some lateral directions instead of all sides.

Next, when the mask cell sheet part 220 corresponds to the edge frame part 210 , the edge sheet part 221 of the mask cell sheet part 220 may be welded (W) to be adhered. It is preferable to weld (W) all sides so that the mask cell sheet part 220 can be firmly attached to the edge frame part 220 . Welding (W) should be performed as close to the edge of the edge frame part 210 as possible to reduce the floating space between the edge frame part 210 and the mask cell sheet part 220 as much as possible and increase adhesion. The weld (W) portion may be generated in the form of a line or a spot, and has the same material as the mask cell sheet 220 and integrates the edge frame 210 and the mask cell sheet 220 together. It can be a medium that connects

7 is a schematic diagram showing a manufacturing process of a frame according to another embodiment of the present invention. In the embodiment of FIG. 6 , the mask cell sheet part 220 having the mask cell region CR was first manufactured and adhered to the edge frame part 210 , but in the embodiment of FIG. After adhering to the 210 , a mask cell region CR portion is formed.

First, as shown in (a) of Figure 6, the frame portion 210 including the hollow region (R) is provided.

Next, referring to FIG. 7A , a flat sheet (planar mask cell sheet portion 220 ′) may correspond to the edge frame portion 210 . The mask cell sheet part 220 ′ is in a planar state in which the mask cell region CR is not yet formed. In the process of matching, all sides of the mask cell sheet part 220' may be stretched (F1 to F4) to correspond to the edge frame part 210 in a state in which the mask cell sheet part 220' is flattened. On one side, the mask cell sheet unit 220 ′ may be held and tensioned at several points (eg, 1 to 3 points in FIG. 7A ). Meanwhile, the mask cell sheet unit 220 ′ may be stretched (F1, F2) along some lateral directions instead of all sides.

Next, when the mask cell sheet portion 220 ′ corresponds to the edge frame portion 210 , the edge portion of the mask cell sheet portion 220 ′ may be welded (W) to adhere thereto. It is preferable to weld (W) all sides so that the mask cell sheet part 220 ′ can be firmly attached to the edge frame part 220 . Welding (W) should be performed as close as possible to the edge of the edge frame part 210, so that the floating space between the edge frame part 210 and the mask cell sheet part 220' can be reduced as much as possible and adhesion can be increased. The weld (W) portion may be formed in the form of a line or a spot, and has the same material as the mask cell sheet portion 220 ′, and includes the edge frame portion 210 and the mask cell sheet portion 220 ′. It can be a medium that connects them together.

Next, referring to FIG. 7B , a mask cell region CR is formed on a flat sheet (planar mask cell sheet portion 220 ′). The mask cell region CR may be formed by removing the sheet of the mask cell region CR through laser scribing, etching, or the like. In the present specification, a case in which 6 X 5 mask cell regions CR: CR11 to CR56 are formed will be described as an example. When the mask cell region CR is formed, the edge frame portion 210 and the welded portion W become the edge sheet portion 221 , and five first grid sheet portions 223 and four second grids are formed. The mask cell sheet unit 220 including the sheet unit 225 may be configured.

8 is a schematic view showing the shape of the mask 100 and the state in which the mask 100 is attached to the tray 50 according to an embodiment of the present invention.

Referring to FIG. 8A , a mask 100 having a plurality of mask patterns P formed thereon may be provided. The mask 100 may include a mask cell C on which a plurality of mask patterns P are formed and a dummy DM around the mask cell C. The dummy DM corresponds to a portion of the mask layer 110 excluding the cell C, and includes only the mask layer 110 or the mask layer 110 in which a predetermined dummy pattern similar to the mask pattern P is formed. may include. A part or all of the dummy DM may be adhered to the frame 200 (the mask cell sheet unit 220 ) corresponding to the edge of the mask 100 . The mask 100 made of Invar or Super Invar material can be manufactured by electroplating.

The mother plate used as a cathode in electroplating uses a conductive material. As a conductive material, in the case of a metal, metal oxides may be generated on the surface, impurities may be introduced during the metal manufacturing process, and in the case of a polycrystalline silicon substrate, inclusions or grain boundaries may exist, and a conductive polymer In the case of a base material, it is highly likely to contain impurities, and strength. Acid resistance, etc. may be weak. Elements that prevent the uniform formation of an electric field on the surface of the mother plate (or cathode body), such as metal oxides, impurities, inclusions, and grain boundaries, are referred to as “defects”. Due to the defect, a uniform electric field may not be applied to the cathode body made of the above material, so that a portion of the plating film (mask 100 ) may be non-uniformly formed.

In realizing ultra-high-definition pixels of UHD level or higher, the non-uniformity of the plating film and the plating film pattern (mask pattern P) may adversely affect the formation of the pixel. For example, in the case of the current QHD image quality, the pixel size reaches about 30-50㎛ with 500-600 PPI (pixel per inch), and in the case of 4K UHD and 8K UHD high-definition, higher ~860 PPI, ~1600 PPI resolution, etc. A micro display applied directly to a VR device or a micro display used by inserting a VR device aims for an ultra-high resolution of about 2,000 PPI or higher, and the size of the pixel reaches about 5 to 10 μm. The pattern width of the FMM and shadow mask applied thereto can be formed in a size of several to several tens of μm, preferably smaller than 30 μm, so that even defects with a size of several μm occupy a large proportion in the pattern size of the mask. am. In addition, in order to remove defects in the anode body made of the above material, an additional process for removing metal oxides, impurities, etc. may be performed, and in this process, other defects such as etching of the cathode body material may be induced. have.

Accordingly, in the present invention, a single crystal material mother plate (or negative electrode body) may be used. In particular, it is preferable that the material is single-crystal silicon. In order to have conductivity, a ^{high-concentration doping of 10 19} /cm ³ or more may be performed on the mother plate made of single-crystal silicon. The doping may be performed on the entire mother plate or only on the surface portion of the mother plate.

On the other hand, as a single crystal material, metals such as Ti, Cu, Ag, semiconductors such as GaN, SiC, GaAs, GaP, AlN, InN, InP, Ge, and carbon-based materials such as graphite and graphene , such as _{CH 3 NH 3 PbCl 3, CH} 3 NH 3 PbBr 3, CH3NH 3 PbI 3, SrTiO 3 , etc. page containing the perovskite single crystal ceramic, aircraft single crystal second heat-resistant alloy for components for a superconductor, such as (perovskite) structure can be used Metals and carbon-based materials are basically conductive materials. In the case of a semiconductor material, high-concentration doping of 1019 or more may be performed to have conductivity. In the case of other materials, conductivity may be formed by doping or forming oxygen vacancies. The doping may be performed on the entire mother plate or only on the surface portion of the mother plate.

In the case of a single crystal material, since there is no defect, there is an advantage that a uniform plating film (mask 100 ) can be generated due to the formation of a uniform electric field on the entire surface during electroplating. The frame-integrated masks 100 and 200 manufactured through a uniform plating film can further improve the quality of OLED pixels. And, since there is no need to perform an additional process for removing and resolving defects, there is an advantage in that process costs are reduced and productivity is improved.

In addition, if it is a silicon material or a single crystal material capable of forming an insulating film on the surface by oxidation or nitridation, the advantage of being able to form an insulating part only by oxidizing and nitriding the surface of the mother plate if necessary. have. The insulating portion may be formed using a photoresist. Electrodeposition of the plating film (mask 100) is prevented in the portion where the insulating portion is formed, and a pattern (mask pattern P) is formed on the plating film.

On the other hand, it should be noted that the material of the mother plate of the present invention is not necessarily limited to the above-described single crystal material as long as it is within the range of reducing defects in the cathode body.

The width of the mask pattern P may be formed to be smaller than 40 μm, and the thickness of the mask 100 may be formed to be about 2 to 50 μm. Since the frame 200 includes a plurality of mask cell regions CR: CR11 to CR56, the mask 100 having mask cells C: C11 to C56 corresponding to each of the mask cell regions CR: CR11 to CR56. ) may also be provided in plurality.

The mask 100 may be attached to the frame 200 by laser welding. The laser L may be irradiated to the welding portion WP of the mask 100 . The welding portion WP may mean a target area in which the welding bead WB may be formed by irradiation of the laser L0. The welding portion WP may be at least a portion of the edge or the dummy DM portion of the mask 100 . Hereinafter, it is assumed that the plurality of welding parts WP are disposed at regular intervals in the dummy DM region of the mask 100 and the shape of the welding part WP is approximately circular. , but not necessarily limited thereto.

Meanwhile, the mask 100 of the present invention is characterized in that anti-wrinkle patterns 150 to 170 are formed around the welding portion WP. The anti-wrinkle patterns 150 to 170 prevent the periphery of the welding portion WP from being distorted, contracted, or the like in the process of forming the welding bead WB by irradiating the laser L to the welding portion WP. It is characterized in that (see FIGS. 14 and 15).

The anti-wrinkle patterns 150 to 170 are the same as the holes formed in the dummy DM (or the edge portion) of the mask 100 similar to the mask pattern P, and in the process of forming the mask pattern P can be formed in the same way. For example, it may be a portion where the plating film 110 is not formed like the mask pattern P during the electroplating process of the mask 100 , or it may be a portion formed through a pattern forming process after electroplating of the mask 100 .

The anti-wrinkle patterns 150 to 170 are formed around the welding portion WP spaced apart from each other by a predetermined distance, and may be disposed to surround the welding portion WP as a whole, or may be disposed on both sides of the welding portion WP. For convenience of explanation, although the anti-wrinkle patterns 150 to 170 are illustrated as simple figures in FIG. 8A , specific shapes according to various embodiments will be described later with reference to FIGS. 9 to 12 .

Next, referring to FIGS. 8B and 8C , the prepared mask 100 may be attached on a tray 50 ′. The mask 100 electrodeposited on the mother plate may be removed and attached to the tray 50'. Electrostatic force, magnetic force, vacuum, etc. may be used so that the mask 100 is spread and attached flatly without wrinkling or wrinkles on one surface of the tray 50'. The tray 50 ′ may be made of a glass material through which the laser light L can pass.

9 to 12 are schematic views showing anti-wrinkle patterns 150 to 170 of a mask according to various embodiments of the present invention. 9 to 12 are enlarged portions of part D of FIG. 8 . For convenience of understanding, the mask cell C including the mask pattern P is shown on the right side, but the anti-wrinkle patterns 150 to 170 and the buffer pattern 190 in contrast to the mask pattern P are pattern sizes and patterns. It should be noted that the arrangement position and the like are not limited to those illustrated in FIGS. 9 to 12 .

9 to 12 , the anti-wrinkle patterns 150 to 170 may be formed around the welding part WP spaced apart from each other by a predetermined distance. According to an embodiment, the anti-wrinkle patterns 150 to 170 are concentric with the welding part WP (WPC), and a virtual circle having diameters R2 and R3 larger than the diameter R1 of the welding part WP. The area on the circumference of (AC) can be occupied. The form occupying the area on the circumferences R2 and R3 having a diameter greater than the diameter R1 of the welded portion WP is, when the unit anti-wrinkle pattern is disposed on the circumference, the unit anti-wrinkle pattern forms a part of the circumference. It may be implemented in the case of including itself.

Referring to FIG. 9 , the anti-wrinkle pattern 150 according to the first embodiment may include a plurality of unit anti-wrinkle patterns 151 . In order to facilitate dispersing the stress, tension, etc. applied to the mask 100 film, the plurality of unit anti-wrinkle patterns 151 are preferably in a shape having a curvature such as a circle or an ellipse rather than a shape including an angled corner.

A plurality of unit anti-wrinkle patterns 151 are disposed with mutual intervals, and are concentric with the welding portion WP (WPC) and have a larger diameter R2 than the diameter R1 of the welding portion WP (AC). may be disposed on the circumference of The unit anti-wrinkle pattern 151 may be disposed in a single layer around the welding portion WP, but may be disposed in double or triple layers.

In addition to the anti-wrinkle pattern 150 , a plurality of buffer patterns 190 may be further formed. The buffer pattern 190 may be formed with a mutual gap between the anti-wrinkle pattern 150 and the mask pattern P. The buffer pattern 190 may be disposed approximately along the inner edge of the dummy DM area.

Since the buffer pattern 190 does not surround the periphery of the welding portion WP, it serves to disperse stress, tension, etc. applied to the mask 100 layer in a larger range. Accordingly, it may have a width greater than the width of the mask pattern P, and may have a width greater than that of the anti-wrinkle patterns 150 to 170 . The buffer pattern 190 includes a plurality of unit buffer patterns 191 and 192, and it is preferable that the unit buffer patterns 191 and 192 also have a curvature such as a circle or an ellipse rather than a shape including angular corners. do.

According to an embodiment, the first unit buffer patterns 191 may be disposed on a horizontal axis passing through the middle of the pair of anti-wrinkle patterns 150 . In addition, the second unit buffer patterns 192 may be disposed on the same horizontal axis as the first unit buffer pattern 191 , and may be further disposed on a horizontal axis passing through the middle of the pair of first unit buffer patterns 191 . have. However, the arrangement form is not necessarily limited thereto.

Referring to FIG. 10 , the anti-wrinkle pattern 160 according to the second embodiment may include a plurality of unit anti-wrinkle patterns 161 .

A plurality of unit anti-wrinkle patterns 161 are disposed with mutual intervals, and are concentric with the welding portion (WP) (WPC), and a virtual circle (AC) having a diameter (R2) greater than the diameter (R1) of the welding portion (WP) (AC) It may have a shape including at least a portion (162, 163) of the circumference of the. In other words, one unit anti-wrinkle pattern 161 is concentric with the specific welding part WP1 (WPC) and has at least a portion 162 of the circumference having a larger diameter R2 than the specific welding part WP1, and the specific welding part WP1 ) may have a shape including at least a portion 163 of the circumference having a diameter R2 that is concentric with the adjacent welded portion WP2 and WPC and has a larger diameter R2 than the adjacent welded portion WP2. The unit anti-wrinkle pattern 161 may have a closed figure shape by further including corners 164 and 165 connecting them in addition to at least a portion of the circumference 162 and 163 . Since the unit anti-wrinkle pattern 161 includes the curvature portions 162 and 163 having a predetermined interval from the welding portion WP, there is an advantage in that it is easy to disperse stress, tension, etc. applied to the welding portion WP.

Referring to FIG. 11 , the anti-wrinkle pattern 160 ′ according to the third exemplary embodiment may include a plurality of unit anti-wrinkle patterns 161 ′.

The anti-wrinkle pattern 160 ′ according to the third exemplary embodiment may include curvature portions 162 and 163 similar to the anti-wrinkle pattern 160 according to the second exemplary embodiment. However, in addition to the curvature portions 162 and 163 and the corners 164 and 165 connecting them, it may be a closed figure shape further including opposite and parallel sides 166 . Since the unit anti-wrinkle pattern 161 includes the curvature portions 162 and 163 having a predetermined interval from the welding portion WP, there is an advantage in that it is easy to disperse stress, tension, etc. applied to the welding portion WP.

12 , the anti-wrinkle pattern 170 according to the fourth embodiment may include a plurality of unit anti-wrinkle patterns 171 .

The unit anti-wrinkle pattern 171 includes at least a portion 172 of an imaginary circumference having a first diameter R2 that is concentric with the welded portion WP and is concentric with the welded portion WP and has a first diameter R2 greater than the diameter R1 of the welded portion WP, and a first The shape may include at least a portion 173 of an imaginary circumference having a second diameter R3 greater than the diameter R1. The unit anti-wrinkle pattern 171 may have a closed figure shape by further including edges 174 and 175 connecting them in addition to at least a portion of the circumference 172 and 173 .

The plurality of unit anti-wrinkle patterns 171 may be spaced apart from each other and may be disposed to surround one welding portion WP. The unit anti-wrinkle pattern 171 may be disposed in a single layer around the welding portion WP, but may be disposed in double or triple layers. The unit anti-wrinkle pattern 171 includes the welding portion WP and the curvature portions 172 and 173 having a predetermined interval, and is disposed to surround the welding portion WP, so that the stress, tension, etc. applied to the welding portion WP is dispersed. It has the advantage of being easy to do.

13 is a plan view of the shape of the mask 100 ′ according to the comparative example (FIG. 13 (a)) and the state in which the mask 100 ′ according to the comparative example is attached on the tray 50 ′ ( FIG. 13 ( b)] and a side cross-sectional view [Fig. 13(c)]. 14 is a side cross-sectional view showing a state in which the mask 100 according to a comparative example is adhered to the cell region CR of the frame 200 (FIG. 14(a)) and an enlarged plan view of E [FIG. 14(b)] ]am.

Referring to FIG. 13A , in contrast to the mask 100 of the embodiment of the present invention described above in FIG. 8 , the mask 100 ′ according to the comparative example has a plurality of mask patterns ( P), and the dummy DM has no separate pattern. Then, referring to FIGS. 13B and 13C , the mask 100 ′ may be attached on a tray 50 ′. The mask 100 electrodeposited on the mother plate may be removed and attached to the tray 50'.

Referring to FIG. 14A , part or all of the edge of the mask 100 may be adhered to the frame 200 (the first grid sheet part 223 or the second grid sheet part 225 ). The bonding may be performed by welding, preferably by laser welding. Laser welding should be performed as close to the edge of the frame 200 as possible to reduce the floating space between the mask 100 and the frame 200 as much as possible and increase adhesion.

When the laser L is irradiated to the welding portion WP from the upper portion of the mask 100 ′, the laser L may melt a portion of the mask 100 ′ in the welding portion WP region. A portion of the mask 100' may be melted to form a weld bead (WB). In addition, the welding bead WB may be a medium for integrally connecting the mask 100 ′ and the frame 200 .

In this case, a tension T may be applied to the periphery of the weld bead WB while the mask 100 ′ in the portion where the weld bead WB is formed is melted and then solidified. Deformation 105 ′ such as wrinkles, distortion, and smearing may occur around the weld bead WB due to the contracted tension T. In addition, deformation 106 ′ such as wrinkles and distortion in the space between the weld bead WB and the mask cell C may occur. Eventually, deformations 105' and 106' occur due to the tension T, and by these deformations 105' and 106', the alignment state between the mask pattern P and the cells C is eventually misaligned. problems may arise.

The mask 100 of the present invention can prevent the above problem as the anti-wrinkle patterns 150 to 170 and the buffer pattern 190 are formed.

15 is a schematic diagram illustrating a state in which the mask 100 is adhered to the cell region CR of the frame 200 according to an embodiment of the present invention.

Referring to (a) of FIG. 15 , the laser L may be irradiated to the welding portion WP of the dummy DM (or the edge region) of the mask 100 from the upper portion of the mask 100 . A portion of the mask 100 may be melted to form a weld bead (WB). In addition, the welding bead WB may be a medium for integrally connecting the mask 100 and the frame 200 (or the edge sheet portion 221 , and the first and second grid sheet portions 223 and 225 ). have.

In this case, a tension T may be applied to the periphery of the weld bead WB while the mask 100 in the portion where the weld bead WB is formed is melted and then solidified. The contracted tension T applied around the weld bead WB may be dispersed in each of the anti-wrinkle patterns 150 to 170 . Since the tension T is dispersed in the plurality of anti-wrinkle patterns 150 to 170 , deformation 105 ′ such as wrinkles, warping, and spreading around the weld bead WB may be eliminated.

In addition, the contracted tension T applied in the space between the weld bead WB and the mask cell C may be dispersed in each of the buffer patterns 190 . Since the tension T is dispersed in the plurality of buffer patterns 190 , the deformation 106 ′ such as wrinkles or distortion in the space between the weld bead WB and the mask cell C may be eliminated.

As described above, the deformations 105' and 106' by the plurality of anti-wrinkle patterns 150 to 170 and the buffer pattern 190 are eliminated or only deformed at a level that has little effect on the alignment of the mask pattern P, In the process of bonding the mask 100 to the frame 200 , the alignment state between the mask pattern P and the cells C can be maintained.

16 is a plan view of a state in which a tray 50 ′ according to a comparative example is loaded onto the frame 200 and the mask 100 ′ corresponds to the cell region CR of the frame 200 ( FIG. 16 (a) ). ] and a side cross-sectional view [Fig. 16(b)]. 17 shows a process of loading a tray 50 ′ according to a comparative example onto the frame 200 and adhering the mask 100 ′ to the cell region CR of the frame 200 , and the mask 100 and the tray 50 . ') shows a side cross-sectional view and a partially enlarged side cross-sectional view showing the interface state.

Referring to FIGS. 16A and 16B , the mask 100 ′ may correspond to one mask cell region CR of the frame 200 . The mask 100' is turned over, and the tray 50' is loaded onto the frame 200 (or the mask cell sheet unit 220) with the mask 100' attached thereon. It may correspond to the mask cell region CR. When the tray 50 ′ is loaded onto the frame 200 (or the mask cell sheet unit 220 ), the mask 100 ′ is loaded onto the tray 50 ′ and the frame 200 (or the mask cell sheet unit 220 ). 220)], and can be compressed by the tray 50'.

Referring to FIG. 17 , the mask 100 ′ may be adhered to the frame 200 by laser welding by irradiating the laser L on the mask 100 ′. A welding bead WB is generated in the welding portion WP of the laser-welded mask, and the welding bead WB may have the same material as that of the mask 100/frame 200 and may be integrally connected.

Meanwhile, in addition to pressing the mask 100 ′ by the tray 50 ′, the mask 100 and the frame 200 (or the edge sheet portion 221 , the first and second grid sheet portions 223 and 225 ) )], it is possible to add compression to the pressing body (M) from the top of the tray (50') so that the more closely abutting. In addition to the load by the weight of the compression body (M) may further include means for pressing the compression body (M). A through hole MH through which the laser L passes may be formed in the compression body M, and the laser L passes through the through hole MH and then passes through the transparent tray 50 ′ to the mask 100 . It can be irradiated to the welding part (the area to be welded) of

However, despite the load of the tray 50 ′ and the compression body M as described above, a fine air gap (AG) may exist on the interface between the tray 50 ′ and the mask 100 . Since the glass tray 50 ′ has a surface roughness Ra of about 20 to 30 μm, when looking at the surface of the tray 50 ′ on a micrometer scale, there is usually a fine curve. Accordingly, even when the mask 100 ′ is compressed, there may be a portion where the tray 50 ′ and the mask 100 ′ do not come into close contact with each other. 200 (or the edge sheet part 221 and the first and second grid sheet parts 223 and 225) may not come into close contact with each other.

In a portion where the tray 50' and the mask 100' are in close contact without an air gap AG, the welding bead WB is well between the mask 100' and the frame 200 by the laser L1 irradiation. generated, and integrally connecting the mask 100 ′ and the frame 200 , and as a result, welding can be performed well. However, in the portion that does not come into close contact with the air gap AG between the tray 50 ′ and the mask 100, the welding bead ( WB) is not well generated, and as a result, there is a problem that welding is not performed well.

Accordingly, the present invention is characterized by providing a tray 50 that can be in close contact with the mask 100 without an air gap AG.

18 shows a process of loading the tray 50 on the frame 200 and adhering the mask 100 to the cell region CR of the frame 200 and the mask 100 and the tray according to an embodiment of the present invention. A side cross-sectional view and a partially enlarged side cross-sectional view of the interface state of (50) are shown. 19 is a plan view [Fig. 19 (a)] and a rear view [Fig. 19 (b)] showing the tray 50 according to an embodiment of the present invention. 20 is a schematic diagram illustrating a state in which the tray 50 is loaded onto the frame 200 and the mask 100 corresponds to the cell region CR of the frame 200 according to an embodiment of the present invention.

18 and 19 , the mask 100 may be attached on a tray 50 . The mask 100 electrodeposited on the mother plate may be removed and attached to the tray 50 . The tray 50 is preferably in the shape of a flat plate so that the mask 100 can be attached flatly. The size of the tray 50 may be a flat plate shape larger than that of the mask 100 so that the mask 100 can be attached flat as a whole.

Electrostatic force, magnetic force, vacuum, etc. may be used so that the mask 100 is spread and attached flatly without wrinkling or wrinkles on one surface of the tray 50 . The method of using electrostatic force is a method of inducing static electricity by rubbing an electrified body on one surface of the tray 50 . In addition, in the method using electrostatic force, a voltage is applied to the transparent electrode disposed on the upper or lower surface of the tray 50 , and when a voltage is also applied to the mask 100 , static electricity is induced and the mask 100 is spread flat. It is a method of being attached to one surface of the tray 50 with a predetermined adhesive force while being removed. The method of using magnetic force is a method of holding and moving the mask 100 with magnetic force using a plurality of magnets on the opposite surface of the tray 50 on which the mask 100 is disposed. The method of using a vacuum is a method of holding and moving the mask 100 by using a vacuum device from one end to the other end of the mask 100 disposed on the tray 50 .

In particular, the tray 50 of the present invention is characterized in that one surface in contact with the mask 100 is a mirror surface so that an air gap AG does not occur between the interface with the mask 100 . Specifically, the surface roughness Ra of one surface of the tray 50 may be 100 nm or less. Since the general glass tray 50 ′ described above in FIG. 17 has a surface roughness Ra of about 20 to 30 μm, the presence of the air gap AG affects the alignment error of the mask pattern P having a μm scale. enough to give However, since the surface roughness Ra of the tray 50 of the present invention is in the nm scale, the alignment error of the mask pattern P is not affected to a level with no or almost no air gap AG.

In order to implement the tray 50 having a surface roughness Ra of 100 nm or less, the tray 50 may use a wafer. The wafer (wafer) has a surface roughness (Ra) of about 10 nm, and since there are many products on the market and many surface treatment processes are known, it is suitable for use as the tray 50 . In addition, if the surface roughness (Ra) can satisfy 100 nm or less by micro-mirror processing the surface, the tray 50 is glass, silica, heat-resistant glass, quartz, alumina (Al ₂ O) ₃ ) can also be used. Hereinafter, it is assumed that the wafer is used as the tray 50 .

Referring to the enlarged portion of FIG. 18 , it can be seen that the interface between the tray 50 and the mask 100 having a surface roughness Ra of 50 nm or less is in close contact without an air gap AG. Laser welding may be performed by irradiating the laser L to the welding portion WP of the mask 100 .

On the other hand, the tray 50 made of a wafer material may be opaque to the laser (L) light. Accordingly, the tray 50 of the present invention has a laser passing through hole ( 51) is characterized in that it is formed.

Referring to (a) and (b) of Figure 19, the laser passing hole 51 may be formed in the tray 50 to correspond to the position and number of the welding portion (WP). Since a plurality of welding portions WP are disposed along a predetermined interval in the edge or dummy DM portion of the mask 100 , a plurality of laser passage holes 51 may be formed along predetermined intervals to correspond thereto. For example, since a plurality of welding portions WP are disposed along a predetermined interval on both sides (left/right) dummy DM portions of the mask 100, the laser passage hole 51 also has the tray 50 on both sides (left / A plurality may be formed along a predetermined interval on the right side).

The laser passing hole 51 does not necessarily correspond to the position and number of the welding part. For example, welding may be performed by irradiating the laser L to only a part of the laser passing hole 51 . In addition, some of the laser passing holes 51 that do not correspond to the welding part may be used instead of the alignment mark when aligning the mask 100 and the tray 50 . If the material of the tray 50 is transparent to the laser (L) light, the laser passing hole 51 may not be formed.

A compression body M is provided on the tray 50 so that the mask 100 and the frame 200 (or the edge sheet part 221 and the first and second grid sheet parts 223 and 225 ) more closely contact each other. You can add more compression. In addition to the load by the weight of the compression body (M) may further include means for pressing the compression body (M). A through hole MH through which the laser L passes may be formed in the compression body M, and the forming area of the through hole MH may overlap with the forming area of the laser passing through hole 51 of the tray 50 . can The laser L may pass through the through hole MH and then through the laser through hole 51 of the tray 50 to be irradiated to the welding portion WP of the mask 100 . Laser welding should be performed as close to the edge of the frame 200 as possible to reduce the floating space between the mask 100 and the frame 200 as much as possible and increase adhesion.

The tray 50 and the mask 100 can be in close contact without an air gap AG, and the tray 50 and the mask ( 100 ), the mask 100 and the frame 200 (or, the edge sheet part 221 , and the first and second grid sheet parts 223 and 225 ) may be in closer contact with each other. Accordingly, the welding bead WB may be well generated between the mask 100 and the frame 200 by the laser L irradiation. The welding bead WB can be viewed as a part of the mask 100 molten, has the shape of a spot or a line, and is interposed to connect the mask 100 and the frame 200 integrally. Thus, as a result, welding can be performed well.

Next, referring to FIGS. 20A and 20B , the mask 100 may correspond to one mask cell region CR of the frame 200 . The mask 100 is placed in the mask cell region ( CR) can be matched. While controlling the position of the tray 50 , it is possible to check whether the mask 100 corresponds to the mask cell region CR through a microscope. When the tray 50 is loaded on the frame 200 (or the mask cell sheet part 220 ), the mask 100 is the tray 50 and the frame 200 (or the mask cell sheet part 220 ). It may be pressed by the tray 50 while being disposed therebetween.

Meanwhile, the lower support 70 may be further disposed under the frame 200 . The lower support 70 may have a size sufficient to fit into the hollow region R of the frame edge portion 210 and may have a flat plate shape. In addition, a predetermined support groove (not shown) corresponding to the shape of the mask cell sheet part 220 may be formed on the upper surface of the lower support body 70 . In this case, the edge sheet part 221 and the first and second grid sheet parts 223 and 225 are fitted into the support grooves, so that the mask cell sheet part 220 can be more well fixed.

The lower support 70 may press the opposite surface of the mask cell region CR to which the mask 100 contacts. That is, the lower support 70 may support the mask cell sheet 220 in the upper direction to prevent the mask cell sheet 220 from sagging in the lower direction during the bonding process of the mask 100 . At the same time, since the lower support 70 and the tray 50 press the edge and the frame 200 (or the mask cell sheet part 220) of the mask 100 in opposite directions, the mask 100 can be maintained without being disturbed.

In the present invention, the mask 100 corresponds to the mask cell region CR of the frame 200 only by attaching the mask 100 on the tray 50 and loading the tray 50 on the frame 200 . Since the process is completed, it is characterized in that no tensile force is applied to the mask 100 in this process.

Since the mask cell sheet unit 220 of the frame 200 has a thin thickness, when the mask cell sheet unit 220 is adhered to the mask cell sheet unit 220 while a tensile force is applied to the mask 100, the tensile force remaining in the mask 100 is applied to the mask. It acts on the cell sheet part 220 and the mask cell region CR, and may deform them. Therefore, the mask 100 must be adhered to the mask cell sheet 220 without applying a tensile force to the mask 100 . Thus, it is possible to prevent the frame 200 (or the mask cell sheet part 220 ) from being deformed by the tensile force applied to the mask 100 acting as tension on the frame 200 .

However, one problem arises when a frame-integrated mask is manufactured by adhering to the frame 200 (or the mask cell sheet 220) without applying a tensile force to the mask 100, and the frame-integrated mask is used in a pixel deposition process. can occur In the pixel deposition process performed at about 25 to 45° C., the mask 100 is thermally expanded by a predetermined length. Even with the mask 100 made of Invar material, the length may vary by about 1 to 3 ppm according to a temperature increase of about 10° C. to form an atmosphere for the pixel deposition process. For example, when the total length of the mask 100 is 500 mm, the length may be increased by about 5 to 15 μm. Then, the mask 100 is hit by its own weight or is deformed, such as stretched and twisted in a fixed state in the frame 200 , and an alignment error of the patterns P increases.

Accordingly, the present invention may correspond to and adhere to the mask cell region CR of the frame 200 at a temperature higher than room temperature, without applying a tensile force to the mask 100 . In the present specification, it is expressed that the mask 100 corresponds to the frame 200 and is adhered after the temperature of the process region is raised (ET) to the first temperature.

The “process region” may mean a space in which components such as the mask 100 and the frame 200 are located, and an adhesion process of the mask 100 is performed. The process region may be a space within a closed chamber or an open space. Also, when the frame-integrated mask is used in the OLED pixel deposition process, the “first temperature” may mean a temperature that is higher than or equal to the pixel deposition process temperature. Considering that the pixel deposition process temperature is about 25 to 45°C, the first temperature may be about 25 to 60°C. The temperature increase of the process region may be performed by installing a heating means in the chamber, or by installing a heating means around the process region.

Again, referring to FIG. 13 , after the mask 100 corresponds to the mask cell region CR, the temperature of the process region including the frame 200 may be increased (ET) to the first temperature. Alternatively, after the temperature of the process region including the frame 200 is increased (ET) to the first temperature, the mask 100 may correspond to the mask cell region CR. Although the drawing shows that only one mask 100 corresponds to one mask cell region CR, the temperature of the process region is increased to the first temperature after matching the masks 100 for each mask cell region CR. (ET) can also be done.

Since the conventional mask 10 of FIG. 1 includes six cells (C1 to C6), it has a long length, whereas the mask 100 of the present invention has a short length including one cell (C). The degree of distortion of pixel position accuracy (PPA) may be reduced. For example, assuming that the length of the mask 10 including the plurality of cells C1 to C6, ... is 1 m, and a PPA error of 10 μm occurs in the entire 1 m, the mask 100 of the present invention can make the above error range 1/n according to the relative length reduction [corresponding to the reduction in the number of cells (C)]. For example, if the length of the mask 100 of the present invention is 100 mm, since it has a length reduced from 1 m to 1/10 of the conventional mask 10, a PPA error of 1 μm occurs over the entire length of 100 mm. , there is an effect that the alignment error is significantly reduced.

On the other hand, if the mask 100 includes a plurality of cells C, and each cell C corresponds to each cell region CR of the frame 200, within a range in which an alignment error is minimized, The mask 100 may correspond to a plurality of mask cell regions CR of the frame 200 . Alternatively, the mask 100 having a plurality of cells C may correspond to one mask cell region CR. Even in this case, in consideration of the process time and productivity according to the alignment, it is preferable that the mask 100 includes as few cells C as possible.

In the case of the present invention, since it is only necessary to match one cell (C) of the mask 100 and check the alignment state, it is necessary to simultaneously correspond a plurality of cells (C: C1 to C6) and check the alignment state. Compared to the conventional method (see Fig. 2), the manufacturing time can be significantly reduced.

That is, the frame-integrated mask manufacturing method of the present invention corresponds to each of the cells C11 to C16 included in the six masks 100 to one cell region CR11 to CR16 and checks the alignment state, respectively. Through this process, the time can be significantly reduced compared to the conventional method of simultaneously matching the six cells C1 to C6 and checking the alignment status of the six cells C1 to C6 at the same time.

In addition, in the frame-integrated mask manufacturing method of the present invention, the product yield in the 30-step process of matching and aligning 30 masks 100 to 30 cell regions (CR: CR11 to CR56) is 6 cells (C1). ~C6) each containing 5 masks 10 (see Fig. 2 (a)) can be shown to be much higher than the conventional product yield in the process of 5 times to correspond and align with the frame 20. Since the conventional method of aligning six cells C1 to C6 in an area corresponding to six cells C at a time is a much cumbersome and difficult task, the product yield appears low.

Meanwhile, after the mask 100 corresponds to the frame 200 , the mask 100 may be temporarily fixed to the frame 200 with a predetermined adhesive interposed therebetween. Thereafter, an adhesion step of the mask 100 may be performed.

21 is a plan view [Fig. 21 (a)] and a side cross-sectional view [Fig. 21 ((a) of Fig. b)].

Referring to FIG. 21 , after the mask 100 is adhered correspondingly to the mask cell region CR11 , the mask 100 may be adhered correspondingly to the adjacent mask cell region CR12 . Although only two masks 100 are adhered to each other in FIG. 21 , the masks 100 may be adhered correspondingly to all the mask cell regions CR.

A form in which one edge of two adjacent masks 100 is adhered (formed by welding beads WB) appears on the upper surface of the first grid sheet portion 223 (or the second grid sheet portion 225 ). The width and thickness of the first grid sheet portion 223 (or the second grid sheet portion 225 ) may be formed to be about 1 to 5 mm, and in order to improve product productivity, the first grid sheet portion 223 [ Alternatively, it is necessary to reduce the overlapping width of the second grid sheet portion 225] and the edge of the mask 100 as much as possible to about 0.1 to 2.5 mm.

Since welding LW is performed on the mask cell sheet 220 without applying a tensile force to the mask 100 , the mask cell sheet 220 (or the edge sheet 221 , the first and second grid sheets) No tension is applied to the portions 223 and 225].

After one mask 100 is adhered to the frame 200 , the remaining masks 100 are sequentially matched to the remaining mask cells C, and the process of adhering to the frame 200 may be repeated. Since the mask 100 already adhered to the frame 200 can present the reference position, the time required for sequentially matching the remaining masks 100 to the cell region CR and checking the alignment state is significantly reduced. There are advantages to being In addition, the pixel position accuracy (PPA) between the mask 100 adhered to one mask cell region and the mask 100 adhered to the neighboring mask cell region does not exceed 3 μm, so that the alignment is clear. There is an advantage in that a mask for forming an OLED pixel can be provided.

22 is a schematic diagram illustrating a process of lowering (LT) the temperature of the process region after the mask 100 is adhered to the cell region CR of the frame 200 according to an embodiment of the present invention.

Next, referring to FIG. 22 , the temperature of the process region may be lowered (LT) to the second temperature. The “second temperature” may mean a temperature lower than the first temperature. Considering that the first temperature is about 25°C to 60°C, the second temperature may be about 20°C to 30°C on the assumption that it is lower than the first temperature, and preferably, the second temperature may be room temperature. The temperature drop of the process region may be performed by installing a cooling means in the chamber, installing a cooling means around the process zone, or naturally cooling to room temperature.

When the temperature of the process region is lowered (LT) to the second temperature, the mask 100 may be thermally contracted by a predetermined length. The mask 100 may be isotropically heat-shrinkable along all lateral directions. However, since the mask 100 is fixedly connected to the frame 200 (or, the mask cell sheet unit 220 ) by welding, the heat shrinkage of the mask 100 is self-tensive to the surrounding mask cell sheet unit 220 . (TS) will be approved. The mask 100 may be more tightly adhered to the frame 200 by the application of the self-tensile TS of the mask 100 .

In addition, since the temperature of the process region is lowered (LT) to the second temperature after each mask 100 is adhered to the corresponding mask cell region CR, all of the masks 100 undergo thermal contraction at the same time to cause the frame The problem that 200 is deformed or that the alignment error of the patterns P increases can be prevented. More specifically, even if the tension TS is applied to the mask cell sheet part 220 , since the plurality of masks 100 apply the tension TS in opposite directions to each other, the force is canceled and the mask cell sheet part At 220, no deformation occurs. For example, the first grid sheet part 223 between the mask 100 attached to the CR11 cell area and the mask 100 attached to the CR12 cell area moves to the right of the mask 100 attached to the CR11 cell area. The applied tension TS and the tension TS acting in the left direction of the mask 100 attached to the CR12 cell region may be offset. Thus, the frame 200 (or the mask cell sheet portion 220 ) due to the tension TS is deformed to be minimized, so that the alignment error of the mask 100 (or the mask pattern P) can be minimized. There is this.

23 is a schematic diagram illustrating an OLED pixel deposition apparatus 1000 using the frame-integrated masks 100 and 200 according to an embodiment of the present invention.

Referring to FIG. 23 , the OLED pixel deposition apparatus 1000 includes a magnet plate 300 in which a magnet 310 is accommodated and a coolant line 350 is disposed, and an organic material source 600 from a lower portion of the magnet plate 300 . ) and a deposition source supply unit 500 for supplying the .

A target substrate 900 such as glass on which the organic source 600 is deposited may be interposed between the magnet plate 300 and the source deposition unit 500 . The frame-integrated masks 100 and 200 [or FMMs] that allow the organic material source 600 to be deposited for each pixel may be disposed in close contact with or very close to each other on the target substrate 900 . The magnet 310 may generate a magnetic field and may be in close contact with the target substrate 900 by the magnetic field.

The deposition source supply unit 500 may supply the organic material source 600 while reciprocating left and right paths, and the organic material sources 600 supplied from the deposition source supply unit 500 may include patterns P formed on the frame-integrated masks 100 and 200 . ) and may be deposited on one side of the target substrate 900 . The deposited organic material source 600 passing through the pattern P of the frame-integrated masks 100 and 200 may act as the pixel 700 of the OLED.

In order to prevent non-uniform deposition of the pixel 700 due to the shadow effect, the pattern of the frame-integrated masks 100 and 200 may be inclined (S) (or formed in a tapered shape (S)). . Since the organic material sources 600 passing through the pattern diagonally along the inclined surface may also contribute to the formation of the pixel 700 , the pixel 700 may be deposited to have a uniform thickness as a whole.

Since the mask 100 is adhesively fixed to the frame 200 at a first temperature higher than the pixel deposition process temperature, even if the process temperature for pixel deposition is increased, the position of the mask pattern P has little effect, and the mask The PPA between 100 and the mask 100 adjacent thereto may be maintained so as not to exceed 3 μm.

24 is a schematic diagram illustrating a process of separating a mask from a frame-integrated mask according to an embodiment of the present invention. 24A is a plan view of two mask cells C11 and C12, and FIGS. 24B to 24D are cross-sectional views of FIG. 24A.

On the other hand, when a defect such as a foreign material interposed in the mask 100 adhered to the frame 200 or damage to the mask pattern P occurs, it is necessary to replace the mask 100 . Alternatively, even when the mask 100 is adhered to the frame 200 because the partial alignment of the mask pattern P is not clear, it is necessary to clarify the alignment by replacing only the mask 100 .

In the prior art [see FIG. 2 ], the stick mask 10 was separated from the frame 20 by applying a physical force to the stick mask 10 welded (W) to the frame 20 . For example, the stick mask 10 is torn off from the frame 20 using pliers, nippers, or the like. In this process, a force may be applied to the frame 20 to cause a slight deformation in the frame 20 . Even a slight deformation at the micrometer level may cause a problem of misalignment between the mask cells C: C1 to C6 of the stick masks 10 .

The present invention prevents the frame 200 from being deformed in the process of separating/replacing the mask 100 from the frame 200 , and attaching the mask 100 to the mask 100 in the process of reattaching the mask 100 to the frame 200 . A method of replacing the mask sets 100 - 1 , 100 - 2 , and 100 - 3 and the mask 100 capable of improving positioning accuracy by preventing deformation is proposed.

Referring to FIGS. 24A and 24B , the frame-integrated masks 100 and 200 to which the mask 100a to be replaced due to the occurrence of a defect is adhered are prepared. It is assumed that the mask 100a including the mask cell C11 is separated. It is assumed that the mask 100a is in a state of being bonded to the frame 200 (mask cell sheet portion 220) as the left edge 101a and the right edge 102a are welded to form the weld bead WB. Of course, all four corners of the mask 100 may be welded and adhered to the frame 200 (mask cell sheet unit 220). The corners need to be compressed.

After one edge 102a (right edge) of the mask 100a including the mask cell C11 is removed from the frame 200 , the other edge 101a (left edge) may be peeled off from the frame 200 . Specifically, one edge 102a of the mask 100a may be in a state of being adhered to the first grid sheet portion 223a that is a right edge of the mask cell region CR11. Therefore, when an external force SP is applied to one edge 102a of the mask 100a to remove it, the first grid sheet portion is caused by the adhesive force between the mask 100a and the frame 200 (the first grid sheet portion 223a). There is a problem that deformation occurs in the part of (223a). Therefore, it is necessary to remove the mask 100a after the frame 200 (first grid sheet portion 223a) is firmly fixed.

In order to firmly fix the frame 200 against the external force SP, the outer part of the one side edge 102a of the mask 100a to which the external force SP directly acts may be compressed. That is, the first grid sheet portion 223a to which the mask 100a is adhered and/or the left edge portion 101b of the mask 100b adjacent to the right side of the mask 100a may be compressed. As the upper and lower surfaces of the first grid sheet portion 223a and/or the left edge portion 101b of the mask 100b are compressed, they may be firmly fixed against the external force SP.

The upper surface of the first grid sheet portion 223a and the left edge portion 101b of the mask 100b may be compressed through the compression bar 260 at the upper portion. The lower surface of the first grid sheet portion 223a and the left edge portion 101b of the mask 100b may be compressed through a compression bar (not shown) at the lower portion. 24, the compression bar 260, the first grid sheet portion 223a, and the end contacting the mask 100b are illustrated as having a step, but this is an exaggerated thickness and width for convenience of explanation. The thickness of the mask 100b is about several μm, and since the welding bead WB is included in the mask 100 without almost protruding, the end of the compression bar 260 may be understood to be flat.

On the other hand, the support 250 for supporting the frame 200 may be used in the lower portion without using a compression bar (not shown). The support 250 may correspond to the lower support 70 described above with reference to FIG. 20 . The support 250 may support the lower portion of the frame 200 . The supporter 250 may have a plate shape to support the frame 200 , and may be formed to be approximately equal to or smaller than the area of the frame 200 . The support 250 is preferably made of the same material as the frame 200 in consideration of the coefficient of thermal expansion, but a material having high rigidity may be used. Frame support grooves 251 and 253 corresponding to the shape of the frame 200 may be formed in the upper portion of the support 250 . The frame support grooves 251 and 253 include an edge support groove 251 and a grid support groove 253 . The edge support groove 251 may be a groove having a shape corresponding to the edge frame part 210 and the edge sheet part 221 . The grid support grooves 253 may be formed in a first direction (x-direction) and a second direction (y-direction) corresponding to the first and second grid sheet parts 223 and 225 . The grid support groove 253 may be formed in a straight shape so that both ends thereof may be connected to the edge support groove 251 . Similar to the first and second grid sheet parts 223 and 225 , the respective grid support grooves 253 may be equally spaced. The shape of the cross section perpendicular to the longitudinal direction of the grid support groove 253 may be a groove having a shape corresponding to the first and second grid sheet parts 223 and 235 .

Since the thickness of the edge frame part 210 and the edge sheet part 221 may be thicker than the thickness of the first and second grid sheet parts 223 and 225 , the edge support groove 251 is deeper than the grid support groove 253 . It may be formed to a thickness.

The frame 200 may be received and supported in the frame support grooves 251 and 253 of the support 250 . In a state in which the frame 200 is seated and supported on the supporter 250 , the uppermost surface of the frame 200 , that is, the surface to which the mask 100 is adhered, may have the same or higher position than the uppermost surface of the supporter 250 . Thus, the support 250 can support only the frame 200 without affecting the mask 100 .

Next, referring to FIG. 24C , an external force SP may be applied to one edge 102a of the mask 100a to be removed from the first grid sheet part 223a. At this time, in the upper part, the compression bar 260 presses the upper surface of the first grid sheet part 223a outside of the one edge 102a and the upper surface of the left edge part 101b of the mask 100b, and in the lower part, the support 250 ) receives and stably supports the frame 200 (the first grid sheet portion 223a) in the support grooves 251 and 253, so even if an external force SP is applied, the frame 200 (the first grid sheet portion ( 223a)] can be prevented from being deformed.

In addition, since the pressing bar 260' is also pressing the other edge 101a and the edge sheet portion 221a of the mask 100a, only the right edge 102b can be peeled off by the external force SP. Of course, a compression bar (not shown) may apply compression to the upper and lower edges in addition to the other edge 101a.

Next, referring to (d) of FIG. 24 , an external force SP may be applied to the other edge 101a of the mask 100a to be peeled off from the edge sheet portion 221a. At this time, in the upper part, the compression bar 260 "compresses the upper surface of the edge sheet part 221a which is the outer side of the other edge 101a, and in the lower part, the support body 250 is attached to the support grooves 251 and 253 and the frame 200 ) (border sheet portion 221a) is accommodated and stably supported, so that even when an external force SP is applied, it is possible to prevent the frame 200 (edge sheet portion 221a) from being deformed.

After the mask 100a is separated from the frame 200 , a new mask 100 may correspond to the cell region CR11 of the frame 200 and be adhered thereto. Corresponding and bonding processes are the same as described above.

On the other hand, after the mask 100a is separated from the frame 200, a burr generated in the laser welding process, a residue of the welding bead WB, etc. may remain on the frame 200 [Fig. See weld bead (WB) in d)]. When a new mask 100 is matched on the residue of such smearing and the weld bead WB and the weld bead WB is regenerated by welding, the adhesion between the mask 100 and the frame 200 is lowered, so that the weld bead WB is lowered. may not be created properly. This is because, as described above with reference to FIG. 17 , the mask 100 and the frame 200 may not be in close contact with each other due to the remaining material and an air gap may exist. In addition, there may be problems such as deformation of the mask 100 or more severe wrinkles due to residual material in the process of bonding the mask 100 to the frame 200 .

Therefore, in the present invention, the mask sets 100-1, 100-2, 100 in which the welding parts WP-1, WP-2, WP-3, ... are formed at different positions in the process of replacing the mask 100. -3, ...). Hereinafter, a mask set including three types of masks 100-1, 100-2, and 100-3 will be described as an example, but the number of types of masks is not limited. In addition, hereinafter, an example of forming the welding portions WP on both sides of the mask 100 and performing laser welding will be described.

25 is a schematic diagram illustrating mask sets 100-1, 100-2, 100-3, ... according to an embodiment of the present invention.

Referring to (a) of FIG. 25 , welding portions WP-1 may be formed at a predetermined interval in the dummy DM on both sides of the first mask 100-1. The first mask 100 - 1 may be understood as a mask 100 that is initially adhered to the cell region CR of the frame 200 . The first masks 100 - 1 may be adhered to the plurality of cell regions CR of the frame 200 in the first and second directions.

Next, referring to FIG. 25B , the welding portions WP-2 may be formed at a predetermined interval in the dummy DM on both sides of the second mask 100-2. It is preferable that the interval between the welding portions WP-1 and WP-2 of the first mask 100-1 and the second mask 100-2 is the same. However, the position where the welding part WP-1 of the first mask 100-1 is formed is different from the position where the welding part WP-2 of the second mask 100-2 is formed. For example, the welding part WP-2 may be formed at a position shifted downward from the position of the welding part WP-1. In order for the welding part WP-2 to be disposed at the shifted position, the anti-wrinkle patterns 150 , 160 , and 170 of the second mask 100 - 2 are also the anti-wrinkle patterns of the first mask 100 - 1 . It can be shifted down compared to the position of (150, 160, 170). Thus, the welding part WP-2 located at the center of the anti-wrinkle patterns 150 , 160 , and 170 may be disposed at a shifted position.

Next, referring to FIG. 25C , welding portions WP-3 may be formed at a predetermined interval in the dummy DM on both sides of the third mask 100-3. Intervals between the welding portions WP-1, WP-2, and WP-3 of the first mask 100-1, the second mask 100-2, and the third mask 100-3 are preferably the same. However, the position where the welding part WP-1 of the first mask 100-1 and the welding part WP-2 of the second mask 100-2 are formed, and the welding part WP of the third mask 100-3 The positions where -3) is formed are different. For example, the welding part WP-3 may be formed at a position shifted downward from the position of the welding part WP-2. In order for the welding part WP-3 to be disposed at the shifted position, the anti-wrinkle patterns 150 , 160 , and 170 of the third mask 100-3 are also the anti-wrinkle patterns of the second mask 100-2. It can be shifted down compared to the position of (150, 160, 170). Thus, the welding part WP-3 positioned at the center of the anti-wrinkle patterns 150 , 160 , and 170 may be disposed at a shifted position.

26 is a schematic view showing a state in which the mask is replaced in the frame-integrated mask according to an embodiment of the present invention. In FIG. 26 , the masks 100 adhered to the two cell regions CR will be described as an example.

FIG. 26A shows the first frame-integrated mask in which the first mask 100 - 1 is adhered to the cell regions CR of the frame 200 . As the laser is irradiated to the welding portion WP-1 of the first mask 100-1, a welding bead WB-1 is formed between the first masks 100-1 and the frame 200 to form the first mask ( 100-1) and the frame 200 may be integrally connected. In this frame-integrated mask, when a defect occurs, such as a foreign material interposed in the mask 100 adhered to the frame 200 or damage to the mask pattern P, the mask 100 must be replaced. The separation process is the same as described above with reference to FIG. 24 .

Referring to FIG. 26B , it can be seen that the first mask 100 - 1 is separated from the first cell region CR11 and the second mask 100 - 2 is adhered. As the laser is irradiated to the welding portion WP-2 of the second mask 100-2, a welding bead WB-2 is formed between the second mask 100-2 and the frame 200 to form the second mask ( 100-2) and the frame 200 may be integrally connected. At this time, the position where the welding bead WB-2 of the second mask 100-2 is formed is different from the position where the welding bead WB-1 of the first mask 100-1 before replacement is formed. Therefore, the weld bead WB-2 is not affected by the burr of the weld bead WB-1 or the weld bead WB-1 remaining on the frame 200, and is in close contact with the second It may be stably formed between the mask 100 - 2 and the frame 200 .

Referring to (c) of FIG. 26 , a situation arises in which replacement of the second mask 100 - 2 is necessary, so that the second mask 100 - 2 is separated from the first cell region CR11, and the third mask ( 100-3) can be checked. As the laser is irradiated to the welding portion WP-3 of the third mask 100-3, a welding bead WB-3 is formed between the third mask 100-3 and the frame 200 to form the third mask ( 100-3) and the frame 200 may be integrally connected. At this time, the position where the welding bead WB-3 of the third mask 100-3 is formed is the welding bead WB-1 of the first mask 100-1 and the second mask 100-2 before replacement. It is different from the position where WB-2) is formed. Therefore, the weld bead WB-3 is affected by the burr of the weld bead WB-1 and WB-2 remaining on the frame 200 or the position of the weld bead WB-1 and WB-2. It may be stably formed between the third mask 100 - 3 and the frame 200 that are in close contact without receiving the .

As described above, in the present invention, in the process of replacing the mask 100, the mask sets 100-1, 100-2, 100-3, ...), there is an advantage that the weld bead WB can be stably formed between the masks 100 before and after replacement and the frame 200 .

Although the present invention has been illustrated and described with reference to preferred embodiments as described above, it is not limited to the above embodiments and is not limited to the above-described embodiments, and various methods can be made by those of ordinary skill in the art to which the invention pertains without departing from the spirit of the present invention. Transformation and change are possible. Such modifications and variations are intended to fall within the scope of the present invention and the appended claims.

50: tray
51: laser passing hole
70: lower support
100: mask
100-1, 100-2, 100-3, ...: Mask Set
110: mask film
150, 160, 160', 170: anti-wrinkle pattern
151, 161, 161', 171: unit anti-wrinkle pattern
190: buffer pattern
191, 192: unit buffer pattern
200: frame
210: border frame portion
220: mask cell sheet portion
221: border sheet portion
223: first grid sheet portion
225: second grid sheet portion
1000: OLED pixel deposition device
C: cell, mask cell
CR: mask cell area
DM: dummy, mask dummy
ET: Raise the temperature of the process region to the first temperature
L: laser
LT: lowering the temperature of the process zone to the second temperature
M: upper pressing body
R: Hollow area of the border frame part
P: mask pattern
TS: tension
W: Weld
WB: Weld Bead
WP: Weld
WPC: Weld Center Point

Claims (22)

A mask set used for a frame-integrated mask in which a plurality of masks and a frame supporting the masks are integrally formed, the mask set comprising:
The mask set includes a plurality of masks including a mask cell on which a plurality of mask patterns are formed, and a dummy around the mask cell,
A mask set, wherein each mask is formed with a plurality of welds spaced apart from each other in at least a part of the dummy, and a position where the welds are formed is different for each mask. According to claim 1,
A mask set, wherein a weld is formed at a shifted position for each mask. According to claim 1,
A mask set in which an anti-wrinkle pattern is formed around each weld portion of the mask spaced apart from each other by a predetermined distance. 4. The method of claim 3,
A mask set, wherein an anti-wrinkle pattern is formed at a shifted position for each mask. 4. The method of claim 3,
The anti-wrinkle pattern is a mask set that occupies at least a circumferential area concentric with the weld and has a larger diameter than the weld. 4. The method of claim 3,
The mask set further comprising a plurality of buffer patterns formed to form a mutual gap between the anti-wrinkle pattern and the mask pattern, the buffer pattern having a width greater than the width of the mask pattern. A method of replacing a mask in a frame-integrated mask in which a plurality of masks and a frame supporting the masks are integrally formed, comprising:
(a) providing a frame-integrated mask in which a plurality of masks are adhered to at least a portion of an upper portion of the frame having a plurality of mask cell regions;
(b) separating the first mask adhered on the predetermined mask cell region from the frame;
(c) attaching the second mask to the frame by irradiating a laser to the welding part of the second mask, corresponding to the predetermined mask cell area;
including,
Each of the first mask and the second mask includes a mask cell on which a plurality of mask patterns are formed, and a dummy around the mask cell, and a plurality of welding portions are formed at least in part of the dummy with a gap therebetween, each of the first mask and The second mask is a method of replacing a mask of a frame-integrated mask, wherein the welding portion is formed in a different position. 8. The method of claim 7,
The frame includes a mask cell sheet portion having an edge frame portion and a plurality of mask cell regions and connected to the edge frame portion. 9. The method of claim 8,
The mask cell sheet part includes a plurality of mask cell regions along at least one of a first direction and a second direction perpendicular to the first direction. 9. The method of claim 8,
The mask cell sheet part,
edge sheet portion;
at least one first grid sheet portion extending in a first direction and having both ends connected to the edge sheet portion; and
At least one second grid sheet portion extending in a second direction perpendicular to the first direction, intersecting the first grid sheet portion, and having both ends connected to the edge sheet portion
Including, a mask replacement method of the frame-integrated mask. 8. The method of claim 7,
A mask replacement method of a frame-integrated mask, wherein each mask corresponds to each mask cell region. 8. The method of claim 7,
In step (b), the mask replacement method of the frame-integrated mask, wherein the first mask is separated from the frame by pressing the outer portion of at least one edge of the first mask, and applying an external force to the one edge of the mask. 13. The method of claim 12,
In step (b), the mask replacement method of the frame-integrated mask by pressing the upper surface and the lower surface of the frame disposed on the outside of the first mask side edge. 14. The method of claim 13,
A mask replacement method of a frame-integrated mask, in which the upper surface of the edge of the frame corresponding to one edge of the first mask is pressed with a pressing bar. 15. The method of claim 14,
A method of replacing a mask for a frame-integrated mask, wherein a support having a frame support groove corresponding to the shape of the frame is disposed in the lower portion of the frame. 8. The method of claim 7,
In step (b), one edge of the first mask is removed from the frame by applying an external force to one edge of the first mask, and then the other edge is removed from the frame by applying an external force to the other edge opposite to one side of the first mask. , separating the first mask from the frame, the mask replacement method of the frame-integrated mask. 8. The method of claim 7,
In step (c), a welding bead is formed in a portion of the welding portion of the second mask irradiated with a laser, and the welding bead is a method for replacing the mask of the frame-integrated mask, which mediates the second mask and the frame to be integrally connected. . 8. The method of claim 7,
A method of replacing a mask of a frame-integrated mask, wherein the position of the welding portion of the second mask is formed at a position shifted from the welding portion of the first mask. 8. The method of claim 7,
A mask replacement method for a frame-integrated mask, wherein an anti-wrinkle pattern is formed around each weld portion of the mask spaced apart by a predetermined distance. 20. The method of claim 19,
The method of replacing the mask of the frame-integrated mask, wherein the position of the anti-wrinkle pattern of the second mask is formed at a position shifted from the anti-wrinkle pattern part of the first mask. 20. The method of claim 19,
The anti-wrinkle pattern is a mask replacement method for a frame-integrated mask, wherein the anti-wrinkle pattern occupies at least a circumferential area that is concentric with the weld and has a larger diameter than the weld. 20. The method of claim 19,
A mask replacement method for a frame-integrated mask, further comprising a plurality of buffer patterns formed to form a mutual gap between the anti-wrinkle pattern and the mask pattern and having a width greater than the width of the mask pattern.

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