KR20190134005A - Apparatus and method for cutting substrate - Google Patents

Abstract

According to an embodiment of the present invention, a substrate cutting apparatus includes: a scribing unit pressurizing a scribing wheel to form a scribing line on a substrate; a dummy removing unit removing a dummy portion along the scribing line formed on the dummy portion of the substrate by the scribing unit; a cut surface measuring unit measuring a shape of a cut surface of the dummy portion removed by the dummy removing unit; and a control unit adjusting pressurizing force of the scribing wheel pressurized on the substrate based on the shape of the cut surface of the dummy portion measured by the cut surface measuring unit.

Description

Substrate cutting device and substrate cutting method {APPARATUS AND METHOD FOR CUTTING SUBSTRATE}

The present invention relates to a substrate cutting device and a substrate cutting method for cutting a substrate.

Generally, liquid crystal display panels, organic electroluminescent display panels, inorganic electroluminescent display panels, transmissive projector substrates, and reflective projector substrates used in flat panel displays are brittle mother glass panels (hereinafter, referred to as substrates) such as glass. ) Is cut into a predetermined size from the unit glass panel (hereinafter referred to as 'unit substrate').

The process of cutting a substrate into a unit substrate is performed by moving the scribing wheel and / or the substrate while pressing the scribing wheel made of a material such as diamond along the cut line to be cut. And a scribing process to form a line.

During the process of cutting the substrate into unit substrates, it is necessary to remove dummy portions (cullets, ie, invalid regions which are discarded after being cut without being used as effective regions of the unit substrate) which are not included in the unit substrate. .

For example, Korean Patent Laid-Open Publication No. 10-2003-0069195 uses a wheel tip to form a scribing line on a glass substrate, and then holds a cut piece of a liquid crystal mother substrate by using a chuck installed on a support device. It is proposed to separate and discard.

On the other hand, in the scribing step, since the pressing force for pressing the scribing wheel against the substrate is arbitrarily set, there is a problem in that the scribing line is not properly formed on the substrate. If the scribing line is not properly formed on the substrate, there is a problem that when removing the dummy portion from the substrate, debris or chips are generated from the substrate and the quality of the cut surface of the substrate is degraded.

Republic of Korea Patent Publication No. 10-2003-0069195

The present invention is to solve the above problems of the prior art, an object of the present invention, by adjusting the pressing force of the scribing wheel based on the shape of the cut surface of the dummy portion removed from the substrate, the characteristics of the scribing wheel It is an object of the present invention to provide a substrate cutting apparatus and a substrate cutting method capable of maintaining the quality of the cut surface of the substrate uniformly and consistently even when this change or the characteristics of the substrate change.

Substrate cutting device according to an embodiment of the present invention for achieving the above object, the scribing unit for pressing the scribing wheel to the substrate to form a scribing line; A dummy removal unit for removing the dummy portion from the substrate along a scribing line formed in the dummy portion of the substrate by the scribing unit; A cut plane measuring unit measuring a cut surface shape of the dummy portion removed by the dummy removing unit; And it may include a control unit for adjusting the pressing force of the scribing wheel pressed on the substrate based on the cut surface shape of the dummy portion measured by the cut surface measuring unit.

The control unit may adjust the pressing force of the scribing wheel based on the depth of penetration of the scribing wheel into the substrate measured from the cut surface shape of the dummy portion.

The control unit includes an image conversion module for converting an image of the cut surface of the dummy portion using a binarization algorithm; A counting module for counting the number of pixels extending in the thickness direction of the dummy portion in the image converted by the image conversion module; It may include a penetration depth calculation module for histogramizing the number of pixels counted by the counting module to calculate the penetration depth of the scribing wheel.

The image conversion module may detect only the component extending in the thickness direction of the dummy portion among the pixel elements in the image as the white pixels, and the counting module may count the number of white pixels detected by the image conversion module.

The counting module may count the number of white pixels having a length equal to or greater than a reference length in the thickness direction of the dummy portion.

The control unit may further comprise a thickness measuring module for measuring the thickness of the dummy part from the image of the cut surface of the dummy part.

The dummy removal unit includes a clamp module including a clamp member for holding a dummy portion; A support for supporting the clamp module; A rotation module for rotating the support about the central axis of the support; A horizontal moving module for moving the support horizontally; And a vertical moving module for vertically moving the support.

The clamp module may be provided in plurality in the support, and the plurality of clamp modules may be installed in the support so as to be movable in the longitudinal direction of the support so that the distance between the plurality of clamp modules may be adjusted.

The clamp module includes a base member; A body installed to be movable relative to the base member and to which the clamp member is mounted; And a position adjuster for moving the body relative to the base member.

The scribing unit includes a frame extending in a direction orthogonal to the direction in which the substrate is conveyed, and a scribing head mounted on the frame so as to be movable in the extending direction of the frame and having a scribing wheel, and measuring a cut surface The unit may be installed in the scribing head and move together with the scribing head in the extending direction of the frame to measure the cut surface shape of the dummy part held by the clamp member of the dummy removing unit.

In addition, the substrate cutting method according to an embodiment of the present invention for achieving the above object, (a) by pressing the scribing wheel to the dummy portion of the substrate with a first pressing force to form a scribing line on the dummy portion step; (b) cutting and separating the dummy part in which the scribing line is formed in step (a); (c) imaging the cut surface of the dummy portion cut in step (b); (d) measuring the penetration depth of the scribing wheel from the image of the cut surface of the dummy portion photographed in step (c); (e) determining whether the penetration depth of the scribing wheel measured in step (d) is outside the preset reference range; And (f) pressing the substrate with a second pressing force different from the first pressing force when the penetration depth of the scribing wheel measured in step (d) is outside the reference range to form a scribing line on the substrate. Can be.

(d) measuring the penetration depth of the scribing wheel comprises converting an image of the cut surface of the dummy portion using a binarization algorithm; Counting the number of pixels having a length equal to or greater than a reference length in the thickness direction of the dummy portion in the converted image; Histogram the number of counted pixels; And measuring the penetration depth of the scribing wheel from the histogram.

According to the substrate cutting apparatus and the substrate cutting method according to the embodiment of the present invention, even if the characteristics of the scribing wheel, such as the wear of the scribing wheel changes or the characteristics of the substrate changes, the pressing force of the scribing wheel By appropriately adjusting, the penetration depth of the scribing wheel can be kept constant. Therefore, even when the characteristics of the scribing wheel change or the characteristics of the substrate change, the quality of the cut surface of the substrate can be kept uniform and constant.

In addition, according to the substrate cutting apparatus and the substrate cutting method according to an embodiment of the present invention, the quality of the cut surface is measured by using a dummy portion to be discarded after cutting, the pressing force of the scribing wheel based on the measured quality of the cut surface Since the process of cutting the substrate can be carried out in earnest after adjusting the appropriately, the process of cutting the substrate can be performed more smoothly and efficiently.

1 and 2 are diagrams schematically showing a substrate cutting apparatus according to an embodiment of the present invention.
3 is a perspective view schematically showing a dummy removal unit of a substrate cutting device according to an embodiment of the present invention.
4 and 5 are schematic views of the clamp module of the dummy removal unit of the substrate cutting device according to the embodiment of the present invention.
6 is a perspective view schematically showing the clamp module of the dummy removal unit of the substrate cutting device according to the embodiment of the present invention.
7 and 8 are schematic views illustrating a cleaning unit of a substrate cutting apparatus according to an exemplary embodiment of the present invention.
9 and 10 are diagrams schematically illustrating a dummy removing unit and a cut plane measuring unit of a substrate cutting apparatus according to an embodiment of the present invention.
11 is a control block diagram of a substrate cutting apparatus according to an embodiment of the present invention.
12 is a cross-sectional view schematically showing a cut surface of a dummy portion of a substrate cut by the substrate cutting device according to the embodiment of the present invention.
13 is an image schematically showing a cut surface of a dummy portion of a substrate cut by a substrate cutting device according to an embodiment of the present invention.
14 is an image schematically showing an image resulting from converting an image of a cut surface of a dummy portion of a substrate cut by the substrate cutting device according to an embodiment of the present invention.
FIG. 15 is a graph schematically illustrating a result of histogramizing the number of pixels counted in the image of FIG. 14.
16 to 22 are views sequentially illustrating the operation of the first transfer unit, the scribing unit, the dummy removal unit and the second transfer unit of the substrate cutting device according to an embodiment of the present invention.
23 and 24 are flowcharts schematically illustrating a substrate cutting method according to an embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings, a substrate cutting apparatus and a substrate cutting method according to an embodiment of the present invention will be described.

The object to be cut by the substrate cutting device and the substrate cutting method according to an embodiment of the present invention may be a bonded substrate to which the first substrate and the second substrate are bonded. For example, the first substrate may include a thin film transistor, and the second substrate may include a color filter. In contrast, the first substrate may include a color filter, and the second substrate may include a thin film transistor.

Hereinafter, the bonded substrate is simply referred to as a substrate, the surface of the first substrate exposed to the outside is called the first surface, and the surface of the second substrate exposed to the outside is called the second surface.

In addition, the direction in which the substrate to be subjected to the substrate cutting process is transferred is defined as the Y-axis direction, and the direction perpendicular to the direction in which the substrate is transferred (the Y-axis direction) is defined as the X-axis direction. The direction perpendicular to the X-Y plane on which the substrate is placed is defined as the Z-axis direction.

As shown in FIGS. 1 and 2, the substrate cutting apparatus according to the embodiment of the present invention may include a scribing unit 30 and a first transfer for transferring the substrate S to the scribing unit 30. The unit 10, the second transfer unit 20 for transferring the substrate S from the scribing unit 30 to a subsequent process, and the dummy removal unit 40 disposed adjacent to the scribing unit 30. ), A cutting plane measuring unit 70 for measuring the cut surface shape of the dummy portion removed by the dummy removing unit 40, and a control unit 90 (Fig. 4 and Fig., Controlling the operation of the components of the substrate cutting device). 5).

The scribing unit 30 is configured to form scribing lines in the X-axis direction on the first and second surfaces of the substrate S, respectively.

The scribing unit 30 includes a first frame 31 extending in the X-axis direction, a first scribing head 32 mounted to the first frame 31 so as to be movable in the X-axis direction, and A second frame 33 extending in the X-axis direction parallel to the first frame 31 below the first frame 31 and a second frame movably installed in the X-axis direction on the second frame 33. It may include a crushing head 34. The first and second scribing heads 32 and 34 and the first and second frames 31 and 33 are connected to the first and second scribing heads 32 and 34, respectively. 2 may be provided with a linear moving mechanism for moving the scribing heads 32 and 34 in the X-axis direction. For example, the linear movement mechanism may be composed of an actuator using pneumatic or hydraulic pressure, a linear motor operated by electromagnetic interaction, or a ball screw mechanism.

A plurality of first scribing heads 32 may be mounted to the first frame 31 in the X-axis direction, and a plurality of second scribing heads 34 may be mounted to the second frame 33 in the X-axis direction. Can be mounted. A space through which the substrate S passes may be formed between the first frame 31 and the second frame 33. The first frame 31 and the second frame 33 may be manufactured and assembled as separate members, or may be manufactured integrally.

The first scribing head 32 and the second scribing head 34 may be disposed to face each other in the Z-axis direction.

Wheel holders 35 holding the scribing wheel 351 may be installed in the first and second scribing heads 32 and 34. The scribing wheel 351 mounted to the first scribing head 32 and the scribing wheel 351 mounted to the second scribing head 34 may be disposed to face each other in the Z-axis direction. have.

The pair of scribing wheels 351 may be pressed onto the first and second surfaces of the substrate S, respectively. The first and second scribing heads 32 and 34 are relative to the substrate S while the pair of scribing wheels 351 are pressed against the first and second surfaces of the substrate S, respectively. By moving in the X-axis direction, scribing lines may be formed on the first and second surfaces of the substrate S in the X-axis direction.

Meanwhile, the first and second scribing heads 32 and 34 may be configured to be movable in the Z-axis direction with respect to the first and second frames 31 and 33, respectively. To this end, between the first and second scribing heads 32 and 34 and the first and second frames 31 and 33 are connected to the first and second scribing heads 32 and 34, respectively. Head moving modules 38 and 39 for moving the first and second scribing heads 32 and 34 in the Z-axis direction may be provided. For example, the head movement modules 38 and 39 may be equipped with actuators using pneumatic or hydraulic pressure, linear motors actuated by electromagnetic interaction, or linear movement mechanisms such as ball screw mechanisms.

As the first and second scribing heads 32 and 34 move in the Z-axis direction with respect to the first and second frames 31 and 33, respectively, the pair of scribing wheels 351 moves to the substrate ( It may be pressed against S or spaced apart from the substrate S. FIG. Then, by adjusting the degree of movement of the first and second scribing heads 32 and 34 in the Z-axis direction, the pressing force applied to the substrate S by the pair of scribing wheels 351 is adjusted. Can be. In addition, the first and second scribing heads 32 and 34 are moved in the Z-axis direction so that the cutting depth (penetration depth) of the pair of scribing wheels 351 to the substrate S is increased. Can be adjusted.

The first transfer unit 10 includes a plurality of belts 11 for supporting the substrate S, a gripping member 12 for holding a trailing end of the substrate S supported on the plurality of belts 11, A support bar 13 connected to the holding member 12 and extending in the X-axis direction, a first guide rail 14 connected to the support bar 13 and extending in the Y-axis direction, and a scribing unit 30. It may include a first plate 15 disposed adjacent to) to support or absorb and support the substrate (S).

The plurality of belts 11 may be spaced apart from each other in the X-axis direction. Each belt 11 is supported by a plurality of pulleys 111, and at least one of the plurality of pulleys 111 may be a driving pulley that provides a driving force for rotating the belt 11.

Between the support bar 13 and the first guide rail 14 may be provided with an actuator using pneumatic or hydraulic pressure, a linear motor operated by electromagnetic interaction, or a linear moving mechanism such as a ball screw mechanism. Therefore, as the support bar 13 is moved in the Y-axis direction by the linear movement mechanism in the state where the holding member 12 holds the substrate S, the substrate S can be transferred in the Y-axis direction. In this case, the plurality of belts 11 may stably support the substrate S while rotating in synchronization with the movement of the gripping member 12.

The holding member 12 may be a clamp for pressing and holding the substrate S. As another example, the gripping member 12 may be configured to adsorb the substrate S by having a vacuum hole connected to a vacuum source.

The first plate 15 may be configured to support or adsorb the substrate S. For example, a plurality of slots connected to the gas supply source and the vacuum source may be formed on the surface of the first plate 15. When gas is supplied from the gas source to the plurality of slots of the first plate 15, the substrate S may be lifted from the first plate 15. In addition, when the gas is sucked through the plurality of slots of the first plate 15 by the negative pressure formed by the vacuum source, the substrate S may be adsorbed onto the first plate 15.

In a state in which the substrate S is lifted from the first plate 15, the substrate S may be moved without friction with the first plate 15. In addition, in the process of forming the scribing lines on the first and second surfaces of the substrate S, the substrate S may be absorbed and fixed to the first plate 15.

The second transfer unit 20 is disposed adjacent to the scribing unit 30 and is adjacent to the second plate 25 and the second plate 25 for supporting or adsorbing and supporting the adsorption substrate S. It may include a conveying belt 21 and a moving device 26 for reciprocating the second plate 25 and the conveying belt 21 in the Y-axis direction. The moving device 26 serves to move the second plate 25 and the transfer belt 21 reciprocally in the Y-axis direction along the second guide rail 24 extending in the Y-axis direction. As the moving device 26, a linear moving mechanism such as an actuator using pneumatic or hydraulic pressure, a linear motor operated by electromagnetic interaction, or a ball screw mechanism may be applied.

The second plate 25 and the transfer belt 21 may be configured to be movable together in the Y-axis direction. That is, the second plate 25 and the transfer belt 21 may be configured to be movable together in a direction parallel to the direction in which the substrate S is transferred (Y-axis direction).

When scribing lines are formed on the first and second surfaces of the substrate S by the scribing unit 30, the second plate 25 is moved toward the first plate 15, and First and second scribing heads 32 and 34 may be located between the first plate 15 and the second plate 25. When the scribing lines are formed on the first and second surfaces of the substrate S by the scribing unit 30, the second plate 25 is moved toward the first plate 15, so that the substrate S may be stably supported on both the first plate 15 and the second plate 25.

The conveying belt 21 may be provided in plurality, and the plurality of conveying belts 21 may be spaced apart from each other in the X-axis direction. Each transfer belt 21 is supported by a plurality of pulleys 211, at least one of the plurality of pulleys 211 may be a drive pulley that provides a driving force for rotating the transfer belt 21.

The second plate 25 may be configured to support or adsorb the substrate S. For example, a plurality of slots connected to the gas supply source and the vacuum source may be formed on the surface of the second plate 25. When gas is supplied from the gas source to the plurality of slots of the second plate 25, the substrate S may be lifted from the second plate 25. In addition, when the gas is sucked through the plurality of slots of the second plate 25 by the negative pressure formed by the vacuum source, the substrate S may be adsorbed onto the second plate 25.

In the process of transferring the substrate S to the second plate 25, gas is supplied to the slot of the second plate 25, whereby the substrate S can be moved without friction with the second plate 25. Can be.

In addition, in the process of forming the scribing lines on the first and second surfaces of the substrate S, the adsorption substrate S may be absorbed and fixed to the second plate 25.

After the scribing lines are formed on the first and second surfaces of the substrate S, respectively, in the state where the substrate S is adsorbed to the first plate 15 and the second plate 25, the second As the plate 25 is moved away from the first plate 15, the substrate S may be divided based on the scribing line.

Meanwhile, in the process of moving the substrate S from the second plate 25 to the subsequent process, gas is supplied to the slot of the second plate 25, whereby the substrate S is the second plate 25. Can be moved without friction.

As shown in FIGS. 3 to 5, the dummy removal unit 40 includes a dummy portion (cullet, ie, located at the edge of the leading end of the substrate S and the edge of the trailing end of the substrate S). The non-effective region, which is not used as a unit substrate and is discarded after being cut, is held and removed from the substrate S. FIG.

The dummy removal unit 40 may be disposed between the first transfer unit 10 and the second transfer unit 20.

The dummy removal unit 40 includes the support 41 extending in the X-axis direction, the clamp module 42 disposed on the support 41, and the support 41 with the central axis (X-axis direction and the support 41). A parallel module), a rotation module 43 for rotating the center, a horizontal moving module 44 for moving the support 41 in the Y-axis direction, and a vertical moving module for moving the support 41 in the Z-axis direction ( 45).

The rotary module 43 may be configured as a rotary motor connected to the central axis of rotation of the support 41 through a rotary shaft. The rotary module 43 may include a power transmission mechanism such as a link or a belt provided between the rotary shaft of the rotary motor and the support 41.

The horizontal movement module 44 or the vertical movement module 45 may be configured as a linear movement mechanism such as an actuator using pneumatic or hydraulic pressure, a linear motor operated by electromagnetic interaction, or a ball screw mechanism.

3 shows a configuration in which the rotating module 43, the horizontal moving module 44 and the vertical moving module 45 are provided on both sides of the support 41, respectively. However, the present invention is not limited thereto, and the rotating module 43, the horizontal moving module 44, and the vertical moving module 45 may be provided on any one side of the support 41 and the support 41 on the other side of the support 41. The configuration is provided with a guide means for guiding rotation, horizontal movement and vertical movement.

The plurality of clamp modules 42 may be disposed along the support 41 in the X-axis direction. The clamp module 42 may be installed to be movable in the X-axis direction along the guide 411 extending along the support 41. For this purpose, between the clamp module 42 and the guide 411 may be provided with an actuator using pneumatic or hydraulic pressure, a linear motor operated by electromagnetic interaction, or a linear moving mechanism such as a ball screw mechanism. Therefore, as the plurality of clamp modules 42 are moved in the X-axis direction by the linear movement mechanism, the spacing between the plurality of clamp modules 42 can be adjusted. Accordingly, the plurality of clamp modules 42 may be appropriately disposed corresponding to the width of the substrate S, so that the substrate S may be stably gripped.

The clamp module 42 includes a base member 421 detachably coupled to the support 41, a body 423 movably installed on the base member 421, and mounted to and adjacent to the body 423. A pair of clamp members 424 moved or spaced apart from each other, and a driver 427 for driving the pair of clamp members 424.

The base member 421 is detachably fixed to the support 41, whereby the clamp module 42 may be supported by the support 41.

The dummy portion of the substrate S can be gripped by the pair of clamp members 424 by moving the pair of clamp members 424 adjacent to each other with the substrate S therebetween. As shown in FIGS. 4 and 5, the pair of clamp members 424 may be moved adjacent or spaced apart from one another by being rotated about their respective central axis. To this end, a mechanism may be provided for converting the driving force from the driver 427 into a rotational force for rotating the pair of clamp members 424. However, the present invention is not limited to this configuration, the pair of clamp members 424 may be configured to move in a straight line. To this end, a mechanism may be provided for converting the driving force from the driver 427 into a driving force for moving the pair of clamp members 424 linearly.

The contact pads 425 may be provided on the surfaces of the pair of clamp members 424 facing each other, that is, the surfaces of the pair of clamp members 424 facing the dummy portion of the substrate S. The contact pad 425 may be made of a soft material such as urethane. The contact pad 425 absorbs the shock generated when the pair of clamp members 424 grip the dummy portion of the substrate S to prevent the pair of clamp members 424 or the substrate S from being damaged. do. In addition, the contact pad 425 allows the pair of clamp members 424 to grip the dummy portion of the substrate S with a uniform pressing force.

The body 423 may be configured to be movable relative to the base member 421. Accordingly, the position of the body 423 relative to the base member 421 may be adjusted. The position of the pair of clamp members 424 can be precisely adjusted by adjusting the position of the body 423 relative to the base member 421. For example, the body 423 may be configured to be movable in the X-axis direction, the Y-axis direction, and / or the Z-axis direction with respect to the base member 421. Accordingly, the position of the body 423 in the X-axis direction, the Y-axis direction and / or the Z-axis direction with respect to the base member 421 can be adjusted, whereby the X-axis of the pair of clamp members 424 The position in the direction, Y-axis direction and / or Z-axis direction can be adjusted.

A position adjuster 422 may be provided between the base member 421 and the body 423 to adjust the position of the body 423 relative to the base member 421. For example, the position adjusting unit 422 may include a screw and a rotation mechanism for rotating the screw. Thus, as the screw is rotated by the rotating mechanism, the body 423 can be moved relative to the base member 421, whereby the position of the pair of clamp members 424 can be adjusted. The screw of the position adjusting unit 422 may be configured to be manually operated by the operator.

In particular, when the support 41 is provided with a plurality of clamp modules 42, a pair of clamp members of each of the plurality of clamp modules 42 through the position adjusting portion 422 of the plurality of clamp modules 42 ( The position of 424 can be adjusted, thereby allowing the plurality of clamp modules 42 to grip the dummy portion of the substrate S uniformly. Since the plurality of clamp modules 42 hold the dummy portion of the substrate S uniformly, deformation of the substrate S, such as bending of the substrate S, may be prevented in the process of removing the dummy portion from the substrate S. FIG.

The driver 427 may consist of an electric motor, in particular a servo motor. As another example, the driver 427 may be composed of an actuator using pneumatic or hydraulic pressure, a linear motor operated by electromagnetic interaction, a ball screw mechanism, or the like. The driver 427 serves to drive the pair of clamp members 424 by using the power supplied to the driver 427.

According to the load of the driver 427, the pressing force of the pair of clamp members 424 holding the dummy portion of the substrate S may vary. As the pair of clamp members 424 press the dummy portion of the substrate S, the load of the driver 427 may increase. When the thickness of the dummy portion of the substrate S is increased, the load of the driver 427 may be increased so that the pair of clamp members 424 may properly grip the dummy portion of the substrate S. FIG. For example, when the driver 427 is a rotary motor, the load of the driver 427 may be torque.

The driver 427 may be connected to the control unit 90 and controlled by the control unit 90. The control unit 90 may include a load measuring module 91 for measuring the load of the driver 427.

When the pair of clamp members 424 presses the dummy portion of the substrate S with a predetermined pressing force, a predetermined load acts on the driver 427. Therefore, by measuring the load of the driver 427, the pressing force applied to the dummy part of the board | substrate S by the pair of clamp members 424 can be measured.

The load measuring module 91 may measure the load of the driver 427 in real time. The control unit 90 may calculate the pressing force applied by the pair of clamp members 424 to the dummy portion of the substrate S based on the load of the driver 427 measured by the load measuring module 91.

To this end, while increasing the pressing force of the pair of clamp members 424 by increasing the load of the driver 427, the change in the pressing force of the pair of clamp members 424 according to the change of the load of the driver 427. Experiments or simulations that measure the results can be preceded. By such an experiment or simulation, data relating to the change in the pressing force of the pair of clamp members 424 according to the load change of the driver 427 can be obtained. The control unit 90 may calculate the pressing force of the pair of clamp members 424 based on this data and the load of the driver 427 measured in real time.

In addition, the pressing force when the pair of clamp members 424 properly grips the dummy portion of the substrate S can be set in advance as the reference pressing force. The reference pressing force may vary depending on the characteristics of the substrate S, such as the thickness and material of the substrate S. Therefore, the plurality of reference pressing forces according to the characteristics of the substrate S can be set in advance by experiment or simulation.

The control unit 90 may determine whether the pair of clamp members 424 grip the dummy portion of the substrate S based on this reference pressing force. The control unit 90 calculates the pressing force applied by the pair of clamp members 424 to the dummy portion of the substrate S based on the load of the driver 427 measured by the load measuring module 91.

Then, the control unit 90 compares the calculated pressing force of the pair of clamp members 424 with the reference pressing force, and when the calculated pressing force of the pair of clamp members 424 is within the range of the reference pressing force, It can be determined that the clamp member 424 grips the dummy portion of the substrate S at an appropriate pressing force. Further, the control unit 90 compares the calculated pressing force of the pair of clamp members 424 with the reference pressing force, so that when the calculated pressing force of the pair of clamp members 424 is outside the range of the reference pressing force, the pair It can be determined that the clamp member 424 does not grip the dummy portion of the substrate S with an appropriate pressing force.

If the calculated pressing force of the pair of clamp members 424 is greater than the reference pressing force, the control unit 90 can reduce the load of the driver 427, and the calculated pressing force of the pair of clamp members 424 When smaller than this reference pressing force, the control unit 90 can increase the load of the driver 427. After adjusting the load of the driver 427 by the control unit 90 to adjust the pressing force of the pair of clamp members 424, the dummy portion is removed by the pair of clamp members 424. The process can proceed.

Therefore, according to the substrate cutting device according to the embodiment of the present invention, the pair of clamp members 424 grasp the dummy portion of the substrate S at a suitable pressing force, so that the dummy portion of the substrate S is removed from the substrate S. It can be easily removed.

As another example, the control unit 90 may determine whether the dummy portion is removed from the substrate S based on the reference pressing force. After performing the process of removing the dummy portion from the substrate S by using the pair of clamp members 424, the control unit 90 moves the pair of clamp members 424 to a position where the dummy portion previously existed. After positioning, the pair of clamp members 424 is activated. At this time, when the dummy portion is removed from the substrate S, even if the pair of clamp members 424 move adjacent to each other, the dummy portion of the substrate S is not gripped, so that the load of the driver 427 is one pair. The reference load corresponding to the reference pressing force of the clamp member 424 does not exceed. On the other hand, when the dummy portion is not removed from the substrate S, the dummy portion that is not removed by the pair of clamp members 424 is gripped, so that the load of the driver 427 is applied to the pair of clamp members 424. It becomes more than the reference load corresponding to the reference pressing force.

Accordingly, the control unit 90 determines whether the load of the driver 427 measured by the load measuring module 91 exceeds the reference load, and based on this, determines whether the dummy portion has been removed from the substrate S. You can judge.

Meanwhile, as shown in FIGS. 4 to 6, the dummy control unit 40 is provided in the clamp module 42 and has a gap measuring unit 50 measuring the gap between the pair of clamp members 424. Can be.

In the case where the pair of clamp members 424 are rotated about the central axis, the gap measuring unit 50 measures the amount of rotation of the pair of clamp members 424, whereby the pair of clamp members ( 424) can be measured. As another example, in the case where the pair of clamp members 424 are moved in a straight line, the gap measuring unit 50 measures the linear movement amount of the pair of clamp members 424, thereby providing a pair of clamp members. The interval between 424 can be measured.

For example, as shown in FIG. 6, the gap measurement unit 50 includes a reference member 51 provided in the body 423 and a sensing member provided in any one of the pair of clamp members 424. 52). As another example, the reference member 51 may be provided in any one of the pair of clamp members 424, and the sensing member 52 may be provided in the body 423. As another example, the reference member 51 may be provided in any one of the pair of clamp members 424, and the sensing member 52 may be provided in the other one of the pair of clamp members 424. . As another example, the reference member 51 may be provided in the body 423, and a pair of sensing members 52 may be provided in the pair of clamp members 424, respectively. As another example, the sensing member 52 may be provided in the body 423, and a pair of reference members 51 may be provided in the pair of clamp members 424, respectively.

The gap measuring unit 50 measures the displacement of the pair of clamp members 424 by using the interaction of the reference member 51 and the sensing member 52 to determine the gap between the pair of clamp members 424. Measure

As an example, the reference member 51 may be configured with a scale having a predetermined scale, and the sensing member 52 may be configured with a camera that captures the scale. In this case, the relative position between the reference member 51 and the sensing member 52 is measured based on the image of the scale photographed by the sensing member 52, and a pair of clamp members ( 424) can be measured.

As another example, the reference member 51 may be configured as a reflective surface whose reflection angle varies depending on a position, and the sensing member 52 receives a light sensor that emits light toward the reflective surface and light reflected by the reflective surface. It may be configured as a light receiving sensor. In this case, the relative position between the reference member 51 and the sensing member 52 is measured by measuring the reflection angle of the light reflected from the reflective surface, and the pair of clamp members 424 based on the measured relative position. ) Can be measured.

According to this configuration, when the pair of clamp members 424 are moved adjacent to each other to hold the dummy portion of the substrate S, the relative position between the reference member 51 and the sensing member 52 is changed. The distance between the pair of clamp members 424 may be measured based on the change of the relative position.

The gap measuring unit 50 measures the gap between the pair of clamp members 424 in real time, and transmits the measured gap to the control unit 90.

The control unit 90 properly holds the dummy portion of the substrate S by the pair of clamp members 424 based on the distance between the pair of clamp members 424 measured by the gap measuring unit 50. Can be determined.

To this end, an experiment or simulation may be performed to measure the change in the pressing force of the pair of clamp members 424 according to the change in the distance between the pair of clamp members 424. By such experiments or simulations, data regarding the change in the pressing force of the pair of clamp members 424 according to the change in the distance between the pair of clamp members 424 can be obtained.

In addition, the pressing force when the pair of clamp members 424 properly grips the dummy portion of the substrate S can be set in advance as the reference pressing force. The reference pressing force may vary depending on the characteristics of the substrate S, such as the thickness and material of the substrate S. Therefore, the plurality of reference pressing forces according to the characteristics of the substrate S can be set in advance by experiment or simulation.

The control unit 90 may determine whether the pair of clamp members 424 grip the dummy portion of the substrate S based on this reference pressing force. The control unit 90 applies a pressing force applied by the pair of clamp members 424 to the dummy portion of the substrate S based on the distance between the pair of clamp members 424 measured by the gap measuring unit 50. Calculate.

Then, the control unit 90 compares the calculated pressing force of the pair of clamp members 424 with the reference pressing force, and when the calculated pressing force of the pair of clamp members 424 is within the range of the reference pressing force, It can be determined that the clamp member 424 grips the dummy portion of the substrate S at an appropriate pressing force. Further, the control unit 90 compares the calculated pressing force of the pair of clamp members 424 with the reference pressing force, so that when the calculated pressing force of the pair of clamp members 424 is outside the range of the reference pressing force, the pair It can be determined that the clamp member 424 does not grip the dummy portion of the substrate S with an appropriate pressing force.

If the calculated pressing force of the pair of clamp members 424 is greater than the reference pressing force, the control unit 90 may control the driver 427 to increase the spacing between the pair of clamp members 424. In addition, when the calculated pressing force of the pair of clamp members 424 is smaller than the reference pressing force, the control unit 90 can control the driver 427 to reduce the gap between the pair of clamp members 424. have. After performing the process of adjusting the pressing force of the pair of clamp members 424 by adjusting the distance between the pair of clamp members 424 by the control unit 90, by the pair of clamp members 424 The process of removing the dummy portion may proceed.

Therefore, according to the substrate cutting device according to the embodiment of the present invention, the pair of clamp members 424 grasp the dummy portion of the substrate S at a suitable pressing force, so that the dummy portion of the substrate S is removed from the substrate S. It can be easily removed.

As another example, the control unit 90 may determine whether the dummy portion is removed from the substrate S based on the reference pressing force. After performing the process of removing the dummy portion from the substrate S by using the pair of clamp members 424, the control unit 90 moves the pair of clamp members 424 to a position where the dummy portion previously existed. After positioning, the pair of clamp members 424 is activated. At this time, when the dummy part is removed from the substrate S, even if the pair of clamp members 424 move adjacent to each other, the dummy part of the substrate S is not gripped, and thus, between the pair of clamp members 424. The interval of does not exceed the reference interval corresponding to the reference pressing force of the pair of clamp members 424. On the other hand, when the dummy portion is not removed from the substrate S, the dummy portion that is not removed by the pair of clamp members 424 is gripped, so that the gap between the pair of clamp members 424 is one pair of clamps. The reference interval of the member 424 is equal to or greater than the reference interval.

Therefore, the control unit 90 determines whether the gap between the pair of clamp members 424 measured by the gap measuring unit 50 exceeds the reference gap, and the dummy portion is based on the substrate S. It can be determined whether or not removed from the.

As shown in FIG. 7 and FIG. 8, the substrate cutting apparatus according to the embodiment of the present invention may further include a cleaning unit 60 for cleaning the dummy removal unit 40.

As an example, the cleaning unit 60 may be configured to be accessible to the dummy control unit 40. As another example, the dummy removal unit 40 may be accessible to the cleaning unit 60.

The cleaning unit 60 includes a brush 61 accessible to a pair of clamp members 424, a brush driver 62 for driving the brush 61, and a swing module for turning the brush 61. 63, the horizontal drive module 64 for moving the brush 61 in the horizontal direction (X-axis direction and / or Y-axis direction), and the vertical for moving the brush 61 in the vertical direction (Z-axis direction). The drive module 65 may be included.

Brush driver 62 may be configured to rotate brush 61. As another example, the brush driver 62 can vibrate the brush 61 in the horizontal and / or vertical direction. Accordingly, the brush 61 may be moved by the brush driver 62 to separate the foreign matter attached to the clamp member 424 from the clamp member 424.

The pivot module 63 pivots the brush 61 to allow the brush 61 to easily access the clamp member 424. The pivot module 63 may be composed of a rotary motor connected to the brush 61 through a connection bar. The pivot module 63 may include a power transmission mechanism such as a link, a belt, and the like provided between the rotary motor and the brush 61.

The horizontal drive module 64 or the vertical drive module 65 may be configured as a linear moving mechanism such as an actuator using pneumatic or hydraulic pressure, a linear motor operated by electromagnetic interaction, or a ball screw mechanism.

After removing the dummy portion from the preset number of substrates S or when the preset period has elapsed, a process of cleaning the dummy removal unit 40 using the cleaning unit 60 is performed.

In this case, the brush 61 of the cleaning unit 60 may approach the dummy removal unit 40 by the horizontal driving module 64 and / or the vertical driving module 65. Then, in the state where the brush 61 is driven by the brush driver 62, the brush 61 is swiveled by the turning module 63 to come into contact with the clamp member 424. Accordingly, foreign matter attached to the clamp member 424 may be separated by the brush 61.

Thus, when the dummy removal unit 40 removes the dummy portion from the substrate S, foreign matter such as debris of the substrate S that can be attached to the clamp member 424 can be removed by the cleaning unit 60. have. Therefore, it is possible to prevent the substrate S and the peripheral components from being contaminated by foreign matter such as debris of the substrate S.

Meanwhile, the cleaning unit 60 is configured to surround the brush 61 and has a housing 66 having an opening through which the brush 61 is exposed, and a gas connected to the housing 66 to supply gas to the housing 66. May include a supply module 67. Accordingly, gas supplied from the gas supply module 67 to the housing 66 may be injected through the opening of the housing 66.

During the process of cleaning the dummy removal unit 40, the opening of the housing 66 may face the clamp member 424, whereby the gas supplied from the gas supply module 67 may cause the opening of the housing 66 to fall off. Through the clamp member 424 may be injected. As such, the housing 66 may serve as a nozzle for injecting air. Thus, foreign matter attached to the clamp member 424 can be removed from the clamp member 424 not only by driving the brush 61 but also by gas injected through the opening of the housing 66. Therefore, the process of removing the foreign matter attached to the clamp member 424 can be performed more efficiently.

In addition, the cleaning unit 60 may include a vacuum source 69 connected to the housing 66. A negative pressure may be applied to the housing 66 by the vacuum source 69. Thus, the air around the opening of the housing 66 can be sucked into the housing 66 by the negative pressure applied to the housing 66 by the vacuum source 69. Thus, foreign matter separated from the clamp member 424 by the brush 61 can flow into the housing 66 without being scattered around. Therefore, the foreign matter separated from the clamp member 424 can be prevented from scattering around the cleaning unit 60 to contaminate the surroundings of the cleaning unit 60.

Meanwhile, a filter 68 may be provided between the housing 66 and the vacuum source 69 to filter foreign matter removed from the clamp member 424.

The gas supply module 67 and the vacuum source 69 may be provided together in the cleaning unit 60. In this case, the gas supply module 67 and the vacuum source 69 may be operated alternately or sequentially with each other.

9 to 11, the cut plane measuring unit 70 may include an imaging module 71 installed in one of the first and second scribing heads 32 and 34.

For example, the imaging module 71 may be configured as a camera. As shown in FIG. 9, the imaging module 71 may be installed in the first scribing head 32 above the dummy removing unit 40. However, if the imaging module 71 can image the cut surface of the dummy portion D held by the pair of clamp members 424, the imaging module 71 may be installed at various positions.

As shown in FIG. 10, the imaging module 71 may be configured to image the cut surface of the dummy portion D that is gripped by the pair of clamp members 424 and then rotated by the rotation module 43. .

As the first scribing head 32 is moved in the Z-axis direction, the imaging module 71 is moved in the Z-axis direction, adjacent to the dummy portion D gripped by the pair of clamp members 424. Can be located.

As the first scribing head 32 is moved in the X-axis direction, the imaging module 71 may be moved in the X-axis direction. Therefore, as the imaging module 71 moves in the X-axis direction (that is, while moving in the longitudinal direction of the dummy part D), the entire cut surface of the dummy part D can be picked up. In addition, as the imaging module 71 moves in the X-axis direction (that is, in the longitudinal direction of the dummy part D), the cut surface of the dummy part D can be picked up at a plurality of points.

In this way, the imaging module 71 is provided in either one of the first and second scribing heads 32, 34 and moved in the X-axis direction and / or Z-axis direction, the pair of clamp members 424 The cut surface of the dummy part D gripped by this can be picked up. Therefore, compared with the case where the imaging module 71 is equipped in a separate apparatus, a structure can be simplified.

Meanwhile, the position of the dummy part D may be adjusted so that the imaging module 71 may image the cut surface of the dummy part D. FIG. The dummy part gripped by the clamp module 42 as the support 41 of the dummy removal unit 40 is moved in the Y-axis direction and the Z-axis direction by the horizontal moving module 44 and the vertical moving module 45. The position in the Y-axis direction and the Z-axis direction of (D) can be adjusted. As the support 41 is rotated by the rotation module 43, the dummy part D held by the clamp module 42 may be disposed to face the imaging module 71.

As shown in FIG. 11, the imaging module 71 may be connected to the control unit 90. The control unit 90 measures the shape of the cut surface from the image of the cut surface of the dummy portion D picked up by the imaging module 71. And it can be determined whether the shape of the measured cut surface falls within a reference range, that is, whether the quality of the cut surface is good.

In addition, as shown in FIG. 11, the control unit 90 moves the first and second scribing heads 32 and 34 in the Z-axis direction so that the scribing wheel 351 moves on the substrate S. As shown in FIG. The applying force may be connected to the head moving module 38, 39 for adjusting the pressing force. Therefore, when the control unit 90 determines that the quality of the cut surface of the dummy portion D is good, the head moving module (ie, the scribing wheel 351 presses the substrate S with the same pressing force as the previous pressing force) 38, 39) can be controlled. In addition, when the control unit 90 determines that the quality of the cut surface of the dummy portion D is not good, the head moving module causes the scribing wheel 351 to press the substrate S with a pressing force different from the previous pressing force. (38, 39) can be controlled.

As shown in FIG. 12, in the scribing process, when the scribing wheel 351 passes the surface of the substrate S while rotating while pressing the substrate S, the substrate S A vertical crack called a median crack M is generated along with the depression P generated by the crushing wheel 351 pressing the substrate S. As shown in FIG. In some cases, only the median crack M may be generated without the depression P being generated.

Then, in the braking step, the shear stress is applied to the substrate S along the scribing line L in a state in which a predetermined median crack M is generated on the substrate S, and thus, the median already generated. As the crack grows starting from the crack M, the fracture portion C is formed, whereby the substrate S is instantaneously cut.

On the other hand, cyclic wear (mechanical wear and thermal wear) occurs on the scribing wheel 351 by the continuous friction between the scribing wheel 351 and the substrate (S). The degree of wear of the scribing wheel 351 affects the size of the depression P and the median crack M. FIG. The characteristics of the substrate S such as the thickness and brittleness of the substrate S also affect the size of the depression P and the median crack M. FIG. In addition, the characteristics of the scribing wheel 351, such as the hardness of the scribing wheel 351, the angle of the cutting edge also affects the size of the depression P and the median crack M. .

The size of the depression P and the median crack M is closely related to the quality of the cut surface such as the surface roughness of the cut surface of the substrate S and the smoothness. In particular, the surface roughness of the cut surface is determined according to the quality of the median crack M, and the impact fracture toughness of the substrate S is changed. When the sizes of the depressions P and the median crack M are irregular, the quality of the cut surface of the dummy portion D is not good, and there is a problem that debris, chips, and the like occur.

Therefore, even when the characteristic of the substrate S or the characteristic of the scribing wheel 351 changes, the quality of the cut surface of the dummy part D is made uniform by making the magnitude | size of the recessed part P and the median crack M uniform. It is desirable to keep it constant.

Specifically, the control unit 90 is a criterion for determining whether the quality of the cut surface of the dummy portion D is good, and the following parameters are determined from the image of the cut surface of the dummy portion D picked up by the imaging module 71. Obtain information about.

(1) Thickness A of board | substrate S (here, thickness A is thickness A of either the 1st board | substrate and the 2nd board | substrate which comprise a bonded substrate)

(2) the depth H of the depression P formed by the scribing wheel 351, that is, the penetration depth H of the scribing wheel 351 into the substrate S.

(3) the thickness T of the median crack M formed by the scribing wheel 351

(4) the thickness (B) of the breaking portion (C) generated in the braking process

Among these various variables, the penetration depth (H) of the scribing wheel 351 is characterized by the characteristics of the scribing wheel 351 such as the hardness, wear degree, angle of the edge of the scribing wheel 351 , The scribing wheel 351 is related to the pressing force for pressing the substrate (S). Therefore, under the same pressure, when the characteristic of the scribing wheel 351 is changed due to wear of the scribing wheel 351, the penetration depth H of the scribing wheel 351 may vary. . Therefore, the control unit 90 may determine whether the quality of the cut surface is good by determining whether the penetration depth H of the scribing wheel 351 is out of the preset reference range. Here, the reference range is a scribing wheel measured when the quality of the cut surface of the substrate S is not good and the shape of the depression P, the median crack M, or the fracture C is irregular. It can be obtained experimentally from the penetration depth (H) of 351). That is, the shape of the depression P, the median crack M, or the fracture C according to the change of the penetration depth H of the scribing wheel 351 is analyzed, and the depression P and the median are analyzed. The reference range can be set by determining the penetration depth H of the scribing wheel 351 in the case where a crack occurs in the crack M or the break C. FIG.

If the penetration depth H of the scribing wheel 351 is out of the reference range, the control unit 90 controls the head moving modules 38 and 39 so that the scribing wheel 351 is connected to the substrate S. The applied pressure can be changed.

Therefore, even when the characteristics of the scribing wheel 351 such as the degree of wear of the scribing wheel 351 change or the characteristics of the substrate S change, the pressing force applied to the scribing wheel 351 is applied. In other words, the penetration depth H of the scribing wheel 351 can be kept constant. Therefore, even when the characteristics of the scribing wheel 351 change or the characteristics of the substrate S change, the pressing force applied to the scribing wheel 351 is changed to keep the quality of the cut surface uniform and constant. Can be.

As shown in FIG. 11, in order to more accurately measure the penetration depth H of the scribing wheel 351, the control unit 90 is provided with the dummy part D captured by the imaging module 71. A thickness measurement module 95 for measuring the thickness A of the dummy portion D from the image of the cut surface, an image conversion module 96 for converting the image of the cut surface of the dummy portion D using a binarization algorithm, A counting module 97 that counts the number of white pixels from the image converted by the image conversion module 96 and histograms of the number of white pixels are histogramized to calculate the penetration depth H of the scribing wheel 351. The penetration depth calculation module 98 may be included.

As shown in FIG. 13, the thickness measuring module 95 may measure the thickness A of the dummy part D from an image of the cut surface of the dummy part D.

Meanwhile, as shown in FIG. 13, the depression P formed by the scribing wheel 351 representing the penetration depth H of the scribing wheel 351 is approximately Z-axis direction (dummy portion D). ) And a plurality of rib shapes (hereinafter referred to as rib marks) extending in the thickness direction). Therefore, the penetration depth H of the scribing wheel 351 can be measured based on the plurality of rib marks.

To this end, the image conversion module 96 converts the image of the cut surface of the dummy portion D into an image as shown in FIG. 14 using a binarization algorithm. For example, image conversion module 96 may use a Sobel algorithm. The image conversion module 96 may reverse the black and white in the image of the cut surface of the dummy portion (D).

At this time, the image conversion module 96 may detect only the component in the Z-axis direction as the white pixel W among the pixel elements in the image, and remove the X-axis direction component by first derivative. In this process, foreign substances such as dust, glass powder, particles, and debris, which may be attached to the cut surface of the dummy portion D, may be removed as noise elements, and thus, the penetration depth of the scribing wheel 351 may be H) can be measured more accurately.

The image converted by the image conversion module 96 has a shape in which a plurality of white pixels W extending in the Z-axis direction are arranged in the X-axis direction, as shown in FIG. 14.

The counting module 97 counts the number of white pixels W having a length equal to or greater than a reference length in the Z-axis direction among the white pixels W formed to extend in the Z-axis direction. Therefore, the number of foreign matters such as dust, glass powder, particles, etc., which may be attached to the cut surface of the dummy part D is not counted, so that the penetration depth H of the scribing wheel 351 is more accurately measured. Can be.

As shown in FIG. 15, the number of white pixels W counted by the counting module 97 may be histogramized. Therefore, the penetration depth H of the scribing wheel 351 can be measured from the number according to the distance of the X-axis direction of the some white pixel which has the length more than a reference length in the Z-axis direction.

16 to 24, the operation of the substrate cutting device according to the embodiment of the present invention, that is, the substrate cutting method, will be described.

As shown in FIG. 16, the substrate S is transferred to the scribing unit 30 by the first transfer unit 10 without the dummy portion D of the leading end of the substrate S being removed. do. In this case, the substrate S may be supported from the first plate 15 by the gas injected from the first plate 15.

When the substrate S is positioned on the first plate 15, the substrate S is attracted to the first plate 15. At this time, after the scribing wheels 351 of the first and second scribing heads 32 and 34 are in contact with the substrate S, respectively, and are moved in the X-axis direction, the dummy part of the substrate S is moved. A scribing line is formed in (D).

17, the clamp module 42 of the dummy removal unit 40 is moved to the dummy part D of the substrate S on which the scribing line is formed. Then, in a state where the pair of clamp members 424 hold the dummy portion D of the substrate S, the support 41 rotates or is horizontal and / or vertical (X-axis direction, Y-axis direction and / or The dummy portion D is removed from the substrate S by moving in the Z-axis direction).

At this time, the clamp module 42 holding the removed dummy part D is rotated and moved in the Y-axis direction and / or Z-axis direction so that the dummy part D may be disposed to face the imaging module 71. In this state, the imaging module 71 may move in the X-axis direction to image the cut surface of the dummy portion D. FIG. The process of photographing the cut surface of the dummy part D may be performed every time the dummy part D is separated, or may be performed at a predetermined cycle.

As shown in FIG. 18, the second plate 25 moves toward the first plate 15 in the Y-axis direction while the first plate 15 is fixed. Accordingly, the gap between the first plate 15 and the second plate 25 is reduced, so that the substrate S can be stably supported on both the first plate 15 and the second plate 25.

Then, the substrate S is transferred toward the scribing unit 30. In this case, the substrate S may be supported from the first plate 15 and the second plate 25 by the gas supplied to the first plate 15 and the second plate 25.

And, as shown in FIG. 19, when the substrate S is positioned on the first plate 15 and the second plate 25, the substrate S is the first plate 15 and the second plate 25. Is adsorbed on. At this time, after the scribing wheels 351 of the scribing heads 32 and 34 are in contact with the substrate S, respectively, and move in the X-axis direction, an X-axis scribing line is formed on the substrate S. Is formed.

20, after the X-axis scribing line is formed on the substrate S, the scribing wheels 351 of the scribing heads 32 and 34 are spaced apart from the substrate S. As shown in FIG. Is moved. Then, when the second plate 25 is moved away from the first plate 15 in a state where the substrate S is adsorbed to both the first plate 15 and the second plate 25, the substrate S It is divided along this X-axis scribing line.

On the other hand, as shown in FIG. 21, after dividing the middle portion of the substrate S, the substrate S is scribed in a state in which the dummy portion D is not removed at the trailing end of the substrate S. FIG. Are transferred to 30. At this time, it may be supported from the second plate 25 by the gas injected from the second plate 25.

When the substrate S is positioned on the second plate 25, the substrate S is attracted to the second plate 25. At this time, after the scribing wheels 351 of the scribing heads 32 and 34 respectively contact the substrate S, the scribing wheels 351 move in the X-axis direction. An axial scribing line is formed.

As shown in FIG. 22, the clamp module 42 of the dummy removal unit 40 is moved to the dummy portion D of the substrate S on which the X-axis scribing line is formed. Then, in a state where the dummy portion D of the substrate S is held by the pair of clamp members 424, the support 41 rotates or is horizontal and / or vertical (X-axis direction, Y-axis direction and / or the like). Alternatively, the dummy part D is removed from the substrate S by moving in the Z-axis direction).

At this time, the clamp module 42 holding the removed dummy part D is rotated and moved in the Y-axis direction and / or Z-axis direction so that the dummy part D may be disposed to face the imaging module 71. In this state, the imaging module 71 may move in the X-axis direction to image the cut surface of the dummy portion D. FIG. The process of photographing the cut surface of the dummy part D may be performed every time the dummy part D is separated, or may be performed at a predetermined cycle.

Meanwhile, the substrate S divided along the X-axis scribing line may be transferred to the subsequent process by the transfer belt 21.

As shown in FIG. 23, it is possible to judge whether the quality of the cut surface of the dummy part D is good from the image of the cut surface of the dummy part D picked up by the imaging module 71.

To this end, as shown in FIG. 16, the scribing wheel 351 is pressed to the dummy part D at a first pressing force to form a scribing line at the dummy part D (S10).

As shown in FIG. 17, the dummy portion D is cut and separated using the dummy removal unit 40 (S20).

10, the cut surface of the dummy part D is imaged using the imaging module 71 (S30).

Then, the penetration depth H of the scribing wheel 351 into the substrate S is measured from the image of the cut surface of the dummy portion D (S40).

In addition, the control unit 90 determines whether the penetration depth H of the scribing wheel 351 is out of a preset reference range (S50), and the penetration depth H of the scribing wheel 351. Is outside the preset reference range, the first pressing force is adjusted to a second pressing force different from the first pressing force, and the scribing wheel 351 is pressed to the second pressing force against the subsequent substrate S to press the substrate S. In step S60, a scribing line is formed.

On the other hand, when the penetration depth H is less than the reference range, the pressing force of the scribing wheel 351 is increased, that is, the scribing wheel 351 is moved to the substrate at a second pressing force larger than the first pressing force. By pressurizing to S, the penetration depth H can be increased. When the penetration depth H exceeds the reference range, the pressing force of the scribing wheel 351 is reduced, that is, the scribing wheel 351 is mounted on the substrate with a second pressing force smaller than the first pressing force. By pressurizing to S, the penetration depth H can be reduced.

On the other hand, as shown in Figure 24, the step of measuring the penetration depth (H) of the scribing wheel 351 into the substrate (S) from the image of the cut surface of the dummy portion (D), as described above, Converting an image of the cut surface using a binarization algorithm (S41), and counting the number of pixels having a length equal to or greater than a reference length in the thickness direction (Z-axis direction) of the dummy portion D in the converted image (S42). ), A step of histogramizing the number of counted pixels (S43), and a step (S44) of measuring the penetration depth H of the scribing wheel 351 from the histogram.

In the step S42 of counting the number of pixels having a length equal to or greater than the reference length in the thickness direction of the dummy part D in the converted image, the number of foreign matters such as dust, glass powder, particles, and the like is not counted. Therefore, foreign matter such as dust, glass powder, particles, etc., which may be attached to the cut surface of the dummy portion D, can be removed as a noise element. Therefore, the penetration depth H of the scribing wheel 351 can be measured more accurately.

According to the substrate cutting apparatus and the substrate cutting method according to an embodiment of the present invention, when the characteristics of the scribing wheel 351, such as the wear of the scribing wheel 351 changes or the characteristics of the substrate (S) changes In addition, by adjusting the pressing force of the scribing wheel 351 appropriately, the penetration depth H of the scribing wheel 351 can be kept constant. Therefore, even when the characteristic of the scribing wheel 351 changes or the characteristic of the substrate S changes, the quality of the cut surface of the substrate S can be kept uniform and constant.

According to the substrate cutting apparatus and the substrate cutting method according to an embodiment of the present invention, the quality of the cut surface is measured using the dummy portion (H) to be discarded after cutting, and based on the measured quality of the cut surface scribing wheel ( Since the process of cutting the substrate S may be performed in earnest after adjusting the pressing force of 351, the process of cutting the substrate S may be performed more smoothly and efficiently.

Further, according to the substrate cutting device according to the embodiment of the present invention, the pressing force of the pair of clamp members 424 is calculated and calculated based on the load of the driver 427 for operating the pair of clamp members 424. The pressing force of the pair of clamp members 424 can be adjusted while comparing the applied pressing force with the reference pressing force. Therefore, the pair of clamp members 424 can hold the dummy portion of the substrate S at a predetermined reference pressing force. Therefore, the dummy part of the board | substrate S can be gripped stably, and the dummy part can be removed smoothly from the board | substrate S.

In addition, according to the substrate cutting device according to an embodiment of the present invention, the pressing force of the pair of clamp members 424 is calculated based on the distance between the pair of clamp members 424, and the calculated pressing force is determined by the reference pressing force. In comparison, the pressing force of the pair of clamp members 424 can be adjusted. Therefore, the pair of clamp members 424 can hold the dummy portion of the substrate S at a predetermined reference pressing force. Therefore, the dummy part of the board | substrate S can be gripped stably, and the dummy part can be removed smoothly from the board | substrate S.

In particular, when the plurality of clamp modules 42 are provided on the support 41, the pair of clamp members 424 of each of the plurality of clamp modules 42 grips the dummy portion of the substrate S at an appropriate pressing force. . Therefore, the plurality of clamp modules 42 are synchronized with each other, thereby stably holding the dummy portion of the substrate S to remove the dummy portion from the substrate S, and removing the dummy portion from the substrate S. In this process, the substrate S may be prevented from being bent or broken. Deformation of the substrate (S), cracking of the substrate (S), a substrate that may occur when the plurality of clamp modules (42) are not synchronized with each other and grip the dummy portions of the substrate (S) at different pressing forces. Problems such as the generation of debris due to breaking of (S) can be prevented.

According to the substrate cutting device according to the embodiment of the present invention, it is possible to check the clamp module 42 in which the pressing force is abnormally changed among the plurality of clamp modules 42, and check the clamp module 42 in which the pressing force is abnormally changed. Or can be replaced. Therefore, the defect which arises when removing a dummy part from the board | substrate S can be prevented.

According to the substrate cutting device according to the embodiment of the present invention, the pressing force of the pair of clamp members 424 is calculated based on the load of the driver 427 for operating the pair of clamp members 424, and the calculated pressing force is calculated. It may be determined whether the dummy part is removed from the substrate S based on the reference. Therefore, the process of removing the dummy part from the substrate S can be efficiently performed.

According to the substrate cutting device according to the embodiment of the present invention, the pressing force of the pair of clamp members 424 is calculated based on the distance between the pair of clamp members 424, and the substrate S is based on the calculated pressing force. ), It may be determined whether the dummy portion has been removed. Therefore, the process of removing the dummy part from the substrate S can be efficiently performed.

Therefore, the dummy part may not be properly removed from the substrate S, and may be separated and dropped from the substrate S during the transfer of the substrate S to contaminate the periphery of the substrate cutting device or may be a component or substrate around the substrate cutting device. The problem which damages S) can be prevented.

In addition, according to the substrate cutting device according to the embodiment of the present invention, when the dummy removal unit 40 removes the dummy portion from the substrate S, fragments of the substrate S that can be attached to the clamp member 424, or the like. Foreign matters may be removed by the cleaning unit 60. Therefore, it is possible to prevent the substrate S and the peripheral components from being contaminated by foreign matter such as debris of the substrate S.

While the preferred embodiments of the present invention have been described by way of example, the scope of the present invention is not limited to these specific embodiments, and may be appropriately modified within the scope of the claims.

10: first transfer unit
20: second transfer unit
30: scribing unit
40: dummy removal unit
50: interval measuring unit
60: cleaning unit
70: cutting plane measuring unit
90: control unit

Claims (12)

A scribing unit for pressing a scribing wheel to the substrate to form a scribing line;
A dummy removal unit for removing the dummy portion from the substrate along a scribing line formed in the dummy portion of the substrate by the scribing unit;
A cut plane measuring unit measuring a cut surface shape of the dummy portion removed by the dummy removing unit; And
And a control unit for adjusting the pressing force of the scribing wheel pressed against the substrate based on the cut surface shape of the dummy portion measured by the cut surface measuring unit. The method according to claim 1,
And the control unit adjusts the pressing force of the scribing wheel based on the depth of penetration of the scribing wheel into the substrate measured from the cut surface shape of the dummy portion. The method according to claim 2,
The control unit,
An image conversion module for converting an image of the cut surface of the dummy portion using a binarization algorithm;
A counting module that counts the number of pixels extending in the thickness direction of the dummy portion in the image converted by the image conversion module;
And a penetration depth calculation module that histograms the number of pixels counted by the counting module to calculate the penetration depth of the scribing wheel. The method according to claim 3,
The image conversion module detects only components extending in the thickness direction of the dummy portion among the pixel elements in the image as white pixels,
And the counting module counts the number of white pixels detected by the image conversion module. The method according to claim 4,
And the counting module counts the number of white pixels having a length equal to or greater than a reference length in the thickness direction of the dummy portion. The method according to claim 3,
The control unit further comprises a thickness measuring module for measuring the thickness of the dummy portion from the image of the cut surface of the dummy portion. The method according to claim 1,
The dummy removal unit,
A clamp module including a clamp member for holding the dummy portion;
A support for supporting the clamp module;
A rotation module for rotating the support about the central axis of the support;
A horizontal moving module for moving the support horizontally; And
Substrate cutting device comprising a vertical movement module for moving the support vertically The method according to claim 7,
The clamp module is provided in plurality in the support,
The plurality of clamp modules are installed on the support so as to be movable in the longitudinal direction of the support substrate cutting apparatus, characterized in that the gap between the plurality of clamp modules is adjusted. The method according to claim 7,
The clamp module,
A base member;
A body installed to be movable with respect to the base member and to which the clamp member is mounted; And
And a position adjusting unit for moving the body with respect to the base member. The method according to claim 7,
The scribing unit may include a frame extending in a direction orthogonal to a direction in which the substrate is transferred, and a scribing head mounted to the frame to be movable in an extension direction of the frame and including the scribing wheel. Including,
The cutting plane measuring unit is installed on the scribing head and moves together with the scribing head in the extending direction of the frame to measure the shape of the cutting plane of the dummy part held by the clamp member of the dummy removing unit. Substrate cutting device. (a) pressing a scribing wheel with a first pressing force to the dummy portion of the substrate to form a scribing line in the dummy portion;
(b) cutting and separating the dummy part in which the scribing line is formed in step (a);
(c) imaging the cut surface of the dummy portion cut in step (b);
(d) measuring the penetration depth of the scribing wheel from the image of the cut surface of the dummy portion photographed in step (c);
(e) determining whether the penetration depth of the scribing wheel measured in step (d) is outside a preset reference range; And
(f) when the penetration depth of the scribing wheel measured in step (d) is outside the reference range, pressurizing the substrate to a second pressing force different from the first pressing force to form a scribing line on the substrate. Substrate cutting method comprising the step. The method according to claim 11,
(D) measuring the penetration depth of the scribing wheel,
Converting an image of the cut surface of the dummy portion using a binarization algorithm;
Counting the number of pixels having a length equal to or greater than a reference length in the thickness direction of the dummy portion in the converted image;
Histogram the number of counted pixels; And
Measuring the penetration depth of the scribing wheel from the histogram.

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