KR20190125321A - 폴리에스테르 수지와 그 경화물 - Google Patents

폴리에스테르 수지와 그 경화물 Download PDF

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Publication number
KR20190125321A
KR20190125321A KR1020197025411A KR20197025411A KR20190125321A KR 20190125321 A KR20190125321 A KR 20190125321A KR 1020197025411 A KR1020197025411 A KR 1020197025411A KR 20197025411 A KR20197025411 A KR 20197025411A KR 20190125321 A KR20190125321 A KR 20190125321A
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KR
South Korea
Prior art keywords
group
phenolic hydroxyl
compound
substituent
resin
Prior art date
Application number
KR1020197025411A
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English (en)
Korean (ko)
Inventor
다츠야 오카모토
유타카 사토우
Original Assignee
디아이씨 가부시끼가이샤
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Application filed by 디아이씨 가부시끼가이샤 filed Critical 디아이씨 가부시끼가이샤
Publication of KR20190125321A publication Critical patent/KR20190125321A/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
    • C08G63/12—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
    • C08G63/123—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds the acids or hydroxy compounds containing carbocyclic rings
    • C08G63/133—Hydroxy compounds containing aromatic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/64—Polyesters containing both carboxylic ester groups and carbonate groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/68—Polyesters containing atoms other than carbon, hydrogen and oxygen
    • C08G63/682—Polyesters containing atoms other than carbon, hydrogen and oxygen containing halogens
    • C08G63/6824—Polyesters containing atoms other than carbon, hydrogen and oxygen containing halogens derived from polycarboxylic acids and polyhydroxy compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
  • Polyesters Or Polycarbonates (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020197025411A 2017-03-24 2018-02-01 폴리에스테르 수지와 그 경화물 KR20190125321A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2017-059121 2017-03-24
JP2017059121 2017-03-24
PCT/JP2018/003361 WO2018173499A1 (ja) 2017-03-24 2018-02-01 ポリエステル樹脂とその硬化物

Publications (1)

Publication Number Publication Date
KR20190125321A true KR20190125321A (ko) 2019-11-06

Family

ID=63584497

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197025411A KR20190125321A (ko) 2017-03-24 2018-02-01 폴리에스테르 수지와 그 경화물

Country Status (5)

Country Link
JP (1) JPWO2018173499A1 (ja)
KR (1) KR20190125321A (ja)
CN (1) CN110494470A (ja)
TW (1) TW201840636A (ja)
WO (1) WO2018173499A1 (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004169021A (ja) 2002-10-31 2004-06-17 Dainippon Ink & Chem Inc エポキシ樹脂組成物およびその硬化物

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH087461B2 (ja) * 1991-07-18 1996-01-29 三洋化成工業株式会社 トナーバインダー用ポリエステル樹脂、バインダー、トナーの製法
JP2657608B2 (ja) * 1993-05-31 1997-09-24 三洋化成工業株式会社 金属塗料用樹脂組成物
JPH07258385A (ja) * 1994-03-22 1995-10-09 Sumitomo Metal Ind Ltd 半導体封止用エポキシ樹脂組成物
JP3369323B2 (ja) * 1994-09-13 2003-01-20 ジャパンエポキシレジン株式会社 半導体封止用エポキシ樹脂組成物
JP4113544B2 (ja) * 2002-02-28 2008-07-09 三洋化成工業株式会社 トナーバインダー
JP4436339B2 (ja) * 2005-05-31 2010-03-24 三洋化成工業株式会社 トナーおよびトナーバインダー
JP5340996B2 (ja) * 2010-02-26 2013-11-13 三洋化成工業株式会社 ポリエステル樹脂水性分散体
KR101780991B1 (ko) * 2011-05-27 2017-09-25 디아이씨 가부시끼가이샤 활성 에스테르 수지, 그 제조 방법, 열경화성 수지 조성물, 그 경화물, 반도체 봉지 재료, 프리프레그, 회로 기판, 및 빌드업 필름
JP5910866B2 (ja) * 2012-03-06 2016-04-27 Dic株式会社 活性エステル樹脂、熱硬化性樹脂組成物、その硬化物、半導体封止材料、プリプレグ、回路基板、及びビルドアップフィルム
WO2013141247A1 (ja) * 2012-03-21 2013-09-26 Dic株式会社 活性エステル樹脂、熱硬化性樹脂組成物、その硬化物、半導体封止材料、プリプレグ、回路基板、及びビルドアップフィルム
IN2015DN01035A (ja) * 2012-07-30 2015-06-26 Taisho Pharmaceutical Co Ltd
CN105745213A (zh) * 2013-11-25 2016-07-06 四国化成工业株式会社 具有官能团的甘脲类及其利用
JP5907319B2 (ja) * 2014-03-18 2016-04-26 Dic株式会社 活性エステル樹脂、エポキシ樹脂組成物、その硬化物、プリプレグ、回路基板、及びビルドアップフィルム
CN105566621B (zh) * 2014-11-11 2018-09-21 江苏雅克科技股份有限公司 低介电含磷聚酯化合物组成及其制法
CN109415483B (zh) * 2016-07-06 2021-09-14 Dic株式会社 活性酯树脂和其固化物
JP6862701B2 (ja) * 2016-07-15 2021-04-21 Dic株式会社 活性エステル樹脂とその硬化物

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004169021A (ja) 2002-10-31 2004-06-17 Dainippon Ink & Chem Inc エポキシ樹脂組成物およびその硬化物

Also Published As

Publication number Publication date
JPWO2018173499A1 (ja) 2020-02-20
WO2018173499A1 (ja) 2018-09-27
TW201840636A (zh) 2018-11-16
CN110494470A (zh) 2019-11-22

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