KR20190097064A - 카메라 모듈, 카메라 모듈의 제조 방법 및 전자기기 - Google Patents

카메라 모듈, 카메라 모듈의 제조 방법 및 전자기기 Download PDF

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Publication number
KR20190097064A
KR20190097064A KR1020197018115A KR20197018115A KR20190097064A KR 20190097064 A KR20190097064 A KR 20190097064A KR 1020197018115 A KR1020197018115 A KR 1020197018115A KR 20197018115 A KR20197018115 A KR 20197018115A KR 20190097064 A KR20190097064 A KR 20190097064A
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KR
South Korea
Prior art keywords
imaging device
solid
state imaging
spacer
glass substrate
Prior art date
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Abandoned
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KR1020197018115A
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English (en)
Korean (ko)
Inventor
카츠지 키무라
히로카즈 세키
Original Assignee
소니 세미컨덕터 솔루션즈 가부시키가이샤
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Publication of KR20190097064A publication Critical patent/KR20190097064A/ko
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H01L27/14618—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
    • H01L27/14683—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/805—Coatings
    • H10F39/8057—Optical shielding

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Studio Devices (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
KR1020197018115A 2016-12-28 2017-12-15 카메라 모듈, 카메라 모듈의 제조 방법 및 전자기기 Abandoned KR20190097064A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016256829A JP6869717B2 (ja) 2016-12-28 2016-12-28 撮像装置および撮像装置の製造方法、並びに、電子機器
JPJP-P-2016-256829 2016-12-28
PCT/JP2017/045041 WO2018123643A1 (en) 2016-12-28 2017-12-15 Camera module, method for producing camera module,and electronic apparatus

Publications (1)

Publication Number Publication Date
KR20190097064A true KR20190097064A (ko) 2019-08-20

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197018115A Abandoned KR20190097064A (ko) 2016-12-28 2017-12-15 카메라 모듈, 카메라 모듈의 제조 방법 및 전자기기

Country Status (6)

Country Link
US (1) US20200098810A1 (enExample)
EP (1) EP3563414B1 (enExample)
JP (1) JP6869717B2 (enExample)
KR (1) KR20190097064A (enExample)
CN (1) CN109952648B (enExample)
WO (1) WO2018123643A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12040338B2 (en) 2018-10-24 2024-07-16 Sony Semiconductor Solutions Corporation Imaging apparatus

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6976751B2 (ja) * 2017-07-06 2021-12-08 ソニーセミコンダクタソリューションズ株式会社 撮像装置および撮像装置の製造方法、並びに、電子機器
JP2019066422A (ja) 2017-10-04 2019-04-25 ソニーセミコンダクタソリューションズ株式会社 検査装置、および検査方法、並びに、プログラム
WO2020184267A1 (ja) * 2019-03-08 2020-09-17 デクセリアルズ株式会社 接続構造体の製造方法、及び接続構造体、並びにフィルム構造体、及びフィルム構造体の製造方法
JP7334675B2 (ja) * 2020-05-25 2023-08-29 株式会社デンソー 車載カメラ及び車両制御システム

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016056510A1 (ja) 2014-10-06 2016-04-14 東洋製罐グループホールディングス株式会社 塗装金属板及び有機樹脂被覆塗装金属板

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JP3971087B2 (ja) * 2000-06-26 2007-09-05 株式会社リコー 固体撮像装置
JP2009003073A (ja) * 2007-06-20 2009-01-08 Hitachi Maxell Ltd カメラモジュール、台座マウント及び撮像装置
JP4932745B2 (ja) * 2008-01-10 2012-05-16 シャープ株式会社 固体撮像装置およびそれを備えた電子機器
US8179462B2 (en) * 2008-10-28 2012-05-15 Panasonic Corporation Imaging unit
JP2011238667A (ja) * 2010-05-06 2011-11-24 Shinko Electric Ind Co Ltd 固体撮像装置の製造方法および固体撮像装置
JP5595786B2 (ja) * 2010-05-11 2014-09-24 シャープ株式会社 カメラモジュールおよびそれを備えた電子機器
JP2012018993A (ja) * 2010-07-06 2012-01-26 Toshiba Corp カメラモジュールおよびその製造方法
JP5031876B2 (ja) * 2010-09-24 2012-09-26 シャープ株式会社 カメラモジュールおよび撮像装置
JP2012222546A (ja) * 2011-04-07 2012-11-12 Sony Corp 固体撮像装置及びその製造方法、並びに電子機器
CN202120913U (zh) * 2011-06-08 2012-01-18 旭丽电子(广州)有限公司 薄型化图像撷取模块
US9007520B2 (en) * 2012-08-10 2015-04-14 Nanchang O-Film Optoelectronics Technology Ltd Camera module with EMI shield
KR102055840B1 (ko) * 2014-02-20 2019-12-17 삼성전자 주식회사 이미지 센서 패키지
JP6254680B2 (ja) * 2014-04-04 2018-01-10 シャープ株式会社 レンズ素子および撮像装置
US9997554B2 (en) * 2014-12-24 2018-06-12 Stmicroelectronics Pte Ltd Chip scale package camera module with glass interposer having lateral conductive traces between a first and second glass layer and method for making the same
JP6479857B2 (ja) * 2015-01-23 2019-03-06 シャープ株式会社 カメラモジュールの製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016056510A1 (ja) 2014-10-06 2016-04-14 東洋製罐グループホールディングス株式会社 塗装金属板及び有機樹脂被覆塗装金属板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12040338B2 (en) 2018-10-24 2024-07-16 Sony Semiconductor Solutions Corporation Imaging apparatus

Also Published As

Publication number Publication date
WO2018123643A1 (en) 2018-07-05
CN109952648B (zh) 2023-07-14
CN109952648A (zh) 2019-06-28
EP3563414A1 (en) 2019-11-06
JP2018110302A (ja) 2018-07-12
US20200098810A1 (en) 2020-03-26
EP3563414B1 (en) 2021-11-24
JP6869717B2 (ja) 2021-05-12

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