CN109952648B - 相机模块、相机模块的制造方法和电子设备 - Google Patents

相机模块、相机模块的制造方法和电子设备 Download PDF

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CN109952648B
CN109952648B CN201780068936.XA CN201780068936A CN109952648B CN 109952648 B CN109952648 B CN 109952648B CN 201780068936 A CN201780068936 A CN 201780068936A CN 109952648 B CN109952648 B CN 109952648B
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solid
camera module
lens
state imaging
camera
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CN109952648A (zh
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木村胜治
关大一
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Sony Semiconductor Solutions Corp
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Sony Semiconductor Solutions Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/805—Coatings
    • H10F39/8057—Optical shielding

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Studio Devices (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
CN201780068936.XA 2016-12-28 2017-12-15 相机模块、相机模块的制造方法和电子设备 Active CN109952648B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016256829A JP6869717B2 (ja) 2016-12-28 2016-12-28 撮像装置および撮像装置の製造方法、並びに、電子機器
JP2016-256829 2016-12-28
PCT/JP2017/045041 WO2018123643A1 (en) 2016-12-28 2017-12-15 Camera module, method for producing camera module,and electronic apparatus

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CN109952648A CN109952648A (zh) 2019-06-28
CN109952648B true CN109952648B (zh) 2023-07-14

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US (1) US20200098810A1 (enExample)
EP (1) EP3563414B1 (enExample)
JP (1) JP6869717B2 (enExample)
KR (1) KR20190097064A (enExample)
CN (1) CN109952648B (enExample)
WO (1) WO2018123643A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6976751B2 (ja) * 2017-07-06 2021-12-08 ソニーセミコンダクタソリューションズ株式会社 撮像装置および撮像装置の製造方法、並びに、電子機器
JP2019066422A (ja) 2017-10-04 2019-04-25 ソニーセミコンダクタソリューションズ株式会社 検査装置、および検査方法、並びに、プログラム
JP2020068302A (ja) * 2018-10-24 2020-04-30 ソニーセミコンダクタソリューションズ株式会社 撮像装置
WO2020184267A1 (ja) * 2019-03-08 2020-09-17 デクセリアルズ株式会社 接続構造体の製造方法、及び接続構造体、並びにフィルム構造体、及びフィルム構造体の製造方法
JP7334675B2 (ja) * 2020-05-25 2023-08-29 株式会社デンソー 車載カメラ及び車両制御システム

Citations (7)

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JP2002009206A (ja) * 2000-06-26 2002-01-11 Ricoh Co Ltd 固体撮像装置、その製造方法、画像読取ユニット及び画像走査装置
JP2009170977A (ja) * 2008-01-10 2009-07-30 Sharp Corp 固体撮像装置およびそれを備えた電子機器
CN102077577A (zh) * 2008-10-28 2011-05-25 松下电器产业株式会社 摄像组件
CN102237388A (zh) * 2010-05-06 2011-11-09 新光电气工业株式会社 制造固态图像传感装置的方法及固态图像传感装置
CN102738189A (zh) * 2011-04-07 2012-10-17 索尼公司 固体摄像装置及其制造方法和电子系统
CN205194700U (zh) * 2014-12-24 2016-04-27 意法半导体有限公司 具有玻璃中介层的芯片级封装照相机模块
WO2016117250A1 (ja) * 2015-01-23 2016-07-28 シャープ株式会社 カメラモジュールの製造方法、像面側群レンズ、像面側群レンズの製造方法、および撮像素子

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JP2009003073A (ja) * 2007-06-20 2009-01-08 Hitachi Maxell Ltd カメラモジュール、台座マウント及び撮像装置
JP5595786B2 (ja) * 2010-05-11 2014-09-24 シャープ株式会社 カメラモジュールおよびそれを備えた電子機器
JP2012018993A (ja) * 2010-07-06 2012-01-26 Toshiba Corp カメラモジュールおよびその製造方法
JP5031876B2 (ja) * 2010-09-24 2012-09-26 シャープ株式会社 カメラモジュールおよび撮像装置
CN202120913U (zh) * 2011-06-08 2012-01-18 旭丽电子(广州)有限公司 薄型化图像撷取模块
US9007520B2 (en) * 2012-08-10 2015-04-14 Nanchang O-Film Optoelectronics Technology Ltd Camera module with EMI shield
KR102055840B1 (ko) * 2014-02-20 2019-12-17 삼성전자 주식회사 이미지 센서 패키지
JP6254680B2 (ja) * 2014-04-04 2018-01-10 シャープ株式会社 レンズ素子および撮像装置
EP3205494B1 (en) 2014-10-06 2019-09-25 Toyo Seikan Group Holdings, Ltd. Coated metal plate and organic resin-coated coated metal plate

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002009206A (ja) * 2000-06-26 2002-01-11 Ricoh Co Ltd 固体撮像装置、その製造方法、画像読取ユニット及び画像走査装置
JP2009170977A (ja) * 2008-01-10 2009-07-30 Sharp Corp 固体撮像装置およびそれを備えた電子機器
CN102077577A (zh) * 2008-10-28 2011-05-25 松下电器产业株式会社 摄像组件
CN102237388A (zh) * 2010-05-06 2011-11-09 新光电气工业株式会社 制造固态图像传感装置的方法及固态图像传感装置
CN102738189A (zh) * 2011-04-07 2012-10-17 索尼公司 固体摄像装置及其制造方法和电子系统
CN205194700U (zh) * 2014-12-24 2016-04-27 意法半导体有限公司 具有玻璃中介层的芯片级封装照相机模块
WO2016117250A1 (ja) * 2015-01-23 2016-07-28 シャープ株式会社 カメラモジュールの製造方法、像面側群レンズ、像面側群レンズの製造方法、および撮像素子

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Publication number Publication date
WO2018123643A1 (en) 2018-07-05
CN109952648A (zh) 2019-06-28
EP3563414A1 (en) 2019-11-06
JP2018110302A (ja) 2018-07-12
KR20190097064A (ko) 2019-08-20
US20200098810A1 (en) 2020-03-26
EP3563414B1 (en) 2021-11-24
JP6869717B2 (ja) 2021-05-12

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