KR20190038390A - 스크라이브 가공 방법 및 스크라이브 가공 장치 - Google Patents

스크라이브 가공 방법 및 스크라이브 가공 장치 Download PDF

Info

Publication number
KR20190038390A
KR20190038390A KR1020180115136A KR20180115136A KR20190038390A KR 20190038390 A KR20190038390 A KR 20190038390A KR 1020180115136 A KR1020180115136 A KR 1020180115136A KR 20180115136 A KR20180115136 A KR 20180115136A KR 20190038390 A KR20190038390 A KR 20190038390A
Authority
KR
South Korea
Prior art keywords
light
glass substrate
laser
scribe
processing
Prior art date
Application number
KR1020180115136A
Other languages
English (en)
Korean (ko)
Inventor
히로요시 하야시
후미요시 나카타니
Original Assignee
미쓰보시 다이야몬도 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미쓰보시 다이야몬도 고교 가부시키가이샤 filed Critical 미쓰보시 다이야몬도 고교 가부시키가이샤
Publication of KR20190038390A publication Critical patent/KR20190038390A/ko

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037—Controlling or regulating
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
    • C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Thermal Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
KR1020180115136A 2017-09-29 2018-09-27 스크라이브 가공 방법 및 스크라이브 가공 장치 KR20190038390A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2017-191500 2017-09-29
JP2017191500A JP6904567B2 (ja) 2017-09-29 2017-09-29 スクライブ加工方法及びスクライブ加工装置

Publications (1)

Publication Number Publication Date
KR20190038390A true KR20190038390A (ko) 2019-04-08

Family

ID=65919936

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180115136A KR20190038390A (ko) 2017-09-29 2018-09-27 스크라이브 가공 방법 및 스크라이브 가공 장치

Country Status (4)

Country Link
JP (1) JP6904567B2 (zh)
KR (1) KR20190038390A (zh)
CN (1) CN109570782A (zh)
TW (1) TW201921464A (zh)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013536081A (ja) 2010-07-12 2013-09-19 フィレイザー ユーエスエー エルエルシー レーザーフィラメント形成による材料加工方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2658809B2 (ja) * 1992-08-27 1997-09-30 三菱電機株式会社 レーザ加工装置
TW583046B (en) * 2001-08-10 2004-04-11 Mitsuboshi Diamond Ind Co Ltd Method and device for scribing brittle material substrate
EP2216128B1 (en) * 2002-03-12 2016-01-27 Hamamatsu Photonics K.K. Method of cutting object to be processed
US9138913B2 (en) * 2005-09-08 2015-09-22 Imra America, Inc. Transparent material processing with an ultrashort pulse laser
JP4867301B2 (ja) * 2005-11-11 2012-02-01 セイコーエプソン株式会社 レーザスクライブ加工方法
JP2007185664A (ja) * 2006-01-11 2007-07-26 Seiko Epson Corp レーザ内部スクライブ方法
JP2007284269A (ja) * 2006-04-13 2007-11-01 Seiko Epson Corp レーザスクライブ方法および電気光学装置
JP2007284310A (ja) * 2006-04-19 2007-11-01 Seiko Epson Corp レーザスクライブ方法、レーザ加工装置および電気光学装置
JP2007290932A (ja) * 2006-04-27 2007-11-08 Seiko Epson Corp スクライブ装置ならびにスクライブ方法
JP2008155269A (ja) * 2006-12-26 2008-07-10 Seiko Epson Corp 基板の分断方法、レーザスクライブ装置及び電気光学装置の製造方法
JP5379384B2 (ja) * 2008-02-15 2013-12-25 サイバーレーザー株式会社 レーザによる透明基板の加工方法および装置
TWI395630B (zh) * 2009-06-30 2013-05-11 Mitsuboshi Diamond Ind Co Ltd 使用雷射光之玻璃基板加工裝置
JP2011110591A (ja) * 2009-11-27 2011-06-09 Pioneer Electronic Corp レーザ加工装置
KR101217698B1 (ko) * 2010-08-16 2013-01-02 주식회사 이오테크닉스 순차적 멀티 포커싱을 이용한 레이저 가공방법 및 레이저 가공장치
KR101920100B1 (ko) * 2011-08-19 2018-11-19 에이지씨 가부시키가이샤 유리 기판의 절단 방법, 고체 촬상 장치용 광학 유리
JP5966468B2 (ja) * 2012-03-15 2016-08-10 三星ダイヤモンド工業株式会社 レーザー加工装置
CN202539812U (zh) * 2012-04-20 2012-11-21 华中科技大学 一种激光多点聚焦加工系统
JP5904590B2 (ja) * 2012-10-05 2016-04-13 株式会社日本製鋼所 結晶質半導体の製造方法および結晶質半導体の製造装置
DE102012110971A1 (de) * 2012-11-14 2014-05-15 Schott Ag Trennen von transparenten Werkstücken
JP6272300B2 (ja) * 2013-03-27 2018-01-31 浜松ホトニクス株式会社 レーザ加工装置及びレーザ加工方法
CN104646834A (zh) * 2013-11-18 2015-05-27 北京科涵龙顺激光设备有限公司 激光划片的方法及系统
JP2017171530A (ja) * 2016-03-23 2017-09-28 株式会社アライドレーザー 断面端部不加工鏡面切断法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013536081A (ja) 2010-07-12 2013-09-19 フィレイザー ユーエスエー エルエルシー レーザーフィラメント形成による材料加工方法

Also Published As

Publication number Publication date
TW201921464A (zh) 2019-06-01
CN109570782A (zh) 2019-04-05
JP2019064863A (ja) 2019-04-25
JP6904567B2 (ja) 2021-07-21

Similar Documents

Publication Publication Date Title
KR101757937B1 (ko) 가공대상물 절단방법
US8828891B2 (en) Laser processing method
JP5410250B2 (ja) レーザ加工方法及びレーザ加工装置
JP5094996B2 (ja) レーザ加工装置
KR101839439B1 (ko) 레이저 가공시스템
JP7437323B2 (ja) レーザ加工装置、これを動作させる方法、及びこれを用いてワークピースを加工する方法
KR102128416B1 (ko) 레이저 가공 장치 및 레이저 가공 방법
KR20150133713A (ko) 레이저 가공 장치 및 레이저 가공 방법
JP2015223620A (ja) レーザ加工装置及びレーザ加工方法
JP2008272830A (ja) レーザ加工装置
KR20190093222A (ko) 레이저 가공 장치에서 광학계의 수명을 연장하는 방법 및 시스템
JP2006068762A (ja) レーザー加工方法およびレーザー加工装置
KR101918203B1 (ko) 레이저 처리 장치 및 방법
TWI628028B (zh) 雷射加工裝置與方法
KR20190038390A (ko) 스크라이브 가공 방법 및 스크라이브 가공 장치
JP2001276985A (ja) マーキング方法、装置及びマーキングされた光学部材
JP7456604B2 (ja) スクライブ加工方法及びスクライブ加工装置
US20080165406A1 (en) Subsurface Reticle
JP2010184265A (ja) レーザ光照射装置及び照射方法

Legal Events

Date Code Title Description
A201 Request for examination