JP6272300B2 - レーザ加工装置及びレーザ加工方法 - Google Patents
レーザ加工装置及びレーザ加工方法 Download PDFInfo
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
- B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
- B23K26/0617—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis and with spots spaced along the common axis
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
- B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Laser Beam Processing (AREA)
- Dicing (AREA)
Description
なお、「アキシコンレンズパターン」とは、アキシコンレンズの作用を実現するように生成された変調パターンを意味している(以下、同じ)。
一方、入射面側改質領域及び反対面側改質領域を形成する場合、アキシコンレンズパターンを変調パターンとして空間光変調器に表示させないため、入射面側改質領域及び反対面側改質領域が縦長となるのに起因しレーザ光入射面及びその反対面にダメージが生じ易くなることも抑制できる。従って、本発明の一側面によれば、加工品質を向上することが可能となる。
変調パターンの表示無し :抗折強度 75.3MPa
アキシコンレンズパターンを表示 :抗折強度 109.6MPa
Claims (4)
- 加工対象物にレーザ光を集光させることにより、レーザ光照射方向に沿って複数列の改質領域を、前記加工対象物の内部に切断予定ラインに沿って形成するレーザ加工装置であって、
前記レーザ光を出射するレーザ光源と、
前記レーザ光源により出射された前記レーザ光を変調する空間光変調器と、
前記空間光変調器により変調された前記レーザ光を前記加工対象物に集光する集光光学系と、を備え、
複数列の前記改質領域は、
レーザ光入射面側に位置する入射面側改質領域と、
前記レーザ光入射面の反対面側に位置する反対面側改質領域と、
前記入射面側改質領域と前記反対面側改質領域との間に位置する中間改質領域と、を少なくとも含み、
前記空間光変調器は、
前記中間改質領域を形成する場合には、アキシコンレンズパターンを変調パターンとして表示することにより、レーザ光照射方向に沿って近接して並ぶ複数位置に集光点が形成されるように前記レーザ光を集光させると共に、
前記入射面側改質領域及び前記反対面側改質領域を形成する場合には、前記アキシコンレンズパターンを変調パターンとして表示しない、レーザ加工装置。 - 前記レーザ加工装置は、前記切断予定ラインに沿って前記加工対象物の内部に改質スポットを複数形成し、複数の前記改質スポットによって前記改質領域を形成するものであって、
前記空間光変調器は、前記中間改質領域を形成する場合、前記レーザ光照射方向に沿って近接して並ぶ前記複数位置のそれぞれに改質ドットを形成させ、
複数の前記改質ドットは、前記レーザ光照射方向に長尺形状の前記改質スポットを構成する、請求項1記載のレーザ加工装置。 - 前記空間光変調器の表示部において、
前記アキシコンレンズパターンは、入射する前記レーザ光に対し中心に位置する円領域と、前記円領域の周囲に画設され当該円領域と同心の複数の円環領域と、を有しており、
前記円領域及び複数の前記円環領域では、径方向外側から内側に行くに従って明度が徐々に明るくなるように設定されている、請求項1又は2記載のレーザ加工装置。 - レーザ光源から出射されたレーザ光を空間光変調器によって変調し、前記空間光変調器で変調された前記レーザ光を加工対象物に集光させることにより、レーザ光照射方向に沿って複数列の改質領域を、前記加工対象物の内部に切断予定ラインに沿って形成するレーザ加工方法であって、
レーザ光入射面側に位置する入射面側改質領域を形成する工程と、
前記レーザ光入射面の反対面側に位置する反対面側改質領域を形成する工程と、
前記入射面側改質領域と前記反対面側改質領域との間に位置する中間改質領域を形成する工程と、を少なくとも具備し、
前記中間改質領域を形成する工程では、前記空間光変調器にアキシコンレンズパターンを変調パターンとして表示することにより、レーザ光照射方向に沿って近接して並ぶ複数位置に集光点が形成されるように前記レーザ光を集光させ、
前記入射面側改質領域を形成する工程及び前記反対面側改質領域を形成する工程では、前記空間光変調器にアキシコンレンズパターンを変調パターンとして表示しない、レーザ加工方法。
Applications Claiming Priority (3)
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JP2013065990 | 2013-03-27 | ||
JP2013065990 | 2013-03-27 | ||
PCT/JP2014/056723 WO2014156687A1 (ja) | 2013-03-27 | 2014-03-13 | レーザ加工装置及びレーザ加工方法 |
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US (1) | US9902017B2 (ja) |
JP (1) | JP6272300B2 (ja) |
KR (1) | KR102128416B1 (ja) |
CN (1) | CN105209219B (ja) |
DE (1) | DE112014001653B4 (ja) |
TW (1) | TWI648119B (ja) |
WO (1) | WO2014156687A1 (ja) |
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JP6689631B2 (ja) | 2016-03-10 | 2020-04-28 | 浜松ホトニクス株式会社 | レーザ光照射装置及びレーザ光照射方法 |
JP6904567B2 (ja) * | 2017-09-29 | 2021-07-21 | 三星ダイヤモンド工業株式会社 | スクライブ加工方法及びスクライブ加工装置 |
US10707130B2 (en) | 2018-03-05 | 2020-07-07 | The Chinese University Of Hong Kong | Systems and methods for dicing samples using a bessel beam matrix |
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US9902017B2 (en) | 2018-02-27 |
CN105209219A (zh) | 2015-12-30 |
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US20160045979A1 (en) | 2016-02-18 |
KR20150133709A (ko) | 2015-11-30 |
JPWO2014156687A1 (ja) | 2017-02-16 |
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