KR20190031267A - 반도체 웨이퍼 상의 균일한 두께의 전기-증착 금속층 - Google Patents

반도체 웨이퍼 상의 균일한 두께의 전기-증착 금속층 Download PDF

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Publication number
KR20190031267A
KR20190031267A KR1020197004346A KR20197004346A KR20190031267A KR 20190031267 A KR20190031267 A KR 20190031267A KR 1020197004346 A KR1020197004346 A KR 1020197004346A KR 20197004346 A KR20197004346 A KR 20197004346A KR 20190031267 A KR20190031267 A KR 20190031267A
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KR
South Korea
Prior art keywords
solution
crossbar
semiconductor wafer
cathode
hollow
Prior art date
Application number
KR1020197004346A
Other languages
English (en)
Korean (ko)
Inventor
조지 라딜
Original Assignee
테크닉, 인크
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 테크닉, 인크 filed Critical 테크닉, 인크
Publication of KR20190031267A publication Critical patent/KR20190031267A/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/14—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with multiple outlet openings; with strainers in or outside the outlet opening
    • B05B1/20—Arrangements of several outlets along elongated bodies, e.g. perforated pipes or troughs, e.g. spray booms; Outlet elements therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/14—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with multiple outlet openings; with strainers in or outside the outlet opening
    • B05B1/20—Arrangements of several outlets along elongated bodies, e.g. perforated pipes or troughs, e.g. spray booms; Outlet elements therefor
    • B05B1/205—Arrangements of several outlets along elongated bodies, e.g. perforated pipes or troughs, e.g. spray booms; Outlet elements therefor characterised by the longitudinal shape of the elongated body
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B3/00—Spraying or sprinkling apparatus with moving outlet elements or moving deflecting elements
    • B05B3/02—Spraying or sprinkling apparatus with moving outlet elements or moving deflecting elements with rotating elements
    • B05B3/04—Spraying or sprinkling apparatus with moving outlet elements or moving deflecting elements with rotating elements driven by the liquid or other fluent material discharged, e.g. the liquid actuating a motor before passing to the outlet
    • B05B3/06—Spraying or sprinkling apparatus with moving outlet elements or moving deflecting elements with rotating elements driven by the liquid or other fluent material discharged, e.g. the liquid actuating a motor before passing to the outlet by jet reaction, i.e. creating a spinning torque due to a tangential component of the jet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B9/00—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour
    • B05B9/03—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material
    • B05B9/04—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump
    • B05B9/0403—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump with pumps for liquids or other fluent material
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B14/00—Arrangements for collecting, re-using or eliminating excess spraying material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B5/00—Electrostatic spraying apparatus; Spraying apparatus with means for charging the spray electrically; Apparatus for spraying liquids or other fluent materials by other electric means
    • B05B5/007—Electrostatic spraying apparatus; Spraying apparatus with means for charging the spray electrically; Apparatus for spraying liquids or other fluent materials by other electric means the high voltage supplied to an electrostatic spraying apparatus during spraying operation being periodical or in time, e.g. sinusoidal
    • B05B5/008—Electrostatic spraying apparatus; Spraying apparatus with means for charging the spray electrically; Apparatus for spraying liquids or other fluent materials by other electric means the high voltage supplied to an electrostatic spraying apparatus during spraying operation being periodical or in time, e.g. sinusoidal with periodical change of polarity

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Physics & Mathematics (AREA)
  • Nozzles (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
KR1020197004346A 2016-07-20 2017-07-17 반도체 웨이퍼 상의 균일한 두께의 전기-증착 금속층 KR20190031267A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662364538P 2016-07-20 2016-07-20
US62/364,538 2016-07-20
PCT/US2017/042323 WO2018017452A1 (en) 2016-07-20 2017-07-17 Electro-depositing metal layers of uniform thickness on semiconducting wafers

Publications (1)

Publication Number Publication Date
KR20190031267A true KR20190031267A (ko) 2019-03-25

Family

ID=60992514

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197004346A KR20190031267A (ko) 2016-07-20 2017-07-17 반도체 웨이퍼 상의 균일한 두께의 전기-증착 금속층

Country Status (6)

Country Link
JP (1) JP7073332B2 (ja)
KR (1) KR20190031267A (ja)
CN (1) CN109475884A (ja)
DE (1) DE112017003666T5 (ja)
SG (1) SG11201811476XA (ja)
WO (1) WO2018017452A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111321448B (zh) * 2020-03-17 2021-03-23 佳波(惠州)电镀有限公司 一种金属制品电镀设备
CN112263197B (zh) * 2020-09-30 2022-03-18 宁波方太厨具有限公司 一种清洗机
WO2022118431A1 (ja) * 2020-12-03 2022-06-09 株式会社荏原製作所 めっき装置、およびめっき方法
CN112875943B (zh) * 2021-01-14 2022-12-16 芜湖市爱三迪电子科技有限公司 一种3d打印机生产用废水净化装置
CN114959842B (zh) * 2021-02-18 2024-06-07 日月光半导体制造股份有限公司 电镀装置及制造封装结构的方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04311591A (ja) * 1991-04-08 1992-11-04 Sumitomo Metal Ind Ltd めっき装置及びめっき方法
JPH05195183A (ja) * 1992-01-23 1993-08-03 Mitsubishi Electric Corp 半導体装置の製造方法
US6001235A (en) * 1997-06-23 1999-12-14 International Business Machines Corporation Rotary plater with radially distributed plating solution
EP1055020A2 (en) * 1998-02-12 2000-11-29 ACM Research, Inc. Plating apparatus and method
JP3364485B2 (ja) * 2001-03-07 2003-01-08 株式会社半導体先端テクノロジーズ めっき装置、及び半導体装置の製造方法
JP4171368B2 (ja) * 2003-08-11 2008-10-22 株式会社ルネサステクノロジ 半導体装置の製造方法
US7358186B2 (en) * 2003-12-12 2008-04-15 Lam Research Corporation Method and apparatus for material deposition in semiconductor fabrication
US20060131276A1 (en) * 2004-12-17 2006-06-22 Johnston Steven W Uniformity in batch spray processing using independent cassette rotation
TWI343840B (en) * 2005-07-06 2011-06-21 Applied Materials Inc Apparatus for electroless deposition of metals onto semiconductor substrates
US20080128019A1 (en) * 2006-12-01 2008-06-05 Applied Materials, Inc. Method of metallizing a solar cell substrate
US7966968B2 (en) * 2007-04-27 2011-06-28 Taiwan Semiconductor Manufacturing Company, Ltd. Electroless plating apparatus with non-liquid heating source
JP2012082450A (ja) * 2010-10-07 2012-04-26 Teramikros Inc めっき装置およびめっき方法
US9414736B2 (en) * 2011-09-22 2016-08-16 Whirlpool Corporation Dishwasher with directional spray
CN204874804U (zh) * 2015-05-29 2015-12-16 东莞市开美电路板设备有限公司 镀铜槽

Also Published As

Publication number Publication date
WO2018017452A1 (en) 2018-01-25
DE112017003666T5 (de) 2019-05-02
CN109475884A (zh) 2019-03-15
JP7073332B2 (ja) 2022-05-23
JP2019525000A (ja) 2019-09-05
SG11201811476XA (en) 2019-02-27

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