KR20190022650A - 가요성 열전 모듈 - Google Patents

가요성 열전 모듈 Download PDF

Info

Publication number
KR20190022650A
KR20190022650A KR1020197001588A KR20197001588A KR20190022650A KR 20190022650 A KR20190022650 A KR 20190022650A KR 1020197001588 A KR1020197001588 A KR 1020197001588A KR 20197001588 A KR20197001588 A KR 20197001588A KR 20190022650 A KR20190022650 A KR 20190022650A
Authority
KR
South Korea
Prior art keywords
thermoelectric
vias
flexible
thermoelectric module
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020197001588A
Other languages
English (en)
Korean (ko)
Inventor
재용 이
로저 더블유 바톤
에밀리 엘 보웬
도나토 지 카레이그
가레스 에이 휴
라비 팔라니스와미
제임스 에프 포쉬
마이클 더블유 돌레잘
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 컴파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쓰리엠 이노베이티브 프로퍼티즈 컴파니 filed Critical 쓰리엠 이노베이티브 프로퍼티즈 컴파니
Publication of KR20190022650A publication Critical patent/KR20190022650A/ko
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01—Manufacture or treatment
    • H01L35/34—
    • H01L35/04—
    • H01L35/16—
    • H01L35/18—
    • H01L35/22—
    • H01L35/24—
    • H01L35/32—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/81—Structural details of the junction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/82—Interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/851—Thermoelectric active materials comprising inorganic compositions
    • H10N10/852—Thermoelectric active materials comprising inorganic compositions comprising tellurium, selenium or sulfur
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/851—Thermoelectric active materials comprising inorganic compositions
    • H10N10/853—Thermoelectric active materials comprising inorganic compositions comprising arsenic, antimony or bismuth
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/851—Thermoelectric active materials comprising inorganic compositions
    • H10N10/855—Thermoelectric active materials comprising inorganic compositions comprising compounds containing boron, carbon, oxygen or nitrogen
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/856—Thermoelectric active materials comprising organic compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structure Of Printed Boards (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
KR1020197001588A 2016-06-23 2017-06-13 가요성 열전 모듈 Ceased KR20190022650A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662353741P 2016-06-23 2016-06-23
US62/353,741 2016-06-23
PCT/US2017/037117 WO2017222862A1 (en) 2016-06-23 2017-06-13 Flexible thermoelectric module

Publications (1)

Publication Number Publication Date
KR20190022650A true KR20190022650A (ko) 2019-03-06

Family

ID=59091662

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197001588A Ceased KR20190022650A (ko) 2016-06-23 2017-06-13 가요성 열전 모듈

Country Status (6)

Country Link
US (1) US20190181323A1 (enExample)
EP (1) EP3475989B1 (enExample)
JP (1) JP2019525455A (enExample)
KR (1) KR20190022650A (enExample)
CN (1) CN109314173A (enExample)
WO (1) WO2017222862A1 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210249580A1 (en) * 2015-05-14 2021-08-12 Sridhar Kasichainula Flexible encapsulation of a flexible thin-film based thermoelectric device with sputter deposited layer of n-type and p-type thermoelectric legs
US20210249579A1 (en) * 2015-05-14 2021-08-12 Sridhar Kasichainula Flexible encapsulation of a flexible thin-film based thermoelectric device with sputter deposited layer of n-type and p-type thermoelectric legs
US11114599B2 (en) 2017-03-31 2021-09-07 3M Innovative Properties Company Electronic devices including solid semiconductor dies
US11338236B2 (en) 2017-04-28 2022-05-24 3M Innovative Properties Company Air filtration monitoring based on thermoelectric devices
US11640013B2 (en) * 2017-10-13 2023-05-02 University Of Utah Research Foundation Weather-detecting devices and related methods
CN111433576B (zh) 2017-12-08 2022-06-28 3M创新有限公司 差分热电装置
NL2020206B1 (nl) * 2017-12-29 2019-07-08 Arcadis Nederland B V Thermo-elektrisch element en werkwijze voor het vervaardigen daarvan
CN112853492B (zh) * 2019-11-27 2022-10-11 中国科学院金属研究所 一种SnSe／CNT高温柔性热电薄膜材料及其制备方法
CN113203348B (zh) * 2021-04-30 2022-07-12 中国科学院物理研究所 一种纤维型热电模块多区域识别器及其制备方法
JP7627034B2 (ja) * 2021-06-23 2025-02-05 国立研究開発法人物質・材料研究機構 平面型熱電変換素子、および、その製造方法
CN114220908A (zh) * 2021-11-16 2022-03-22 东莞先导先进科技有限公司 一种柔性热电制冷器的制备工艺、电子设备
WO2024057344A2 (en) * 2022-09-13 2024-03-21 Fallahshayan Masood Advanced ultra-low-power ecg patch integrating self-power generation with artificial intelligence cloud platform
CN116429276A (zh) * 2023-04-06 2023-07-14 武汉理工大学 一种取能测温一体化可塑型温度传感器及其制备和温度传感方法
US20250052621A1 (en) * 2023-08-07 2025-02-13 City University Of Hong Kong Wide-band photodetectors using thermoelectric materials

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH413018A (de) * 1963-04-30 1966-05-15 Du Pont Thermoelektrischer Generator
SU455702A1 (ru) * 1973-12-06 1976-08-05 Предприятие П/Я В-2763 Термоэлемент
US6127619A (en) * 1998-06-08 2000-10-03 Ormet Corporation Process for producing high performance thermoelectric modules
DE10022726C2 (de) * 1999-08-10 2003-07-10 Matsushita Electric Works Ltd Thermoelektrisches Modul mit verbessertem Wärmeübertragungsvermögen und Verfahren zum Herstellen desselben
JP4200256B2 (ja) * 1999-08-10 2008-12-24 パナソニック電工株式会社 熱電変換モジュール
US6611046B2 (en) 2001-06-05 2003-08-26 3M Innovative Properties Company Flexible polyimide circuits having predetermined via angles
US7012017B2 (en) 2004-01-29 2006-03-14 3M Innovative Properties Company Partially etched dielectric film with conductive features
JP2005217353A (ja) * 2004-02-02 2005-08-11 Yokohama Teikoki Kk 熱電半導体素子、熱電変換モジュールおよびその製造方法
JP2005353710A (ja) * 2004-06-09 2005-12-22 Suzuki Sogyo Co Ltd 熱電素子モジュール及びその製法
CN1969398A (zh) * 2004-06-17 2007-05-23 阿鲁策株式会社 热电转换模块
JP4829552B2 (ja) * 2004-07-06 2011-12-07 財団法人電力中央研究所 熱電変換モジュール
US20080308140A1 (en) * 2004-08-17 2008-12-18 The Furukawa Electric Co., Ltd. Thermo-Electric Cooling Device
JP2008227178A (ja) * 2007-03-13 2008-09-25 Sumitomo Chemical Co Ltd 熱電変換モジュール用基板及び熱電変換モジュール
TWI338390B (en) * 2007-07-12 2011-03-01 Ind Tech Res Inst Flexible thermoelectric device and manufacturing method thereof
US20100154855A1 (en) * 2008-12-18 2010-06-24 David Nemir Thin walled thermoelectric devices and methods for production thereof
US20110030754A1 (en) * 2009-08-06 2011-02-10 Laird Technologies, Inc. Thermoelectric modules and related methods
US9698563B2 (en) 2010-11-03 2017-07-04 3M Innovative Properties Company Flexible LED device and method of making
US20130218241A1 (en) * 2012-02-16 2013-08-22 Nanohmics, Inc. Membrane-Supported, Thermoelectric Compositions
JP2014007376A (ja) * 2012-05-30 2014-01-16 Denso Corp 熱電変換装置
JP6035970B2 (ja) * 2012-08-03 2016-11-30 富士通株式会社 熱電変換デバイス及びその製造方法
JP5984748B2 (ja) * 2013-07-01 2016-09-06 富士フイルム株式会社 熱電変換素子および熱電変換モジュール
KR101580041B1 (ko) * 2014-04-07 2015-12-23 홍익대학교 산학협력단 신축성 열전모듈
US20160163949A1 (en) * 2014-12-03 2016-06-09 Perpetua Power Source Technologies Flexible thermoelectric generator

Also Published As

Publication number Publication date
JP2019525455A (ja) 2019-09-05
EP3475989A1 (en) 2019-05-01
WO2017222862A1 (en) 2017-12-28
EP3475989B1 (en) 2021-03-17
CN109314173A (zh) 2019-02-05
US20190181323A1 (en) 2019-06-13

Similar Documents

Publication Publication Date Title
KR102047736B1 (ko) 가요성 열전 모듈
KR20190022650A (ko) 가요성 열전 모듈
KR102414392B1 (ko) 열전 테이프
CN104576917B (zh) 具有石墨烯探测层的霍尔效应传感器
US6127619A (en) Process for producing high performance thermoelectric modules
KR101878751B1 (ko) 그래핀 구조체 및 그 제조방법과, 그래핀 소자 및 그 제조방법
JP6488017B2 (ja) 熱電変換モジュール、熱電変換モジュールの製造方法および熱伝導性基板
JP2008132585A (ja) 相互接続されたナノワイヤに基づくナノ構造体の製造方法、ナノ構造体及び熱電コンバータとしての利用
TW200835047A (en) Integrated circuit device having antenna conductors and the mothod for the same
JP6553191B2 (ja) 熱電変換モジュール
US20160247995A1 (en) Thermoelectric converter having thermoelectric conversion elements connected to each other via wiring pattern, and method for fabricating the thermoelectric converter
US20160268493A1 (en) Manufacturing method of thermoelectric converter
US10347811B2 (en) Thermoelectric conversion module
US20140130839A1 (en) Structure useful for producing a thermoelectric generator, thermoelectric generator comprising same and method for producing same
JP2011166079A (ja) 熱電変換素子の製造方法
US20210143307A1 (en) Modules and elements for a thermoelectric generator
EP2028693B1 (en) Switching element, method of manufacturing the switching element, and memory element array
TW202502187A (zh) 熱電轉換模組
JP2004259667A (ja) カーボンナノチューブ電極の垂直整列法及び垂直に配列したカーボンナノチューブを具えたｆｅｄカソード
KR101327788B1 (ko) 자기장 센서 및 그를 이용한 자기장 측정 방법

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20190117

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20200325

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20201218

Patent event code: PE09021S01D

E90F Notification of reason for final refusal
PE0902 Notice of grounds for rejection

Comment text: Final Notice of Reason for Refusal

Patent event date: 20210528

Patent event code: PE09021S02D

E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20211022

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20210528

Comment text: Final Notice of Reason for Refusal

Patent event code: PE06011S02I

Patent event date: 20201218

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I