JP2019525455A - フレキシブル熱電モジュール - Google Patents

フレキシブル熱電モジュール Download PDF

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Publication number
JP2019525455A
JP2019525455A JP2018567101A JP2018567101A JP2019525455A JP 2019525455 A JP2019525455 A JP 2019525455A JP 2018567101 A JP2018567101 A JP 2018567101A JP 2018567101 A JP2018567101 A JP 2018567101A JP 2019525455 A JP2019525455 A JP 2019525455A
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JP
Japan
Prior art keywords
thermoelectric
flexible
thermoelectric module
substrate
vias
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Pending
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JP2018567101A
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English (en)
Japanese (ja)
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JP2019525455A5 (enExample
Inventor
ジェ ヨン リ
ジェ ヨン リ
ダブリュ．バートン ロジャー
ダブリュ．バートン ロジャー
エル．ボウエン エミリー
エル．ボウエン エミリー
ジー．カレイグ ドナート
ジー．カレイグ ドナート
エー．ヒューズ ガレス
エー．ヒューズ ガレス
パラニスワミー ラビ
パラニスワミー ラビ
エフ．ポック ジェイムズ
エフ．ポック ジェイムズ
ダブリュ．ドレサル マイケル
ダブリュ．ドレサル マイケル
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3M Innovative Properties Co
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3M Innovative Properties Co
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Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2019525455A publication Critical patent/JP2019525455A/ja
Publication of JP2019525455A5 publication Critical patent/JP2019525455A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/81—Structural details of the junction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/82—Interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/851—Thermoelectric active materials comprising inorganic compositions
    • H10N10/852—Thermoelectric active materials comprising inorganic compositions comprising tellurium, selenium or sulfur
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/851—Thermoelectric active materials comprising inorganic compositions
    • H10N10/853—Thermoelectric active materials comprising inorganic compositions comprising arsenic, antimony or bismuth
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/851—Thermoelectric active materials comprising inorganic compositions
    • H10N10/855—Thermoelectric active materials comprising inorganic compositions comprising compounds containing boron, carbon, oxygen or nitrogen
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/856—Thermoelectric active materials comprising organic compositions

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  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structure Of Printed Boards (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
JP2018567101A 2016-06-23 2017-06-13 フレキシブル熱電モジュール Pending JP2019525455A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662353741P 2016-06-23 2016-06-23
US62/353,741 2016-06-23
PCT/US2017/037117 WO2017222862A1 (en) 2016-06-23 2017-06-13 Flexible thermoelectric module

Publications (2)

Publication Number Publication Date
JP2019525455A true JP2019525455A (ja) 2019-09-05
JP2019525455A5 JP2019525455A5 (enExample) 2020-07-27

Family

ID=59091662

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018567101A Pending JP2019525455A (ja) 2016-06-23 2017-06-13 フレキシブル熱電モジュール

Country Status (6)

Country Link
US (1) US20190181323A1 (enExample)
EP (1) EP3475989B1 (enExample)
JP (1) JP2019525455A (enExample)
KR (1) KR20190022650A (enExample)
CN (1) CN109314173A (enExample)
WO (1) WO2017222862A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023002885A (ja) * 2021-06-23 2023-01-11 国立研究開発法人物質・材料研究機構 平面型熱電変換素子、および、その製造方法

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210249580A1 (en) * 2015-05-14 2021-08-12 Sridhar Kasichainula Flexible encapsulation of a flexible thin-film based thermoelectric device with sputter deposited layer of n-type and p-type thermoelectric legs
US20210249579A1 (en) * 2015-05-14 2021-08-12 Sridhar Kasichainula Flexible encapsulation of a flexible thin-film based thermoelectric device with sputter deposited layer of n-type and p-type thermoelectric legs
US11114599B2 (en) 2017-03-31 2021-09-07 3M Innovative Properties Company Electronic devices including solid semiconductor dies
US11338236B2 (en) 2017-04-28 2022-05-24 3M Innovative Properties Company Air filtration monitoring based on thermoelectric devices
US11640013B2 (en) * 2017-10-13 2023-05-02 University Of Utah Research Foundation Weather-detecting devices and related methods
CN111433576B (zh) 2017-12-08 2022-06-28 3M创新有限公司 差分热电装置
NL2020206B1 (nl) * 2017-12-29 2019-07-08 Arcadis Nederland B V Thermo-elektrisch element en werkwijze voor het vervaardigen daarvan
CN112853492B (zh) * 2019-11-27 2022-10-11 中国科学院金属研究所 一种SnSe／CNT高温柔性热电薄膜材料及其制备方法
CN113203348B (zh) * 2021-04-30 2022-07-12 中国科学院物理研究所 一种纤维型热电模块多区域识别器及其制备方法
CN114220908A (zh) * 2021-11-16 2022-03-22 东莞先导先进科技有限公司 一种柔性热电制冷器的制备工艺、电子设备
WO2024057344A2 (en) * 2022-09-13 2024-03-21 Fallahshayan Masood Advanced ultra-low-power ecg patch integrating self-power generation with artificial intelligence cloud platform
CN116429276A (zh) * 2023-04-06 2023-07-14 武汉理工大学 一种取能测温一体化可塑型温度传感器及其制备和温度传感方法
US20250052621A1 (en) * 2023-08-07 2025-02-13 City University Of Hong Kong Wide-band photodetectors using thermoelectric materials

Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3554815A (en) * 1963-04-30 1971-01-12 Du Pont Thin,flexible thermoelectric device
JPS5168279A (en) * 1973-12-06 1976-06-12 Moiseeuichi Dashefusuk Zuinobi Netsudensoshi oyobi koreokisotosurunetsudentai
US6127619A (en) * 1998-06-08 2000-10-03 Ormet Corporation Process for producing high performance thermoelectric modules
JP2001119076A (ja) * 1999-08-10 2001-04-27 Matsushita Electric Works Ltd 熱電変換モジュール及びその製造方法
JP2005217353A (ja) * 2004-02-02 2005-08-11 Yokohama Teikoki Kk 熱電半導体素子、熱電変換モジュールおよびその製造方法
JP2005353710A (ja) * 2004-06-09 2005-12-22 Suzuki Sogyo Co Ltd 熱電素子モジュール及びその製法
WO2005124882A1 (ja) * 2004-06-17 2005-12-29 Aruze Corp. 熱電変換モジュール
JP2006049872A (ja) * 2004-07-06 2006-02-16 Central Res Inst Of Electric Power Ind 熱電変換モジュール
WO2006019059A1 (ja) * 2004-08-17 2006-02-23 The Furukawa Electric Co., Ltd. 熱電冷却装置
US20090014046A1 (en) * 2007-07-12 2009-01-15 Industrial Technology Research Institute Flexible thermoelectric device and manufacturing method thereof
US20100154855A1 (en) * 2008-12-18 2010-06-24 David Nemir Thin walled thermoelectric devices and methods for production thereof
US20130218241A1 (en) * 2012-02-16 2013-08-22 Nanohmics, Inc. Membrane-Supported, Thermoelectric Compositions
JP2014007376A (ja) * 2012-05-30 2014-01-16 Denso Corp 熱電変換装置
JP2014033114A (ja) * 2012-08-03 2014-02-20 Fujitsu Ltd 熱電変換デバイス及びその製造方法
JP2015012236A (ja) * 2013-07-01 2015-01-19 富士フイルム株式会社 熱電変換素子および熱電変換モジュール
KR20150116187A (ko) * 2014-04-07 2015-10-15 홍익대학교 산학협력단 신축성 열전모듈
US20160163949A1 (en) * 2014-12-03 2016-06-09 Perpetua Power Source Technologies Flexible thermoelectric generator

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DE10022726C2 (de) * 1999-08-10 2003-07-10 Matsushita Electric Works Ltd Thermoelektrisches Modul mit verbessertem Wärmeübertragungsvermögen und Verfahren zum Herstellen desselben
US6611046B2 (en) 2001-06-05 2003-08-26 3M Innovative Properties Company Flexible polyimide circuits having predetermined via angles
US7012017B2 (en) 2004-01-29 2006-03-14 3M Innovative Properties Company Partially etched dielectric film with conductive features
JP2008227178A (ja) * 2007-03-13 2008-09-25 Sumitomo Chemical Co Ltd 熱電変換モジュール用基板及び熱電変換モジュール
US20110030754A1 (en) * 2009-08-06 2011-02-10 Laird Technologies, Inc. Thermoelectric modules and related methods
US9698563B2 (en) 2010-11-03 2017-07-04 3M Innovative Properties Company Flexible LED device and method of making

Patent Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3554815A (en) * 1963-04-30 1971-01-12 Du Pont Thin,flexible thermoelectric device
JPS5168279A (en) * 1973-12-06 1976-06-12 Moiseeuichi Dashefusuk Zuinobi Netsudensoshi oyobi koreokisotosurunetsudentai
US6127619A (en) * 1998-06-08 2000-10-03 Ormet Corporation Process for producing high performance thermoelectric modules
JP2001119076A (ja) * 1999-08-10 2001-04-27 Matsushita Electric Works Ltd 熱電変換モジュール及びその製造方法
JP2005217353A (ja) * 2004-02-02 2005-08-11 Yokohama Teikoki Kk 熱電半導体素子、熱電変換モジュールおよびその製造方法
JP2005353710A (ja) * 2004-06-09 2005-12-22 Suzuki Sogyo Co Ltd 熱電素子モジュール及びその製法
WO2005124882A1 (ja) * 2004-06-17 2005-12-29 Aruze Corp. 熱電変換モジュール
JP2006049872A (ja) * 2004-07-06 2006-02-16 Central Res Inst Of Electric Power Ind 熱電変換モジュール
WO2006019059A1 (ja) * 2004-08-17 2006-02-23 The Furukawa Electric Co., Ltd. 熱電冷却装置
US20090014046A1 (en) * 2007-07-12 2009-01-15 Industrial Technology Research Institute Flexible thermoelectric device and manufacturing method thereof
US20100154855A1 (en) * 2008-12-18 2010-06-24 David Nemir Thin walled thermoelectric devices and methods for production thereof
US20130218241A1 (en) * 2012-02-16 2013-08-22 Nanohmics, Inc. Membrane-Supported, Thermoelectric Compositions
JP2014007376A (ja) * 2012-05-30 2014-01-16 Denso Corp 熱電変換装置
JP2014033114A (ja) * 2012-08-03 2014-02-20 Fujitsu Ltd 熱電変換デバイス及びその製造方法
JP2015012236A (ja) * 2013-07-01 2015-01-19 富士フイルム株式会社 熱電変換素子および熱電変換モジュール
KR20150116187A (ko) * 2014-04-07 2015-10-15 홍익대학교 산학협력단 신축성 열전모듈
US20160163949A1 (en) * 2014-12-03 2016-06-09 Perpetua Power Source Technologies Flexible thermoelectric generator

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023002885A (ja) * 2021-06-23 2023-01-11 国立研究開発法人物質・材料研究機構 平面型熱電変換素子、および、その製造方法
JP7627034B2 (ja) 2021-06-23 2025-02-05 国立研究開発法人物質・材料研究機構 平面型熱電変換素子、および、その製造方法

Also Published As

Publication number Publication date
KR20190022650A (ko) 2019-03-06
EP3475989A1 (en) 2019-05-01
WO2017222862A1 (en) 2017-12-28
EP3475989B1 (en) 2021-03-17
CN109314173A (zh) 2019-02-05
US20190181323A1 (en) 2019-06-13

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