KR20190018079A - 스크라이빙 장치 - Google Patents

스크라이빙 장치 Download PDF

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Publication number
KR20190018079A
KR20190018079A KR1020170101732A KR20170101732A KR20190018079A KR 20190018079 A KR20190018079 A KR 20190018079A KR 1020170101732 A KR1020170101732 A KR 1020170101732A KR 20170101732 A KR20170101732 A KR 20170101732A KR 20190018079 A KR20190018079 A KR 20190018079A
Authority
KR
South Korea
Prior art keywords
substrate
moving
pair
unit
scribing
Prior art date
Application number
KR1020170101732A
Other languages
English (en)
Korean (ko)
Inventor
이준석
노광석
Original Assignee
주식회사 탑 엔지니어링
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 탑 엔지니어링 filed Critical 주식회사 탑 엔지니어링
Priority to KR1020170101732A priority Critical patent/KR20190018079A/ko
Priority to CN201711452679.8A priority patent/CN109384377A/zh
Publication of KR20190018079A publication Critical patent/KR20190018079A/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
KR1020170101732A 2017-08-10 2017-08-10 스크라이빙 장치 KR20190018079A (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020170101732A KR20190018079A (ko) 2017-08-10 2017-08-10 스크라이빙 장치
CN201711452679.8A CN109384377A (zh) 2017-08-10 2017-12-28 划片设备

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020170101732A KR20190018079A (ko) 2017-08-10 2017-08-10 스크라이빙 장치

Publications (1)

Publication Number Publication Date
KR20190018079A true KR20190018079A (ko) 2019-02-21

Family

ID=65417434

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170101732A KR20190018079A (ko) 2017-08-10 2017-08-10 스크라이빙 장치

Country Status (2)

Country Link
KR (1) KR20190018079A (zh)
CN (1) CN109384377A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113547847A (zh) * 2020-04-23 2021-10-26 细美事有限公司 载荷分散装置及具有其的基板处理系统

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070070824A (ko) 2005-12-29 2007-07-04 주식회사 탑 엔지니어링 모터의 포지션 에러를 이용한 기판 위치 검출 방법 및 이를이용한 스크라이버

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070070824A (ko) 2005-12-29 2007-07-04 주식회사 탑 엔지니어링 모터의 포지션 에러를 이용한 기판 위치 검출 방법 및 이를이용한 스크라이버

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113547847A (zh) * 2020-04-23 2021-10-26 细美事有限公司 载荷分散装置及具有其的基板处理系统
CN113547847B (zh) * 2020-04-23 2023-03-21 细美事有限公司 载荷分散装置及具有其的基板处理系统

Also Published As

Publication number Publication date
CN109384377A (zh) 2019-02-26

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