KR20190018079A - 스크라이빙 장치 - Google Patents
스크라이빙 장치 Download PDFInfo
- Publication number
- KR20190018079A KR20190018079A KR1020170101732A KR20170101732A KR20190018079A KR 20190018079 A KR20190018079 A KR 20190018079A KR 1020170101732 A KR1020170101732 A KR 1020170101732A KR 20170101732 A KR20170101732 A KR 20170101732A KR 20190018079 A KR20190018079 A KR 20190018079A
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- moving
- pair
- unit
- scribing
- Prior art date
Links
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020170101732A KR20190018079A (ko) | 2017-08-10 | 2017-08-10 | 스크라이빙 장치 |
CN201711452679.8A CN109384377A (zh) | 2017-08-10 | 2017-12-28 | 划片设备 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020170101732A KR20190018079A (ko) | 2017-08-10 | 2017-08-10 | 스크라이빙 장치 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20190018079A true KR20190018079A (ko) | 2019-02-21 |
Family
ID=65417434
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020170101732A KR20190018079A (ko) | 2017-08-10 | 2017-08-10 | 스크라이빙 장치 |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR20190018079A (zh) |
CN (1) | CN109384377A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113547847A (zh) * | 2020-04-23 | 2021-10-26 | 细美事有限公司 | 载荷分散装置及具有其的基板处理系统 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20070070824A (ko) | 2005-12-29 | 2007-07-04 | 주식회사 탑 엔지니어링 | 모터의 포지션 에러를 이용한 기판 위치 검출 방법 및 이를이용한 스크라이버 |
-
2017
- 2017-08-10 KR KR1020170101732A patent/KR20190018079A/ko unknown
- 2017-12-28 CN CN201711452679.8A patent/CN109384377A/zh active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20070070824A (ko) | 2005-12-29 | 2007-07-04 | 주식회사 탑 엔지니어링 | 모터의 포지션 에러를 이용한 기판 위치 검출 방법 및 이를이용한 스크라이버 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113547847A (zh) * | 2020-04-23 | 2021-10-26 | 细美事有限公司 | 载荷分散装置及具有其的基板处理系统 |
CN113547847B (zh) * | 2020-04-23 | 2023-03-21 | 细美事有限公司 | 载荷分散装置及具有其的基板处理系统 |
Also Published As
Publication number | Publication date |
---|---|
CN109384377A (zh) | 2019-02-26 |
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