KR20180130508A - 모바일 전자기기를 위한 평면내 능동 냉각 디바이스 - Google Patents

모바일 전자기기를 위한 평면내 능동 냉각 디바이스 Download PDF

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Publication number
KR20180130508A
KR20180130508A KR1020187028222A KR20187028222A KR20180130508A KR 20180130508 A KR20180130508 A KR 20180130508A KR 1020187028222 A KR1020187028222 A KR 1020187028222A KR 20187028222 A KR20187028222 A KR 20187028222A KR 20180130508 A KR20180130508 A KR 20180130508A
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KR
South Korea
Prior art keywords
electrode
layer
lateral surface
junction
transfer device
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Ceased
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KR1020187028222A
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English (en)
Korean (ko)
Inventor
펭 왕
언니크리슈난 바다칸마루비두
비나이 미터
Original Assignee
퀄컴 인코포레이티드
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Application filed by 퀄컴 인코포레이티드 filed Critical 퀄컴 인코포레이티드
Publication of KR20180130508A publication Critical patent/KR20180130508A/ko
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F25B21/04—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect reversible
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38—Cooling arrangements using the Peltier effect
    • H01L35/30—
    • H01L35/32—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
KR1020187028222A 2016-03-30 2017-03-28 모바일 전자기기를 위한 평면내 능동 냉각 디바이스 Ceased KR20180130508A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/086,039 2016-03-30
US15/086,039 US10267545B2 (en) 2016-03-30 2016-03-30 In-plane active cooling device for mobile electronics
PCT/US2017/024517 WO2017172752A1 (en) 2016-03-30 2017-03-28 In-plane active cooling device for mobile electronics

Publications (1)

Publication Number Publication Date
KR20180130508A true KR20180130508A (ko) 2018-12-07

Family

ID=58548893

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187028222A Ceased KR20180130508A (ko) 2016-03-30 2017-03-28 모바일 전자기기를 위한 평면내 능동 냉각 디바이스

Country Status (8)

Country Link
US (1) US10267545B2 (OSRAM)
EP (1) EP3436892B1 (OSRAM)
JP (1) JP2019517128A (OSRAM)
KR (1) KR20180130508A (OSRAM)
CN (1) CN108780344B (OSRAM)
CA (1) CA3015939A1 (OSRAM)
TW (1) TW201806204A (OSRAM)
WO (1) WO2017172752A1 (OSRAM)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102539153B1 (ko) * 2016-12-05 2023-06-01 삼성디스플레이 주식회사 표시 장치
JP7471308B2 (ja) 2019-02-01 2024-04-19 ディーティーピー サーモエレクトリックス エルエルシー 空間的に変動する分散輸送プロパティに基づいて増強された最大温度差を伴う熱電素子およびデバイス
US11421919B2 (en) 2019-02-01 2022-08-23 DTP Thermoelectrics LLC Thermoelectric systems employing distributed transport properties to increase cooling and heating performance
KR102846605B1 (ko) * 2020-02-04 2025-08-19 삼성디스플레이 주식회사 표시 모듈
US20210278887A1 (en) 2020-03-05 2021-09-09 Samsung Electronics Co., Ltd. Thermal control for electronic devices
EP4165352A4 (en) 2020-06-15 2024-08-07 DTP Thermoelectrics LLC THERMOELECTRICALLY ENHANCED HYBRID HEAT PUMP SYSTEMS
CN112254371A (zh) * 2020-09-28 2021-01-22 西南电子技术研究所（中国电子科技集团公司第十研究所） 多级梯度热电制冷片热控装置
US20230403935A1 (en) * 2022-05-20 2023-12-14 Apple Inc. Thermoelectric Cooling Modules
US12243469B2 (en) * 2022-12-13 2025-03-04 Lx Semicon Co., Ltd. Display driving apparatus for operating display device that displays image and control method therefor

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JPH02221821A (ja) * 1989-02-22 1990-09-04 Murata Mfg Co Ltd 薄膜熱電素子
JPH06318736A (ja) * 1993-05-06 1994-11-15 Canon Inc 薄膜ペルチェ熱電素子
US6282907B1 (en) 1999-12-09 2001-09-04 International Business Machines Corporation Thermoelectric cooling apparatus and method for maximizing energy transport
JP4218241B2 (ja) * 2001-12-27 2009-02-04 三菱電機株式会社 光モジュール、および光送信もしくは光受信装置
KR101094783B1 (ko) * 2003-10-27 2011-12-16 엘지디스플레이 주식회사 열전기 발생장치를 이용한 액정표시장치
US20050150537A1 (en) * 2004-01-13 2005-07-14 Nanocoolers Inc. Thermoelectric devices
WO2005083808A1 (ja) * 2004-03-01 2005-09-09 Matsushita Electric Industrial Co., Ltd. 熱電変換デバイス、およびこれを用いた冷却方法および発電方法
US20060076046A1 (en) 2004-10-08 2006-04-13 Nanocoolers, Inc. Thermoelectric device structure and apparatus incorporating same
US7825324B2 (en) 2006-12-29 2010-11-02 Alcatel-Lucent Usa Inc. Spreading thermoelectric coolers
US20090071525A1 (en) 2007-09-17 2009-03-19 Lucent Technologies, Inc. Cooling Hot-Spots by Lateral Active Heat Transport
KR100997994B1 (ko) * 2009-04-13 2010-12-03 삼성전기주식회사 열전소자
JPWO2012035768A1 (ja) * 2010-09-14 2014-01-20 学校法人幾徳学園 情報表示装置
DE102012105373B4 (de) 2012-02-24 2019-02-07 Mahle International Gmbh Thermoelektrisches Element sowie Verfahren zu dessen Herstellung
JP5857792B2 (ja) * 2012-02-27 2016-02-10 富士通株式会社 熱電デバイスおよびその製造方法
KR20160127740A (ko) * 2014-02-28 2016-11-04 고쿠리츠다이가쿠호징 나라 센탄카가쿠기쥬츠 다이가쿠인 다이가쿠 열전 변환 재료 및 열전 변환 소자
KR101574012B1 (ko) * 2014-04-17 2015-12-02 부산대학교 산학협력단 열전 장치 및 이를 포함하는 열전 시스템
US11211539B2 (en) * 2015-09-04 2021-12-28 Hiroaki Nakaya Thermoelectric conversion element and thermoelectric conversion module

Also Published As

Publication number Publication date
CN108780344B (zh) 2021-03-12
CN108780344A (zh) 2018-11-09
BR112018069655A2 (pt) 2019-02-05
CA3015939A1 (en) 2017-10-05
EP3436892B1 (en) 2020-09-23
WO2017172752A1 (en) 2017-10-05
US20170284708A1 (en) 2017-10-05
JP2019517128A (ja) 2019-06-20
TW201806204A (zh) 2018-02-16
US10267545B2 (en) 2019-04-23
EP3436892A1 (en) 2019-02-06

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