KR20180128349A - 진공 반송 모듈 및 기판 처리 장치 - Google Patents

진공 반송 모듈 및 기판 처리 장치 Download PDF

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Publication number
KR20180128349A
KR20180128349A KR1020180056824A KR20180056824A KR20180128349A KR 20180128349 A KR20180128349 A KR 20180128349A KR 1020180056824 A KR1020180056824 A KR 1020180056824A KR 20180056824 A KR20180056824 A KR 20180056824A KR 20180128349 A KR20180128349 A KR 20180128349A
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KR
South Korea
Prior art keywords
module
vacuum
substrate
wafer
load lock
Prior art date
Application number
KR1020180056824A
Other languages
English (en)
Korean (ko)
Inventor
다케히로 신도
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20180128349A publication Critical patent/KR20180128349A/ko
Priority to KR1020200074025A priority Critical patent/KR102433472B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
KR1020180056824A 2017-05-23 2018-05-18 진공 반송 모듈 및 기판 처리 장치 KR20180128349A (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020200074025A KR102433472B1 (ko) 2017-05-23 2020-06-18 진공 반송 모듈 및 기판 처리 장치

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2017-102016 2017-05-23
JP2017102016 2017-05-23
JPJP-P-2017-188627 2017-09-28
JP2017188627A JP6972852B2 (ja) 2017-05-23 2017-09-28 真空搬送モジュール及び基板処理装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020200074025A Division KR102433472B1 (ko) 2017-05-23 2020-06-18 진공 반송 모듈 및 기판 처리 장치

Publications (1)

Publication Number Publication Date
KR20180128349A true KR20180128349A (ko) 2018-12-03

Family

ID=64662743

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020180056824A KR20180128349A (ko) 2017-05-23 2018-05-18 진공 반송 모듈 및 기판 처리 장치
KR1020200074025A KR102433472B1 (ko) 2017-05-23 2020-06-18 진공 반송 모듈 및 기판 처리 장치

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020200074025A KR102433472B1 (ko) 2017-05-23 2020-06-18 진공 반송 모듈 및 기판 처리 장치

Country Status (3)

Country Link
JP (1) JP6972852B2 (zh)
KR (2) KR20180128349A (zh)
TW (1) TWI759485B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210004843A (ko) * 2019-07-05 2021-01-13 도쿄엘렉트론가부시키가이샤 기판 반송 장치 및 기판 반송 방법
KR20210104933A (ko) * 2019-12-05 2021-08-25 어플라이드 머티어리얼스, 인코포레이티드 교체 가능 계면 플레이트를 갖는 재구성 가능 메인프레임

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7259476B2 (ja) * 2019-03-27 2023-04-18 東京エレクトロン株式会社 アライメント装置、基板処理装置、アライメント方法及び基板処理方法
KR102585551B1 (ko) * 2021-09-16 2023-10-06 주식회사 나인벨 기판 교체시간이 단축된 반도체 기판 처리장치

Family Cites Families (15)

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TW295677B (zh) * 1994-08-19 1997-01-11 Tokyo Electron Co Ltd
JP3965343B2 (ja) * 1994-08-19 2007-08-29 東京エレクトロン株式会社 処理装置
US5751003A (en) * 1996-02-16 1998-05-12 Eaton Corporation Loadlock assembly for an ion implantation system
US6045620A (en) * 1997-07-11 2000-04-04 Applied Materials, Inc. Two-piece slit valve insert for vacuum processing system
JP2000012647A (ja) * 1998-06-19 2000-01-14 Sumitomo Eaton Noba Kk ウエハ搬送装置及びその方法
KR100441875B1 (ko) * 2003-06-02 2004-07-27 주성엔지니어링(주) 분리형 이송 챔버
KR100708610B1 (ko) * 2005-03-24 2007-04-18 박영남 액정표시장치 제조설비
JP2008300552A (ja) * 2007-05-30 2008-12-11 Ulvac Japan Ltd 搬送室、真空処理装置
JP4720790B2 (ja) * 2007-05-31 2011-07-13 株式会社安川電機 ウェハのアライメント装置、それを備えた搬送装置、半導体製造装置、ソータ装置
US8430620B1 (en) * 2008-03-24 2013-04-30 Novellus Systems, Inc. Dedicated hot and cold end effectors for improved throughput
JP4920667B2 (ja) * 2008-12-03 2012-04-18 アドヴァンスド・ディスプレイ・プロセス・エンジニアリング・コーポレーション・リミテッド 基板処理装置
JP5488227B2 (ja) * 2010-06-07 2014-05-14 東京エレクトロン株式会社 基板処理装置
JP5503006B2 (ja) * 2010-08-06 2014-05-28 東京エレクトロン株式会社 基板処理システム、搬送モジュール、基板処理方法及び半導体素子の製造方法
KR102417929B1 (ko) * 2015-08-07 2022-07-06 에이에스엠 아이피 홀딩 비.브이. 기판 처리 장치
US20170114462A1 (en) * 2015-10-26 2017-04-27 Applied Materials, Inc. High productivity pecvd tool for wafer processing of semiconductor manufacturing

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210004843A (ko) * 2019-07-05 2021-01-13 도쿄엘렉트론가부시키가이샤 기판 반송 장치 및 기판 반송 방법
KR20210104933A (ko) * 2019-12-05 2021-08-25 어플라이드 머티어리얼스, 인코포레이티드 교체 가능 계면 플레이트를 갖는 재구성 가능 메인프레임
KR20220049043A (ko) * 2019-12-05 2022-04-20 어플라이드 머티어리얼스, 인코포레이티드 교체 가능 계면 플레이트를 갖는 재구성 가능 메인프레임

Also Published As

Publication number Publication date
KR20200074934A (ko) 2020-06-25
KR102433472B1 (ko) 2022-08-17
TWI759485B (zh) 2022-04-01
TW201909321A (zh) 2019-03-01
JP2018198305A (ja) 2018-12-13
JP6972852B2 (ja) 2021-11-24

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