KR20180107228A - 광 반사용 경화성 수지 조성물 및 그의 경화물, 그리고 광반도체 장치 - Google Patents

광 반사용 경화성 수지 조성물 및 그의 경화물, 그리고 광반도체 장치 Download PDF

Info

Publication number
KR20180107228A
KR20180107228A KR1020187025525A KR20187025525A KR20180107228A KR 20180107228 A KR20180107228 A KR 20180107228A KR 1020187025525 A KR1020187025525 A KR 1020187025525A KR 20187025525 A KR20187025525 A KR 20187025525A KR 20180107228 A KR20180107228 A KR 20180107228A
Authority
KR
South Korea
Prior art keywords
resin composition
curable resin
group
light
weight
Prior art date
Application number
KR1020187025525A
Other languages
English (en)
Korean (ko)
Inventor
히로세 스즈키
야스타카 에비우라
Original Assignee
주식회사 다이셀
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2016025326A external-priority patent/JP6899199B2/ja
Priority claimed from JP2016025328A external-priority patent/JP2017141414A/ja
Priority claimed from JP2016025327A external-priority patent/JP2017141413A/ja
Priority claimed from JP2016025325A external-priority patent/JP6899198B2/ja
Application filed by 주식회사 다이셀 filed Critical 주식회사 다이셀
Publication of KR20180107228A publication Critical patent/KR20180107228A/ko

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
    • C08G59/4253—Rubbers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0041—Optical brightening agents, organic pigments
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L21/00—Compositions of unspecified rubbers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Led Device Packages (AREA)
KR1020187025525A 2016-02-12 2017-02-06 광 반사용 경화성 수지 조성물 및 그의 경화물, 그리고 광반도체 장치 KR20180107228A (ko)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
JPJP-P-2016-025326 2016-02-12
JP2016025326A JP6899199B2 (ja) 2016-02-12 2016-02-12 光反射用硬化性樹脂組成物及びその硬化物、並びに光半導体装置
JPJP-P-2016-025327 2016-02-12
JP2016025328A JP2017141414A (ja) 2016-02-12 2016-02-12 光反射用硬化性樹脂組成物及びその硬化物、並びに光半導体装置
JP2016025327A JP2017141413A (ja) 2016-02-12 2016-02-12 光反射用硬化性樹脂組成物及びその硬化物、並びに光半導体装置
JPJP-P-2016-025328 2016-02-12
JP2016025325A JP6899198B2 (ja) 2016-02-12 2016-02-12 光反射用硬化性樹脂組成物及びその硬化物、並びに光半導体装置
JPJP-P-2016-025325 2016-02-12
PCT/JP2017/004214 WO2017138490A1 (ja) 2016-02-12 2017-02-06 光反射用硬化性樹脂組成物及びその硬化物、並びに光半導体装置

Publications (1)

Publication Number Publication Date
KR20180107228A true KR20180107228A (ko) 2018-10-01

Family

ID=59563882

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187025525A KR20180107228A (ko) 2016-02-12 2017-02-06 광 반사용 경화성 수지 조성물 및 그의 경화물, 그리고 광반도체 장치

Country Status (4)

Country Link
KR (1) KR20180107228A (zh)
CN (1) CN108603011A (zh)
TW (1) TW201741388A (zh)
WO (1) WO2017138490A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111650811B (zh) * 2020-06-18 2024-01-26 上海孚赛特新材料股份有限公司 一种白色感光膜及其制备方法和应用
CN113150605A (zh) * 2021-03-31 2021-07-23 江苏唐彩新材料科技股份有限公司 一种紫外光固化胶印油墨及其制备方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011060819A (ja) * 2009-09-07 2011-03-24 Nitto Denko Corp 光半導体素子収納用実装パッケージ用樹脂組成物およびそれを用いて得られる光半導体発光装置
CN103492482B (zh) * 2011-06-27 2016-11-09 株式会社大赛璐 光反射用固化性树脂组合物及光半导体装置
JP5829893B2 (ja) * 2011-11-09 2015-12-09 株式会社ダイセル 硬化性エポキシ樹脂組成物
JP5729270B2 (ja) * 2011-11-21 2015-06-03 信越化学工業株式会社 Ｌｅｄリフレクターとして有用な白色熱硬化性シリコーン樹脂組成物及び該組成物を用いた光半導体装置
JP5838790B2 (ja) * 2011-12-22 2016-01-06 日本ゼオン株式会社 光反射部材用樹脂組成物、光反射部材及び発光素子

Also Published As

Publication number Publication date
CN108603011A (zh) 2018-09-28
WO2017138490A1 (ja) 2017-08-17
TW201741388A (zh) 2017-12-01

Similar Documents

Publication Publication Date Title
KR101905216B1 (ko) 광 반사용 경화성 수지 조성물 및 광반도체 장치
JP5154340B2 (ja) 光半導体封止用樹脂組成物
JP5918699B2 (ja) 硬化性エポキシ樹脂組成物及びこれを使用した光半導体装置
US20110114972A1 (en) Optical semiconductor sealing resin composition and optical semiconductor device using same
TWI753994B (zh) 硬化性環氧樹脂組成物
JP6335807B2 (ja) 新規なグリコールウリル類とその利用
JP6376907B2 (ja) 硬化性エポキシ樹脂組成物
JP2018119032A (ja) 光反射用硬化性樹脂組成物及びその硬化物、並びに光半導体装置
JPWO2012093591A1 (ja) 硬化性エポキシ樹脂組成物
KR20180107227A (ko) 광 반사용 경화성 수지 조성물 및 그의 경화물, 그리고 광반도체 장치
WO2018135558A1 (ja) 光反射用硬化性樹脂組成物及びその硬化物、並びに光半導体装置
KR20180107228A (ko) 광 반사용 경화성 수지 조성물 및 그의 경화물, 그리고 광반도체 장치
KR20170123645A (ko) 백색 리플렉터 성형용 경화성 에폭시 수지 조성물 및 그의 경화물, 광반도체 소자 탑재용 기판, 그리고 광 반도체 장치
WO2017138487A1 (ja) 白色リフレクター用硬化性エポキシ樹脂組成物及びその硬化物、光半導体素子搭載用基板、光半導体装置、並びに製造方法
WO2017131152A1 (ja) 白色リフレクター用硬化性エポキシ樹脂組成物及びその硬化物、光半導体素子搭載用基板、並びに光半導体装置
WO2019124476A1 (ja) 硬化性エポキシ樹脂組成物及びその硬化物、並びに光半導体装置
JP6929069B2 (ja) 光反射用硬化性樹脂組成物及びその硬化物、並びに光半導体装置
JP6899198B2 (ja) 光反射用硬化性樹脂組成物及びその硬化物、並びに光半導体装置
JP7329320B2 (ja) 硬化性エポキシ樹脂組成物
JP2017141414A (ja) 光反射用硬化性樹脂組成物及びその硬化物、並びに光半導体装置
JP6899199B2 (ja) 光反射用硬化性樹脂組成物及びその硬化物、並びに光半導体装置
JP2017155145A (ja) 光学材料用硬化性エポキシ樹脂組成物
JP2017141413A (ja) 光反射用硬化性樹脂組成物及びその硬化物、並びに光半導体装置
JP6472754B2 (ja) 硬化性エポキシ樹脂組成物