KR20180099273A - Method and apparatus for supply of solder container - Google Patents

Method and apparatus for supply of solder container Download PDF

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Publication number
KR20180099273A
KR20180099273A KR1020170026499A KR20170026499A KR20180099273A KR 20180099273 A KR20180099273 A KR 20180099273A KR 1020170026499 A KR1020170026499 A KR 1020170026499A KR 20170026499 A KR20170026499 A KR 20170026499A KR 20180099273 A KR20180099273 A KR 20180099273A
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KR
South Korea
Prior art keywords
solder
unit
vessel
container
supply
Prior art date
Application number
KR1020170026499A
Other languages
Korean (ko)
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KR101920818B1 (en
Inventor
김귀한
Original Assignee
한화에어로스페이스 주식회사
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Application filed by 한화에어로스페이스 주식회사 filed Critical 한화에어로스페이스 주식회사
Priority to KR1020170026499A priority Critical patent/KR101920818B1/en
Priority to PCT/KR2017/004187 priority patent/WO2018159894A1/en
Priority to CN201710506617.4A priority patent/CN108501509B/en
Publication of KR20180099273A publication Critical patent/KR20180099273A/en
Application granted granted Critical
Publication of KR101920818B1 publication Critical patent/KR101920818B1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/40—Inking units
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F33/00—Indicating, counting, warning, control or safety devices
    • B41F33/16—Programming systems for automatic control of sequence of operations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Screen Printers (AREA)

Abstract

The present invention relates to an apparatus and a method for automatically feeding a solder vessel, and includes an operation unit for applying a solder paste on a printed circuit board with a solder vessel mounted thereon; A mounting portion for supplying a new solder container to the working portion as the reciprocating movement is performed with respect to the working portion; A supply part for supplying a new solder container filled with solder paste to the mounting part by its own weight; A conveying part for reciprocating the mounting part; A solder detecting unit for detecting a remaining amount of the solder paste in the solder container mounted on the working unit; And discharging a solder container disposed in the working portion according to a measured value of a solder paste remaining amount in a solder container disposed in the working portion by the solder detecting portion, driving the supplying portion and the mounting portion to move the new solder container to the working portion And a control unit for applying an input signal to supply the input signal.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a solder vessel,

The present invention relates to an apparatus and a method for automatically supplying a solder vessel, and more particularly, to a solder vessel capable of automatically discharging a solder-exhausted container without stopping the process, And more particularly,

2. Description of the Related Art In general, a printed circuit board (PCB) embedded in a main component of an electronic device such as a computer or an electronic appliance is provided with a solder layer (not shown) so that various types of small electronic components such as a semiconductor chip, The paste is applied in a certain pattern.

Such a solder paste application process is performed by a solder paste application device called a screen printer. The screen printer squeegees the solder paste supplied on the metal mask having the opening of a specific pattern, As shown in Fig.

In such a conventional screen printer, after the solder paste filled with the solder paste is mounted, the solder paste is applied on the printed circuit board. If the solder paste in the solder container is insufficient, the solder paste on the printed circuit board is defective .

In addition, when the solder paste in the solder container is exhausted, the worker must perform the operation of directly replacing the solder container after the operation of the screen printer is stopped, thereby reducing the overall process efficiency.

Korean Patent Registration No. 10-1196284 (October 25, 2012)

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and it is an object of the present invention to provide a solder dispenser capable of automatically changing the solder vessel without stopping the process during the process, And to provide an automatic supply apparatus and method of the solder vessel.

It is another object of the present invention to provide a solder paste dispenser in which when solder paste remaining in a solder paste is detected after the solder paste remaining amount is insufficient, And an object thereof is to provide an automatic supply apparatus and method of a solder vessel which can prevent a solder paste from being applied to a printed circuit board in a defective manner.

The problems of the present invention are not limited to the above-mentioned problems, and other problems not mentioned can be clearly understood by those skilled in the art from the following description.

According to an aspect of the present invention, there is provided an apparatus for automatically supplying a solder vessel, including: an operation unit for applying a solder paste on a printed circuit board in a state that a solder vessel is mounted; A mounting portion for supplying a new solder container to the working portion as the reciprocating movement is performed with respect to the working portion; A supply part for supplying a new solder container filled with solder paste to the mounting part by its own weight; A conveying part for reciprocating the mounting part; A solder detecting unit for detecting a remaining amount of the solder paste in the solder container mounted on the working unit; And discharging a solder container disposed in the working portion according to a measured value of a solder paste remaining amount in a solder container disposed in the working portion by the solder detecting portion, driving the supplying portion and the mounting portion to move the new solder container to the working portion And a control unit for applying an input signal to supply the input signal.

Here, the supply unit may include: a plurality of supply rollers arranged in a downward sloping manner; A first cylinder operated according to an input signal of the control unit; And a first stopper for interrupting movement of the new solder container, which is disposed on the supply roller while being lifted and lowered according to the operation of the first cylinder.

The mounting portion may be disposed between the supply portion and the work portion, and a second stopper may be provided on one side of the upper portion of the work portion to change the direction of a new solder container supplied through the supply portion, Can be disposed.

The operation unit may include a second cylinder for mounting or dismounting a cap at a rear end of the solder vessel in accordance with an input signal of the controller.

In this case, the working unit may include a third cylinder for pushing the solder vessel and a third cylinder for reciprocating the solder vessel with the cap separated from the rear end of the solder vessel.

According to another aspect of the present invention, there is provided a method of automatically supplying a solder container to a screen printer, the method comprising the steps of: (a) Sensing a remaining amount of solder paste in the container; (b) separating the solder container from the separator and pushing the solder container into the collection space when the remaining amount of the solder paste is less than a predetermined value; (c) supplying a new solder container filled with solder paste to the working portion; And (d) when the new solder vessel is supplied to the work unit, sealing the rear end of the new solder vessel with the cap, and then continuously applying the solder paste on the printed circuit board.

Other specific details of the invention are included in the detailed description and drawings.

According to the apparatus and method for automatically supplying the solder vessel according to the embodiment of the present invention, the solder vessel can be automatically replaced without interrupting the process during the process, so that the efficiency of the overall process can be increased.

In addition, according to the apparatus and method for automatically supplying the solder container according to the embodiment of the present invention, if the remaining amount of the solder paste detected after detecting the remaining amount of the solder paste in the solder container is insufficient, The effect of preventing the solder paste from being applied to the printed circuit board in a bad manner can be also provided.

The effects according to the present invention are not limited by the contents exemplified above, and more various effects are included in the specification.

1 is an overall perspective view of a screen printer to which an automatic supply device for a solder container according to an embodiment of the present invention is applied.
Figure 2 is a front view of Figure 1;
FIG. 3 is a perspective view showing a supply portion of the solder vessel in FIG. 1; FIG.
Figure 4 is a front view of Figure 3;
FIG. 5 is a perspective view showing a mounting portion of the solder vessel in FIG. 1; FIG.
Figure 6 is a front view of Figure 5;
FIG. 7 is a perspective view showing a working portion of the solder vessel in FIG. 1; FIG.
8 is a front view of Fig.
9 is a block diagram schematically showing the control relationship of the automatic feeding device of the solder vessel 100 according to the embodiment of the present invention.
10 is a flowchart sequentially showing an automatic supply method of a solder vessel 100 according to an embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and the manner of achieving them, will be apparent from and elucidated with reference to the embodiments described hereinafter in conjunction with the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

Further, the embodiments described herein will be described with reference to cross-sectional views and / or schematic drawings that are ideal illustrations of the present invention. Thus, the shape of the illustrations may be modified by manufacturing techniques and / or tolerances. In addition, in the drawings of the present invention, each component may be somewhat enlarged or reduced in view of convenience of explanation. Like reference numerals refer to like elements throughout the specification.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of an automatic supply apparatus and method of a solder vessel of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is an overall perspective view of a screen printer to which an automatic supply device for a solder container according to an embodiment of the present invention is applied, and FIG. 2 is a front view of FIG.

1 and 2, a screen printer 10 to which an automatic supply device for a solder container according to an embodiment of the present invention is applied includes a supply portion 20 of the solder container 100, A mounting portion 30 and a working portion 40 of the solder vessel 100 and includes a transfer portion for moving the mounting portion 30 of the solder vessel 100 in the X axis direction.

Here, the transfer unit may include a driving motor 90 and a lead screw 80. When the driving motor 90 is driven, the lead screw 80 rotates to rotate the mounting unit 30 in the X-axis direction The solder vessel 100 mounted on the mounting portion 30 can be moved to the work unit 40. The operation of the solder vessel 100 will be described later in detail.

1 and 2 illustrate a state in which the mounting part 30 moves and is located in the work part 40. The mounting part 30 moves toward the work part 40 by the transfer part, As shown in FIG.

1 and 2, the solder vessel 100 is not provided separately, but the solder vessel 100 filled with the solder paste is automatically supplied to one side of the mount 30 by its own weight (Not shown).

FIG. 3 is a perspective view showing a supply portion of a solder container disposed on one side of the screen printer shown in FIG. 1, and FIG. 4 is a front view of FIG.

3 and 4, the supply unit 20 of the solder vessel 100 includes a plurality of supply rollers 22 arranged at regular intervals in a downward inclined direction, And a first cylinder 24 for moving the stopper 26 and the first stopper 26 up and down.

Therefore, when the operator inserts the solder vessel 100 filled with the solder paste into the inlet (not shown) of the supply unit 20, the solder vessel 100 is rotated by the plurality of feed rollers 22 arranged downwardly inclined When the first stopper 26 is lifted up, the first stopper 26 slidably interlocks with the first stopper 26 to be placed on the supply roller 22.

In this state, when the first cylinder 24 is operated according to the input signal to lower the first stopper 26, the solder vessel 100 is lowered by its own weight and is mounted on the mounting portion 30, The working relationship of this is as follows.

FIG. 5 is a perspective view showing a mounting portion of the solder vessel in FIG. 1, and FIG. 6 is a front view of FIG.

As described above, the supply unit 20 can shut off or open the solder vessel 100 as the first stopper 26 is moved up and down by the operation of the first cylinder 24.

At this time, when the first cylinder 24 is operated and the first stopper 26 is lowered, the solder vessel 100 slides along the feed roller 22 due to its own weight and moves in a downward inclined direction .

Here, referring to FIGS. 1 and 2, and FIGS. 7 and 8, which will be described in detail later, a second stopper 70 is disposed at an upper side of the operating portion.

Therefore, the solder vessel 100, which is slid and moved in a downward inclined direction along the feed roller 22 of the supply unit 20, is not vertically advanced by the second stopper 70, And is freely dropped by its own weight to be mounted vertically on the mounting portion 30 as shown in Figs. 5 and 6.

The mounting portion 30 includes a grip portion 32 having elasticity so that the solder container 100 stably grips the solder container 100 in the vertical direction so that the solder vessel 100 is held by the grip portion 32 The mounting is performed in the vertical direction.

In this state, when the solder vessel 100 is mounted on the mounting portion 30, the mounting portion 30 moves in the X-axis direction and can be transferred to the working portion 40 by the operation of the carrying portion.

Referring to Figs. 1 and 2 again, the mounting portion 30 is moved in the X-axis direction by the carrying portion and is disposed in the working portion 40. [

FIG. 7 is a perspective view showing a work part of the solder vessel in FIG. 1, and FIG. 8 is a front view of FIG.

7 and 8, the second stopper 70 is installed on one side of the upper portion of the working portion 40 and the cap 110 of the solder vessel 100 is vertically moved up and down A second cylinder 50 may be disposed to seal the rear end of the solder vessel 100 in a sealed manner.

Here, a cap 110 is provided at the tip of the second cylinder 50, and a pneumatic hose 60 for providing pneumatic pressure is connected to one side of the cap 110.

The second cylinder 50 may perform the function of sealingly mounting the cap 110 to the rear end of the solder vessel 100 or separating the cap 110 from the rear end of the solder vessel 100 while being lifted or lowered according to the input signal. The operational relationship will also be described in detail later.

On one side of the work unit 40, a round correction unit 42 for correcting the angle of the moved solder vessel 100 may be disposed.

That is, when the solder vessel 100 transferred from the mounting portion 30 to the work portion 40 is in an exactly vertical state, the cap 110 can be smoothly mounted. At this time, When the solder vessel 100 is disposed in a slightly oblique inclined state, there is a possibility that the cap 110 is not properly mounted as described above. In order to eliminate such a concern, the round corrector 42 Thereby making it possible to adjust the solder vessel 100 to be in an exactly vertical state.

For example, one surface of the round correction part 42 forms a rounded surface corresponding to the round of the solder container 100. When the solder container 100 is brought into close contact with the round correction part 42, The correction unit 100 can be accurately corrected by the round correction unit 42 in the vertical direction.

In addition, at the base of the work unit 40, the solder vessel 100 having the solder paste exhausted therefrom can be pushed out and the solder pintle 44 for free fall into the collection space can be disposed.

As the solder paste is moved in the horizontal direction by the third cylinder (not shown) operated by the input signal, the solder paste 100 can be pushed out of the solder vessel 100 , And its operation will be described later in detail.

The solder detecting unit 200 may measure the remaining amount of the solder paste in the solder vessel 100. The solder detecting unit 200 may measure the amount of solder paste remaining in the solder vessel 100, And transmits the signal to the control unit 300 so that the control unit 300 can control the operation of the supply unit 20, the mounting unit 30, the operation unit 40, and the transfer unit.

Here, the solder detecting unit 200 is filled in the solder vessel 100 and then is turned off when the level of the solder paste gradually decreases as the level of the solder paste is discharged and becomes lower than the set position. As a result, On / off sensor for transmitting the on / off signal to the control unit.

However, the solder detecting unit 200 is an on / off sensor, and the present invention is not limited thereto. Various known sensors may be used as long as the solder paste remaining amount in the solder vessel is detected. Of course.

An automatic supplying method of the solder vessel 100 using the automatic supplying apparatus of the solder vessel 100 according to the embodiment of the present invention, which can be configured as described above, will be described as follows.

9 is a block diagram schematically showing the control relationship of the automatic feeder of the solder vessel 100 according to the embodiment of the present invention. FIG. 10 is a schematic view showing the automatic feeding method of the solder vessel 100 according to the embodiment of the present invention And FIG.

9, the automatic supply apparatus for a solder vessel 100 according to an embodiment of the present invention includes a solder detecting unit 200 for detecting a solder paste remaining amount in a solder vessel 100, And the control unit 300 is connected to the supply unit 20, the work unit 40, and the transfer unit, respectively.

Accordingly, the control unit 300 can control the operation of the supply unit 20, the work unit 40, and the transfer unit according to the input signal of the solder detection unit 200, and its operation will be described as follows.

First, as shown in FIGS. 1, 2, 7, and 8, in a state where the solder vessel 100 is mounted on the work unit 40, the screen printer 10 is operated, In the process of applying the paste, the solder sensing unit 200 senses the remaining amount of the solder paste in the solder vessel 100 and transmits the sensed amount of the solder paste to the controller 300.

At this time, in order to replace the solder vessel 100 used in the process, the operator preliminarily supplies a new solder vessel 100 filled with a solder paste to the inlet of the supply unit 20 as shown in FIGS. 3 and 4 Can be set.

The solder vessel 100 is moved downward in one direction by the supply roller 22 of the supply unit 20 due to its own weight in a state where the new solder vessel 100 is supplied to the supply unit 20, The first cylinder 24 maintains the first stopper 26 in an elevated state so that the solder vessel 100 is placed on the supply roller 22 in a standby state.

In this case, the mounting portion 30 is spaced apart from the working portion 40 and positioned between the supplying portion 20 and the working portion 40.

In this state, during the process of applying the solder paste by the screen printer 10, the solder detecting unit 200 senses the remaining amount of the solder paste in the solder container 100 used in the process and transmits the signal to the control unit 300 At this time, when it is detected that a sufficient amount of solder paste to be applied on the printed circuit board is not left, and the controller 300 transmits the signal to the controller 300, the controller 300 controls the solder vessel 100).

When the replacement signal of the solder vessel 100 is input by the control unit 300, an input signal is applied to the work unit 40 to stop the supply of air pressure to the solder vessel 100 through the pneumatic hose 60, The capillary 110 is separated from the rear end of the solder vessel 100 by actuating the second cylinder 50 disposed on the upper side of the working unit 40.

That is, as the second cylinder 50 is lifted, the cap 110 is separated from the rear end of the solder vessel 100.

In this state, the third cylinder of the work unit 40 is operated to horizontally move the tilting pin 44, so that the cap 110 moves the separated solder vessel 100 horizontally and drops freely into the collection space do.

Accordingly, the solder vessel 100 is not present in the working unit 40, and at the same time, the new solder vessel 100 can be supplied from the supply unit 20.

The control unit 300 applies an input signal to the supply unit 20 so as to lower the first cylinder 24 so that the solder vessel 100 is removed from the work unit 40, The new solder container 100 is slid by its own weight in the downward inclined direction along the feed roller 22. [

The new solder container 100 which is released from the interruption by the first stopper 26 and slides in the downward inclined direction along the feed roller 22 is held by the second stopper 26 disposed on one side of the upper portion of the working portion 40, And the free fall is made to the mounting portion 30 by its own weight after changing the direction in the vertical direction.

5 and 6, the new solder container 100 freely dropped in the vertical direction to the mounting portion 30 is mounted in a state of being held in the vertical direction by the grip portion 32 of the mounting portion 30, When the mounting of the solder vessel 100 to the mounting portion 30 is completed, the controller 300 applies an input signal to the transfer portion so that the mounting portion 30 moves to the work portion 40 .

The mounting part 30 transferred to the work part 40 by the operation of the transfer part places the solder container 100 on the work part 40. In this state, the control part 300 inputs the solder container 100 into the second cylinder 50 A signal is applied to lower the cap 110, thereby causing the cap 110 to seal the rear end of the new solder container 100.

When the cap 110 is hermetically mounted to the rear end of the new solder container 100 as described above, the mounting of the new solder container 100 to the working portion 40 is completed. The solder paste filled in the new solder vessel 100 is applied onto the printed circuit board.

As described above, the automatic supplying device of the solder vessel 100 according to the embodiment of the present invention can automatically supply the solder paste to the new solder vessel 100 when the solder paste in the solder vessel 100 is exhausted. As a result, the worker does not have to manually replace the solder vessel 100, and the process efficiency can be greatly improved.

In particular, as the solder vessel 100 is automatically replaced, the process of the screen printer 10 is not interrupted for replacing the solder vessel 100, so that the overall process efficiency can be further improved.

When the remaining amount of the solder paste sensed in the solder paste container 100 is not sufficient after the remaining amount of the solder paste in the solder container 100 is detected, The replacement of the solder paste with the solder paste 100 is automatically performed, thereby preventing the solder paste from being applied to the printed circuit board in a bad manner.

As described above, when the remaining amount of the solder paste in the solder vessel 100 becomes insufficient during the process of applying the solder paste to the printed circuit board with the new solder vessel 100 being replaced, As long as the container 100 is put in advance, replacement of the new container with the new container is automatically performed by the above-described operation sequence.

It will be understood by those skilled in the art that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. The scope of the present invention is defined by the appended claims rather than the detailed description and all changes or modifications derived from the meaning and scope of the claims and their equivalents are to be construed as being included within the scope of the present invention do.

10: Screen printer 20:
22: feed roller 24: first cylinder
26: first stopper 30:
32: grip part 40: work part
42: round correction section 44:
50: second cylinder 60: pneumatic hose
70: Second stopper 80: Lead screw
90: Driving motor 100: Solder container
110: cap 200: solder sensing part
300:

Claims (6)

An operation portion for applying a solder paste onto the printed circuit board in a state that the solder vessel is mounted;
A mounting portion for supplying a new solder container to the working portion as the reciprocating movement is performed with respect to the working portion;
A supply part for supplying a new solder container filled with solder paste to the mounting part by its own weight;
A conveying part for reciprocating the mounting part;
A solder detecting unit for detecting a remaining amount of the solder paste in the solder container mounted on the working unit; And
The solder container disposed in the work unit is discharged according to the measured value of the solder paste remaining amount in the solder container disposed in the work unit by the solder detecting unit, and the supply unit and the mounting unit are driven to supply a new solder container to the work unit And a controller for applying an input signal to the solder vessel. The method according to claim 1,
Wherein the supply unit includes:
A plurality of feed rollers disposed downwardly inclined;
A first cylinder operated according to an input signal of the control unit; And
And a first stopper which is moved up and down according to the operation of the first cylinder to interrupt movement of a new solder container disposed on the supply roller. The method according to claim 1,
Wherein,
A supply portion disposed between the supply portion and the work portion,
And a second stopper is disposed on one side of the upper portion of the work unit for changing a direction of a new solder container supplied through the supply unit so as to be vertically mounted on the mounting unit. The method according to claim 1,
Wherein,
And a second cylinder for mounting or dismounting a cap at a rear end of the solder vessel in accordance with an input signal of the control unit. 5. The method of claim 4,
Wherein,
In a state where the cap is separated from the rear end of the solder vessel,
And a third cylinder for reciprocating the microneedle. ≪ Desc / Clms Page number 19 > A method of supplying a solder container mounted on a screen printer and applying a solder paste onto a printed circuit board,
(a) detecting a solder paste remaining amount in a solder vessel mounted on a work portion;
(b) separating the solder container from the separator and pushing the solder container into the collection space when the remaining amount of the solder paste is less than a predetermined value;
(c) supplying a new solder container filled with solder paste to the working portion; And
(d) continuously sealing the solder paste on the printed circuit board after sealing the rear end of the new solder vessel with the cap when a new solder vessel is supplied to the work unit.
KR1020170026499A 2017-02-28 2017-02-28 Method and apparatus for supply of solder container KR101920818B1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020170026499A KR101920818B1 (en) 2017-02-28 2017-02-28 Method and apparatus for supply of solder container
PCT/KR2017/004187 WO2018159894A1 (en) 2017-02-28 2017-04-19 Apparatus and method for automatically supplying solder container
CN201710506617.4A CN108501509B (en) 2017-02-28 2017-06-28 Automatic supply device and method for solder container

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020170026499A KR101920818B1 (en) 2017-02-28 2017-02-28 Method and apparatus for supply of solder container

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Publication Number Publication Date
KR20180099273A true KR20180099273A (en) 2018-09-05
KR101920818B1 KR101920818B1 (en) 2018-11-21

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CN (1) CN108501509B (en)
WO (1) WO2018159894A1 (en)

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KR102242463B1 (en) * 2019-04-16 2021-04-20 (주)보성이엔지 First-in first-out Solder Container Automatic Supplying Management System
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CN108501509A (en) 2018-09-07
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