WO2022149264A1

WO2022149264A1 - Component presence/absence detection device, training method for component presence/absence detection device, and component mounting machine

Info

Publication number: WO2022149264A1
Application number: PCT/JP2021/000501
Authority: WO
Inventors: 岳史櫻山
Original assignee: 株式会社Fuji
Priority date: 2021-01-08
Filing date: 2021-01-08
Publication date: 2022-07-14
Also published as: JPWO2022149264A1

Abstract

According to the present specification, a component mounting machine includes a component presence/absence detection device that detects whether or not a component is housed in a cavity. The component presence/absence detection device is equipped with: a detection unit which executes a detection process to determine whether or not a component is housed in a cavity; a storage unit which stores criteria for determining whether or not the component is housed in the cavity; and a determination unit which determines, on the basis of a detection result obtained by performing the detection process in the detection unit and a determination criteria stored in the storage unit, whether or not the component is housed in the cavity. The determination criteria are determined on the basis of a detection result obtained when the component is housed in the cavity, and a detection result obtained when no component is housed in the cavity.

Description

Parts presence / absence detection device, learning method of parts presence / absence detection device, and parts mounting machine

This specification relates to a technique for detecting (determining) whether or not a component is housed in a tape cavity.

In a component mounting machine that mounts components on a board, the components may be supplied to the board by accommodating the components in a cavity formed in the tape and sending the tape to the component supply position. For example, in the component mounting machine disclosed in Japanese Patent No. 2653107, the tape containing the component is attached to the component mounting machine in a state of being wound on a reel. When supplying the component to the substrate, the reel rotates to send the tape (specifically, the cavity portion of the tape) to the component suction position. When the tape is fed to the component suction position, the nozzle sucks the component in the cavity. The components attracted to the nozzles are carried to the mounting position of the board and mounted at the mounting position of the board.

In a component mounting machine that supplies components to a board using tape, it is necessary to determine whether or not the component is housed in the cavity of the tape. For example, if the parts contained in the tape are used up, they must be replaced with new reels. Therefore, the detection sensor detects whether or not the component is housed in the cavity of the tape, and determines whether or not the component is housed in the cavity based on the detection result. However, due to the miniaturization of the parts housed in the tape and the difference in shape (for example, the presence or absence of bumps) due to the diversification of the parts types, whether or not the parts are housed in the cavity is determined based on the detection result of the detection sensor. There was a problem that it was difficult to make an accurate judgment.

This specification discloses a technique for accurately determining whether or not a component is housed in a tape cavity.

The component presence / absence detection device disclosed in the present specification is provided in a component mounting machine that performs a mounting process for mounting a component housed in a cavity of a tape to be sent on a substrate, and whether or not the component is housed in the cavity. Is detected. This component presence / absence detection device includes a detection unit, a storage unit, and a determination unit. The detector comprises at least one of a camera capable of imaging the cavity from above and a measuring device capable of measuring the distance from the reference height set above the cavity to the suction surface of the component housed in the cavity. , Executes a detection process of whether or not a component is housed in the cavity. The storage unit stores a criterion for determining whether or not a component is contained in the cavity, and this criterion is obtained when the detection process is executed with the component accommodated in the cavity. It is determined based on the detection result and the detection result obtained when the detection process is executed when the cavity is not accommodated. When the detection process is executed in the case of performing the mounting process, the determination unit accommodates the parts in the cavity based on the detection result obtained by the detection process and the determination criteria stored in the storage unit. Determine if it is.

The figure which shows the schematic structure of the component mounting machine which concerns on Example. The figure which shows the state which the electronic component is housed in the cavity formed in the tape. An example of an image taken by a parts camera, which is an image of a nozzle in a state where electronic parts are not adsorbed. An example of an image captured by a parts camera, which is an image of a nozzle in which electronic components are adsorbed. The figure which shows the structure of the control system of the component mounting machine which concerns on Example. A flowchart showing the flow of the sensor learning process executed by the control device. An example of an image captured by a camera that captures the nozzle from the side, and is an image of the nozzle in a state where electronic components are adsorbed. An example of an image taken by a camera that captures the nozzle from the side, and is an image of the nozzle in a state where electronic components are not adsorbed. Schematic diagram for explaining the configuration of the suction nozzle (a diagram showing a state in which the tip of the suction nozzle is separated from an electronic component). Schematic diagram for explaining the configuration of the suction nozzle (a diagram showing a state in which the tip of the suction nozzle presses an electronic component).

The component mounting machine 10 according to the embodiment will be described with reference to the drawings. The component mounting machine 10 performs a mounting process for mounting an electronic component P (illustrated in FIG. 2 (an example of a component according to claim)) on a circuit board S (an example of a substrate according to claim). The circuit board S is carried into the component mounting machine 10, and a predetermined electronic component P is mounted in the component mounting machine 10. The circuit board S on which the electronic component P is mounted is carried out of the component mounting machine 10. A plurality of component feeders 24 can be installed in the component mounting machine 10. By installing a plurality of component feeders 24 on the component mounting machine 10, a plurality of types of electronic components P can be mounted on the substrate S from the component feeder 24. As shown in FIG. 1, the component mounting machine 10 includes a component feeder 24, a mounting head 12, a board conveyor 18, a parts camera 22, and a control device 34 (shown in FIG. 5).

The component feeder 24 is detachably attached to a feeder holding portion (not shown) to supply the electronic component P to the mounting head 12. The component feeder 24 includes a reel (not shown), a tape 26 wound around the reel, and a motor (not shown) for feeding the tape 26 from the reel. As shown in FIG. 2, the tape 26 is formed with a cavity 28 for accommodating the electronic component P. More specifically, the tape 26 includes a base tape and a cover tape attached to the base tape. The cavity 28 is formed on a base tape, and a cover tape covers the upper surface of the cavity 28. When the cover tape is peeled off from the base tape, the electronic component P in the cavity 28 can be supplied. A plurality of cavities 28 are formed at regular intervals in the longitudinal direction of the tape 26. Since a plurality of cavities 28 are formed in the tape 26, a plurality of electronic components P are housed in the tape 26. Further, a plurality of feed holes 30 are formed in the tape 26 at regular intervals in the longitudinal direction. The feed hole 30 is located between adjacent cavities 28.

The tape 26 accommodating a plurality of electronic components P is wound around a reel with one end fixed to the reel. When the motor is driven, the reel rotates and the tape 26 is sent out from the reel. The tape 26 sent out from the reel is sent toward the tip end of the component feeder 24 (the end portion on the circuit board S side in FIG. 1). The cover tape of the tape 26 fed toward the tip of the component feeder 24 is peeled off from the base tape in the middle of the tape 26. The cavity 28 of the tape 26 is sent to a predetermined position (so-called component suction position) at the tip of the component feeder 24, and the component is supplied to the mounting head 12 at this component suction position. Since the feed hole 30 is formed in the tape 26, the tape 26 is fed in order by a predetermined length according to the feed hole 30. Therefore, each of the plurality of cavities 28 is sequentially positioned at the component supply position. Since one end of the tape 26 is fixed to the reel, the cavity near the fixed end is not sent to the component supply position. Therefore, the electronic component P is not housed in the cavity 28 near the fixed end.

The mounting head 12 includes a suction nozzle 14 (an example of the nozzle according to claim). The suction nozzle 14 is detachably attached to the mounting head 12 and sucks the electronic component P supplied by the component feeder 24. That is, the suction nozzle 14 can suck the electronic component P housed in the cavity 28. That is, as shown in FIGS. 9 and 10, the suction nozzle 14 includes a nozzle holder 14c, a tip portion 14a, a base end portion 14b, and a spring 14d housed in the nozzle holder 14c. The spring 14d is arranged between the base end portion 14b and the tip end portion 14a. The base end portion 14b is fixed to the nozzle holder 14c, and the tip end portion 14a can move in the vertical direction (that is, the axial direction of the suction nozzle 14) with respect to the nozzle holder 14c. In the state where the tip portion 14a is not in contact with the electronic component P (the state shown in FIG. 9), the tip portion 14a is in a state of protruding from the nozzle holder 14c due to the urging force of the spring 14d (that is, the tip portion 14a is in the nozzle holder 14c). It becomes the state where it has moved to the most downward position. On the other hand, in a state where the tip portion 14a comes into contact with the electronic component P and presses the electronic component P with a preset force (state shown in FIG. 10), the spring 14d is compressed by a predetermined amount, thereby causing the tip portion 14a. Most of the above is housed inside the nozzle holder 14c (that is, the tip portion 14a is moved most upward with respect to the nozzle holder 14c).

A negative pressure source 44 is connected to the suction nozzle 14. As the negative pressure source 44, for example, a vacuum pump can be used. The negative pressure source 44 supplies a negative pressure to a negative pressure introduction passage (not shown) formed in the suction nozzle 14. The negative pressure introduction passage extends from the base end portion 14b to the tip end portion 14a, and supplies negative pressure to the tip end portion 14a. Further, a switching valve (not shown) is provided in the negative pressure introduction passage, and the negative pressure introduction passage communicates with the atmosphere through the switching valve. By supplying a negative pressure to the tip portion 14a, the electronic component P can be attracted to the tip portion 14a. On the other hand, by releasing the negative pressure supplied to the tip portion 14a by the switching valve to the atmosphere, the electronic component P adsorbed on the tip portion 14a can be released.

A positive pressure source 48 is further connected to the suction nozzle 14 via a flow rate sensor 46. As the positive pressure source 48, for example, a compressor can be used. The positive pressure source 48 supplies positive pressure to the positive pressure introduction passage (not shown) formed in the suction nozzle 14. The positive pressure introduction passage does not communicate with the atmosphere when the tip portion 14a protrudes from the nozzle holder 14c (the state shown in FIG. 9), and the tip portion 14a is housed in the nozzle holder 14c (shown in FIG. 10). In the state), it is configured to communicate with the atmosphere. Therefore, in the state shown in FIG. 9, air does not flow in the positive pressure introduction passage, and in the state shown in FIG. 10, air flows in the positive pressure introduction passage. The flow rate sensor 46 detects whether or not air flows in the positive pressure introduction passage. By detecting whether or not air flows in the positive pressure introduction passage by the flow rate sensor 46, whether or not the tip portion 14a is in contact with the electronic component P (that is, the tip portion 14a is in contact with and presses on the electronic component P). Whether or not it is in the state) can be detected.

The suction nozzle 14 described above is held so as to be movable in the vertical direction with respect to the mounting head 12. Specifically, the mounting head 12 is provided with an elevating mechanism 40 (shown in FIG. 9). The elevating mechanism 40 includes a motor and a mechanism for converting the driving force of the motor into an elevating motion of the suction nozzle 14. By driving the motor of the elevating mechanism 40, the suction nozzle 14 can move in the vertical direction with respect to the mounting head 12. The vertical position of the suction nozzle 14 is detected by the position sensor 42 provided on the mounting head 12.

The mounting head 12 further includes a mark camera 16 (an example of the detection unit (first detection unit) according to the claim). The mark camera 16 is mounted on the lower surface of the mounting head 12. The optical axis of the mark camera 16 extends vertically downward, and the mark camera 16 captures an image below the mounting head 12. In this embodiment, the mark camera 16 is used to image a substrate mark provided on the circuit board S as a reference for positioning and alignment, and to image a cavity 28 accommodating an electronic component P.

The mounting head 12 can be moved in a range from above the component feeder 24 to above the circuit board S by the head moving device 32 (shown in FIG. 5). Therefore, when the mounting head 12 is positioned above the component feeder 24 by the head moving device 32, the suction nozzle 14 can suck the electronic component P supplied by the component feeder 24, and the mark camera 16 is an electronic component. The cavity 28 accommodating P can be imaged. On the other hand, when the mounting head 12 is positioned above the circuit board S by the head moving device 32, the suction nozzle 14 can mount the electronic component P sucked on the lower end thereof on the circuit board S, and the mark camera. 16 can image the board mark of the circuit board S.

The board conveyor 18 includes a pair of

belt conveyors

20a and 20b, and is capable of carrying in the circuit board S, supporting the circuit board S when mounting the electronic component P, and mounting the electronic component P on the circuit board S. Carry out. A parts camera 22 (an example of the second detection unit according to claim) is arranged between the substrate conveyor 18 (specifically, the belt conveyor 20b) and the parts feeder 24. The optical axis of the parts camera 22 extends vertically upward, and the parts camera 22 captures an image above the optical axis. Therefore, when the mounting head 12 is positioned above the parts camera 22 by the head moving device 32, the parts camera 22 can take an image of the electronic component P sucked on the lower end of the suction nozzle 14. The suction process of the electronic component P by the suction nozzle 14 may not be possible due to various factors. When the electronic component P cannot be attracted to the suction nozzle 14, the parts camera 22 captures an image as shown in FIG. On the other hand, when the electronic component P can be adsorbed on the adsorption nozzle 14, the component camera 22 captures an image as shown in FIG. In this embodiment, it is determined whether or not the electronic component P can be attracted to the suction nozzle 14 based on the image captured by the parts camera 22. Although the suction nozzle 14 and the electronic component P are displayed so as to be distinguishable in FIG. 4, the suction nozzle 14 and the electronic component P cannot be clearly distinguished in the actual image. Therefore, in this embodiment, the determination is made based on the brightness (color) of each pixel in the image captured by the parts camera 22. For example, when the suction nozzle 14 is black and the electronic component P is white in the image to be captured, the electronic component P is reflected in the image depending on the number of pixels of the portion displayed in white in the image. Determine if it is. Alternatively, when the suction nozzle 14 is black and the electrode portion of the electronic component P is white in the image to be captured, the electronic component P is reflected in the image by the pattern of the portion displayed in white in the image. Determine if it is crowded. When the electronic component P is reflected in the image, it is determined that the electronic component P has been adsorbed on the adsorption nozzle 14.

The control device 34 (an example of the determination unit according to the claim) is configured by using a computer including a CPU, ROM, and RAM, and includes a component feeder 24, a mounting head 12, a board conveyor 18, and a component camera 22. And so on, each part of the component mounting machine 10 is controlled. By controlling each part of the component mounting machine 10, the control device 34 carries in the circuit board S, processes for mounting the electronic component P on the circuit board S, and carries out the circuit board S on which the electronic component P is mounted. Further, in the component mounting machine 10 of the present embodiment, the control device 34 improves the accuracy of the component presence / absence detection process of detecting whether or not the electronic component P is housed in the cavity 28 by the mark camera 16 and the accuracy of this detection process. Perform the learning process for.

Next, the learning process and the component presence / absence detection process executed by the control device 34 will be described. As shown in FIG. 5, these processes include a control device 34, a mounting head 12 (that is, a suction nozzle 14 and a mark camera 16), a head moving device 32, a component feeder 24, a component camera 22, and a storage device 36 (claim). It is executed by an example of the storage unit described in. That is, the control device 34 drives the mounting head 12, the head moving device 32, the component feeder 24, and the component camera 22, and stores the image obtained thereby in the storage device 36. In this embodiment, the learning process executed by the control device 34 can be executed when the mounting process for mounting the electronic component P on the circuit board S is being performed, and the learning process is separate from the mounting process. You don't have to do just that. Further, after the learning process is completed, the component presence / absence detection process may be performed only by using the learned determination criteria at the time of the mounting process.

FIG. 6 shows the flow of the learning process executed by the control device 34. As shown in FIG. 6, the control device 34 first acquires an image of the cavity 28 of the component feeder 24 (S10). That is, the control device 34 drives the component feeder 24 to feed the tape 26, and positions the portion of the cavity 28 of the tape 26 at the component suction position. Next, the control device 34 drives the head moving device 32 to position the mark camera 16 above the cavity 28, and the mark camera 16 takes an image of the cavity 28. As described above, the cavity 28 of the tape 26 contains an electronic component P and a cavity 28 in which the electronic component P is not accommodated (for example, one near the fixed end of the reel). Therefore, the image acquired by the process of S10 includes an image in which the electronic component P is housed in the cavity 28 and an image in which the electronic component P is not housed in the cavity 28.

Next, the control device 34 executes a suction process of sucking the electronic component P in the cavity 28 by the mounting head 12 (S12). Specifically, the control device 34 first drives the head moving device 32 to position the suction nozzle 14 above the cavity 28. Next, the suction nozzle 14 is lowered by the elevating mechanism 40, and the electronic component P is sucked at the tip thereof. As described above, some of the cavities 28 of the tape 26 contain the electronic component P, and some do not contain the electronic component P. Therefore, when the electronic component P is not accommodated in the cavity 28, the electronic component P is not attracted to the suction nozzle 14.

Next, the control device 34 detects and determines whether or not the electronic component P can be adsorbed on the adsorption nozzle 14 by the adsorption process of S12 (S14). Specifically, the control device 34 drives the head moving device 32 to position the suction nozzle 14 above the parts camera 22, and the parts camera 22 takes an image of the suction nozzle 14. When the suction nozzle 14 is imaged by the parts camera 22, the control device 34 determines whether or not the electronic component P is sucked by the suction nozzle 14 from the image captured by the parts camera 22. The determination of S14 can be performed by the same method as the determination method performed by the conventional component mounting machine. For example, the determination may be performed based on the brightness of the image captured by the parts camera 22 as described above. can.

When it is determined that the electronic component P has not been adsorbed on the suction nozzle 14 (NO in S14), the control device 34 stops the operation of each part of the component mounting machine 10 as an abnormality has occurred (S22). That is, when the component feeder 24 is out of parts (when the electronic component P is not accommodated in the cavity 28 sent to the component suction position), or when the suction nozzle 14 is damaged and the electronic component P cannot be sucked. Is not reasonable to continue further processing. Therefore, the operation of each part of the component mounting machine 10 is stopped, and the operator is notified to take appropriate measures.

When it is determined that the electronic component P can be adsorbed to the suction nozzle 14 (YES in S14), the control device 34 stores the image acquired in S10 in the storage device 36 as an image with components (S16). That is, at the learning stage, it cannot be determined whether or not the electronic component P is housed in the cavity 28 only from the image captured by the mark camera 16. On the other hand, whether or not the electronic component P is attracted to the suction nozzle 14 can be accurately determined from the image of the parts camera 22. In this embodiment, when it is determined from the image of the parts camera 22 that the electronic component P can be adsorbed to the suction nozzle 14, the image acquired in S10 after the fact is taken as the image with the component (that is, the electronic component P is in the cavity 28). It is stored in the storage device 36 as a stored image). As a result, the image of the state in which the electronic component P is housed in the cavity 28 is appropriately stored in the storage device 36.

Next, the control device 34 acquires an image of the cavity 28 of the component feeder 24, specifically, the cavity 28 (the cavity 28 after the electronic component P is adsorbed) captured by S10 by the mark camera 16 (S18). .. That is, the control device 34 drives the head moving device 32 to position the mark camera 16 above the cavity 28 and images the cavity 28 by the mark camera 16 before driving the component feeder 24 to feed the tape 26. .. If YES in S14, it is certain that there is no electronic component P in the cavity 28 because the electronic component P has been adsorbed from the cavity 28. Therefore, the image captured in S18 is an image in which the electronic component P is not accommodated in the cavity 28. In this embodiment, if YES is determined in S14, the electronic component P adsorbed on the adsorption nozzle 14 is first mounted on the circuit board S, and then the imaging of S18 is performed. By immediately mounting the electronic component P sucked on the suction nozzle 14 on the circuit board S after the suction nozzle 14 is imaged by the parts camera 22, the accuracy of the mounting position of the electronic component P can be improved.

Next, the control device 34 stores the image acquired in S18 as a component-less image in the storage device 36 (S20). As described above, since the image acquired in S18 is an image captured without the electronic component P in the cavity 28, this image is stored in the storage device 36 as an image without components. As a result, the image with parts and the image without parts are accumulated in the storage device 36.

Since the image with parts and the image without parts are accumulated in the storage device 36 by the above processing, the control device 34 has the cavity imaged by the mark camera 16 based on the stored images with parts and the image without parts. From the image of 28, a determination criterion for determining whether or not the electronic component P is housed in the cavity 28 is determined (S22). Specifically, in this embodiment, the electronic component P is housed in the cavity 28 by comparing the image with components and the corresponding image without components and learning the difference (for example, machine learning). Determine the criteria for determining whether or not. For example, a difference image between an image with parts and a corresponding image without parts can be calculated, a feature pattern can be extracted from the luminance distribution of the difference image by machine learning, and the extracted feature pattern can be used as a determination criterion. That is, when the electronic component P is housed in the cavity 28, the electronic component P is reflected in the image captured by the mark camera 16. On the other hand, when the electronic component P is not accommodated in the cavity 28, the electronic component P is not reflected in the image captured by the mark camera 16. Therefore, when the difference image between the image with parts and the corresponding image without parts is calculated, the electronic component P is extracted from the difference image. Therefore, the control device 34 can machine-learn the difference image between the image with parts and the corresponding image without parts, and can extract the feature pattern (determination standard) of the electronic component P. In this embodiment, since the determination criterion is determined by comparing and learning the image with parts and the corresponding image without parts, it is accurately determined whether or not the electronic component P is housed in the cavity 28. Can be done.

If the type of the electronic component P housed in the cavity 28 changes, the shape of the electronic component P also changes, so that the above-mentioned determination criteria also differ. Therefore, the above comparative learning process is performed for each type of electronic component P, and the determination criteria thereof are also determined for each type of electronic component P. Further, the determination criterion is determined every time the image with parts and the corresponding image without parts are stored, but it may be performed after accumulating a certain number of images with parts and images without parts. ..

The determination criteria determined as described above are stored in the storage device 36 for each type of the electronic component P. Then, after the learning process is completed, it is used to determine whether or not the electronic component P is housed in the cavity 28. That is, every time the electronic component P is mounted on the circuit board S, it is determined whether or not the electronic component P is housed in the cavity 28. For example, when the component feeder 24 is driven and the portion of the cavity 28 of the tape 26 is located at the component suction position, the control device 34 drives the head moving device 32 to position the mark camera 16 above the cavity 28. The cavity 28 is imaged by the mark camera 16. Next, the control device 34 compares the image captured by the mark camera 16 with the componentless image (the average componentless image stored in the storage device 36), and compares these difference images with the above-mentioned determination criteria. It is used to determine whether or not the electronic component P is housed in the cavity 28. When it is determined that the electronic component is housed in the cavity 28, the process of mounting the electronic component P on the circuit board S is performed as it is. On the other hand, if it is determined that the electronic component P is not accommodated in the cavity 28, the operator is notified to that effect. As a result, the operator can take necessary measures (for example, replacement of the component feeder 24).

In the component mounting machine 10 of this embodiment, an image captured with the electronic component P housed in the cavity 28 and an image captured with the electronic component P not housed in the cavity 28 are stored. Then, by comparing and learning these images, a determination criterion for determining whether or not the electronic component P is housed in the cavity 28 is determined. Therefore, it is possible to accurately determine whether or not the electronic component P is housed in the cavity 28. Further, since the mark camera 16 that captures the substrate mark detects whether or not the electronic component P is housed in the cavity 28, it is not necessary to provide a dedicated detection sensor.

Further, in this embodiment, when the electronic component P is adsorbed by the adsorption nozzle 14, the image captured before adsorption is stored as an image with components, and the image captured after adsorption is stored as an image without components. It is possible to appropriately acquire an image with a component and an image without a component while performing a mounting process for mounting the electronic component P on the circuit board S.

In the above embodiment, the mark camera 16 detects whether or not the electronic component P is housed in the cavity 28, but the present invention is not limited to such an example. For example, the position sensor 42 and the flow rate sensor 46 used for measuring the distance from the mounting head 12 to the circuit board S may be used to detect whether or not the electronic component P is housed in the cavity 28. .. That is, as described above, the component mounting machine 10 detects whether or not the position sensor 42 that detects the vertical position of the suction nozzle 14 and the tip portion 14a of the suction nozzle 14 are in contact with the electronic component P. It is equipped with a sensor 46. Therefore, by using the position sensor 42 and the flow rate sensor 46, it is possible to measure the distance from the reference height set above the cavity 28 to the suction surface of the electronic component P housed in the cavity 28. Specifically, the suction nozzle 14 is moved up and down from a state (an example of the second state according to the claim) in which the suction nozzle 14 is located at a preset height (an example of the reference height according to the claim) above the cavity 28. The mechanism 40 is driven and lowered so that the tip of the suction nozzle 14 is in contact with the electronic component P (an example of the first state according to claim). When the tip of the suction nozzle 14 comes into contact with the electronic component P, the flow rate sensor 46 detects that air has flowed into the positive pressure introduction passage. Therefore, the control device 34 stops the descent of the suction nozzle 14 by the elevating mechanism 40 based on the detection result of the flow rate sensor 46, and detects the position of the suction nozzle 14 in the vertical direction by the position sensor 42 at that time. Next, the control device 34 is based on the difference between the height (reference height) of the suction nozzle 14 when the lowering of the suction nozzle 14 is started and the height of the suction nozzle 14 when the lowering of the suction nozzle 14 is stopped. The distance from the reference height set above the cavity 28 to the suction surface of the electronic component P housed in the cavity 28 is calculated.

Here, when the electronic component P is housed in the cavity 28, the control device 34 measures the distance from the reference height to the suction surface of the electronic component P housed in the cavity 28. When the electronic component P is not housed in the control device 34, the control device 34 measures the distance from the reference height to the bottom surface of the cavity 28. Therefore, the distance calculated by the control device 34 differs depending on whether or not the electronic component P is housed in the cavity 28. Therefore, it is possible to detect whether or not the electronic component P is housed in the cavity 28 based on the distance calculated by the control device 34. Specifically, the above-mentioned distance measurement is performed before and after sucking the electronic component P on the suction nozzle 14. As a result, the measurement result measured when the electronic component P is housed in the cavity 28 and the measurement result measured when the electronic component P is not housed in the cavity 28 are accumulated. Then, by comparing and learning these accumulated measurement results, a determination criterion for determining whether or not the electronic component P is housed in the cavity 28 is determined. Even with such a form, it is possible to accurately determine whether or not the electronic component P is housed in the cavity 28. In the above-mentioned example, the distance is measured by using the position sensor 42, the flow rate sensor 46, and the like, but the distance is not limited to such an example. For example, the mounting head is equipped with a distance sensor (for example, a reflection type photoelectric sensor). You may go there.

Further, in the above embodiment, it is determined whether or not the electronic component P is attracted to the suction nozzle 14 based on the image captured by the parts camera 22, but the present invention is not limited to such an example. For example, a camera that captures the suction nozzle 14 from the side may be used. That is, the mounting head of the component mounting machine may be provided with a camera that captures images of the suction nozzle 14 from the side in order to determine damage to the suction nozzle 14. When the suction nozzle 14 is imaged with such a camera, an image as shown in FIG. 7 is acquired when the electronic component P is sucked, and an image as shown in FIG. 8 is obtained when the electronic component P is not sucked. Is obtained. Therefore, from the acquired image, it is possible to determine whether or not the electronic component P is sucked on the lower end of the suction nozzle 14. It should be noted that the determination as to whether or not the electronic component P is adsorbed on the suction nozzle 14 can be performed in the same manner as in the conventional component mounting machine of this type.

Further, in the above embodiment, when it is determined that the electronic component P is adsorbed on the suction nozzle 14, the electronic component P adsorbed on the suction nozzle 14 is first mounted on the circuit board S, and then the cavity 28 is imaged. I tried to acquire the image without parts, but it is not limited to such an example. For example, when it is determined that the electronic component P has been adsorbed on the suction nozzle 14, the cavity 28 is first imaged to acquire a component-less image, and then the electronic component P adsorbed on the suction nozzle 14 is mounted on the circuit board S. You may. Even by such a procedure, an image with parts and an image without parts can be appropriately acquired. If high accuracy is required at the position where the electronic component P is mounted, the cavity 28 is imaged to acquire a component-less image, and then the electronic component P sucked by the suction nozzle 14 is imaged again by the parts camera 22. Then, the electronic component P adsorbed on the adsorption nozzle 14 may be mounted at a position on the circuit board S which is corrected based on the captured data. According to such an aspect, the electronic component P sucked by the suction nozzle 14 is imaged again by the parts camera 22, but the accuracy of the position where the electronic component P is mounted can be improved.

Although specific examples of the disclosed techniques have been described in detail in the present specification, these are merely examples and do not limit the scope of claims. The techniques described in the claims include various modifications and modifications of the specific examples exemplified above. Further, the technical elements described in the present specification or the drawings exhibit technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. In addition, the techniques exemplified in the present specification or the drawings achieve a plurality of purposes at the same time, and achieving one of the purposes itself has technical usefulness.

Claims

It is a component presence / absence detection device provided in a component mounting machine that performs a mounting process for mounting components contained in the cavity of the sent tape on a substrate and detects whether or not the component is contained in the cavity. ,
It is equipped with at least one of a camera capable of photographing the cavity from above and a measuring device capable of measuring the distance from a reference height set above the cavity to the suction surface of the component housed in the cavity. , A detection unit that executes a detection process of whether or not the component is housed in the cavity,
A detection result obtained when the detection process is executed with the component contained in the cavity, and a detection result obtained when the detection process is executed with the component not contained in the cavity. A storage unit that stores a determination criterion for determining whether or not the component is housed in the cavity, which is determined based on the above.
When the detection process is executed in the case of performing the mounting process, the component is placed in the cavity based on the detection result obtained by the detection process and the determination criterion stored in the storage unit. A judgment unit that determines whether or not it is contained, and
A component presence / absence detection device equipped with.
The component mounting machine is
A nozzle capable of performing an adsorption process for adsorbing the component housed in the cavity,
A mounting head that holds the nozzle so that it can move up and down,
The first state in which the nozzle is moved up and down with respect to the mounting head and the tip of the nozzle presses the component housed in the cavity, and the tip of the nozzle is housed in the cavity. An elevating mechanism that enables switching to a second state that is separated from the component and is located at the reference height.
Equipped with
The measuring device is
The first state detection sensor that detects that the first state has been reached, and
It is equipped with a position sensor that detects the vertical position of the nozzle.
The detection unit is based on the position of the nozzle tip detected by the position sensor in the second state and the position of the nozzle tip detected by the position sensor in the first state. The component presence / absence detection device according to claim 1, wherein the distance from the reference height to the suction surface of the component housed in the cavity is measured.
In a component mounting machine that performs a mounting process in which components housed in the cavity of the tape to be sent are adsorbed by a nozzle and the adsorbed components are mounted on a substrate, whether or not the components are housed in the cavity is determined. It is a learning method of a component presence / absence detection device provided with a detection unit for detection.
A detection process for detecting whether or not a component is housed in the cavity is executed by the detection unit for the cavity before the suction process for sucking the component housed in the cavity by the nozzle is executed. The first detection step to acquire the first detection result and
After the first detection step, the adsorption step of executing the adsorption process and the adsorption step
After the suction step, a second detection step of detecting whether or not the component is sucked on the nozzle, and a second detection step.
When it is detected that the component is adsorbed on the nozzle in the second detection step, the component is housed in the cavity based on the first detection result acquired in the first detection step. The first storage process, which is sometimes obtained as a detection result with parts, and
When it is detected in the second detection step that the component is adsorbed on the nozzle, the detection process is executed on the cavity after the component is adsorbed, and the second detection result is acquired. Detection process and
A second storage step of storing the second detection result acquired in the third detection step as a component-less detection result obtained when the component is not accommodated in the cavity.
A learning method for a component presence / absence detection device.
Only when it is detected in the second detection step that the component is adsorbed on the nozzle, the first storage step, the third detection step, and the second storage step are executed.
The third aspect of the present invention, wherein when the component is not detected to be adsorbed on the nozzle in the second detection step, the first storage step, the third detection step, and the second storage step are not executed. Learning method of component presence / absence detection device.
The detection unit is a camera capable of capturing an image of the cavity from above, or a measuring device capable of measuring the distance from a reference height set above the cavity to the suction surface of the component housed in the cavity. The learning method of the component presence / absence detection device according to claim 3 or 4, which is provided.
A step of determining a determination criterion based on the component presence detection result stored in the first storage step and the component-less detection result stored in the second storage step is further provided.
The component according to any one of claims 3 to 5, wherein the determination standard is a standard for determining whether or not the component is housed in the cavity from the detection result obtained by the detection process. Learning method of presence / absence detection device.
It is a component mounting machine that adsorbs the components contained in the cavity of the tape to be sent and mounts the adsorbed components on the board.
A nozzle capable of performing an adsorption process for adsorbing the component housed in the cavity,
A first detection unit that executes a first detection process of whether or not the component is housed in the cavity, and
A second detection unit that executes a second detection process for detecting whether or not the component is adsorbed on the nozzle by the adsorption process when the adsorption process is executed.
A control unit that controls the nozzle, the first detection unit, and the second detection unit, and is configured to be able to execute the learning method according to any one of claims 3 to 6. ,
A component mounting machine equipped with.