JPWO2022149264A1 - - Google Patents
Info
- Publication number
- JPWO2022149264A1 JPWO2022149264A1 JP2022573879A JP2022573879A JPWO2022149264A1 JP WO2022149264 A1 JPWO2022149264 A1 JP WO2022149264A1 JP 2022573879 A JP2022573879 A JP 2022573879A JP 2022573879 A JP2022573879 A JP 2022573879A JP WO2022149264 A1 JPWO2022149264 A1 JP WO2022149264A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2021/000501 WO2022149264A1 (ja) | 2021-01-08 | 2021-01-08 | 部品有無検出装置、部品有無検出装置の学習方法及び部品実装機 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022149264A1 true JPWO2022149264A1 (ja) | 2022-07-14 |
Family
ID=82357856
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022573879A Pending JPWO2022149264A1 (ja) | 2021-01-08 | 2021-01-08 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPWO2022149264A1 (ja) |
WO (1) | WO2022149264A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024069783A1 (ja) * | 2022-09-28 | 2024-04-04 | 株式会社Fuji | 制御装置、実装装置、管理装置及び情報処理方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015176970A (ja) * | 2014-03-14 | 2015-10-05 | オムロン株式会社 | キャリアテープ中の部品の有無を検出する方法、センサモジュール、スプライシング装置、及び、部品実装機 |
JP6602269B2 (ja) * | 2016-06-30 | 2019-11-06 | ヤマハ発動機株式会社 | 部品実装装置 |
JP2020181868A (ja) * | 2019-04-24 | 2020-11-05 | パナソニックIpマネジメント株式会社 | 部品実装装置およびピッチ自動検出方法 |
-
2021
- 2021-01-08 WO PCT/JP2021/000501 patent/WO2022149264A1/ja active Application Filing
- 2021-01-08 JP JP2022573879A patent/JPWO2022149264A1/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
WO2022149264A1 (ja) | 2022-07-14 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20231117 |