CN108501509B - Automatic supply device and method for solder container - Google Patents
Automatic supply device and method for solder container Download PDFInfo
- Publication number
- CN108501509B CN108501509B CN201710506617.4A CN201710506617A CN108501509B CN 108501509 B CN108501509 B CN 108501509B CN 201710506617 A CN201710506617 A CN 201710506617A CN 108501509 B CN108501509 B CN 108501509B
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- solder container
- solder
- container
- new
- work department
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 234
- 238000000034 method Methods 0.000 title claims abstract description 51
- 238000005476 soldering Methods 0.000 claims description 55
- 239000000463 material Substances 0.000 claims description 9
- 238000004064 recycling Methods 0.000 claims description 8
- 238000009434 installation Methods 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 3
- 238000007598 dipping method Methods 0.000 claims description 2
- 230000005611 electricity Effects 0.000 claims 1
- 238000000576 coating method Methods 0.000 abstract description 3
- 239000011248 coating agent Substances 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000007591 painting process Methods 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
- B41F15/40—Inking units
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F33/00—Indicating, counting, warning, control or safety devices
- B41F33/16—Programming systems for automatic control of sequence of operations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Screen Printers (AREA)
Abstract
The invention relates to an automatic supply device and method for solder container, the automatic supply device includes: a working part for coating solder paste on the printed circuit board in a state of mounting the solder container; a mounting portion for supplying a new solder container to the working portion as reciprocating movement is effected with respect to the working portion; a supply unit configured to supply a new solder container filled with solder paste to the mounting unit by its own weight; a transfer unit that reciprocates the mounting unit; a solder sensing part for sensing the residual amount of solder paste in a solder container mounted on the working part; and a control part applying an input signal to discharge the solder container disposed at the working part according to a measured value of a remaining amount of solder paste in the solder container disposed at the working part sensed by the solder sensing part, and driving the supply part and the mounting part to supply a new solder container to the working part.
Description
Technical field
The present invention relates to a kind of automatic supply device of solder container and methods, more specifically, are related to a kind of following
The automatic supply device and its method of solder container: the container for exhausting solder in the case where not interrupting process is automatically drained out,
Automatic supply is filled with the new container of solder simultaneously.
Background technique
In general, the electronic equipment as such as computer or household appliances etc main component and built-in printed circuit
Plate (PCB:Printed Circuit Board), to make the small electrical sub-portion of various shapes such as semiconductor chip or pellet resistance
Part can be mounted, and be coated with the soldering paste of molten condition in a predetermined pattern.
The coating process of this soldering paste is by being referred to as the soldering paste apparatus for coating of screen process press (Screen printer)
It executes, scraper for screen process press (squeegee) extruding is provided on the metal mask for the opening portion for being formed with specific pattern
Soldering paste, to be applied to the component mounting portion of printed circuit board.
This previous screen process press is coated on a printed circuit after installing the solder container filled with soldering paste
Soldering paste, the and when soldering paste in solder container is insufficient, the case where being defectively applied to printed circuit board there are soldering paste.
In addition, in the case that the soldering paste in solder container all exhausts, need the work for interrupting screen process press it
The work of replacement solder container manually is executed by staff afterwards, therefore there are problems that whole process efficiency decline.
Summary of the invention
It is proposed currently invention addresses problems as described above, technical task to be solved by this invention is to provide one
The automatic supply device and its method of the following solder container of kind: automatic replacement solder is realized without interrupting process in process
Container, so as to increase the efficiency of integrated artistic.
In addition, technical task to be solved by this invention be to provide a kind of following solder container automatic supply device and
Its method: after the surplus of the soldering paste in sensing solder container, when the soldering paste surplus sensed is insufficient, automatically more
It is changed to the new solder container filled with soldering paste, is defectively applied to printed circuit board so as to prevent soldering paste.
Project of the invention is not limited to above-mentioned project, and those skilled in the art should pass through following explanation
It is clearly understood that other unmentioned projects.
According to the solder container automatic supply device of the embodiment of the present invention for solve the problem, may include:
Work department, the applying solder paste on a printed circuit in the state of being equipped with solder container；Mounting portion, with relative to the work
Make portion to realize reciprocating movement and supply new solder container to the work department；Supply department, using self weight to the mounting portion
Supply is filled with the new solder container of soldering paste；Transferred unit moves back and forth the mounting portion；Solder detecting part, for sensing
It is installed on the surplus of the soldering paste in the solder container of the work department；And control unit, apply input signal, thus according to logical
Cross the measured value of the soldering paste surplus in solder container that the solder detecting part senses, being configured at the work department, discharge
It is configured at the solder container of the work department, and drives the supply department and the mounting portion and supplies new solder container
To the work department.
Herein, the supply department may include: multiple feed rolls, dips down and tiltedly configures；First cylinder, according to described
The input signal of control unit and work；And first retainer, it is gone up and down by the work of first cylinder, and constrain configuration
In the movement of the new solder container in the feed rolls.
The transferred unit may include: driving motor；And driving screw, it is rotated with the driving of the driving motor,
To keep the mounting portion mobile.
In addition, the mounting portion is configured between the supply department and the work department, on the top of the work department one
Side is configured with the second retainer, the side for the new solder container which is supplied by change by the supply department
To and so that it is vertically installed to the mounting portion.
The mounting portion can also include: grip part, make the new solder container along constitute vertical direction shape
The new solder container is held under state.
In addition, the work department may include the second cylinder, lifting is realized by the input signal of the control unit, thus
The lid is separated in the rear end of solder container installation lid (cap) or from the rear end of the solder container.
In this case, the work department may include: knock pin and third cylinder, in the lid relative to described
The rear end of solder container and in the state of separating, the knock pin ejects the solder container；The third cylinder makes the top
Pin moves back and forth out.
It can connect the input signal of the with good grounds control unit in the side of the lid and the air-pressure tube of pneumatics be provided.
On the other hand, the automatic Supply Method of the solder container of embodiment according to the present invention, the solder container are pacified
Loaded on screen process press, thus applying solder paste on a printed circuit, which is characterized in that comprise the following steps that (a) sensing peace
The surplus of soldering paste in solder container loaded on work department；(b) the surplus of the soldering paste be preset value below when, from
The working portion is from push-in recycling space after the solder container；(c) it will be filled with the new solder container supply of soldering paste
To the work department；And (d) hold once new solder container is supplied to the work department with the lid sealing new solder
After the rear end of device, continue applying solder paste on a printed circuit.
Will be filled with the new solder container of the soldering paste supplied to the step of work department may include following step
It is rapid: to provide the new solder container to supply department；The new weldering is configured in the multiple feed rolls tiltedly configured dipping down
Material container；And first retainer according to the input signal of control unit go up and down and release for be configured at it is new in the feed rolls
Solder container movement constraint, to supply the new solder container to the work department.
Will be filled with the new solder container of the soldering paste supplied to the step of work department may include following step
It is rapid: to make the new solder container be installed to the peace being configured between the supply department and the work department in vertical direction
Dress portion, the second retainer conversion for being configured at the top side of the work department are held by the new solder that the supply department supplies
The direction of device.
Will be filled with the new solder container of the soldering paste supplied to the step of work department can also include following
Step: the grip part that the mounting portion is included holds described new in the state that the new solder container constitutes vertical direction
Solder container.
From the working portion from the solder container after push-in recycling space the step of may include following step
It is rapid: the second cylinder operation that the work department is included, so that removal is installed on the lid of the rear end of the solder container.
From the working portion from the solder container after push-in recycling space the step of can also include following
Step: it in the state that the lid is separated relative to the rear end of the solder container, is pushed up by the knock pin of reciprocating movement
The solder container out.
From the working portion from the solder container after push-in recycling space the step of may include following step
It is rapid: interrupt and supply pneumatics by the air-pressure tube for the side for being connected to the lid, and if new solder container supplied to described
Work department, then the step of continuing applying solder paste on a printed circuit after the rear end for sealing the new solder container with lid
It may include following step: supplying pneumatics by the air-pressure tube.
Other specific items of the invention are included in detailed description and attached drawing.
The automatic supply device and its method of solder container based on embodiment according to the present invention, is not necessarily in process
Disconnected process and realize automatic replacement solder container, so as to increase the efficiency of integrated artistic.
In addition, the automatic supply device and its method of the solder container based on embodiment according to the present invention, can also mention
For when the soldering paste surplus sensed is insufficient, being changed to filling after the surplus of the soldering paste in sensing solder container
There is the new solder container of soldering paste, so as to prevent the effect that soldering paste is defectively applied to printed circuit board.
Effect according to the present invention is not limited to content enumerated above, and more effects are included in this specification
It is interior.
Detailed description of the invention
Fig. 1 be apply the automatic supply device of solder container of embodiment according to the present invention screen process press it is whole
Body perspective view.
Fig. 2 is the front view of Fig. 1.
Fig. 3 is the perspective view that the supply department of solder container is shown in Fig. 1.
Fig. 4 is the front view of Fig. 3.
Fig. 5 is the perspective view that the mounting portion of solder container is shown in Fig. 1.
Fig. 6 is the front view of Fig. 5.
Fig. 7 is the perspective view that the work department of solder container is shown in Fig. 1.
Fig. 8 is the front view of Fig. 7.
Fig. 9 is the flow chart for successively showing the automatic Supply Method process of solder container of embodiment according to the present invention.
Figure 10 is the process for successively illustrating the process of the automatic Supply Method of solder container of embodiment according to the present invention
Figure.
Symbol description
10: screen process press 20: supply department
22: 24: the first cylinder of feed rolls
26: the first retainers 30: mounting portion
32: grip part 40: work department
42: circular arc compensation section 44: knock pin
50: the second cylinders 60: air-pressure tube
70: the second retainers 80: driving screw
90: driving motor 100: solder container
110: lid 200: solder detecting part
300: control unit
Specific embodiment
Advantages and features of the invention and the method for realizing them, by referring to hereinafter together with attached drawing specifically
Bright embodiment becomes more clear.However, can be presented as that the invention is not limited to embodiment as disclosed below
This different various forms, the present embodiment are used for the purpose of that the present invention is made to disclose more complete and make the technical field of the invention
Those of ordinary skill be more fully understood from scope of the invention and provide, the present invention is only obtained by the scope of claim
Definition.Identical reference marks indicates identical constituent element throughout the specification.
In addition, the embodiment described in the present specification will referring to idealized schematic diagram of the invention i.e. sectional view and/or
Schematic diagram is illustrated.Therefore, it may be deformed according to the form of the schematic diagrames such as manufacturing technology and/or allowable error.In addition, In
In each drawing shown in the present invention, for ease of description, each component may some zoom in or out display.Entire
Identical reference marks indicates identical constituent element in specification.
Hereinafter, be described in detail with reference to the accompanying drawings solder container according to the present invention automatic supply device and its method it is preferred
Embodiment.
Fig. 1 is the entirety using the screen process press of the automatic supply device of the solder container of embodiment according to the present invention
Perspective view, Fig. 2 are the front views of Fig. 1.
As shown in Figures 1 and 2, using the screen printing of the automatic supply device of the solder container of embodiment according to the present invention
Brush machine 10 may include: the supply department 20 of solder container 100；The mounting portion 30 of solder container 100；The work of solder container 100
Portion 40, and the transferred unit including moving the mounting portion 30 of solder container 100 along X-direction.
Herein, transferred unit may include driving motor 90 and driving screw (Lead Screw) 80, and driving screw 80 is by drive
It moves the driving of motor 90 and rotates and move mounting portion 30 along X-direction, so as to so as to be installed on the weldering of mounting portion 30
Material container 100 is mobile to work department 40, and the work relationship about this will be explained below.
Referring to FIG. 1 and FIG. 2, the mobile and state positioned at work department 40 of display mounting portion 30, mounting portion 40 can pass through shifting
It send portion mobile to 40 side of work department or is separated from work department 40.
On the other hand, in fig. 1 and fig. 2 without especially showing the supply department 20 of solder container 100, but in mounting portion 30
Side can configure supply department 20, and the supply department 20 is used to keep the solder container 100 filled with soldering paste automatic using self weight
Supply.
Fig. 3 is the perspective view for showing the supply department of solder container for the side for being configured at screen process press as shown in Figure 1,
Fig. 4 is the front view of Fig. 3.
As shown in Figures 3 and 4, the supply department 20 of solder container 100 may include: multiple feed rolls 22, tilt down
Direction on configuration is separated by with scheduled spacing；First retainer 26 is realized according to input signal and is gone up and down；And first cylinder
24, go up and down first retainer 26.
Therefore, once the input port investment (not shown) from operator to supply department 20 is filled with the solder container of soldering paste
100, solder container 100 can be slided by 22 one direction of multiple feed rolls tiltedly configured that dips down, at this point, in the first retainer
In the state that 26 rise, by 26 limit slippage of the first retainer, to realize the state being configured in feed rolls 22.
In this state, it if the first cylinder 24 works according to input signal and declines the first retainer 26, welds
Material container 100 is declined using self weight and is installed on mounting portion 30, as follows if illustrating the work relationship.
Fig. 5 is the perspective view that the mounting portion of solder container is shown in Fig. 1, and Fig. 6 is the front view of Fig. 5.
Such as it is illustrated above, supply department 20 goes up and down the first retainer 26 by the work of the first cylinder 24, thus
It can stop or open solder container 100.
At this point, in the case where retainer declines the first retainer 26 due to the work of the first cylinder 24, solder container 100
It is slided according to self weight along feed rolls 22 and is moved along downwardly-inclined direction.
Herein, referring to Fig.1 with Fig. 2 and the Fig. 7 and Fig. 8 that will be explained below, on the top of work department one
Side is configured with the second retainer 70.
Therefore, the solder container feed rolls 22 along supply department 20 slided and moved along downwardly-inclined direction
For 100, front end is benefit after vertical direction since second retainer 70 can not further advance, and by angulation change
The free-falling with self weight, to vertically be installed on mounting portion 30 as shown in Figures 5 and 6.
Mounting portion 30 includes grip part 32, has elasticity, so that solder container 100 is in the state of constituting vertical direction
It is steadily held, accordingly, by grip part 32, solder container 100 realizes installation in the state of constituting vertical direction.
In this way, in the state that solder container 100 is installed on mounting portion 30, mounting portion 30 due to the work of transferred unit along
X-direction is mobile, so as to be shifted into work department 40.
Referring again to Fig. 1 and Fig. 2, show that mounting portion 30 is configured to X-direction is mobile in work department by transferred unit
40 state.
On the other hand, Fig. 7 is the perspective view that the work department of solder container is shown in Fig. 1, and Fig. 8 is the front view of Fig. 7.
As shown in Figures 7 and 8, work department 40 is equipped with second retainer 70 in top side, can match in upper side
It is equipped with the second cylinder 50, second cylinder 50 closes solder container and 110 oscilaltion of lid for making solder container 100
100 rear end, so that it is sealed.
Herein, it is equipped with lid 110 in the front end of the second cylinder 50, be connected in the side of the lid 110 for supplying gas
The air-pressure tube 60 of pressure.
Second cylinder 50 can play following function: being gone up and down according to input signal and lid 110 is mounted on solder and held
The rear end of device 100 so that rear end is sealed, or is separated from the rear end of solder container 100 by the lid 110, about its work
Make relationship to be also described in detail below.
It on the other hand, can be configured with for compensating by the angle of mobile solder container 100 in the side of work department 40
Circular arc compensation section 42.
That is, accurately must keep plumbness can from the solder container 100 that mounting portion 30 is transplanted on work department 40
The installation for successfully realizing lid 110, at this point, if the solder container 100 for being transplanted on work department 40 is configured to the shape being slightly slanted
State, then there is the worry that can not be accurately mounted as described above in lid 110, therefore in order to eliminate such worry, can make
Circular arc compensation section 42 adjusts solder container 100 and it is made to accurately form plumbness.
For example, the one side of circular arc compensation section 42 forms the arc surface for corresponding to the circular arc of solder container 100, if making solder
Container 100 is tightly attached to circular arc compensation section 42, then solder container 100 can be accurately compensated for by circular arc compensation section 42 as vertical configuration
State.
In addition, the basal part in work department 40 can be configured with making for ejecting the solder container 100 that soldering paste has exhausted
The knock pin (ejector pin) 44 in space is extremely recycled in its free-falling.
Such knock pin 44 can play following effect: (not schemed by the third cylinder to be worked according to input signal
Show) and realize movement in the horizontal direction, the solder container 100 that soldering paste has exhausted is ejected accordingly, about its work relationship
Also it will be explained below.
On the other hand, it may be configured to the solder sense of the soldering paste surplus in measurement solder container 100 in work department 40
Survey portion 200, solder detecting part 200 transmit the signal to control unit by the soldering paste surplus in sensing solder container 100
300, so that control unit 300 be enable to control the work of supply department 20 and mounting portion 30 and work department 40 and transferred unit.
Herein, solder detecting part 200 can using ON/OFF sensor described in hereafter, the ON/OFF sensor,
It is gradually decreased and its water level decreasing is to being lower than in the surplus with the soldering paste being filled in solder container 100 with being discharged
(off) is closed when predetermined position, and sends control unit for the signal so closed.
But the situation that the solder detecting part 200 is ON/OFF sensor is only one embodiment, the present invention is not
It is confined to this, it, in the nature of things, can be using existing well known as long as the surplus of the soldering paste in solder container can be sensed
Various sensors.
If the automatic Supply Method of solder container 100 to the automatic supply device using solder container 100 is illustrated
It is then as follows, wherein the solder container 100 is can be by constituting the weldering of the embodiment according to the present invention of realization as described above
Material container.
Fig. 9 is the control for being schematically illustrated the automatic supply device of solder container 100 of embodiment according to the present invention
The block diagram of relationship, Figure 10 are the processes for successively illustrating the automatic Supply Method of solder container 100 of embodiment according to the present invention
Flow chart.
Referring to Fig. 9, in the automatic supply device of the solder container 100 of embodiment according to the present invention, for sensing weldering
The solder detecting part 200 of soldering paste surplus in material container 100 by circuit connection in control unit 300, control unit 300 also with confession
Portion 20, work department 40 and transferred unit is answered to connect respectively by circuit.
Therefore, control unit 300 can control supply department 20, work department 40 according to the input signal of solder detecting part 200
And the work of transferred unit, its work relationship is illustrated below.
Firstly, being installed on work department in solder container 100 in screen process press 10 as shown in Fig. 1 and Fig. 2, Fig. 7 and Fig. 8
It is worked during executing the process of applying solder paste on a printed circuit in the state of 40, solder detecting part 200 is felt
Survey solder container 100 in soldering paste surplus and be sent to control unit 300.
At this point, operator can correspond to be used in the replacement of the solder container 100 of process, such as Fig. 3 and Fig. 4 institute
Show that the prior new solder container 100 that will be filled with soldering paste in ground is supplied to the input port of supply department 20.
In this way, in the state that new solder container 100 is supplied to supply department 20, solder container 100 using self weight and
The feed rolls 22 for costing supply department 20 are moved down to a side direction, at this point, keeping the first retainer 26 by the first cylinder 24
And the state after rising, solder container 100 is located at the position of the waiting state in feed rolls 22 accordingly.
In this case, mounting portion 30 separates from work department 40 and between supply department 20 and work department 40.
In this state, in the painting process of the soldering paste executed by screen process press 10, solder detecting part 200 is felt
It surveys the soldering paste surplus being used in the solder container 100 of process and sends this signal to control unit 300, at this point, if sensing
Below preset value, that is, sense can not to be applied to the sufficient soldering paste surplus on printed circuit board, and to control unit
300 send this signal, then control unit 300 sends the replacement signal of solder container 100.
If receiving the replacement signal of the solder container 100 from control unit 300, apply input letter to work department 40
Number and interrupt and provide pneumatics to solder container 100 by air-pressure tube 40, while making the second gas for being configured at 40 upper side of work department
Cylinder 50 works, to separate lid 110 from the rear end of solder container 100.
That is, lid 110 is separated from the rear end of solder container 100 with the rising of the second cylinder 50.
In this state, the third cylinder operation of work department 40 and move horizontally knock pin 44, to make 110 quilt of lid
Isolated solder container 100 is moved along horizontal direction and free-falling is to recycling space.
Therefore, solder container 100 is not present in work department 40, while new solder container can be obtained from supply department 20
100 supply.
As described above, control unit 300 transmits defeated to supply department 20 while removing solder container 100 from work department 40
Enter signal and decline the first cylinder 24, accordingly, new solder container 100 is using self weight and along feed rolls 22 along tilting down
Direction slide.
In this way, being released to the constraint with the first retainer 26, being sliding along downwardly-inclined direction along feed rolls 22
For the new solder container 100 fallen, the second retainer 70 by the top side for being configured at work department 40 will be square
To after being converted to vertical direction, using self weight, free-falling is to mounting portion 30.
For the new solder container 100 for freely falling to mounting portion 30 along vertical direction, such as Fig. 5 and Fig. 6 institute
Show, the state of vertical direction is kept to be mounted with the grip part 32 by mounting portion 30, once mounting portion 30 is completed for weldering
The installation of material container 100, then control unit 300 sends input signal to transferred unit and mounting portion 30 is made to be moved to work department 40.
Solder container 100 is placed in mounting portion by the mounting portion 30 that the work of transferred unit is shifted into work department 40
40, in this state, control unit 300 applies input signal to the second cylinder 50 and declines lid 110, to make 110 envelope of lid
Close the rear end of new solder container 100.
In this way, if lid 110 new solder container 100 back-end closure install, then it represents that new solder container 100
Terminate in the installation of work department 40, in this state, if providing air pressure by the air-pressure tube 60 for being connected to lid 110, fills out
The soldering paste being charged in new solder container 100 can be applied on a printed circuit.
As described above, the automatic supply device of the solder container 100 of embodiment according to the present invention, if solder container
Soldering paste in 100 has exhausted, then is changed to new solder container 100 automatically, therefore operator is without replacement weldering manually one by one
Material container 100, so as to greatly improve its process efficiency.
Especially since solder container 100 is replaced automatically, without interrupting silk-screen printing to replace solder container 100
The process of machine 10, therefore can larger improve whole process efficiency.
In addition, the automatic supply device of solder container 100 according to the present invention can also provide following effect: sensing
After soldering paste surplus in solder container 100, when the soldering paste surplus sensed is insufficient, it is changed to automatically filled with weldering
The new solder container 100 of cream, is defectively applied to printed circuit board so as to prevent soldering paste.
As described above, the process that soldering paste is applied to printed circuit board in the state of being changed to new solder container 100
In, when soldering paste surplus deficiency in solder container 100, as long as new solder container 100 is put into supply department 20 in advance,
Then new solder container can be changed to automatically according to workflow as described above.
As long as the personnel with the general knowledge in the technical field of the invention are to be understood that the present invention does not change
Its technical idea or essential feature then may be embodied as other specific forms.It will be appreciated, therefore, that implementation described above
Example is exemplary embodiment in all respects, and non-limiting embodiment.The scope of the present invention is wanted according to appended right
The range asked is defined, rather than the detailed description carried out above, and from the meaning of the scope of the claims, range and it is equivalent general
Having altered or deform derived from reading be interpreted to be included in the scope of the present invention.
Claims (11)
1. a kind of automatic supply device of solder container characterized by comprising
Work department, the applying solder paste on a printed circuit in the state of being equipped with solder container；
Supply department supplies the new solder container filled with the soldering paste using self weight；
Mounting portion is arranged between the work department and the supply department, receive new solder container from the supply department and with
Relative to the work department realize move back and forth and new solder container is supplied to the work department；
Transferred unit moves back and forth the mounting portion；
Solder detecting part, for sensing the surplus for the soldering paste being installed in the solder container of the work department；And
Control unit applies input signal, thus according to weldering sensing by the solder detecting part, being configured at the work department
The measured value of soldering paste surplus in material container, discharge are configured at the solder container of the work department, and drive the supply department
And the mounting portion and by new solder container be supplied to the work department,
The supply department includes:
Multiple feed rolls dip down and tiltedly configure；
First cylinder works according to the input signal of the control unit；
First retainer is gone up and down by the work of first cylinder, and constrains the new weldering being configured in the feed rolls
The movement of material container, and
Second retainer is configured at the top side of the work department, and the direction by changing new solder container makes its edge
Vertical direction is installed to the mounting portion.
2. the automatic supply device of solder container according to claim 1, which is characterized in that the transferred unit includes:
Driving motor；And
Driving screw is rotated with the driving of the driving motor, to keep the mounting portion mobile.
3. the automatic supply device of solder container according to claim 1, which is characterized in that
The mounting portion further include: grip part, in the state of making the new solder container along vertical direction described in gripping
New solder container.
4. the automatic supply device of solder container according to claim 1, which is characterized in that
The work department includes: the second cylinder, realizes lifting by the input signal of the control unit, to hold in the solder
The rear end installation lid of device separates the lid from the rear end of the solder container.
5. the automatic supply device of solder container according to claim 4, which is characterized in that
The work department includes: knock pin and third cylinder, is separated in the lid relative to the rear end of the solder container
In the state of, the knock pin ejects the solder container；The third cylinder moves back and forth the knock pin.
6. the automatic supply device of solder container according to claim 4, which is characterized in that
It is connected in the side of the lid according to the input signal of the control unit and the air-pressure tube of pneumatics is provided.
7. a kind of automatic Supply Method of solder container, the solder container are installed in screen process press, thus in printing electricity
Applying solder paste on the plate of road, which is characterized in that comprise the following steps that
(a) surplus for the soldering paste that sensing is installed in the solder container of work department；
(b) when the surplus of the soldering paste is preset value or less, in the pusher from the working portion from the solder container
Enter to recycle space；
(c) the new solder container that will be filled with soldering paste is supplied to the work department；And
(d) once new solder container is supplied to the work department, after the rear end for sealing the new solder container with lid,
Continue applying solder paste on a printed circuit,
It will be filled with the new solder container of the soldering paste and comprise the following steps that supplied to the step of work department
The new solder container is provided to supply department；
The new solder container is configured in the multiple feed rolls tiltedly configured dipping down；And
First retainer goes up and down according to the input signal of control unit and releases for the new solder being configured in the feed rolls
The constraint of the movement of container, to supply the new solder container to the work department；And
It is configured between the supply department and the work department to be installed to the new solder container in vertical direction
Mounting portion, the second retainer for being configured at the top side of the work department convert the new solder supplied by the supply department
The direction of container.
8. the automatic Supply Method of solder container according to claim 7, which is characterized in that
Will be filled with the new solder container of the soldering paste include the steps that supplied to the step of work department it is as follows:
The grip part that the mounting portion is included holds described new in the state that the new solder container is along vertical direction
Solder container.
9. the automatic Supply Method of solder container according to claim 7, which is characterized in that
From the working portion from the solder container after push-in recycling space the step of comprise the following steps that
The second cylinder operation that the work department is included, so that removal is installed on the lid of the rear end of the solder container.
10. the automatic Supply Method of solder container according to claim 9, which is characterized in that
From the working portion from the solder container after push-in recycling space the step of include the steps that it is as follows:
In the state that the lid is separated relative to the rear end of the solder container, ejected by the knock pin of reciprocating movement
The solder container.
11. the automatic Supply Method of solder container according to claim 7, which is characterized in that
From the working portion from the solder container after push-in recycling space the step of comprise the following steps that
It interrupts and supplies pneumatics by the air-pressure tube for the side for being connected to the lid,
If new solder container is supplied to the work department, the subsequent of the rear end of the new solder container is being sealed with lid
The step of continuous applying solder paste on a printed circuit, comprises the following steps that
Pneumatics is supplied by the air-pressure tube.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020170026499A KR101920818B1 (en) | 2017-02-28 | 2017-02-28 | Method and apparatus for supply of solder container |
| KR10-2017-0026499 | 2017-02-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108501509A CN108501509A (en) | 2018-09-07 |
| CN108501509B true CN108501509B (en) | 2019-11-05 |
Family
ID=63370904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710506617.4A Active CN108501509B (en) | 2017-02-28 | 2017-06-28 | Automatic supply device and method for solder container |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101920818B1 (en) |
| CN (1) | CN108501509B (en) |
| WO (1) | WO2018159894A1 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111216441A (en) * | 2018-11-26 | 2020-06-02 | 伊利诺斯工具制品有限公司 | Stencil printing machine |
| TWI789552B (en) * | 2018-11-26 | 2023-01-11 | 美商伊利諾工具工程公司 | A stencil printer |
| WO2020131068A1 (en) * | 2018-12-20 | 2020-06-25 | Hewlett-Packard Development Company, L.P. | Printing system |
| CN210148924U (en) | 2019-01-04 | 2020-03-17 | 伊利诺斯工具制品有限公司 | Vacuum wiper and stencil printer having the same |
| KR102242463B1 (en) * | 2019-04-16 | 2021-04-20 | (주)보성이엔지 | First-in first-out Solder Container Automatic Supplying Management System |
| CN115179645B (en) * | 2022-09-06 | 2022-12-20 | 徐州日托光伏科技有限公司 | SMT welding tin cream printing device with automatic feeding function |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0839770A (en) * | 1995-08-10 | 1996-02-13 | Sony Corp | Cream solder supply vessel |
| JP2004306102A (en) * | 2003-04-08 | 2004-11-04 | Sony Corp | Solder feeder and solder printing machine |
| JP2005007401A (en) * | 2003-06-16 | 2005-01-13 | Tamura Seisakusho Co Ltd | Soldering device |
| JP2006255719A (en) * | 2005-03-15 | 2006-09-28 | Sharp Corp | Solder level detection method, solder automatic feeder, and solder dipping device |
| JP4643719B2 (en) * | 2009-02-09 | 2011-03-02 | ヤマハ発動機株式会社 | Solder supply apparatus, printing apparatus and printing method |
| JP5739171B2 (en) * | 2011-01-18 | 2015-06-24 | ヤマハ発動機株式会社 | Adhesive material coating device and solder coating device |
| CN103567325A (en) * | 2012-07-31 | 2014-02-12 | 西门子公司 | Preformed solder generating device, feeder, assembling system and assembling method |
| KR101196284B1 (en) | 2012-09-18 | 2012-11-06 | 이동주 | Apparatus for supplying solder paste |
| EP2754556A1 (en) * | 2013-01-11 | 2014-07-16 | Crown Packaging Technology Inc | In-feed system and method for supplying can bodies to a decorator |
| KR101431079B1 (en) * | 2013-02-19 | 2014-08-22 | 주식회사 두원정밀 | Apparatus for transfering cartridge of automatic solder supplying unit |
| CN106029278B (en) * | 2014-02-26 | 2018-11-16 | 株式会社富士 | Solder feed system |
| JP2016050085A (en) * | 2014-08-29 | 2016-04-11 | 株式会社 日立産業制御ソリューションズ | Container supply device |
-
2017
- 2017-02-28 KR KR1020170026499A patent/KR101920818B1/en active IP Right Grant
- 2017-04-19 WO PCT/KR2017/004187 patent/WO2018159894A1/en active Application Filing
- 2017-06-28 CN CN201710506617.4A patent/CN108501509B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2018159894A1 (en) | 2018-09-07 |
| KR101920818B1 (en) | 2018-11-21 |
| CN108501509A (en) | 2018-09-07 |
| KR20180099273A (en) | 2018-09-05 |
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