JPH0839770A - Cream solder supply vessel - Google Patents

Abstract

PURPOSE:To obtain a cream solder supply vessel adapted for a cream solder automatic supplying apparatus. CONSTITUTION:A screen solder supply vessel 81 is disposed at an apparatus 1 side and used when scream solder in the vessel is automatically supplied to a screen for printing the solder. The vessel 81 has a mount 83, is filled with the solder from an opening of a front side, and sealed. The sealed front side is cut, and can be formed with an outlet extended in a slender state at the front side. When the solder is externally pressed in the state disposed at the mount 17 of the apparatus 1 side and locked via the mount 83, it is formed in a bag to be exhausted from the outlet.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cream solder supply container suitable for automatically supplying cream solder used in a cream solder printing machine.

[0002]

2. Description of the Related Art One of the methods for soldering a printed wiring board is a reflow soldering method. In this soldering method, cream solder is supplied in advance to the soldering points on the printed circuit board in the printed wiring board, and the chip parts are fixed to this and heated in an electric furnace or infrared furnace to melt and solder. There is a way to attach.

Further, as a method of supplying cream solder to a soldering portion on a wiring circuit conductor, a printing machine screen is arranged on the wiring circuit conductor, and by passing this screen, only a portion necessary for soldering is provided. The cream solder is applied. In this case, as a method of supplying the cream solder onto the screen of the printing machine, a method of filling the cream solder into a syringe and pushing it out by air pressure etc., and a method of filling the container with the cream solder instead of the syringe and having a stirring function A cream solder automatic supply method and the like using a spiral extrusion method are known.

[0005]

In the method of filling the above-mentioned cream solder into a syringe and pushing it out by air pressure or the like, the cream solder is pushed out by applying a pressure to the whole cream solder in the syringe. If not done properly, the flux may be separated from the cream solder by applying pressure to the entire cream solder, which may cause the viscosity of the cream solder to change over time. For this reason, it is difficult to adjust the pressure applied to the syringe, and the quality of the cream solder also changes over time due to the progress of the above separation over time, which adversely affects the soldering quality.

On the other hand, in the method of filling the cream solder in the container and extruding it with the spiral having the stirring function, it is possible to prevent the flux from separating from the cream solder to some extent. However, due to heat history due to intermittent stirring for viscosity adjustment, the supply of the cream solder is stopped due to an increase in viscosity, the stirring section is directly in the cream solder, the drive section malfunctions, old solder remains, etc. Has an adverse effect on soldering quality. Furthermore, the maintainability such as cleaning of the container and the drive unit is poor.

Further, in both of the above two methods, the supply amount tends to be uneven. For this reason, there is a problem that a drive unit is required to supply the ink in the printing direction evenly, resulting in a high cost, and a long waiting time at the time of supply, resulting in poor productivity. Further, there is a problem in that the cream solder dries down from the nozzle and drops, causing the screen mask to be clogged, resulting in defective printing.

In order to solve the above problems, the present inventors can supply the necessary cream solder evenly in the printing direction, and can reduce the space and running cost. We have developed an automatic solder supply method and device. The present invention is to provide a cream solder supply container suitable for it.

[0009]

That is, the present invention relates to a cream solder supply container which is arranged on the device side and is used when the cream solder inside is automatically supplied onto a screen for printing the cream solder. A container on the device side, which has an attachment portion, is filled with cream solder from an opening on the front side, is sealed, and is capable of forming an outlet extending to the front side by cutting the sealed portion on the front side. In a state of being arranged on the mounting portion and being locked via the mounting portion, when the cream solder inside is pushed from the outside, it has a bag shape that can be discharged from the outlet.

According to the above construction, by setting the outlet of the cream solder supply container in the direction intersecting with the printing direction on the screen, the cream solder can be discharged in the direction intersecting with the printing direction through the outlet elongated from the inside. Therefore, it becomes easy to uniformly supply the cream solder in the printing direction. And since it is pushed out through the elongated outlet, there is no ingress of air into the bag, and by this,
By discharging the required amount each time through the elongated outlet, the cream solder in the container is prevented from being oxidized and can be used up to the end.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below with reference to the drawings. FIG. 1 shows the relationship between a cream solder supply container and a supply device as a first embodiment of the present invention, and FIG. 2 is an overall configuration diagram of a cream solder printing machine. In the description, first, the structure of a cream solder printing machine using the cream solder supply container of the present invention will be outlined. The cream solder printing machine is mainly composed of a cream solder supply placing section 1 and a cream solder printing apparatus section 51. The cream solder supply device unit 1 includes a supply unit 2 and a control unit 3 arranged behind the supply unit 2, and the cream solder printing device unit 51 includes a printing machine head unit 52 and a printing screen unit 53. I have it.

On the cream solder supply device 1 side, the control unit 3 has an alarm device 4 for generating an alarm at the time of an error on the upper outer surface, and an error monitor 5 for displaying the content of the error by numbers or the like. In addition to the supply counter 6 for displaying the number of times of supplying cream solder, a start switch button 7 also serving as a start / stop button, an automatic switch button 8 for instructing automatic supply, and a manual Single-acting switch button 9 for instructing supply, and alarm release switch 10 that lights up when an error occurs, and when pressed, the alarm is released and goes out.
And a home position return switch button 11 for resetting the supply counter 6 and returning the entire device to the home position, and a count switch button 12 for advancing the supply count each time it is pressed.
And a single-action head operation switch button 13 in which a head for supplying cream solder is operated one time each time the button is pressed,
A single-acting supply plate forward / backward switch button 14, a single-acting upper nozzle push switch 15, and a single-acting squeegee up / down switch button 16 are provided, and commands required by the operator are provided through these respective switch buttons. To be able to give.

The supply portion 2 is arranged in a plate-shaped solder container mounting portion 17 which also serves as a bottom plate of the apparatus main body 1, and is divided into left and right sides of the solder container mounting portion 17 and extended in the front-rear direction. A pair of guide portions 18a, 18b
And a head portion 19 and the like arranged between the pair of guide portions 18a and 18b so as to be movable in the front-rear direction.

More specifically, in the solder container mounting portion 17, reference numeral 20 is a supply plate mounted on the lower surface on the front end side of the solder container mounting portion 17 across the pair of guide portions 18a and 18b. The supply plate 20 is the solder container mounting portion 17
It is arranged so that it can project and withdraw from the front end side. Further, a part 20a of the leading end of the supply plate 20 is bent upward with respect to the base end 20b. Reference numeral 21 is an upper nozzle arranged on the front end surface of the solder container mounting portion 17,
A pair of stopper pins 22 mounted on the solder container mounting portion 17 are mounted so as to be vertically movable and guided. Further, the front surface of the upper nozzle 21 is formed as an inclined surface 21a that gradually decreases toward the front side, and a recess 23 is formed in the substantially center of the upper surface. Reference numeral 24 is a container lifting prevention member (see FIG.
Between the container rising prevention member 24 and the solder container mounting portion 17, a cream solder container 81 described later is provided.
A gap X is provided to allow the rear end portion to penetrate. Reference numeral 25 denotes a container lifting prevention member 24.
Is a pair of left and right mounting screws detachably mounted on the solder container mounting portion 17 on the rear side of the.

Further, a pair of left and right guide portions 18a, 18b
Of these, one guide portion 18a is provided with a feed guide screw 26 in a state of being extended in the front-rear direction, and the feed guide screw 26 is rotated by a head drive motor 27. On the other hand, a head track rail 28 is provided in the guide portion 18b in a state of being extended in the front-rear direction. Further, in the guide portion 18b, a supply plate driving cylinder mechanism 29 for causing the supply plate 2 to be projected or retracted more than the front end of the solder container mounting portion 17 is arranged.

The head portion 19 includes a feed guide screw 26 of the guide portion 18a and a head track rail 28 of the guide portion 18b.
It has a head plate 30 supported by. Further, a squeegee 32, whose tip is formed in a wedge-shaped cross section, is laid on the head plate 30 via a squeegee drive cylinder 31 so as to lie horizontally across the solder container mounting portion 17 and attached. A nozzle retainer 34 is attached via a nozzle cylinder 33.

When the feed guide screw 26 is rotated by the drive of the head drive motor 27, the head plate 30 is guided by the feed guide screw 26 and the head track rail 28 to rotate the feed guide screw 26. Depending on the direction, the squeegee 32 and the nozzle retainer 3 are moved forward (in the direction of arrow A in FIG. 1) or backward (in the direction of arrow B in FIG. 1).
Moved with 4th grade. Also, the squeegee drive cylinder 3
By the driving of No. 1, the squeegee 32 is moved to the lower side and can be switched between the operating position extremely close to the solder container mounting portion 17 and the non-operating position which is moved to the upper side and greatly separated from the solder container mounting portion 17. Furthermore, the nozzle cylinder 33
When is driven, the structure is such that the nozzle retainer 34 can be moved and switched between a position where it is moved downward and pressed against the upper nozzle 21 and a position where it is moved upward and separated from the upper nozzle 21.

Further, in the cream solder supply device section 1 thus constructed, the cream solder supply container for supplying the cream solder printing device section 51 is referred to as the cream solder supply container of the present invention (hereinafter simply referred to as the cream solder container). Set). 20 to 22 show an example of the cream solder container, FIG. 20 is a top view thereof, FIG. 21 is a side view thereof, and FIG. 22 is a schematic sectional view taken along the line AA of FIG. 20 to 22, the cream solder container 81 is formed in a substantially rectangular bag shape, and the cream solder 82 is put inside and sealed, and the front and rear and left and right peripheral portions thereof are pressure-bonded to each other to form a sheet. It is in a state of being in a state. Also, the sheet-shaped rear side is set as a mounting portion, and the solder container mounting portion 1 is attached to this mounting portion.
A mounting hole 83 is formed corresponding to the mounting screw 25 on the 7 side. The sheet-shaped front side is sealed by a heat-sealed seal portion 84, the rear side of the seal portion 84 is set as a planned cutting portion 85, and a predetermined length is arranged rearward of the planned cutting portion 85. Through the space portion (the portion between the filled cream solder 82 and the planned cutting portion as shown in FIGS. 5, 20 to 22), the cream solder is cut from the front opening to the planned cutting portion 85 and the space. It is filled and sealed on the rear side through the section. The cream solder container 81 here is
Polyethylene or polypropylene is desirable as the material, and if other materials are used, it is necessary to study compatibility with the flux and solvent in the cream solder in advance. The size of the cream solder container 81 is determined in consideration of the amount of cream solder used for board production, and the strength of the cream solder container 81 should be sufficient so as not to be damaged by friction with the squeegee 32. Of course, it is used.

When the cream solder container 81 is set in the cream solder supply device unit 1, first, as shown in FIG.
Remove 5 Next, after passing the cream solder container 81 under the upper nozzle 21 with the upper nozzle 21 being lifted, the rear end side of the cream solder container 81 is passed under the container rising prevention member 24 and the mounting hole 83 is provided.
Is arranged at a position corresponding to the screw hole on the side of the solder container mounting portion 17 to which the mounting screw 25 is mounted, and in this state, the mounting screw 25 is screwed into the solder container mounting portion 17 through the mounting hole 83 and tightened. As a result, the cream solder container 81 is positioned on the solder container mounting portion 17, and the upper nozzle 21 is placed on the front side of the cream solder container 81. FIG. 3 shows this state. In this state, on the front end side of the cream solder container 81, the heat-welded portion 84 protrudes forward of the upper nozzle 21, and the planned cutting portion 85 is the front end side of the upper nozzle 21. Is located in. Further, after the setting, the planned cutting portion 85 is cut. Then, the cream solder container 81 is unsealed with the cut end (cream solder discharge port) laid on the front end of the solder container mounting portion 17 in the left-right direction, whereby the cream solder 82 can be pushed out from the front end side. It becomes a state. FIG. 4 shows this state. When the squeegee 32 is pressed against the cream solder container 81 from above and is moved to the upper nozzle 21 side in this state, the cream solder 82 in the cream solder container 81 is moved to the upper nozzle 21. Be moved to the side. FIG. 5 shows this state.

Next, the structure of the cream solder printing device section 51 will be described. The printing screen portion 53 is arranged such that the rear end side thereof corresponds to the supply plate 20 of the cream solder supply device portion 1, and the printing portion P corresponding to the soldering location of the wiring circuit conductor of the printed wiring board (not shown) is provided. Printing screen 5
5, and a screen frame 56 that holds the screen 55, and the like.

The printing machine head portion 52 includes a head mounting substrate 5
7 and the print screen portion 53 on the head mounting substrate 57.
It is composed of a pair of front and rear squeegees 59a, 59b, etc., which are laid across the right and left and are attached via squeegee drive cylinders 58a, 58b. Also,
The printing machine head portion 52 is movable in the front-rear direction (direction of arrow AB in FIG. 2) on the printing screen portion 53 by means not shown, and the squeegee drive cylinders 58a, 58b are driven. Squeegee 59a, 59
b is moved in the vertical direction (CD direction in FIG. 2). Further, as shown in FIGS. 6 and 7, a printing screen 55 is provided between the squeegees 59a and 59b.
A pair of sensors 60 for detecting the amount of the cream solder 82 supplied above are separately arranged on the left and right. As this sensor, for example, a detector using infrared rays or ultrasonic waves is used.

The printing machine head 52 is moved back and forth, and at this time, the cream solder 82 is applied onto the printing screen 55 by the squeegees 59a and 59b, and the printed wiring board arranged below the printing screen 55. Is applied (printed) to the soldering portion of the wiring circuit conductor of, and the head mounting substrate 57 is on the rear side (direction of arrow B in FIG. 2).
When moving to, the squeegee 59a is moved upward (direction of arrow D in FIG. 2) to be separated from the printing screen 55, and the squeegee 59b is moved downward (direction of arrow C in FIG. 2). It is brought into a state of lightly contacting the printing screen 55, and in this state, the cream solder 82 supplied onto the printing screen 55 is applied to the rear side by the squeegee 59b. Next, the squeegee 59b is moved upward (in the direction of arrow D in FIG. 2) to be separated from the printing screen 55, and the squeegee 59a is moved downward (in the direction of arrow C in FIG. 2) to move to the printing screen. 55
It is brought into a state of lightly contacting the upper side and moved to the front side (direction A in FIG. 2). At this time, the cream solder 82 supplied on the printing screen 55 is applied to the front side by the squeegee 59a, and this reciprocation is performed. By moving, solder printing on one sheet is completed. A shaded portion P in FIG. 2 is a printing portion required for printing. In addition, printing may be completed by moving one of the front and back, if necessary.

FIG. 8 shows an example of a flow chart when the cream solder 82 in the cream solder container 81 is supplied from the cream solder supply unit 1 side to the cream solder printing unit 51. 9 to 19 are operation explanatory views showing the supply process of the cream solder. Therefore, next, the operation of the cream solder printing machine will be described with reference to FIGS. 8 and 9 to 19. First, in the cream solder printing device section 51,
As described above, the cream solder application (printing) operation is repeated by moving the squeegees 59a and 59b in the front-rear direction. When the sensor 60 detects that the amount of the cream solder 82 supplied between the squeegees 59a and 59b has decreased, the cream solder printing device unit 51 supplies the solder to the cream solder supply device unit 1. The requested signal is issued. Then, in the cream solder printing device section 51, when the printing of the first printed wiring board set at the printing position at that time is completed, the next printed wiring board is set and the printing is prepared. Then, the head mounting board 57 stands by at the front position (direction of arrow A in FIG. 2).

On the other hand, on the cream solder supply unit 1 side,
The head drive motor 27 is controlled to move to the front end portion of the cream solder container 81 filled with the cream solder 82. Next, the squeegee driving cylinder 31 is driven, and the squeegee 32 is pressed against the cream solder container 81 from above (see FIGS. 9 and 10). Further, with the squeegee 32 being pressed against the cream solder container 81, the squeegee 32 is operated by the operation of the head drive motor 27.
Is moved to the front side. Then, in the cream solder container 81, the cream solder 82, which is on the front side of the squeegee 32, is scraped out to the front side together with the squeegee 32, and when the squeegee 32 is moved to the foremost end, the upper nozzle 21 is pressed by the pressure of the cream solder 82. And the cream solder 82 is placed at the outlet of the cream solder container 81 (see FIGS. 11 and 12). Next, the nozzle cylinder 33 is driven and the nozzle retainer 34 is pressed against the solder container mounting portion 17 from above the cream solder container 81. Then, the cream solder 82 arranged below the nozzle retainer 34 is pushed out from the cream solder container 81 onto the tip portion 20a of the supply plate 20 (see FIG. 13). As shown in FIG. 19, the extruded cream solder 82 is arranged in a line in a direction intersecting at right angles to the printing direction.

Next, the supply plate driving cylinder mechanism 29 is driven, and the supply plate 20 that has been retracted to the lower side of the solder container mounting portion 17 is projected, and the tip 20 of this supply plate 20 is projected.
a is brought into contact with the printing screen 55 of the solder printer unit 51 (see FIGS. 13 and 15).

Next, the head mounting substrate 57 is placed on the rear side (see FIG. 2).
In the direction of arrow B). At this time, squeegee 59a
Is moved upward (in the direction of arrow D in FIG. 2) to be separated from the printing screen 55, and the squeegee 59
b is moved downward (in the direction of arrow C in FIG. 2) to be in a state of lightly contacting the printing screen 55 and then moved to the rear side. Then, the cream solder 82 remaining on the printing screen 55 is moved to the rear side by the squeegee 59b with an applying operation, and the first cream solder 82 is applied to the next printed wiring board which has already been set. . When the trailing edge is reached, the squeegee 59b is moved upward (in the direction of arrow D in FIG. 2) and the printing screen 5b is moved.
5, the squeegee 59a is moved downward (in the direction of arrow C in FIG. 2) behind the cream solder 82 on the supply plate 20 to be in a state of lightly contacting the supply plate 20. (See FIGS. 16 and 17). Next, in this state, the head mounting plate 57 is on the front side (direction A in FIG. 2).
And the cream solder 82 supplied on the supply plate 20 at this time is scraped out on the printing screen 55,
The cream solder 82 is moved to the front side by the squeegee 59b with a coating operation, and the solder printing of one sheet is completed.
After that, the cream solder printing device unit 51 repeats the same operation until the cream solder 82 is supplied again.

On the other hand, in the cream solder supply device section 1, the supply plate drive cylinder mechanism 29 is driven, and the supply plate 20 which has been projected up to that point is retracted and stored below the solder container mounting section 17 again. The squeegee driving cylinder 31 and the nozzle cylinder 33 are driven to return the squeegee 32 and the nozzle retainer 34 upward (see FIG. 18). Next, after the head drive motor 27 is driven to return the squeegee 32 to the position where the cream solder is supplied next, the squeegee drive cylinder 31 is driven to drive the cream solder container 8
It is in a state of being pressed against the solder container mounting portion 17 from above 1. This completes the first supply of cream solder.

Therefore, according to the cream solder container structure of the present invention, when the cream solder container 81 is pushed by the squeegee 32 when necessary, the required amount of cream solder 82 is lined in the direction intersecting the printing direction. It can be discharged in the shape of a sheet and supplied onto the printing screen 55 on the cream solder printing device section 51 side via the supply plate 20. Then, the cream solder 82 is linearly discharged in the direction orthogonal to the printing direction, so that the cream solder 82 can be uniformly supplied in the printing direction. Moreover, when necessary, the squeegee 32 can be used to scrape it out from the outside, and the squeegees 59a and 59b can be supplied to apply it evenly. It can be lost. Also, since it is put in a bag-shaped cream solder container and the required amount is discharged each time, it is possible to prevent the cream solder in the container from oxidizing and to use it up to the end. Become. Further, when the squeegee or scraper of the printing machine is used, the space and cost are minimized, and the printing waiting time at the time of supplying the cream solder can be shortened. As a result, both space and running cost can be reduced.

In the above embodiment, the tip end of the squeegee 32 is formed by cutting one surface to have a substantially V-shaped cross section, but any other shape may of course be used. Some examples of the deformable structure are shown in FIG.
27 to 27. That is, in the modification shown in FIG. 23, the tip shape is formed in a planar shape. In the modification shown in FIG. 24, the tip shape is cut at a right angle, and the edge thereof is arranged at the center. In the modification shown in FIG. 25, the tip shape is formed in a wedge shape having an acute angle. FIG. 26
In the modification shown in (1), the tip has a rounded shape. In the modification shown in FIG. 27, the rotary roller 35 is attached to the tip.

In the above embodiment, the cream solder supply timing is controlled by the signal from the sensor 60, but it may be determined by the number of print shots. Further, the supply of the cream solder 82 has been described in the case where the structure of the cream solder printing device section 51 uses the double squeegee 32, but it can be applied to either a single squeegee or a scraper.

FIG. 28 shows another example of the device used in the cream solder container 81. In FIG. 28, the same reference numerals as those in FIGS. 1 to 27 denote the same parts as those in FIGS. 1 to 27. In this example of the apparatus, the position on the rear end side in the printing screen portion 53 (the direction of arrow B in FIG. 28)
The rear end side of the cream solder container 81 is attached to the fixing member 60, and the cream solder 82 in the cream solder container 81 is attached.
From the portion that is cut and opened at the planned cutting portion 85 by a means (not shown).
3 is scraped out by a pair of front and rear squeegees 59a and 59b attached to a printing machine head portion 52 that is movable in the front-back direction (arrow AB direction in FIG. 28), and is supplied onto the printing screen 55 in the required amount. It was done like this. Even in this structure, the cream solder discharge port formed by cutting the planned cutting portion 85 is placed on the printing screen 55, and the cream solder 8 scraped out from the inside of the cream solder container 81.
2 are arranged in a line in a direction intersecting the printing direction at a right angle. Further, in this structure, a backup table 61 for supporting the cream solder container 81 is provided on the back surface side of the printing screen 55 corresponding to the portion to which the cream solder container 81 is attached.

FIG. 29 is an operation state diagram of the cream solder printing machine in this apparatus example. Therefore, the operation of the cream solder printing machine shown in FIG. 28 will be described next with reference to FIG. First, the printing press head 52 with this structure is reciprocated within the "normal printing stroke S1" shown in FIG. 29 in normal printing, and when the cream solder 82 is scraped out from the cream solder container 81 and supplied, It is adapted to be moved into the supply stroke S2 ".

In normal printing, when the head mounting substrate 57 moves to the rear side (direction of arrow B in FIG. 29), the squeegee 59a is moved upward (direction of arrow D in FIG. 28) to print screen 55. The squeegee 59b is moved downward so as to be in slight contact with the printing screen 55 and is moved rearward.
At this time, the cream solder 82 supplied onto the printing screen 55 is applied rearward by the squeegee 59b (see FIG. 29). Next, the squeegee 59b is moved upward so as to be separated from the printing screen 55, and the squeegee 59a is moved downward (arrow C in FIG. 28).
Direction) to lightly contact the printing screen 55, and is moved to the front side (direction A in FIG. 28). At this time, the cream solder 82 supplied onto the printing screen 55 is moved by the squeegee 59b. By applying the solder toward the front side, one sheet of solder printing is completed (see FIG. 29).

In this way, the printing of the cream solder 82 is repeated, and when the sensor detects that the amount of the cream solder 82 supplied between the squeegees 59a and 59b has decreased, the squeegee 59a is moved upward. It is moved in the direction of arrow D in FIG. 28 to be separated from the printing screen 55, and the squeegee 59b is moved.
Is moved downward (in the direction of arrow C in FIG. 28) and is lightly contacted with the printing screen 55, and in the state in which the cream solder 82 is applied, the “normal printing stroke S
1 ”is moved to the rear end. Then, when the squeegee drive cylinders 58a and 58b are driven to the rear end of the "normal printing stroke S1", the squeegee 59a,
59b are both moved upward (in the direction of arrow D in FIG. 28) to be far away from the printing screen 55. Then, the squeegee 59a is moved to the "stroke S2 at the time of supply", and is moved to a predetermined position of the cream solder container 81 (see FIG. 29). Are pressed onto the cream solder container 81 (see FIG. 29). next,
In this state, the head mounting plate 57 is located on the front side (reference numeral A in FIG. 29).
Direction), and at this time, the cream solder 82 in the cream solder container 81 is scraped out onto the printing screen 55 and supplied in a state of being lined up in a direction intersecting the printing direction at right angles. The solder 82 is moved to the front side by the squeegee 59b along with the coating operation, and the printing of one sheet of solder is completed (FIG. 29). After that, until the cream solder 82 is supplied again, the head mounting plate 57
Is reciprocated within the "normal printing stroke S1",
The same printing operation will be repeated.

Therefore, even in the case of the cream solder printer of this device example, by using the cream solder container 81 of the present invention, the cream solder 82 can be uniformly supplied in the printing direction when necessary. .

[0036]

As described above, according to the present invention,
By simply setting the outlet of the cream solder supply container in the direction that intersects the printing direction on the screen, the cream solder can be discharged in a direction that intersects the printing direction through the elongated outlet that extends from the inside, and the cream solder can be discharged in the printing direction. The cream in the container is easy to supply uniformly and is extruded through an elongated outlet so that air is not entrapped in the bag, and the necessary amount is discharged from the elongated outlet each time. Prevents solder oxidization, eliminates solder paste separation, deterioration over time, and print defects, and can be used up to the end. Moreover, the structure of the solder container can be simplified and the cost can be reduced, and the solder container structure is suitable for a small-sized printing machine.

[Brief description of drawings]

FIG. 1 is a diagram showing an example of a cream solder supply container of the present invention and an example of a device using the same.

FIG. 2 is an overall configuration diagram showing an overall configuration of the device side.

FIG. 3 is an explanatory view of an attaching procedure of the ream solder supply container.

FIG. 4 is an explanatory view of an attaching procedure of the cream solder supply container.

FIG. 5 is a diagram showing a structure and an operation of a main part of the cream solder supply container.

FIG. 6 is a diagram showing a structural example of a squeegee on the device side.

FIG. 7 is a diagram showing a structural example of a squeegee on the device side.

FIG. 8 is a flowchart for supplying cream solder from the cream solder supply container of the present invention using the above apparatus.

FIG. 9 is an operation explanatory view showing a supply process of the cream solder.

FIG. 10 is an operation explanatory view showing a supply process of the cream solder.

FIG. 11 is an operation explanatory view showing a supply process of the cream solder.

FIG. 12 is an operation explanatory view showing a supply process of the cream solder.

FIG. 13 is an operation explanatory view showing a supply process of the cream solder.

FIG. 14 is an operation explanatory view showing a supply process of the cream solder.

FIG. 15 is an operation explanatory view showing a supply process of the cream solder.

FIG. 16 is an operation explanatory diagram showing a supply process of the cream solder.

FIG. 17 is an operation explanatory diagram showing a supply process of the cream solder.

FIG. 18 is an operation explanatory view showing a supply process of the cream solder.

FIG. 19 is an operation explanatory diagram showing a supply process of the cream solder.

20 is a top view of the cream solder supply container of FIG. 1. FIG.

21 is a side view of the cream solder supply container of FIG. 1. FIG.

22 is a cross-sectional view taken along the line AA of FIG.

FIG. 23 is a view showing a modified example of the squeegee on the device side.

FIG. 24 is a view showing a modified example of the squeegee on the device side.

FIG. 25 is a diagram showing a modified example of the squeegee on the device side.

FIG. 26 is a view showing a modified example of the squeegee on the device side.

FIG. 27 is a view showing a modified example of the squeegee on the device side.

FIG. 28 is an overall configuration diagram showing another example of a device using the cream solder supply container of the present invention.

29 is a flowchart for supplying cream solder from the cream solder supply container of the present invention using the apparatus of FIG. 28.

[Explanation of symbols]

 1 Cream Solder Supply Device Part (Device Side) 17 Solder Container Mounting Part (Container Mounting Part) 32 Squeegee 51 Cream Solder Printing Device Part (Device Side) 55 Printing Screen 81 Cream Solder Container (Cream Solder Supply Container) 82 Cream Solder 83 Mounting Hole 85 Planned cutting area

Claims (4)

[Claims] 1. A cream solder supply container which is arranged on the device side and which is used when the cream solder inside is automatically supplied onto a screen for printing the cream solder, comprising a mounting portion, It is filled and sealed from the opening on the front side, it is possible to cut the sealed portion of the front side to form an elongated outlet on the front side, and it is arranged in the container mounting portion on the device side and through the mounting portion. A cream solder supply container for a cream solder printing machine, which is in a bag shape and can be discharged from the outlet when the cream solder inside is pushed from the outside in the locked state. 2. The cream solder supply container according to claim 1, wherein the mounting portion is a mounting hole provided in a bag-shaped rear side. 3. The cream solder supply container according to claim 1, wherein the attachment portion is formed to have a length that can be inserted into a holding gap provided on the container attachment portion side. 4. A cream solder supply container which is disposed on the device side and which is used when the cream solder inside is automatically supplied onto a screen for printing the cream solder, wherein a mounting portion is provided on the rear side and the front side is provided. Has a planned cutting part and a space part of a predetermined length behind the planned cutting part, and cream solder is filled and sealed behind the space part from an opening on the front side, and the planned cutting part is cut. It is possible to form an elongated outlet on the front side, and it can be discharged from the outlet when the internal cream solder is pushed from the outside while it is arranged in the container mounting part on the device side and is locked via the mounting part Cream solder supply container for a cream solder printing machine in the shape of a substantially rectangular bag.