JP5739171B2 - Adhesive material coating device and solder coating device - Google Patents

Description

  The present invention relates to an adhesive material application device and a solder application device, and more particularly, to an adhesion material application device and a solder application device that supply an adhesion material by extruding the adhesion material from a storage container.

  2. Description of the Related Art Conventionally, an adhesive material application device that supplies an adhesive material by extruding the adhesive material from a storage container is known (see, for example, Patent Document 1).

  Patent Document 1 discloses a screen printing machine including a pressure plate (extrusion unit) for extruding solder from an extrusion container (container) and an air cylinder (drive unit) that moves the pressure plate relative to the extrusion container. (Adhesive material applicator) is disclosed. This screen printing machine is configured to drive the air cylinder to move the pressure plate to push out the solder (adhesive material) stored in the extrusion container (storage container). Further, this screen printing machine is configured to be able to measure the pressure in the extruded container by a pressure sensor. The screen printing machine is configured to stabilize the solder supply by feedback controlling the driving of the air cylinder so that the pressure in the extrusion container is within the target range while supplying the solder. Has been. Further, the above-mentioned Patent Document 1 describes feedback control of driving of an air cylinder (driving unit) while supplying solder (during solder supply), but after starting to drive the air cylinder. There is no description about control in a period until solder starts to be supplied.

  Here, in the conventional screen printing machine as described in Patent Document 1, by pressing (pressurizing) the storage container, the solder in the storage container is pushed out and the supply of the solder is finished. A device having a configuration in which the drive unit is driven in a direction opposite to that at the time of supply is known so as to apply a reduced pressure (extract the internal pressure in the container).

  In such a conventional screen printing machine (adhesive material application device), after supplying the solder (adhesive material) is finished and the drive position of the drive unit is returned, the next time the solder is supplied, the drive unit It is considered that the supply of solder is started by driving the drive unit by a predetermined fixed amount during the period from the start of driving of the solder to the start of the supply of solder.

JP 2009-132047 A

  However, in the conventional configuration in which the drive unit is driven by a predetermined fixed amount and the supply of solder is started during the period from the start of driving the drive unit to the start of the supply of the adhesive material, the supply operation of the adhesive material is repeatedly performed. Even when the remaining amount of the adhering material in the container is reduced, the drive unit is uniformly driven as in the case where the remaining amount of the adhering material is large. It is considered that the supply of the adhering material may not be started even if it is driven by a predetermined fixed amount, or conversely, the supply of the adhering material may be started before the driving of the predetermined fixed amount of the drive unit is completed. It is done. For this reason, it is considered that there is a problem that the supply amount of the adhering material deviates from the target supply amount.

  The present invention has been made to solve the above-described problems, and one object of the present invention is to provide a supply amount of the adhesion material in a configuration in which the drive position of the drive unit is returned after the supply of the adhesion material is completed. It is an object of the present invention to provide an adhesion material coating apparatus and a solder coating apparatus capable of suppressing deviation from a target supply amount.

Means for Solving the Problems and Effects of the Invention

In order to achieve the above object, an adhesive material application apparatus according to a first aspect of the present invention includes an extrusion unit for extruding an adhesion material from a storage container that stores the adhesion material through a supply port, a storage container, and an extrusion unit. A drive unit that relatively moves the drive unit, and a control for returning the drive position of the drive unit after the supply of the adhering material is completed. Based on the corresponding information, the pre-supply section and the adhering material are supplied until the adhering material starts to be pushed out through the supply port by the relative movement of the container and the extruding unit after the driving unit starts to drive in a predetermined direction. And a control unit for determining a boundary with the main supply section pushed out through the mouth.

  In the adhesive material application apparatus according to the first aspect of the present invention, as described above, the drive unit is controlled to return the drive position of the drive unit after completion of the supply of the adhesive material, and based on the drive state information of the drive unit, the drive unit The supply section in which the adhering material is pushed out through the supply port until the adhering material starts to be pushed out through the supply port by the relative movement of the container and the pushing portion after the container starts to drive in a predetermined direction. In the configuration in which the drive position of the drive unit is returned after the supply of the adhesive material is completed, the control unit determines the pre-supply section and the main supply section and actually supplies the adhesive material. Since the start timing can be grasped, the supply operation of the adhering material can be appropriately controlled. As a result, the supply amount of the adhering material is prevented from deviating from the target supply amount. It is possible.

  In the adhering material application apparatus according to the first aspect, preferably, the control unit drives the driving unit at the time of supply after the supply of the adhering material is completed based on the pre-supply driving amount in the pre-supply section of the driving unit. It is configured to control to drive a predetermined amount drive unit corresponding to the drive amount before supply in the opposite direction. According to this structure, unlike the case where the drive position of the driving unit is uniformly returned to the initial position regardless of the remaining amount of the adhering material after the supply of the adhering material is completed, the amount of the remaining adhering material is reduced ( The drive position of the drive unit is returned to a position shifted from the initial position by a drive amount corresponding to the amount supplied at the time of supply), so that the drive position of the drive unit is set to a position corresponding to the remaining amount of the adhering material in the container Can be returned. As a result, even when the remaining amount of the adhering material is small, it is possible to suppress the drive amount of the drive unit from becoming excessively large. Even when the remaining amount of the adhering material is small, it is possible to suppress an increase in the time required for the operation of supplying the adhering material.

  In the adhering material application apparatus according to the first aspect, preferably, the control unit sets the driving unit in a direction opposite to the predetermined direction after the supply of the adhering material is completed based on the driving amount before supply. It is configured to control to drive substantially the same drive amount. If comprised in this way, since the drive position of a drive part will be returned to the position which shifted | deviated from the initial position by the part which the residual amount of adhering material decreased at the time of supply (the part supplied at the time of supply), the drive position of a drive part Can be returned to a position more suitable for the remaining amount of the adhering material in the container. As a result, it is possible to more effectively suppress the change in the supply time of the adhesion material due to the remaining amount of the adhesion material, and even when the remaining amount of the adhesion material is small, the time required for the supply operation of the adhesion material is reduced. It can be further suppressed from becoming longer. In addition, the control unit returns the driving position by a driving amount that is substantially the same as the driving amount before supply after the supply of the adhering material is completed, so that the relative position between the container and the pushing unit is the position before the driving unit is started to be driven. Therefore, the adhering material can be reliably returned to the state where it is not pushed out from the storage container.

  In the adhering material application apparatus according to the first aspect, preferably, the drive amount before supply is pushed out through the supply port after the adhering material in the storage container starts to be pressurized by driving the driving unit in a predetermined direction. The predetermined amount after the supply of the adhering material is at least a driving amount at the time of decompression in which the inside of the container is depressurized by driving in a direction opposite to the predetermined direction. Including at least. With this configuration, the adhering material in the container can be easily pushed out by the applied pressure, and after the supply of the adhering material is finished, the adhering material is removed by the decompression drive that releases the internal pressure in the container. It is possible to suppress leakage from the water.

  In this case, preferably, the drive amount before supply is the drive amount during pressurization and the idle drive amount before supply until the attached material in the container starts to be pressurized after the drive unit starts to drive in a predetermined direction. The predetermined amount after the supply of the adhering material is completed is the driving amount during decompression, and the post-supply idle driving amount from when the drive unit starts to drive in the direction opposite to the predetermined direction until the inside of the container starts to be depressurized. including. If comprised in this way, the idle run area (section until it begins to pressurize the adhering material in a storage container after a drive part begins to drive in a predetermined direction) before the relative movement of a storage container and an extrusion part begins is carried out. Even with a certain configuration, the drive position of the drive unit can be reliably returned to the position corresponding to the remaining amount of the adhering material in the receiving container after the supply of the adhering material.

  In the configuration in which the pre-supply drive amount includes at least the pressurization drive amount, preferably, the control unit is configured to change the pressurization drive amount as the remaining amount of the attached material in the storage container varies. Based on the pre-supply drive amount including at least the pressurization drive amount, control is performed so that the drive unit is driven in substantially the same drive amount as the pre-supply drive amount in a direction opposite to the predetermined direction after the supply of the adhering material is completed. It is configured as follows. If comprised in this way, since the drive position of a drive part will be returned by the drive amount corresponding to the fluctuation | variation of the drive amount at the time of pressurization, it will drive at the time of pressurization in connection with the fluctuation | variation of the residual amount of the adhesion material in a storage container. Even when the amount varies, the drive position of the drive unit can be reliably returned to the position corresponding to the remaining amount of the adhering material in the container.

  In the configuration in which the driving unit is driven by the driving amount that is substantially the same as the driving amount before supply when the driving amount at the time of pressurization varies, preferably, the control unit It is configured to predict the remaining amount of adhering material. If comprised in this way, the residual amount of the adhesion material in a storage container can be easily estimated using the characteristic that the drive amount at the time of pressurization changes with the residual amount of the adhesion material in a storage container.

  In the adhering material application apparatus according to the first aspect, preferably, the control unit has a predetermined idling driving amount before supply from when the driving unit starts to drive in a predetermined direction until the adhering material in the container starts to be pressurized. When the allowable amount is exceeded, control for stopping the drive unit is performed. With this configuration, for example, when the storage container is not properly installed, the idling driving amount before supply becomes excessively large. In such a case, the driving unit is stopped by the control unit. Can do. Thereby, it can suppress that a drive part continues driving in a state with a certain malfunction.

  In the adhering material application apparatus according to the first aspect, preferably, the control unit has a driving force of the driving unit exceeding a predetermined allowable value after the driving unit starts to drive in a predetermined direction until the supply of the adhering material ends. In this case, control is performed to stop the drive unit. If configured in this way, for example, when the adhering material in the storage container is lost and the storage container and the pushing portion cannot be moved relative to each other any more, the driving force of the drive unit becomes excessively large. In such a case, the drive unit can be stopped by the control unit. Thereby, it can suppress that a drive part continues driving in a state with a certain malfunction. In addition, when the driving force of the driving unit becomes excessively large, a portion where the driving force acts due to the excessively large driving force of the driving unit is stopped by stopping the driving unit by the control unit. It can suppress that it breaks.

  In the adhering material application apparatus according to the first aspect, preferably, the control unit acquires information on a driving state of the driving unit based on information on the amount of power supplied to the driving unit when the driving unit is driven. It is configured as follows. If comprised in this way, based on the information regarding electric energy, such as an electric current value and a voltage value, it will be easy for a control part to supply a supply before area and this supply area from the change of the electric energy accompanying the fluctuation | variation of the load concerning a drive part. Can be determined. In addition, when supplying the adhering material, the control unit can perform stable supply control while monitoring the driving state of the driving unit based on information on the electric energy such as a current value and a voltage value. Here, as a configuration for monitoring the drive state of the drive unit, for example, a configuration in which information on the drive state of the drive unit is acquired based on the pressure state in the storage container by providing a pressure sensor in the storage container is conceivable. However, when using attachment materials having different properties, it is necessary to replace or clean the pressure sensor. In addition, by using a load cell, a configuration in which information on the driving state of the driving unit is acquired based on the pressing force acting on the storage container is conceivable. However, in this configuration, the device becomes large by installing the load cell. . On the other hand, if it is configured to acquire information on the drive state of the drive unit based on information on the amount of power supplied to the drive unit as in the present invention, the drive state (drive) of the drive unit can be easily obtained. Quantity and driving force status) can be monitored.

A solder coating apparatus according to a second aspect of the present invention includes an extrusion unit for extruding a solder paste from a storage container that stores a solder paste through a supply port, a drive unit that relatively moves the storage container and the extrusion unit, Based on the information corresponding to the change in the driving force of the driving unit due to the relative movement of the container and the pushing unit, the driving unit is controlled to return the driving position of the driving unit after the supply of the solder paste is completed. Section before the solder paste starts to be pushed out through the supply port due to relative movement between the container and the pushing portion after the container starts to be driven in a predetermined direction, and a main supply section in which the solder paste is pushed out through the supply port And a control unit for determining the boundary between the

  In the solder coating apparatus according to the second aspect of the present invention, as described above, control is performed to return the drive position of the drive unit after the supply of the solder paste is completed, and the drive unit is controlled based on the drive state information of the drive unit. A section before supply until solder paste starts to be pushed out through the supply port due to relative movement between the container and the pushing portion after starting to drive in a predetermined direction, and a main supply zone in which the solder paste is pushed out through the supply port In the configuration in which the drive position of the drive unit is returned after the supply of the solder paste is completed by providing the control unit for determining the solder paste, the control unit discriminates the pre-supply section and the main supply section and starts to actually supply the solder paste. Since the timing can be grasped, the supply operation of the solder paste can be appropriately controlled. As a result, whether the supply amount of the solder paste is the target supply amount. It is possible to suppress the deviation becomes the. In particular, in a solder coating apparatus that requires a predetermined supply amount to be stably supplied to the substrate, the present invention capable of suppressing the supply amount of the solder paste from deviating from the target supply amount is more effective. .

1 is a perspective view illustrating an overall configuration of a printing apparatus according to an embodiment of the present invention. 1 is a side view showing an overall configuration of a printing apparatus according to an embodiment of the present invention. It is a schematic diagram which shows the solder supply part of the printing apparatus by one Embodiment of this invention. 1 is a block diagram illustrating a configuration of a printing apparatus according to an embodiment of the present invention. It is a flowchart which shows the supply process of the solder paste of the printing apparatus by one Embodiment of this invention. It is a conceptual diagram which shows the relationship between the electric current value supplied to the servomotor of the solder supply part of the printing apparatus by one Embodiment of this invention, and a drive amount. FIG. 6 is a diagram illustrating a state in which the solder paste starts to be pressed in the solder paste supply process of FIG. 5. FIG. 6 is a diagram illustrating a state in which solder paste starts to be pushed out from a supply port in the solder paste supply process of FIG. 5. It is a figure which shows the state which complete | finished supply of the solder paste in the supply process of the solder paste of FIG. FIG. 6 is a diagram showing a state in which the inside of the housing space of the solder container has started to be depressurized in the solder paste supply process of FIG. 5. FIG. 6 is a diagram illustrating a state in which the servo motor drive position of the solder supply unit is returned to a predetermined position after the supply of the solder paste in the solder paste supply process of FIG. 5. It is the figure which showed the modification which provided the pressure sensor of the printing apparatus by one Embodiment of this invention. It is the figure which showed the modification which provided the load cell of the printing apparatus by one Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  The structure of the printing apparatus 100 according to an embodiment of the present invention will be described below with reference to FIGS. In the present embodiment, an example will be described in which the “adhesive material coating apparatus” and the “solder coating apparatus” of the present invention are applied to a printing apparatus that prints solder on a printed circuit board.

  As shown in FIGS. 1 and 2, the printing apparatus 100 according to the present embodiment is provided on a base 1, a substrate transport unit 2 that is provided on the base 1 and transports a printed circuit board 200, and above the substrate transport unit 2. And a printing unit 3 that prints solder on the printed circuit board 200.

  As shown in FIG. 1, the board transport unit 2 includes a pair of conveyors 4 a that carry in the printed board 200 before printing and a pair of conveyors 4 b that carry out the printed board 200 after printing. The substrate transport unit 2 is provided between the conveyors 4a and 4b, and moves up and down the conveyor 55 in a state where the printed circuit board 200 is held, thereby bringing the printed circuit board 200 into contact with the lower surface of the mask 300 described later. A device 5 is further included. The conveyors 4a and 4b are provided so as to extend in the substrate transport direction (X direction). As shown in FIGS. 1 and 2, the printing unit 3 prints solder on the printed circuit board 200 through the mask support unit 6 (see FIG. 1) that supports the mask 300 used for printing and the mask 300. The printing unit 7 and a drive unit 8 that drives the printing unit 7 in the printing direction (Y direction) during printing are included. A mask recognition camera 91 is provided on the substrate positioning lift 5.

  The mask 300 has a plurality of openings formed in a predetermined pattern corresponding to a solder application region applied to the printed circuit board 200. Further, the mask 300 is manufactured based on Gerber data (mask design information) including position information and opening size information of each opening to be formed.

  As shown in FIGS. 1 and 2, the substrate positioning lifting device 5 includes a Y-axis table 51, an X-axis table 52, an R-axis table 53, and a Z-axis table 54. Further, the substrate positioning elevating device 5 is configured to be able to move the printed circuit board 200 in the X direction, the Y direction, the Z direction, and the R direction (rotation direction in the horizontal plane) by driving the tables 51 to 54. Has been.

  As shown in FIG. 2, the Y-axis table 51 is slidably attached to the rail 51 a so as to extend in the front-rear direction (Y direction) provided on the base 1. Further, the Y-axis table 51 is configured to be movable in the Y direction by a servo motor and a ball screw mechanism (not shown). The X-axis table 52 is slidably attached to the rail 52a so as to extend in the X direction provided on the Y-axis table 51. Further, the X-axis table 52 is configured to be movable in the X direction with respect to the Y-axis table 51 by a servo motor and a ball screw mechanism (not shown). The R-axis table 53 is supported by a support mechanism 53a provided on the X-axis table 52 so as to be rotatable in a horizontal plane. The R-axis table 53 is configured to be rotatable with respect to the X-axis table 52 by a servo motor (not shown).

  Further, a guide shaft 54 a extending in the Z direction fixed to the Z axis table 54 is inserted into the R axis table 53. The Z-axis table 54 is configured to be movable in the Z direction with respect to the R-axis table 53 by a servo motor and a ball screw mechanism 54b (not shown). As shown in FIGS. 1 and 2, the pair of conveyors 55 is provided on the Z-axis table 54 so as to extend in the X direction. The conveyor 55 has a function of receiving the printed circuit board 200 before printing from the conveyor 4a and delivering the printed circuit board 200 after printing to the conveyor 4b.

  Further, the Z-axis table 54 is provided with a lifting table 56 (see FIG. 2) that can be lifted in the vertical direction (Z direction) in the region between the pair of conveyors 55. The lifting table 56 is attached to the Z-axis table 54 via a slide shaft 56a extending in the vertical direction. Further, the lifting table 56 is configured to be movable in the Z direction with respect to the Z-axis table 54 by a servo motor and a rack and pinion mechanism (not shown). The lifting table 56 is configured to place the printed circuit board 200 at a height corresponding to the clamp pieces 57a and 57b by lifting the printed circuit board 200 on the conveyor 55. Thereafter, the printed circuit board 200 is held by the clamp pieces 57a and 57b and supported from below by pins (not shown). When printing is completed, the printed board 200 is placed on the conveyor 55 by releasing the holding by the clamp pieces 57a and 57b and lowering the lifting table 56.

  As shown in FIG. 1, the mask support 6 is fixedly attached to frame members 1 a and 1 b that extend in the Y direction of the base 1 above the substrate positioning lift 5. The mask support 6 includes a pair of support plates 6a that support the mask 300 from below, and a pair of clamp pieces 6b that are installed on the support plates 6a and press the mask 300 from above.

  The printing unit 7 has a function of pushing the solder on the upper surface of the mask 300 onto the printed circuit board 200 disposed below the mask 300 through the opening of the mask 300 by sliding with respect to the upper surface of the mask 300. doing. Specifically, as shown in FIGS. 1 and 2, the printing unit 7 includes a squeegee unit 71 that extends solder, a solder supply unit 72 that supplies solder onto the mask 300, a solder supply unit 72, and a squeegee unit 71. And a support member 73 that supports and can reciprocate in the printing direction (Y direction).

  As shown in FIG. 3, the solder supply unit 72 is a piston support that supports a solder container holding unit 721 that holds a solder container 110 containing solder and a piston 112 that extrudes the solder paste 111 in the solder container 110. Part 722. The solder supply unit 72 further includes a servo motor 723 that relatively moves the solder container 110 and the piston 112, and a ball screw shaft 724 to which the solder container holding unit 721 is movably attached. Further, as shown in FIG. 1, the solder supply section 72 is supported by a support section 725 provided on the front side (arrow Y1 direction side) of the squeegee unit 71 so as to be movable in the X direction. Specifically, the support portion 725 includes a ball screw shaft 725a extending in the X direction and a servo motor 725b that rotationally drives the ball screw shaft 725a. The solder supply unit 72 is supported by the support unit 725 via a nut (not shown) that is screwed onto the ball screw shaft 725a. The solder supply unit 72 is configured to move in the X direction when the ball screw shaft 725a is rotated by the servo motor 725b. The solder container 110 is an example of the “accommodating container” in the present invention, and the solder paste 111 is an example of the “adhesive material” in the present invention. The piston 112 is an example of the “extrusion part” of the present invention, and the servo motor 723 is an example of the “drive part” of the present invention.

  As shown in FIG. 3, the solder container holding part 721 includes an upper holding part 721 a arranged on the upper side of the solder container 110 and a lower holding part 721 b arranged on the lower side of the solder container 110. . The solder container holding part 721 is configured to hold the solder container 110 with the opening 110a facing downward. The upper holding portion 721a and the lower holding portion 721b are configured such that one end thereof is screwed to the ball screw shaft 724. Further, the upper holding portion 721a and the lower holding portion 721b are configured to move in the vertical direction (Z direction) along the ball screw shaft 724 as the ball screw shaft 724 rotates. At this time, the upper holding portion 721a and the lower holding portion 721b are moved while keeping the distance between them constant. That is, the upper holding portion 721a and the lower holding portion 721b are configured to be moved in the same direction with the same movement amount.

  Here, in the printing apparatus 100 of the present embodiment, as the solder container 110, it is possible to use a commercially available container that is distributed in a state where the solder paste 111 is accommodated. Such a commercially available solder container 110 has, for example, a cylindrical shape composed of a bottom portion closed at one end and an opening 110a open at the other end. Solder paste 111 is accommodated in such a solder container 110, and the opening 110a is sold with a lid member (not shown) sealed. In the present embodiment, after removing the lid member, the commercially available solder container 110 can be used as it is for solder supply simply by fitting the piston 112 into the opening 110a and setting the solder container 110 in the solder container holding part 721. is there. The solder container 110 contains a solder paste 111 in which solder powder and flux are mixed.

  The piston support part 722 is fixedly provided in the solder supply part 72. The piston support portion 722 supports the ball screw shaft 724 in a rotatable manner. The piston support portion 722 fixedly supports the servo motor 723 connected to the end of the ball screw shaft 724 and the piston 112. For this reason, when the ball screw shaft 724 is rotated by the servo motor 723, the solder container holding portion 721 is moved up and down relatively with respect to the piston 112. Thereby, when the solder container holding part 721 moves downward, the solder container 110 is pressed from the upper side by the upper holding part 721a and moves downward with respect to the piston 112, and the solder container holding part 721 is moved upward. In the case of moving to the piston 112, it is pushed up from the lower side by the lower holding portion 721b and moves upward with respect to the piston 112.

  The piston 112 is attached so as to penetrate the piston support portion 722 up and down. The piston 112 includes a pressing portion 112a provided at the upper end and a shaft portion 112b extending in the vertical direction. In addition, a solder supply path 112c that penetrates in the vertical direction from the upper end of the pressing portion 112a to the lower end of the shaft portion 112b is formed inside the piston 112, and the lower end portion of the piston 112 (shaft portion 112b) is the solder paste 111. Is the supply port 113 through which the water is pushed out.

  The pressing portion 112a is slidably fitted into the opening 110a of the solder container 110. That is, a space for accommodating the solder paste 111 is formed by the solder container 110 and the pressing portion 112a. The pressing portion 112a is pushed into the solder container 110 when the solder container 110 is pressed from above by the upper holding portion 721a and moved downward. As a result, since the space for accommodating the solder paste 111 is reduced, the pressure of the solder paste 111 is increased and the solder paste 111 is pushed out from the supply port 113 through the solder supply path 112c. Then, the solder paste 111 pushed out from the supply port 113 is supplied onto the mask 300 disposed below.

  The servo motor 723 has an encoder 723 a that detects the rotational position (coordinates) of the servo motor 723. The encoder 723a is provided for acquiring information on the drive amount of the servo motor 723 by the control unit 10 described later.

  As shown in FIG. 1, the drive unit 8 includes a pair of guide rails 81 that support the support member 73 so as to be movable in the Y direction, a ball screw shaft 82 that extends in the Y direction, and a servo motor 83 that rotates the ball screw shaft 82. Is included. The support member 73 is provided with a ball nut 73a (see FIG. 2) to which the ball screw shaft 82 is screwed. The support member 73 is configured to move in the Y direction when the servo motor 83 rotates the ball screw shaft 82. Accordingly, the support member 73, the squeegee unit 71, and the solder supply unit 72 can be integrally moved in the Y direction by the single drive unit 8.

  As shown in FIG. 4, control of each unit of the printing apparatus 100 is performed by the control unit 10. The control unit 10 includes an arithmetic processing unit 11, a storage unit 12, a motor control unit 13, an external input / output unit 14, an image processing unit 15, and a server communication unit 16. In addition, a display unit 101 is provided outside the printing apparatus 100, and the display unit 101 is controlled by the control unit 10. The display unit 101 is a touch panel type and can accept an input operation by a user.

  Here, in this embodiment, the arithmetic processing unit 11 is mainly configured by a CPU (Central Processing Unit), and reads various programs and data from the storage unit 12 to control the entire control unit 10. It is configured. Further, the arithmetic processing unit 11 is configured to acquire information regarding the amount of power supplied to the servo motor 723 of the solder supply unit 72. Specifically, the arithmetic processing unit 11 is configured to acquire a current value supplied to the servo motor 723 of the solder supply unit 72. Note that the current value supplied to the servomotor 723 varies depending on the load applied to the servomotor 723. Further, the arithmetic processing unit 11 is configured to acquire information on the driving amount and the driving force as the driving state of the servo motor 723 based on the current value supplied to the servo motor 723. Further, as will be described later, the arithmetic processing unit 11 starts from the time when the servo motor 723 starts to rotate forward (rotates in a direction to move the solder container holding unit 721 downward) until the solder paste 111 starts to be pushed out from the supply port 113. Based on the drive amount before supply of the servo motor 723, after the supply of the solder paste 111 is completed, the servo motor 723 is reversed by the same drive amount as the drive amount before supply (rotates in a direction to move the solder container holding portion 721 upward). It is configured to let you.

  The storage unit 12 is configured by an HDD (hard disk drive), a flash memory, or the like. The storage unit 12 stores various programs and data related to the production of the printed circuit board 200.

  The motor control unit 13 has a function of driving the above-described servo motors (servo motor 83, servo motor 723, servo motor 725b, etc.) based on the control instruction of the arithmetic processing unit 11. In addition, the motor control unit 13 has a function of acquiring a detection value (rotational position information) from an encoder (encoder 723a or the like) of each servo motor and outputting it to the arithmetic processing unit 11.

  The external input / output unit 14 has a function of transmitting and receiving signals associated with control of various valves, sensors, stopper mechanisms and the like provided in the printing apparatus 100.

  The image processing unit 15 has a function of performing imaging control of the mask recognition camera 91, the substrate recognition camera, and the inspection camera based on a control instruction from the arithmetic processing unit 11 and reading out image data. The server communication unit 16 has a function of communicating with an external server (not shown) by wire or wireless.

  Next, the supply process of the solder paste 111 by the arithmetic processing unit 11 will be described with reference to FIGS.

  First, in step S1, the arithmetic processing unit 11 sets the operation section as the pre-supply idle running section. Here, in this embodiment, as shown in FIG. 6, as the operation section, the pre-supply idle running section (section AB), the pressurizing section (section BC), the main supply section (section CD), and the post-supply idle running section. There are five operation sections, (section DE) and decompression section (section EF). The pre-supply idle section is a drive section of the servo motor 723 from when the servo motor 723 of the solder supply section 72 starts to be driven until the upper holding section 721a contacts the upper end of the solder container 110. Since no special load is applied to the servo motor 723 in the pre-supply idle running section, the current value supplied to the servo motor 723 is substantially constant at the current value during normal rotation. In this embodiment, when the servo motor 723 is started to be driven, there is a gap between the upper holding portion 721a and the solder container 110, so that a pre-supply idle running section occurs (exists). When the upper holding portion 721a is already in contact with the solder container 110 when starting to drive, the pre-supply idle running section does not occur. The drive amount of the servo motor 723 in the pre-supply idle running section is the “pre-supply idle drive amount” of the present invention.

  The pressurization section is a drive section of the servo motor 723 until the solder paste 111 starts to be pushed out from the supply port 113 after the upper holding portion 721a contacts the upper end of the solder container 110. In the pressurizing section, the solder paste 111 in the solder container 110 is pressurized, and the current value supplied to the servomotor 723 increases as the load applied to the servomotor 723 increases. The main supply section is a drive section of the servo motor 723 from when the solder paste 111 starts to be pushed out from the supply port 113 until the supply of the solder paste 111 is finished. In this supply section, the load applied to the servo motor 723 is substantially constant, and the current value supplied to the servo motor 723 is substantially constant. The driving amount of the servo motor 723 in the pressurizing section is the “driving driving amount” in the present invention.

  The idle running section after supply is a driving section of the servo motor 723 from the end of the supply of the solder paste 111 until the lower holding portion 721b contacts the lower end of the solder container 110. In the idle running section after supply, since the servo motor 723 is reversed, the current value becomes a negative value. Further, the absolute value of the current value at this time is approximately the same as the absolute value of the current value in the pre-supply idle running section. The drive amount of the servo motor 723 in the post-supply idle running section is the “post-supply idle drive amount” of the present invention.

  The decompression section is a drive section of the servo motor 723 from when the lower holding portion 721b contacts the lower end of the solder container 110 until the servo motor 723 stops driving. In the decompression section, the solder container 110 is moved upward by the lower holding portion 721b, so that the accommodation space for the solder paste 111 is increased, and the interior of the accommodation space for the solder container 110 is decompressed accordingly (the internal pressure of the accommodation space). Is removed). At this time, the load applied to the servo motor 723 increases, and the absolute value of the current value (negative current value) supplied to the servo motor 723 increases. Thereafter, when the drive of the servo motor 723 is stopped, the current value supplied to the servo motor 723 becomes zero. The drive amount of the servo motor 723 in the decompression section is the “drive amount during decompression” of the present invention.

In step S2, the arithmetic processing unit 11 performs control to repeat the following operation at a predetermined sampling time (for example, 1/10 ⁶ seconds). In step S <b> 3, the arithmetic processing unit 11 determines what is the currently set operation section. Immediately after starting the supply process of the solder paste 111, the operation section is set to the pre-supply idle running section in step S1, and therefore the process proceeds to step S4. In step S4, the arithmetic processing unit 11 controls the servo motor 723 to rotate normally. Thereby, the solder container holding part 721 is moved downward from the state in which the upper holding part 721a is separated from the solder container 110, as shown in FIG. At this time, the arithmetic processing unit 11 measures the current value supplied to the servo motor 723 in step S5.

  In step S6, the arithmetic processing unit 11 determines whether or not the current value supplied to the servo motor 723 has exceeded the value at the time of normal rotation. If not, in step S7, whether or not the allowable drive amount has been exceeded. Determine whether. The allowable drive amount is set in advance as an index for detecting any malfunction such as the solder container 110 not being attached. Here, when the solder container 110 is properly attached, the servo motor 723 is driven by a predetermined amount, so that the upper holding portion 721a comes into contact with the upper end portion of the solder container 110, and the load applied to the servo motor 723 is increased. To increase. That is, if the solder container 110 is properly attached, the current value supplied to the servo motor 723 starts to increase when the servo motor 723 is driven by a predetermined amount. On the other hand, when the solder container 110 is not attached, the upper holding portion 721a does not contact the solder container 110 and the current value of the servo motor 723 does not increase even if the drive amount of the servo motor 723 increases. . If the drive amount of the servo motor 723 exceeds the allowable drive amount while the current value of the servo motor 723 does not exceed the value at the normal rotation (see state G in FIG. 6), the arithmetic processing unit 11 determines in step S8. Then, an error message is displayed on the display unit 101, and in step 9, control for stopping the driving of the servo motor 723 is performed.

  When the current value of the servo motor 723 does not exceed the value at the time of normal rotation and the drive amount of the servo motor 723 does not exceed the allowable drive amount, the arithmetic processing unit 11 performs the above processing at a predetermined sampling time. The processes in steps S2 to S7 are repeated. As shown in FIG. 7, when the drive amount of the servo motor 723 increases and the upper holding portion 721a contacts the upper end of the solder container 110, the load applied to the servo motor 723 increases and the current of the servo motor 723 increases. The value exceeds the value during normal rotation (see drive amount B in FIG. 6). At this time, the arithmetic processing unit 11 sets the operation section as a pressurization section in step S10, and in step S11, based on the detection value of the encoder 723a, the driving amount (pre-supply idling). Drive amount) is stored in the storage unit 12. Thereby, in the determination of the next step S3, the operation processing unit 11 determines that the operation section is a pressurization section, and thereafter, each process in the pressurization section is executed.

  In the pressurizing section, the arithmetic processing unit 11 continuously rotates the servo motor 723 continuously from the pre-supply idle running section in step S12. At this time, as the pressure of the solder paste 111 in the solder container 110 increases, the load applied to the servo motor 723 also increases, so the current value supplied to the servo motor 723 also increases. The arithmetic processing unit 11 measures the current value supplied to the servomotor 723 in step S13, and determines whether or not the current value has reached the peak value in step S14. As shown in FIG. 8, when the pressure of the solder paste 111 in the solder container 110 increases and the solder paste 111 starts to be pushed out from the supply port 113, the pressure of the solder paste 111 in the solder container 110 reaches a peak value. At this time, the current value of the servo motor 723 also becomes a peak value (see driving amount C in FIG. 6). Thereby, the arithmetic processing unit 11 can discriminate between the pre-supply section (pre-supply idle running section and pressurizing section) and the main supply section in which the solder paste 111 is pushed out through the supply port 113.

  If the current value of the servo motor 723 has not reached the peak value, the arithmetic processing unit 11 determines whether or not the current value of the servo motor 723 exceeds the maximum allowable value in step S15. For example, when the solder paste 111 in the solder container 110 is fixed, the value of the current supplied to the servomotor 723 increases beyond the maximum allowable value as in the state H of FIG. That is, the driving force of the servo motor 723 increases beyond a predetermined allowable value. In such a case, the arithmetic processing unit 11 displays an error message on the display unit 101 in step S <b> 16, and performs control to stop driving the servo motor 723 in step 17. If the current value does not exceed the maximum allowable value, the arithmetic processing unit 11 repeats the processing from step S2 with a predetermined sampling time.

  Further, as shown in FIG. 8, when the solder paste 111 starts to be pushed out from the supply port 113 and the current value supplied to the servomotor 723 reaches the peak value, the arithmetic processing unit 11 sets the operation interval in step S18. In addition to being set to the supply section, in step S19, based on the detection value of the encoder 723a, the drive amount (pressurization drive amount) in the pressurization section is stored in the storage unit 12. Thereby, in the determination of the next step S3, the operation processing unit 11 determines that the operation section is the main supply section, and thereafter, each process in the main supply section is executed.

  Here, the peak value depends on the remaining amount of the solder paste 111 in the solder container 110. Specifically, the peak value increases as the remaining amount of the solder paste 111 increases, and gradually decreases as the remaining amount decreases. Further, the drive amount of the servo motor 723 in the pressurizing section decreases as the current peak value decreases (see section BJ in FIG. 6). Using this characteristic, the arithmetic processing unit 11 can predict the remaining amount of the solder paste 111 in the solder container 110 based on the drive amount of the servo motor 723 in the pressurizing section. When the remaining amount of the solder paste 111 falls below a predetermined amount, the arithmetic processing unit 11 displays a message indicating that the remaining amount is low on the display unit 101.

  In this supply section, the arithmetic processing unit 11 continuously rotates the servo motor 723 continuously from the pressurization section in step S20. The arithmetic processing unit 11 measures the current value supplied to the servomotor 723 in step S21, and determines whether or not the current value has increased in step S22. Here, in this supply section, normally, as shown in FIG. 6, the current value supplied to the servomotor 723 changes substantially constant. However, for example, when the solder paste 111 in the solder container 110 is exhausted or when the pressure of the solder paste 111 is excessively increased, as shown in the state I of FIG. Increases excessively. That is, the driving force of the servo motor 723 increases excessively. In this case, the arithmetic processing unit 11 determines whether or not the current value exceeds the maximum allowable value in step S15.

  On the other hand, if the current value has not increased, the arithmetic processing unit 11 determines whether or not the necessary amount of the solder paste 111 has been supplied (extruded) in step S23, and the predetermined amount until the required amount is supplied. The processing from step S2 is repeated at the sampling time. When the necessary amount has been supplied (see FIG. 9), the arithmetic processing unit 11 sets the operating section as the post-supply idle running section in step S24. Thereby, in the determination of the next step S3, it is judged by the arithmetic processing part 11 that an operation area is a post-supply idle run area, and each process in an after-supply idle run area is performed after that.

  In the post-supply idle running section, the arithmetic processing unit 11 controls the servo motor 723 to reversely rotate in step S25. Accordingly, as shown in FIG. 9, the solder container holding portion 721 is moved upward from a state where the lower holding portion 721 b is separated from the solder container 110 (a state immediately after the supply of the solder paste 111). In step S26, the arithmetic processing unit 11 reverses the driving amount in the pre-supply idling section (pre-supply idling driving quantity) stored in step S11 by the same amount of driving (driving direction in the pre-supplied idling section). It is determined whether or not it is driven by rotation in the opposite direction). And the process from said step S2 is repeated by predetermined sampling time until it becomes the drive amount same as the drive amount in the idling section before supply. That is, the solder container holding part 721 is moved (returned) upward by the same movement amount as the movement amount moved downward in the pre-supply idle running section.

  When driving in the reverse direction by the same driving amount as the driving amount in the pre-supply idle running section, the lower holding portion 721b comes into contact with the lower end portion of the solder container 110 as shown in FIG. At this time, the arithmetic processing unit 11 sets the operation section to the decompression section in step S27. Thereby, in the determination of the next step S3, it is judged by the arithmetic processing part 11 that an operation area is a pressure reduction area, and each process in a pressure reduction area is performed after that.

  In the decompression section, the arithmetic processing unit 11 continuously reverses the servo motor 723 from the post-supply idle running section in step S28. At this time, since the solder container 110 is moved upward with respect to the piston 112, the space for accommodating the solder paste 111 is increased, and thus the space inside the solder container 110 is depressurized (the internal pressure of the space). Is removed). As a result, the load applied to the servo motor 723 increases and the absolute value of the current value (negative current value) increases. Further, as the inside of the housing space of the solder container 110 is depressurized, as shown in FIG. 11, the solder paste 111 (see FIG. 10) pushed out to the supply port 113 through the solder supply path 112c is contained in the housing space. Pulled back to.

  Then, in step S29, the arithmetic processing unit 11 determines whether or not the driving unit has been driven by the same driving amount as the driving amount in the pressurizing section (pressurizing driving amount) stored in step S19. And the process from said step S2 is repeated by predetermined sampling time until it becomes the drive amount same as the drive amount in a pressurization area. That is, the solder container holding part 721 is moved (returned) upward by the same movement amount as the movement amount moved downward in the pressurization section.

  When driving in the reverse direction by the same driving amount as the driving amount in the pressurization interval, the arithmetic processing unit 11 sets the operation interval to complete in step S30. Thereby, in the determination of the next step S3, the arithmetic processing unit 11 determines that the operation section is complete, and stops the driving of the servo motor 723 in step S31. In this way, the supply process of the solder paste 111 is performed. Further, when supplying the solder paste 111 next time, the arithmetic processing unit 11 executes the supply process of the solder paste 111 from the state shown in FIG.

  As described above, in the supply process of the solder paste 111, the forward drive amount (drive amount before supply) of the servo motor 723 in the pre-supply idle running section and the pressurizing section, and the post-supply idle running section and the servo in the decompression section. The servo motor 723 is controlled by the arithmetic processing unit 11 such that the reverse drive amount (post-drive amount) of the motor 723 becomes the same drive amount. That is, the drive position of the servo motor 723 is shifted to a position shifted by the supply amount of the solder paste 111 supplied in the main supply section, as shown in FIGS. 3 and 11, every time one supply process is completed. Returned.

  In the present embodiment, as described above, control is performed to return the drive position of the servo motor 723 after the supply of the solder paste 111 is completed, and the servo motor 723 is rotated in the forward direction based on the current value supplied to the servo motor 723. Section before the solder paste 111 starts to be extruded through the supply port 113 (pre-supply idle running section and pressurization section) and the main supply section in which the solder paste 111 is extruded through the supply port 113 An arithmetic processing unit 11 (control unit 10) is provided. As a result, the arithmetic processing unit 11 can discriminate between the pre-supply interval and the main supply interval and grasp the timing at which the solder paste 111 actually starts to be supplied, so that the supply operation of the solder paste 111 is appropriately controlled. As a result, it is possible to suppress the supply amount of the solder paste 111 from deviating from the target supply amount. In particular, in a printing apparatus such as the present embodiment that needs to stably supply a predetermined supply amount to the substrate, the book that can suppress the supply amount of the solder paste 111 from deviating from the target supply amount. The invention is more effective.

  In the present embodiment, as described above, the supply of the solder paste 111 is based on the drive amount before supply of the servo motor 723 (the drive amount of forward rotation of the servo motor 723 in the pre-supply idle running section and the pressurizing section). After the completion, an arithmetic processing unit 11 (control unit 10) is provided for controlling the servo motor 723 having the same drive amount as the pre-supply drive amount to be driven in reverse. Thus, unlike the case where the drive position of the servo motor 723 is uniformly returned to the initial position regardless of the remaining amount of the solder paste 111 after the supply of the solder paste 111 is completed, the remaining amount of the solder paste 111 is reduced ( Since the drive position of the servo motor 723 is returned to a position shifted from the initial position by the amount supplied at the time of supply), the drive position of the servo motor 723 is returned to a position corresponding to the remaining amount of the solder paste 111 in the solder container 110. be able to. Thereby, even when the remaining amount of the solder paste 111 is small, it is possible to prevent the drive amount of the servo motor 723 from becoming excessively large, so that the supply time of the solder paste 111 greatly varies depending on the remaining amount of the solder paste 111. In addition, even when the remaining amount of the solder paste 111 is small, it is possible to suppress an increase in the time required for supplying the solder paste 111. In particular, in a printing apparatus such as the present embodiment in which it is necessary to apply the solder paste 111 to many printed circuit boards in a short time, the present invention that can shorten the time required for supplying the solder paste 111 is more effective. is there.

  In addition, after the supply of the solder paste 111 is completed by the arithmetic processing unit 11 (the control unit 10), the relative position between the solder container 110 and the piston 112 is servoed by returning the drive position by the same drive amount as the pre-supply drive amount. Since the motor 723 can be returned to the same position as before the driving of the motor 723, the solder paste 111 can be reliably returned to the state where it is not pushed out from the solder container 110.

  Further, in the present embodiment, as described above, the servo motor 723 is driven in the normal rotation to the drive amount before supply, and the solder paste 111 in the solder container 110 starts to be pressurized and then pushed out through the supply port 113. At least the driving amount at the time of pressurization until starting to be applied is included, and the driving amount after the supply of the solder paste 111 is at least included in the driving amount at the time of decompression. According to this configuration, the solder paste 111 in the solder container 110 can be easily pushed out by the applied pressure, and after the supply of the solder paste 111 is finished, the solder paste 111 is depressurized to release the internal pressure in the solder container 110. The paste 111 can be prevented from leaking from the solder container 110.

  In the present embodiment, as described above, the pre-supply driving amount and the pressing driving amount and the servo motor 723 start to drive in a predetermined direction until the solder paste 111 in the solder container 110 starts to be pressurized. And the idling driving amount after supply and the idling driving amount after supply are included in the driving amount after the supply of the solder paste 111 is completed. According to this configuration, the idle running section before the relative movement between the solder container 110 and the piston 112 starts (from the servo motor 723 starts to drive in a predetermined direction until the solder paste 111 in the solder container 110 starts to be pressurized. Even in a configuration in which there is a section of (5), after the supply of the solder paste 111 is completed, the drive position of the servo motor 723 can be reliably returned to a position corresponding to the remaining amount of the solder paste 111 in the solder container 110.

  In the present embodiment, as described above, the arithmetic processing unit 11 is driven before supply when the driving amount during pressurization varies as the remaining amount of the solder paste 111 in the solder container 110 varies. Based on the amount, after the supply of the solder paste 111 is completed, the servo motor 723 is controlled to be driven in the reverse direction so as to be driven by the same drive amount as the drive amount before supply. With this configuration, the drive position of the servo motor 723 is returned by a drive amount corresponding to the change in the drive amount at the time of pressurization, so that the additional amount is increased as the remaining amount of the solder paste 111 in the solder container 110 changes. Even when the pressure driving amount varies, the driving position of the servo motor 723 can be reliably returned to the position corresponding to the remaining amount of the solder paste 111 in the solder container 110.

  Further, in the present embodiment, as described above, the arithmetic processing unit 11 is configured to predict the remaining amount of the solder paste 111 in the solder container 110 based on fluctuations in the driving amount during pressurization. With this configuration, the remaining amount of the solder paste 111 in the solder container 110 can be easily predicted using the characteristic that the driving amount during pressurization varies depending on the remaining amount of the solder paste 111 in the solder container 110. be able to.

  Further, in the present embodiment, as described above, the calculation processing unit 11 causes the idle driving amount before supply until the solder paste 111 in the solder container 110 starts to be pressurized after the servo motor 723 starts to rotate forward. Is configured to perform control to stop the servo motor 723 when the allowable drive amount exceeds the allowable drive amount. With this configuration, for example, when the solder container 110 is not properly installed, the pre-supply idle driving amount becomes excessively large. In such a case, the servo motor 723 is operated by the arithmetic processing unit 11. Can be stopped. As a result, the servo motor 723 can be prevented from continuing to be driven in a state where there is a problem.

  In the present embodiment, as described above, the driving force of the servo motor 723 from the time when the servo motor 723 starts to rotate forward until the supply of the solder paste 111 ends exceeds the allowable value. In such a case, the servo motor 723 is controlled to stop. With this configuration, for example, when the solder paste 111 in the solder container 110 is lost and the solder container 110 and the piston 112 cannot be moved relative to each other, the driving force of the servo motor 723 is excessively large. Therefore, in such a case, the servo motor 723 can be stopped by the arithmetic processing unit 11. Thereby, it is possible to suppress the servo motor 723 from continuing to be driven in a state where there is some trouble. Further, when the driving force of the servo motor 723 becomes excessively large, the arithmetic processing unit 11 stops the servo motor 723, thereby causing the driving force of the servo motor 723 that has become excessively large. Can be prevented from being damaged.

  In the present embodiment, as described above, the arithmetic processing unit 11 is configured to acquire information on the driving state (driving amount, driving force, etc.) of the servo motor 723 based on the current value supplied to the servo motor 723. Configure. With this configuration, when supplying the solder paste 111, the arithmetic processing unit 11 can perform stable supply control while monitoring the driving state of the servo motor 723 based on the current value.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiments but by the scope of claims for patent, and further includes all modifications within the meaning and scope equivalent to the scope of claims for patent.

  For example, in the above-described embodiment, an example in which the adhesive material application apparatus of the present invention is applied to a printing apparatus that prints solder on a printed board has been described. An apparatus other than a (solder) printing apparatus, such as an adhesive material application apparatus for applying an adhesive for fixing a component for fixing an electronic component mounted on a printed circuit board to the printed circuit board. You may apply to. Further, in this way, an adhesive material other than the solder paste such as an adhesive may be used.

  In the above embodiment, an example is shown in which a commercially available solder container (accommodating container) distributed in a state where the solder paste (adhering material) is accommodated can be used. Not limited to. In the present invention, a dedicated container may be used to fill the adhering material every time the adhering material becomes empty. In addition, the storage container does not need to have a cylindrical shape, and the shape of the storage container is arbitrary. Moreover, the piston as an extrusion part of this invention may be what kind of shape, if it is a shape corresponding to the shape of the inner peripheral part of a storage container.

  In the above embodiment, an example is shown in which the solder container (accommodating container) is moved up and down with respect to the piston (extrusion part) by moving the solder container holding part up and down. Not limited to. In this invention, you may comprise so that an extrusion part may be moved with respect to a storage container. Moreover, the structure which moves to the direction which both a container and an extrusion part approach mutually, and the direction away from each other may be sufficient.

  Moreover, although the example which provided the supply port in the piston (extrusion part) was shown in the said embodiment, this invention is not limited to this. In the present invention, a supply port may be provided in the storage container.

  Moreover, in the said embodiment, although the servomotor was shown as an example of the drive part of this invention, this invention is not limited to this. In the present invention, for example, a drive unit other than the servo motor, such as a linear motor, may be used.

  Moreover, although the example which used the encoder in order to detect the drive amount of a servomotor (drive part) was shown in the said embodiment, this invention is not limited to this. In the present invention, for example, a displacement sensor that detects the amount of movement of the solder container holding unit may be provided, and information on the driving amount of the driving unit may be obtained based on the detection result of the displacement sensor.

  In the above embodiment, an example in which a gap is provided between the solder container holding portion and the solder container (accommodating container) has been described, but the present invention is not limited to this. In this invention, you may comprise so that a clearance gap may not be provided between a solder container holding | maintenance part and a solder container (accommodating container). In this case, as soon as the drive unit is driven, a load is applied to the drive unit, so that the pre-supply idle driving amount and the post-supply idle driving amount are eliminated (becomes zero).

  In the above embodiment, an example is shown in which the servo motor (drive unit) is stopped when the drive amount exceeds the allowable drive amount and when the current value exceeds the maximum allowable value. The invention is not limited to this. The present invention is configured to return the drive position of the drive unit to the initial position before starting to drive the drive unit when the drive amount exceeds the allowable drive amount and when the current value exceeds the maximum allowable value. Also good. Thereby, workability of the user can be improved, such as easy replacement of the storage container.

  In the above embodiment, an example of a configuration for acquiring information on the driving state (driving amount and driving force) of the servo motor based on the current value supplied to the servo motor (driving unit) has been described. It is not limited to this. In this invention, the structure which acquires the information of the drive state of a drive part based on the state regarding electric energy other than electric current values, such as the voltage value supplied to a drive part, may be sufficient. Further, in the present invention, not only the state relating to the amount of power supplied to the drive unit, but, for example, as shown in FIG. 12, a pressure sensor 401 is provided, and the drive state of the drive unit is determined based on the pressure in the storage container. Information may be acquired. Moreover, as shown in FIG. 13, the load cell 402 may be provided and the information of the drive state of a drive part may be acquired based on the pressing force which acts on a storage container.

10 Control Unit 100 Printing Device (Adhesive Material Application Device and Solder Application Device)
110 Solder container (container)
111 Solder paste (adhesive material)
112 Piston (extruded part)
113 Supply port 723 Servo motor (drive unit)

Claims (11)

An extruding unit for extruding the adhering material from a storage container containing the adhering material through a supply port;
A drive unit for relatively moving the container and the pusher;
Control to return the driving position of the driving unit after the supply of the adhering material is performed, and information corresponding to a change in driving force of the driving unit due to relative movement of the container and the pushing unit Based on the above, the pre-supply section and the adhesive material from when the drive unit starts to drive in a predetermined direction until the adhesive material starts to be pushed out through the supply port due to relative movement of the storage container and the push-out unit A controller for discriminating a boundary with the main supply section pushed out through the supply port.   Based on the pre-supply drive amount in the pre-supply section of the drive unit, the control unit performs the pre-supply in a direction opposite to the predetermined direction that the drive unit drives at the time of supply after the supply of the adhesion material is completed. The adhesion material coating apparatus according to claim 1, configured to control the driving unit to drive a predetermined amount corresponding to a driving amount.   The control unit controls the drive unit to drive the drive unit substantially in the same direction as the pre-supply drive amount in a direction opposite to the predetermined direction after completion of the supply of the adhesion material based on the pre-supply drive amount. The adhesion material application device according to claim 2, wherein the adhesion material application device is configured to perform the operation. The driving amount before supply is at least a driving amount at the time of pressurization until the adhering material in the container starts to be pressurized and starts to be pushed out through the supply port when the driving unit is driven in the predetermined direction. Including
The predetermined amount after the supply of the adhering material includes at least a driving amount at the time of decompression in which the inside of the container is depressurized when the driving unit is driven in a direction opposite to the predetermined direction. 3. The adhesion material coating apparatus according to 3. The drive amount before supply includes the drive amount during pressurization and the idling drive amount before supply from when the drive unit starts to drive in the predetermined direction until the adhered material in the container starts to be pressurized. ,
The predetermined amount after the supply of the adhering material is equal to the drive amount during decompression and the empty space after supply until the inside of the container starts to be depressurized after the drive unit starts to drive in a direction opposite to the predetermined direction. The adhesion material coating apparatus according to claim 4, comprising a travel drive amount.   The controller is based on the pre-supply drive amount including at least the pressurization drive amount when the pressurization drive amount varies as the remaining amount of the adhering material in the storage container varies. Then, after the supply of the adhering material is completed, the drive unit is controlled to be driven in substantially the same drive amount as the drive amount before supply in a direction opposite to the predetermined direction. 5. The adhesion material coating apparatus according to 5.   The said control part is an adhesion material coating apparatus of Claim 6 comprised so that the residual amount of the adhesion material in the said storage container may be estimated based on the fluctuation | variation of the said driving amount at the time of a pressurization.   The control unit is configured to perform the driving when the pre-supply idle driving amount from when the driving unit starts to drive in the predetermined direction until the attached material in the container starts to be pressurized exceeds a predetermined allowable amount. The adhesion material application device according to claim 1, wherein the adhesion material application device is configured to perform control to stop the unit.   The control unit stops the driving unit when a driving force of the driving unit from the time when the driving unit starts to drive in the predetermined direction until the supply of the adhering material ends exceeds a predetermined allowable value. The adhesion material application device according to claim 1, wherein the adhesion material application device is configured to perform control.   The said control part is comprised so that the information of the drive state of the said drive part may be acquired based on the information regarding the electric energy supplied to the said drive part, when the said drive part drives. 10. The adhering material coating apparatus according to any one of 9 above. An extruding part for extruding the solder paste from a container containing the solder paste through a supply port;
A drive unit for relatively moving the container and the pusher;
Control to return the driving position of the driving unit after the supply of the solder paste is completed, and information corresponding to a change in driving force of the driving unit due to relative movement of the container and the pushing unit Based on the above, the pre-supply section and the solder paste from when the drive unit starts to be driven in a predetermined direction until the storage container and the push-out unit move relative to each other and the solder paste starts to be pushed out through the supply port A solder coating apparatus comprising: a control unit that determines a boundary with the main supply section pushed out through the supply port.

Images